JP2009188377A - Radiation module and supporting member thereof - Google Patents

Abstract

The present invention provides a heat dissipating module and a supporting member for solving such problems as structural deformation affected by external force of a flat plate heat pipe, damage caused by expansion due to temperature, and damage to a wick structure.
A heat radiation module includes a heat sink, a two-phase heat exchange device, and a support member. The two-phase heat exchange device 21 is disposed between the support member 20 and the heat sink 23. The support member 20 accommodates the two-phase heat exchange device 21, and the support member 20 includes a main body 201 having a bottom surface portion 202 and at least two side wall portions 203. In order to accommodate the two-phase heat exchange device 21, the two-phase heat exchange device 21 formed and accommodated by the bottom surface portion 202 and the side wall portion 203 of the main body 201 of the support member 20 is the bottom surface of the main body 201 of the support member 20. It is attached to the part 202. The two-phase heat exchange device 21 is installed between the support member 20 and the heat sink 23 and is inserted therebetween.
[Selection] Figure 3

Description

  The present invention relates to a heat dissipation module and a support member thereof, and more particularly to a support member used to fix a two-phase heat exchange device. By having the support member, a wick structure caused by temperature and external force is provided. Prevents damage and deformation.

  As electronic devices become more efficient, heat dissipation has become one of the most important issues in electronic devices. If the heat generated by the electronic device is not properly dissipated, the operating efficiency of the electronic device may be reduced, or worse, the electronic device may not operate properly or may burn out.

  FIG. 1 is a schematic view of a conventional flat plate heat pipe 11 to which a heat sink 13 is applied. There is a copper block 12 disposed on the bottom surface of the flat plate heat pipe 11, and the copper block 12 is for transferring heat from a heat source (for example, a CPU (Central Processing Unit), not shown). , And can be in direct contact with the heat source. The heat sink 13 is disposed on the flat plate heat pipe in order to increase the heat radiation area, and the heat sink 13 and the flat plate heat pipe 11 penetrate the screw holes into the screw holes, thereby the heat source. And connected in conjunction.

  Since only the upper surface portion of the flat plate heat pipe 11 is supported by the heat sink 13, and the bottom surface portion of the flat plate heat pipe 11 and the heat source are not in contact with each other, the flat plate heat pipe 11 has a large operating temperature. In response to the change, it deforms by expanding when hot and contracting when cold. Furthermore, the deformation destroys the external appearance of the flat plate heat pipe 11, and the wick structure formed in the flat plate heat pipe 11 is damaged. Therefore, the heat dissipation efficiency of the flat plate heat pipe 11 is lowered.

  In order to closely combine the copper block 12 and the heat source, an external force is applied to the flat plate heat pipe 11. However, due to insufficient support strength of the internal structure of the flat plate heat pipe 11, the flat plate heat pipe 11 is easily deformed by the external force, and the wick structure inside the flat plate heat pipe 11 is easy. Damaged. Therefore, the heat dissipation efficiency of the flat plate heat pipe 11 is lowered.

On the other hand, flat plate heat pipes having a specific shape have been designed to meet the requirements of various heat radiation environments and usable spaces. However, it is required to form a dedicated mold for the flat heat pipe of the specific shape. Furthermore, the planar heat pipe is usually coupled or fixed to other parts on the circuit board, or is not disturbed, so that the recess or slit portion is formed in the planar heat pipe of the specific shape. Must be formed. Therefore, the difficulty and cost of manufacturing the flat heat pipe with the specific shape are increasing.
US Patent Application Publication No. 2003173064

  In order to overcome the disadvantages of the description of the prior art, the present invention provides a heat dissipation module and its support that can solve problems such as structural deformation affected by external force, damage caused by expansion due to temperature, and damage to the wick structure. By providing a member, it is possible to increase the possibility of applying the heat dissipation module in different fields.

  In order to achieve the above object, a support member for housing the two-phase heat exchange device is provided. The support member includes a main body having a bottom surface portion and at least two side wall portions. An accommodation space for accommodating the two-phase heat exchange device is formed by a bottom surface portion and a side wall portion of the main body, and the accommodated two-phase heat exchange device is attached to the bottom surface portion of the main body, and the bottom surface of the main body A welding material is further provided between the portion and the housed two-phase heat exchange device.

  Furthermore, a heat dissipation module is provided. The heat dissipation module includes a heat sink, a two-phase heat exchange device, and a support member. The two-phase heat exchange device is disposed between the support member and the heat sink. The support member used for housing the two-phase heat exchange device includes a main body. The main body of the support member has a bottom surface portion and at least two side wall portions. An accommodation space for accommodating the two-phase heat exchange device is formed by a bottom surface portion and a side wall portion of the main body of the support member, and the accommodated two-phase heat exchange device is a bottom surface of the main body of the support member. It is attached to the part.

  A welding material is provided by coating between the bottom surface of the body of the support member and the two-phase heat exchange device. The bottom surface portion of the main body of the support member has one opening to expose the two-phase heat exchange device. Further, the opening of the bottom surface of the main body of the support member is externally connected to a heat conductor that is in contact with the two-phase heat exchange device. The heat conductor may be a heat pipe, a heat column, or a hard metal block. The support member or the heat conductor is in contact with a heat source. Furthermore, the main body of the support member has at least two locking elements respectively arranged beside the side wall portion. The locking element of the body of the support member has a plurality of holes that are penetrated by external fastening components, so that the support member can be connected on a heat source.

  Based on the features described in the present embodiment, the present invention solves problems such as structural deformation affected by external forces, damage caused by expansion due to temperature, and damage to the wick structure, and thus, two-phase heat to the heat source. The additional cost of a dedicated mold used to form the specific shape of the exchange device can be saved. The present invention also increases the possibility of applying the heat dissipation module in different fields.

  The following embodiments will be described in detail with reference to the accompanying drawings.

  The present invention will be more fully understood by reading the following detailed description and examples with reference to the accompanying drawings.

  The following description is the most considered scheme for carrying out the present invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limited sense. The scope of the invention is best determined with reference to the appended claims.

  FIG. 2 is a schematic view of the heat dissipation module 2 according to the first embodiment of the present invention. The heat dissipation module 2 includes a support member 20, a two-phase heat exchange device 21, and a heat sink 23. The two-phase heat exchange device 21 is disposed between the support member 20 and the heat sink 23, and the accommodated two-phase heat exchange device 21 is adjacent to the support member 20 and the heat sink 23 in the vertical direction. Note that the heat dissipating module 2 of FIG. 2 is placed upside down, so that the positional relationship of the heat dissipating module 2 with respect to a heat source (not shown) can be clearly shown. That is, the bottom surface portion 202 of the support member 20 of the heat dissipation module 2 is disposed on the heat source in the actual application. In the present embodiment, the two-phase heat exchange device 21 is a flat plate heat pipe.

  Referring to FIGS. 2 and 3 at the same time, FIG. 3 is an exploded view of the heat dissipation module 2 of FIG. The support member 20 has a main body 201. The main body 201 of the support member 20 includes a bottom surface portion 202 and at least two side wall portions 203 installed on the outer periphery of the bottom surface portion 202. In the present embodiment, the main body 201 of the support member 20 includes four side wall portions 203 that constitute two sets of opposing side wall portions 203. A housing space 204 for housing the two-phase heat exchange device 21 is formed by the bottom surface portion 202 and the side wall portion 203 of the main body 201 of the support member 20. In the assembly of the heat dissipation module 2, the accommodated two-phase heat exchange device 21 is attached to the bottom surface portion 202 of the main body 201 of the support member 20, and the two-phase heat stored in the bottom surface portion 202 of the main body 201 of the support member 20. The welding material is provided between the exchange device 21 and the coating material. Therefore, it is possible to reduce the difficulty of transferring heat and to increase the heat radiation efficiency.

  The two-phase heat exchange device 21 is a flat plate heat pipe using a working fluid such as water. The wick structure is formed on the inner surface of the two-phase heat exchange device 21, and the material of the wick structure is a metal, an alloy, or a porous non-metallic material. When the stored working fluid absorbs heat at the evaporation end of the two-phase heat exchange device 21, the working fluid is converted into a gas phase state and evaporated to move the heat away from the designated heat source. Further, when the vaporized working fluid is converted into a liquid phase state and liquefied at the condensation end of the two-phase heat exchange device 21, the liquefied working fluid returns to the evaporation end through the wick structure, thereby quickly re-applying. It circulates and continuously transfers heat.

  Further, the bottom surface portion 202 of the main body 201 of the support member 20 has one opening 205 in order to partially expose the accommodated two-phase heat exchange device 21, and the heat conductor 206 includes the support member 20. Is connected to the opening 205 of the bottom surface 202 of the main body 201 and is in contact with the housed two-phase heat exchange device 21. In this embodiment, the thermal conductor 206 can be a heat pipe, a heat column, or a hard metal block. The bottom surface portion 202 of the support member 20 of the heat dissipation module 2 that is in direct contact with the heat source or the heat dissipation module 2 can exchange heat by contacting the heat conductor 206 and the heat source.

  Furthermore, the main body 201 of the support member 20 has at least two locking elements 207 respectively arranged beside the side wall portion 203, so that the support member 20 can be fixed on the heat source. The main body 201 and the locking element 207 are integrally formed as a single member or are two separate parts that can be assembled. In this embodiment, the locking element 207 of the main body 201 of the support member 20 is a hole that is penetrated by an external fastening component (for example, a screw), and the heat source is a central processing unit (CPU), a transistor, a server, It can be a high thermal radiation electronic component such as a standard graphics card, hard drive, power supply, vehicle controller, multimedia electronics, wireless communication station, or high level game console.

  Since the support member 20 is disposed between the heat source and the two-phase heat exchange device 21, when the two-phase heat exchange device 21 is housed in the support member 20, the upper side of the bottom surface portion 202 of the support member 20 is completely The lower side of the bottom surface portion 202 of the support member 20 is in contact with the heat source. In the present embodiment, the accommodated two-phase heat exchange device 21 is adjacent to and inserted between the heat sink 23 and the support member 20 in the vertical direction. In addition, the two-phase heat exchange device 21 is welded to the support member 20. As a result, the two-phase heat exchange device 21 expands when it receives uneven pressure due to external force or when it is hot, and contracts when it is cold. Even if it is affected, it has the ability to withstand a greater pressure, and can solve problems such as deformation, poor appearance, and connection peeling in conventional flat plate heat pipes. A wick installed on the internal surface of the two-phase heat exchange device 21 The uniformity of the structure can be constantly maintained in order to increase the heat dissipation efficiency of the heat dissipation module 2.

  Furthermore, the shape of the opening 205 of the bottom surface 202 of the main body 201 of the support member 20 can be changed correspondingly according to the outer shape of the heat source to be applied. Compared with a conventional flat plate type heat pipe (further, it is necessary to be formed in a specific shape by a dedicated mold), it should be noted that the structure of the two-phase heat exchange device 21 of the embodiment is applied. This means that there is no need to change the heat source. Therefore, the competitiveness of the heat dissipation module of the embodiment can be enhanced, and the manufacturing process and the cost of the dedicated mold can be saved.

  However, the heat dissipation module of the present invention is not limited to the first embodiment. For example, FIG. 4A is an exploded view of the heat dissipation module 4 according to the second embodiment of the present invention, and FIG. 4B is an assembly heat dissipation module of FIG. 4A when all the parts of the heat dissipation module 4 of FIG. 4A are assembled. 4 shows a cross-sectional structure along line AA ′. The heat dissipation module 4 includes a support member 40 having an opening 405, a two-phase heat exchange device 41, and a heat sink 43 that provides two different types of fins 431, 432. The biggest difference between the heat dissipation module 2 in FIG. 2 and the heat dissipation module 4 in FIG. 4A is the difference in heat sink. All the fins of the heat sink 23 of the heat dissipation module 2 are equivalent, but the fins of the heat sink 43 of the heat dissipation module 4 are classified into two types. That is, the quantity, arrangement, and orientation of the fins 431, 432 of the heat sink 43 can be designed based on actual requirements. In FIG. 4B, the two-phase heat exchange device 41 accommodated in the support member 40 partially protrudes along the opening 405 of the support member 40, and as a result, the two-phase heat exchange device 41 is located below the support member 40. It can be in direct contact with a heat source (not shown).

  In addition, the shape of the support member, two-phase heat exchange device, and heat sink can be designed to satisfy the spatial structure of the actual part, and the shape of the support member, two-phase heat exchange device, and heat sink correspond to each other To do.

  FIG. 5 is an exploded view of the heat dissipation module 5 according to the third embodiment of the present invention. The heat dissipation module 5 includes a support member 50, a two-phase heat exchange device 51, and a heat sink 53. The support member 50, the two-phase heat exchange device 51, and the heat sink 53 all have a relatively inclined bottom surface so as to conform to the heat source profile and not interfere with other components on the circuit board. That is, the support member 50 has an inclined bottom surface portion 5000, the heat sink 53 has an inclined bottom surface portion 5300, and the two-phase heat exchange device 51 includes the inclined bottom surface portion 5300 of the heat sink 53 and the inclined bottom surface of the support member 50. The inclined bottom surface portion includes one inclined upper surface portion 5110 and one inclined bottom surface portion 5120 respectively corresponding to the portion 5000. As a result, when the support member 50, the two-phase heat exchange device 51, and the heat sink 53 are assembled, the stored two-phase heat exchange device 51 can be continuously adjacent to the support member 50 and the heat sink 53 in the vertical direction.

  6A is an exploded view of the heat dissipation module 6 according to the fourth embodiment of the present invention, and FIG. 6B is a schematic view of the assembly heat dissipation module of FIG. 6A. The heat radiation module 6 includes a support member 60 having at least an opening 600, a two-phase heat exchange device 61, a metal sheet 62, a heat sink 63, a fan 64, and an outer box having a suction port 67a and an exhaust port 67b formed on one side. 65. The support member 60, the two-phase heat exchange device 61, the metal sheet 62, the heat sink 63, and the fan 64 are accommodated in the outer box 65. The fan 64 disposed on the side of the heat sink 63 generates an airflow that blows in the lateral direction of the heat sink 63, and therefore, heat dissipation efficiency can be improved. The positions of the suction port 67 a and the exhaust port 67 b of the outer box 65 correspond to the fan 64 disposed beside the heat sink 63. The plurality of restriction posts 66 are disposed on the left and right sides of the support member 60. When the two-phase heat exchange device 61, the heat sink 63, and the support member 60 are assembled, the two-phase heat exchange device 61 and the heat sink 63 may be prevented from moving laterally by the restriction posts 66. The metal sheet 62 is in direct contact with the two-phase heat exchange device 61 through the opening 600 of the support member 60. When the heat dissipating module 6 is disposed on the heat source by contacting the metal sheet 62 on the heat source (not shown), the metal sheet 62 can take away the heat generated by the heat source, and then the two-phase heat exchange Heat is dissipated by the device 61 and the fan 64. Therefore, the heat dissipation efficiency can be increased.

  Although the invention has been described with reference to preferred embodiments by way of example, it should be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to compensate for various modifications and equivalent arrangements (as will be apparent to those skilled in the art). Accordingly, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements.

It is the schematic of the flat plate type heat pipe to which the conventional heat sink is applied. It is the schematic of the thermal radiation module by 1st Embodiment of this invention. FIG. 3 is an exploded view of the heat dissipation module of FIG. 2. FIG. 6 is an exploded view of a heat dissipation module having a heat sink different from that of FIG. 2 according to a second embodiment of the present invention. FIG. 4B shows a cross-sectional structure taken along line (A-A ′) of the assembled heat radiating module 4 of FIG. 4A when all the parts of the heat radiating module 4 of FIG. 4A are assembled. FIG. 6 is an exploded view of a heat dissipation module according to a third embodiment of the present invention, wherein the heat dissipation module includes a support member, a two-phase heat exchange device, and a heat sink, and all the support members, the two-phase heat exchange device, and the heat sink. Has a relatively inclined bottom surface. FIG. 7 is an exploded view of a heat dissipation module including a fan disposed beside a heat sink according to a fourth embodiment of the present invention. It is the schematic which shows the assembly heat radiation module of FIG. 6A.

Explanation of symbols

2 Heat radiation module 20 Support member 21 Two-phase heat exchange device (flat plate heat pipe)
23 heat sink 201 main body 202 bottom face part 203 side wall part 204 accommodation space 205 opening part 206 heat conductor 207 locking element

Claims (17)

In a support member for housing a two-phase heat exchange device, comprising a body having a bottom portion and at least two sidewall portions,
An accommodation space for accommodating the two-phase heat exchange device is formed by the bottom surface portion and the side wall portion of the main body, and the two-phase heat exchange device is attached to the bottom surface portion of the main body, and further includes a welding material. Is provided between the bottom portion of the body and the two-phase heat exchange device,
A support member.   The bottom portion of the main body includes an opening for partially exposing the two-phase heat exchange device, and the opening of the bottom portion of the main body is connected to the heat conductor that contacts the two-phase heat exchange device and the outside. The support member according to claim 1, wherein the heat conductor includes a heat pipe, a heat column, or a hard metal block, and the support member or the heat conductor is in contact with a heat source.   The main body further comprises at least two locking elements respectively arranged beside the side wall, the locking elements of the main body being penetrated by external fastening parts so that the support member can be connected on a heat source The support according to claim 1, comprising a plurality of holes, wherein the body and the locking element are integrally formed as a single member or are two separate parts that can be assembled. Element.   The support member is applied together with a heat sink, and the two-phase heat exchange device installed between and inserted between the support member and the heat sink is in contact with the support member and the heat sink. The support member according to claim 1. A heat sink,
A two-phase heat exchange device;
A support member that is used for housing the two-phase heat exchange device and has a main body including a bottom surface portion and at least two side wall portions;
In a heat dissipation module comprising:
An accommodation space for accommodating the two-phase heat exchange device is formed by the bottom surface portion and the side wall portion of the main body of the support member, and the two-phase heat exchange device is formed by the bottom surface of the main body of the support member. Attached to the
The two-phase heat exchange device is installed between and inserted between the support member and the heat sink, and the welding material is coated between the bottom surface portion of the main body and the two-phase heat exchange device by coating. A heat dissipation module, characterized in that it is provided.   The heat radiating module according to claim 5, wherein the bottom surface portion of the main body of the support member includes an opening to partially expose the two-phase heat exchange device.   The opening of the bottom portion of the main body of the support member is externally connected to a heat conductor in contact with the two-phase heat exchange device, and the heat conductor includes a heat pipe, a heat column, or a hard metal block. The heat dissipation module according to claim 6.   The support member or the heat conductor is a central processing unit, a transistor, a server, a high-level graphic card, a hard drive, a power supply unit, a vehicle control unit, a multimedia electronic mechanism, a wireless communication station, or a high-level game machine. The heat radiation module according to claim 6, wherein the heat radiation module is in contact with a heat source such as a heat radiation electronic component.   The main body of the support member further includes at least two locking elements respectively disposed beside the side wall, and the main body and the locking element are integrally formed as a single member or assembled. The heat dissipating module according to claim 5, wherein two possible separate parts are used.   The said locking element of the said main body of the said supporting member is provided with several holes penetrated by external fastening components, such as a screw | thread, so that the said supporting member can be connected on a heat source. The heat dissipation module described.   The two-phase heat exchange device is a flat plate heat pipe, and includes an inner surface on which a wick structure is disposed, and a material of the wick structure includes a metal, an alloy, or a porous non-metallic material. The heat dissipation module according to claim 5.   The heat dissipation module according to claim 5, wherein the two-phase heat exchange device is adjacent to the support member and the heat sink.   The support member, the two-phase heat exchange device, and the heat sink all have an inclined bottom surface in relation to a spatial structure of an actual part, and the support member, the two-phase heat exchange device, and the heat sink 6. The heat dissipation module according to claim 5, wherein the shapes correspond to each other.   The heat dissipation module according to claim 5, wherein the heat sink includes a plurality of fins, and the number, arrangement, and direction of the fins of the heat sink change based on actual requirements.   The heat dissipation module according to claim 5, further comprising a fan disposed beside the heat sink to increase heat dissipation efficiency.   The heat dissipating module further includes an outer box that houses the support member, the two-phase heat exchange device, the heat sink, and the fan, and the outer box includes an inlet that is installed corresponding to the fan, and the outer The heat radiation module according to claim 15, further comprising an exhaust port on one side of the box. The support member further includes a plurality of limit posts disposed on the left and right sides and both sides thereof, and when the two-phase heat exchange device, the heat sink, and the support member are assembled, the limit posts of the support member are: The heat dissipation module according to claim 5, wherein displacement of the two-phase heat exchange device and the heat sink is limited.

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