JP2009188483A - Piezoelectric device and surface mount piezoelectric oscillator - Google Patents

Abstract

The present invention provides a means for reducing defects due to the inclination of an element of a piezoelectric vibrator having a small size and a low profile.
A piezoelectric vibration element having a piezoelectric substrate, excitation electrodes formed on both front and back surfaces of the piezoelectric substrate, and lead terminals drawn from the excitation electrodes to the edge of the piezoelectric substrate, respectively. A piezoelectric device 1 having a package body 5 having electrode pads 6 to which lead terminals 16 of the piezoelectric vibration element 10 are respectively bonded via conductive bonding members on an upper surface, and a protrusion 8 on the electrode pad 6 When the lead terminal 16 of the piezoelectric vibration element 10 is bonded to the electrode pad 6, the through hole 12 is formed at a position facing the protrusion 8 of the piezoelectric vibration element 10.
[Selection] Figure 1

Description

  The present invention relates to a piezoelectric device and a surface-mounted piezoelectric oscillator, and more particularly to a piezoelectric device and a surface-mounted piezoelectric oscillator in which a method for connecting a quartz substrate and a pad electrode provided in a package is improved.

Piezoelectric devices such as piezoelectric vibrators are widely used in various electronic devices because of their small size, low price, high accuracy, and high frequency stability, and low aging. Among them, AT-cut quartz resonators having a frequency-temperature characteristic exhibiting a cubic curve are excellent in frequency-temperature characteristics, and are therefore used in large amounts in communication devices such as mobile phones.
FIG. 8 is a cross-sectional view schematically showing the structure of a conventional AT-cut quartz crystal resonator. A conductive adhesive 52 is applied to a stepped portion 51 provided at the corner of the inner bottom portion of the package body 50, and the conductive The crystal resonator element 53 is pressed against the adhesive 52, and the conductive adhesive 52 is dried to adhere and fix the crystal resonator element 53 to the step portion 52. A pad electrode (not shown) is formed on the upper surface of the step portion 51, and the pad electrode and the external terminal 54 are electrically connected by an internal conductor formed in the package. In addition, in order to reduce the height of the piezoelectric vibrator, a crystal vibrator in which a pad electrode is provided directly on the inner bottom surface of the package body 50 without providing the stepped portion 51 and a quartz crystal vibrating element is bonded to the pad electrode is also produced. ing.

Since the piezoelectric vibration element itself vibrates, various devices have been devised to connect the piezoelectric vibration element and the cage (package). Patent Document 1 discloses a method of connecting a tuning fork crystal resonator element to an airtight terminal.
FIG. 9 is a perspective view of the tuning fork crystal resonator element 56 (excitation electrode not shown), and two through holes 57 are formed in the base of the tuning fork crystal resonator element 56. In order to connect and fix the tuning fork crystal resonator element 56 to a lead wire of an airtight terminal composed of a flange, glass, and a lead wire, a through hole 57 formed in the tuning fork crystal resonator element 56 is filled with a conductive agent such as alloy solder. The tuning fork crystal vibrating element and the lead wire are fixed. The lead wire is made of an elastic material and is provided to stably vibrate the tuning fork crystal resonator element 56, and can increase the Q value of the vibrator. That is, it is disclosed that part of the vibration of the tuning fork crystal resonator element 56 has a property of flowing through the lead wire.

Patent Document 2 discloses a crystal resonator in which a notch or a through hole is provided at an end of a piezoelectric substrate.
FIG. 10 is a perspective view showing an AT-cut crystal resonator element. The crystal resonator element 60 has an excitation electrode 61 and a lead electrode 62 on both main surfaces of a strip-shaped AT-cut crystal substrate as a conductive material film. Form. A conductor film 64 connected to the lead electrode 62 is provided on the inner wall of the recess 65 provided with a notch 63 at the end of the substrate on which the lead electrode 62 extends on the main surface of the quartz substrate. The conductor film 64 is on the extension of the lead electrode 62 and reaches the opposite main surface. Moreover, the upper lead electrode 62 can be extended to the lower surface vicinity by making the recess 65 into a through hole. Further, a plurality of grooves 66 are formed between the excitation electrode 61 and the crystal substrate longitudinal direction end in parallel with the excitation electrode side. The depths of these grooves are gradually increased from the excitation electrode 61 toward the longitudinal end of the substrate.
It is described that by forming the plurality of grooves 66 as described above, it is possible to obtain an energy confinement type piezoelectric vibrator that suppresses variations in various characteristics such as resonance characteristics and temperature characteristics and equivalent circuit constant values.
JP-A-53-60593 JP 2003-46366 A

  Customers are strongly demanded to reduce the size and height of piezoelectric vibrators, and the shape dimensions of piezoelectric vibrators are currently extremely small, about 2.5 × 2.0 × 0.55 mm. Along with the reduction in height (h = 0.55 mm), if the angle formed by the inner bottom surface of the package body 50 and the main surface of the crystal resonator element 53 deviates from a predetermined angle, it becomes a major factor in the vibrator failure. For mounting the crystal resonator element on the package, the main surface of the crystal resonator element 53 is adsorbed using an adsorption device and lightly pressed against the conductive adhesive 52 applied to the upper surface of the pad electrode of the stepped portion 51 of the package 50. In the case where the main surface of the crystal resonator element 53 is inclined with respect to the inner bottom surface of the package body 50 due to the amount of the conductive adhesive 52, the viscosity, the pressing force, the inclination of the nozzle of the suction device, etc. There is. When the inclination of the main surface of the crystal resonator element 53 exceeds a predetermined value, the tip end portion of the crystal resonator element 53 comes into contact with the inner bottom surface, or comes into contact with a lid member welded to the upper peripheral edge of the package body 50, resulting in a defect. In order to prevent such a defect in advance, the inclination of the main surface of the crystal resonator element 53 is measured and selected. However, there is a problem that this man-hour is greatly increased and the yield is also deteriorated.

However, the connection and fixing method with the cage described in Patent Document 1 is a fixing method peculiar to a tuning fork crystal vibration element, and is not suitable for connection and fixing of a piezoelectric vibration element that performs thickness-shear vibration. In this case, if a part of the vibration is leaked, there arises a problem that the Q value is lowered. The recess or through hole described in Patent Document 2 is for connecting the lead electrode and the pad electrode of the package body, and is not intended to fix the crystal resonator element to the package. There is a problem that it does not contribute to fixing the vibration element in parallel to the inner bottom surface of the package body.
An object of the present invention is to solve the above problems, and to provide a small-sized, low-profile piezoelectric device and a surface-mount type piezoelectric oscillator with improved yield.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 At least a piezoelectric substrate, a piezoelectric vibration element having excitation electrodes formed on both front and back surfaces of the piezoelectric substrate, and a lead terminal drawn from the excitation electrode to an edge of the piezoelectric substrate, and an upper surface And an insulating substrate having electrode pads to which the lead terminals of the piezoelectric vibration element are respectively bonded via a conductive bonding member, wherein a protrusion is formed on the electrode pad, and the electrode A piezoelectric device is characterized in that when a lead terminal of the piezoelectric vibration element is bonded on a pad, a through-hole is formed at a position facing the protrusion of the piezoelectric vibration element.

  When the piezoelectric device is configured as described above, the surface of the pad electrode of the insulating substrate (package body) and the surface of the piezoelectric vibration element are bonded together by the conductive adhesive, and the protrusion provided on the pad electrode and the piezoelectric substrate Since the adhesive force of the conductive adhesive applied to the through-hole provided in the (quartz substrate) is added, the main surface of the piezoelectric vibration element is kept parallel to the surface of the bottom plate of the package body, so the lid member is seam welded At this time, since it does not come into contact with the lid member and does not come into contact with the bottom plate, there is an effect that the yield of the crystal unit is greatly improved and that it contributes greatly to the reduction in height.

  [Application Example 2] The piezoelectric device according to Application Example 1 is characterized in that a plurality of the protrusions and the through holes are provided.

  When the piezoelectric device is configured in this way, the plurality of protrusions and the plurality of through holes are filled with the conductive adhesive, and a three-dimensional adhesive force is generated, so that the main surface of the piezoelectric vibration element is the package body. There is an effect that it is kept parallel to the surface of the bottom plate and an effect that contributes to a reduction in height.

  [Application Example 3] The piezoelectric device according to Application Example 1 in which one protrusion and one through hole are provided.

  When the piezoelectric device is configured in this manner, the mounting method is such that one through hole is passed through one protrusion, so that the mounting device is simplified and the cost can be reduced. In addition, since the main surface of the piezoelectric vibration element is kept parallel to the surface of the bottom plate of the package main body, there are almost the same effects as when a plurality of protrusions are provided.

  [Application Example 4] The piezoelectric device according to any one of Application Examples 1 to 3, wherein the through hole is circular or rectangular.

  When the piezoelectric device is configured in this way, the circular or rectangular shape is easy in terms of the shape recognition of the piezoelectric vibration element mounting device, the contact area between the protrusion and the through hole can be increased, and the surface of the protrusion and the penetration There is also an effect that the adhesive force with the inner surface of the hole is increased.

  Application Example 5 At least a piezoelectric substrate, a piezoelectric vibration element having excitation electrodes formed on both front and back surfaces of the piezoelectric substrate, and a lead terminal drawn from the excitation electrode to an edge of the piezoelectric substrate, and an upper surface And a piezoelectric substrate comprising: a plurality of electrode pads to which lead terminals of the piezoelectric vibration element are respectively bonded via a conductive bonding member; and a protrusion on each of the plurality of electrode pads. The piezoelectric device is characterized in that a notch portion is formed at a position facing the protruding portion of the piezoelectric vibration element when the lead terminal of the piezoelectric vibration element is bonded to the electrode pad.

  When the piezoelectric device is configured in this manner, the conductive adhesive 3 applied to the protrusions and the notches provided in the piezoelectric substrate (quartz substrate) due to the surface adhesion force between the surface of the pad electrode and the surface of the piezoelectric vibration element. Since the dimensional adhesive force is applied, there is an effect that the main surface of the piezoelectric vibration element is kept parallel to the surface of the bottom plate of the package body and an effect of contributing to a reduction in height.

  [Application Example 6] The piezoelectric device according to any one of Application Examples 1 to 5, wherein the piezoelectric substrate is an AT-cut quartz crystal substrate.

  When the piezoelectric device is configured in this way, the frequency temperature characteristic exhibits a cubic curve, and there is an effect that a highly stable frequency can be obtained.

  Application Example 7 A piezoelectric device according to any one of Application Examples 1 to 5, wherein the piezoelectric vibration element is a tuning fork type piezoelectric vibration element.

  This configuration of the piezoelectric device has the effect of keeping the tuning fork type piezoelectric resonator element that is long and heavy in weight compared to the AT-cut quartz resonator element in parallel with the surface of the bottom plate of the package main body, thereby reducing the height. Contribute.

  Application Example 8 An insulating substrate having an element mounting pad electrode electrically connected to each excitation electrode of a piezoelectric vibration element on the upper surface, a piezoelectric vibration element mounted on the element mounting pad electrode, and the piezoelectric element Consists of a lid member that hermetically seals the vibration element, a stepped portion projecting along one side of the outer bottom surface of the insulating substrate, and an oscillation circuit mounted on an IC component mounting pad disposed on the outer bottom surface of the insulating substrate An IC component to be mounted, a mounting terminal distributed on the bottom surface of the stepped portion and the bottom surface of the IC component, a conductor conducting between each mounting terminal and the IC component mounting pad, and each element mounting pad And a conductor that conducts between the IC component mounting pad, a protrusion formed on the electrode pad for mounting the element, and the piezoelectric vibration element bonded to the electrode pad The piezoelectric vibration Wherein the surface mount type piezoelectric oscillator in which the forming the protruding portion facing the through-the position holes of the element.

  When the surface mount type piezoelectric oscillator is configured in this manner, the recess for accommodating the piezoelectric vibration element can be thinned, so that the piezoelectric oscillator can be reduced in height.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the present embodiment, a piezoelectric vibrator will be described as an example of a piezoelectric device.
1A and 1B are schematic views showing a first embodiment of a piezoelectric device according to the present invention, in which FIG. 1A is a perspective view of a piezoelectric vibrator 1 with a lid member (not shown) removed, and FIG. FIG. 4C is a perspective view of the piezoelectric vibration element 10, and FIG.
The piezoelectric vibrator 1 according to the first embodiment includes an insulating substrate (hereinafter referred to as a package body) 5, a piezoelectric vibration element 10, and an upper portion of the package body 5, as shown in the perspective view of FIG. A lid member (not shown) welded to the metallization (not shown) formed on the peripheral edge by means such as seam welding.
The configuration of the piezoelectric vibration element 10 will be described by taking, for example, an AT cut crystal vibration element as an example. First, a quartz plate is cut out from the quartz at a predetermined angle (about 35 ° from the Z-axis), polished to a desired frequency thickness, and both surfaces are etched to produce an AT-cut quartz wafer W. The quartz crystal wafer W is processed by using the photolithography technique and the etching technique, and as shown in the plan view of FIG. 2, small through holes 12 regularly arranged in the vertical and horizontal directions are formed. Excitation electrodes 15 and lead terminals 16 as shown in FIG. 1B are formed in a lattice pattern on both sides of the quartz wafer W through a mask using a vapor deposition apparatus or a sputtering apparatus. Then, it is cut into individual crystal plates using a dicing saw or the like along the broken line in FIG. 2 to form the crystal resonator element 10 shown in FIG.
The lead terminals 16 formed on the front and back are respectively passed over the through holes 12, and the width of the lead terminals 16 is larger than the diameter of the through holes 12.

  3A and 3B are views showing the structure of the package body (insulating substrate) 5. FIG. 3A is a perspective view of the package body 5, and FIG. 3B is a cross-sectional view taken along the line R-R of the package body. As shown in FIG. 3 (b), the package body 5 is formed at the top plate corner of the bottom plate 5a, the annular side wall 5b erected integrally with the periphery of the bottom plate 5a, and the bottom plate 5a where the bottom plate 5a and the side wall 5b are in contact. Stepped portion 6, pad electrode 7 formed on stepped portion 6, projection 8 formed on pad electrode 7, and external terminal 9 formed at the back surface corner of bottom plate 5 a, I have. A feature of the package body 5 used for the piezoelectric vibrator according to the first embodiment is that two cylindrical protrusions 8 are formed on the pad electrode 7 on which the piezoelectric vibration element 10 is placed. The diameter of the cylindrical projection 8 is slightly smaller than the diameter of the through hole 12 formed in the piezoelectric substrate 11 shown in FIG. 1B, and the two through holes 12 pass through the projection 8.

  Here, the bottom plate 5a, the side wall 5b, and the stepped portion 6 are generally formed of a ceramic material, and the pad electrode 7, the protruding portion 8, and the external terminal 9 are formed in the same process. That is, a tungsten (or molybdenum) film for the pad electrode 7 is printed on the stepped portion 6, and a tungsten film for the protruding portion 8 is printed thereon in an overlapping manner. Then, a tungsten film for the external terminal 9 is printed on the back surface of the bottom plate 5a and fired in a reducing atmosphere to solidify the ceramic, and at the same time, the tungsten film is metallized. Nickel plating and gold plating are sequentially applied to the metallized portion to form the pad electrode 7, the protrusion 8, and the external terminal 9, respectively. The pad electrode 7 is electrically connected to the external terminal 9 through an internal conductor.

A conductive adhesive 20 is applied to the pad electrode 7 and the protrusion 8 of the package body 5, and the crystal resonator element 10 shown in FIG. It is placed on the pad electrode 7 through the two protrusions 8. When mounting, a force that is lightly pressed by the nozzle of the suction device is applied to bring the main surface of the crystal resonator element 10 into close contact with the surface of the pad electrode 7, and the main surface of the crystal resonator element 10 is Be parallel to the surface.
Since the conductive adhesive 20 is applied to the pad electrode 7, the lead terminal 16 on the back surface of the crystal resonator element 10 shown in FIG. 1B, the back surface of the crystal substrate 11 facing the lead terminal 16 on the front surface, Is bonded to the pad electrode 7. In addition, since the conductive adhesive 20 is applied to the two protrusions 8, when the two through holes 12 of the crystal resonator element 10 are passed through the protrusions 8, the conductive adhesive 20 is passed through the through holes 12. Are sufficiently adhered to the inner surface of the cylindrical member and the surface of the cylindrical protrusion 8, the contact area is increased, and the crystal resonator element 10 is bonded to the protrusion 8.

That is, the three-dimensional adhesive force between the surface of the protrusion 8 and the inner surface of the through hole 12 is added to the planar adhesive force between the main surface of the crystal resonator element 10 and the surface of the pad electrode 7. Since the quartz resonator element 10 is extremely light in weight, its main surface is not inclined downward due to gravity, and is kept parallel to the bottom surface 5a of the package body 5. When the conductive adhesive is dried, the bond between the package body 5 and the crystal resonator element 10 is strengthened, and the lead terminal 16 on the surface side of the crystal resonator element 10 is electrically conductive filled in one through-hole 12. The adhesive 20 is electrically connected to the pad electrode 7. The lead terminal 16 on the back side is made conductive by a conductive adhesive applied to the pad electrode 7. In addition, the protrusion 8 may protrude from the through hole 12 or may be lower.
As described above, the piezoelectric vibrator of this embodiment can keep the main surface of the crystal resonator element 10 parallel to the surface of the bottom plate 5 a by the protrusion 8 provided in the package body 5 and the through hole 12 provided in the crystal substrate 11. Therefore, when the lid member is seam welded to the upper periphery of the package body 5, the lid member is not contacted, and the bottom plate 5a is not contacted. Contributes to low profile.
Moreover, since the through-hole 12 is provided and the through-hole 12 is filled with the conductive adhesive, there is an effect of suppressing spurious due to the higher-order contour system mode and the higher-order inharmonic mode.

  FIG. 4 shows another embodiment of the package body, which is different from the package body 5 shown in FIG. 3 in that the pad electrode 7 and the protrusion 8 are directly formed on the bottom plate 5a without providing the step portion 6. This is the point. By providing the protrusion 8, the crystal resonator element 10 is maintained in parallel with the bottom surface 5a of the package body 5 '. Therefore, if the pad electrode 7 is thick, a sufficient gap from the bottom surface 5a can be maintained. By removing the step portion 6, it is possible to configure a package with a lower height.

FIG. 5 is a modified example of the through hole formed in the crystal resonator element.
FIG. 5A shows an example in which the two through holes 13 formed in the quartz substrate 11 of the quartz vibrating element are rectangular.
When the crystal resonator element 10 having the rectangular through hole 13 is used, the protrusion 8 provided on the package body 5 (see FIG. 1) also has a rectangular cross section, and the shape of the through hole 13 is larger than that of the protrusion 8. It needs to be a little bigger.
Even when the crystal resonator is configured by inserting the quadrangular columnar protrusions 8 of the package body 5 into the through-hole 13 of the crystal resonator element 10 configured as described above, the plane of the surface of the crystal resonator element 10 and the pad electrode is planar. The main surface of the crystal resonator element is kept parallel to the bottom surface of the package main body due to the strong adhesive force and the three-dimensional adhesive force between the inner surface of the rectangular through-hole 13 and the surface of the protrusion. This is the same as the piezoelectric vibration element shown in FIG.

In the crystal resonator element shown in FIG. 5B, one through hole 13 a is formed on the short side of the crystal substrate 11. The length of the through hole 13a in the short direction is slightly longer than the length between the two protrusions 8 shown in FIG. 3A, and the width is the diameter of the protrusion 8 (in the case of a rectangular protrusion, the width is the width). ) Make it a little bigger. If one large through-hole 13a is formed on the short side of the quartz substrate 11 in this way, there is an effect that unnecessary vibration caused by the contour system higher-order mode generated in the vicinity of the main vibration of the piezoelectric vibration element can be suppressed.
The crystal resonator element shown in FIG. 5C is an example in which one through hole 13b is provided at the center of the short side of the crystal substrate 11 on the short side. In addition, although the rectangular through-hole 13b is shown in FIG.5 (c), a circular through-hole may be sufficient.
When a crystal resonator element is configured as shown in FIG. 5C, the number of protrusions formed on the pad electrode of the package body is also one. Note that the lead terminal 16 on the surface of the crystal resonator element extends through the end of the crystal substrate 11 to the through hole 13b as shown in FIG. By doing so, conduction between the excitation electrode 15 on the surface and one of the pad electrodes is achieved. The main surface of the crystal resonator element is kept parallel to the bottom surface of the package body, as in the piezoelectric resonator element shown in FIG.

The crystal resonator element shown in FIG. 5D is an example in which two rectangular cutouts 13 c are provided on the short side of the crystal substrate 11. The lead terminals 16 on the front and back surfaces drawn from the excitation electrode 15 formed on the main surface respectively extend to the notch 13c, and the width of the lead terminal 16 is wider than the width of the notch 13c.
When the crystal resonator element is configured as shown in FIG. 5 (d), the two protrusions 8 (see FIG. 1) of the package body 5 are inserted into the two notches 13c and 13c, and the conductive adhesive is used. Glue and fix with. In this case, when the conductive adhesive is applied, the adhesive force between the inner surface of the notch 13c and the surface of the protrusion is stronger when the protrusion 8 shown in FIG. Become. Even in such a configuration, the main surface of the crystal resonator element can be kept parallel to the bottom surface of the package body.

FIG. 6 is a view showing another example of the crystal resonator element applied to the crystal resonator of the present embodiment, in which the crystal resonator element is configured by the tuning fork resonator element 3.
In this case, two through holes 14 are formed in the base of the tuning fork vibrating element 3, and the two protrusions formed in the package body are inserted into the through holes 14 and fixed with a conductive adhesive. Since the tuning fork vibrating element 3 is thin and thick, and its weight is heavy, the tuning fork vibrating element 3 may be tilted only by bonding on the surface. Therefore, if the projection 8 is used as in the present embodiment, the tuning fork vibration is vibrated. The element 3 can be kept parallel to the bottom surface of the package body.

  In addition, although this embodiment demonstrated so far demonstrated the case where the through-hole formed in a piezoelectric vibration element was circular and a rectangle, shapes, such as an ellipse and a triangle, may be sufficient as a through-hole. In that case, it is desirable that the protrusions formed on the package body have the same shape. Further, although the piezoelectric substrate has been described using a flat plate example, a mesa substrate or an inverted mesa substrate may be used. Moreover, not only an AT cut substrate but also a BT cut substrate may be used.

FIG. 7 is a longitudinal sectional view of a piezoelectric oscillator as an example of a surface-mount crystal oscillator having a package structure according to an embodiment of the present invention.
The crystal oscillator 21 has a configuration in which a crystal resonator element 40 is mounted in a recess 23 provided on the upper surface of the package 22 and hermetically sealed with a metal lid 30, and an IC component 45 is mounted on the outer bottom surface of the package 22. Have.

  The package 22 includes an insulating substrate 24 made of ceramic or the like having a recess 23 on the upper surface, two element mounting pads 25 disposed in the recess and electrically connected to each excitation electrode of the crystal resonator element 40, The outer bottom surface of the insulating substrate 24 for mounting the two mounting terminals 26a disposed on the bottom surface of the step portion 31 projecting along one side of the outer bottom surface of the insulating substrate 24 and the IC component 45 constituting the oscillation circuit. 27, the IC component mounting pad 28, the conductor 29 that conducts between the mounting terminals 26a and the IC component mounting pad 28, and the element mounting pad electrode 25 and the IC component mounting pad 28 are conducted. A conductor 29 and a metal lid 30 hermetically sealing the recess 23 in a state where the two excitation electrodes on the crystal resonator element 40 are electrically connected to the two element mounting pad electrodes 25 provided in the recess, respectively. Preparation There. The step portion 31 constitutes a part of the insulating substrate 24.

  The surface-mount type crystal oscillator according to this embodiment configured as described above is a method for connecting and fixing the two element mounting pads 25 provided in the recess 23 and the crystal resonator element 40. That is, the two protrusions 42 are formed on the two pad electrodes 25, and the two through holes 43 are formed on the end substrate of the crystal resonator element 40, and the protrusions 42 are inserted into the through holes 43 to be conductive. Fix with adhesive. By using such a connection and fixing method, the main surface of the crystal resonator element 40 becomes parallel to the bottom surface of the recess 23, and the defect of the crystal resonator when the metal lid 30 is sealed is greatly reduced.

In addition, two mounting terminals 26b are formed on the bottom surface of the IC component 45, and the pads 45a provided on the top surface of the IC component 45 are flip-chip mounted on the IC component mounting pads 28, for a total of four. The mounting terminals 26a and 26b are located at the same height level in a sufficiently spaced positional relationship.
The mounting terminals 26a and 26b are, for example, a drive power supply mounting terminal (Vcc terminal), a control voltage application mounting terminal (Vcon terminal), and a signal output mounting terminal (Out) that are electrically connected to the lead electrodes on the crystal resonator element 40 side. Terminal) and a ground mounting terminal (Gnd terminal) for electrical connection with the ground circuit. In this example, two of the mounting terminals 26a project along one side of the outer bottom surface 27 of the substrate. The other two mounting terminals 26 b are spaced from each other along the bottom surface of the IC component 45.

1A and 1B are schematic views showing the structure of a piezoelectric vibrator according to the present invention, in which FIG. 1A is a perspective view, FIG. 1B is a perspective view of a piezoelectric vibration element, and FIG. Explanatory drawing when producing a quartz substrate from a quartz wafer. (A) is a perspective view of a package main body, (b) is sectional drawing. Sectional drawing of a package main body. (A) is a plan view of a piezoelectric vibration element provided with two rectangular through holes, (b) is a plan view of a piezoelectric vibration element provided with one elongated through hole, and (c) is provided with one through hole. FIG. 4D is a plan view of the piezoelectric vibration element provided with two notches. The top view of the tuning fork vibration element which provided two through-holes. Sectional drawing which shows the structure of the piezoelectric oscillator using the mounting method of the piezoelectric vibration element which concerns on this invention. Sectional drawing which shows the structure of the conventional piezoelectric vibrator. The perspective view of a tuning fork vibration element. The perspective view which shows the structure of the conventional piezoelectric vibration element.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Piezoelectric vibrator, 3 Tuning fork vibrator, 5, 5 'package main body, 5a Bottom plate, 5b Side wall, 6 Step part, 7 Pad electrode, 8, 42 Protrusion part, 9 External terminal, 10, 40 Piezoelectric vibration element, 11 Piezoelectric Substrate, 12, 13, 13a, 13b, 14, 43 Through hole, 15 Excitation electrode, 16 Lead terminal, W Crystal wafer, 20, 41 Conductive adhesive, 21 Crystal oscillator, 22 Package, 23 Recess, 24 Insulating substrate 25 element mounting pad electrode, 26a, 26b mounting terminal, 27 substrate bottom surface, 28 IC component mounting pad, 29 conductor, 30 metal lid, 31 stepped portion, 45 IC component, 45a pad, 45b through hole, 46 resin

Claims (8)

At least a piezoelectric substrate, excitation electrodes formed on both front and back surfaces of the piezoelectric substrate, a piezoelectric vibration element having lead terminals drawn from the excitation electrodes to the edge of the piezoelectric substrate, and the piezoelectric vibration element on the upper surface An insulating substrate having electrode pads to which the lead terminals are respectively bonded via a conductive bonding member, and a piezoelectric device comprising:
Forming a protrusion on the electrode pad;
A piezoelectric device, wherein a through-hole is formed at a position facing the protruding portion of the piezoelectric vibration element when the lead terminal of the piezoelectric vibration element is bonded to the electrode pad.   The piezoelectric device according to claim 1, wherein a plurality of the protrusions and the through holes are provided.   The piezoelectric device according to claim 1, wherein one protrusion and one through hole are provided.   The piezoelectric device according to any one of claims 1 to 3, wherein the through hole is circular or rectangular. At least a piezoelectric substrate, excitation electrodes formed on both front and back surfaces of the piezoelectric substrate, a piezoelectric vibration element having lead terminals drawn from the excitation electrodes to the edge of the piezoelectric substrate, and the piezoelectric vibration element on the upper surface An insulating substrate having a plurality of electrode pads to which each lead terminal is bonded via a conductive bonding member, and a piezoelectric device comprising:
Protrusions are formed on each of the plurality of electrode pads, and a notch is formed at a position facing the protrusions of the piezoelectric vibration element when the lead terminal of the piezoelectric vibration element is joined to the electrode pads. A piezoelectric device characterized by that.   The piezoelectric device according to claim 1, wherein the piezoelectric substrate is an AT cut quartz substrate.   The piezoelectric device according to any one of claims 1 to 5, wherein the piezoelectric vibration element is a tuning fork type piezoelectric vibration element. An insulating substrate having an element mounting pad electrode electrically connected to each excitation electrode of the piezoelectric vibration element on the upper surface, a piezoelectric vibration element mounted on the element mounting pad electrode, and the piezoelectric vibration element being hermetically sealed A lid member to be stopped, a stepped portion projecting along one side of the outer bottom surface of the insulating substrate, an IC component constituting an oscillation circuit mounted on an IC component mounting pad disposed on the outer bottom surface of the insulating substrate, Mounting terminals distributed on the bottom surface of the stepped portion and the bottom surface of the IC component, conductors that conduct between the mounting terminals and the IC component mounting pad, the element mounting pads, and the IC component mounting A piezoelectric oscillator comprising a conductor conducting between the pads,
A protrusion is formed on the electrode pad for mounting the element, and a through-hole is formed at a position facing the protrusion of the piezoelectric vibration element when the piezoelectric vibration element is bonded on the electrode pad. A surface-mount type piezoelectric oscillator.

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