JP2009182184A - Manufacturing method of ceramic multilayer substrate - Google Patents

Abstract

A method for manufacturing a ceramic multilayer substrate with improved processing accuracy of a pattern formed using droplets is provided.
In a decompression packaging process, an upper elastic plate EP2 is disposed on an upper surface of a laminate 32, and a lower elastic plate EP1 is disposed on a lower surface of the laminate 32, and the upper and lower elastic plates EP2 and EP1 are interposed therebetween. Thus, the laminate 32 was vacuum-sealed. Therefore, since the reaction force from the dry pattern PD is absorbed by the lower elastic plate EP1 and the upper elastic plate EP2, the pressing force related to the dry pattern PD is reduced. As a result, in the vacuum packaging process, the dry pattern PD formed on the green sheet 23 can be prevented from being crushed and deformed, and a highly accurate pattern can be formed.
[Selection] Figure 6

Description

  The present invention relates to a method for manufacturing a ceramic multilayer substrate.

  Low temperature co-fired ceramics (LTCC) technology enables the simultaneous firing of green sheets and metals, and thus can implement a device-embedded substrate incorporating various passive elements between ceramic layers. In the system-on-package (SOP) mounting technology, this element-embedded substrate (hereinafter simply referred to as an LTCC multilayer substrate) is used in order to reduce the parasitic effects that occur in the combination of electronic components and surface-mounted components. The manufacturing method involved has been intensively developed.

  In the manufacturing method of the LTCC multilayer substrate, a drawing process for drawing a pattern such as a passive element or a wiring on each of a plurality of green sheets, a crimping process for laminating a plurality of green sheets having the pattern, and a crimping body, A firing step of batch firing is sequentially performed.

  In order to increase the density of various patterns in the drawing process, a so-called ink jet method is proposed in which conductive ink is discharged as fine droplets (for example, Patent Document 1). The ink-jet method uses droplets of several picoliters to several tens of picoliters, and enables pattern miniaturization and narrow pitch by changing the ejection position of the droplets.

In order to stabilize the lamination state of each green sheet, a so-called hydrostatic pressure molding method in which a hydrostatic pressure is applied to the laminated body has been proposed (for example, Patent Documents 2 to 4). In the hydrostatic pressure molding method, a laminate is packaged under reduced pressure, and the laminate is left in a heated liquid to increase the static pressure of the liquid. This makes it possible to apply isotropic pressure to the laminate.
JP 2005-57139 A JP-A-5-315184 JP-A-6-77658 JP 2007-201245 A

  Fig.7 (a) is a top view of the pattern by a drawing process, FIG.7 (b) is AA sectional drawing of Fig.7 (a). Fig.8 (a) is a top view of the pattern by a crimping | compression-bonding process, FIG.8 (b) is AA sectional drawing of Fig.8 (a).

  The conductive ink used in the inkjet method is a dispersion system of conductive fine particles, and the particle diameter of the conductive particles is generally several nm to several tens of nm. As shown in FIGS. 7A and 7B, the pattern 101 formed on the green sheet 100 through the drawing process is an aggregate of the conductive fine particles 102, and the state is maintained until it is fired by the firing process. Continue to maintain.

By the way, in the said crimping | compression-bonding process, after accommodating the green sheet 100 which pinches | interposes the pattern 101 in a vacuum packaging bag and pressing with an atmospheric pressure (decompression packaging process), hydrostatic pressure is applied to the said laminated body, and the said crimping | compression-bonding body is carried out. Form. At this time, since the conductive fine particles before firing have a weak adhesion to the green sheet 100 and a bonding force between the particles, as shown in FIGS. It will be crushed. As a result, in the above crimping step, the pattern 101 is deformed so as to extend along the main surface 100a of the green sheet 100, protrudes from a desired pattern region 104 (two-dot chain line in FIGS. 7 and 8), There is a problem that the pattern 101 comes into contact with the pattern 101 and short-circuits.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a ceramic multilayer substrate with improved processing accuracy of a pattern formed using droplets.

  The method for producing a ceramic multilayer substrate of the present invention includes a drawing step of drawing a liquid pattern on the green sheet by discharging a liquid containing conductive fine particles into droplets by a discharge means and discharging the liquid onto the green sheet; A drying step of drying a pattern to form a dry pattern on the green sheet, a laminating step of laminating a plurality of the green sheets on which the dry pattern is formed to form a laminate, and the laminate to a vacuum packaging bag The pressure-reducing packaging step of accommodating and depressurizing the inside of the vacuum packaging bag to decompress-wrap the laminate, and forming a pressure-bonded body by applying hydrostatic pressure to the laminate packaged under reduced pressure in the vacuum packaging bag And a firing process for firing the crimped body, wherein the green laminate is formed on both sides of the laminate in the vacuum packaging process. Arranged an elastic plate formed of a low elastic modulus than over preparative, the laminate is vacuum packaged across the both resilient plate.

  According to the method for producing a ceramic multilayer substrate of the present invention, in the decompression packaging step, elastic plates having an elastic modulus lower than that of the green sheet are disposed on both side surfaces of the laminate, and the laminate is sandwiched between both elastic plates. Since the packaging is decompressed, the reaction force from the drying pattern PD to the pressing force applied to the drying pattern is absorbed by both elastic plates. Therefore, the pressing force applied to the dry pattern formed on the green sea during the vacuum packaging process is reduced. As a result, the dry pattern formed on the green sheet during the decompression packaging process is prevented from being crushed and deformed, and a highly accurate pattern can be formed.

  In the method for manufacturing a ceramic multilayer substrate, in the crimping step, the crimped body may be formed by applying hydrostatic pressure to the laminated body in a state where the elastic plate is sandwiched under reduced pressure.

  According to this method for producing a ceramic multilayer substrate, in the crimping step, the laminated body is crimped in a state in which elastic plates having an elastic modulus lower than that of the green sheet are disposed on both side surfaces of the laminated body. The reaction force from the drying pattern against the pressing force applied to the pattern is absorbed by the elastic plates on both sides. Therefore, the pressing force applied to the dry pattern during the crimping process is also reduced. As a result, the dry pattern formed on the green sheet is prevented from being crushed and deformed during the crimping process, and a highly accurate pattern can be formed.

In this method for producing a ceramic multilayer substrate, the elastic plate may be a synthetic rubber.
According to this method for producing a ceramic multilayer substrate, the elastic plate formed of synthetic rubber can absorb the reaction force from the dry pattern.

In this method for producing a ceramic multilayer substrate, when the pressure is reduced in the vacuum packaging bag, the pressure may be reduced while heating the green sheet.
According to this method for manufacturing a ceramic multilayer substrate, the green sheet is softened, and the reaction force from the dry pattern is also absorbed by the softened green sheet being deformed. As a result, the pattern is prevented from being crushed and deformed during the decompression packaging process, and a highly accurate pattern can be formed.

In this method for producing a ceramic multilayer substrate, when the hydrostatic pressure is applied to form the crimped body, the hydrostatic pressure may be applied while heating the green sheet.
According to this method for manufacturing a ceramic multilayer substrate, the green sheet is softened, and the reaction force from the dry pattern is also absorbed by the softened green sheet being deformed. As a result, the pattern is prevented from being crushed and deformed during the crimping process, and a highly accurate pattern can be formed.

  Hereinafter, a first embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of a circuit module comprising a ceramic multilayer substrate manufactured using the manufacturing method of the present invention.

  In FIG. 1, a circuit module 10 includes a low temperature co-fired ceramics (LTCC) multilayer substrate 11 as a ceramic multilayer substrate, and a semiconductor chip 12 connected to the LTCC multilayer substrate 11.

  The LTCC multilayer substrate 11 has a plurality of LTCC substrates 13 stacked. Each LTCC substrate 13 is a sintered body of a green sheet and has a thickness of several tens to several hundreds of μm. Each LTCC substrate 13 is formed with various internal elements 14 such as a resistance element, a capacitive element, and a coil element, and an internal wiring 15 electrically connected to each internal element 14. A via wiring 16 forming a thermal via structure is formed.

The internal element 14, the internal wiring 15, and the via wiring 16 are each a sintered body of conductive fine particles, and are formed by an ink jet method using a conductive ink.
Next, a method for manufacturing the LTCC multilayer substrate 11 will be described with reference to FIGS. FIG. 2 is a flowchart showing a manufacturing method of the LTCC multilayer substrate 11, and FIGS. 3 to 6 are process diagrams showing the manufacturing method of the LTCC multilayer substrate 11.

2, in the manufacturing method of the LTCC multilayer substrate 11, a drawing process (step S <b> 11) for drawing a liquid pattern on a green sheet that is a precursor of the LTCC substrate 13, and the liquid pattern is dried to collect the conductive fine particles. The drying process (step S12) for forming the drying pattern is executed in order. Next, in the manufacturing method of the LTCC multilayer substrate 11, a laminating process (step S13) for laminating a plurality of green sheets to form a laminated body, a reduced pressure packaging process (step S14) for decompressing and packaging the laminated body, A crimping step (step S15) for crimping the laminate to form a crimped body and a firing step (step S16) for firing the crimped body are sequentially performed.
(Drawing process)
In FIG. 3, in the drawing process, a laminated sheet 20 and a droplet discharge device 21 are used. The laminated sheet 20 includes a carrier film 22 and a green sheet 23 formed on the carrier film 22.

  The carrier film 22 is a film for supporting the green sheet 23 in the drawing process and the drying process. For example, a plastic film excellent in peelability from the green sheet 23 and mechanical resistance in each process can be used. For the carrier film 22, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene film, or a polypropylene film can be used.

The green sheet 23 is a layer made of a glass ceramic composition containing glass ceramic powder, a binder, and the like. The film thickness of the green sheet 23 is several tens of micrometers when a capacitor element is formed as the internal element 14, and the film thickness is 100 μm to 200 μm in the other layers. The green sheet 23 is a state in which a glass ceramic composition slurried with a dispersion medium is applied onto a carrier film 22 using a sheet forming method such as a doctor blade method or a reverse roll coater method, and the coating film can be handled. Obtained by drying.

As the dispersion medium, for example, a surfactant, a silane coupling agent, or the like can be used as long as it can uniformly disperse the glass ceramic powder.
The glass ceramic powder is a powder having an average particle diameter of 0.1 μm to 5 μm. For example, a glass composite ceramic obtained by mixing borosilicate glass with ceramic powder such as alumina or forsterite can be used. Further, as the glass ceramic powder, a crystallized glass ceramic using a ZnO—MgO—Al 2 O 3 —SiO 2 type crystallized glass, a BaO—Al 2 O 3 —SiO 2 type ceramic powder, an Al 2 O 3 —CaO—SiO 2 —MgO—B 2 O 3 type ceramic powder, etc. Non-glass-based ceramics using may be used.

  The binder is an organic polymer that functions as a binder for the glass ceramic powder and can be easily decomposed and removed in a subsequent firing step. As the binder, for example, a binder resin such as butyral, acrylic or cellulose can be used. As the acrylic binder resin, for example, a homopolymer of a (meth) acrylate compound such as alkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, polyalkylene glycol (meth) acrylate, cycloalkyl (meth) acrylate, or the like is used. Can do. Moreover, as an acrylic binder resin, it can be obtained from a copolymer obtained from two or more of the (meth) acrylate compounds, or from other copolymerizable monomers such as (meth) acrylate compounds and unsaturated carboxylic acids. Can be used.

  The binder may contain a plasticizer such as an adipate ester plasticizer, dioctyl phthalate (DOP), dibutyl phthalate (DBP) phthalate ester plasticizer, or a glycol ester plasticizer.

  A circular hole having a predetermined hole diameter (hereinafter simply referred to as a positioning hole H) is formed on the edge of the laminated sheet 20 by punching. In each positioning hole H, positioning pins 24P of the mounting plate 24 are inserted, and each position of the drawing surface 20a of the laminated sheet 20 is positioned with respect to the droplet discharge device 21.

  The green sheet 23 is formed with a circular hole or a conical hole (hereinafter simply referred to as a via hole 23h) having a hole diameter of several tens of μm to several hundreds of μm by punching or laser processing. The via hole 23h is filled with a conductive material such as silver, gold, copper, or palladium in the previous step by a squeegee method using a conductive paste or an inkjet method using a conductive ink.

  The droplet discharge device 21 includes a placement plate 24 on which the laminated sheet 20 is placed, an ink tank 25 that stores the conductive ink Ik as a liquid material, and the drawing surface 20a of the conductive ink Ik in the ink tank 25. And a droplet discharge head 26 serving as a discharge means for discharging the liquid.

  The mounting plate 24 is a plate made of a rigid material having substantially the same size as the laminated sheet 20, and includes positioning pins 24 </ b> P for positioning the laminated sheet 20 and a heater 24 </ b> H for heating the laminated sheet 20. Then, when the laminated sheet 20 is placed on the placement plate 24, the placement plate 24 passes each position of the drawing surface 20 a with respect to the droplet discharge head 26 by inserting the positioning pins 24 </ b> P into the positioning holes H. Position.

  Further, when the laminated sheet 20 is placed on the placement plate 24, the placement plate 24 drives the heater 24H to heat the laminated sheet 20 to a predetermined drawing temperature.

  The conductive ink Ik is a dispersion system of the conductive fine particles Ia in which the conductive fine particles Ia are dispersed in the dispersion medium Ib. The viscosity of the conductive ink Ik is adjusted to 20 cP or less in order to enable discharge of minute droplets D. Yes.

  The conductive fine particles Ia are fine particles having a particle diameter of several nm to several tens of nm, such as gold, silver, copper, platinum, palladium, rhodium, osmium, ruthenium, iridium, iron, tin, cobalt, nickel, chromium, A metal such as titanium, tantalum, tungsten, indium, or an alloy thereof can be used. In this embodiment, silver fine particles are used as the conductive fine particles Ia.

  The dispersion medium Ib may be any dispersion medium that uniformly disperses the conductive fine particles Ia. For example, water or an aqueous solution mainly containing water, or an organic solvent mainly containing an organic solvent such as tetradecane can be used. .

  The droplet discharge head 26 includes a cavity 27 that communicates with the ink tank 25, a nozzle 28 that communicates with the cavity 27, and a pressure generating element 29 that is coupled to the cavity 27. The cavity 27 stores the conductive ink Ik from the ink tank 25 and supplies the conductive ink Ik from the ink tank 25 to the nozzle 28. The nozzle 28 is a nozzle having an opening of several tens of μm. The pressure generating element 29 is a piezoelectric element or a capacitive element that changes the volume of the cavity 27, or a resistance heating element that changes the temperature of the cavity 27, and generates a predetermined pressure inside the cavity 27. When the pressure generating element 29 is driven, the nozzle 28 vibrates the gas-liquid interface (meniscus) of the conductive ink Ik and discharges the conductive ink Ik as a droplet D of several picoliters to several tens of picoliters. .

  In the drawing process, the laminated sheet 20 and the droplet discharge head 26 are relatively moved in the surface direction of the drawing surface 20a, and a plurality of droplets D from the nozzles 28 land on the drawing surface 20a, respectively, on the drawing surface 20a. Unite at Thus, a liquid pattern PL continuous in a predetermined direction is formed on the drawing surface 20a. At this time, since the temperature of the laminated sheet 20 is a predetermined drawing temperature, the liquid pattern PL is thickened by evaporation of a part of the dispersion medium Ib, so that wetting and spreading along the drawing surface 20a is suppressed. ing.

Note that if the predetermined drawing temperature becomes excessively high, the carrier film 22 and the green sheet 23 are thermally deformed, and the landing accuracy of the droplets D is impaired. Accordingly, the predetermined drawing temperature is, for example, 40 ° C. to 80 ° C., and is appropriately selected according to the composition of the laminated sheet 20 and the composition of the conductive ink Ik so that the landing accuracy of the droplets D can be sufficiently secured. The
(Drying process)
In FIG. 4, in the drying process, the laminated sheet 20 after the drawing process is carried into a drying device such as a drying furnace and heated to a predetermined drying temperature in a state having the liquid pattern PL. Since the temperature of the laminated sheet 20 is heated at a predetermined drying temperature, the liquid pattern PL further promotes the drying. As a result, most of the dispersion medium Ib of the liquid pattern PL is evaporated, and a dry pattern PD composed of an aggregate of the conductive fine particles Ia is formed on the drawing surface 20a.

If the predetermined drying temperature is excessively high, the carrier film 22 and the green sheet 23 are thermally deformed, and the positional accuracy with the other laminated sheets 20 in the lamination process is impaired. Therefore, the drying temperature is, for example, 40 ° C. to 80 ° C., and is appropriately selected according to the composition of the laminated sheet 20 and the composition of the conductive ink Ik so as to ensure the positional accuracy during the lamination process.

As described above, when the liquid pattern PL drawn on the laminated sheet 20 (green sheet 23) is dried to become the dried pattern PD by the drying device, the process proceeds to the lamination step.
(Lamination process)
In FIG. 5, a base plate 31 for laminating a plurality of green sheets 23 is used in the laminating step. The base plate 31 is a plate made of a rigid material having substantially the same size as the laminated sheet 20 and has positioning pins 31P for positioning the plurality of green sheets 23.

  In the stacking step, first, the lower elastic plate EP1 is placed on the base plate 31. The lower elastic plate EP <b> 1 is made of synthetic rubber having a lower elastic modulus than the green sheet 23 and has the same outer shape as the green sheet 23. The lower elastic plate EP1 is positioned on the base plate 31 by inserting the positioning pins 31P through the positioning holes H1 formed in the lower elastic plate EP1.

  Subsequently, the first laminated sheet 20 is placed on the lower elastic plate EP1 with the green sheet 23 facing upward. By positioning the positioning pin 31 </ b> P through the positioning hole H of the laminated sheet 20, the first laminated sheet 20 is positioned on the base plate 31. Next, the second laminated sheet 20 is placed on the base plate 31 with the green sheet 23 facing down. The second-layer laminated sheet 20 is positioned by inserting the positioning pins 31P through the positioning holes H, and the carrier film 22 is peeled so that only the second-layer green sheet 23 is the first-layer green sheet. 23 is stacked on top of the other.

Thereafter, similarly, a predetermined number of green sheets 23 are sequentially laminated to form a laminate (hereinafter simply referred to as a laminate 32) of the green sheets 23 on which the dry pattern PD is formed.
(Decompression packaging process)
In FIG. 6, in the reduced pressure packaging process, in addition to the laminated body 32 laminated on the base plate 31, the upper elastic plate EP <b> 2 and the vacuum packaging bag 35 are used. The upper elastic plate EP2 is a plate material made of synthetic rubber made of the same material as the lower elastic plate EP1, and has a plurality of insertion holes H2 through which the positioning pins 31P of the base plate 31 can be inserted. The vacuum packaging bag 35 is a packaging bag having flexibility that can enclose the base plate 31, the lower elastic plate EP <b> 1, the upper elastic plate EP <b> 2, and the laminate 32.

  In the decompression packaging step, first, the positioning pin 31P is inserted into the insertion hole H2 of the upper elastic plate EP2, and the laminate 32 is sandwiched between the base plate 31 (lower elastic plate EP1) and the upper elastic plate EP2. The base plate 31 (lower elastic plate EP1) and the upper elastic plate EP2 are accommodated in the vacuum packaging bag 35 with the laminate 32 sandwiched therebetween, and are vacuum-sealed inside the vacuum packaging bag 35 by suction using a sealer or the like. . The laminated body 32 that is vacuum-sealed is pressure-bonded by receiving atmospheric pressure via the lower elastic plate EP1 and the upper elastic plate EP2.

  While the laminate 32 is vacuum-sealed, atmospheric pressure is applied to the dry pattern PD via the green sheet 23. At this time, the reaction force from the dry pattern PD is transmitted to the outermost lower elastic plate EP1 and the upper elastic plate EP2 via the green sheet 23. In this embodiment, since the elastic modulus of the lower elastic plate EP1 and the upper elastic plate EP2 is lower than that of the green sheet 23, the lower elastic plate EP1 and the upper elastic plate EP2 wrap around the green sheet 23 in the dry pattern PD portion. Deform.

That is, since the reaction force from the dry pattern PD is absorbed by the lower elastic plate EP1 and the upper elastic plate EP2, the pressing force related to the dry pattern PD is reduced and the crushing and deformation of the dry pattern PD are suppressed. .
(Crimping process)
In the crimping step, the laminated body 32 after decompression packaging is carried into a hydrostatic press, and a hydrostatic pressure is applied to the laminated body 32 sealed in a vacuum packaging bag 35 to form a crimped body. While the laminated body 32 is applied with hydrostatic pressure, the dry pattern PD is pressed through the green sheet 23. At this time, similarly to the above, the reaction force from the dry pattern PD is absorbed by the lower elastic plate EP1 and the upper elastic plate EP2, so the pressing force related to the dry pattern PD is reduced, and in this crimping step, However, the collapse and deformation of the dry pattern PD are suppressed.
(Baking process)
In the firing step, the pressure-bonded body obtained in the pressure-bonding step is taken out from the base plate 31, and the pressure-bonded body is carried into a predetermined firing furnace and fired. The firing temperature is, for example, 800 ° C. to 1000 ° C., and is appropriately changed according to the composition of the green sheet 23.

  In addition, when using Cu as dry pattern PD, it is preferable to bake in a reducing atmosphere to prevent oxidation. When silver, gold, platinum, palladium or the like is used, it may be fired in the air. In the firing step, the pressure-bonded body may be fired while being pressed at a pressure smaller than the hydrostatic pressure in the pressure-bonding step. According to this, the flatness of the LTCC multilayer substrate 11 is improved, and the warp and peeling of the green sheet 23 can be prevented.

Next, effects of the embodiment configured as described above will be described below.
(1) According to the above embodiment, in the decompression packaging step, the upper elastic plate EP2 is arranged on the upper side surface of the laminate 32, and the lower elastic plate EP1 is arranged on the lower side surface of the laminate 32, so The laminate 32 was vacuum-sealed through the plates EP2 and EP1.

  Therefore, since the reaction force from the dry pattern PD is absorbed by the lower elastic plate EP1 and the upper elastic plate EP2, the pressing force related to the dry pattern PD is reduced. As a result, in the vacuum packaging process, the dry pattern PD formed on the green sheet 23 can be prevented from being crushed and deformed, and a highly accurate pattern can be formed.

  (2) According to the above embodiment, in the pressure bonding step with hydrostatic pressure, the upper elastic plate EP2 is disposed on the upper side surface of the multilayer body 32, and the lower elastic plate EP1 is disposed on the lower side surface of the multilayer body 32. The laminated body 32 was vacuum-sealed through the lower elastic plates EP2 and EP1.

  Therefore, since the reaction force from the dry pattern PD is absorbed by the lower elastic plate EP1 and the upper elastic plate EP2, the pressing force related to the dry pattern PD is reduced. As a result, even in the pressure bonding step with hydrostatic pressure, the dry pattern PD formed on the green sheet 23 can be prevented from being crushed and deformed, and a highly accurate pattern can be formed.

In addition, you may change the said embodiment as follows.
In the above embodiment, in the laminating step, the temperature of the green sheet 23 may be heated to soften the hardness of the green sheet 23.

  As a result, the load on the dry pattern PD due to atmospheric pressure is reduced and deformation and the like are suppressed by the amount that the green sheet 23 softens during decompression packaging. As a result, the processing accuracy of the pattern formed on the LTCC substrate 13 can be improved.

-According to the said embodiment, in the crimping | compression-bonding process, the temperature of the green sheet 23 may be heated and the green sheet 23 may be softened.
Accordingly, the dry pattern PD by hydrostatic pressure is as much as the green sheet 23 is softened.
This reduces the load applied and reduces deformation and the like. As a result, the processing accuracy of the pattern formed on the LTCC substrate 13 can be improved.

Sectional drawing which shows a circuit module. The flowchart which shows the manufacturing method of a ceramic multilayer substrate. Process drawing which shows the manufacturing method of a ceramic multilayer substrate. Process drawing which shows the manufacturing method of a ceramic multilayer substrate. Process drawing which shows the manufacturing method of a ceramic multilayer substrate. Process drawing which shows the manufacturing method of a ceramic multilayer substrate. (A), (b) is a figure which shows the manufacturing method of the ceramic multilayer substrate of a prior art example, respectively. (A), (b) is a figure which shows the manufacturing method of the ceramic multilayer substrate of a prior art example, respectively.

Explanation of symbols

  D ... droplet, EP1 ... lower elastic plate, EP2 ... upper elastic plate, Ik ... conductive ink, Ia ... conductive fine particle, PL ... liquid pattern, PD ... dry pattern, 11 ... ceramic multilayer substrate, 21 ... droplet Discharge device, 23 ... green sheet, 26 ... droplet discharge head, 32 ... laminated body, 35 ... vacuum packaging bag.

Claims (5)

A drawing step of drawing a liquid pattern on the green sheet by discharging a liquid containing conductive fine particles into a droplet by a discharge unit and discharging the liquid onto the green sheet;
A drying step of drying the liquid pattern to form a dry pattern on the green sheet;
A stacking step of stacking a plurality of the green sheets on which the dry pattern is formed to form a stack;
A vacuum packaging step of accommodating the laminated body in a vacuum packaging bag, decompressing the inside of the vacuum packaging bag and decompressing the laminated body, and
A pressure-bonding step of forming a pressure-bonded body by applying hydrostatic pressure to the laminate packaged under reduced pressure in the vacuum-packaging bag; and
A method for producing a ceramic multilayer substrate having a firing step of firing the pressure-bonded body,
In the decompression packaging step, an elastic plate having an elastic modulus lower than that of the green sheet is disposed on both side surfaces of the laminate, and the laminate is subjected to decompression packaging with both elastic plates interposed therebetween. A method for manufacturing a substrate. In the manufacturing method of the ceramic multilayer substrate of Claim 1,
A method for producing a ceramic multilayer substrate, wherein, in the crimping step, hydrostatic pressure is applied to the laminated body that is packaged under reduced pressure with the elastic plate in between, to form the crimped body. In the manufacturing method of the ceramic multilayer substrate according to claim 1 or 2,
The method for manufacturing a ceramic multilayer substrate, wherein the elastic plate is a synthetic rubber. In the manufacturing method of the ceramic multilayer substrate of any one of Claims 1-3,
A method for producing a ceramic multilayer substrate, wherein when the pressure is reduced in the vacuum packaging bag, the pressure is reduced while heating the green sheet. In the manufacturing method of the ceramic multilayer substrate according to any one of claims 1 to 4,
A method for producing a ceramic multilayer substrate, wherein the hydrostatic pressure is applied while heating the green sheet when the hydrostatic pressure is applied to form the crimped body.

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