JP2009164410A - Electromagnetic shielding member and its production process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production process of an electromagnetic shielding member having a reduced environmental load. <P>SOLUTION: In a production process of an electromagnetic shielding member, a plastic substrate 1 is arranged below nozzles 3, and a mask 2 is arranged between the nozzles 3 and the plastic substrate 1 to cover the plastic substrate 1. The mask 2 is provided with a plurality of slits 2a extending in the direction of arrow A at an interval in the direction perpendicular to the arrow direction A. The nozzles 3 are moved in the direction of arrow A in Fig.1, and conductive powder 6 is sprayed from the nozzles 3. The conductive powder 6 thus sprayed passes through the slits 2a of the mask 2, collides against the surface of the plastic substrate 1 and is bonded onto the substrate 1 by collision energy. Subsequently, a mask 2A having slits extending in the different direction as compared with the mask 2 is used in place of the mask 2, and the conductive powder 6 is sprayed similarly. Consequently, conductive linear patterns 1a and 1b are formed on the surface of the substrate 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding member in which a conductive pattern is formed on a plastic substrate and a manufacturing method thereof.

Conventionally, various methods are known as a method for manufacturing an electromagnetic wave shielding member in which a conductive pattern is formed on a plastic substrate.
I. For example, Japanese Patent Application Laid-Open No. 2003-318593 describes that a conductive layer having a mesh pattern is formed on a transparent substrate by spraying a conductive fine particle dispersion in a mesh pattern from an inkjet head.
II. Japanese Patent Laid-Open No. 9-148780 describes that an electromagnetic wave shielding member is manufactured by a photolithography method. In the same publication, in a metal vapor-deposited film in which a metal thin film is vapor-deposited on a plastic film, a photosensitive etching resist is applied to the entire surface of the metal thin film, and then exposed with a pattern mask in contact with the exposed portion. A resist pattern is formed using the solubility difference of the unexposed portion, and then a metal pattern is formed by eluting metal other than the pattern portion with an etching solution.
JP 2003-318593 A JP-A-9-148780

  When an electromagnetic wave shielding member is manufactured by an ink jet method as in JP-A-2003-318593, there is a problem that the load on the environment is high because the conductive fine particle dispersion contains an organic solvent, a surfactant and the like. In addition, it takes a long time to form a thick fine pattern, resulting in poor production efficiency.

  In addition, when manufacturing an electromagnetic wave shielding member by photolithography as disclosed in JP-A-9-148780, the manufacturing process is complicated and the manufacturing cost is high, and the resist material and its cleaning liquid are used. There is a problem that the load is high.

  An object of the present invention is to manufacture an electromagnetic wave shielding member simply and with a small addition to the environment.

  The electromagnetic wave shielding member of the present invention (Claim 1) is an electromagnetic wave shielding member in which a conductive pattern is formed on a plastic substrate. The conductive pattern is formed by directing conductive powder from a nozzle toward the surface of the plastic substrate. It is characterized by being sprayed and fixed to the surface of the plastic substrate.

  An electromagnetic wave shielding member according to claim 2 is characterized in that, in claim 1, the conductive powder is at least one selected from the group consisting of Cu powder, ZnO powder, Ag powder, Ni powder, and Pd powder. .

  The method for producing an electromagnetic wave shielding member of the present invention (Claim 3) is the method for producing an electromagnetic wave shielding member in which a conductive pattern is formed on a plastic substrate, wherein the conductive powder is directed from the nozzle to the surface of the plastic substrate. And a spraying step of fixing to the surface of the plastic substrate.

  According to a fourth aspect of the present invention, there is provided a method for producing an electromagnetic wave shielding member according to the third aspect, wherein in the spraying step, the surface of the plastic substrate is covered with a mask having a slit, and the conductive powder is sprayed from above the mask. And a conductive pattern having the same shape as that on the surface.

  According to a fifth aspect of the present invention, there is provided the method for manufacturing an electromagnetic wave shielding member according to the fourth aspect, wherein the spraying step includes a first spraying step and a second spraying step, and the first spraying step is provided in parallel to each other. The surface of the plastic substrate is covered with a first mask having a plurality of slits, and the conductive powder is sprayed from above the first mask to form a first conductive pattern composed of a plurality of lines. In the second step, the surface of the plastic substrate is covered with a second mask having a plurality of slits parallel to each other and at an angle with respect to the slits of the first mask. The conductive powder is sprayed from above to form a second conductive pattern composed of a plurality of lines, and the lattice-shaped conductive pattern is formed by the first spraying process and the second spraying process. And forming on the surface of the click board.

  The method for manufacturing an electromagnetic wave shielding member according to claim 6 is the method according to claim 4, wherein the spraying step includes a first spraying step and a second spraying step, and the first spraying step is provided in parallel to each other. Covering the surface of the plastic substrate with a mask having a plurality of slits, spraying the conductive powder on the first mask to form a first conductive pattern composed of a plurality of lines, In step 2, the surface of the plastic substrate is covered with the mask so that the extending direction of the slit is different from that in the first step, and the conductive powder is sprayed on the mask, A second conductive pattern comprising a plurality of lines is formed, and a grid-like conductive pattern is formed on the surface of the plastic substrate by the first spraying step and the second spraying step. That.

  In the electromagnetic wave shielding member and the manufacturing method thereof according to the present invention, the conductive powder is sprayed from the nozzle toward the surface of the plastic substrate, and the conductive powder is fixed to the surface of the plastic substrate. As described above, since the conductive powder is sprayed on the substrate without being dispersed in an organic solvent or the like as in the ink jet method, the electromagnetic shielding member can be manufactured easily and with a small addition to the environment. A large conductive pattern can be easily manufactured.

  The conductive powder is preferably at least one selected from the group consisting of Cu powder, ZnO powder, Ag powder, Ni powder, and Pd powder. When Cu powder is used, an electromagnetic wave shielding member having high electromagnetic wave shielding performance is obtained. When using ZnO powder, a transparent conductive pattern can be obtained.

  In the present invention, in the spraying step, it is preferable to cover the surface of the plastic substrate with a mask having a slit and spray conductive powder from above the mask to form a conductive pattern having the same shape as the slit on the surface. . In this case, the electromagnetic wave shielding member can be manufactured with high efficiency.

  In the case of using the mask in this way, in the first spraying step, the surface of the plastic substrate is covered with a first mask having a plurality of slits provided in parallel to each other, and the conductive material is applied from above the first mask. In the second step, the surface of the plastic substrate is covered with a second mask having a plurality of slits parallel to each other and forming an angle with the slits of the first mask. The conductive powder may be sprayed from above the mask. Thereby, a grid | lattice-like electroconductive pattern can be manufactured.

  Further, in the first spraying step, the surface of the plastic substrate is covered with a mask having a plurality of slits provided in parallel to each other, and the conductive powder is sprayed from above the first mask. In the second step, The surface of the plastic substrate may be covered with the mask so that the extending direction of the slit is different from that in the first step, and the conductive powder may be sprayed from above the mask. In this case, a grid-like conductive pattern can be manufactured with one kind of mask.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic diagram for explaining the first spraying step, FIG. 2 is a schematic diagram for explaining the second spraying step, and FIG. 3 is a plan view of the manufactured electromagnetic wave shielding member.

  As shown in FIG. 1, the upper end of the nozzle 3 is connected via a hose 4 to a storage container 5 that stores the conductive powder 6. A high pressure gas such as air can be supplied to the storage container 5 through a high pressure gas pipe 7.

  A plurality of injection holes are provided in the lower end 3 a of the nozzle 3. The nozzle 3 is movable in the direction of arrow A in FIG.

  As said electroconductive powder 6, at least 1 sort (s) selected from the group which consists of Cu powder, ZnO powder, Ag powder, Ni powder, and Pd powder is used. When Cu powder is used, an electromagnetic wave shielding member having high electromagnetic wave shielding performance is obtained. When using ZnO powder, a transparent conductive pattern can be obtained.

  The conductive powder 6 preferably has an average particle size of 3 to 30 μm, particularly 5 to 10 μm. When the thickness is 30 μm or less, the conductive pattern can be thinned. When the thickness is 3 μm or more, the conductive powder 6 is prevented from clogging the nozzle 3 and the hose 4 and the like, and the collision energy can be increased to firmly adhere to the plastic substrate 1. Here, the average particle diameter means a volume average diameter by a sieving method.

  When the electromagnetic shielding member is manufactured using the apparatus configured as described above, the plastic substrate 1 is disposed below the nozzle 3, and the plastic substrate 1 is disposed between the nozzle 3 and the plastic substrate 1. The mask 2 is arranged so as to cover it. The mask 2 is provided with a plurality of slits 2 a extending in the direction of the arrow A with a space in the direction perpendicular to the arrow A.

  As the material of the plastic substrate 1, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyimide (PI), or the like is used.

Examples of the material of the mask 2 include various ceramics such as SiC, Al ₂ O ₃ , and Y ₂ O _3, and various high-hardness metals such as titanium and tungsten.

  The thickness of the mask 2 is preferably 100 to 500 μm, particularly 200 to 300 μm. When it is 100 μm or more, damage due to impact such as collision of the conductive powder 6 is prevented. When it is 500 μm or less, the passing rate of the conductive powder 6 is improved.

  The width of the slit 2a provided in the mask 2 is preferably 10 to 100 μm, particularly preferably 10 to 30 μm. When the thickness is 100 μm or less, the conductive pattern can be thinned. When it is 10 μm or more, disconnection is prevented.

  The interval between the slits 2a is preferably 50 to 1000 μm, particularly preferably 100 to 500 μm. Electromagnetic wave shielding properties improve that it is 1000 micrometers or less. The transmittance | permeability of the electromagnetic wave shielding member obtained as it is 50 micrometers or more improves.

  Next, the high pressure gas is supplied into the container 5 from the high pressure gas pipe 7 and the nozzle 3 is moved in the direction of arrow A in FIG. Thereby, the conductive powder 6 in the container 5 is supplied to the nozzle 3 through the hose 4 and sprayed from the injection hole together with the high-pressure gas. The sprayed conductive powder 6 collides with the surface of the plastic substrate 1 through the slit 2a of the mask 2, and is fixed onto the substrate 1 by the collision energy. In this way, a plurality of conductive linear patterns 1a parallel to each other are formed on the surface of the plastic substrate 1 (first spraying step).

  After the conductive linear pattern 1a is formed on the plastic substrate 1 as described above, a mask 2A is arranged instead of the mask 2 as shown in FIG. In this mask 2A, a plurality of slits 2b extending in the direction orthogonal to the arrow A direction are provided at intervals in the same direction as the arrow A.

  The material of the mask 2A, the thickness of the mask 2, the width of the slit 2b, and the interval between the slits 2b are preferably approximately the same as those of the mask 2.

  Next, the high pressure gas is supplied into the container 5 from the high pressure gas pipe 7 and the nozzle 3 is moved in the direction of arrow A in FIG. Thereby, the conductive powder 6 in the container 5 is supplied to the nozzle 3 through the hose 4 and sprayed from the injection hole together with the high-pressure gas. The sprayed conductive powder 6 collides with the surface of the plastic substrate 1 through the slit 2b of the mask 2A, and is fixed on the substrate 1 by the collision energy. In this way, a plurality of conductive linear patterns 1b parallel to each other are formed on the surface of the plastic substrate 1 (second spraying step).

  In this way, as shown in FIG. 3, the electromagnetic wave shielding member 10 in which the lattice-like conductive pattern composed of the conductive linear pattern 1a and the conductive linear pattern 1b is formed on the surface of the plastic substrate 1 is manufactured.

  The width of the conductive linear pattern 1a is preferably 10 to 40 μm, particularly 20 to 30 μm. When the thickness is 30 μm or less, the conductive pattern can be thinned. When it is 20 μm or more, disconnection is prevented.

  The interval between the conductive linear patterns 1a is preferably 50 to 1000 μm, particularly preferably 100 to 500 μm. Electromagnetic wave shielding properties improve that it is 1000 micrometers or less. The transmittance | permeability of the electromagnetic wave shielding member obtained as it is 50 micrometers or more improves.

  The thickness of the conductive linear pattern 1a is preferably 2 to 20 μm, particularly 5 to 10 μm. Electromagnetic wave shielding properties improve that it is 2 micrometers or more. When the thickness is 20 μm or less, the visibility when the obtained electromagnetic wave shielding member is viewed from an oblique direction is improved.

  Moreover, it is preferable that the width | variety of this electroconductive linear pattern 1b, the space | interval of the electroconductive linear patterns 1b, and the thickness of the electroconductive linear pattern 1a are also comparable as said electroconductive linear pattern 1a.

  According to the manufacturing method of the electromagnetic wave shielding member 10 according to the present embodiment, since the conductive powder 6 is sprayed on the substrate 1 without being dispersed in an organic solvent or the like as in the ink jet method, the addition to the environment is simple and reduced. Thus, the electromagnetic wave shielding member 10 can be manufactured, and a conductive pattern having a large thickness can be easily manufactured.

  In addition, since the conductive powder 6 is sprayed from above the masks 2 and 2A, the electromagnetic wave shielding member 10 is more efficient than when the conductive linear patterns 1a and 1b are formed one by one without using the masks 2 and 2A. Can be manufactured.

  Furthermore, by using two types of masks 2 and 2A having different slit extending directions, a grid-like conductive pattern can be efficiently formed.

  The above embodiment is an example of the present invention, and the present invention is not limited to the above embodiment. For example, in the above embodiment, two types of masks having different slit extending directions are used in the first spraying step and the second spraying step, but the same mask may be used. In this case, after completion of the first spraying process, the mask is rotated so that the extending direction of the slit is angled with respect to the arrow direction A in FIG.

  In the above embodiment, the conductive linear pattern 1a and the conductive linear pattern 1b are orthogonal to each other. However, they may be crossed at an angle other than a right angle, or may be a conductive pattern of other shapes. .

  Hereinafter, the present invention will be described more specifically with reference to examples.

Example 1
The following were prepared as the substrate, mask and conductive powder.

Substrate: Polyester substrate (thickness 125 μm)
Mask: SiC mask
Slit width 10μm, space between adjacent slits 100μm
Conductive powder: Cu powder (average particle size 5 μm)

  An electromagnetic wave shielding member was manufactured using the apparatus shown in FIG. Specifically, a substrate was disposed below the nozzles, and a mask was disposed between these nozzles and the substrate. Then, conductive particles were sprayed from the nozzle while moving the nozzle in the direction of arrow A. Next, the mask 2 was rotated 90 ° so that the slits were orthogonal to the direction of arrow A, and conductive particles were sprayed from the nozzle while moving the nozzle in the direction of arrow A.

  As a result, a grid-like conductive pattern having a thickness of 5 μm, a width of 10 μm, and a space of 100 μm between adjacent lines could be formed on the substrate.

It is a schematic diagram explaining a 1st spraying process. It is a schematic diagram explaining a 2nd spraying process. It is a top view of the manufactured electromagnetic wave shielding member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a, 1b Conductive linear pattern 2 Mask 2a, 2b Slit 3 Nozzle 3a Lower end 4 Hose 5 Container 6 Conductive powder 7 High pressure gas piping

Claims (6)

In an electromagnetic wave shielding member in which a conductive pattern is formed on a plastic substrate,
The electromagnetic wave shielding member, wherein the conductive pattern is formed by spraying conductive powder from a nozzle toward the surface of the plastic substrate and fixing the conductive powder to the surface of the plastic substrate.   2. The electromagnetic wave shielding member according to claim 1, wherein the conductive powder is at least one selected from the group consisting of Cu powder, ZnO powder, Ag powder, Ni powder, and Pd powder. In a method of manufacturing an electromagnetic wave shielding member in which a conductive pattern is formed on a plastic substrate,
A method for producing an electromagnetic wave shielding member, comprising: a step of spraying conductive powder from a nozzle toward the surface of the plastic substrate and fixing the conductive powder to the surface of the plastic substrate.   In Claim 3, the surface of the said plastic substrate is covered with the mask which has a slit in the said spraying process, and the said conductive powder is sprayed from on this mask, The conductive pattern of the same shape as this slit is formed in this surface The manufacturing method of the electromagnetic wave shielding member characterized by doing. In Claim 4, the said spraying process contains the 1st spraying process and the 2nd spraying process,
In the first spraying step, the surface of the plastic substrate is covered with a first mask having a plurality of slits provided in parallel to each other, and the conductive powder is sprayed from above the first mask, so that a plurality of strips are formed. Forming a first conductive pattern consisting of
In the second step, the surface of the plastic substrate is covered with a second mask having a plurality of slits parallel to each other and forming an angle with the slits of the first mask, and from above the second mask. Spraying the conductive powder to form a second conductive pattern consisting of a plurality of lines,
A grid-like conductive pattern is formed on the surface of the plastic substrate by the first spraying step and the second spraying step. In Claim 4, the said spraying process contains the 1st spraying process and the 2nd spraying process,
In the first spraying step, the surface of the plastic substrate is covered with a mask having a plurality of slits provided in parallel to each other, and the conductive powder is sprayed from above the first mask. Forming a first conductive pattern comprising:
In the second step, the surface of the plastic substrate is covered with the mask so that the extending direction of the slit is different from that in the first step, and the conductive powder is sprayed on the mask. Forming a second conductive pattern comprising a plurality of lines,
A grid-like conductive pattern is formed on the surface of the plastic substrate by the first spraying process and the second spraying process.

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