JP2009188202A - Substrate mounting structure and liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase peeling strength of another substrate from a mounting region defined on a substrate and to make the mounting region small. <P>SOLUTION: A substrate mounting structure includes a first substrate 11 on which the mounting area 11a having a plurality of connection electrodes 15 is defined at its end, an integrated circuit chip 20 which has, on its bottom surface, a plurality of bump electrodes 21 provided in a projection shape correspondingly to the plurality of connection electrodes 15b and 15a, and mounted on the mounting region 11a by electrically connecting the respective bump electrodes 21 to the connection electrodes 15b and 15a, and a second substrate 25 mounted on the mounting region 11a while being electrically connected other portions 15c of the plurality of connection electrodes 15 outside the integrated circuit chip 20, wherein a portion of the second substrate 50 is provided between the first substrate 11 and integrated circuit chip 20 outside the respective bump electrodes 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate mounting structure and a liquid crystal display device.

  Generally, a liquid crystal display device includes a liquid crystal display panel in which a liquid crystal layer is sealed inside a frame-shaped sealing material provided between a pair of substrates, an IC (Integrated Circuit) chip for driving the liquid crystal display panel, and And a flexible printed wiring board (FPC) that is electrically connected to the IC chip, and a substrate mounting structure in which the IC chip and the FPC are mounted on a liquid crystal display panel.

  As a method for mounting an IC chip on a liquid crystal display panel, a COG (Chip On Glass) mounting method is known. FIG. 9 is a cross-sectional view schematically showing a conventional COG type liquid crystal display device.

  As shown in FIG. 9, the liquid crystal display panel 100 includes a TFT substrate 101 on which a plurality of TFTs (Thin Film Transistors: not shown) and the like are formed, and a plurality of color filters (Color And a liquid crystal layer 104 sealed inside a frame-shaped sealing material 103 between the TFT substrate 101 and the CF substrate 102. The TFT substrate 101 has a protruding portion 101a protruding from the CF substrate 102 as a mounting region.

  As shown in the figure, the liquid crystal display panel 100 includes a display unit D that performs image display and a frame portion F that is a non-display unit outside the display unit D. An IC chip 105 is mounted on the protruding portion 101 a arranged in the frame portion F, and an FPC 106 is mounted outside the IC chip 105. These IC chip 105 and FPC 106 are anisotropic conductive films (ACF) 107, 108 in which conductive particles 107b, 108b are dispersed in insulating adhesives 107a, 108a. And are connected to the respective terminal pads 109 provided on the protruding portion 101a via conductive particles 107b and 108b in the ACFs 107 and 108, respectively.

  Each output terminal pad 109a connected to the IC chip 105 is connected to a plurality of lead wires 110 drawn from the display portion D of the TFT substrate 101 to the protruding portion 101a. Similarly, each input terminal pad 109b connected to the IC chip 105 and each external connection terminal pad 109c connected to the FPC 106 are respectively connected to both ends of a plurality of wirings 111 formed in the protruding portion 101a. The wirings 111 are connected to each other. Thus, the IC chip 105 and the FPC 106 are electrically connected, and a signal input to the FPC 106 can be supplied to the liquid crystal display panel 100 via the IC chip 105.

  By the way, it is preferable that the liquid crystal display device has a wide display portion and a narrow frame portion.

  However, in the above-mentioned COG type liquid crystal display device, when the IC chip and the FPC are mounted on the TFT substrate, a positional shift when the IC chip and the FPC are respectively pressure-bonded, or one of the IC chip and the FPC to be mounted later. It is necessary to consider that the crimping tool interferes with the other mounted first. In particular, considering that one crimping tool of the IC chip and the FPC interferes with the other, it is necessary to provide a relatively large distance 112 between the IC chip 105 and the FPC 106 as shown in FIG. As a result, the distance 113 between the connection region 101b of the IC chip 105 and the connection region 101c of the FPC 106 in the protrusion 101a is relatively large, so that the protrusion 101a is relatively long and the frame portion F is wide.

Therefore, in the liquid crystal display device of Patent Document 1, as shown in FIG. 10, the IC chip 105 and the FPC 106 share the protruding portion 101 a by sharing one ACF 114 in which conductive particles 114 b are dispersed in an insulating adhesive material 114 a. Has been implemented. As a result, the IC chip 105 and the FPC 106 are brought closer to each other to shorten the protruding portion 101a as compared with the case where the IC chip 105 and the FPC 106 are mounted by separate ACFs. In addition, in Patent Document 1, when manufacturing this liquid crystal display device, as shown in the drawing, a pressure bonding having a step corresponding to the difference in height from the surface of the protruding portion 101a between the IC chip 105 and the FPC 106 is shown. It is described that the IC chip 105 and the FPC 106 are simultaneously pressed and pressed against the protruding portion 101a by a tool 115.
JP 2006-339613 A

  By the way, the height from the surface of the protruding portion of the IC chip and the FPC varies depending on the tolerance of the thickness of the IC chip and the FPC. Accordingly, since the difference in height from the surface of the protruding portion between the IC chip and the FPC varies, as described above, in the method in which the IC chip and the FPC are pressed against the protruding portion by the pressure-bonding tool having a step, the IC chip and the FPC When the difference in height from the surface of the protruding portion at the point is larger than the level difference of the crimping tool, the FPC may not be sufficiently pressed and the peel strength of the FPC may be lowered.

  Also, in order to narrow the frame portion F, even when the adhesion region 116 of the FPC 106 in the protruding portion 101a shown in FIGS. 9 and 10 is reduced, the peel strength of the FPC 106 is lowered. As a result, the FPC 106 may be peeled off from the protruding portion 101a.

  The present invention has been made in view of such various points, and an object of the present invention is, in a substrate mounting structure such as a liquid crystal display device, other components mounted on the mounting region relative to the mounting region defined on the substrate. The purpose is to increase the peel strength of the substrate and reduce the mounting area.

  In order to achieve the above object, according to the present invention, each of the integrated circuit chips in which a part of the second substrate mounted in the mounting region of the first substrate is mounted in the mounting region inside the second substrate. Outside the bump electrode, it is provided between the integrated circuit chip and the first substrate.

  Specifically, the substrate mounting structure according to the present invention is provided in a protruding shape corresponding to a part of the first substrate having a mounting region having a plurality of connection electrodes defined at an end portion and the plurality of connection electrodes. An integrated circuit chip having a plurality of bump electrodes on the bottom surface and electrically connecting each bump electrode to a part of the plurality of connection electrodes and mounted in the mounting region; and A substrate mounting structure including a second substrate electrically connected to the other part of the plurality of connection electrodes on the outside and mounted in the mounting region, wherein a part of the second substrate includes the bumps It is provided between the first substrate and the integrated circuit chip outside the electrodes.

  The integrated circuit chip has a circuit portion, and the bump electrodes are input via a plurality of input bump electrodes to which external signals are input from the connected connection electrodes, and the input bump electrodes. A plurality of output bump electrodes that output the output signals generated by the circuit unit based on the external signals generated to the connected connection electrodes, and the circuit unit includes the input bump electrodes and the input bump electrodes. It is preferable to be provided in a region that overlaps the second substrate outside the output bump electrodes.

  One of the integrated circuit chip and the second substrate preferably overlaps the other in the width direction.

  The integrated circuit chip preferably overlaps the entire width direction of the second substrate.

  The integrated circuit chip is preferably mounted in the mounting region via an anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive.

  The integrated circuit chip and the second substrate may be mounted on the mounting region via the common anisotropic conductive film.

  In addition, the liquid crystal display device according to the present invention includes a first substrate in which a mounting region having a plurality of connection electrodes is defined at an end, and a plurality of protrusions provided corresponding to a part of the connection electrodes. An integrated circuit chip mounted on the mounting region by electrically connecting each bump electrode to a part of the plurality of connection electrodes, and on the outside of the integrated circuit chip. A second substrate electrically connected to other portions of the plurality of connection electrodes and mounted in the mounting region; a third substrate disposed opposite to the first substrate; the first substrate and the first substrate; A liquid crystal layer provided between the substrate and the mounting region provided outside the third substrate, wherein a part of the second substrate includes the bump electrodes. Outside the first substrate and the integrated circuit chip. That.

-Action-
Next, the operation of the present invention will be described.

  According to the substrate mounting structure according to the present invention, a part of the second substrate mounted in the mounting region of the first substrate is formed by each bump electrode of the integrated circuit chip mounted in the mounting region inside the second substrate. Since the integrated circuit chip and the second substrate are arranged in the mounting region, only the integrated circuit chip is pressed to the first substrate side. As a result, a part of the second substrate can be pressed together with the integrated circuit chip toward the first substrate via the integrated circuit chip, and the integrated circuit chip and the second substrate can be simultaneously mounted in the mounting region. In this way, there is no possibility that the pressing tool that presses one of the integrated circuit chip and the second substrate directly interferes with the other and shifts the other position. And the space | interval of the connection area | region of an integrated circuit chip and the connection area | region of a 2nd board | substrate in a mounting area becomes small, and a mounting area becomes small.

  Further, by pressing a part of the second substrate together with the integrated circuit chip toward the first substrate through the integrated circuit chip, both the integrated circuit chip and a part of the second substrate are sufficiently pressed with a desired pressure. The In addition, since a part of the second substrate is provided between the integrated circuit chip and the mounting region, peeling from the mounting region of the second substrate is suppressed by the integrated circuit chip. Therefore, the peel strength of the second substrate with respect to the mounting area is increased, and the mounting area is reduced. Furthermore, even when the bonding area of the second substrate in the mounting area is relatively small, the peeling strength of the second substrate with respect to the mounting area is suppressed from being lowered.

  By the way, in order to provide a part of the second substrate between the integrated circuit chip and the first substrate outside each bump electrode of the integrated circuit chip, it is necessary to provide a region overlapping the second substrate in the integrated circuit chip. is there. The integrated circuit chip has a circuit part, and each bump electrode includes a plurality of input bump electrodes and a plurality of output bump electrodes, and the circuit part is provided between each input bump electrode and each output bump electrode. In the case where the integrated circuit chip is provided, it is necessary to newly provide a region overlapping with the second substrate separately from the circuit portion on the integrated circuit chip, so that the integrated circuit chip becomes larger by the region overlapping with the second substrate. On the other hand, when the circuit unit is provided in a region overlapping the second substrate outside each input bump electrode and each output bump electrode, each input bump electrode and each output bump electrode , And the integrated circuit chip is prevented from becoming larger. Thus, the mounting area can be further reduced by the circuit portion.

  Further, when the whole of the integrated circuit chip and the second substrate in the width direction overlaps the other, the integrated circuit chip and the second substrate are integrated as compared with the case where the integrated circuit chip and the second substrate partially overlap each other in the width direction. Since the overlapping region between the circuit chip and the second substrate is large, the peeling of the second substrate from the mounting region is further suppressed, and the peeling strength of the second substrate with respect to the mounting region is further increased.

  In particular, when the integrated circuit chip overlaps the entire width direction of the second substrate, the separation of the second substrate from the mounting region is suppressed over the entire width direction, and the second substrate peels from the mounting region. The strength is further increased.

  When the integrated circuit chip is mounted in the mounting region via an anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive, insulation is performed between adjacent bump electrodes in the integrated circuit chip. Since the conductive adhesive is filled, sufficient insulation is easily ensured between the bump electrodes.

  Even when the integrated circuit chip and the second substrate are mounted on the mounting region via the common anisotropic conductive film, the effects of the present invention are specifically exhibited.

  Further, in the liquid crystal display device according to the present invention, each bump of the integrated circuit chip in which a part of the second substrate mounted on the mounting region of the first substrate is mounted on the mounting region on the inner side of the second substrate. Since the integrated circuit chip and the second substrate are provided outside the electrodes and between the integrated circuit chip and the first substrate, the integrated circuit chip and the second substrate are disposed in the mounting region, and then only the integrated circuit chip is moved to the first substrate side. By pressing, the integrated circuit chip and the second substrate can be simultaneously mounted on the mounting area. In this way, there is no possibility that the pressing tool that presses one of the integrated circuit chip and the second substrate directly interferes with the other and shifts the other position, and the connection region of the integrated circuit chip and the second substrate in the mounting region are eliminated. The distance from the connection area becomes smaller, and the mounting area becomes smaller.

  Further, both of the integrated circuit chip and a part of the second substrate are sufficiently pressed and pressed with a desired pressure, and peeling from the mounting area of the second substrate is suppressed by the integrated circuit chip. Therefore, the peel strength of the second substrate with respect to the mounting area is increased, and the mounting area is reduced. And the frame part which is a non-display part arrange | positioned outside the display part which performs the image display in a liquid crystal display device becomes narrow. Furthermore, even when the bonding area of the second substrate in the mounting area is made relatively small in order to narrow the frame portion, the peeling strength of the second substrate with respect to the mounting area is suppressed from being lowered.

  According to the present invention, a part of the second substrate mounted in the mounting region of the first substrate is outside the bump electrodes of the integrated circuit chip mounted in the mounting region inside the second substrate. Since it is provided between the integrated circuit chip and the first substrate, the peel strength of the second substrate relative to the mounting region can be increased, and the mounting region can be reduced.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 5 show Embodiment 1 of the present invention. FIG. 1 is a plan view schematically showing the liquid crystal display device S. FIG. FIG. 2 is a cross-sectional view schematically showing the liquid crystal display device S in an enlarged manner along the line II-II in FIG. FIG. 3 is a plan view schematically showing the integrated circuit chip 20 from the bottom surface side.

  As shown in FIGS. 1 and 2, the liquid crystal display device S includes a liquid crystal display panel 10 and an integrated circuit (IC) chip for driving the liquid crystal display panel 10 (hereinafter referred to as an IC chip). 20) and a flexible printed circuit (FPC) which is a second substrate for supplying a signal and power for performing image display to the liquid crystal display panel 10 from an external circuit (not shown). And a liquid crystal display panel 10 on which an IC chip 20 and an FPC 25 are mounted.

  The liquid crystal display panel 10 is disposed opposite to the TFT substrate 11 as a first substrate on which a plurality of TFTs (Thin Film Transistors: not shown) and the like are formed, for example, a color filter (Color Filter: illustrated). And the like, and a liquid crystal layer 13 provided between the TFT substrate 11 and the CF substrate 12. The liquid crystal display panel 10 includes a display unit D that displays an image, and a frame portion F that is a non-display area disposed outside the display unit D.

  The TFT substrate 11 and the CF substrate 12 are formed in a rectangular shape, for example, and are not shown in the figure. Each plate is provided. A frame-shaped sealing material 14 made of epoxy resin or the like is disposed between the TFT substrate 11 and the CF substrate 12, and a liquid crystal material is sealed inside the sealing material 14. 13 is configured.

  Although not shown, the TFT substrate 11 is provided in a region constituting the display portion D so that a plurality of source lines and a plurality of gate lines extend so as to cross each other. Each of the TFTs is provided at the intersection. Further, a plurality of pixel electrodes respectively connected to each TFT are formed on the TFT substrate 11 in a matrix. Although not shown, the TFT substrate 11 is formed with a circuit portion having a power supply circuit, a gate driver, a switching circuit, and the like in a region inside the outer edge of the sealing material 14.

  As shown in FIGS. 1 and 2, the TFT substrate 11 has a protruding portion 11 a whose one side protrudes outward from the CF substrate 12 in a region constituting the frame portion F. The protruding portion 11 a is provided as a mounting region defined at the end of the TFT substrate 11.

  As shown in FIG. 2, a plurality of terminal pads 15 that are connection electrodes are formed on the protruding portion 11a. Each terminal pad 15 is connected to a plurality of wirings 16 formed in the protruding portion 11a through through holes 17b formed in an insulating film 17 covering each wiring 16. Each output terminal pad 15a is connected to a plurality of lead wires 16a drawn from the source line to the protruding portion 11a. Each input terminal pad 15b and each external connection terminal pad 15c are respectively connected to both ends of the plurality of wirings 16b, and are electrically connected to each other via the respective wirings 16b. Each of these output terminal pads 15a, each input terminal pad 15b, and each external connection terminal pad 15c is provided in order from the inner side of the TFT substrate 11 toward the distal end side of the protruding portion 11a.

  On the protruding portion 11a, the IC chip 20 and the FPC 25 are made of an anisotropic conductive film (ACF: Anisotropic Conductive Film, hereinafter) in which conductive particles 18b and 19b are dispersed in, for example, insulating adhesives 18a and 19a. , Referred to as ACF) 18 and 19. The FPC 25 is mounted outside the IC chip 20 (at the front end side of the protruding portion 11a). A part of the FPC 25 is provided between the protruding portion (TFT substrate 11) 11a and the IC chip 20 outside the bump electrodes 21 of the IC chip 20 to be described later, as shown in FIGS. ing.

  The IC chip 20 overlaps a part of the FPC 25 so as to cover the entire connection region 11c of the FPC 25 in the protruding portion 11a, and the entire width direction overlaps the FPC 25 as shown in FIG. The IC chip 20 is an IC chip of a BGA (Ball Grid Array) package, and as shown in FIG. 3, each output terminal pad 15a, which is a part of the plurality of terminal pads 15 on the protruding portion 11a, and each input terminal. A plurality of bump electrodes 21 provided in a protruding shape on the bottom surface corresponding to the terminal pads 15b, and a drive circuit portion 22 are provided.

  The plurality of bump electrodes 21 are input by the drive circuit unit 22 based on the plurality of input bump electrodes 21a to which external signals are input from the input terminal pads 15b and the external signals input through the input bump electrodes 21a. The output bump electrode 21b outputs the generated output signal to the output terminal pad 15a.

  The drive circuit unit 22 includes, for example, a source driver and a timing controller, and is provided in a region overlapping the FPC 25 in the IC chip 20 outside the input bump electrodes 21a and the output bump electrodes 21b. Each of the input bump electrodes 21a and each of the output bump electrodes 21b is arranged closer to the inner side than the drive circuit unit 22 and adjacent to each other. The IC chip 20 is bonded to the protruding portion 11a by an adhesive 18a in the ACF 18, and the input bump electrodes 21a and the output bump electrodes 21b are connected to the input terminal pads 15b and the output via the conductive particles 18b. Each terminal pad 15a is electrically connected.

  Although not shown, the FPC 25 includes an insulating film substrate made of, for example, polyimide or polyethylene terephthalate, and a copper foil wire is formed on the surface of the film substrate. The FPC 25 is bonded to the bonding region 26 of the protruding portion 11a by an adhesive 19a in the ACF 19, and is connected to the external connection terminal pad 15c, which is the other portion of the plurality of terminal pads 15, via the conductive particles 19b. The wires are electrically connected. Thus, the FPC 25 is electrically connected to the input terminal pad 15b via the external connection terminal pad 15c. The FPC 25 is also electrically connected to the circuit portion formed on the TFT substrate 11 via an external connection terminal pad 15c and wiring (not shown).

  In this way, the liquid crystal display device S applies a voltage to the liquid crystal layer 13 in accordance with a signal input to the circuit portion formed on the TFT substrate 11 and the IC chip 20 via the FPC 25, whereby the liquid crystal molecules in the liquid crystal layer 13 are The orientation state is controlled to perform desired display.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device S will be described.

  In order to manufacture the liquid crystal display device S, first, the TFT substrate 11 and the CF substrate 12 are respectively fabricated, and the substrates 11 and 12 are bonded to each other via the sealing material 14. A liquid crystal display panel 10 is manufactured by enclosing a liquid crystal layer 13 between the TFT substrate 11 and the TFT substrate 11. Then, after polarizing plates are attached to both surfaces of the liquid crystal display panel 10, the IC chip 20 and the FPC 25 are mounted on the liquid crystal display panel 10. Since the liquid crystal display device S according to the present invention is characterized by the mounting structure of the IC chip 20 and the FPC 25 on the liquid crystal display panel 10, the mounting method of the IC chip 20 and the FPC 25 on the liquid crystal display panel 10 will be described below with reference to FIGS. This will be described in detail with reference to FIG. 4 and 5 are cross-sectional views for explaining a method of mounting the IC chip 20 and the FPC 25 on the liquid crystal display panel 10.

  When mounting the IC chip 20 and the FPC 25 on the liquid crystal display panel 10, first, the ACF 19 is attached to a region of the FPC 25 that adheres to the protruding portion 11 a. Next, as shown in FIG. 4, the FPC 25 is disposed on the protruding portion 11 a through the pasted ACF 19 and temporarily press-bonded.

  Next, the ACF 18 is affixed to a region where the IC chip 20 is disposed in the protruding portion 11a. At this time, the ACF 18 may overlap the surface of the FPC 25. Subsequently, as shown in FIG. 5, the IC chip 20 is placed on the ACF 18 attached to the protruding portion 11a and temporarily press-bonded.

  Thereafter, the ACFs 18 and 19 are heated, and the IC chip 20 is pressed toward the protruding portion 11a by the pressing tool 30 having a flat pressing surface. An arrow 31 in FIG. 5 indicates a direction in which the pressing tool 30 presses the IC chip 20. Then, a part of the FPC 25 is pressed together with the IC chip 20 toward the protruding portion 11a via the IC chip 20, and the IC chip 20 and the FPC 25 are simultaneously pressed and mounted on the protruding portion 11a. As described above, the IC chip 20 and the FPC 25 are mounted on the liquid crystal display panel 10.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, a part of the FPC 25 mounted on the protruding portion 11a of the TFT substrate 11 is outside the bump electrodes 21 of the IC chip 20 mounted on the protruding portion 11a inside the FPC 25. Since the IC chip 20 and the FPC 25 are arranged on the protruding portion 11a as shown in the above-described manufacturing method, only the IC chip 20 is provided. By pressing toward the TFT substrate 11, a part of the FPC 25 can be pressed together with the IC chip 20 toward the TFT substrate 11 via the IC chip 20, and the IC chip 20 and the FPC 25 can be simultaneously mounted on the protruding portion 11a. In this way, there is no possibility that the pressing tool that presses one of the IC chip 20 and the FPC 25 directly interferes with the other and shifts the other position. And the space | interval 27 of the connection area | region 11b of IC chip 20 in the protrusion part 11a and the connection area | region 11c of FPC25 can be made small, and the protrusion part 11a can be shortened.

  Furthermore, by pressing a part of the FPC 25 together with the IC chip 20 toward the TFT substrate 11 via the IC chip 20, both the IC chip 20 and a part of the FPC 25 can be sufficiently pressed with a desired pressure. In addition, by providing a part of the FPC 25 between the IC chip 20 and the protruding portion 11a, the IC chip 20 can suppress peeling of the FPC 25 from the protruding portion 11a. Therefore, the peel strength of the FPC 25 with respect to the protruding portion 11a can be increased, and the protruding portion 11a can be shortened. And the frame part F in the liquid crystal display device S can be narrowed. Furthermore, even when the adhesion area 26 of the FPC 25 in the protruding portion 11a is made relatively small in order to narrow the frame portion F, it is possible to suppress the peeling strength of the FPC 25 from the protruding portion 11a from being lowered.

  By the way, in order to provide a part of the FPC 25 between the IC chip 20 and the TFT substrate 11 outside the bump electrodes 21 of the IC chip 20, it is necessary to provide an area overlapping the FPC 25 in the IC chip 20. In the IC chip 20, as shown in FIG. 8 described later, when the drive circuit unit 22 is provided between each input bump electrode 21a and each output bump electrode 21b, Since it is necessary to newly provide a region overlapping the FPC 25 separately in the IC chip 20, the IC chip 20 becomes larger by the region overlapping the FPC 25. On the other hand, as shown in FIG. 2, the drive circuit section 22 is provided in a region overlapping the FPC 25 outside the input bump electrodes 21a and the output bump electrodes 21b. The distance between the electrode 21a and each output bump electrode 21b can be reduced by the drive circuit portion 22, and the increase in the size of the IC chip 20 can be suppressed. As a result, the protruding portion 11a can be further shortened by the drive circuit portion 22 of the IC chip 20.

  Further, since the entire width direction of the IC chip 20 overlaps the FPC 25, the overlapping area between the IC chip 20 and the FPC 25 is larger than when only a part of the IC chip 20 overlaps the FPC 25. Peeling of the FPC 25 from the protruding portion 11a can be further suppressed, and the peeling strength of the FPC 25 with respect to the protruding portion 11a can be further increased.

  Since the IC chip 20 is mounted on the protruding portion 11 a via the ACF 18, the insulating adhesive 18 a is filled between the adjacent bump electrodes 21 in the IC chip 20, and sufficient between the bump electrodes 21. Insulating properties can be easily secured.

<< Embodiment 2 of the Invention >>
FIG. 6 shows Embodiment 2 of the present invention. In the following embodiments, the same portions as those in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted. FIG. 6 is a cross-sectional view schematically showing an enlarged mounting location of the IC chip 20 and the FPC 25 in the liquid crystal display device S of the present embodiment.

  In the first embodiment, the IC chip 20 and the FPC 25 are mounted on the protruding portion 11a via the ACFs 18 and 19 that are separate from each other. However, in the present embodiment, as shown in FIG. The IC chip 20 and the FPC 25 are mounted on the protruding portion 11a.

  The height of each bump electrode 21 of the IC chip 20 is substantially equal to the thickness of the FPC 25. The IC chip 20 and the FPC 25 are respectively bonded to the protruding portion 11a by the common adhesive material 28a of the ACF 28, and are connected to the terminal pads 15 through the conductive particles 28b in the ACF 28, respectively.

  An example of a method for mounting the IC chip 20 and the FPC 25 on the liquid crystal display panel 10 using the common ACF 28 as described above will be described below.

  First, the ACF 28 is disposed in a region where the IC chip 20 and the FPC 25 are mounted in the protruding portion 11a. Next, the FPC 25 is disposed on the protruding portion 11a and temporarily pressure-bonded. Subsequently, the IC chip 20 is disposed on the protruding portion 11a and temporarily crimped. Thereafter, the ACF 28 is heated, and the IC chip 20 is pressed by the pressing tool 30 similar to that of the first embodiment, whereby the IC chip 20 and the FPC 25 are pressure-bonded and mounted on the protruding portion 11a.

-Effect of Embodiment 2-
Therefore, also in the second embodiment, a part of the FPC 25 mounted on the protruding portion 11a of the TFT substrate 11 is outside the bump electrodes 21 of the IC chip 20 mounted on the protruding portion 11a inside the FPC 25. In this case, since it is provided between the IC chip 20 and the protruding portion 11a, the peel strength of the FPC 25 with respect to the protruding portion 11a can be increased and the protruding portion 11a can be shortened as in the first embodiment. And the frame part F in the liquid crystal display device S can be narrowed.

<< Other Embodiments >>
In the above embodiments, the IC chip 20 overlaps the FPC 25 in the entire width direction. However, the present invention is not limited to this, and the width of the FPC 25 is larger than the width of the IC chip 20 as shown in FIG. It is preferable that the IC chip 20 is formed small and overlaps the entire width direction of the FPC 25. If it does in this way, peeling from the protrusion part 11a of FPC25 will be suppressed over the whole width direction, and it will become possible to further raise the peeling strength of FPC25 with respect to the protrusion part 11a.

  In each of the above embodiments, the drive circuit unit 22 is provided in a region that overlaps the FPC 25 in the IC chip 20 outside the bump electrodes 21a and 21b. However, the present invention is not limited to this, and the drive circuit unit is not limited thereto. As shown in FIG. 8, 22 may be provided in a region between each input bump electrode 21 a and each output bump electrode 21 b in the IC chip 20. Even with such a configuration, it is possible to increase the peel strength of the FPC 25 with respect to the protruding portion 11a and shorten the protruding portion 11a.

  In each of the above embodiments, the IC chip 20 and the FPC 25 are mounted on the protruding portion 11a via the ACF 18, 19 or ACF 28. However, the present invention is not limited to this, and the paste-like heat mixed with the conductive material is used. The IC chip 20 and the FPC 25 may be mounted on the protruding portion 11a via a curable resin. In the IC chip 20, each bump electrode 21 may be formed of a low melting point metal material made of indium or the like, and each bump electrode 21 and each terminal pad 15b, 15a may be directly connected.

  In each of the above embodiments, the FPC 25 has been described as an example of the substrate mounted on the liquid crystal display panel 10, but the present invention is not limited to this, and a printed circuit board (PCB) is used instead of the FPC 25. May be mounted on the protruding portion 11a.

  In each of the above embodiments, the liquid crystal display device S in which the IC chip 20 and the FPC 25 are mounted on the liquid crystal display panel 10 has been described. However, the present invention is not limited to this, and other display devices such as an organic electroluminescence display device can also be used. The present invention can be applied, and can be applied to a substrate mounting structure having a structure in which an IC chip and another substrate are mounted on a substrate in which a mounting area is defined.

  As described above, the present invention is useful for a substrate mounting structure and a liquid crystal display device. In particular, the present invention increases the peel strength of another substrate mounted on the mounting region relative to the mounting region defined on the substrate and implements the mounting. It is suitable for a substrate mounting structure and a liquid crystal display device that require a small area.

1 is a plan view schematically showing a liquid crystal display device of Embodiment 1. FIG. It is a figure which shows schematically the II-II sectional view taken on the line of FIG. It is a top view which shows an IC chip roughly from the bottom face side. It is sectional drawing which shows the protrusion part of the state by which FPC was temporarily crimped | bonded. It is sectional drawing which shows a protrusion part when an IC chip and FPC are finally crimped | bonded. FIG. 6 is a cross-sectional view schematically showing an enlarged mounting location of an IC chip and an FPC in the liquid crystal display device of Embodiment 2. It is a top view which shows schematically the liquid crystal display device with which the IC chip in other embodiment has overlapped with the whole width direction of FPC. It is sectional drawing which expands and shows the mounting location of IC chip and FPC in which the drive circuit part was provided between each input bump electrode and each output bump electrode in other embodiment. It is sectional drawing which expands and shows schematically the mounting location of IC chip and FPC in the conventional liquid crystal display device. It is sectional drawing which expands and shows roughly the mounting location of IC chip and FPC mounted via common ACF in the conventional liquid crystal display device.

Explanation of symbols

S Liquid crystal display device 11 TFT substrate (first substrate)
11a Protruding part (mounting area)
12 CF substrate (third substrate)
13 Liquid crystal layer 15 Terminal pad (connection electrode)
15a terminal pad for output 15b terminal pad for input 15c terminal pad for external connection 18, 19, 28 ACF (anisotropic conductive film)
18a, 19a, 28a Adhesive 18b, 19b, 28b Conductive particle 20 IC chip (integrated circuit chip)
21 Bump electrode 21a Bump electrode for input 22b Bump electrode for output 22 Drive circuit section (circuit section)
25 FPC (second board)

Claims (7)

A first substrate in which a mounting region having a plurality of connection electrodes is defined at an end;
A plurality of bump electrodes provided in a protruding shape corresponding to a part of the plurality of connection electrodes are provided on the bottom surface, and the bump electrodes are electrically connected to a part of the plurality of connection electrodes, respectively. An integrated circuit chip mounted in a mounting area; and
A substrate mounting structure comprising: a second substrate electrically connected to the other part of the plurality of connection electrodes outside the integrated circuit chip and mounted in the mounting region;
A part of the second substrate is provided between the first substrate and the integrated circuit chip outside the bump electrodes. The board mounting structure according to claim 1,
The integrated circuit chip has a circuit portion,
The bump electrodes are generated by the circuit unit based on a plurality of input bump electrodes to which external signals are input from the connected connection electrodes and external signals input through the input bump electrodes. A plurality of output bump electrodes that output the output signals to the connected connection electrodes,
The circuit board mounting structure, wherein the circuit portion is provided in a region overlapping the second substrate outside the input bump electrodes and the output bump electrodes. The board mounting structure according to claim 1,
One of the integrated circuit chip and the second substrate overlaps the other in the width direction. In the substrate mounting structure according to claim 3,
The substrate mounting structure, wherein the integrated circuit chip overlaps the entire width direction of the second substrate. The board mounting structure according to claim 1,
The substrate mounting structure, wherein the integrated circuit chip is mounted in the mounting region via an anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive. In the substrate mounting structure according to claim 5,
The substrate mounting structure, wherein the integrated circuit chip and the second substrate are mounted in the mounting region via the common anisotropic conductive film. A first substrate in which a mounting region having a plurality of connection electrodes is defined at an end;
A plurality of bump electrodes provided in a protruding shape corresponding to a part of the plurality of connection electrodes are provided on the bottom surface, and the bump electrodes are electrically connected to a part of the plurality of connection electrodes, respectively. An integrated circuit chip mounted in a mounting area; and
A second substrate that is electrically connected to the other part of the plurality of connection electrodes outside the integrated circuit chip and is mounted in the mounting region;
A third substrate disposed opposite the first substrate;
A liquid crystal layer provided between the first substrate and the third substrate;
The mounting area is a liquid crystal display device provided outside the third substrate,
A part of said 2nd board | substrate is provided between the said 1st board | substrate and the said integrated circuit chip outside the said each bump electrode, The liquid crystal display device characterized by the above-mentioned.

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