JP2009180578A - Inspection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection system for achieving inspection hour shortening by efficiently performing a review inspection irrespective of the moving speed or auto-focus speed of a microscope. <P>SOLUTION: The inspection system includes a defect inspection device and a review inspection device. The defect inspection device is for recognizing a defect formed on a substrate to acquire defect information including defect position coordinates being the position coordinates of the defect and a defect size being the size of the defect. Further, the review inspection device includes a coordinate calculation part for inspecting the substrate by means of the microscope while relatively moving an imaging range based on the position coordinates acquired by the defect inspection device and calculating the coordinates so that the number of the relative movements decreases based on the defect information and imaging range information for determining the imaging range. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a review inspection for observing a fine pattern defect manufactured on a semiconductor wafer or glass substrate by magnifying it with a microscope, and a defect review and correction apparatus having a correction function capable of correcting the defect with a laser. .

  Conventionally, a semiconductor IC chip and a liquid crystal panel are manufactured through a plurality of manufacturing processes and become products. In general, an inspection process is provided between these processes in order to manage defects on a fine pattern caused by the manufacturing apparatus and the manufacturing process.

  This inspection process consists of visual inspection equipment that inspects wiring pattern disturbances and foreign matter contamination, line width measurement inspection equipment that measures the distance and width between wiring patterns, and review inspection that performs detailed inspection of defects detected by the visual inspection equipment. It is executed by an inspection system composed of an apparatus or the like. Finding defects early in these inspection processes and feeding them back to the manufacturing process that caused them leads to an improvement in production line yield. In addition, a correction step for correcting a defective portion may be provided as means for improving the yield. In the case of an inspection system without this correction process, a semiconductor IC chip or a liquid crystal substrate panel including a detected defect is determined as a defective product and does not become a product.

However, by using the correction device, it is possible to correct a defective part or a defective part, and a substrate determined to be defective in the inspection process can be advanced to a subsequent process again as a non-defective product.
As a review inspection apparatus without a correction process, it is disclosed by patent document 1, for example. This corrects the error between the defect coordinates output from the inspection device and the observation coordinates of the review inspection device, accurately searches for defects that identify the defect location, and further increases the magnification of the SEM etc. based on the tendency of the detected value of the defect size This system improves review efficiency by selecting defects that require visual observation.

Moreover, as a correction inspection apparatus which has an inspection process, there exists a defect correction method and defect correction apparatus which were disclosed by patent document 2, for example. This correction device analyzes and collects defects detected by the inspection device as constituent components such as defect position coordinates, shape, size, etc., and stores the defect-related data, circuit design layout data, and a correction method for each defect. This is a device that uses a method knowledge database to automatically classify defects that cause electrical inconsistencies and remove or repair those defects.
JP 2006-145269 A JP 2006-303227 A

  The review inspection apparatus as described above moves the observation apparatus such as an optical microscope to the coordinates of the defect output from the inspection apparatus, and performs a review inspection. Further, when the inspection apparatus has a classification function, the number of review inspections can be reduced by selecting in advance defects that need to be reviewed using the classification data.

  When a review is performed using the method described above, the movement coordinates of the microscope described above will move around the individual defect coordinates output by the inspection device, resulting in movement of the microscope as many as the number of defects to be reviewed. There was a problem of end.

Further, the above-described method has a problem that the inspection time cannot be shortened unless the moving speed of the microscope and the autofocus speed are improved.
The present invention has been made in view of the above problems, and an inspection system capable of efficiently performing review inspection and reducing inspection time regardless of the movement speed of the microscope and the autofocus speed. The purpose is to provide.

The present invention employs the following configuration in order to solve the above problems.
That is, according to one aspect of the present invention, the inspection system of the present invention is an inspection system including a defect inspection apparatus and a review inspection apparatus. And the said defect inspection apparatus recognizes the defect formed in the board | substrate, and acquires the defect information containing the defect position coordinate which shows the position coordinate of the said defect, and the defect size which shows the size of the said defect. The review inspection apparatus is configured to inspect the substrate with a microscope by relatively moving an imaging range based on the defect position coordinates acquired by the defect inspection apparatus, and configure the defect information and the imaging range. And a coordinate calculation unit that calculates coordinates so that the number of relative movements is reduced based on imaging range information.

  In the inspection system of the present invention, the coordinate calculation unit is different from the review inspection apparatus, for example, a defect inspection apparatus connected to the review inspection apparatus via a network, a production data management server, or a coordinate management server. It is desirable to provide.

In the inspection system of the present invention, it is preferable that the coordinate calculation unit includes a defect extraction unit in the same field for obtaining coordinates at which a plurality of defects enter the same imaging range of the microscope at the same time.
In the inspection system of the present invention, it is preferable that the coordinate calculation unit includes a lattice coordinate setting unit for obtaining a lattice in which a plurality of defects enter based on an imaging range of the microscope.

In the inspection system of the present invention, it is preferable that the review inspection apparatus includes a defect coordinate storage unit that stores position coordinates of defects output from the defect inspection apparatus.
The inspection system according to the present invention is preferably a review inspection apparatus with a correction function, in which the review inspection apparatus includes a spatial modulation element and irradiates a plurality of laser beams in an arbitrary shape at a time for repair.

  In the inspection system of the present invention, it is preferable that the review inspection apparatus includes a laser irradiation unnecessary portion determination unit that extracts a defective portion that needs repair by a laser and excludes a portion that does not require repair.

  According to the present invention, a plurality of defect coordinates on a substrate generated by a semiconductor manufacturing process can be integrated into one coordinate that falls within the same imaging range of a microscope of a review inspection apparatus. The number of times of moving the imaging range can be reduced, and the inspection time can be shortened.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, even if the embodiments are different, the same or corresponding members are denoted by the same reference numerals, and common description is omitted.
(First embodiment)
FIG. 1 is a diagram showing a configuration of an inspection system to which the present invention is applied.

  In FIG. 1, the inspection system is a part of a liquid crystal substrate production system that produces a liquid crystal substrate, and includes a defect inspection device 101 and a review inspection device 103 connected to a network 104. In addition, a production data management server 102 and a coordinate management server 105 are connected to the network 104.

  The defect inspection apparatus 101 recognizes a defect formed on the substrate, and acquires defect information including a defect position coordinate indicating the position coordinate of the defect and a defect size indicating the size of the defect. The review inspection apparatus 103 is equipped with a microscope, and based on the defect position coordinates acquired by the defect inspection apparatus 101, the imaging range is relatively moved to observe and inspect the substrate with a microscope.

  The production data management server 102 has a database function for comprehensively managing production line information of a factory that produces liquid crystal substrates, and the coordinate management server 105 has a database function for creating and managing review data.

  In general, a liquid crystal display device such as a liquid crystal TV is manufactured by repeating manufacturing processes such as a process of forming a thin film layer on a glass substrate and patterning. In the inspection process, this patterning is evaluated. A general inspection process is performed as follows.

  First, the glass substrate with a pattern manufactured by the photo process is carried into the defect inspection apparatus 101 by the transport system of the production factory. Next, the defect inspection apparatus 101 performs inspection in accordance with the set inspection conditions (inspection recipe), and detects coating unevenness, foreign matter contamination, and pattern disturbance as defects. Then, the defect inspection apparatus 101 registers the inspection result in the coordinate management server 105 via the network 104 using, for example, FTP (File Transfer Protocol).

  The coordinate management server 105 converts the registered inspection result into a format that can be registered in the production data management server 102, and then registers the file as a file in the production data management server 102 via the network 104 using FTP.

  Next, the substrate on which the pattern defect has been inspected as described above is transported to the review inspection apparatus 103 by the transport system. Then, the review inspection apparatus 103 creates a request file using, for example, a board ID for identifying the substrate of the transported board as a search condition, and requests review information from the coordinate management server 105 by FTP.

  The coordinate management server 105 acquires a review file from the production data management server 102 by FTP. Then, the coordinate management server 105 creates an optimal review file in accordance with the internally set conversion information, and transmits the review information to the review inspection apparatus 103.

  The review inspection apparatus 103 takes a defect image by moving the microscope head of the microscope according to the acquired optimum review file. Then, the result of classifying the types of defects by the image processing function is created as a review result file creation and registered in the coordinate management server 105.

  The coordinate management server 105 converts the format into a format that can be registered in the production data management server 102 and then registers it in the production data management server 102 via the network 104 using FTP.

Then, the substrate is unloaded from the review inspection apparatus, and the inspection is completed.
The present invention is realized in the inspection system as described above. Here, an outline of the first embodiment will be described.

  First, the review inspection apparatus 103 receives the position coordinates of the defect extracted by the defect inspection apparatus 101. Next, a portion of the defect image received from the defect inspection apparatus 101 that does not require laser irradiation is determined by image processing, and the portion is excluded from the defects to be laser irradiated. Here, the unnecessary portion refers to, for example, a defect that does not cause damage even if the patterns described later are not short-circuited and repaired.

  Then, an order for performing inspection by the review inspection apparatus 103 with a laser repair function is calculated from the position coordinates of the defect image. Specifically, sorting is performed in the order of coordinates, and it is determined whether another defect falls within the same imaging range. If so, the center coordinates are obtained, and the order of review inspection is determined.

Finally, the microscope of the review inspection apparatus 103 is moved, and the review inspection and, if necessary, laser repair are performed in the determined order.
FIG. 2 is a diagram illustrating a format example of the review file.

  In FIG. 2, a block 201 indicates a header area, and the following board information is included as information on the board to be reviewed. That is, the board information here represents the comment 201a, the board ID 201b for specifying the board to be reviewed, and the number of chamfers 201c included in this board from the first line.

  A block 202 represents defect information of chamfer number 1. That is, the defect information here represents the comment 202a, the total number of defects 202b included in this surface, the first defect information 202c, the second defect information 202d, and the third defect information 202e from the first line. The first defect information 202c to the third defect information 202e are composed of an index, an X coordinate, a Y coordinate, an X size, and a Y size, respectively. For example, in the first defect information 202c, the index is “01”, the X coordinate is “111”, the Y coordinate is “111”, the X size is “10”, and the Y size is “10”.

A block 203 represents defect information of other chamfer numbers 2 to 4.
Such a review file is a file in which defect coordinates to be reviewed are described in a list, and is created based on result data created by the defect inspection apparatus 101 or another inspection apparatus.

Next, an optimal review file creation method will be described.
FIG. 3 is a flowchart showing the flow of review file creation processing for creating an optimal review file.

  First, in step S301, the defect coordinate data of the review file is sorted to create a coordinate list so that the microscope can move between defect points in the order of the shortest distance. The reason is that if the defect coordinate data in the review file is processed in ascending or descending order as they are, efficient control for moving the microscope at the shortest distance cannot always be performed.

  Next, for the purpose of minimizing the number of times of movement of the microscope, defects that fall within the same imaging range of the microscope magnification to be reviewed are grouped. As a specific procedure, first, in step S302, a review list for managing new coordinate data to be created is initialized. Next, in step S303, the top coordinates of the coordinate list sorted in step S301 are set as reference defect coordinates. In step S304, the next defect coordinate in the list is compared with the reference defect coordinate, and in step S305, it is determined whether these defect coordinates are simultaneously within the same imaging range.

  If it is determined that they are simultaneously within the same imaging range (step S305: Yes), in step S306, the center coordinates of the group of defect coordinates determined to be simultaneously included in the same imaging range are calculated. Then, in order to set this center coordinate as a new reference defect coordinate, the process returns to the reference defect coordinate setting step in step S303.

  On the other hand, if it is determined that they do not fall within the same imaging range at the same time (step S305: No), the reference defect coordinates held at that time (when determined not to fall within the same imaging range at the same time) in step S307 Are added to the review list for managing the new coordinate data, and the next defect coordinates are held as candidates for the reference defect coordinates. In step S308, it is determined whether the data is the last data in the coordinate list. If it is determined that there is a remaining coordinate list (step S308: Yes), the reference defect coordinate candidate held in step S307 is newly set. In order to obtain a correct reference defect coordinate, the process returns to the reference defect coordinate setting step in step S303. On the other hand, when it is determined that the coordinate list is at the end (step S308: No), the review file creation process ends.

Next, processing from the above-described reference defect coordinate setting step (step S303) to the review list adding step (step S307) will be described in detail.
4, 5, 6 and 7 are diagrams for explaining the processing from step S303 to step S307 in FIG. 3 in detail.

FIG. 4 is a diagram showing a defect 401 and a rectangle 402 having a size in which the defect is inserted. In the present embodiment, the rectangle 402 is treated as a defect.
FIG. 5 is a diagram showing a state in which the center coordinate of the defect 503 overlaps the center coordinate 502 of the microscope visual field 501, and this defect 503 is the reference defect coordinate set in the first step S303 in FIG. Become. The defect 504 indicates the next defect.

  FIG. 6 is a diagram illustrating a state where the center coordinates are calculated in step S306 of FIG. Here, the calculated center coordinates 601 are the center coordinates of the defect 503 and the rectangle 602 surrounding the defect 504. And the defect 603 shows the next defect further.

  FIG. 7 is a diagram illustrating a state in which the center coordinates are calculated for the second time in step S306, and center coordinates 701 including the defect 603 in addition to the defect 503 and the defect 504 are calculated. Here, when the defect 702 is further included, that is, the defect group composed of the defect 503, the defect 504, the defect 603, and the defect 702 has a size outside the microscope field of view, the defect 503, the defect 504, and the defect Up to 603 is defined as one group, and this central coordinate 701 is added to the review list. By using the review list created by these processes, it is possible to realize a review inspection with the minimum number of movements and shorten the inspection time.

  In this embodiment, the coordinate management server 105 is provided and the review file creation process is performed separately. However, in the case of a system in which this review file creation process does not cause a problem even if it leads to a delay in the examination time, the review examination apparatus The program may be executed by an internal program 103. Further, this function may be included in the coordinate management server 105 to create a review file converted by the coordinate management server 105. Further, although the defect is regarded as a rectangle, a curve may be included as long as it surrounds the defect to be observed.

Next, a method for calculating review coordinates in a review inspection apparatus having a pattern correction function will be described.
Here, the pattern correction function is to cut a defect straddling between two patterns, for example, by irradiating the defect to be corrected with a laser. For example, in Japanese Patent Application Laid-Open No. 2006-350123, a micromirror array is used. There is a method of cutting into an arbitrary shape pattern by controlling. When cutting into such an arbitrary shape pattern, it is not necessary to use the rectangle in which the entire defect shown in the first embodiment described above is entered as a reference, and only the region to be laser-cut is considered as the target coordinates in consideration of the wiring pattern. Calculate it.

  FIG. 8 is a diagram illustrating a state in which the resist pattern is normally formed, and FIG. 9 is a diagram illustrating a state in which defects are formed on the substrate. FIG. 10 is a diagram illustrating a state in which a defect area is extracted from a defect.

In FIG. 8, three resist patterns of a pattern 801, a pattern 802, and a pattern 803 are normally formed on the substrate.
In FIG. 9, there are three normal resist patterns of a pattern 901, a pattern 902, and a pattern 903 formed on the substrate, and a defect 904, a defect 905, and a defect 906 that straddle them.

  Here, for example, when an image process that compares only an image of a normal resist pattern as shown in FIG. 8 with a reference image and is compared with an image including a defect 901 or the like as shown in FIG. A part of the defect not on the resist pattern can be extracted as a defect region 1001, a defect region 1002, a defect region 1003, a defect region 1004, a defect region 1005, and a defect region 1006 as shown in FIG.

  Next, a flow for identifying a short defect that needs to be corrected among these defect areas 1001 to 1006, that is, a defect that straddles between patterns will be described.

FIG. 11 is a diagram illustrating an example of a circuit design layout data format, and FIG. 12 is a diagram illustrating an example of a resist pattern.
11 indicates the start position coordinates (X, Y) 1201 of the resist pattern 1204a in FIG. 12, and the length 1102 indicates the length 1202 of the resist pattern 1204a in FIG. The width 1103 is the width of the resist pattern 1204a and represents the length 1203 of the resist pattern 1204a in FIG. 12. The number 1104 is a resist having the same size as the resist pattern 1204a defined by the length 1102 and the width 1103 described above. Indicates the number of patterns. The example shown in FIG. 12 indicates that there are three resist patterns: a resist pattern 1204a, a resist pattern 1204b, and a resist pattern 1204c. The repetition interval 1105 indicates the interval between the resist pattern 1204a and the adjacent resist pattern 1204b, and is indicated by the repetition interval 1205 in FIG. The interval between the resist pattern 1204b and the adjacent resist pattern 1204c is also the interval defined by the repetition interval 1105.

FIG. 13 is a flowchart showing the flow of short defect identification processing for identifying short defects.
This short defect identification process is a process executed to identify a defect that is not short-circuited and does not cause any harm even if it is not repaired, and a defect that requires repair.

  First, in step S1301, a repair list (RepairerList) for managing the rectangular coordinates of the correction defect is created and initialized. In step S1302, the number of resist pattern repetitions, for example, a layout data format as illustrated in FIG. 11 is described. Define Number = 3.

  Next, in step S1303, in order to repeat the processing after step S1304 by the number of repetitions, it is determined whether Number is 1 or less. If it is determined that the number is 1 or less (step S1303: Yes), The short defect identification process is terminated.

  On the other hand, if it is determined that Number is not 1 or less (step S1303: No), in step S1304, the coordinates of the area where the short is prohibited, the prohibited area coordinates X1 and X2, are calculated. Here, for example, X1 is obtained by adding half of the width of the pattern 901 to the center coordinates (PointX) of the pattern 901 in FIG. This is the right edge coordinate of the pattern 801. X2 adds a pattern repetition interval (Interval) to the center coordinates (PointX) of the pattern 801, and subtracts half of the width of the pattern 801. This is the left edge coordinate of the pattern 802.

  Next, in step S1305, for example, it is determined whether or not the defects 1001 to 1006 shown in FIG. 10 are between X1 and X2 calculated in step S1304. Specifically, the lower left and upper right coordinates of the rectangle surrounding the defect 1001 and the like are (DefectL, DefectB) and (DefectR, DefectT), respectively, and whether X1 is DefectL or more and X2 is DefectR or less. Determine whether.

If it is determined that the defect 1001 or the like is a defect between X1 and X2 (1305: Yes), rectangular coordinates (RepairerL, RepairerR, RepairerB, RepairerT) are set by the following formula in Step S1306.
RepairerL = X1
RepairerR = X2
RepairerB ＝ DefectB
RepairerT ＝ DefectT
Further, in step S1307, the rectangular coordinates set in step S1306 are added to the RepairerList. In step S1308, the variable Number is incremented by 1 to identify the next defect, the pattern interval is added to PointX, and the process returns to step S1304.

  By this short defect identification processing, for example, two defects 1002 and 1004 in FIG. 10 can be identified as short defects to be repaired. Thereby, the irradiation to the part which does not need repair can be prevented.

FIG. 14 is a diagram illustrating a state in which the short defect is within the same imaging range.
In FIG. 14, the defect 1002 and the defect 1004 are identified by the short defect identification process described with reference to FIG. 13, and are determined to fall within the same imaging range by the process described with reference to FIGS. . As described above, when the correction function capable of cutting the defect 1002 and the defect 1004 in the microscope visual field 1401 into an arbitrary shape pattern by the micromirror array control is used, the defect 1002 and the defect 1004 can be corrected simultaneously. The number of coordinate movements is reduced, and a review inspection for the purpose of correction can be performed efficiently.

  According to the first embodiment, when integrating a plurality of defect coordinates generated in the semiconductor manufacturing process into one coordinate that falls within the same imaging range of the microscope, information on defects that need to be corrected is taken into account. Thus, the coordinate movement of the review inspection coordinates for the purpose of correction can be reduced, and the inspection time can be shortened.

In addition, according to the first embodiment, a calculation process that integrates a plurality of defect coordinates generated in the semiconductor manufacturing process into one coordinate that falls within the same imaging range of the microscope is performed separately from the review inspection. As a result, the load on the calculation process can be removed from the inspection apparatus, and the processing time required for the calculation process can be shortened.
(Second Embodiment)
The second embodiment to which the present invention is applied is a method in which observation area rectangles are evenly arranged on a substrate and the rectangle center coordinates are set as observation coordinates.

The second embodiment is realized in an inspection system having the same configuration as the inspection system that realizes the first embodiment. Here, an outline of the second embodiment will be described.
First, the review inspection apparatus 103 receives the position coordinates of the defect extracted by the defect inspection apparatus 101. Next, the defect image received from the defect inspection apparatus 101 is used to determine a portion that does not require laser irradiation by image processing by using the short defect identification processing of FIG. 13 described in the first embodiment. That portion is excluded from the defects to be irradiated with the laser.

  Then, an order for performing inspection by the review inspection apparatus 103 with a laser repair function is calculated from the position coordinates of the defect image. Specifically, a plurality of lattice coordinates obtained by dividing the coordinates of the defect into a lattice shape based on the field of view of the microscope are prepared and applied to the lattice coordinates. Therefore, it is determined where the other grid coordinates are entered, and the grid coordinates to be entered are determined, and the order of review inspection is determined.

Finally, the microscope of the review inspection apparatus 103 is moved, and the review inspection and, if necessary, laser repair are performed in the determined order.
FIG. 15 is a diagram illustrating an example in which observation region rectangles that enter a microscope field of view are arranged in a lattice pattern on a substrate.

  In FIG. 15, for the coordinates of the substrate 1501, the lower left is the origin (0, 0), the horizontal axis is the X axis, and the vertical axis is the Y axis. In the observation area rectangle 1502, rectangular coordinates 1503 are indicated by (X, Y).

FIG. 16 is a diagram showing the defect position coordinates of the review file on the substrate.
In FIG. 16, among the defect 1601, the defect 1602, the defect 1603, the defect 1604, the defect 1605, and the defect 1606, the defect 1602 and the defect 1603 are in the same observation region. The defect 1606 is a defect that extends over three observation areas.

FIG. 17 is a diagram illustrating the order in which the microscope moves only in the observation area rectangle including the defect.
In FIG. 17, the rectangular coordinates (1, 3), the rectangular coordinates (2, 4), the rectangular coordinates (3, 6), the rectangular coordinates (5, 3), the rectangular coordinates (7, 1), and the rectangular coordinates to be observed. (8, 1) and rectangular coordinates (9, 1) indicate that the observation is made by a broken line 1702 connected from the start observation position 1701 to the final observation position 1703.

FIG. 18 is a flowchart showing a flow of microscope movement order determination processing for determining the order of movement of the microscope.
In this microscope movement order determination process, a target observation area rectangle is determined from the defect information in the review file, and the movement order of the microscope is determined.

  First, in step S1801, the substrate 1501 is divided by the observation area rectangle 1502 as shown in FIG. 15, and a two-dimensional array InspMap [maxX] [maxY] map having the rectangular coordinates 1503 of each observation area rectangle 1502 as element numbers is obtained. create. Here, maxX is the number required when the horizontal axis is divided by the horizontal width of the observation area rectangle 1502, and maxY is the number required when the vertical axis is divided by the vertical width of the observation area rectangle 1502. is there.

In step S1802, the data of all elements is initialized with zero.
In step S1803, the review file is read, and all information (defect coordinates, size X, size Y) indicated in the review file is acquired. Here, in order to facilitate the description of the defect coordinate system, the lower left shown in FIG.

  Next, in step S1804, a subroutine “two-dimensional array InspMap [maxX] [maxY] data setting process” for setting data in the two-dimensional array InspMap [maxX] [maxY] coinciding with the defect coordinates is executed.

FIG. 19 is a flowchart showing the flow of the subroutine “two-dimensional array InspMap [maxX] [maxY] data setting process”, and FIG. 20 is a diagram for explaining the definition of defects.
In FIG. 20, the X size 2003 of the defect 2001 is represented by DefectX, and the Y size 2004 is represented by DefectY. Further, the X coordinate 2005X of the lower left coordinate 2005 of the rectangle 2002 surrounding the defect 2001 is represented by RectL_X, the Y coordinate 2005Y is represented by RectB_Y, the X coordinate 2006X of the upper right coordinate 2006 is represented by RectR_X, and the Y coordinate 2006Y is represented by RectT_Y.

  The subroutine “two-dimensional array InspMap [maxX] [maxY] data setting process” shown in FIG. 19 is performed in steps between step S1900 and “review defect coordinate number loop” shown in step S1912, that is, steps S1901 to S1901. This is a process of repeating S1911 while changing the coordinates by the number of coordinates of the defect.

  First, in step S1901, X size DefectX2003, Y size RefectY2004, X coordinate RectL_X2005X, Y coordinate RectB_Y2005Y of lower left coordinate 2005 of rectangle 2002, X coordinate RectR_X2006 and Y coordinate RectT_Y2006Y of upper coordinate 2006 are calculated in step S1901. .

In step S1902, RectL_X and RectB_Y are set as initial values in variables PointX and PointY in the subroutine program, respectively. In step S1903, it is calculated which number of elements of the two-dimensional array InspMap the coordinates of the rectangle 2002 match. The number of elements of the two-dimensional array InspMap is represented by InspMap [ElementX] [ElementY], the initial value of ElementX is InitElementX, the initial value of ElementY is InitElementY, and is calculated as follows.
InitElementX = PointX / InspAreaX
ElementX = InitElement
InitElementY = PointY / InspArea
ElementY = InitElementY
In step S1904, the data of InspMap [ElementX] [ElementY] that matches the number of elements calculated in step S1903 is incremented by 1. In step S1905, the coordinate number on the right side (X axis positive direction) is obtained. ElementX is incremented by 1, and the start coordinate value PointX of that ElementX is obtained.

  In step S1906, it is determined whether or not the start coordinate value PointX of ElementX calculated in step S1905 exceeds the rectangular coordinate RectR_X of the target defect, that is, whether or not the defect is not continuous. If the start coordinate value PointX exceeds the rectangular coordinate RectR_X, it means that the defect is not continuous. If it is determined that the start coordinate value PointX does not exceed the rectangular coordinate RectR_X (step S1906: NO), the data of InspMap [ElementX] [ElementY] is incremented by 1 in step S1907, and the process returns to step S1905.

  On the other hand, when it is determined that the start coordinate value PointX is equal to or less than the rectangular coordinate RectR_X (step S1906: Yes), it is determined that there is no defect in this ElementX, and the process proceeds to step S1908.

  Next, in step S1908, the X-axis parameter coordinate number ElementX and the start coordinate value PointX are returned to their initial values, and then in step S1909, ElementY is used to obtain the coordinate number one higher (in the positive direction of the Y-axis). Increment by 1 to obtain the start coordinate value PointY of ElementY.

  Next, in step S1910, it is determined whether or not the start coordinate value PointY of ElementY calculated in step S1909 exceeds the rectangular coordinate rectangle coordinate RectR_Y of the target defect, that is, whether or not the defect is not continuous. If the start coordinate value PointY exceeds the rectangular coordinate RectR_Y, it means that the defect is not continuous. If it is determined that the start coordinate value PointY does not exceed the rectangular coordinate RectR_Y (step S1910: No), the data of InspMap [ElementX] [ElementY] is incremented by 1 in step S1911, and the process returns to step S1905.

  On the other hand, when it is determined that the start coordinate value PointY is equal to or less than the rectangular coordinate RectR_Y (step S1910: Yes), it is determined that there is no defect in this ElementY. When the number of loops corresponding to the number of defect coordinates is completed, this subroutine “two-dimensional array InspMap [maxX] [maxY] data setting process” is terminated.

  As described above, by executing the subroutine “two-dimensional array InspMap [maxX] [maxY] data setting process” in step S1804 of FIG. 18 described with reference to FIGS. 19 and 20, InspMap [ElementX] [ Since ElementY] contains zero or more data, the microscope may be moved in order to the center coordinates of InspMap [ElementX] [ElementY] containing data other than zero.

FIG. 21 is a diagram illustrating an example of the microscope movement rule on the substrate.
In FIG. 21, an arrow 2102 on the substrate 2101 indicates a movement rule of the microscope. Steps S1805 and after in FIG. 18 are based on this movement rule.

Returning to the description of FIG.
In step S1805, ElementX of InspMap [ElementX] [ElementY] is initialized to 0.

In step S1806, it is determined whether ElementX is an even number or an odd number.
If it is determined that ElemenX is an even number (step S1806: Yes), ElementY is initialized to 0 in step S1807. If it is determined that ElementY is an odd number (step S1806: No), in step S1808. Set MaxY to ElementY.

Next, in step S1809, it is determined whether data is contained in InspMap [ElementX] [ElementY] (1 or more).
If it is determined that data is contained (step S1809: YES), in step S1810, the center coordinates of InspMap [ElementX] [ElementY] are calculated by the following formula, and the coordinates of movement of the microscope (MoveX, MoveY) And
MoveX = ElementX × InspAreaX + InspAreaX / 2
MoveY = ElementY × InspAreaY + InspAreaY / 2
In step S1811, a list for moving the microscope to the coordinates (MoveX, MoveY) calculated in step S1810 is created.

Next, in step S1812, it is determined again whether ElementX is an even number or an odd number.
If it is determined that ElementX is an even number (step S1812: Yes), ElementY is incremented by 1 in step S1813, and in step S1814, it is determined whether ElementY is equal to or greater than MaxY. If it is determined that it is less than MaxY (step S1814: No), the process returns to step S1809, and if it is determined that it is equal to or greater than MaxY (step S1814: Yes), the process proceeds to step S1817.

  On the other hand, if it is determined in step S1812 that ElementY is an odd number (step S1812: No), in step S1815, ElementY is decremented by 1, and in step S1816, it is determined whether ElementY is less than 0. If it is determined that it is not less than 0 (step S1816: No), the process returns to step S1809. If it is determined that it is less than 0 (step S1816: Yes), the process proceeds to step S1817.

In step S1817, ElementX is incremented by 1.
Finally, in step S1818, it is determined whether ElementX is equal to or greater than MaxX. If it is determined that it is not equal to or greater than MaxX (step S1818: No), the process returns to step S1807, and it is determined that it is equal to or greater than MaxX. (Step S1818: Yes) ends the microscope movement order determination process.

  According to the second embodiment, since a defect that can be observed at one time is obtained using an observation area rectangle created in advance, the load for calculation is small, and the order of observation can be obtained quickly. it can.

  As mentioned above, although each embodiment of the present invention has been described with reference to the drawings, the defect inspection apparatus and the review inspection apparatus provided in the inspection system to which the present invention is applied can perform the function, The present invention is not limited to the above-described embodiments, and processing is performed via a network such as a LAN or WAN, whether it is a single device, a system composed of a plurality of devices, or an integrated device. Needless to say, it may be a system.

  It can also be realized by a system comprising a CPU, ROM or RAM memory connected to a bus, an input device, an output device, an external recording device, a medium drive device, a portable storage medium, and a network connection device. That is, a ROM or RAM memory, an external recording device, or a portable storage medium that records a program code of software that realizes the system of each embodiment described above is supplied to a defect inspection device or a review inspection device, and the defect Needless to say, this can also be achieved by the computer of the inspection apparatus or review inspection apparatus reading and executing the program code.

  In this case, the program code itself read from the portable storage medium or the like realizes the novel function of the present invention, and the portable storage medium or the like on which the program code is recorded constitutes the present invention. .

  Examples of portable storage media for supplying the program code include flexible disks, hard disks, optical disks, magneto-optical disks, CD-ROMs, CD-Rs, DVD-ROMs, DVD-RAMs, magnetic tapes, and nonvolatile memories. Various storage media recorded through a network connection device (in other words, a communication line) such as a card, a ROM card, electronic mail or personal computer communication can be used.

  In addition, the functions of the above-described embodiments are realized by executing the program code read out on the memory by the computer, and the OS running on the computer is actually executed based on the instruction of the program code. The functions of the above-described embodiments are also realized by performing part or all of the process.

  Furthermore, a program code read from a portable storage medium or a program (data) provided by a program provider is provided in a function expansion board inserted into a computer or a function expansion unit connected to a computer. The CPU of the function expansion board or function expansion unit performs part or all of the actual processing based on the instruction of the program code, and the functions of the above-described embodiments are also performed by the processing. Can be realized.

  That is, the present invention is not limited to the above-described embodiments and the like, and can take various configurations or shapes without departing from the gist of the present invention.

It is a figure showing composition of an inspection system to which the present invention is applied. It is a figure which shows the format example of a review file. It is a flowchart which shows the flow of the review file creation process which creates an optimal review file. FIG. 4 is a diagram (part 1) for explaining in detail processing from step S303 to step S307 in FIG. 3; FIG. 4 is a diagram (part 2) for explaining the processing from step S303 to step S307 in FIG. 3 in detail; FIG. 6 is a diagram (part 3) for explaining in detail the processing from step S303 to step S307 in FIG. 3; FIG. 4 is a diagram (part 4) for explaining in detail the processing from step S303 to step S307 in FIG. 3; It is a figure which shows the state in which the resist pattern is normally formed. It is a figure which shows the state in which the defect is formed on the board | substrate. It is a figure which shows the state which extracted the defect area | region from the defect. It is a figure which shows an example of a circuit design layout data format. It is a figure which shows the example of a resist pattern. It is a flowchart which shows the flow of the short defect identification process for identifying a short defect. It is a figure which shows the state in which the short defect is in the same imaging range. It is a figure which shows the example which has arrange | positioned the observation area | region rectangle which enters into a microscope visual field on a board | substrate at the grid | lattice form. It is the figure which showed the defect position coordinate of the review file on a board | substrate. It is the figure which showed the order in which a microscope moves only the observation area | region rectangle containing a defect. It is a flowchart which shows the flow of the microscope movement order determination process which determines the order which a microscope moves. It is a flowchart which shows the flow of a subroutine "two-dimensional array InspMap [maxX] [maxY] data setting process". It is a figure for demonstrating the definition of a defect. It is a figure which shows the example of the microscope movement rule on a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Defect inspection apparatus 102 Production data management server 103 Review inspection apparatus 104 Network 105 Coordinate management server 201 Block 201a Comment 201b Board ID
201c Number of chamfers 202 Block 202a Comment 202b Total number of defects 202c First defect information 202d Second defect information 202e Third defect information 203 Block 401 Defect 402 Rectangle 501 Microscope field of view 502 Center coordinate 503 Defect 504 Defect 601 Center coordinate 602 Rectangle 603 Defect 701 Center coordinate 702 Defect 801, 802, 803, 901, 902, 903 Pattern 904, 905, 906 Defect 1001, 1002, 1003, 1004, 1005, 1006 Defect area 1101 Start position coordinate 1102 Length 1103 Width 1104 Number 1105 Repeat Interval 1201 Start position coordinates 1202 Length 1203 Width 1204a, 1204b, 1204c, 1205 Resist pattern 1205 Repeat interval 1401 Revealed Mirror field 1501 substrate 1502 observation region rectangular 1503 rectangular coordinate 1601,1602,1603,1604,1605,1606 defect 1701 start viewing position 1702 dashed 1703 Last observation position 2001 defect 2002 square 2003 X Size (DefectX)
2004 Y size (DefectY)
2005 Lower left coordinate 2006 Upper right coordinate 2101 Substrate 2102 Microscope movement rule

Claims (7)

An inspection system comprising a defect inspection device and a review inspection device,
The defect inspection apparatus recognizes a defect formed on a substrate, acquires defect information including a defect position coordinate indicating a position coordinate of the defect and a defect size indicating a size of the defect,
The review inspection apparatus, based on the defect position coordinates acquired by the defect inspection apparatus, inspects the substrate with a microscope by relatively moving an imaging range,
The review inspection apparatus, based on the defect information and imaging range information for configuring the imaging range, a coordinate calculation unit that calculates coordinates so that the number of relative movements is reduced,
An inspection system characterized by comprising:   The inspection system according to claim 1, wherein the coordinate calculation unit is provided in an apparatus different from the review inspection apparatus.   The inspection system according to claim 1, wherein the coordinate calculation unit includes an in-field defect extraction unit that obtains coordinates at which a plurality of defects simultaneously enter the same imaging range of the microscope.   The inspection system according to claim 1, wherein the coordinate calculation unit includes a lattice coordinate setting unit for obtaining a lattice in which a plurality of defects enter based on an imaging range of the microscope.   5. The inspection system according to claim 1, wherein the review inspection apparatus includes a defect coordinate storage unit that stores position coordinates of defects output from the defect inspection apparatus.   6. The review inspection apparatus according to claim 1, wherein the review inspection apparatus includes a spatial modulation element, and is a review inspection apparatus with a correction function that performs repair by irradiating a plurality of laser beams in an arbitrary shape at a time. The inspection system according to claim 1.   The said review inspection apparatus is equipped with the laser irradiation unnecessary part determination part which extracts the defective part which needs the repair by a laser, and excludes the part which does not require repair, The any one of Claim 1 thru | or 6 characterized by the above-mentioned. Inspection system as described in.