JP2009170760A - Structure of electronic equipment - Google Patents

Abstract

【Task】
Provided is a structure of an electronic device in which a wiring board is provided sandwiching a heat sink and wiring between the wiring boards is required without impairing the heat dissipation effect of the heat sink.
[Solution]
A heat sink 2 is housed inside the housing 1, a wiring board 5 is provided with the heat sink interposed, and at least a portion of the housing that faces the surface of the heat sink where the wiring board is not provided has a double wall structure, The wiring boards were electrically connected by a cable 11 inserted into a double wall structure space.
[Selection] Figure 1

Description

  The present invention relates to a structure of an electronic device in consideration of cooling efficiency.

  In the structure of an electronic device in which a heat generating component is mounted and a wiring board that needs to be cooled is stored, a heat sink for heat dissipation is provided, and the wiring board is attached to the heat sink. In consideration of efficiency, the housing itself forms a ventilation path.

  The structure of a conventional electronic device will be described with reference to FIGS.

  A heat sink 2 is housed inside the housing 1, and spaces are formed above and below the heat sink 2 and before and after.

  The heat sink 2 has a structure having fins 3 between an upper plate and a lower plate, and the fins 3 form a ventilation path between the upper plate and the lower plate. Further, an upper wiring board 5 and a lower wiring board 6 on which the heat generating component 4 is mounted are respectively attached to the upper board and the lower board.

  The front panel 7 and the rear panel 8 of the housing 1 are provided with ventilation holes 9 (one is not shown) corresponding to the fins 3, and the ventilation holes 9 have a position shape corresponding to the fins 3. ing.

  Therefore, a ventilation path is formed inside the casing 1 by the fins 3, and the ventilation holes 9 and the ventilation holes of the rear panel 8 (not shown) are provided so that the ventilation path communicates with the outside.

  The heat generated from the heat generating component 4 is transmitted to the fin 3, and the fin 3 is cooled by the wind flowing through the ventilation path.

  Further, since the upper wiring board 5 and the lower wiring board 6 are provided above and below the heat sink 2, the upper wiring board 5 and the lower wiring board 6 are electrically connected by cables 11 and 12. Yes.

  The cable 11 on the front side is wired so as to cross the ventilation hole 9 in front of the heat sink 2, and the cable 12 on the rear side is wired through a notch 13 formed in the heat sink 2.

  In the structure of the conventional electronic device, the cable 11 blocks the ventilation path of the fin 3, thereby preventing air from flowing. Alternatively, depending on the content of the wiring work, the state of the cable 11 is not uniform and varies depending on air flow. That is, the cooling effect changes. The wiring of the cable 12 has the problem that the cutout portion 13 is necessary and the heat dissipation effect of the heat sink 2 is lowered.

  In addition, there exists a thing shown by patent document 1 as a thing where the heat sink was accommodated in the inside of a housing | casing and the flow path was formed.

Japanese Patent Laid-Open No. 2001-196776

  In view of such circumstances, the present invention provides a structure of an electronic device that does not impair the heat dissipation effect of a heat sink when wiring boards are provided with a heat sink interposed and wiring is required between the wiring boards. is there.

  In the present invention, a heat sink is housed inside the housing, a wiring board is provided with the heat sink interposed, and at least a portion of the housing that faces the surface of the housing where the wiring board is not provided has a double wall structure. The present invention relates to a structure of an electronic device in which the wiring boards are electrically connected by a cable inserted through the space of the double wall structure.

  According to the present invention, a heat sink is accommodated in the housing, a wiring board is provided with the heat sink interposed, and at least a portion of the housing facing the surface on which the wiring board of the heat sink is not provided has a double wall structure. Since the wiring boards are electrically connected by the cable inserted into the space of the double wall structure, the cable is routed in a space separated from the ventilation path formed by the heat sink, and the cable is ventilated. There is no obstacle, and wiring is free as long as it is in the space of the double wall structure, so that excellent effects such as elimination of restrictions on connection between wiring boards are exhibited.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  1 and 2 show an example of the structure of an electronic device in which the present invention is implemented. 1 and 2, the same components as those shown in FIGS. 3 to 5 are denoted by the same reference numerals, and the description thereof is omitted.

  One side surface of the housing 1 is opened, a side plate 15 is attached to the opening, and an inner wall plate 16 is provided between the side plate 15 and the side surface of the heat sink 2 facing the side plate 15.

  The inner wall plate 16 is formed by processing a flat plate, has a flange portion 17 on the upper side and the lower side, has a flat shallow box shape with an opening on one side, and the opening surface is arranged to face the side plate 15. The inner wall plate 16 is attached to the side surface of the heat sink 2 and the flange portion 17 is fixed to the side plate 15.

  When the inner wall plate 16 is attached, the space between the side plate 15 and the heat sink 2 is closed by the inner wall plate 16. The side plate 15 and the inner wall plate 16 form a double wall structure, and a flat space 19 separated from the inside of the housing 1 is formed between the side plate 15 and the inner wall plate 16. The double wall structure including the side plate 15 and the inner wall plate 16 may be formed over the entire side plate 15 or may be formed only in a portion facing the heat sink 2.

  A cable insertion port 18 is formed at a required position on the upper side of the inner wall plate 16 and a required position on the lower side, preferably in a position close to the heat generating component 4 provided on the upper wiring board 5 and the lower wiring board 6.

  The case where the cable 11 is wired between the upper wiring board 5 and the lower wiring board 6 will be described.

  The upper wiring board 5 and the lower wiring board 6 are attached to the heat sink 2, and the heat sink 2 is assembled into the housing 1 with the side surfaces opened. The cable 11 is inserted into the cable insertion port 18, and the inner wall plate 16 is attached to the heat sink 2. Further, the cable 11 is connected to the upper wiring board 5 and the lower wiring board 6. The side plate 15 is fixed to the inner wall plate 16 and the housing 1.

  By fixing the side plate 15 to the housing 1, a flat plate-like space 19 is formed between the side plate 15 and the inner wall plate 16, and the cable 11 passes through the space 19 and the cable 11 is The wiring board 5 and the lower wiring board 6 are connected.

  Since the space 19 is separated from the interior of the housing 1, that is, the ventilation path, a part of the cooling air does not branch and flow into the space 19. Therefore, the cable 11 wired in the space 19 does not become an obstacle to ventilation. Moreover, the ventilation state with respect to the said heat sink 2 does not change with the wiring conditions of this cable 11, and quality is stabilized.

  Although one cable 11 is shown in the figure, a plurality of cables can be wired and any number of cables 11 may be used as long as they are accommodated in the space 19. Further, the cable wiring position may be appropriately formed in accordance with the cable insertion position 18 according to the wiring position. Therefore, the connection position of the cable 11 to the upper wiring board 5 and the lower wiring board 6 can be determined freely. , No design restrictions.

  In the above description, the wiring board is provided above and below the heat sink 2, but the wiring board may be provided on the left and right of the heat sink 2. In this case, the upper and lower surfaces of the heat sink 2 may be provided. Either one side is made into a double wall structure, and the opposing wiring board is connected to the space inside the double wall through the cable.

It is the perspective view which fractured | ruptured a part which shows the electronic device which concerns on embodiment of this invention. It is the front view which fractured | ruptured a part of this electronic device. It is the perspective view which fractured | ruptured a part which shows the electronic device of a prior art example. It is the top view which fractured | ruptured the part before the same. It is the front view which fractured | ruptured the part before the same.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Case 2 Heat sink 3 Fin 4 Heat-generating component 5 Upper wiring board 6 Lower wiring board 7 Front panel 9 Ventilation hole 11 Cable 12 Cable 15 Side board 16 Inner wall board 18 Cable insertion port 19 Space

Claims (1)

  A heat sink is housed inside the housing, a wiring board is provided across the heat sink, and at least a portion of the housing that faces the surface of the heat sink where the wiring board is not provided has a double wall structure. A structure of an electronic device, wherein the wiring boards are electrically connected by a cable inserted into a space of the structure.

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