JP2009164505A - Component imaging device, surface mounter and component testing device - Google Patents

Abstract

A component imaging device capable of suppressing the occurrence of uneven irradiation in a direction along an imaging center line while suppressing an increase in size of the device.
The component imaging device includes a plurality of LEDs having a light emission center P shifted in position with respect to a geometric center G. In addition, the LED 532 is disposed in the region 53a on one side with respect to the imaging center line 150, and the LED 532 is located on the Y1 direction side parallel to the imaging center line 150 with respect to the geometric center G. An LED 532 which is disposed in the region 53b on the other side with respect to the center line 150 so as to correspond to the LED 532 on one side, and whose emission center P is located on the Y2 direction side opposite to the Y1 direction with respect to the geometric center G; including.
[Selection] Figure 15

Description

  The present invention relates to a component imaging device, a surface mounter, and a component testing device, and in particular, a component imaging device used when imaging a component with an imaging unit, and a surface mounting provided with an illumination unit used when imaging the component with an imaging unit The present invention relates to a machine and a part testing apparatus.

  2. Description of the Related Art Conventionally, there is known an illuminating device that is used when an electronic part mounted on a printed wiring board (hereinafter referred to as “printed circuit board”) is imaged by an imaging unit (for example, see Patent Document 1).

  In the illumination device of Patent Document 1, a plurality of bullet-type LEDs arranged in a line at predetermined pitch intervals in a direction along the imaging center line correspond to one side and the other side of the imaging center line, respectively. Has been placed. This bullet-type LED is configured such that the emission center is located at the geometric center of the LED when viewed in plan. And LED (1st light emitting element) arrange | positioned at one side of the imaging center line is 1 with respect to LED (2nd light emitting element) corresponding to LED of the one side arrange | positioned at the other side of the imaging center line. / 2 pitches are shifted in the direction along the imaging center line. Therefore, in Patent Document 1, the light emission center of one LED (first light emitting element) and the light emission center of the other LED (second light emitting element) corresponding to the one LED are along the imaging center line. They are arranged so as to be shifted from each other by ½ pitch in the direction. Thereby, when irradiating light with the illuminating device of the said patent document 1, the area | region where the intensity | strength of the light of the LED of one side is strong, and a weak area | region are respectively the area | region where the intensity | strength of the light of the LED of the other side is weak Since they can be overlapped, it is possible to suppress the occurrence of uneven irradiation in the direction along the imaging center line.

  Conventionally, also in a surface mounter for mounting electronic components on a printed circuit board and a component inspection apparatus (component testing apparatus) for inspecting electronic components, illumination for irradiating the electronic components with light when imaging the electronic components 2. Description of the Related Art A component imaging device including a unit is known. In the surface mounter and the component inspection apparatus, the component conveyed by the head unit is imaged by the component imaging device.

JP 2004-101311 A

  However, in the illumination device of Patent Document 1, as described above, a bullet-type LED whose emission center is located at the geometric center is used, and in order to suppress irradiation unevenness, one side of the imaging center line is used. By shifting the position of the LED and the corresponding LED on the other side by ½ pitch each other, the light emission center of the LED on one side and the light emission center of the LED on the other side are shifted from each other. For this reason, the area for arranging the row-shaped LEDs is the imaging center line by the distance (1/2 pitch) of shifting the LED on one side with respect to the LED on the other side in the direction along the imaging center line. There is an inconvenience that it becomes longer in the direction along. As a result, since the dimension of the LED mounting portion (light emitting element mounting portion) for arranging the LEDs becomes large, there is a problem that the lighting device is increased in size accordingly. In addition, when such an illuminating device is used as an illuminating unit of a surface mounting machine and an illuminating unit of a component testing apparatus, the surface mounting machine and the component testing apparatus can move the head unit in order to avoid contact with the illuminating device. There is a problem that the range is limited or becomes large.

  The present invention has been made in order to solve the above-described problems, and one object of the present invention is to prevent irradiation unevenness in the direction along the imaging center line while suppressing an increase in size of the apparatus. It is an object of the present invention to provide a component imaging device, a surface mounter, and a component testing apparatus that can suppress the occurrence.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, a component imaging apparatus according to a first aspect of the present invention is a component imaging apparatus used when an imaging unit images an image of a component conveyed by a head unit. A plurality of light emitting elements having light emission centers whose positions are shifted with respect to the geometric center, and a plurality of light emitting elements are arranged, and arrangement regions on one side and the other side with respect to an imaging center line when imaging a component A light emitting element mounting portion, and at least a part of the light emitting element is disposed in an arrangement region on one side of the light emitting element mounting portion, and the light emitting center is a first centered along the imaging center line with respect to the geometric center. A first light-emitting element located on the direction side, and disposed in the arrangement region on the other side of the light-emitting element mounting portion so as to correspond to the first light-emitting element; Second direction along opposite imaging centerline And a second light emitting element located on.

  In the component imaging device according to the first aspect, as described above, a plurality of light emitting elements having emission centers shifted from the geometric center in plan view are used, and the imaging center line is used. A light emitting element (first light emitting element) whose light emission center is located on the first direction side with respect to the geometric center is disposed in the one arrangement region, and the light emission center is geometric in the other arrangement region. By disposing the light emitting element (second light emitting element) located on the second direction side opposite to the first direction with respect to the target center, the position of the one side light emitting element (first light emitting element) and the other Without shifting the position of the light emitting element (second light emitting element) on the side in the direction along the imaging center line or only slightly shifting, the light emission center and the other side of the light emitting element on the one side (first light emitting element) The light emission center of the light emitting element (second light emitting element) along the imaging center line It can be shifted significantly to the direction. As described above, the first light-emitting element and the second light-emitting element are not shifted or only slightly shifted so that the direction along the imaging center line of the region (light-emitting element mounting portion) for arranging the light-emitting elements is arranged. Can be suppressed, and the uneven emission in the direction along the imaging center line is caused by largely shifting the light emission center of the first light emitting element and the light emission center of the second light emitting element. Can be suppressed. As a result, it is possible to suppress the occurrence of uneven irradiation in the direction along the imaging center line while suppressing an increase in size of the component imaging device. As a result, a clearer image of the component can be obtained, so that the posture of the component can be accurately recognized.

  In the component imaging device according to the first aspect described above, preferably, the first light emitting element and the second light emitting element are respectively rotated by about 180 degrees in a plane with respect to the other, It arrange | positions at the arrangement | positioning area | region of the one side and the other side. With this configuration, the position of the light emitting element on the one side (first light emitting element) and the position of the corresponding light emitting element on the other side (second light emitting element) are not shifted in the direction along the imaging center line. Alternatively, the amount of shift in the direction along the imaging center line between the emission center of the first light emitting element and the emission center of the second light emitting element in a slightly shifted state can be maximized. As a result, it is possible to further increase the degree of overlap of the region where the light intensity of the second light emitting element is high with respect to the region where the light intensity of the first light emitting element is weak, and thus irradiation unevenness in the direction along the imaging center line occurs. Therefore, the posture of the component can be recognized more accurately.

  In the component imaging apparatus according to the first aspect, preferably, the first light emitting element and the second light emitting element are substantially symmetrical with respect to the imaging center line in the arrangement regions on one side and the other side of the light emitting element mounting portion, respectively. The light emission centers of the first light emitting element and the second light emitting element arranged symmetrically are shifted from each other by a predetermined distance in a direction parallel to the imaging center line. If comprised in this way, a 1st light emitting element and a 2nd light emitting element corresponding to the 1st light emitting element by the 1st light emitting element and a 2nd light emitting element being arrange | positioned substantially symmetrically with respect to an imaging centerline. Are arranged at the same position in the direction along the imaging center line, and the respective emission centers of the first light emitting element and the second light emitting element are shifted from each other by a predetermined distance in a direction parallel to the imaging center line. The light emitting center of the first light emitting element and the light emitting center of the second light emitting element are set to the imaging center line without shifting the position of the first light emitting element and the position of the second light emitting element corresponding to the first light emitting element. Can be shifted in parallel directions. Thereby, since the length of the area | region (light emitting element attachment part) for arrange | positioning a light emitting element along the imaging center line can be made small, a component imaging device can be further reduced in size.

  In this case, preferably, the first light-emitting element and the second light-emitting element are arranged in a plurality of rows in the arrangement region on one side and the other side of the light-emitting device mounting portion, respectively, The first light-emitting element and the second light-emitting element are disposed at positions substantially symmetrical with respect to the imaging center line of the light-emitting element mounting portion in the arrangement regions on one side and the other side of the light-emitting element mounting portion, respectively. The light emission centers of the first light emitting element and the second light emitting element in the corresponding columns are shifted from each other by a predetermined distance in a direction parallel to the imaging center line. If comprised in this way, light will be irradiated by the 1st light emitting element and the 2nd light emitting element which were respectively arrange | positioned 1 row at a time by irradiating light by the 1st light emitting element and 2nd light emitting element which were respectively arrange | positioned in multiple rows. The amount of light can be increased as compared with the case of doing so. In addition, since the emission centers of the first light emitting element and the second light emitting element in the corresponding columns are shifted from each other by a predetermined distance in a direction parallel to the imaging center line, irradiation unevenness in the direction along the imaging center line is caused. Since generation | occurrence | production can be suppressed, it is possible to recognize the attitude | position of components correctly.

  In the component imaging apparatus according to the first aspect described above, preferably, the light emitting element mounting portion includes a slit for passing imaging light provided along the imaging center line, and the first light emitting element and the second light emitting element are In each of the arrangement regions on the one side and the other side of the light emitting element mounting portion, the light emitting element attachment portions are arranged at substantially symmetrical positions with respect to the center line in the slit extending direction. If comprised in this way, when the components conveyed by the head unit to the position corresponding to the centerline of the slit as an imaging centerline are imaged by the imaging unit, the first light emitting element and the first By using the two light emitting elements, light with suppressed irradiation unevenness can be irradiated from both sides of the slit. Thereby, a favorable illumination environment for imaging of components can be obtained. Further, the imaging light from the component can be easily guided to the imaging unit through the slit.

  In this case, preferably, a plurality of light emitting elements are arranged along the edge of the slit in the direction in which the slit extends in the arrangement region on one side and the other side of the light emitting element mounting portion, and the light emitting center is located with respect to the geometric center. And a third light emitting element positioned on the slit side. If comprised in this way, since light can be irradiated with respect to components not only by a 1st light emitting element and a 2nd light emitting element but by a 3rd light emitting element, a light quantity can be enlarged more. Further, by positioning the light emission center of the third light emitting element on the slit side with respect to the geometric center, the light emission center of the third light emitting element can be brought closer to the slit provided along the imaging center line. Since the amount of light emitted toward the imaging center can be increased by the three light emitting elements, higher-speed shooting can be performed.

  A surface mounter according to a second aspect of the present invention transports a component, mounts the component on a substrate, an imaging unit that images the component conveyed by the head unit, and captures the component by the imaging unit. A plurality of light emitting elements having a light emission center whose position is shifted with respect to the geometric center in a plan view, and a plurality of light emitting elements are arranged. A light emitting element mounting portion having an arrangement region on one side and the other side with respect to an imaging center line at the time of imaging, at least a part of the light emitting element is disposed in an arrangement region on one side of the light emitting element mounting portion. The light emission center corresponds to the first light emitting element in the first light emitting element located on the first direction side along the imaging center line with respect to the geometric center, and the arrangement region on the other side of the light emitting element mounting portion. Arranged at the center, and the emission center is geometric The first direction and a second light emitting element located in a second direction along the opposite imaging center line with respect to center.

  In the surface mounter according to the second aspect, as described above, the illumination unit having the same configuration as that of the component imaging device according to the first aspect is provided. It is possible to suppress the occurrence of uneven irradiation in the other direction. Thus, the movable range of the head unit can be secured sufficiently without increasing the size of the surface mounter, and the posture of the component can be accurately recognized and mounted.

  A component testing apparatus according to a third aspect of the present invention transports a plurality of electronic components to be inspected from a base for supporting a plurality of inspection sockets loaded with electronic components to be inspected from a tray for uninspected components. A head unit that is loaded into a plurality of inspection sockets and then transported to an inspected component tray, an imaging unit that captures an image of the component that is transported by the head unit, and an illumination unit that is used when the component is imaged by the imaging unit The illumination unit includes a plurality of light emitting elements having a light emission center whose position is shifted with respect to the geometric center in a plan view, and an imaging center line when the plurality of light emitting elements are arranged to image a component. A light emitting element mounting portion having an arrangement region on one side and the other side, at least a part of the light emitting element is disposed in an arrangement region on one side of the light emitting element mounting portion, and the light emission center is a geometric center Taken against A first light emitting element positioned on the first direction side along the center line, and disposed on the other side of the light emitting element mounting portion so as to correspond to the first light emitting element, the light emission center being a geometric center On the other hand, it has the 2nd light emitting element located in the 2nd direction side along the imaging centerline opposite to a 1st direction.

  In the component testing apparatus according to the third aspect, as described above, by providing the illumination unit having the same configuration as that of the component imaging apparatus according to the first aspect, the component imaging apparatus is reduced in size while being along the imaging center line. It is possible to suppress the occurrence of uneven irradiation in the other direction. Thereby, the movable range of the head unit can be ensured sufficiently without increasing the size of the component testing apparatus, and the component posture can be accurately recognized to inspect the component.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view showing the overall configuration of the surface mounter according to the first embodiment of the present invention. 2-11 is a figure for demonstrating the structure of the surface mounter shown in FIG. The structure of the surface mounter 100 according to the first embodiment of the present invention will be described below with reference to FIGS. In the first embodiment, an example in which the component imaging device of the present invention is applied to a surface mounter will be described.

  As shown in FIGS. 1 to 5, the surface mounter 100 according to the first embodiment is an apparatus for mounting a component 120 on a printed board 110. The printed circuit board 110 is an example of the “board” in the present invention. As shown in FIG. 1, the surface mounter 100 includes a pair of substrate transport conveyors 10 extending in the X direction and a head unit 20 that can move in the XY directions above the pair of substrate transport conveyors 10. A plurality of tape feeders 121 for supplying the components 120 are arranged on both sides of the pair of substrate transport conveyors 10. The head unit 20 has a function of acquiring the component 120 from the tape feeder 121 and mounting the component 120 on the printed circuit board 110 on the substrate transport conveyor 10. The substrate transfer conveyor 10 and the head unit 20 are installed on the base 1. Hereinafter, a specific structure of the surface mounter 100 will be described.

  A pair of board | substrate conveyance conveyors 10 are comprised so that the printed circuit board 110 can be stopped and hold | maintained in a predetermined mounting operation position while conveying the printed circuit board 110 to a X direction.

  The tape feeder 121 holds a reel around which a tape holding a plurality of components 120 at a predetermined interval is wound. The tape feeder 121 is configured to supply the component 120 from the tip of the tape feeder 121 by feeding a tape that holds the component 120 by rotating a reel. The component 120 is a small electronic component such as an IC, a transistor, or a capacitor.

  The head unit 20 is configured to be movable in the X direction along the head unit support portion 30 extending in the X direction. Specifically, the head unit support section 30 includes a ball screw shaft 31, a servo motor 32 that rotates the ball screw shaft 31, and a guide rail (not shown) in the X direction. It has a ball nut 21 to which the shaft 31 is screwed. The head unit 20 is configured to move in the X direction with respect to the head unit support 30 when the ball screw shaft 31 is rotated by a servo motor 32. Further, the head unit support portion 30 is configured to be movable in the Y direction along a pair of fixed rail portions 40 provided on the base 1 and extending in the Y direction. Specifically, the fixed rail portion 40 includes a guide rail 41 that supports both ends of the head unit support portion 30 so as to be movable in the Y direction, a ball screw shaft 42 (see FIG. 4) extending in the Y direction, and a ball screw shaft 42. The head unit support portion 30 is provided with a ball nut 33 (see FIG. 4) to which the ball screw shaft 42 is screwed. The head unit support portion 30 is configured to move in the Y direction along the guide rail 41 when the ball screw shaft 42 is rotated by the servo motor 43. With such a configuration, the head unit 20 is configured to be able to move on the base 1 in the XY directions.

  The head unit 20 is provided with six suction nozzles 22 arranged in a row in the X direction so as to protrude downward. Each suction nozzle 22 is configured to be able to generate a negative pressure state at the tip thereof by a negative pressure generator (not shown). The suction nozzle 22 can suck and hold the component 120 supplied from the tape feeder 121 at the tip by this negative pressure.

  Each suction nozzle 22 is configured to be movable in the vertical direction (Z direction) with respect to the head unit 20 by a mechanism (not shown) such as a servo motor. The surface mounter 100 carries the component 120 and the like while the suction nozzle 22 is located at the raised position, and sucks the component 120 from the tape feeder 121 and prints the printed circuit board 110 while the suction nozzle 22 is located at the lowered position. It is configured to make an implementation. Further, the suction nozzle 22 is configured such that the suction nozzle 22 itself can rotate around its axis. Thereby, in the surface mounting machine 100, it is possible to adjust the attitude | position (direction in a horizontal surface) of the components 120 hold | maintained at the front-end | tip of a nozzle by rotating the adsorption nozzle 22 in the middle of conveying the components 120. FIG. .

  In addition, a component imaging device 50 for imaging the posture of the component 120 sucked by the suction nozzle 22 is attached to the head unit 20. As shown in FIG. 2, the component imaging device 50 is attached to the head unit 20 so as to be movable in the X direction (the direction in which the six suction nozzles 22 are arranged). Specifically, the head unit 20 is provided with a ball screw shaft 23 extending in the X direction and a servo motor 24 that rotates the ball screw shaft 23, and the ball screw shaft 23 is screwed into the component imaging device 50. A ball nut 51 is provided. The component imaging device 50 is configured to move in the X direction with respect to the head unit 20 when the ball screw shaft 23 is rotated by the servo motor 24. Thereby, the component imaging device 50 can sequentially image the components 120 held by the six suction nozzles 22 arranged side by side in the X direction on the head unit 20. Further, by attaching the component imaging device 50 to the head unit 20, the component imaging device 50 is moved relative to the head unit 20 while moving the head unit 20 to the mounting position while the component 120 is held by the suction nozzle 22. It is possible to move and image the posture of the component 120 (the suction state to the suction nozzle 22).

  2 to 7, the component imaging device 50 illuminates one component recognition camera 52 and a component 120 sucked by the suction nozzle 22 with illumination light from below and from the side. Part 53 and side illumination part 54, and prisms 55 to 57 for guiding imaging light of part 120 to part recognition camera 52. In addition, as will be described later, the component recognition camera 52 includes an image sensor 52a including six line sensors 521 to 526 (see FIG. 10). The component recognition camera 52 is an example of the “imaging unit” in the present invention. The lower illumination unit 53 and the side illumination unit 54 are examples of the “illumination unit” in the present invention.

  As shown in FIGS. 6 and 7, in the lower illumination unit 53 according to the first embodiment, the component imaging device 50 moves to a predetermined position (lower surface imaging position) with respect to the suction nozzle 22 that holds the component 120 to be imaged. In this case, a rectangular LED mounting board 531 located below the component 120 and a plurality of chip-type (surface-mounting type) LEDs 532 arranged on the LED mounting board 531 are provided. A rectangular slit 531 a extending in a direction parallel to the imaging center line 150 is formed in the LED mounting substrate 531. The plurality of LEDs 532 are arranged so as to surround the four sides of the slit 531a. The structure of the LED 532 and the arrangement of the LED 532 on the LED mounting board 531 will be described in detail later. The slit 531a is provided to allow the reflected light (imaging light) from the component 120 irradiated with the light from the LED 532 of the lower illumination unit 53 to pass therethrough. Further, as shown in FIG. 6, a prism 55 having a reflecting surface 55a for reflecting the imaging light in the Z direction in the direction along the X direction is disposed below the slit 531a. Further, on the side of the prism 55, a prism 56 having a reflecting surface 56a for reflecting the imaging light reflected by the prism 55 in the X direction toward the component recognition camera 52 is disposed. Thereby, the imaging light from the lower illumination unit 53 is configured to be reflected by the reflecting surface 55 a of the prism 55 and the reflecting surface 56 a of the prism 56 and to enter the image sensor 52 a of the component recognition camera 52.

  As shown in FIG. 8 and FIG. 9, the side illumination unit 54 is a component when the component imaging device 50 moves to a predetermined position (side imaging position) with respect to the suction nozzle 22 that holds the component 120 to be imaged. It has a rectangular LED mounting board 541 located on the side of 120, and a plurality of chip-type LEDs 542 arranged on the surface of the LED mounting board 541. Further, on the side of the prism 56 described above, the prism 57 having the reflection surfaces 57 a and 57 b is disposed so as to face the LED 542 on the LED mounting substrate 541. The reflecting surface 57a is configured to reflect the imaging light in the Y direction from the LED 542 in the Z direction toward the reflecting surface 57b, and the reflecting surface 57b is directed toward the reflecting surface 56a of the prism 56. And is configured to reflect in the X direction. The reflecting surface 56 a of the prism 56 reflects the imaging light from the side illumination unit 54 to the component recognition camera 52 in addition to the function of reflecting the imaging light from the lower illumination unit 53 to the component recognition camera 52 side. It has the function to do. Thereby, the transmitted light (imaging light) from the component 120 irradiated with the light from the LED 542 of the side illumination unit 54 is recognized as the component through the reflection surfaces 57a and 57b of the prism 57 and the reflection surface 56a of the prism 56. It is comprised so that it may inject into the image sensor 52a of the camera 52 for cameras. With this component imaging device 50, an image viewed from below the component 120 and an image viewed from the side of the component 120 can be captured by one component recognition camera 52. The LED mounting substrates 531 and 541 are examples of the “light emitting element mounting portion” in the present invention. The chip-type LEDs 532 and 542 are examples of the “light emitting element” in the present invention.

  Also, as shown in FIG. 10, the image sensor 52a of the component recognition camera 52 is a so-called TDI sensor (Time Delay Integration Sensor), and a plurality (in the first embodiment, 6 in the first embodiment) extend so that pixels are continuous. Pieces) of line sensors 521 to 526 are arranged in the B direction. By using the image sensor 52a formed of a TDI sensor, a clear image can be obtained even when imaging is performed while moving the component imaging apparatus 50 with respect to the component 120 at high speed. The image sensor 52a composed of the TDI sensor is configured to image the component 120 as follows.

  That is, when the component 120 is imaged by the image sensor 52a made of a TDI sensor while moving the component imaging device 50 (component recognition camera 52), the direction in which the component 120 moves relative to the component recognition camera 52 ( Six line sensors 521 to 526 are arranged at a predetermined pitch (interval) along the (B direction). That is, the component 120 moves across the six line sensors 521 to 526 at a predetermined speed. Here, the six line sensors 521 to 526 are controlled to perform imaging every time (hereinafter, imaging pitch time) required for the component 120 to move through the pitch between the line sensors 521 to 526. Thereby, a part of the part 120 imaged by the first stage line sensor 521 is imaged by the second stage line sensor 522 after the imaging pitch time. Further, after the imaging pitch time, the same part is imaged by the third-stage line sensor 523. Similarly, the same part of the component 120 is imaged six times by the six line sensors 521 to 526. In addition, control is performed such that all charges corresponding to the image of the same part imaged by each of the line sensors 521 to 526 are added. Thereby, with a TDI sensor composed of six line sensors, it is possible to obtain a charge that is six times the charge obtained by one line sensor for a certain part of the component 120 in one imaging. By controlling in this way, it is possible to obtain a clear image even when it is difficult to obtain a sufficient charge with only one line sensor due to increasing the moving speed of the component imaging device 50. It is.

  The operation of the surface mounter 100 is controlled by the control device 60 shown in FIG. The control device 60 includes a main control unit 61, an axis control unit 62, an illumination control unit 63, and an image processing unit 64.

  The main control unit 61 includes a CPU that executes logical operations, a ROM (Read Only Memory) that stores programs for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. It is composed of The main control unit 61 is connected to the lower illumination unit 53, the side illumination unit 54, the image sensor 52a, each servo via the axis control unit 62, the illumination control unit 63, and the image processing unit 64 in accordance with a program stored in the ROM. It is comprised so that a motor etc. may be controlled.

  The axis control unit 62 is configured based on the control signal output from the main control unit 61. Each servo motor of the surface mounter 100 (servo motor 43 for moving the head unit support unit 30 in the Y direction (see FIG. 4)). The servo motor 32 (see FIG. 4) for moving the head unit 20 in the X direction, the servo motor (not shown) for moving the suction nozzle 22 in the vertical direction, and the component imaging device 50 in the X direction It is configured to control the drive of a servo motor 24 (see FIG. 4) for moving.

  The illumination control unit 63 is configured to turn on the lower illumination unit 53 and the side illumination unit 54 at a predetermined timing based on a control signal output from the main control unit 61. Based on the control signal output from the main control unit 61, the image processing unit 64 reads an imaging signal from the image sensor 52a at a predetermined timing, and performs predetermined image processing on the read imaging signal. Image data suitable for recognizing the component 120 is generated. The image processing unit 64 is configured to output the generated image data to the main control unit 61.

  FIG. 12 is a plan view showing an LED mounting board of the lower illumination unit and a chip-type LED disposed on the LED mounting board. 13 and 14 are a perspective view and a plan view, respectively, showing the structure of a chip-type LED disposed in the lower illumination section. FIG. 15 is a plan view showing a simplified arrangement of chip-type LEDs in the plan view of the lower illumination unit shown in FIG. Next, with reference to FIGS. 12 to 15, the structure of the chip-type LED of the surface mounter 100 according to the first embodiment of the present invention and the arrangement of the LED on the substrate will be described in detail.

  In the first embodiment, a chip-type (surface-mount type) LED is used as a light source mounted on the component imaging device 50 that performs imaging while moving. This chip-type LED is characterized in that it is smaller and lighter and has a smaller thickness than a bullet-type LED. For this reason, since the component imaging device 50 can be reduced in size and weight, the imaging device can be stably moved at high speed, and the movable range of the head unit is increased. Further, when the illumination thickness is reduced, the component imaging device 50 can be brought closer to the printed circuit board 110 when the suction nozzle 22 is lowered and the component 120 is mounted. For this reason, the stroke of the suction nozzle 22 can be reduced, and as a result, accurate and high-speed component mounting is possible. As the chip-type LED 532 used in the first embodiment, for example, a UR1111C type manufactured by Stanley can be used. Hereinafter, the structure of the LED 532 will be described in detail.

  As shown in FIGS. 12 to 14, a chip-type LED 532 includes a cathode terminal 532a, an anode terminal 532b having the same shape as the cathode terminal 532a, an LED element 532c disposed on the surface of the cathode terminal 532a, A bonding wire 532d for connecting the LED element 532c and the anode terminal 532b and a package 532e for sealing them are included. The LED 532 has a length L1 of about 1.6 mm, a width W1 of about 0.8 mm, and a thickness t of about 0.7 mm.

  Here, in the first embodiment, as shown in FIG. 14, the light emission center P of the LED element 532c is shifted from the geometric center G of the LED 532 by a distance D1 of about 0.28 mm as viewed in a plan view. Has been placed. As described above, the LED 532 is configured such that the position of the light emission center P of the LED element 532 c is deviated from the position of the geometric center G of the LED 532. In the first embodiment, as shown in FIG. 12, a plurality of LEDs 532 in which the cathode terminal 532 a and the anode terminal 532 b are attached to the LED attachment substrate 531 with the solder 533 are used as the lower illumination unit 53. The length in the Y direction when the cathode terminal 532a and the anode terminal 532b of the LED 532 are attached to the solder 533 is L2.

  Next, the arrangement of the LEDs 532 on the LED mounting board 531 will be described. As shown in FIG. 15, on the surface of the LED mounting substrate 531, in a region 53 a on one side with respect to the imaging center line 150 (center line of the rectangular slit 531 a), a direction parallel to the imaging center line 150 ( A plurality of LEDs 532 are arranged in a row at a predetermined pitch (interval) L3 in a direction parallel to the direction in which the slits 531a extend (Y direction). Hereinafter, one row of the plurality of LEDs 532 arranged in a row is referred to as an LED row. In FIG. 15, the region including the LED 532 and the solder 533 is simply illustrated as a rectangular region having a length L2 in the Y direction. In the first embodiment, three LED rows A1 to A3 are arranged in the region 53a on one side. In the first embodiment, the LED arrays A1, A2, and A3 are each composed of 8, 7, and 6 LEDs 532, and the number of LEDs 532 included in the LED array is configured to decrease as the distance from the slit 531a increases. Has been. In the first embodiment, the LED 532 of the LED rows A1, A2, and A3 in the region 53a on one side has the emission center P located on the Y1 direction side parallel to the imaging center line 150 with respect to the geometric center G of the LED 532. Are arranged as follows.

  In addition, three LED rows B1, B2, and B3 are arranged in the region 53b on the other side with respect to the imaging center line 150 so as to correspond to the arrangement of the LEDs 532 in the one region 53a. The LED rows A1, A2, and A3 on one side and the LED rows B1, B2, and B3 on the other side are arranged at the same position in the Y direction so that the corresponding LEDs 532 are symmetric with respect to the imaging center line 150, respectively. ing. Here, in the first embodiment, the LEDs 532 of the LED rows B1, B2, and B3 in the other region 53b are parallel to the imaging center line 150 with respect to the geometric center G of the LED 532 and 180 in the Y1 direction. It is arranged so that the light emission center P is located on the opposite Y2 direction side. Thereby, the emission center P of the LED 532 of the LED array A1 on one side and the emission center P of the corresponding LED 532 of the LED array B1 on the other side are shifted from each other in the direction parallel to the imaging center line 150 (Y direction). It is shifted by D2. That is, in the arrangement of the LEDs 532 on the LED mounting board 531 of the first embodiment shown in FIG. 15, the three rows of LEDs 532 in the one side region 53a and the corresponding three rows of LEDs 532 in the other side region 53b are Y The light emission center P is disposed so as to be shifted by the amount of shift D2 in the Y direction while being arranged at the same position without being shifted in the direction.

  Further, the light emission center P of the LED 532 of the LED array A1 on one side and the light emission center P of the LED 532 adjacent in the Y direction with respect to the LED 532 of the other LED array B1 corresponding to the LED 532 are shifted by a deviation amount D3. It is off. In the first embodiment, the shift amount D3 is larger than the shift amount D2, and the sum of the shift amounts D2 and D3 becomes the pitch L3. Similarly, the emission center P of the LED 532 of the LED rows A2 and A3 on one side is parallel to the imaging center line 150 with respect to the emission center P of the corresponding LED 532 of the LED rows B2 and B3 on the other side, respectively. It is shifted in the direction (Y direction) by the shift amount D2 and is shifted by the shift amount D3 with respect to the light emission center P of the LED 532 adjacent to the corresponding LED 532 on the other side.

  A plurality of LEDs 532 are arranged in a region 53c along the edge 531b in the extending direction of the slit 531a. In the first embodiment, three LED rows C1 to C3 including two LEDs 532 are arranged along the edge portion 531b. The LEDs 532 of the three LED rows C1 to C3 in the region 53c are arranged such that the light emission center P is positioned on the slit 531a side with respect to the geometric center G without shifting the position in the Y direction parallel to the imaging center line 150. Is arranged.

  Further, the LED 542 of the side illumination unit 54 has the same structure as the LED 532 of the lower illumination unit 53 described above. As shown in FIG. 8, also in the side illumination unit 54, a plurality of lines arranged in a row in a direction parallel to the imaging center line 151 in the area 54 a on one side and the area 54 b on the other side with respect to the imaging center line 151. LED 542 is arranged. The LEDs 542 in the one side region 54a are arranged such that the light emission center P is located on the Z1 direction side parallel to the imaging center line 151 with respect to the geometric center G. The LED 542 in the other region 54b is parallel to the imaging center line 151 with respect to the geometric center G of the LED 542, and the light emission center P is positioned on the Z2 direction side that is 180 degrees opposite to the Z1 direction. Has been placed. Further, the LED 542 in the one side region 54a and the corresponding LED 542 in the other side region 54b are arranged at the same position in the Z direction so as to be symmetric with respect to the imaging center line 151.

  Next, the mounting operation of the component 120 on the printed circuit board 110 by the surface mounter 100 of the first embodiment will be described.

  First, as shown in FIG. 1, the printed circuit board 110 is carried onto the base 1 via the pair of board transport conveyors 10 and is transported to the mounting work position at the center of the base 1.

  In parallel with the loading operation of the printed circuit board 110, the component 120 to be mounted is taken out from the tape feeder 121 by the head unit 20. Specifically, when the head unit 20 is moved above the tape feeder 121, the suction nozzle 22 of the head unit 20 is disposed above the component 120 to be mounted held by the tape feeder 121.

  Thereafter, the suction nozzle 22 is lowered, and negative pressure is supplied to the tip of the suction nozzle 22 at a predetermined timing. Thereby, the component 120 on the tape feeder 121 is sucked and held by the suction nozzle 22.

  Next, the suction nozzle 22 holding the component 120 is raised, and the head unit 20 is moved to the mounting position above the printed circuit board 110. At this time, the component 120 held by the suction nozzle 22 is moved by moving the component imaging device 50 attached to the head unit 20 in the X direction as shown in FIGS. 7 and 9 while moving the head unit 20. Imaging is performed. At this time, in the first embodiment, as shown in FIGS. 6 to 9, an image of the lower surface of the component 120 is obtained using the lower illumination unit 53 and the side illumination unit 54 having the characteristic LED arrangement as described above. And side images.

  In addition, the image data of the lower surface and the side surface of the component 120 is taken into the main control unit 61 (see FIG. 11). The main control unit 61 determines whether or not there is a suction failure such as so-called chip standing based on the image of the side surface of the component 120. When it is determined that there is no suction failure, the main control unit 61 calculates a deviation amount of the suction position of the component 120 with respect to the correct suction position based on the image of the lower surface of the component 120. Then, the head unit moves and the suction nozzle 22 rotates based on the calculated deviation amount, and the mounting position of the component 120 is corrected. The correction processing of the mounting position of the component 120 described above is performed in parallel with the head unit 20 moving from the tape feeder 121 to the mounting position of the printed circuit board 110.

  As shown in FIG. 1, after the head unit 20 is moved to the mounting position of the printed circuit board 110, the suction nozzle 22 is lowered and the component 120 is mounted on the printed circuit board 110. By repeatedly performing the above processing, the component 120 is mounted on the printed circuit board 110.

  In addition, the printed circuit board 110 on which the mounting of the component 120 is completed is carried out from the base 1 via the pair of board conveyance conveyors 10. In this way, the mounting operation of the component 120 by the surface mounter 100 is completed.

  In the first embodiment, as described above, the LED 532 having the light emission center P whose position is shifted with respect to the geometric center G in a plan view is used, and the region 53a on one side of the imaging center line 150 is used. The LED 532 is arranged so that the light emission center P is located on the Y1 direction side with respect to the geometric center G, and the light emission center P is located on the other side region 53b with respect to the geometric center G, Y2 opposite to the Y1 direction. By disposing the LED 532 so as to be positioned on the direction side, the light emission center P of the LED 532 on one side is shifted without shifting the position of the LED 532 on one side and the position of the LED 532 on the other side in a direction parallel to the imaging center line 150. And the light emission center P of the LED 532 on the other side can be largely shifted in a direction parallel to the imaging center line 150 (Y direction). Thus, by not shifting the position of the LED 532 on the one side and the position of the LED 532 on the other side, the direction (Y direction) parallel to the imaging center line 150 of the region (LED mounting board 531) for arranging the LED 532 The emission unevenness in the direction parallel to the imaging center line 150 can be suppressed by largely shifting the light emission center P of the LED 532 on one side and the light emission center P of the LED 532 on the other side. Can be suppressed. As a result, the movable range of the head unit 20 can be secured sufficiently without increasing the size of the surface mounter 100, and the mounting position can be corrected by accurately recognizing the suction posture of the component 120.

  In the first embodiment, as described above, the LED 542 is also arranged in the side illumination unit 54 so that the emission center P is located on the Z1 direction side in the region 54a on the one side with respect to the imaging center line 151. At the same time, by disposing the LED 542 so that the light emission center P is positioned on the Z2 direction side opposite to the Z1 direction in the region 54b on the other side with respect to the imaging center line 151, the position of the LED 542 on one side and the other side The light emission center P of the LED 542 on one side and the light emission center P of the LED 542 on the other side can be shifted in a direction parallel to the imaging center line 151 without shifting the position of the LED 542 in a direction parallel to the imaging center line 151. . Accordingly, it is possible to sufficiently secure the movable range of the head unit 20 without increasing the size of the surface mounter 100, and more accurately recognize the suction posture of the component 120 and correct the mounting position.

  In the first embodiment, as described above, the LED 532 is arranged on the LED mounting board 531 in a state where the LED 532 in the one side region 53a is rotated approximately 180 degrees in a plane with respect to the LED 532 in the other side region 53b. Thus, the light emission center P of the one LED 532 and the light emission of the other LED 532 in a state where the position of the LED 532 on one side and the position of the corresponding LED 532 on the other side are not shifted in the direction parallel to the imaging center line 150. The amount of deviation from the center P in the direction parallel to the imaging center line 150 can be maximized. Thereby, since the overlapping degree of the region where the light intensity of the LED 532 on the other side is high with respect to the region where the light intensity of the LED 532 on the one side is weak can be increased, irradiation unevenness in the direction parallel to the imaging center line 150 is caused. Since generation | occurrence | production can be suppressed more, it is possible to recognize the attitude | position of the components 120 correctly and to correct | amend a mounting position.

  In the first embodiment, as described above, the LEDs 532 are arranged at positions symmetrical to the imaging center line 150 in the one-side region 53a and the other-side region 53b. The light emission center P of the one LED 532 and the light emission center P of the other LED 532 are shifted in a direction parallel to the imaging center line 150 without shifting the position of the LED 532 on the other side corresponding to the LED 532 on the one side. be able to. Thereby, since it can suppress more that the length of the direction along the imaging center line 150 of the area | region for arrange | positioning LED532 is larger, it can suppress more that the surface mounter 100 enlarges. Therefore, it is possible to more accurately recognize the posture of the component 120 and correct the mounting position.

  In the first embodiment, as described above, three rows of LEDs 532 are arranged in each of the one side region 53a and the other side region 53b, so that one in each of the one side region 53a and the other side region 53b. Since the amount of light can be increased as compared with the case where the LEDs 532 are arranged for each column, it is possible to take an image at a higher speed.

  Further, in the first embodiment, as described above, the LED 532 is disposed at a position symmetrical to the center line (imaging center line 150) in the extending direction of the slit 531a, so that the component 120 is captured by the head unit 20 at the imaging center. When being conveyed to a position corresponding to the center line of the slit 531a as the line 150 and imaged by the component imaging device 50, the component 120 is irradiated with light with suppressed irradiation unevenness from both sides of the slit 531a. be able to. Thereby, a favorable illumination environment for imaging of the component 120 can be obtained.

  In the first embodiment, as described above, by arranging the LED rows C1 to C3 along the edge portion 531b of the slit 531a, not only the LED rows A1 to A3 and the LED rows B1 to B3 but also the LED rows. Since the component 120 can also be irradiated with light by C1 to C3, the amount of light can be increased. Further, by positioning the light emission center P of the LED 532 of the LED rows C1 to C3 on the slit 531a side, the light emission center P of the LED 532 of the LED rows C1 to C3 becomes closer to the slit 531a, so that the LED 532 of the LED rows C1 to C3 The light emission center P can be brought close to the component 120 located above the slit 531a during imaging. Thereby, the illumination intensity with respect to the component 120 can be enlarged.

(Second Embodiment)
FIG. 16 is a plan view showing a lower illumination unit of the surface mounter according to the second embodiment of the present invention. In the second embodiment, unlike the first embodiment, among the LEDs 532 arranged in the region 53c along the edge portion 531b in the extending direction of the slit 531a, the light emission centers P of some of the LEDs 532 are opposite to the slit 531a. An example arranged so as to be located on the side will be described.

  In the lower illumination unit 200 of the second embodiment, as shown in FIG. 16, three LED rows C1 to C3 are arranged in the region 53c along the edge portion 531b in the extending direction of the slit 531a without being displaced in the Y direction. Among the LEDs 532, the light emission center P of the LED 532 of the LED row C2 arranged on the imaging center line 150 is arranged on the slit 531a side, while the light emission center P of the LED 532 of the LED rows C1 and C3 is arranged. It arrange | positions so that it may be located on the opposite side to the slit 531a. The other LED 532 is arranged in the same manner as in the first embodiment, and a description thereof will be omitted.

  In the second embodiment, among the LEDs 532 arranged in the region 53c along the edge 531b in the extending direction of the slit 531a, the light emission center P of the LEDs 532 of the LED rows C1 and C3 is positioned on the opposite side to the slit 531a. By disposing, during imaging, the distance from the light emission center P of the LEDs 532 of the LED rows C1 and C3 to the component 120 located above the slit 531a can be increased. Thereby, compared with the case where the LED 532 of the LED rows C1 and C3 is positioned on the slit 531a side, the light emitted from the LED 532 of the LED rows C1 and C3 is more widely applied to the component 120. Can be irradiated. Thereby, compared with LED arrangement of the said 1st Embodiment, it can suppress more that the irradiation nonuniformity of the Y direction both ends of the component 120 arises.

(Third embodiment)
FIG. 17 is a plan view showing a lower illumination unit of the surface mounter according to the third embodiment of the present invention. In the third embodiment, unlike the first embodiment, the emission center P of the LEDs 532 of the LED rows corresponding to each other on the one side and the other side with respect to the imaging center line 150 is in a direction parallel to the imaging center line 150 and the like. An example in which the LED array on one side and the LED array on the other side are shifted so as to be alternately arranged at intervals will be described.

  In the lower illumination unit 300 of the third embodiment, as shown in FIG. 17, the light emission center P of the LED 532 in the region 53 a on one side is arranged on the Y1 direction side parallel to the imaging center line 150 and on the other side. The emission center P of the LED 532 in the region 53b is arranged on the Y2 direction side opposite to the Y1 direction. The LED rows A1, A2 and A3 in the one side region 53a are parallel to the imaging center line 150 by a predetermined distance (interval) L4 with respect to the LED rows B1, B2 and B3 in the other side region 53b, respectively. They are displaced in the direction. As a result, the light emission center P of the LED 532 of the LED array A1 on one side and the light emission center P of the LED 532 of the LED array B1 on the other side are alternately arranged at equal intervals (deviation amount D4) in the direction parallel to the imaging center line 150. It is comprised so that it may be arrange | positioned. Similarly, between the LED array A2 on one side and the LED array B2 on the other side, and between the LED array A3 on one side and the LED array B3 on the other side, the light emission center P is parallel to the imaging center line 150. Are arranged alternately at equal intervals (deviation amount D4).

  Here, in the third embodiment, the Y-direction interval (Y-direction misalignment amount) L4 between the LED 532 in the one-side region 53a and the LED 532 in the corresponding other-side region 53b is set in each column. The pitch (interval) L5 between the light emission centers P of the LEDs 532 is smaller than 1/2 (1/2 pitch) of L5. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  In the lower illumination unit 300 of the third embodiment, as described above, the LEDs 532 of the LED rows corresponding to each other in the one-side region 53a and the other-side region 53b, By arranging them at equal intervals, it is possible to overlap the region where the intensity of the illumination light of the LED 532 of the LED row on one side is the weakest with the region where the illumination light of the LED 532 of the LED row on the other side is the strongest. Therefore, it is possible to further suppress the occurrence of irradiation unevenness as compared with the first embodiment.

  In the third embodiment, the light emission center P of the LED 532 in the one side region 53a is arranged on the Y1 direction side parallel to the imaging center line 150, and the light emission center of the LED 532 in the other side region 53b is opposite to the Y1 direction. Unlike the case where the LED having the light emission center located at the geometric center is used, the pitch (interval) L5 between the light emission centers P of the LEDs 532 in each column is 1/2 (1 / The LED 532 of the LED rows corresponding to each other on the one side and the other side can be obtained by simply shifting the LED row on one side and the LED row on the other side by a shift amount (interval L4) smaller than 2 pitch). 150 can be alternately arranged at equal intervals (shift amount D4) in a direction parallel to 150. Therefore, also in the third embodiment, the length in the direction along the imaging center line 150 of the region (LED mounting board 531) for arranging the LED rows A1 to A3 and the LED rows B1 to B3 is increased. While suppressing, it is possible to further suppress the occurrence of uneven irradiation in the direction along the imaging center line 150. As a result, it is possible to suppress the occurrence of uneven irradiation in the direction along the imaging center line 150 while suppressing an increase in the size of the component imaging device 50 (surface mounter 100).

(Fourth embodiment)
FIG. 18 is a perspective view showing an IC handler (component testing apparatus) according to the fourth embodiment of the present invention. In the fourth embodiment, an example in which the lower illumination unit 53 of the first embodiment is applied to an IC handler 400 will be described.

  The IC handler 400 according to the fourth embodiment is an apparatus that inspects an electronic component that has been packaged and completed, and classifies it into a non-defective product or a defective product based on the inspection result. The IC handler 400 includes a base 401, a component storage portion 402 (a tray is not shown) in which a tray in which electronic components are stored is disposed on the base 401, and the base 401. A plurality of inspection sockets 403 are arranged and loaded with electronic components for inspection of the electronic components. The component storage unit 402 is determined to be a tray support unit 402a that stores uninspected electronic components, a tray support unit 402b that stores electronic components determined to be non-defective after inspection, and a defective product after inspection. And a tray support portion 402c for storing electronic components.

  The IC handler 400 further includes two component moving devices 404 that convey electronic components between the component storage unit 402 and the inspection socket 403. The component moving device 404 includes a moving unit 406 that can move in the Y direction along a pair of rails 405 provided on the base 401, and a ball screw type driving device 407 that moves the moving unit 406 in the Y direction. Is included. The moving unit 406 includes a head unit 408 having a suction nozzle (not shown) for sucking electronic components. The suction nozzle has a function of correcting the posture of the component as in the first embodiment. The head unit 408 is configured to be movable relative to the moving unit 406 in the X direction. The component moving device 404 conveys the electronic component between the component storage unit 402 and the inspection socket 403 by moving the head unit 408 in the X and Y directions while the electronic component is held by the suction nozzle of the head unit 408. It is configured as follows.

  Here, in the fourth embodiment, the component imaging device 409 is configured to be movable in the Y direction with respect to the head unit 408 and to image the lower surface of the electronic component held by the suction nozzle of the head unit 408. Is provided. The illumination unit 409a of the component imaging device 409 is configured in the same manner as the lower illumination unit 53 of the first embodiment. The configuration of the component imaging device 409 is the same as that of the component imaging device 50 of the first embodiment, and a detailed description thereof will be omitted. By imaging the electronic component held by the suction nozzle of the head unit 408 by the component imaging device 409, the posture of the electronic component is accurately recognized based on the captured image, and the position to be loaded in the inspection socket 403 is corrected. Is possible.

  In the fourth embodiment, as described above, the illumination unit 409a configured in the same manner as the lower illumination unit 53 of the first embodiment is used as the illumination unit 409a of the imaging device 409 of the IC handler 400. While suppressing the increase in size of 409a, it is possible to suppress the occurrence of irradiation unevenness in the direction along the imaging center line 150 (see FIG. 15). Accordingly, it is possible to accurately recognize the posture of the electronic component and correct the position to be loaded in the inspection socket 403 while suppressing the IC handler 400 from becoming large.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first embodiment, the example in which the emission centers P of the plurality of LEDs 532 in the region 53a on one side with respect to the imaging center line 150 are all arranged on the same Y1 direction side with respect to the geometric center G is shown. However, the present invention is not limited to this, and in the region 53a on one side, the LED is arranged so that the direction of the light emission center P of one LED row is opposite to the direction of the light emission center P of the LED of the other LED row. May be arranged. For example, as in the lower illumination unit 500 of the first modification of the first embodiment shown in FIG. 19, the light emission center P of the LED 532 of the LED array A2 is positioned on the Y2 direction side, and the LED array A1 and the LED array A3 The light emission center P of the LED 532 may be arranged on the Y1 direction side opposite to the Y2 direction. In this case, in the region 53b on the other side, the light emission center P of the LED 532 of the LED row B2 is positioned on the Y1 direction side, and the light emission center P of the LED 532 of the LED row B1 and LED row B3 is the Y2 direction opposite to the Y1 direction. Place on the side.

  In the first embodiment, the example in which three LED rows are arranged in each of the region 53a on the one side and the region 53b on the other side with respect to the imaging center line 150 is shown, but the present invention is not limited to this. 20, as in the lower illumination unit 600 of the second modification of the first embodiment shown in FIG. 20, two rows of LED rows A 1, A 2, B 1 and 2 rows are provided in one region 53 a and the other region 53 b, respectively. B2 may be arranged. In the second modification, two LED rows C1 and C2 are arranged in a region 53c along the edge 531b of the slit 531a. Note that the LED row may be one row or four or more rows.

  In the first embodiment, the example in which the number of LEDs included in each of the three LED rows is reduced in order from the side closer to the slit is shown. However, the present invention is not limited thereto, and You may comprise so that it may increase in an order from the near side, and you may make the number of LED of each LED row | line | column the same.

  Moreover, although the example which provided the rectangular-shaped slit 531a in the LED attachment board | substrate 531 of the downward illumination part 53 was shown in the said 1st Embodiment, this invention is not limited to this, Ellipse shape etc. are depended on the components of imaging object. You may provide the slit of shapes other than a rectangular shape.

  In the first embodiment, the LED in one region 53a is parallel to the imaging center line 150 in a state where the LED in one region 53a is rotated 180 degrees in a plane with respect to the LED in the other region 53b. However, the present invention is not limited to this, and the LED is set to the imaging center line 150 in a state where the LED in one area is rotated 180 degrees in the plane with respect to the LED in the other area. You may arrange | position so that it may incline with a predetermined angle. Moreover, you may make it arrange | position the LED of one side rotated in the reverse direction at an angle different from 180 degree | times within a plane with respect to LED of the other side.

  Moreover, although the example which used the TDI sensor which consists of six line sensors as an image sensor was shown in the said 1st Embodiment, this invention is not limited to this, You may use one line sensor.

  In the first to fourth embodiments, the component imaging apparatus of the present invention is applied to the surface mounter 100 and the component testing apparatus (IC handler 400). However, the component imaging apparatus of the present invention is surface mounted. The present invention can be widely applied to devices and apparatuses other than machines and component testing apparatuses.

1 is a perspective view showing a surface mounter according to a first embodiment of the present invention. It is a perspective view which shows the peripheral part of the head unit and component imaging device of the surface mounter by 1st Embodiment shown in FIG. It is a front view of the surface mounting machine by 1st Embodiment shown in FIG. It is a top view of the surface mounter by 1st Embodiment shown in FIG. It is a side view of the component imaging device shown in FIG. It is a perspective view which shows the optical path in the case of imaging the lower surface of components with the component imaging device shown in FIG. FIG. 7 is a plan view corresponding to FIG. 6. It is a perspective view which shows the optical path in the case of imaging the side surface of components with the components imaging device shown in FIG. FIG. 9 is a plan view corresponding to FIG. 8. It is a conceptual diagram for demonstrating the function of the TDI sensor used for the component imaging device of 1st Embodiment. It is a block diagram which shows the control structure of the surface mounter by 1st Embodiment shown in FIG. It is a top view which shows the downward illumination part of the component imaging device of the surface mounter by 1st Embodiment shown in FIG. It is a perspective view which shows chip-type LED used for the downward illumination part by 1st Embodiment shown in FIG. It is a top view which shows chip-type LED used for the downward illumination part by 1st Embodiment shown in FIG. It is a top view for demonstrating arrangement | positioning of LED of the downward illumination part of the surface mounter by 1st Embodiment of this invention. It is a top view for demonstrating arrangement | positioning of LED of the downward illumination part of the surface mounter by 2nd Embodiment of this invention. It is a top view for demonstrating arrangement | positioning of LED of the downward illumination part of the surface mounter by 3rd Embodiment of this invention. It is a perspective view which shows the components testing apparatus by 4th Embodiment of this invention. It is a top view for demonstrating arrangement | positioning of LED of the downward illumination part by the 1st modification of 1st Embodiment of this invention. It is a top view for demonstrating arrangement | positioning of LED of the downward illumination part by the 2nd modification of 1st Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 20 Head unit 50 Component imaging device 52 Component recognition camera (imaging part)
53, 200, 300, 500, 600 Downward illumination unit (illumination unit)
54 Side illumination unit (illumination unit)
100 Surface mounter 110 Printed circuit board (board)
120 parts 150, 151 imaging center line 400 IC handler (part test equipment)
531, 541 LED mounting board (light emitting element mounting portion)
531a Slit 531b Edge 532, 542 LED (light emitting element)
532c LED element A1, A2, A3 LED row (first light emitting element)
B1, B2, B3 LED row (second light emitting element)
C1, C2, C3 LED array (third light emitting element)
G Geometric center P Luminescent center

Claims (8)

A component imaging device used when imaging an image of a component conveyed by a head unit by an imaging unit,
A plurality of light emitting elements having a light emission center whose position is shifted from a geometric center in plan view;
A plurality of light emitting elements arranged, and a light emitting element mounting portion having arrangement regions on one side and the other side with respect to an imaging center line of the imaging unit that images the component,
At least a part of the light emitting element is
A first light emitting element that is disposed in an arrangement region on one side of the light emitting element mounting portion, and wherein the light emission center is located on a first direction side along the imaging center line with respect to the geometric center;
The imaging center line disposed in the arrangement region on the other side of the light emitting element mounting portion so as to correspond to the first light emitting element, and the light emission center being opposite to the first direction with respect to the geometric center And a second light emitting element located on the second direction side along the component imaging device.   The first light-emitting element and the second light-emitting element are arranged in arrangement regions on one side and the other side of the light-emitting element attachment portion, respectively, with one being rotated approximately 180 degrees in a plane with respect to the other. The component imaging device according to claim 1. The first light-emitting element and the second light-emitting element are disposed at substantially symmetrical positions with respect to the imaging center line in the arrangement regions on one side and the other side of the light-emitting element mounting portion, respectively.
3. The light emission center of each of the first light emitting element and the second light emitting element arranged symmetrically is shifted from each other by a predetermined distance in a direction parallel to the imaging center line. Component imaging device. The first light emitting element and the second light emitting element are respectively arranged in a plurality of rows in a row in the arrangement region on one side and the other side of the light emitting element mounting portion,
The first light-emitting element and the second light-emitting element in the columns corresponding to each other are substantially symmetric with respect to the imaging center line of the light-emitting element mounting part in the arrangement region on one side and the other side of the light-emitting element mounting part, respectively The light emitting centers of the first light emitting element and the second light emitting element in the columns corresponding to each other are shifted from each other by a predetermined distance in a direction parallel to the imaging center line. Item imaging apparatus according to Item 3. The light emitting element mounting portion includes a slit for passing imaging light provided along the imaging center line,
The first light-emitting element and the second light-emitting element are arranged at positions substantially symmetrical with respect to the center line in the extending direction of the slit in the arrangement regions on one side and the other side of the light-emitting element mounting portion, respectively. The component imaging device according to any one of claims 1 to 4.   A plurality of the light emitting elements are arranged along an edge of the slit in a direction in which the slit extends in an arrangement region on one side and the other side of the light emitting element mounting portion, and the light emission center is located with respect to the geometric center. The component imaging device according to claim 5, further comprising a third light emitting element positioned on the slit side. A head unit for transporting the component and mounting the component on a substrate;
An imaging unit that images the component conveyed by the head unit;
An illumination unit used when imaging the component by the imaging unit,
The illumination unit is
A plurality of light emitting elements having a light emission center whose position is shifted from a geometric center in plan view;
A plurality of light emitting elements are disposed, and includes a light emitting element mounting portion having arrangement regions on one side and the other side with respect to an imaging center line when imaging the component;
At least a part of the light emitting element is
A first light emitting element that is disposed in an arrangement region on one side of the light emitting element mounting portion, and wherein the light emission center is located on a first direction side along the imaging center line with respect to the geometric center;
The imaging center line disposed in the arrangement region on the other side of the light emitting element mounting portion so as to correspond to the first light emitting element, and the light emission center being opposite to the first direction with respect to the geometric center And a second light emitting element located on the second direction side along the surface mounting machine. A base supporting a plurality of inspection sockets loaded with electronic components to be inspected;
A head unit for transporting a plurality of electronic components to be inspected from an uninspected component tray and loading the plurality of electronic components to the inspected component tray after loading the plurality of inspection sockets;
An imaging unit that images the component conveyed by the head unit;
An illumination unit used when imaging the component by the imaging unit;
The illumination unit is
A plurality of light emitting elements having a light emission center shifted in position with respect to a geometric center in plan view;
A plurality of light emitting elements are disposed, and includes a light emitting element mounting portion having an arrangement region on one side and the other side with respect to an imaging center line when imaging the component;
At least a part of the light emitting element is
A first light emitting element that is disposed in an arrangement region on one side of the light emitting element mounting portion, and the light emission center is located on a first direction side along the imaging center line with respect to the geometric center;
The imaging center line disposed in the arrangement region on the other side of the light emitting element mounting portion so as to correspond to the first light emitting element, and the light emission center being opposite to the first direction with respect to the geometric center And a second light emitting element located on the second direction side along the line.

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