JP2009182002A - Substrate connection structure and electronic device - Google Patents

Abstract

An object of the present invention is to provide a board connection structure including a board and a flexible printed circuit board, in which wiring in the flexible printed circuit board is less likely to be disconnected, and an electronic device including the board connection structure. To do.
A board connection structure includes a key board on which a key board side conductive part is formed, a flexible printed circuit board having an FPC side conductive part, a key board side conductive part, and an FPC side conductive part. The flexible printed circuit board 90 includes a curved portion 94 that bends so that the inner surface 90b is on the inner side. A protruding portion 110 that protrudes toward the first surface 50 a side from the second surface 50 b of the key substrate 50 in the thickness direction D of the key substrate 50 is formed at a portion of the curved portion 94 on the connection portion 95 side.
[Selection] Figure 4

Description

  The present invention relates to a board connection structure including a board and a flexible printed board, and an electronic apparatus including the board connection structure.

  Conventionally, a board connection structure for connecting a circuit board and an FPC (Flexible Printed Circuit) is used, and an ACF (Anisotropic Conductive Film) as a connection member is provided between the circuit board and the FPC. Arranged board connection structures are known (see, for example, Patent Document 1).

  In this board connection structure, the conductive portion in the FPC is formed by removing a surface insulating layer and exposing a part of the inner conductive layer. This conductive portion is connected to the circuit board by a connecting portion made of ACF. Here, in order to connect one end of the FPC to another opposing substrate, when a curved portion with the surface opposite to the side where the conductive portion is formed is formed inside, the portion corresponding to the outer edge of the connecting portion is Bending stress is concentrated. For this reason, there is a case where the conductive portion breaks (wiring breaks) at a portion corresponding to the outer edge of the connection portion in the conductive portion (generally, the boundary with the insulating layer).

On the other hand, in order to prevent the conductive part (layer) from cracking in the FPC, a connection structure has been proposed in which a UV curable bond is poured and fixed between the FPC and the substrate.
JP 2003-264353 A

  However, even with a connection structure in which a UV curable bond is poured and fixed between the FPC and the circuit board, the FPC and the circuit board are connected in a state where a force acts in the peeling direction with respect to the bonded portion by the UV curable bond. In such a case, the FPC and the circuit board may be separated from each other, and a fold may occur near the ACF in the FPC. In this case, a crack (disconnection) may occur in the conductive layer (wiring) in the vicinity of the ACF in the FPC.

  Further, there may be a case where a sufficient UV curing bond cannot be poured between the circuit board and the FPC. In this case, the above-described peeling is likely to occur, and a crack (disconnection) may easily occur in the above-described conductive layer (wiring).

  It is an object of the present invention to provide a board connection structure that includes a board and a flexible printed board, in which the wiring in the flexible printed board is less likely to be disconnected, and an electronic device including the board connection structure.

  The present invention provides a first substrate in which an electrode wiring and a first conductive portion connected to the electrode wiring are formed on one surface of an insulating substrate, and a pair of layers arranged so as to sandwich the flexible wiring and the flexible wiring. A flexible printed circuit board having a second conductive part formed by exposing a part of the flexible wiring without the insulating sheet being laminated and the first conductive part and the second conductive sheet. A connecting member that is arranged between a conductive part and that constitutes a connecting part that electrically connects the first conductive part and the second conductive part, and the flexible printed circuit board comprises: A curved portion that bends so that a surface opposite to the side on which the second conductive portion is formed is inward; a portion of the curved portion on the side of the connecting portion has a thickness direction of the first substrate; Oite relates board connection structure protruding portion is formed to protrude on the other surface side of the first substrate than the one surface of the first substrate.

  Moreover, it is preferable that the outer edge side portion of the first substrate in the protruding portion is curved or bent so that the surface of the flexible printed board on which the second conductive portion is formed is inward.

  Moreover, it is preferable that the part located in the vicinity of the outer edge of the said 1st board | substrate in the said protrusion part is curved or bent by using the outer edge of the said 1st board | substrate as a fulcrum.

  Moreover, it is preferable that the part corresponding to the outer edge of the said 1st board | substrate in the said flexible printed circuit board is the state pressed against the said outer edge in the said 1st board | substrate.

  Further, the first substrate is disposed on one side of the first substrate so as to support the first substrate, and is disposed on the inner side of the curved portion, and more than the one surface in the thickness direction of the first substrate. And a support having a contact portion that protrudes toward the other surface, and the protrusion has a surface opposite to the side on which the second conductive portion is formed in the flexible printed circuit board. It is preferable that the contact portion is supported and formed so as to be pushed out to the other surface side.

  Moreover, it is preferable that the said contact part has a curved surface part which swells to the said flexible printed circuit board side.

  In addition, a part of the flexible printed circuit board is placed on a portion of the support body that faces the outer edge of the first substrate through the flexible printed circuit board, and the flexible printed circuit board is attached to the first printed circuit board. It is preferable that a pinching portion for pinching with the outer edge is formed.

  Moreover, it is preferable that the recessed part which can accommodate the part corresponding to the said connection member in the said flexible printed circuit board is formed in the part which opposes the said connection member via the said flexible printed circuit board in the said support body.

  A second substrate disposed substantially parallel to the first substrate and spaced apart from the first substrate, and the flexible printed circuit board is electrically connected to the second substrate, Preferably, the first substrate and the second substrate are electrically connected.

  The present invention relates to an electronic device including the above-described substrate connection structure.

  ADVANTAGE OF THE INVENTION According to this invention, it is a board | substrate connection structure containing a board | substrate and a flexible printed circuit board, Comprising: A board | substrate connection structure which is hard to produce a disconnection in the wiring in a flexible printed circuit board, and an electronic device provided with this board | substrate connection structure can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
With reference to FIG. 1, a basic structure of a mobile phone 1 as an electronic device will be described. FIG. 1 is an external perspective view in a state where the mobile phone 1 is opened.

  As shown in FIG. 1, the mobile phone 1 includes an operation unit side body 2 and a display unit side body 3 as a housing. The operation unit side body 2 and the display unit side body 3 are connected so as to be openable and closable via a connecting part 4 having a hinge mechanism. Specifically, the upper end portion of the operation unit side body 2 and the lower end portion of the display unit side body 3 are connected via a connecting portion 4. Thereby, the mobile phone 1 is configured to be able to relatively move the operation unit side body 2 and the display unit side body 3 connected via the hinge mechanism. That is, in the mobile phone 1, the operation unit side body 2 and the display unit side body 3 are opened (open state), and the operation unit side body 2 and the display unit side body 3 are folded. (Closed state). Here, the closed state is a state in which both housings are arranged so as to overlap each other, and the open state is a state in which both housings are arranged so as not to overlap each other.

  The outer surface of the operation unit side body 2 includes a front case 2a and a rear case 2b. The operation unit side body 2 exposes the operation key group 11 and the voice input unit 12 as a microphone to which the voice uttered by the user of the mobile phone 1 is input on the front case 2a side. Composed.

  The operation key group 11 includes a function setting operation key 13 for operating various functions such as various settings, a telephone book function, and a mail function, and an input operation key 14 for inputting a telephone number and characters such as mail. And a determination operation key 15 as an operation member for performing determination in various operations, scrolling in the vertical and horizontal directions, and the like. Each key constituting the operation key group 11 has a predetermined function according to the open / close state of the operation unit side body 2 and the display unit side body 3, various modes, or the type of the activated application. Assigned (key assignment). Then, when the user presses each key, an operation corresponding to the function assigned to each key is executed.

  The voice input unit 12 is disposed on the outer end side opposite to the connection unit 4 side in the longitudinal direction of the operation unit side body 2. That is, the voice input unit 12 is arranged on one outer end side when the mobile phone 1 is in the open state.

  An interface (not shown) for communicating with an external device (for example, a host device) is disposed on one side surface of the operation unit side body 2. A side key to which a predetermined function is assigned and an interface (not shown) through which an external memory is inserted and removed are arranged on the other side surface of the operation unit side body 2. The interface is covered with a cap. Each interface is covered with a cap when not in use.

  The outer surface of the display unit side body 3 includes a front panel 3a, a front case 3b, a rear case 3c, and a rear panel 3d. The front case 3b in the display unit side body 3 is disposed so as to expose a display unit 21 for displaying various types of information and a voice output unit 22 as a receiver for outputting the voice of the other party of the call. The Here, the display unit 21 includes a liquid crystal panel, a drive circuit that drives the liquid crystal panel, and a light source unit such as a backlight that emits light from the back side of the liquid crystal panel.

  Next, the internal structure of the operation unit side body 2 and the display unit side body 3 will be described with reference to FIGS. FIG. 2 is an exploded perspective view of members built in the operation unit side body 2. FIG. 3 is an exploded perspective view of members built in the display unit side body 3. 4 is a cross-sectional view taken along the line DD in FIG. FIG. 5 is an enlarged view of region E in FIG. FIG. 6 is a partially enlarged view for explaining the shape and position of the contact portion 111 and the like formed on the case body 60.

  As shown in FIG. 2, the operation unit side body 2 includes a front case 2a, a key structure unit 40, a key substrate 50 as a first substrate, a case body 60 as a support, and a reference potential pattern layer 75. And a circuit board 70 as a second board having various electronic components such as an RF (Radio Frequency) module for a mobile phone, a rear case 2b having a battery lid 2c, and a battery 80. The key board 50 and the circuit board 70 are electrically connected by a flexible printed board 90. In other words, the mobile phone 1 is configured to have a board connection structure that electrically connects the key board 50 and the flexible printed board 90.

  The front case 2a and the rear case 2b are disposed such that the concave inner surfaces face each other, and are joined so that the outer peripheral edges thereof overlap each other. In addition, the key structure 40, the key board 50, the case body 60, the circuit board 70, and the flexible printed board 90 are built in between the front case 2a and the rear case 2b. .

  In the front case 2a, key holes 13a, 14a, and 15a are formed on the inner surface of the front case 2a facing the display unit 21 of the display unit side body 3 in a state in which the cellular phone 1 is folded. From each of the key holes 13a, 14a, 15a, the pressing surface of the function setting operation key member 13b constituting the function setting operation key 13, the pressing surface of the input operation key member 14b constituting the input operation key 14, and the determination operation key 15 The pressing surface of the determination operation key member 15b that constitutes is exposed. By pressing the exposed function setting operation key member 13b, the input operation key member 14b, and the determination operation key member 15b so as to depress, the metal dome described later is provided in each corresponding key switch 51, 52, 53. The apex of (saddle-like shape) is pressed and comes into electrical contact with the switch terminal.

  The key structure unit 40 includes an operation member 40A, a key frame 40B as a reinforcing member, and a key sheet 40C as a sheet member.

  The operation member 40A is composed of a plurality of key operation members. Specifically, it is configured by a function setting operation key member 13b, an input operation key member 14b, and a determination operation key member 15b. Each operation key member constituting the operation member 40A is bonded to the key sheet 40C with a key frame 40B described later interposed therebetween. As described above, the pressing surface of each operation key member bonded to the key sheet 40C is disposed so as to be exposed to the outside from each of the key holes 13a, 14a, 15a.

  The key frame 40B is a metallic plate-like member having a plurality of holes 14c. The key frame 40B is a reinforcing member for preventing adverse effects on the circuit board 70 and the like due to the pressing of the input operation key member 14b. The key frame 40B is a conductive member, and also functions as a member for releasing static electricity from the input operation key member 14b. The plurality of holes 14c formed in the key frame 40B are arranged so that convex portions 14d formed in the key sheet 40C described later are fitted. The input operation key member 14b is bonded to the convex portion 14d.

  The key sheet 40C is a flexible sheet-like member made of silicon rubber. As described above, a plurality of convex portions 14d are formed on the key sheet 40C. The plurality of convex portions 14d are formed on the surface of the key sheet 40C on the side where the key frame 40B is disposed. Each of the plurality of convex portions 14d is formed at a position corresponding to a key switch 52 described later.

  The key substrate 50 includes a plurality of key switches 51, 52, and 53 disposed on a first surface 50a that is a surface on the key sheet 40C side. The plurality of key switches 51, 52, 53 are arranged at positions corresponding to the respective operation members 40A. The key switches 51, 52 and 53 arranged on the key substrate 50 have a structure having a metal dome of a metal plate which is curved in a bowl shape and is three-dimensionally formed. The metal dome is configured to be electrically connected to a switch terminal formed on an electric circuit (not shown) printed on the surface of the key substrate 50 when the apex of the bowl-shaped shape is pressed. Is done. A plurality of electrode wirings are formed on the second surface 50 b side of the key substrate 50.

  One end 90 </ b> A of the flexible printed circuit board 90 is connected to the second surface 50 b which is the surface opposite to the first surface 50 a of the key substrate 50. Specifically, as shown in FIG. 4, the flexible printed circuit board 90 is connected to the key board 50 by the anisotropic conductive film 100 on the outer surface 90 a side at one end 90 </ b> A. The flexible printed circuit board 90 is attached to a connector 77 whose other end 90 </ b> B is mounted on the second surface 70 b of the circuit board 70. As a result, the flexible printed circuit board 90 is configured to have a bending portion 94 that is bent around the bending axis with the inner surface 90b opposite to the outer surface 90a on the inside between the one end 90A and the other end 90B. The As shown in FIG. 5, the flexible printed circuit board 90 includes a gold plating layer 193 and a copper pattern layer 195 constituting a conductive layer, and coverlays 191 and 197 as insulating layers arranged on both surfaces of the conductive layer. Configured. Here, the gold plating layer 193 and the copper pattern layer 195 include the flexible wiring 190. In other words, the flexible wiring 190 for electrically connecting the key board 50 and the circuit board 70 is formed by the gold plating layer 193 and the copper pattern layer 195 formed in a predetermined shape.

  On the second surface 50b of the key substrate 50, a key substrate side conductive portion 57 as a first conductive portion is formed. The key board side conductive portion 57 is electrically connected to an electrode wiring formed on one surface of the insulating substrate constituting the key board 50. On the outer surface 90a of one end 90A of the flexible printed circuit board 90, an FPC side conductive portion 91 is formed as a second conductive portion that is disposed so as to face the key substrate side conductive portion 57. The FPC-side conductive portion 91 is formed by removing the first coverlay 191 as an insulating layer. The FPC side conductive portion 91 is formed by exposing a part of the gold plating layer 193. Further, in the FPC side conductive portion 91, a gold plating layer 193 is disposed outside one side of the copper pattern layer 195, and a second cover 197 is disposed outside the other side. For this reason, when it deform | transforms so that it may curve with the 2nd coverlay 197 side (inner surface 90b side) inside, it becomes easy to produce a crack in the copper pattern layer 195.

  The connection part 95 is configured by an anisotropic conductive film 100 disposed between the FPC side conductive part 91 formed on the flexible printed circuit board 90 and the key board side conductive part 57 formed on the key board 50. . The connecting portion 95 is formed by subjecting the anisotropic conductive film 100 disposed between the FPC side conductive portion 91 and the key board side conductive portion 57 to a thermocompression treatment.

  The anisotropic conductive film 100 is formed corresponding to the shape of the connecting portion 95. The anisotropic conductive film 100 has one surface fixed to the FPC side conductive portion 91 and the other surface fixed to the key substrate side conductive portion 57. In other words, the anisotropic conductive film 100 physically and electrically connects the FPC side conductive part 91 and the key board side conductive part 57.

  As shown in FIG. 4, the flexible printed circuit board 90 is attached to a connector 77 mounted on a circuit board 70 whose other end 90 </ b> B is arranged in parallel with the key body 50 across the case body 60. . As described above, the flexible printed circuit board 90 is configured to have the curved portion 94 that is curved around the curved axis with the inner surface 90b on the inside between the one end 90A and the other end 90B. The bending portion 94 is disposed so as to surround the outer edges of the outer edge of the case body 60 and the outer edge of the circuit board 70.

  As shown in FIGS. 4 and 5, the bending portion 94 has a protruding portion 110 formed on the connecting portion 95 side of the bending portion 94. The protruding portion 110 is formed by pushing a part of the inner surface 90b of the flexible printed board 90 to the D1 side in the thickness direction D by a contact portion 111 described later.

  The protruding portion 110 is formed to protrude from the second surface 50b of the key substrate 50 toward the D1 side in the thickness direction D (perpendicular direction of the second surface 50b). The protruding portion 110 is formed to protrude to the first surface 50 a side from the second surface 50 b of the key substrate 50.

  The connecting portion 95 side (outer edge 55 side) of the protruding portion 110 is curved so that the outer surface 90a is on the inner side. Specifically, the connecting portion 95 side (outer edge 55 side) of the protruding portion 110 is bent with the outer edge 55 of the key substrate 50 as a fulcrum, and the entire connecting portion 95 side (outer edge 55 side) of the protruding portion 110 is bent. Curved so that the outer surface 90a is on the inside.

  A part of the flexible printed circuit board 90 is pushed up to the D1 side in the thickness direction D by a contact part 111 to be described later to form the protruding part 110, thereby corresponding to the outer edge 55 of the key board 50 in the flexible printed circuit board 90. The portion is pressed against the outer edge 55.

  Here, the key substrate 50 to which the flexible printed circuit board 90 is connected is placed on the flat plate portion 61 in the case body 60 in which a later-described recess 113 and a contact portion 111 are formed. The pressure and deflection caused by pressing each of the operation members 40 </ b> A are not easily transmitted to the circuit board 70 disposed below the case body 60.

  The case body 60 is a conductive member having a shape in which one wide surface of a thin rectangular parallelepiped is opened. The case body 60 includes ribs 62 that are formed substantially perpendicular to the opening-side surface of the flat plate portion 61. The rib 62 is formed to be equal to or sufficiently higher than the height of the tallest electronic component among the various electronic components mounted on the circuit board 70. The rib 62 is formed so as to correspond to the reference potential pattern layer 75 constituting the reference potential portion on the periphery and inside of the flat plate portion 61. Specifically, the rib 62 is formed so as to be disposed on the reference potential pattern layer 75 in a state where the case body 60 is placed on the circuit board 70. Note that the case body 60 may be formed of a metal, a skeleton formed of a resin, and a conductor film formed on the surface thereof.

  The case body 60 is electrically connected to the reference potential pattern layer 75 by contacting the bottom surface of the rib with the reference potential pattern layer 75. The case body 60 is electrically connected to the reference potential pattern layer 75 and has the same potential as the reference potential pattern layer 75. That is, the case body 60 functions as a shield case. The case body 60 serves as a shield case to suppress external noise such as high frequency from acting on various electronic components disposed on the circuit board 70, and to emit from an RF (Radio Frequency) circuit, a CPU circuit, a power supply circuit, and the like. This prevents the generated noise from acting on other electronic components and a receiving circuit connected to the antenna. Specifically, the bottom surface of the rib 62 in the case body 60 is disposed on the reference potential pattern layer 75, so that each circuit described later is surrounded by the rib 62 and covered with a part of the flat plate portion 61. The rib 62 functions as a partition wall in each circuit, and shields each circuit together with a part of the flat plate portion 61.

  As shown in FIGS. 4 to 6, the flat plate portion 61 is formed with a recess 113 that is recessed toward the D2 side in the thickness direction D. Specifically, a recess 113 is formed in a portion of the flat plate portion 61 that faces the anisotropic conductive film 100 as a connecting member via the flexible printed board 90. The recess 113 is disposed so as to accommodate a portion corresponding to the portion where the anisotropic conductive film 100 (connecting portion 95) is disposed in the flexible printed circuit board 90. The recess 113 is disposed so that a portion corresponding to the FPC-side conductive portion 91 exposed by removing the first coverlay 191 as an insulating sheet in the flexible printed circuit board 90 is accommodated.

  On the outer edge side of the case body 60 in the recess 113, a holding part 114 and a contact part 111 are formed. The sandwiching portion 114 is a planar portion formed so as to be higher on the D1 side in the thickness direction D than the bottom surface of the recess 113. The sandwiching portion 114 is a portion facing the outer edge 55 of the circuit board 70 through the flexible printed board 90.

  The sandwiching portion 114 has a portion on which the inner surface 90b of the flexible printed circuit board 90 is placed and the first cover lay 191 and the second cover lay 197 as insulating sheets in the flexible printed circuit board 90 are disposed on the circuit board 70. It is formed so as to be sandwiched with the outer edge 55 in FIG. The sandwiching portion 114 supports a part of the flexible printed circuit board 90 and restricts the movement of the flexible printed circuit board 90 so as not to move to the D2 side in the thickness direction D.

  The contact portion 111 is formed along the outer edge of the flat plate portion 61 and is formed so as to protrude to the D1 side (the first surface 50a side of the key substrate 50) in the thickness direction D. In the thickness direction D, the contact portion 111 is formed so as to protrude from the second surface 50b of the key substrate 50 toward the first surface 50a. The contact portion 111 is formed in a wall shape on the outer edge side of the flat plate portion 61 with respect to the sandwiching portion 114.

  The contact portion 111 is formed inside the curved portion 94. The contact portion 111 has a curved surface portion 111a that swells toward the flexible printed circuit board 90, which is disposed in contact with the D1 side in the thickness direction D of the corresponding contact portion 111. The flexible printed circuit board 90 is deformed along the curved surface shape of the curved surface portion 111a.

  The abutting portion 111 abuts on the inner surface 90 b of the flexible printed circuit board 90 and supports the flexible printed circuit board 90. Specifically, the abutting portion 111 abuts so as to push up a part of the inner surface 90b of the flexible printed circuit board 90 to the D1 side (first surface 50a side) in the thickness direction D, and in the pushed state, the flexible print The substrate 90 is supported. Thereby, the protrusion part 110 is formed. The contact portion 111 bends a part of the flexible printed circuit board 90 so that the outer surface 90a is on the inner side. The abutting portion 111 is in a state where a predetermined portion of the outer surface 90 a of the flexible printed circuit board 90 is pressed against the outer edge 55 of the key substrate 50. Here, it can be said that the contact portion 111 constitutes a part of the side wall of the recess 113.

  On the circuit board 70, various electronic components and circuits (not shown) including a signal processing unit that processes signals transmitted and received by the antenna 108 are arranged. Various electronic components form a plurality of circuit blocks by a predetermined combination. For example, various circuit blocks including an RF (Radio Frequency) circuit, a power supply circuit, and the like are formed.

  In addition to the various electronic components described above, a reference potential pattern layer 75 constituting a reference potential portion is formed on the first surface 70a of the circuit board 70 on the case body 60 side. The reference potential pattern layer 75 is formed so as to partition each circuit block described above. The reference potential pattern layer 75 is formed by printing a conductive member in a predetermined pattern on the surface of the first surface 70a of the circuit board 70. Further, as described above, the connector 77 is mounted on the second surface 70 b of the circuit board 70. The other end 90B of the flexible printed circuit board 90 is attached to the mounted connector 77.

  A detachable battery lid 2c is provided on one end side (in FIG. 2) of the rear case 2b. After the battery 80 is stored from the outside of the rear case 2b, the battery case 2b is attached to the rear case 2b. In addition, an audio input unit 12 (not shown) for inputting the user's voice is accommodated at one end of the rear case 2b.

  As shown in FIG. 3, the display unit side body 3 includes a front panel 3a, an audio output unit 22, a front case 3b, an audio output unit 22, a display unit 21, and a print to which the display unit 21 is connected. A substrate 85, a rear case 3c, and a rear panel 3d are provided.

  The display unit side body 3 includes a front panel 3a, a front case 3b, a display unit 21, a printed circuit board 85, a rear case 3c, and a rear panel 3d that are stacked. Specifically, the front case 3b and the rear case 3c are arranged so that the inner surfaces of the concave shapes face each other, and are joined so that the outer peripheral edges thereof overlap each other.

  A printed circuit board 85 to which the display unit 21 is connected is sandwiched between the front case 3b and the rear case 3c. A speaker connected to an amplifier (not shown) is connected to the printed board 85.

Subsequently, the operation of the substrate connection structure of the present embodiment will be described.
As shown in FIG. 4, the flexible printed circuit board 90 is curved so that the inner surface 90b is on the inner side in order to electrically connect the key board 50 and the circuit board 70, which are spaced apart from each other and arranged substantially in parallel. A curved portion 94 is provided. Thereby, a force is applied to the region on the connection part 95 side in the flexible printed circuit board 90 in the direction in which the connection in the connection part 95 is peeled off (the direction in which the flexible wiring 190 is bent).

  Here, in the present embodiment, a part of the flexible printed circuit board 90 has a thickness due to the contact portion 111 formed on the outer edge of the case body 60 (the flat plate portion 61) so as to protrude to the D1 side in the thickness direction D. Since the protruding portion 110 is formed by being pushed up to the D1 side in the direction D (the first surface 50a side in the key substrate 50), peeling at the connecting portion 95 and disconnection of the flexible wiring 190 are unlikely to occur.

  Specifically, a part of the flexible printed circuit board 90 is pushed up to the first surface 50 a side from the second surface 50 b of the key circuit board 50, so that the flexible printed circuit board 90 is placed on the outer edge 55 of the key circuit board 50 in the flexible printed circuit board 90. Is pressed. That is, the same effect as the flexible printed circuit board 90 is urged | biased so that the direction in which the connection in the connection part 95 is peeled off may be directed. Thereby, peeling at the connecting portion 95 and disconnection of the flexible wiring 190 are unlikely to occur.

  In addition, since the part on the connection part 95 side in the flexible printed circuit board 90 is always located on the D1 side in the thickness direction D than the connection part 95, the part on the connection part 95 side in the flexible printed circuit board 90 is also provided. Is moved in the peeling direction (D2 side in the thickness direction D). Thereby, peeling at the connecting portion 95 and disconnection of the flexible wiring 190 are unlikely to occur.

  Further, in the present embodiment, since the sandwiching portion 114 is formed in the case body 60 (the flat plate portion 61), the portion on the connection portion 95 side in the flexible printed circuit board 90 may be moved to the D2 side in the thickness direction D. Be regulated. That is, the movement of the flexible printed circuit board 90 due to the force applied in the direction in which the connection at the connection portion 95 is peeled off can be suppressed at a portion closer to the connection portion 95. Thereby, peeling at the connecting portion 95 and disconnection of the flexible wiring 190 are unlikely to occur.

According to the present embodiment, it is possible to provide a board connection structure that includes the key board 50 and the flexible printed board 90 and that is less likely to cause breakage in the flexible wiring 190 in the flexible printed board 90.
Further, according to the present embodiment, it is possible to provide a board connection structure that includes the key board 50 and the flexible printed board 90 and that is prevented from being peeled off at the connection portion 95.

  Further, according to the present embodiment, it is possible to provide a connection structure that can suppress disconnection of the flexible wiring 190 in the flexible printed circuit board 90 without introducing special equipment. Thereby, the merit in cost can be acquired.

  Further, according to the present embodiment, disconnection of the flexible wiring 190 on the flexible printed circuit board 90 can be suppressed without fixing the flexible printed circuit board 90 and the key substrate 50 with an adhesive or the like.

  Moreover, according to this embodiment, compared with the case where the movement to the peeling direction of the flexible printed circuit board 90 is suppressed with an adhesive agent etc., the influence on the effect by the quality of an adhesive agent is scarce. As a result, it is possible to provide a mobile phone that has the effect of suppressing breakage of the flexible wiring 190 in the flexible printed circuit board 90 in a stable manner.

  Moreover, according to this embodiment, the mobile telephone 1 as an electronic device containing the above board | substrate connection structures can be provided.

  As mentioned above, although preferred embodiment was described, this invention can be implemented with a various form, without being limited to embodiment mentioned above. For example, in the present embodiment, the mobile phone 1 is described as an electronic device. However, the present invention is not limited to this, and is not limited to this. A PHS (registered trademark), a personal digital assistant (PDA), a portable navigation device, and a laptop computer. Etc.

  Further, in the present embodiment, the mobile phone 1 that can be folded by the connecting portion 4 is described. However, it is not such a foldable type, and the operation unit side body 2 and the display unit side body 3 are overlapped. One of the cases is slid in one direction from the closed state, and one case is rotated around an axis along the overlapping direction of the operation unit side case 2 and the display unit side case 3 A rotation (turn) type, or a type (straight type) in which the operation unit side body 2 and the display unit side body 3 are arranged in one housing and do not have a connecting portion may be used. The mobile phone 1 may be a so-called biaxial hinge type that can be opened and closed and rotated.

  In the present embodiment, the key substrate 50 is described as the first substrate. However, the present invention is not limited to this, and another substrate may be used. In the present embodiment, the board connection structure is accommodated in the operation unit side body 2 of the mobile phone 1, but is not limited thereto, and may be accommodated in the display unit side body 3.

  Moreover, in this embodiment, although the case body 60 is demonstrated as a support body, it is not limited to this, For example, a plate-shaped reinforcement member may be sufficient.

  Moreover, in this embodiment, although the contact part 111 is formed in a wall shape, it is not limited to this, For example, you may have a some protrusion-shaped part.

FIG. 3 is an external perspective view in a state where the mobile phone 1 is opened. FIG. 6 is an exploded perspective view of members built in the operation unit side body 2. FIG. 5 is an exploded perspective view of members built in the display unit side body 3. It is DD sectional drawing in FIG. It is an enlarged view of the area | region E in FIG. 4 is a partially enlarged view for explaining the shape and position of an abutting portion 111 and the like formed on the case body 60. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mobile phone 2 Operation part side housing | casing 3 Display part side housing | casing 50 Key board | substrate (1st board | substrate)
50b 2nd surface (one surface)
57 Key board side conductive part (first conductive part)
60 Case body (support)
70 Circuit board (second board)
90 flexible printed circuit board 90a outer surface 90b inner surface 91 FPC side conductive part (second conductive part)
94 Bending part 95 Connecting part 100 Anisotropic conductive film (connecting member)
DESCRIPTION OF SYMBOLS 110 Protrusion part 111 Contact part 113 Concave part 114 Clamping part 190 Flexible wiring 191 1st coverlay 193 Gold plating layer 195 Copper pattern layer 197 2nd coverlay

Claims (10)

A first substrate in which an electrode wiring and a first conductive portion connected to the electrode wiring are formed on one surface of the insulating substrate;
A second conductive portion having a flexible wiring and a pair of insulating sheets arranged so as to sandwich the flexible wiring, wherein the insulating sheets are not arranged in a stacked manner and a part of the flexible wiring is exposed. A flexible printed circuit board having
A board connecting structure comprising: a connecting member that is disposed between the first conductive portion and the second conductive portion and that constitutes a connecting portion that electrically connects the first conductive portion and the second conductive portion. There,
The flexible printed circuit board has a curved portion that curves so that a surface opposite to the side on which the second conductive portion is formed is inside,
A protruding portion that protrudes toward the other surface of the first substrate from the one surface of the first substrate in the thickness direction of the first substrate is formed in the connecting portion side portion of the curved portion. Board connection structure.   2. The board connection according to claim 1, wherein a portion on the outer edge side of the first substrate in the protruding portion is bent or bent so that a surface of the flexible printed board on which the second conductive portion is formed is inward. Construction.   3. The substrate connection structure according to claim 2, wherein a portion of the protruding portion located in the vicinity of the outer edge of the first substrate is curved or bent with the outer edge of the first substrate as a fulcrum.   4. The board connection structure according to claim 1, wherein a portion of the flexible printed board corresponding to an outer edge of the first board is pressed against the outer edge of the first board. 5. The first substrate is disposed on one side of the first substrate so as to support the first substrate, and is disposed on the inner side of the curved portion and the other side of the first substrate in the thickness direction of the first substrate. A support body having a contact portion formed to protrude to the surface side of
2. The protruding portion is formed by being supported so that a surface of the flexible printed board opposite to a side where the second conductive portion is formed is pushed out to the other surface side by the contact portion. 5. The board connection structure according to any one of 4 to 4.   The bonded structure according to claim 5, wherein the contact portion is formed to have a curved surface portion that swells toward the flexible printed circuit board.   A portion of the flexible printed circuit board is placed on a portion of the support that faces the outer edge of the first substrate through the flexible printed circuit board, and the flexible printed circuit board is placed on the first printed circuit board. The board connection structure according to claim 5 or 6, wherein a clamping part that clamps with an outer edge is formed.   The recessed part which can accommodate the part corresponding to the said connection member in the said flexible printed circuit board is formed in the part which opposes the said connection member via the said flexible printed circuit board in the said support body. The board connection structure described in 1. A second substrate disposed substantially parallel to the first substrate and spaced apart from the first substrate,
The board connection structure according to claim 1, wherein the flexible printed circuit board is electrically connected to the second board and electrically connects the first board and the second board.   An electronic device provided with the board | substrate connection structure in any one of Claim 1 to 9.

Images