JP2009117530A - Electronic circuit module and method for manufacturing electronic circuit module - Google Patents

Abstract

When a semiconductor chip is adsorbed with a nozzle heated to high temperature and solder provided on an electrode portion of a substrate is heated for flip chip mounting, if there is a variation in temperature rise between electrodes, connection reliability Will fall.
On a wiring substrate on which a semiconductor chip is flip-chip mounted, electrodes 18a to 34a are secured in a part of wiring patterns 18 to 34, and solder 36 is placed on each of the electrodes 18a to 34a. It has been applied. At this time, the usage amount (application amount) of the solder 36 is individually adjusted in consideration of heat dispersion (escape) to the wiring patterns 18 to 34. For example, the usage amount of the solder 36 is reduced in the wiring pattern 18 having a large area, and the usage amount of the solder 36 is increased in the other wiring patterns 20 to 34.
[Selection] Figure 2

Description

  The present invention relates to an electronic circuit module configured by flip-chip mounting an electronic circuit component such as a semiconductor chip on an insulating substrate, and a manufacturing method thereof.

  Conventionally, when a semiconductor chip is mounted on a mounting substrate on which an electrode portion is formed, the semiconductor chip is adsorbed by a heat block that is a heat source, and the semiconductor chip is soldered to the electrode portion on the substrate in a high temperature environment. A method is known (for example, refer to Patent Document 1). In this soldering method, flip chip mounting is performed by soldering a semiconductor chip while melting a solder layer formed on an electrode portion of a mounting board using heat conduction or radiant heat from a heat block. is there. In particular, in this method, since the chip is pressed onto the substrate in a state where the solder layer is first melted, it is considered that the mounting pressure at that time is almost unnecessary.

Conventionally, a prior art for appropriately managing a solder temperature time curve (temperature profile) at the time of soldering by a reflow method is known (see, for example, Patent Document 2). In this prior art, the temperature of the solder is controlled within a specified range for a time from when the solder is raised to the melting temperature or higher until the soldering is reliably performed. If the solder temperature deviates from this specified range, soldering defects such as a decrease in soldering strength or thermal damage to parts will occur. Therefore, managing the temperature profile during soldering is to ensure product reliability. is important.
JP-A-9-92682 (5th page, FIG. 12) JP-A-6-224551 (page 4-5, FIG. 9)

  In the above soldering method, the solder is melted by heat conduction or radiant heat from the semiconductor chip. In this case, the heat supplied to the solder is dispersed (escapes) to the wiring pattern connected to the electrode portion. There is. On the other hand, the wiring patterns usually have different routing lengths and routes, and not all the wiring patterns have the same form, so the heat distribution mode (how to escape heat) is not uniform. For this reason, in the electrode portion where the heat distribution to the wiring pattern is small, the solder rises to the melting temperature in a relatively short time, but in the electrode portion where the heat dispersion is large, the solder temperature rises that much longer. Therefore, the time until the solder reaches the melting temperature is not uniform in all the electrode portions.

  On the other hand, as described in the above prior art (Patent Document 2), the management of the temperature profile at the time of soldering is important for guaranteeing connection reliability. For example, if the heating time from the heat block is set too short, the electrode portion that takes a long time to rise in temperature will not sufficiently melt the solder, resulting in poor connection. For this reason, in order to sufficiently melt the solder in all the electrode portions, it is necessary to set the heating time longer in accordance with the electrode portion that requires the most time for the temperature rise.

  However, if the overall heating time is set to be long, the amount of heat supplied will be excessive at the electrode part where the heat dispersion is small, and the solder will melt with the electrode part and terminal components to form an alloy (especially an alloy of gold and tin). Progress). When alloying proceeds at the soldered portion, an increase in electrical resistance and a decrease in connection strength are caused, resulting in a problem that connection reliability is lowered.

  Accordingly, the present invention has an object to provide a technique capable of maintaining the reliability of connection by soldering without causing variation in the temperature rise in the whole even when the heat distribution from the individual electrode portions is not uniform. It is what.

  First, the present invention provides an electronic circuit module in which an electronic circuit component is mounted on a mounting surface of an insulating substrate. A plurality of wiring patterns are formed on the mounting surface of the insulating substrate, and the plurality of wiring patterns are formed on the mounting surface and have different forms. Each of the plurality of wiring patterns includes an electrode part. These electrode portions are connected to a plurality of terminals of the electronic circuit component.

  In addition, the electronic circuit module according to the present invention reduces the usage amount of solder provided between each electrode portion and each terminal of the electronic component connected thereto to a morphological difference between a plurality of wiring patterns. The above-mentioned problem is solved by individually adjusting in advance according to the difference in heat capacity caused by the cause.

  That is, since the plurality of wiring patterns have various forms (the length and route of handling), the individual heat capacities are not uniform. In particular, a wiring pattern having a large heat capacity is likely to take heat, and thus the temperature rise of the solder is slow. Conversely, a wiring pattern having a small heat capacity does not take much heat and the temperature rise of the solder is fast. Therefore, adjust the amount of solder used on the electrode in advance for wiring patterns with a large heat capacity, and adjust the amount of solder used on the electrode in advance for wiring patterns with a small heat capacity. By doing so, the total heat capacity of the wiring pattern and the solder is made uniform. As a result, when the electronic circuit component is heated to melt the solder, the temperature rise of the solder can be leveled for all the electrode parts, so that the supply of heat to the solder is excessive in some electrode parts. Therefore, it is possible to prevent the alloying at the soldering portion and maintain the connection reliability.

  More specifically, the value obtained by dividing the combined heat capacity of each wiring pattern and solder by the area of each electrode part is adjusted to the amount of solder used that is substantially uniform when viewed between a plurality of wiring patterns. Yes.

  For example, in a wiring pattern used as a ground (grounding electrode) in an electronic circuit, electrode portions may be formed at a plurality of locations. On the other hand, an electrode part is a part connected with the terminal of an electronic circuit component in a wiring pattern, The area is substantially uniform irrespective of the form of a wiring pattern (there is some difference). For this reason, even when a plurality of electrode portions are formed on a common wiring pattern (such as a ground) connected to one, the total heat capacity of the wiring pattern and the solder combined with the area of the electrode portion ( If the value divided by the sum of the plurality is substantially equal to the others, the heat capacity per electrode part is substantially uniform for all. As a result, even if all the wiring patterns are not separated from each other, the temperature rise of the solder can be leveled for each electrode portion, so that the connection reliability by soldering can be maintained.

  Secondly, the present invention provides an electronic circuit module in which the amount of solder used is adjusted in advance at another cut end. That is, the second invention provides an insulating substrate having electronic circuit components mounted on a predetermined mounting surface, a plurality of wiring patterns formed on the mounting surface of the insulating substrate and having different areas, and a plurality of wiring patterns. A plurality of electrode portions each configured in part and individually connected to a plurality of terminals of the electronic circuit component, and provided between each electrode portion and each terminal of the electronic component connected thereto The electronic circuit module includes a connection solder whose use amount is individually adjusted in advance according to the area difference between the plurality of wiring patterns. In the second aspect of the invention, the amount of solder provided in the electrode portion of the wiring pattern having a relatively small area is adjusted more than the amount of use provided in the electrode portion of the wiring pattern having a relatively large area.

  Since the wiring pattern is usually formed on the mounting surface with a substantially uniform thickness, the larger the area, the easier it is to release heat from the solder, and vice versa. It tends to be difficult. Therefore, in the second invention, the amount of solder provided on the electrode portion is adjusted in advance according to the difference in the area of the wiring pattern to compensate for the difference in total heat escape. Thereby, since the temperature rise of the solder is leveled in all the electrode portions, the reliability of the connection by soldering can be maintained as in the first invention.

  In the second invention, the wiring pattern having a relatively large area includes that used for the ground in the electronic circuit. In this case, even if the laying area of the wiring pattern is increased to be used as a ground, or the entire area of the wiring pattern is increased due to the formation of a plurality of electrode portions, the wiring pattern having a smaller area is also used. Since the amount of solder used is adjusted to a higher level, the temperature rise during soldering is leveled as a result.

  In this invention, the electrode part of a wiring pattern or the terminal of an electronic circuit component contains gold | metal | money at least in the surface layer, and the solder used for these connections is an alloy which has tin as a main component.

  The use of gold (Au) or gold-plated terminals for electronic circuit components has the advantage of reducing connection loss and reducing loss. However, it is generally known that gold (Au) -solder connection is not suitable for high temperature use. Specifically, since the alloying of gold (Au) and tin (Sn) proceeds excessively in a high temperature state, there is a problem that the connection resistance is increased and the connection strength is decreased as described above. .

  In this regard, in the present invention, as described above, the temperature rise of the solder is leveled in all the electrode parts, and the excessive supply of heat to the solder is suppressed in some electrode parts. No alloying with tin is allowed to proceed. For this reason, even if gold is used for the terminals of the electronic circuit component, the reliability of connection is not lowered during soldering, and the merit (loss reduction) can be fully utilized.

  Moreover, the electronic circuit module of this invention may be the aspect further provided with the resin-made solder resist which is provided on the mounting surface of an insulated substrate and coat | covers the circumference | surroundings of an electrode part at least.

  That is, in the present invention, since the amount of solder used is adjusted and provided on the electrode in advance, in the electrode portion where the amount used is adjusted to a large amount, the solder before soldering (solder applied in advance) is removed from the electrode portion. May protrude. Even in this case, when the solder melts during actual soldering, it is attracted to the solder on the electrode portion by its surface tension, so that the solder protruding from the electrode portion is not left on the solder resist as it is.

  Moreover, the electronic circuit module of this invention can be manufactured using the following manufacturing methods. That is, the manufacturing method of the present invention includes a step of forming a plurality of wiring patterns having different forms on a mounting surface of an insulating substrate, and a part of the plurality of wiring patterns as electrode portions, and soldering on each of these electrode portions. And soldering while pressing the electronic circuit component to be mounted on the insulating substrate onto the mounting surface in a heated state, and bringing the terminals of the electronic circuit component into contact with the solder on the corresponding electrode parts, respectively. And a step of cooling the solder to complete the soldering of the electrode portion and the terminals of the electronic circuit component. Among these, in the step of applying the solder, in particular, the solder that has been adjusted in advance to an amount that makes the time for melting the solder on each electrode portion substantially the same in the step of melting the next solder is individually applied.

  As described above, in the manufacturing method of the present invention, when the solder is melted while actually heating the electronic circuit component, the amount of solder applied is adjusted in advance in consideration of heat distribution to the wiring pattern. The time for melting the solder on all the electrode portions can be made substantially uniform. The “time for melting the solder” here means the time until the solder is actually raised to the melting temperature in the process of melting the solder (for example, the timing at which the solder starts to melt).

  According to the manufacturing method of the present invention, even if the heat distribution method is different for each wiring pattern, when the solder is actually heated, it is almost the same time period (need to be completely simultaneous) Since the solder reaches the melting temperature, the temperature profile of the solder does not become extremely nonuniform between the electrode portions. Therefore, the alloying of the terminal and the solder does not proceed excessively in some of the electrode portions, and the overall connection reliability can be improved.

Preferably, the following elements are added in the manufacturing method of the present invention.
That is, in the step of applying the solder, a solder material in the opening is mounted in a state in which a mask member whose area of each opening is adjusted in advance corresponding to each electrode is placed on the mounting surface of the insulating substrate. In this case, solder is applied to the electrode portion.

  In this case, since a pre-adjusted amount of solder can be easily applied by a printing method using a mask material prepared in advance, the production efficiency can be improved accordingly.

In the manufacturing method of the present invention, the following elements may be applied.
(1) In the step of applying the solder, a value obtained by dividing the heat capacity of the individual wiring patterns and the solder by the area of each electrode portion is substantially uniform when viewed between the plurality of wiring patterns. The solder adjusted to a certain amount is applied.

(2) The step of forming the wiring pattern may form a plurality of wiring patterns having different areas. In this case, in the step of applying the solder, the amount of solder applied to the electrode portion of the wiring pattern having a relatively small area is set to the amount of solder applied to the electrode portion of the wiring pattern having a relatively large area. To do more.

(3) In the step (2), in the step of forming the wiring pattern, the wiring pattern having a relatively large area is formed including that used for the ground in the electronic circuit.

(4) The manufacturing method of the present invention may further include a step of preparing an electronic circuit component having an electrode portion containing gold at least on the surface layer prior to the step of melting the solder. Moreover, the step of forming the wiring pattern may include an element for gold plating the surface layer of the electrode part. In this case, in the step of applying the solder, tin or an alloy containing tin as a main component is used as the solder.

(5) The manufacturing method of the present invention may further include a step of coating at least the periphery of the electrode portion on the mounting surface with a resin solder resist prior to the step of applying the solder.

  In any case, by adopting the above elements (1) to (5) in the manufacturing method of the present invention, alloying at the soldering portion is suppressed, and an electronic circuit module with higher connection reliability is produced. Can do.

  As described above, the present invention can prevent poor connection of soldered parts and lower connection reliability that occur during the manufacturing process of an electronic circuit module, and greatly improve the quality, reliability, and performance of the manufactured electronic circuit module. it can.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an exploded perspective view schematically showing the basic structure of the semiconductor module 10. The semiconductor module 10 is an example of an electronic circuit module configured by using, for example, a semiconductor chip 14 as an electronic circuit component and flip-chip mounting the semiconductor chip 14 on a mounting surface of a wiring substrate (insulating substrate) 12. .

  The semiconductor chip 14 is a bare chip in which a semiconductor integrated circuit is formed on a silicon substrate, for example. On one side of the semiconductor chip 14 (the side facing the wiring substrate 12 in FIG. 1), for example, gold bumps 16 (shown only on one side edge in FIG. 1) are provided on both side edges in the longitudinal direction. Is formed. The semiconductor chip 14 may be packaged. In FIG. 1, a flip chip mounting area A of the semiconductor chip 14 is shown on the wiring board 12 by a two-dot chain line.

  On the other hand, a plurality of wiring patterns 18, 20, 22, 24, 26, 28, 30, 32, 34 made of, for example, a metal thin film (copper foil) are formed on the front side mounting surface of the wiring board 12. Yes. The plurality of wiring patterns 18 to 34 constitute an electronic circuit (for example, a high frequency circuit) together with the semiconductor chip 14 mounted on the wiring board 12.

  Among the plurality of wiring patterns 18 to 34, for example, those used as the ground 18b in the electronic circuit are included. The wiring pattern 18 used as such a ground 18b is formed to have a particularly large area in the whole. The other wiring patterns 20 to 34 are also different from each other in form and area due to differences in the length and route of routing on the mounting surface.

  The plurality of wiring patterns 18 to 34 each have an electrode portion (no reference symbol in FIG. 1) in a part thereof. This electrode portion is a portion that is connected (soldered) to the gold bump 16 of the semiconductor chip 14 via solder. For this reason, FIG. 1 shows the solder 36 in an orderly attached (applied) state on each electrode portion. In the state where the semiconductor module 10 is actually completed as a product, the form of the solder 36 changes due to melting and solidification at the time of soldering, so that the orderly three-dimensional shape (cuboid shape) is as shown in FIG. However, in FIG. 1, the solder 36 is shown in an orderly three-dimensional shape in order to facilitate understanding of the structure of the finished product. In the present embodiment, the solder 36 is tin or an alloy containing tin as a main component. Although not shown in FIG. 1, another wiring pattern may be formed on the back surface of the wiring board 12, or the wiring board 12 may be a multilayer board.

  FIG. 2 is a plan view showing in detail the configuration of the wiring board 12 before the semiconductor chip 14 is mounted. First, as shown in FIG. 2A, electrode portions 18a, 20a, 22a, 24a, 26a, 28a, 30a, 32a, and 34a are secured in a part of the plurality of wiring patterns 18 to 34, respectively. Has been. As for the wiring pattern 18, four electrode portions 18a connected to the common ground 18b are secured. For the other wiring patterns 20 to 34, electrode portions 20a to 34a are secured one by one. These electrode portions 18 a to 34 a are in positions facing the gold bumps 16 in the mounting area A of the semiconductor chip 14. Moreover, the area ensured as electrode part 18a-34a does not have an extreme difference, and is substantially uniform.

  On the other hand, the amount of the solder 36 attached (applied) on each of the electrode portions 18a to 34a is adjusted in advance for each of the wiring patterns 18 to 34, and is not uniform for all. Specifically, the usage amount of the solder 36 is individually adjusted according to the following criteria.

(1) Heat Capacity Reference For the plurality of wiring patterns 18 to 34, the total heat capacity obtained by combining the specific heat capacity of each of the wiring patterns 18 to 34 and the heat capacity of the solder 36 provided on each of the electrode parts 18a to 34a, respectively. This is a standard for determining the amount of use in which the value divided by the area of 34a is substantially uniform. This standard is intended to make uniform as a whole by making up for the difference in heat capacity caused by the difference in the form (length and route of routing) between the wiring patterns 18 to 34 by the amount of solder 36 used. In addition, about the wiring pattern 18 which has the ground 18b, since the solder 36 is used for a total of four electrode parts 18a, the whole heat capacity shall be remove | divided by the total area of the four electrode parts 18a.

(2) Area standard This standard is much simpler than the heat capacity standard of (1) above. That is, it is a standard for determining the usage amount of the solder 36 according to the area on the mounting surface for each of the plurality of wiring patterns 18 to 34. This standard is intended to make the difference in heat dispersion (heat escape) caused by the difference in area between the wiring patterns 18 to 34 during soldering uniform depending on the amount of solder 36 used (application amount). Specifically, among the wiring patterns 18 to 34, those having a relatively large area are adjusted so that the usage amount (application amount) of the solder 36 is relatively small. On the other hand, with respect to a comparatively small area, the usage amount (application amount) of the solder 36 is adjusted relatively large.

  In this embodiment, if the usage amount of the solder 36 is adjusted by adopting the above-mentioned criterion (1) or (2), is the inherent heat capacity relatively large as shown in FIG. For the wiring pattern 18 having a relatively large area, the amount of solder 36 applied to each electrode portion 18a is relatively small. On the other hand, with respect to the other wiring patterns 20 to 34 having a relatively small specific heat capacity or a relatively small area, the amount of the solder 36 applied to the electrode portions 20a to 34a is relatively large. I understand that.

  Further, preferably, as shown in FIG. 2B, a region other than the electrode portions 18 a to 34 a on the mounting surface of the wiring board 12 may be covered with a solder resist 38. In this case, for the electrode portions 20 a to 34 a in which the usage amount (application amount) of the solder 36 is adjusted to be relatively large, the solder 36 protruding to the periphery is temporarily applied on the solder resist 38.

  By adjusting the amount of solder 36 used in advance as described above, the following advantages can be obtained in the manufacturing process of the semiconductor module 10. Hereinafter, the manufacturing method of the semiconductor module 10 will be described in the order of steps, and the advantages of this embodiment will be described.

  3 and 4 are diagrams illustrating a method for manufacturing the semiconductor module 10 in the order of steps. The longitudinal sections shown in FIGS. 3 and 4 are taken along the line III-III shown in FIG. 2B, for example. Hereinafter, the steps will be described in order.

[Step 1: Formation of wiring pattern]
3A: On the mounting surface of the wiring board 12, a plurality of wiring patterns 18 to 34 having the above-described differences in form and area are formed. In the individual wiring patterns 18 to 34, electrode portions 18a to 34a are secured at the time of formation.

[Process 2: Solder resist film formation]
Further, after the wiring patterns 18 to 34 are formed, a film of the solder resist 38 is formed around the electrode portions 18a to 34a as described above.

[Step 3: Application of solder]
In FIG. 3, (B): A metal mask 40 (mask member) is positioned and laid on the wiring board 12. In the metal mask 40 used here, openings 40a and 40b are formed in advance in accordance with the positions of the electrode portions 18a to 34a. These openings 40a and 40b are for printing a solder paste on each of the electrode portions 18a to 34a and applying the solder 36.

  Here, the opening portions 40a and 40b have their respective opening areas appropriately defined in order to adjust the usage amount (application amount) of the solder 36. For example, with respect to the electrode portion 18a, in order to adjust the usage amount (application amount) of the solder 36 to be relatively small, the opening width (W1 in the drawing) of the corresponding opening portion 40a is defined to be relatively narrow. For the portions 28a to 34a, the opening width (W2 in the figure) of the corresponding opening portion 40b is defined relatively wide in order to adjust the usage amount (application amount) of the solder 36 to be relatively large. The lengths of the openings 40a and 40b (in the depth direction as viewed in FIG. 3B) are defined in accordance with the lengths of the electrode portions 18a to 34a shown in FIG.

In FIG. 3, (C): Solder paste is printed by, for example, squeezing in a state where the metal mask 40 is correctly positioned.
In FIG. 3, (D): When the metal mask 40 is removed with the solder paste fixed, the solder 36 is applied (attached) on the mounting surface of the wiring board 12. At this time, the amount of the solder 36 on each of the electrode portions 18a to 34a is appropriately adjusted according to the areas of the openings 40a and 40b as described above.

[Step 4: Melting solder]
In FIG. 4E, the semiconductor chip 14 (bare chip) to be mounted on the wiring board 12 is adsorbed by the nozzle 42, and the temperature of the nozzle 42 is increased to heat the semiconductor chip 14. Further, the semiconductor chip 14 is correctly positioned with respect to the wiring board 12 (flip chip mounting position), and the nozzle 42 is lowered with each gold bump 16 facing the corresponding electrode portion 18a to 34a (solder 36). The semiconductor chip 14 is pressed against the wiring board 12.

  In FIG. 4F, the solder 36 is heated via the high-temperature gold bumps 16 while pressing the semiconductor chip 14 against the wiring board 12. At this time, since the usage amount (application amount) of the solder 36 is adjusted in advance for each of the electrode portions 18a to 34a as described above, the temperature rise of the solder 36 is substantially uniform for all the electrode portions 18a to 34a. It will show changes over time (but not always the same). For this reason, in Step 4, the timing at which the solder 36 melts for all the electrode portions 18a to 34a after the solder 36 starts to be heated substantially coincides.

  When the solder 36 melts, the solder 36 adheres so as to cover the surface of the gold bump 16 widely. As for the electrode portions 20a to 34a, the portion that protrudes on the solder resist 38 (part of the solder 36) is attracted by the surface tension and collected on each of the electrode portions 20a to 34a.

[Step 5: Cooling of solder]
Thereafter, when heating is performed until the solder 36 is sufficiently melted, the heating from the nozzle 42 is released, and the solder 36 is cooled to below the melting point.

  In FIG. 4, (G): When the solder 36 is solidified and the soldering is completed, the suction of the nozzle 42 is released and the semiconductor chip 14 is released. Thereby, the finished product as the semiconductor module 10 can be obtained.

  Even in the state of the finished product as the semiconductor module 10, the wiring patterns 18 to 34 are formed on the mounting surface of the wiring substrate 12, and the gaps between the electrode portions 18 a to 34 a and the gold bumps 16 are formed. The solder 36 whose usage amount (application amount) has been adjusted is still present. In such a solder 36, the temperature change is leveled in the melting process, and the amount of heat supplied does not become excessive in part, so gold (Au) -tin is formed between the gold bumps 16. Alloying of (Sn) has hardly progressed. For this reason, even in the finished product, the connection reliability at the soldering portion is high, and good electrical characteristics using the gold bumps 16 can be exhibited.

  The present invention can be implemented with various modifications without being limited to the above-described embodiments. For example, the present invention can be implemented as an electronic circuit module in which various devices such as a high frequency filter (surface acoustic wave filter) and a high frequency oscillation circuit are flip-chip mounted in addition to a semiconductor chip.

  In addition, the form of the wiring patterns 18 to 34, the area on the mounting surface, the arrangement of the electrode portions 18a to 34a, and the like described in the embodiment are merely examples, and these can be appropriately modified.

  In the embodiment, only two types of openings 40a and 40b of the metal mask 40 are used. However, if the usage amount (application amount) of the solder 36 is adjusted more strictly, the sizes of the openings can be varied. You may prescribe.

1 is an exploded perspective view schematically showing a basic structure of a semiconductor module. It is a top view which shows in detail the structure of the wiring board before a semiconductor chip is mounted. It is the figure (1/2) explaining the manufacturing method of the semiconductor module in order of a process. It is FIG. (2/2) explaining the manufacturing method of the semiconductor module in order of a process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor module 12 Wiring board 14 Semiconductor chip 16 Gold bump 18, 20, 22, 24, 26, 28, 30, 32, 34 Wiring pattern 18a, 20a, 22a, 24a, 26a, 28a, 30a, 32a, 34a Electrode part 36 Solder 38 Solder resist 40 Metal mask

Claims (8)

An insulating substrate on which electronic circuit components are mounted on a predetermined mounting surface;
A plurality of wiring patterns formed on the mounting surface of the insulating substrate and having different forms;
A plurality of electrode parts configured to be part of each of the plurality of wiring patterns, to which a plurality of terminals of the electronic circuit component are individually connected;
It is provided between each electrode part and each terminal of the electronic component connected to the electrode part, and the amount of use is previously determined according to the difference in heat capacity caused by the difference in form between the plurality of wiring patterns. An electronic circuit module comprising: individually adjusted solder for connection. The electronic circuit module according to claim 1,
The solder is
A value obtained by dividing the heat capacity of each of the wiring patterns and the solder by the area of each of the electrode portions is adjusted to a usage amount that is substantially uniform between the plurality of wiring patterns. Electronic circuit module. An insulating substrate on which electronic circuit components are mounted on a predetermined mounting surface;
A plurality of wiring patterns formed on the mounting surface of the insulating substrate and having different areas from each other;
A plurality of electrode parts configured to be part of each of the plurality of wiring patterns, to which a plurality of terminals of the electronic circuit component are individually connected;
It is provided between each electrode part and each terminal of the electronic component connected to the electrode part, and a connection amount whose usage is individually adjusted in advance according to an area difference between the plurality of wiring patterns. With solder,
The solder is
An electronic circuit module characterized in that a usage amount provided in the electrode portion of the wiring pattern having a relatively small area is larger than a usage amount provided in the electrode portion of the wiring pattern having a relatively large area. The electronic circuit module according to claim 3,
The electronic circuit module, wherein the wiring pattern having a relatively large area includes a wiring pattern used for a ground in an electronic circuit. The electronic circuit module according to any one of claims 1 to 4,
The electrode part or the terminal of the electronic circuit component contains gold at least on the surface layer,
The electronic circuit module, wherein the solder is tin or an alloy containing tin as a main component. The electronic circuit module according to any one of claims 1 to 5,
An electronic circuit module, further comprising a resin solder resist provided on the mounting surface and covering at least the periphery of the electrode portion. Forming a plurality of wiring patterns having different forms on the mounting surface of the insulating substrate;
Applying a part of each of the plurality of wiring patterns as an electrode part and applying solder to each of the electrode parts;
The electronic circuit component to be mounted on the insulating substrate is pressed on the mounting surface in a heated state, and the plurality of terminals of the electronic circuit component are respectively brought into contact with the solder on the corresponding electrode portion, thereby melting the solder. And a process of
A step of cooling the solder to complete the soldering of the electrode part and the terminal of the electronic circuit component,
In the step of applying the solder, the electronic circuit is individually applied so that the time for melting the solder on each electrode portion in the step of melting the solder is adjusted to be substantially the same. Module manufacturing method. In the manufacturing method of the electronic circuit module of Claim 7,
In the step of applying the solder,
The electrode part is filled with a solder material in a state where a mask member whose area of each opening part is adjusted in advance corresponding to each electrode part is placed on the mounting surface of the insulating substrate. A method of manufacturing an electronic circuit module, wherein solder is applied to the substrate.