JP2009194181A - Surface position detection apparatus, surface position detection method, exposure apparatus, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect a surface position of a test surface with high accuracy without being affected by fluctuation of an optical member.
A light-transmitting optical system (5, 7, 8) that guides measurement light from a plurality of measurement marks to a test surface (Wa) and guides reference light from the plurality of reference marks to the vicinity of the test surface. The measurement light reflected by the test surface is guided to the first observation surface (13a) to form measurement mark images of a plurality of measurement marks, and the reference light that passes through the vicinity (9a) of the test surface is used as the second observation surface. A light receiving optical system (18, 17, 15) that leads to (14a) to form a reference mark image of a plurality of reference marks, each measurement mark position information of the plurality of measurement mark images on the first observation surface, and the second observation surface The reference mark position information of a plurality of reference mark images is detected, and the surface position of the test surface is calculated for each measurement mark image using the measurement mark position information of the measurement mark image and one reference mark position information. And a detector (14, 13, 12, 11, PR). .
[Selection] Figure 1

Description

  The present invention relates to a surface position detection apparatus, a surface position detection method, an exposure apparatus, and a device manufacturing method that detect a surface position of a surface to be measured.

  In an exposure apparatus that transfers a pattern formed on a mask onto a photosensitive substrate via a projection optical system, the projection optical system has a shallow depth of focus, and the transfer surface (exposure surface) of the photosensitive substrate is not flat. There is also. For this reason, in the exposure apparatus, it is necessary to accurately adjust the positioning of the transfer surface of the photosensitive substrate with respect to the imaging surface of the projection optical system.

  For example, a grazing incidence type autofocus sensor is known as a surface position detecting device for detecting the surface position of the photosensitive substrate (the surface position of the transfer surface) along the optical axis direction of the projection optical system (see Patent Document 1). ). In this oblique incidence type autofocus sensor, a slit image is projected from an oblique direction onto a photosensitive substrate as a test surface, and position information of the slit image formed by light reflected from the test surface is detected. The surface position of the photosensitive substrate is detected based on the position information.

JP-A-4-21015

  In the above-described grazing incidence type autofocus sensor, when a variation (position variation, refractive index variation, etc.) of an optical member in the optical system constituting the grazing incidence type autofocus sensor occurs, the surface position of the photosensitive substrate is accurately determined. There was a problem that it could not be detected.

  The present invention has been made in view of the above-described problems, and a surface position detection apparatus, a surface position detection method, and the like that can detect the surface position of the surface to be measured with high accuracy without being affected by fluctuations in the optical member, An object of the present invention is to provide an exposure apparatus and a device manufacturing method.

In order to solve the above problems, in the surface position detection device of the present invention, the measurement light from a plurality of measurement marks is guided to the surface to be measured, and the reference light from a plurality of reference marks that is smaller than the plurality of measurement marks A light transmission optical system that leads to the vicinity of the test surface;
The measurement light reflected by the test surface is guided to a first observation surface to form measurement mark images of the plurality of measurement marks on the first observation surface, and the reference light that passes through the vicinity of the test surface is used. A light receiving optical system that guides to a second observation surface and forms reference mark images of the plurality of reference marks on the second observation surface;
The measurement mark position information of the plurality of measurement mark images on the first observation surface and the reference mark position information of the plurality of reference mark images on the second observation surface are detected, and the measurement mark image is detected for each measurement mark image. A detection unit that calculates a surface position of the test surface using the measurement mark position information of the image and one reference mark position information;
It is provided with.

In the surface position detection method of the present invention, measurement light from a plurality of measurement marks is guided to the surface to be measured, and reference light from a plurality of reference marks that is smaller than the plurality of measurement marks is guided to the vicinity of the surface to be measured. Light step,
The measurement light reflected by the test surface is guided to a first observation surface to form measurement mark images of the plurality of measurement marks on the first observation surface, and the reference light that passes through the vicinity of the test surface is used. A light receiving step for guiding the second observation surface to form reference mark images of the plurality of reference marks on the second observation surface;
The measurement mark position information of the plurality of measurement mark images on the first observation surface and the reference mark position information of the plurality of reference mark images on the second observation surface are detected, and the measurement mark image is detected for each measurement mark image. A detection step of calculating a surface position of the test surface using the measurement mark position information of the image and one reference mark position information;
It is characterized by including.

In the exposure apparatus of the present invention, in an exposure apparatus for transferring a pattern to a photosensitive substrate,
A surface position detecting device of the present invention for detecting at least one surface position of a pattern surface provided with the pattern or a transfer surface of the photosensitive substrate as a surface position of the test surface;
An alignment means for aligning at least one of the pattern surface and the transfer surface based on a detection result of the surface position detection device;
It is characterized by having.

In the device manufacturing method of the present invention, using the exposure apparatus according to the present invention, an exposure step of transferring the pattern onto the transfer surface of the photosensitive substrate detected by the surface position detection device;
Developing the photosensitive substrate to which the pattern has been transferred, and forming a transfer pattern layer having a shape corresponding to the pattern on the surface of the photosensitive substrate;
And a processing step of processing the surface of the photosensitive substrate through the transfer pattern layer.

  In the surface position detection apparatus and method of the present invention, the reference light from the plurality of reference marks is guided to the observation surface via the optical member common to the measurement light from the plurality of measurement marks. Unlike the measurement light, this reference light does not contain information on the movement of the test surface, but, like the measurement light, contains information on the influence of fluctuations in the optical member common to the measurement light. Therefore, for example, based on the positional deviation amount of the reference mark image on the observation surface, it is possible to measure the detection error of the surface position of the test surface due to the fluctuation of the optical member.

  Specifically, in the surface position detection apparatus and method of the present invention, each measurement mark position information of a plurality of measurement mark images and each reference mark position information of a plurality of reference mark images on the observation surface are detected, and each measurement mark image is detected. The surface position of the test surface is calculated using the measurement mark position information of the measurement mark image and one reference mark position information. As a result, the surface position detection apparatus, the surface position detection method, the exposure apparatus, and the device manufacturing method according to the present invention can detect the surface position of the test surface with high accuracy without being affected by the fluctuation of the optical member.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a drawing schematically showing a configuration of an exposure apparatus provided with a surface position detection apparatus according to an embodiment of the present invention. In FIG. 1, the Z axis is set in the direction of the optical axis AX of the projection optical system PL, the X axis is set parallel to the paper surface of FIG. 1 in the plane perpendicular to the optical axis AX, and the Y axis is set perpendicular to the paper surface of FIG. is doing. In this embodiment, the surface position detection device of the present invention is applied to the detection of the surface position of the photosensitive substrate on which the pattern is transferred by the exposure device.

  The illustrated exposure apparatus includes an illumination system IL that illuminates a reticle R as a mask on which a predetermined pattern is formed with illumination light (exposure light) emitted from an exposure light source (not shown). The reticle R is held parallel to the XY plane on the reticle stage RS. Reticle stage RS can be moved two-dimensionally along the XY plane by the action of a drive system (not shown), and its position coordinates are measured and controlled by a reticle interferometer (not shown). It is configured.

  The exposure light transmitted through the reticle R forms an image of the pattern of the reticle R on the surface (transfer surface) Wa of the wafer W, which is a photosensitive substrate, via the projection optical system PL. The wafer W is held along the XY plane on the wafer stage WS. The wafer stage WS can be leveled (leveled), moved in the Z direction (focusing direction), moved two-dimensionally along the XY plane, and rotated around the Z axis by the action of a drive system (not shown). The position coordinates are measured and controlled by a wafer interferometer (not shown).

  In order to satisfactorily transfer the circuit pattern provided on the pattern surface of the reticle R to each exposure area on the transfer surface Wa of the wafer W, an image plane formed by the projection optical system PL is provided for each exposure area. It is necessary to align the current exposure area within the range of the focal depth width. For this purpose, after accurately detecting the position of each point in the current exposure area along the optical axis AX, that is, the surface position of the current exposure area, the leveling of the wafer stage WS and the Z direction are performed based on the detection result. Therefore, the wafer W may be leveled and moved in the Z direction.

  Therefore, the exposure apparatus of the present embodiment includes a surface position detection device for detecting the surface position of the exposure region. Referring to FIG. 1, the surface position detection apparatus of the present embodiment includes a light source 1 that supplies light used for the detection. In general, the surface of the wafer W, which is the test surface, is covered with a thin film such as a resist. Therefore, in order to reduce the influence of interference due to the thin film, the light source 1 is a white light source having a wide wavelength width (for example, a halogen lamp that supplies illumination light having a wavelength width of 600 to 900 nm, or illumination having a wide band similar to this. A xenon light source that supplies light is desirable. As the light source 1, a light emitting diode that supplies light in a wavelength band with low sensitivity to a resist can be used.

  The light from the light source 1 is incident on the light transmitting prism 3 for measurement light and the light transmitting prism 4 for reference light via the condenser lens 2. The light transmitting prisms 3 and 4 deflect the light from the condenser lens 2 in the −Z direction by refraction. On the exit surface 3a of the light transmission prism 3, for example, twelve light transmission slits S1 to S12 for measurement light arranged as shown in FIG. 2 are provided.

  On the exit surface 4a of the light transmission prism 4, for example, three light transmission slits S13 to S15 for reference light arranged as shown in FIG. 2 are provided. The exit surface 3a and the exit surface 4a are parallel to each other. In FIG. 2, the y1 axis is set in the direction parallel to the Y axis of the entire coordinates on the exit surface 3a, and the x1 axis is set in the direction orthogonal to the y1 axis on the exit surface 3a.

  The light transmission slits S1 to S15 are rectangular (slit-shaped) light transmission portions that are elongated in an oblique direction, for example, 45 degrees with the x1 direction and the y1 direction, and the regions other than the light transmission slits S1 to S15 are light shielding portions. is there. The light transmission slits S1 to S12 are arranged in a line at a predetermined pitch along the x1 direction, and the light transmission slits S13 to S15 are provided at intervals from the light transmission slits S1 to S12 in the y1 direction and along the x1 direction. They are arranged in a line at a predetermined pitch. That is, the light transmission slits S13 to S15 as reference marks are arranged in parallel with the row of light transmission slits S1 to S12 as measurement marks.

  Further, the x1 coordinate of the light transmission slit S13 coincides with the x1 coordinate of the intermediate position between the light transmission slits S2 and S3, and the x1 coordinate of the light transmission slit S14 matches the x1 coordinate of the intermediate position between the light transmission slits S6 and S7. In addition, the x1 coordinate of the light transmission slit S15 coincides with the x1 coordinate of the intermediate position between the light transmission slits S10 and S11.

  As described above, the light source 1 and the condenser lens 2 constitute a collective illumination device that collectively illuminates the light transmission slits S1 to S12 for measurement light and the light transmission slits S13 to S15 for reference light. The light that has passed through the light transmission slits S <b> 1 to S <b> 12 as measurement marks is used as measurement light for detecting the surface position of the wafer W. The light that has passed through the light transmission slits S13 to S15 as reference marks is used as reference light for measurement of detection errors caused by fluctuations in the optical members of the surface position detection device. Various modifications can be made with respect to the shape, number, arrangement, form, etc. of the measurement mark and the reference mark. However, the number of reference marks is smaller than the number of measurement marks.

  The measurement light that has passed through the light transmission slits S1 to S12 and the reference light that has passed through the light transmission slits S13 to S15 are incident on the second objective lens 5, the vibrating mirror 6 as scanning means, and the first objective lens 7. The light enters the prism 8. The second objective lens 5 and the first objective lens 7 cooperate to form an intermediate image of the light transmission slits S1 to S15. The vibrating mirror 6 is disposed at the front focal position of the first objective lens 7 and is configured to be rotatable around the Y axis as indicated by an arrow in FIG. The epi-illumination prism 8 is a prism member having a parallelogram section along the XZ plane and having a columnar shape in the Y direction.

  The measurement light Lm incident on the incident surface 8a of the epi-prism 8 along the measurement optical path shown by the solid line in FIG. 3 is sequentially reflected by the reflecting surfaces 8b and 8c and translated in the Z direction, and then is viewed from the exit surface 8d. Along the measurement optical path indicated by the solid line, the light enters the detection area A on the transfer surface Wa as the test surface from an oblique direction. This incident angle is set to a large angle of, for example, 80 degrees or more and less than 90 degrees. On the other hand, the reference light Lr incident on the incident surface 8a of the epi-prism 8 along the reference optical path indicated by the broken line in the figure is sequentially reflected by the reflecting surfaces 8b and 8c and translated in the Z direction, and then from the exit surface 8d. The light enters the surface 9a of the plane mirror 9 from an oblique direction along a reference optical path indicated by a broken line in the figure. In FIG. 3, the measurement optical path indicated by the solid line and the reference optical path indicated by the broken line are separated not only in the Z direction but also in the Y direction.

  Thus, an intermediate image (measurement mark intermediate image) of the light transmission slits S1 to S12 as the measurement mark is projected onto the detection region A. That is, in the detection area A, twelve measurement light irradiation areas extending in an oblique direction that forms 45 degrees with the X direction and the Y direction corresponding to the light transmission slits S1 to S12 have a predetermined pitch along the X direction. Formed with. The center of each measurement light irradiation region corresponds to the detection point in the detection region A. In addition, on the reflecting surface 9a of the flat mirror 9, three rectangular intermediate images extending in an oblique direction that forms 45 degrees with the X direction and the Y direction, corresponding to the light transmission slits S13 to S15 as reference marks. (Reference mark intermediate image) is formed at a predetermined pitch along the X direction. That is, three reference mark intermediate images arranged in parallel with a row of 12 measurement mark intermediate images are projected in the vicinity of the transfer surface Wa as the test surface.

  Thus, the plane mirror 9 constitutes a reference member having a reflection surface 9a as a reference surface provided in the vicinity of the transfer surface Wa. Further, the second objective lens 5, the vibrating mirror 6, the first objective lens 7, and the epi-illumination prism 8 guide the measurement light from the light transmission slits S1 to S12 to the transfer surface Wa and transfer the measurement mark intermediate image to the transfer surface Wa. The light transmission optical system to project is comprised. The light transmission optical system guides the reference light from the light transmission slits S13 to S15 arranged on the light transmission side conjugate surface of the reference surface 9a by the light transmission optical system to the reference surface 9a, and the reference mark intermediate image is referred to as the reference surface. 9a is formed.

  The measurement light Lm reflected by the transfer surface Wa and the reference light Lr reflected by the reflection surface 9a of the flat mirror 9 are incident on the incident light prism 18. The epi-illumination prism 18 is disposed at a position symmetrical to the epi-illumination prism 8 with respect to a predetermined YZ plane (for example, the YZ plane including the optical axis AX) and has a symmetric configuration. Specifically, the incident light prism 18 has a configuration in which the incident light prism 8 is inverted with respect to the incident surface 8a. Therefore, the measurement light Lm and the reference light Lr incident on the incident surface 18a of the epi-prism 18 are sequentially reflected by the reflecting surfaces 18b and 18c and translated in the Z direction, and then emitted from the exit surface 18d.

  Referring to FIG. 1, the measurement light emitted from the epi-illumination prism 18 enters the light-receiving prism 13 for measurement light via the first objective lens 17, the mirror 16, and the second objective lens 15. The reference light emitted from the incident light prism 18 enters the light receiving prism 14 for reference light via the first objective lens 17, the mirror 16, and the second objective lens 15. The first objective lens 17, the mirror 16, and the second objective lens 15 are related to a predetermined YZ plane (for example, a YZ plane including the optical axis AX), the first objective lens 7, the vibrating mirror 6, and the second objective lens 5. Are arranged at symmetrical positions and have symmetrical structures. However, unlike the vibration mirror 6, the mirror 16 is fixedly installed.

  The light receiving prisms 13 and 14 are disposed at symmetrical positions with respect to the light transmitting prisms 3 and 4 with respect to a predetermined YZ plane (for example, the YZ plane including the optical axis AX), and have symmetrical configurations. However, on the incident surface 13a of the light receiving prism 13 for measurement light (surface corresponding to the exit surface 3a of the light transmitting prism 3), as shown in FIG. 4, twelve light receiving portions corresponding to the light transmitting slits S1 to S12 are provided. Slits Sa1 to Sa12 are provided.

  On the incident surface 14a of the light receiving prism 14 for reference light (surface corresponding to the exit surface 4a of the light transmitting prism 4), as shown in FIG. 4, three light receiving slits Sa13 corresponding to the light transmitting slits S13 to S15 are provided. To Sa15. In FIG. 4, on the incident surface 13a of the light receiving prism 13 parallel to the incident surface 14a of the light receiving prism 14, the y2 axis is in a direction parallel to the Y axis of the entire coordinates, and the x2 axis is orthogonal to the y2 axis on the incident surface 13a. It is set.

  The light receiving slits Sa <b> 1 to Sa <b> 15 are rectangular (slit-shaped) light transmitting portions that are elongated in an oblique direction forming 45 degrees with the x <b> 2 direction and the y <b> 2 direction, and regions other than the light receiving slits Sa <b> 1 to Sa <b> 15 are light shielding portions. The light receiving slits Sa1 to Sa12 are arranged at a predetermined pitch along the x2 direction, and the light receiving slits Sa13 to Sa15 are spaced apart from the light receiving slits Sa1 to Sa12 in the y2 direction, and at a predetermined pitch along the x2 direction. It is arranged.

  Observation images (measurement mark images) of the transmission slits S1 to S12 for measurement light are formed on the incident surface 13a of the light receiving prism 13, and light transmission slits S13 to S15 for reference light are formed on the incident surface 14a of the light reception prism 14. Observation images (reference mark images) are formed. That is, twelve rectangular measurement mark images extending in an oblique direction at 45 degrees with respect to the x2 direction and the y2 direction correspond to the light transmission slits S1 to S12 on the incident surface 13a along the x2 direction. It is formed with the pitch. In addition, on the incident surface 14a, three rectangular reference mark images extending in an oblique direction at 45 degrees with respect to the x2 direction and the y2 direction corresponding to the light transmission slits S13 to S15 are predetermined along the x2 direction. It is formed with the pitch. In other words, three reference mark images arranged in parallel with a row of 12 measurement mark images are formed on the incident surfaces 13a and 14a as observation surfaces.

  As described above, the incident-light prism 18, the first objective lens 17, the mirror 16, and the second objective lens 15 guide the measurement light reflected by the transfer surface Wa to the incident surface 13a of the light receiving prism 13 as the first observation surface. Thus, a light receiving optical system for forming a measurement mark image on the incident surface 13a is configured. The light receiving optical system guides the reference light reflected by the reference surface 9a to the incident surface 14a of the light receiving prism 14 which is the second observation surface arranged on the light receiving side conjugate surface of the reference surface 9a by the light receiving optical system. A mark image is formed on the incident surface 14a. The direction in which the twelve measurement mark intermediate images are formed on the transfer surface Wa (that is, the X direction) includes the emission optical axis of the measurement light in the light transmitting optical system and the incident optical axis of the measurement light in the light receiving optical system. It is parallel to the line of intersection between the XZ plane and the transfer surface Wa.

  FIG. 5 is a diagram schematically showing a configuration from the light source to the light receiving prism by linearly developing an optical path from the light transmitting prism to the light receiving prism. In FIG. 5, in order to facilitate understanding of the configuration from the light source 1 to the light receiving prisms 13, 14, a light transmission optical system including the second objective lens 5, the vibrating mirror 6, the first objective lens 7, and the incident prism 8. SL is simplified with one lens, and the light receiving optical system JL including the incident prism 18, the first objective lens 17, the mirror 16, and the second objective lens 15 is simplified with one lens, and the light transmitting optical system SL and the light receiving optics are simplified. Each optical path of the system JL is developed linearly.

  Referring to FIG. 1, the measurement light incident on the light receiving prism 13 passes through the light receiving slits Sa <b> 1 to Sa <b> 12, is deflected by a predetermined angle, and then exits from the light receiving prism 13. The reference light incident on the light receiving prism 14 passes through the light receiving slits Sa13 to Sa15, is deflected by a predetermined angle, and then is emitted from the light receiving prism 14. The measurement light and the reference light emitted from the light receiving prisms 13 and 14 are converted into a conjugate image of the measurement mark image and the reference mark image respectively formed in the light receiving slits Sa1 to Sa15 via the relay lens 12, and the photodetector 11 is used. On the detection surface 11a.

  On the detection surface 11a of the photodetector 11, as shown in FIG. 6, 15 light receiving portions RS1 to RS15 include 12 light receiving slits Sa1 to Sa12 for measurement light and 3 light receiving slits for reference light. It is provided so as to correspond to Sa13 to Sa15. The twelve light receiving parts RS1 to RS12 receive the measurement light that has passed through the twelve light receiving slits Sa1 to Sa12 corresponding to the light sending slits S1 to S12, and the three light receiving parts RS13 to RS15 are light sending slits S13 to S15. The reference light that has passed through the light receiving slits Sa13 to Sa15 corresponding to is received.

  A measurement mark image that is an observation image of the light transmission slits S1 to S12 moves in the x2 direction as the transfer surface Wa moves along the Z direction. Unlike the measurement mark image, the reference mark image, which is an observation image of the light transmission slits S13 to S15, does not pass through the transfer surface Wa and is not affected at all by the movement of the transfer surface Wa along the Z direction. Therefore, the light amount of the measurement light passing through the light receiving slits Sa1 to Sa12 changes according to the movement of the transfer surface Wa in the Z direction, but the light amount of the reference light passing through the light receiving slits Sa13 to Sa15 is changed in the Z direction movement of the transfer surface Wa. It is constant without dependence. In other words, the measurement light that has passed through the light receiving slits Sa1 to Sa12 includes information relating to the Z direction movement of the transfer surface Wa, while the reference light that has passed through the light receiving slits Sa13 to Sa15 is information relating to the Z direction movement of the transfer surface Wa. Is not included.

  In the surface position detection apparatus of the present embodiment, measurement mark images that are observation images of the light transmitting slits S1 to S12 are received by the light receiving slits Sa1 to Sa12 in a state where the transfer surface Wa coincides with the imaging surface of the projection optical system PL. The reference mark image that is the observation image of the light transmission slits S13 to S15 is formed at the position of the light receiving slits Sa13 to Sa15. The detection signals of the light receiving units RS1 to RS15 change in synchronization with the vibration of the vibrating mirror 6 and are supplied to the signal processing unit PR.

  As described above, when the transfer surface Wa moves up and down in the Z direction along the optical axis AX of the projection optical system PL, the measurement mark image formed on the incident surface 13a of the light receiving prism 13 moves up and down on the transfer surface Wa. Correspondingly, positional deviation occurs in the pitch direction (x2 direction). In the signal processing unit PR, for example, based on the principle of the photoelectric microscope disclosed in Japanese Patent Application Laid-Open No. 6-97045 by the present applicant, the positional deviation amount of the measurement mark image is detected, and the detection region A is detected based on the detected positional deviation amount. The Z direction position of each detection point is calculated.

  However, as described above, for example, the transfer surface Wa coincides with the imaging surface of the projection optical system PL due to the position variation and refractive index variation of the optical member constituting the surface position detection device (in the best focus state). Nevertheless, the positions of the measurement mark images S1i to S12i (not shown) formed on the incident surface 13a of the light receiving prism 13 may be displaced from the positions of the light receiving slits Sa1 to Sa12, respectively. In this case, a detection error of the surface position of the transfer surface Wa occurs according to the amount of positional deviation from the light receiving slits Sa1 to Sa12 of the measurement mark images S1i to S12i.

  In the surface position detection apparatus of the present embodiment, the reference light from the light transmission slits S13 to S15 is guided to the incident surface 14a of the light receiving prism 14 through the reference surface 9a provided in the vicinity of the transfer surface Wa, so that the measurement optical path A reference mark image is formed through a common optical member with the measurement light along a reference optical path close to the reference light path. Therefore, unlike the measurement light, the reference light does not include information related to the movement of the transfer surface Wa in the Z direction, but similarly to the measurement light, includes information related to the influence of fluctuations in the optical member common to the measurement light. That is, the amount of displacement of the reference mark images S13i to S15i (not shown) from the light receiving slits Sa13 to Sa15 is the amount of displacement from the light receiving slits Sa1 to Sa12 of the measurement mark images S1i to S12i formed by the measurement light in the best focus state. It is almost equal to the amount. Therefore, in the present embodiment, the detection error of the surface position of the transfer surface Wa can be measured based on the amount of displacement of the reference mark images S13i to S15i from the light receiving slits Sa13 to Sa15.

  Specifically, the signal processing unit PR detects each measurement mark position information of the twelve measurement mark images S1i to S12i on the incident surface 13a based on a signal related to the measurement light from the light receiving units RS1 to RS12. Further, the signal processing unit PR detects each reference mark position information of the three reference mark images S13i to S15i on the incident surface 14a based on a signal related to the reference light from the light receiving units RS13 to RS15. Then, for each measurement mark image, the signal processing unit PR calculates the surface position of the transfer surface Wa using the measurement mark position information and one reference mark position information.

  In the present embodiment, the measurement mark images S1i to S4i that are observation images of the light transmission slits S1 to S4 are associated with the reference mark image S13i that is the observation image of the light transmission slit S13, and the observation images of the light transmission slits S5 to S8 are used. A reference mark image S14i that is an observation image of the light transmission slit S14 is associated with a certain measurement mark image S5i to S8i, and an observation image of the light transmission slit S15 is associated with the measurement mark images S9i to S12i that are observation images of the light transmission slits S9 to S12. The reference mark image S15i is associated with each other, and for each measurement mark image, the surface position of the transfer surface Wa is calculated using the reference mark position information of the one associated reference mark image.

  In other words, in the present embodiment, the reference mark position information of the reference mark image associated according to the position of the measurement mark image, more specifically, the reference mark position information of the reference mark image closest to the measurement mark image Is used to calculate the surface position of the transfer surface Wa for each measurement mark image. However, various forms are possible for the association between each measurement mark image and one reference mark image.

  In the present embodiment, the signal processing unit PR calculates the temporary position of the transfer surface Wa as shown in FIG. 7A based on the measurement mark position information of the twelve measurement mark images S1i to S12i. In FIG. 7A, reference numeral A1 is a reference area in which four measurement mark intermediate images corresponding to the light transmission slits S1 to S4 are formed in the detection area A (hereinafter referred to as detection area A1). A2 is a region in which four measurement mark intermediate images corresponding to the light transmission slits S5 to S8 are formed in the detection region A (hereinafter referred to as detection region A2), and A3 is a light transmission slit in the detection region A. Regions where four measurement mark intermediate images corresponding to S9 to S12 are formed (hereinafter referred to as detection regions A3) are shown.

  The signal processing unit PR calculates the reference position of the transfer surface Wa based on the reference mark position information for each of the three reference mark images S13i to S15i, and based on the result of subtracting the reference position from the temporary position of the transfer surface Wa. In addition, the surface position of the transfer surface Wa is calculated as shown in FIG. That is, the surface position of the detection area A1 is calculated based on the reference mark position information of the reference mark image S13i from the temporary position of the detection area A1 obtained based on the measurement mark position information of the measurement mark images S1i to S4i. It is calculated by subtracting the reference position consisting of the reference measurement value a. Accordingly, the surface position of the detection area A1 shown in FIG. 7B is nothing but the temporary position of the detection area A1 shown in FIG. 7A translated by the reference measurement value a.

  Similarly, the surface position of the detection area A2 is based on the reference mark position information of the reference mark image S14i from the temporary position of the detection area A2 obtained based on the measurement mark position information of the measurement mark images S5i to S8i. It is calculated by subtracting the reference position consisting of the calculated reference measurement value b. In addition, the surface position of the detection area A3 is calculated based on the reference mark position information of the reference mark image S15i from the temporary position of the detection area A3 obtained based on the measurement mark position information of the measurement mark images S9i to S12i. This is calculated by subtracting the reference position consisting of the reference measurement value c.

  In the signal processing unit PR, as shown in FIG. 7C, the result of subtracting the reference position from the temporary position for each measurement mark image is smoothed according to the position of the measurement mark image as necessary. Thus, the final surface position of the transfer surface Wa is calculated. The surface position information of the transfer surface Wa obtained by the signal processing unit PR is supplied to the control unit CR. The control unit CR adjusts the Z direction position of the wafer stage WS by a required amount based on the surface position information supplied from the signal processing unit PR, and detects the detection area A on the transfer surface Wa and thus the current state of the wafer W. The exposure area is aligned with the image plane position (best focus position) of the projection optical system PL.

  As described above, the light receiving prisms 13 and 14, the relay lens 12, the photodetector 11, and the signal processing unit PR have the measurement mark position information and the three references of the 12 measurement mark images S1i to S12i on the incident surface 13a. Detection of detecting each reference mark position information of the mark images S13i to S15i and calculating the surface position of the transfer surface Wa using the measurement mark position information of the measurement mark image and one reference mark position information for each measurement mark image Part.

  As described above, in the surface position detection apparatus and method according to the present embodiment, the detection error due to the fluctuation of the optical member constituting the surface position detection apparatus is measured, and the transfer surface is not affected by the fluctuation of the optical member. Wa surface position can be detected with high accuracy. Therefore, in the exposure apparatus of the present embodiment, the surface position of the transfer surface Wa of the wafer W can be detected with high accuracy, and as a result, transferred to the imaging surface of the projection optical system PL corresponding to the pattern surface of the reticle R. The surface Wa can be aligned with high accuracy.

  In the surface position detection apparatus and method of the present embodiment, one reference mark image is associated with a plurality of measurement mark images, and the surface position of the plurality of measurement mark images is determined based on one reference mark position information. Since the detection is performed, for example, compared to the case where the surface position is detected with reference to different reference mark position information for each measurement mark image, the variation in detection accuracy for each measurement mark image is suppressed, and each measurement mark image is A high correlation can be given to the detection result based on it.

  However, when the surface positions of a wide area on the surface to be detected are detected by a large number of measurement mark images as in the present embodiment described above, if one reference mark image is associated with all the measurement mark images, For example, the relative position between the measurement mark image and the reference mark image is greatly different between the measurement mark image at the center and the measurement mark image at the end, and the correlation between the measurement mark image and the reference mark image is originally varied. May occur. For this reason, in the surface position detection apparatus and method of the present embodiment, a plurality of reference mark images smaller than that are associated with all measurement mark images, and a large difference in correlation with the reference mark according to the measurement mark image. As a result, measurement errors caused by fluctuations in the optical member can be corrected with high accuracy as a whole.

  In the first calculation procedure described with reference to FIG. 7, the reference position is subtracted from the temporary position of the test surface calculated based on the measurement mark position information of the measurement mark image. However, the present invention is not limited to this, and a second calculation procedure in which the reference mark position information is subtracted from the measurement mark position information at the image position information stage is also possible. Specifically, in the second calculation procedure, the correction position information is calculated by subtracting the reference mark position information of the reference mark image S13i from the measurement mark position information of the measurement mark images S1i to S4i, and based on this correction position information. The surface position of the detection area A1 is calculated.

  Similarly, correction position information is calculated by subtracting the reference mark position information of the reference mark image S14i from the measurement mark position information of the measurement mark images S5i to S8i, and the surface position of the detection area A2 is calculated based on the correction position information. To do. Further, correction position information is calculated by subtracting the reference mark position information of the reference mark image S15i from the measurement mark position information of the measurement mark images S9i to S12i, and the surface position of the detection area A3 is calculated based on the correction position information. . The calculated surface position of the test surface is smoothed as necessary to obtain a final surface position.

  By the way, referring to the surface position after the smoothing process shown in FIG. 7C, discontinuity of the surface position is observed between the detection areas A1 and A2 and between the detection areas A2 and A3. This discontinuity of the surface position can be suppressed to a small extent by adopting a calculation procedure using a correction coefficient. As the correction coefficient, for example, a correction coefficient corresponding to the position of the measurement mark image or a correction coefficient corresponding to the relative position from the reference mark image corresponding to the measurement mark image can be used.

  In the third calculation procedure using the correction coefficient corresponding to the position of the measurement mark image, the temporary position of the test surface is calculated based on the measurement mark position information as in the first calculation procedure. That is, based on the measurement mark position information of the twelve measurement mark images S1i to S12i, the temporary position of the transfer surface Wa is calculated as shown in FIG. Next, in the third calculation procedure, unlike the first calculation procedure, the reference position of the transfer surface Wa is calculated based on the reference mark position information and the correction coefficient of the three reference mark images S13i to S15i, and the transfer is performed. Based on the result of subtracting the reference position from the temporary position of the surface Wa, the surface position of the transfer surface Wa is calculated as shown by the solid line in FIG.

As an example, the surface position of the detection area A1 indicated by the solid line in FIG. 8B is obtained from the temporary position of the detection area A1 obtained based on the measurement mark position information of the measurement mark images S1i to S4i. The reference measurement value a calculated based on the reference mark position information and the reference position (a + k ₁ X) consisting of the product k ₁ X of the correction coefficient k ₁ and the position X of each of the measurement mark images S1i to S4i is subtracted. It is calculated by this. Similarly, the surface position of the detection area A2 is based on the reference mark position information of the reference mark image S14i from the temporary position of the detection area A2 obtained based on the measurement mark position information of the measurement mark images S5i to S8i. This is calculated by subtracting the calculated reference measurement value b and the reference position (b + k ₂ X) consisting of the product k ₂ X of the correction coefficient k ₂ and the position X of each of the measurement mark images S5i to S8i.

In addition, the surface position of the detection area A3 is calculated based on the reference mark position information of the reference mark image S15i from the temporary position of the detection area A3 obtained based on the measurement mark position information of the measurement mark images S9i to S12i. This is calculated by subtracting the reference measurement value c and the reference position (c + k ₃ X) consisting of the product k ₃ X of the correction coefficient k ₃ and the position X of each of the measurement mark images S9i to S12i. In FIG. 8B, for comparison with the first calculation procedure, the surface position of the transfer surface Wa shown in FIG.

  In the third calculation procedure, if necessary, the result of subtracting the reference position from the temporary position for each measurement mark image is smoothed according to the position of the measurement mark image to obtain the result shown in FIG. As shown, the final surface position of the transfer surface Wa is calculated. Referring to FIG. 8 (c), it can be seen that the discontinuity of the surface position between the detection areas A1 and A2 and between the detection areas A2 and A3 can be reduced by adopting the correction coefficient.

  Here, for example, when a step is found in the detection result of the surface position as shown by a broken line in FIG. 8B, by controlling to align the test surface faithfully to the step, On the contrary, there is a risk of generating a control error that exceeds the level difference. On the other hand, as shown in FIG. 8 (c), by suppressing the step generated in the detection result of the surface position to be small, it is possible to align the test surface with high accuracy over the entire range of the detection region.

  On the other hand, in the fourth calculation procedure using the correction coefficient corresponding to the relative position from the reference mark image associated with the measurement mark image, the correction amount is calculated based on the reference mark position information and the correction coefficient, and the correction is performed. The correction position information is calculated by subtracting the amount from the measurement mark position information, and the surface position of the test surface is calculated based on the correction position information. Specifically, the correction amount of the detection area A1 is calculated based on the reference mark position information and correction coefficient of the reference mark image S13i, and this correction amount is subtracted from the measurement mark position information of the measurement mark images S1i to S4i. The correction position information of the area A1 is calculated, and the surface position of the detection area A1 is calculated based on the correction position information.

  Similarly, the correction amount of the detection area A2 is calculated based on the reference mark position information and correction coefficient of the reference mark image S14i, and this correction amount is subtracted from the measurement mark position information of the measurement mark images S5i to S8i to detect the detection area A2. Correction position information is calculated, and the surface position of the detection area A2 is calculated based on the correction position information. Further, the correction amount of the detection area A3 is calculated based on the reference mark position information and the correction coefficient of the reference mark image S15i, and this correction amount is subtracted from the measurement mark position information of the measurement mark images S9i to S12i to obtain the detection area A3. The correction position information is calculated, and the surface position of the detection area A3 is calculated based on the correction position information.

  In the fourth calculation procedure, if necessary, the surface position of the transfer surface Wa calculated based on the correction position information for each measurement mark image (temporary correction positions of a plurality of measurement mark images) is used as the measurement mark image. The final surface position of the transfer surface Wa is calculated by performing a smoothing process corresponding to the position. Also in this case, as in the case of the third calculation procedure, the discontinuity of the surface position between the detection areas A1 and A2 and between the detection areas A2 and A3 is suppressed to a small level.

  In the above-described embodiment, the light transmission prism 3 provided with the light transmission slits S1 to S12 as measurement marks and the light transmission prism 4 provided with the light transmission slits S13 to S15 as reference marks are separated. However, the light transmitting prisms 3 and 4 can be provided integrally. Similarly, the light receiving prism 13 having the incident surface 13a and the light receiving prism 14 having the incident surface 14a are separately provided, but the light receiving prisms 13 and 14 may be integrally provided. By integrating the light-transmitting prisms 3 and 4 or by integrating the light-receiving prisms 13 and 14, position fluctuations between the light-transmitting slits S1 to S12 and the light-transmitting slits S13 to S15 and the measurement mark image Unnecessary position fluctuations between the reference mark image and the reference mark image can be avoided, so that detection error can be measured stably and with high accuracy.

  Further integration of the light transmitting prism further includes a first mark surface provided with light transmitting slits S1 to S12 for measurement light and a second mark surface provided with light transmitting slits S13 to S15 for reference light. A light transmission mark member having a mark surface can also be provided. Similarly, further integration of the light receiving prism may include an observation member having a common observation surface including a first observation surface on which a measurement mark image is formed and a second observation surface on which a reference mark image is formed. it can.

  In the above-described embodiment, the plane mirror 9 is used as a reference member having a reference surface provided in the vicinity of the test surface. However, the present invention is not limited to this, and there are various configurations for the configuration of the reference member. Is possible. For example, a one-time reflection type prism, a three-time reflection type prism 31 or the like can be used as the reference member. When a relatively large number of reference marks are used, the required length of the reference surface along the X direction is greater when using a single reflection type prism or a three times reflection type prism than when using a plane mirror. Easy to secure.

  In the above-described embodiment, the illumination device including the light source 1 and the condenser lens 2 collectively illuminates the light transmission slits S1 to S12 for measurement light and the light transmission slits S13 to S15 for reference light. . However, the present invention is not limited to this, and using a pair of illumination devices, the measurement mark surface on which the light transmission slit for measurement light is formed and the reference mark surface on which the light transmission slit for reference light is formed are individually provided. Can also be illuminated.

  In the above-described embodiment, the surface position of the test surface is detected based on the principle of a photoelectric microscope (measurement principle using a vibrating mirror). However, the present invention is not limited to this. For example, the position information of the measurement observation image and the reference observation image can be detected by image processing, and the position of the test surface can be calculated based on the detected position information.

  In the above-described embodiment, an example in which the exposure apparatus includes a single surface position detection device has been described. The detection visual field can also be divided. In this case, each device can be calibrated based on the detection result in the common visual field of the detection visual field of the first surface position detection device and the detection visual field of the second surface position detection device.

  Further, in the above-described embodiment, the present invention is applied to the detection of the surface position of the wafer W as the photosensitive substrate, but the pattern surface of the reticle R (generally a mask) is not limited to this. The present invention can also be applied to the detection of the surface position. Further, in the above-described embodiment, the present invention is applied to the detection of the surface position of the photosensitive substrate in the exposure apparatus. The present invention can also be applied to detection of the surface position of a surface.

  In the above-described embodiment, a variable pattern forming apparatus that forms a predetermined pattern based on predetermined electronic data can be used instead of a mask. By using such a variable pattern forming apparatus, the influence on the synchronization accuracy can be minimized even if the pattern surface is placed vertically. As the variable pattern forming apparatus, for example, a DMD (digital micromirror device) including a plurality of reflecting elements driven based on predetermined electronic data can be used. An exposure apparatus using DMD is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-304135 and International Patent Publication No. 2006/080285. In addition to a non-light-emitting reflective spatial light modulator such as DMD, a transmissive spatial light modulator may be used, or a self-luminous image display element may be used. Note that a variable pattern forming apparatus may be used even when the pattern surface is placed horizontally.

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  Next, a device manufacturing method using the exposure apparatus according to the above-described embodiment will be described. FIG. 9 is a flowchart showing a semiconductor device manufacturing process. As shown in FIG. 9, in the semiconductor device manufacturing process, a metal film is vapor-deposited on the wafer W to be a substrate of the semiconductor device (step S40), and a photoresist, which is a photosensitive material, is applied on the vapor-deposited metal film. (Step S42). Subsequently, using the exposure apparatus of the above-described embodiment, the pattern formed on the reticle R is transferred to each shot area on the wafer W (step S44: exposure process), and development of the wafer W after the transfer is completed, that is, The photoresist to which the pattern has been transferred is developed (step S46: development process). Thereafter, using the resist pattern generated on the surface of the wafer W in step S46 as a mask for wafer processing, the surface of the wafer W is processed such as etching (step S48: processing step).

  Here, the resist pattern is a photoresist layer (transfer pattern layer) in which unevenness having a shape corresponding to the pattern transferred by the exposure apparatus of the above-described embodiment is generated, and the recess penetrates the photoresist layer. It is what you are doing. In step S48, the surface of the wafer W is processed through this resist pattern. The processing performed in step S48 includes, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like. In step S44, the exposure apparatus of the above-described embodiment performs pattern transfer using the wafer W coated with the photoresist as a photosensitive substrate.

  FIG. 10 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. As shown in FIG. 10, in the manufacturing process of the liquid crystal device, a pattern formation process (step S50), a color filter formation process (step S52), a cell assembly process (step S54), and a module assembly process (step S56) are sequentially performed.

  In the pattern forming step of step S50, predetermined patterns such as a circuit pattern and an electrode pattern are formed on the glass substrate coated with a photoresist as the photosensitive substrate, using the projection exposure apparatus of the above-described embodiment. The pattern forming process includes an exposure process in which a pattern is transferred to a photoresist layer using the exposure apparatus of the above-described embodiment, and development of a photosensitive substrate to which the pattern is transferred, that is, development of a photoresist layer on a glass substrate. And a development step for generating a photoresist layer (transfer pattern layer) having a shape corresponding to the pattern, and a processing step for processing the surface of the glass substrate through the developed photoresist layer.

  In the color filter forming process in step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction.

  In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

  The present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor device or a liquid crystal device. For example, an exposure apparatus for a display device such as a plasma display, an image sensor (CCD or the like), a micromachine, The present invention can be widely applied to an exposure apparatus for manufacturing various devices such as a thin film magnetic head and a DNA chip. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.

It is a figure which shows the structure of the exposure apparatus provided with the surface position detection apparatus concerning embodiment of this invention. It is a figure which shows the several light transmission slit provided in the output surface of a pair of light transmission prism. It is a figure which shows the optical path between a pair of incident-light prisms. It is a figure which shows the several light receiving slit provided in the entrance plane of a pair of light receiving prism. It is a figure which expands the optical path from a light transmission prism to a light reception prism linearly, and shows the structure from a light source to a light reception prism. It is a figure which shows the several light-receiving part provided in the detection surface of the photodetector. It is a figure explaining the procedure which calculates a surface position in this embodiment. It is a figure explaining the procedure which calculates a surface position using a correction coefficient. It is a flowchart which shows the manufacturing process of a semiconductor device. It is a flowchart which shows the manufacturing process of a liquid crystal device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source 2 Condenser lens 3, 4 Light transmission prism 5,7,15,17 Objective lens 6 Oscillation mirror 8,18 Epi-illumination prism 11 Photo detector 12 Relay lens 13,14 Light reception prism PR Signal processing part CR Control part R Reticle RS Reticle stage PL Projection optical system W Wafer WS Wafer stage

Claims (27)

A light-transmitting optical system that guides measurement light from a plurality of measurement marks to a test surface, and guides reference light from a plurality of reference marks that is smaller than the plurality of measurement marks to the vicinity of the test surface;
The measurement light reflected by the test surface is guided to a first observation surface to form measurement mark images of the plurality of measurement marks on the first observation surface, and the reference light that passes through the vicinity of the test surface is used. A light receiving optical system that guides to a second observation surface and forms reference mark images of the plurality of reference marks on the second observation surface;
The measurement mark position information of the plurality of measurement mark images on the first observation surface and the reference mark position information of the plurality of reference mark images on the second observation surface are detected, and the measurement mark image is detected for each measurement mark image. A detection unit that calculates a surface position of the test surface using the measurement mark position information of the image and one reference mark position information;
A surface position detecting device comprising: The detection unit calculates, for each measurement mark image, the surface position of the test surface using the reference mark position information of the reference mark image associated with the position of the measurement mark image. The surface position detecting device according to claim 1. The said detection part calculates the surface position of the said to-be-tested surface using the said reference mark position information of the said reference mark image nearest to this measurement mark image for every said measurement mark image. The surface position detection apparatus described in 1. The detection unit calculates correction position information by subtracting the reference mark position information from the measurement mark position information, and calculates a surface position of the test surface based on the correction position information. Item 4. The surface position detection device according to any one of Items 1 to 3. The detection unit calculates a temporary position of the test surface based on the measurement mark position information, calculates a reference position of the test surface based on the reference mark position information, and calculates the reference position from the temporary position. The surface position detection apparatus according to claim 1, wherein the surface position of the test surface is calculated based on a result obtained by subtracting a reference position. The said detection part calculates the surface position of the said to-be-tested surface using the correction coefficient corresponding to the position of this measurement mark image for every said measurement mark image. The surface position detection device according to item. The detection unit calculates, for each measurement mark image, a surface position of the test surface using a correction coefficient corresponding to a relative position from the reference mark image associated with the measurement mark image. The surface position detecting device according to claim 2 or 3. The detection unit calculates a correction amount based on the reference mark position information and the correction coefficient, calculates a correction position information by subtracting the correction amount from the measurement mark position information, and based on the correction position information The surface position detection device according to claim 6, wherein the surface position of the test surface is calculated. The detection unit calculates a temporary position of the test surface based on the measurement mark position information, calculates a reference position of the test surface based on the reference mark position information and the correction coefficient, 8. The surface position detection apparatus according to claim 6, wherein the surface position of the test surface is calculated based on a result obtained by subtracting the reference position from a temporary position. The detection unit calculates a temporary correction position of the test surface based on the correction position information for each measurement mark image, and sets the temporary correction positions of the plurality of measurement mark images to the positions of the measurement mark images. 9. The surface position detection apparatus according to claim 4, wherein the surface position of the test surface is calculated by performing a corresponding smoothing process. The detection unit calculates a surface position of the test surface by performing a smoothing process on a result of subtracting the reference position from the temporary position for each measurement mark image according to the position of the measurement mark image. The surface position detecting device according to claim 5 or 9. The light transmission optical system projects measurement mark intermediate images of the plurality of measurement marks onto the test surface, and projects reference mark intermediate images of the plurality of reference marks in the vicinity of the test surface. The surface position detection apparatus as described in any one of Claims 1-11. The plurality of measurement marks are arranged in a line,
The light transmission optical system forms a plurality of the measurement mark intermediate images arranged in a predetermined direction on the test surface,
13. The light receiving optical system forms a plurality of measurement mark images arranged in a direction corresponding to the predetermined direction via the light receiving optical system on the first observation surface. Surface position detection device. The predetermined direction is parallel to an intersecting line of a plane including the emission optical axis of the measurement light in the light transmitting optical system and the incident optical axis of the measurement light in the light receiving optical system, and the surface to be measured. The surface position detection device according to claim 13. The plurality of reference marks are arranged in parallel with the row of measurement marks,
The light transmission optical system projects a plurality of the reference mark intermediate images arranged in parallel with the rows of the measurement mark intermediate images in the vicinity of the test surface,
15. The surface position detection device according to claim 13, wherein the light receiving optical system forms a plurality of the reference mark images arranged in parallel with the measurement mark image row on the second observation surface. . A reference member having a reference surface provided in the vicinity of the test surface;
The surface position detection apparatus according to claim 12, wherein the light transmission optical system projects the reference mark intermediate image onto the reference surface. A light transmission step for guiding measurement light from a plurality of measurement marks to a test surface, and guiding reference light from a plurality of reference marks that is smaller than the plurality of measurement marks to the vicinity of the test surface;
The measurement light reflected by the test surface is guided to a first observation surface to form measurement mark images of the plurality of measurement marks on the first observation surface, and the reference light that passes through the vicinity of the test surface is used. A light receiving step for guiding the second observation surface to form reference mark images of the plurality of reference marks on the second observation surface;
The measurement mark position information of the plurality of measurement mark images on the first observation surface and the reference mark position information of the plurality of reference mark images on the second observation surface are detected, and the measurement mark image is detected for each measurement mark image. A detection step of calculating a surface position of the test surface using the measurement mark position information of the image and one reference mark position information;
A surface position detection method comprising: In the detection step, the surface position of the test surface is calculated using the reference mark position information of the reference mark image associated with the measurement mark image according to the position of the measurement mark image. The surface position detection method according to claim 17. 19. The detection step calculates a surface position of the test surface for each measurement mark image using the reference mark position information of the reference mark image closest to the measurement mark image. The surface position detection method described in 1. The detection step calculates the surface position of the test surface for each measurement mark image using a correction coefficient corresponding to the position of the measurement mark image. The surface position detection method according to item. The detecting step calculates a surface position of the test surface for each measurement mark image using a correction coefficient corresponding to a relative position from the reference mark image associated with the measurement mark image. The surface position detection method according to claim 18 or 19. The detection step calculates a correction amount based on the reference mark position information and the correction coefficient, calculates a correction position information by subtracting the correction amount from the measurement mark position information, and based on the correction position information The surface position detection method according to claim 20 or 21, wherein the surface position of the test surface is calculated. The detecting step calculates a temporary position of the test surface based on the measurement mark position information, calculates a reference position of the test surface based on the reference mark position information and the correction coefficient, The surface position detection method according to claim 20 or 21, wherein the surface position of the test surface is calculated based on a result obtained by subtracting the reference position from a temporary position. The detection step calculates a temporary correction position of the test surface based on the correction position information for each measurement mark image, and sets the temporary correction positions of the plurality of measurement mark images to the positions of the measurement mark images. 23. The surface position detection method according to claim 22, wherein the surface position of the test surface is calculated by performing a corresponding smoothing process. In the detecting step, the surface position of the test surface is calculated by performing a smoothing process on the result of subtracting the reference position from the temporary position for each measurement mark image according to the position of the measurement mark image. The surface position detection method according to claim 23. In an exposure apparatus that transfers a pattern to a photosensitive substrate,
The surface position detection according to any one of claims 1 to 16, wherein a surface position of at least one of a pattern surface provided with the pattern or a transfer surface of the photosensitive substrate is detected as a surface position of the test surface. Equipment,
An alignment means for aligning at least one of the pattern surface and the transfer surface based on a detection result of the surface position detection device;
An exposure apparatus comprising: An exposure step of transferring the pattern onto the transfer surface of the photosensitive substrate detected by the surface position detection device using the exposure apparatus according to claim 26;
Developing the photosensitive substrate to which the pattern has been transferred, and forming a transfer pattern layer having a shape corresponding to the pattern on the surface of the photosensitive substrate;
And a processing step of processing the surface of the photosensitive substrate through the transfer pattern layer.

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