JP2009161684A - Adhesive composition for use in circuit connection, and connection structure of circuit member and connecting method of circuit member by using the adhesive composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composition which is capable of reconciling an electrical connection characteristic of a low resistance and a high insulation property between the adjacent electrodes for a COG mount and a COF mount, and of preventing fully a panel warpage after mounting a liquid crystal driving IC on a liquid crystal display glass panel, and also of preventing fully a poor transcription in a process of transferring a circuit connection member on circuit members, and to provide a connection structure of circuit members and a connection method of the circuit members by using this adhesive composition. <P>SOLUTION: The adhesive composition, in a tensile peeling test between circuit members and an electrically conductive adhesive layer in a process of transferring an adhesive composition by pressure-sensitive adhering an electrically conductive adhesive layer onto circuit members in such a way as press-bonding it onto circuit members from a separator side under a given condition and as removing the separator, has an adhesion of 20-200 N/m at a test temperature of 23°C, a peeling angle of 90° and a peeling rate of 50 mm/min; and the connection structure of circuit members and the connecting method of the circuit members are provided by using the adhesive composition. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an adhesive composition for circuit connection, more specifically, an anisotropic conductive adhesive composition for circuit connection (hereinafter simply referred to as an adhesive composition), and a circuit member connection structure using the adhesive composition. In particular, the present invention relates to a circuit member connection structure and a circuit member connection method in CHIP-ON-GLASS mounting (hereinafter referred to as COG mounting) or CHIP-ON-FLEX (hereinafter referred to as COF mounting).

  The liquid crystal driving IC is mounted on the liquid crystal display glass panel by a COG mounting method in which the liquid crystal driving IC is directly bonded to the glass panel with a circuit connecting member, or the liquid crystal driving IC is bonded to a flexible tape having metal wiring. A COF mounting method in which the glass glass panel and the circuit connecting member are joined is used. Since it is difficult to connect the circuit members formed with these fine circuits with conventional solders or rubber connectors, an adhesive composition having anisotropic conductivity is used.

  On the other hand, with the recent high definition of liquid crystal displays, the density of circuit electrodes formed on circuit members is increasing. For this reason, circuit electrodes tend to be further miniaturized, that is, high definition such as multi-electrode and narrow pitch, and high connection reliability in high definition liquid crystal modules is required.

However, the conventional circuit connecting member has a problem that the conductive particles in the member flow out between the adjacent electrodes, causing a short circuit.
In addition, when the number of conductive particles in the member is reduced to avoid short circuit, the number of conductive particles in the circuit connection member captured between the bumps / panels decreases, resulting in an increase in connection resistance between circuits. However, there was a problem of causing poor connection.

  Therefore, in order to solve these problems, a method for preventing deterioration in bonding quality in COG mounting and COF mounting by forming an insulating adhesive layer on at least one surface of the circuit connecting member (for example, see Patent Document 1) A method of ensuring sufficient long-term insulation reliability between adjacent electrodes with conductive particles partially covered with insulating fine particles (for example, see Patent Document 2) has been devised.

However, in the above method, when increasing the filling amount of the particles in order to obtain a stable connection resistance value when the bump area is small, for example, less than 3000 μm ^2, it is conductive to the adhesive component of the circuit connection member. One of the circuit members, which is one of the steps of connecting the circuit members by reducing the adhesive force of the surface layer of the conductive adhesive layer containing the conductive particles as a result of increasing the proportion of particles occupied by volume. However, there is still room for improvement in that a transfer failure occurs in the process of transferring the circuit connecting member by sticking the conductive adhesive layer and removing the separator.

  Furthermore, when increasing the proportion of the epoxy resin in the adhesive component in order to improve the adhesiveness of the conductive adhesive layer, when mounting the liquid crystal driving IC on the liquid crystal display glass panel, the circuit after heating and pressurizing There is still room for improvement in terms of preventing deterioration in display quality due to panel warpage that may occur due to the high storage elastic modulus of the cured product of the connection member.

Japanese Patent Laid-Open No. 08-279371 Japanese Patent Laid-Open No. 2005-197089

  The present invention has been made in view of such circumstances, and can achieve both low resistance electrical connection characteristics and high insulation between adjacent electrodes for COG mounting and COF mounting, and to a glass panel for liquid crystal display. Adhesive composition that can sufficiently prevent panel warping after mounting a liquid crystal driving IC, and further can prevent transfer failure in a process of transferring a circuit connecting member to a circuit member, and this adhesive composition An object of the present invention is to provide a circuit member connection structure and a circuit member connection method using an object.

  The adhesive composition according to the present invention is an adhesive composition that is interposed between connecting terminals facing each other, presses circuit electrodes facing each other, and electrically connects the electrodes in the pressurizing direction. The conductive adhesive layer containing particles and the insulating adhesive layer are laminated, and the separator is in close contact with the insulating adhesive layer.

That is, the present invention relates to an adhesive composition in which a conductive adhesive layer containing conductive particles and an insulating adhesive layer are laminated, and the separator (support material) is in close contact with the insulating adhesive layer. The tension between the circuit member and the conductive adhesive layer in the step of adhering the conductive adhesive layer to the circuit member from the separator side under a predetermined condition and transferring the adhesive composition by removing the separator The present invention relates to an adhesive composition having an adhesion strength of 20 to 200 N / m at a test temperature of 23 ° C., a peel angle of 90 °, and a peel speed of 50 mm / min.
When the adhesive composition has the above-mentioned adhesive force, the separator composition can be peeled and removed without removing the adhesive composition from the circuit member when the separator is removed. It can be secured.

Further, according to the present invention, in the step of transferring the adhesive composition, the adhesion by a tensile peel test between the separator and the insulating adhesive layer is 4 to 4 at a test temperature of 23 ° C., a peel angle of 90 °, and a peel speed of 50 mm / min. The present invention relates to the above adhesive composition that is 40 N / m and is smaller than the adhesion between the circuit member and the conductive adhesive layer.
By adopting such a configuration, in the step of peeling and removing the separator, the adhesive composition does not remain on the separator side, and the adhesive composition is not peeled off or removed from the separator other than the transfer step. Can achieve the purpose.

The present invention also relates to the above adhesive composition, wherein the conductive adhesive layer containing the conductive particles contains a bisphenol F type liquid epoxy resin having a molecular weight of 1000 or less as an essential component.
According to this, the adhesiveness of the conductive adhesive layer can be improved without changing the ratio of the epoxy resin in the adhesive component, and the object of the present invention can be achieved to a higher degree.

Further, the present invention is the adhesive composition as described above, which is used for electrically connecting the connecting terminals facing each other, and the storage elasticity of the cured product of the adhesive composition at a frequency of 10 Hz at 40 ° C. It relates to the above-mentioned adhesive composition having a rate E ′ of 0.5 to 2.5 GPa.
By setting it as the above storage elastic modulus E ', the cohesion force of the component in the hardened | cured material of the adhesive composition after connecting a connection terminal improves, and internal stress reduces. Therefore, advantageous effects such as improvement in display quality, adhesive strength, and conduction characteristics of the mounted product can be obtained.

The present invention also relates to the above adhesive composition, wherein the insulating adhesive layer and / or the conductive adhesive layer includes a film forming material, an epoxy resin, and a latent curing agent.
According to this, the above-mentioned effect by this invention can be show | played more reliably.

  In the present invention, the first circuit member having the first connection terminal and the second circuit member having the second connection terminal are disposed so that the first connection terminal and the second connection terminal face each other. The adhesive composition is interposed between the first connection terminal and the second connection terminal arranged opposite to each other, and the first connection terminal and the second connection terminal arranged opposite to each other are electrically heated by pressing. The present invention relates to a connection structure for circuit members to be connected.

  The adhesive composition is obtained by adhering the conductive adhesive layer to one circuit member in the pre-process of the connection process from the separator side under a predetermined condition, thereby removing the separator. Provides a connection structure in which the adhesion force by the tensile peel test between the circuit member and the conductive adhesive layer is 20 to 200 N / m at a test temperature of 23 ° C., a peel angle of 90 °, and a peel speed of 50 mm / min. Therefore, according to such a circuit member connection structure, since the adhesive composition according to the present invention is used, good electrical connection and long-term connection reliability can be ensured.

The present invention also relates to the above circuit terminal connection structure, wherein at least one of the first and second circuit members is an IC chip.
Further, according to the present invention, at least one surface of the first and second connection terminals has gold, silver, tin, platinum group metal, aluminum, titanium, molybdenum, chromium, indium-tin oxide (ITO). In addition, the present invention relates to a connection structure of the above circuit members constituted of at least one selected from the group consisting of indium zinc oxide (IZO).

  Further, in the present invention, at least one surface of the first and second circuit members is coated or adhered with at least one selected from the group consisting of silicon nitride, silicone compound, and polyimide resin. The present invention relates to a circuit member connection structure.

  Further, in the present invention, the first circuit member having the first connection terminal and the second circuit member having the second connection terminal are arranged so that the first connection terminal and the second connection terminal face each other. Then, the adhesive composition described above is interposed between the first connection terminal and the second connection terminal arranged opposite to each other, and the first connection terminal and the second connection arranged opposite to each other by heating and pressing. The present invention relates to a circuit member connection method characterized by electrically connecting terminals.

  The adhesive composition is formed by adhering the conductive adhesive layer by pressure bonding from one side of the separator to the one circuit member in the previous step of the connecting step, and removing the separator. The connection method in which the adhesion force by the tensile peel test between the circuit member and the conductive adhesive layer when transferring the composition is 20 to 200 N / m at a test temperature of 23 ° C., a peel angle of 90 °, and a peel speed of 50 mm / min. According to such a circuit member connection method, since the adhesive composition according to the present invention is used, good electrical connection and long-term connection reliability can be ensured.

  According to the present invention, compared to COG mounting and COF mounting, low resistance electrical connection can be obtained at a microelectrode, and panel warpage after a liquid crystal driving IC is mounted on a liquid crystal display glass panel is sufficiently generated. Provided are an adhesive composition that can be prevented, and can improve workability in a mounting process, shorten work time, and reduce the occurrence of defects, a circuit member connection structure using the adhesive composition, and a circuit member connection method be able to.

  Hereinafter, the best mode for carrying out the invention will be described in detail. However, the present invention is not limited to the best mode described below, and various modifications can be made without departing from the scope of the invention.

  The present invention relates to an adhesive composition for circuit connection in which a conductive adhesive layer containing conductive particles and an insulating adhesive layer are laminated, and the separator is in close contact with the insulating adhesive layer. In accordance with a tensile peel test between the circuit member and the conductive adhesive layer in the step of adhering the conductive adhesive layer by pressure bonding from the separator side with respect to the separator and transferring the adhesive composition by removing the separator It provides an adhesive composition having an adhesion force of 20 to 200 N / m at a test temperature of 23 ° C., a peeling angle of 90 °, and a peeling speed of 50 mm / min.

  According to the adhesive composition of the present invention, a low resistance electrical connection can be obtained at a microelectrode for COG mounting and COF mounting, and a liquid crystal driving IC is mounted on a liquid crystal display glass panel. Panel warpage is sufficiently prevented, and workability in the mounting process can be improved, working time can be shortened, and occurrence of defects can be reduced.

  From the same viewpoint, the value of the adhesion force is in the range of 20 to 200 N / m, preferably 50 to 150 N / m. When the value of the adhesion force is within the above numerical range, the circuit connection member is removed from the circuit member when the separator is removed in the transfer process of the circuit connection member as compared with the case where this value is less than 20 N / m. The object according to the present invention can be achieved without peeling and dropping.

  Further, since the value of the adhesion force is within the above numerical range, it is easy to physically remove the adhesive composition by peeling as necessary, as compared with the case where this value exceeds 200 N / m, and Back surface transfer at the time of winding and maintaining a shape with a separator can be prevented, and the object of the present invention can be achieved.

  That is, if it is less than 20 N / m, the adhesive composition peels off from the circuit member when the separator is removed, and transfer failure occurs, which is not preferable. On the other hand, when it exceeds 200 N / m, for example, when the adhesive composition transferred to recycle the same circuit member needs to be removed due to a defect in a process after the transfer, the adhesive composition It is not preferable because physical removal by peeling is difficult, and when the shape of the product is kept in the state where the adhesive composition with a separator is wound up, the conductive adhesive layer is transferred to the separator on the back surface to transfer it. Since the adhesive composition may be peeled off or removed from the separator outside the process, it is not preferable.

In the adhesive composition for circuit connection, the adhesion strength by the peel test between the separator and the insulating adhesive layer is 4 to 40 N / m at a test temperature of 23 ° C., a peel angle of 90 ° and a peel speed of 50 mm / min, and It is preferable that it is smaller than the adhesion between the circuit member and the conductive adhesive layer.
Moreover, it is preferable that the conductive adhesive layer in the adhesive composition for circuit connection contains a bisphenol F type liquid epoxy resin having a molecular weight of 1000 or less.

Examples of the conductive particles used in the present invention include metal particles such as gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder, and carbon, and carbon to obtain a sufficient pot life. For the surface layer, precious metals such as Au, Ag, and white metal are preferable, and Au is more preferable, instead of transition metals such as Ni and Cu.
Alternatively, the surface of a transition metal such as Ni may be coated with a noble metal such as Au.

  In addition, when the conductive layer is formed on a non-conductive glass, ceramic, plastic, or the like by a method such as coating, and the outermost layer is a noble metal or a hot-melt metal particle, it is deformable by heating and pressing. Therefore, the contact area with the electrode is increased at the time of connection, which is preferable because reliability is improved.

In order to obtain a good resistance, it is preferable that the thickness of the coating layer in the case where the surface of the non-conductive substance is coated with a noble metal is 100 angstroms or more.
In addition, when a layer of noble metals is provided on the surface of a transition metal such as Ni, free radicals are generated and stored by redox action caused by defects in the noble metals layer or defects in the noble metal layer generated when mixing and dispersing conductive particles. There is a risk of causing deterioration. Therefore, the thickness of the coating layer is preferably 300 angstroms or more.

  In addition, since the above-mentioned effect will be saturated when the thickness of a coating layer will be 1 micrometer or more, it is desirable that the thickness of a coating layer is less than 1 micrometer, but this does not restrict | limit the thickness of a coating layer. The conductive particles may be used alone or in combination of two or more.

  Such conductive particles are properly used depending on the application within a range of 0.1 to 30 parts by volume with respect to 100 parts by volume of the adhesive resin component. In order to prevent a short circuit of an adjacent circuit due to excessive conductive particles, the content is more preferably 0.1 to 10 parts by volume.

  The insulating adhesive layer and the conductive adhesive layer preferably contain a film forming material, an epoxy resin, and a latent curing agent. According to this, the above-mentioned effect by this invention can be show | played more reliably.

  The film-forming material used in the present invention is, for example, when the liquid is solidified and the constituent composition is made into a film shape, the film is easy to handle, mechanical properties that are not easily torn, cracked, and sticky, etc. And can be handled as a film in a normal state.

  Specific examples thereof include phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin and the like. These are used singly or in combination of two or more. Among these, a phenoxy resin is particularly preferable because of excellent adhesion, compatibility, heat resistance, and mechanical strength.

  The phenoxy resin is a resin obtained by reacting a bifunctional phenol and epahalohydrin to a high molecular weight or by polyadding a bifunctional epoxy resin and a bifunctional phenol. Specifically, it is obtained by reacting 1 mol of a bifunctional phenol and epihalohydrin 0.985 to 1.015 in a non-reactive solvent at a temperature of 40 to 120 ° C. in the presence of an alkali metal hydroxide. Can do.

  In addition, from the viewpoint of the mechanical properties and thermal properties of the resin, in particular, the blending equivalent ratio of the bifunctional epoxy resin and the bifunctional phenol is represented by epoxy group / phenol hydroxyl group = 1 / 0.9 to 1/1. .1 in an organic solvent such as an amide, ether, ketone, lactone, or alcohol having a boiling point of 120 ° C. or higher in the presence of a catalyst such as an alkali metal compound, an organic phosphorus compound, or a cyclic amine compound. The reaction solid content is preferably 50 parts by weight or less and obtained by polyaddition reaction by heating to 50 to 200 ° C.

  Examples of the bifunctional epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, biphenyl diglycidyl ether, and methyl-substituted biphenyl diglycidyl ether.

  Bifunctional phenols have two phenolic hydroxyl groups. Examples of the bifunctional phenols include hydroquinones, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, bisphenol fluorene, methyl-substituted bisphenol fluorene, bisphenols such as dihydroxybiphenyl and methyl-substituted dihydroxybiphenyl.

  The phenoxy resin may be modified (for example, epoxy-modified) with a radical polymerizable functional group or other reactive compound. In addition, a phenoxy resin may be used independently or may be used in mixture of 2 or more types.

  Epoxy resins used in the present invention include bisphenol-type epoxy resins derived from epichlorohydrin and bisphenol A, F, AD, etc., epoxide novolak resins derived from epichlorohydrin and phenol novolac or cresol novolac, and skeletons containing a naphthalene ring. It is possible to use various epoxy compounds having two or more glycidyl groups in one molecule such as naphthalene-based epoxy resin, glycidylamine, glycidyl ether, biphenyl, alicyclic, etc., alone or in admixture of two or more. Is possible.

For these epoxy resins, it is preferable to use a high-purity product in which impurity ions (Na ⁺ , Cl ^−, etc.), hydrolyzable chlorine and the like are reduced to 300 ppm or less to prevent electron migration.

  The latent curing agent used in the present invention is not particularly limited as long as it can cure an epoxy resin. Examples of such latent curing agents include anionic polymerizable catalyst-type curing agents and cationic polymerizable catalysts. Mold curing agents, polyaddition curing agents, and the like. These can be used alone or as a mixture of two or more. Of these, anionic or cationic polymerizable catalyst-type curing agents are preferred because they are excellent in rapid curability and do not require chemical equivalent considerations.

  Examples of the anionic or cationic polymerizable catalyst-type curing agent include imidazole, hydrazide, boron trifluoride-amine complex, sulfonium salt, amine imide, diaminomaleonitrile, melamine and derivatives thereof, polyamine salt, dicyandiamide and the like. These modifications can also be used. Examples of the polyaddition type curing agent include polyamines, polymercaptans, polyphenols, and acid anhydrides.

  When a tertiary amine or imidazole is compounded as an anionic polymerization type catalyst-type curing agent, the epoxy resin is cured by heating at a medium temperature of about 160 ° C. to 200 ° C. for several tens of seconds to several hours. For this reason, the pot life is relatively long, which is preferable.

  As the cationic polymerization type catalyst-type curing agent, for example, a photosensitive onium salt (an aromatic diazonium salt, an aromatic sulfonium salt or the like is mainly used) that cures an epoxy resin by irradiation with energy rays is preferable.

  In addition to irradiation with energy rays, aliphatic sulfonium salts and the like are activated by heating to cure the epoxy resin. This type of curing agent is preferable because it has a feature of fast curing.

  When these latent hardeners are coated with polymer materials such as polyurethane or polyester, metal thin films such as nickel and copper, and inorganic materials such as calcium silicate, the pot life is extended. This is preferred because

  In the adhesive composition according to the present invention, a polymer or copolymer having at least one of acrylic acid, acrylic acid ester, methacrylic acid ester or acrylonitrile as a monomer component can be used, and a glycidyl ether group can be used. It is preferable to use a copolymer acrylic rubber containing glycidyl acrylate or glycidyl methacrylate in combination because it is excellent in stress relaxation. The molecular weight of these acrylic rubbers (weight average molecular weight in terms of polystyrene by size exclusion chromatography) is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive.

  The adhesive composition according to the present invention further includes a filler, a softener, an accelerator, an anti-aging agent, a flame retardant, a dye, a thixotropic agent, a coupling agent, a phenol resin, a melamine resin, isocyanates, and the like. Can also be contained.

  The inclusion of a filler is preferable because improvement in connection reliability and the like can be obtained. If the maximum diameter of a filler is less than the particle size of an electroconductive particle, it can be used, and the range of 5-60 volume parts (with respect to 100 volume parts of adhesive resin components) is preferable. If it exceeds 60 parts by volume, the effect of improving the reliability may be saturated, and if it is less than 5 parts by volume, the effect of addition is small.

  As the coupling agent, ketimine, vinyl group, acrylic group, amino group, epoxy group and isocyanate group-containing material are preferable from the viewpoint of improving adhesiveness. Specifically, as the silane coupling agent having an amino group, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane. Examples include ethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, and the like.

  Examples of the silane coupling agent having ketimine include those obtained by reacting the above silane coupling agent having an amino group with a ketone compound such as acetone, methyl ethyl ketone, and methyl isobutyl ketone.

  The cured product of the above-described adhesive composition preferably has a storage elastic modulus E ′ of 40 ° C. and a frequency of 10 Hz of 0.5 to 2.5 GPa, and more preferably 1.0 to 2.0 GPa. In this way, compared with the case where the storage elastic modulus is outside the above range, the cohesive force of the components in the cured product of the adhesive composition after connecting the connection terminals is improved, and the internal stress is reduced. To do. Therefore, advantageous effects such as improvement in display quality, adhesive strength and conduction characteristics of a mounted product using the adhesive composition can be obtained.

  When the storage elastic modulus is less than 0.5 GPa, the cohesive force of the components in the cured product of the adhesive composition is lower than that in the above range, and the connection portion when connecting the circuit members is low. Electrical resistance tends to increase. In addition, when the storage elastic modulus exceeds 2.5 GPa, the cohesive force of the components in the cured product of the adhesive composition is too high compared with the case where it is in the above range, so that the panel warpage preventing effect of the mounted product is obtained. There is a tendency to decrease.

  The adhesive composition of the present invention that satisfies the numerical range of the adhesion force between the circuit member and the conductive adhesive layer is, for example, applying a bisphenol F type liquid epoxy resin having a molecular weight of 1000 or less to the conductive adhesive layer, or DSC. The glass transition temperature (Tg) derived by measurement (temperature increase rate: 10 ° C./min) can be obtained by applying a low Tg phenoxy resin having a temperature of 80 ° C. or less.

  The adhesive composition according to the present invention can also be used as a film adhesive for adhesion between an IC chip and a chip mounting substrate or between electric circuits. That is, the first circuit member having the first connection terminal and the second circuit member having the second connection terminal are arranged so that the first connection terminal and the second connection terminal are opposed to each other, and the opposing The adhesive composition (adhesive film) of the present invention is interposed between the arranged first connection terminal and the second connection terminal, and the first connection terminal and the second connection terminal arranged opposite to each other by heating and pressing. Can be electrically connected.

As such a circuit member, a chip component such as a semiconductor chip, a resistor chip or a capacitor chip, or a substrate such as a printed board is used.
These circuit members are usually provided with a large number of connection terminals (or a single connection terminal in some cases), and at least one set of the circuit members is opposed to at least a part of the connection terminals provided on the circuit members. The circuit board is obtained by electrically connecting the connection terminals disposed opposite to each other by heating and pressing the adhesive of the present invention between the connection terminals disposed and opposed to each other.

  By heating and pressurizing at least one set of circuit members, the connection terminals arranged opposite to each other can be electrically connected by direct contact or via conductive particles in the adhesive composition.

  The adhesive composition according to the present invention can also be used as a film-like adhesive for bonding a flexible tape or glass substrate to an IC chip in COG mounting or COF mounting. That is, the first circuit member having the first connection terminal and the second circuit member having the second connection terminal are arranged so that the first connection terminal and the second connection terminal are opposed to each other, and the opposing The adhesive composition (adhesive film) of the present invention is interposed between the arranged first connection terminal and the second connection terminal, and the first connection terminal and the second connection terminal arranged opposite to each other by heating and pressing. Can be electrically connected.

  The circuit terminal connection method according to the present invention comprises the anisotropic conductive adhesive composition for circuit connection according to the present invention, wherein the surface of the connection terminal is gold, silver, tin, a platinum group metal, indium-tin oxide ( (ITO) and indium-zinc oxide (IZO) are formed on connection terminals (electrode circuits) made of at least one kind, and then the other connection terminals (circuit electrodes) are aligned, heated and pressurized to be connected. be able to. At this time, light may be irradiated from one circuit member side.

  In the present invention, the flexible tape is particularly good for a circuit member coated or attached with an organic insulating material such as polyimide resin, and the surface of the glass substrate is at least one selected from silicon nitride, silicone compound, polyimide resin, and silicone resin. It is possible to provide an electrical / electronic adhesive composition that can provide adhesive strength.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not restrict | limited to this. In the following Examples, bisphenol A type phenoxy resin is manufactured by Inchem Corporation, trade name “PKHC”, and bisphenol A / F type copolymer type phenoxy resin is manufactured by Toto Kasei Co., Ltd., with trade name “ZX-”. 1355-2 ”, low Tg phenoxy resin, manufactured by Inchem Corporation, trade name“ PKHM-301 ”, and aromatic sulfonium salt, manufactured by Sanshin Chemical Co., Ltd., trade name“ Sun Aid SI-60L ”were used. .

Example 1
50 g of bisphenol A type phenoxy resin is dissolved in a mixed solvent of toluene (boiling point 110.6 ° C., SP value 8.90) and ethyl acetate (boiling point 77.1 ° C., SP value 9.10) having a mass ratio of 50:50. Then, a first solution having a solid content of 40% by mass was prepared, and 50 g of bisphenol A / F copolymer phenoxy resin was dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to obtain a solid content of 45%. A mass% second solution was obtained.

  The first and second solutions described above were mixed, and a bisphenol A type liquid epoxy resin was further added to the mixed solution. These were blended so that bisphenol A type phenoxy resin: bisphenol A / F copolymerization type phenoxy resin: bisphenol A type liquid epoxy had a solid content mass ratio of 30:30:40 to prepare an adhesive composition-containing liquid. . To the obtained adhesive composition-containing liquid, 2.4 g of an aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connection material-containing liquid.

  And after apply | coating this circuit connection material containing liquid to the polyethylene terephthalate (PET) film of 50 micrometers in thickness which carried out the surface treatment of one side using a coating apparatus, it is thickness on PET film by hot-air drying for 5 minutes at 70 degreeC. A film-like circuit connecting material (insulating adhesive layer) having a thickness of 10 μm was obtained.

  Moreover, the above-mentioned 1st and 2nd solution was mixed and the bisphenol A type liquid epoxy resin and the bisphenol F type liquid epoxy resin were further mix | blended with the liquid mixture. These are blended so that the bisphenol A type phenoxy resin: bisphenol A / F copolymer type phenoxy resin: bisphenol A type liquid epoxy: bisphenol F type liquid epoxy has a solid content mass ratio of 30: 30: 20: 20, and is bonded. An agent composition-containing liquid was prepared. 10 vol% of conductive particles were mixed and dispersed in the obtained adhesive composition-containing liquid, and 2.4 g of aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connecting material-containing liquid.

And after apply | coating this circuit connection material containing liquid to the 75-micrometer-thick polyethylene terephthalate (PET) film which surface-treated one side using a coating apparatus, thickness is formed on PET film by hot-air drying for 70 degreeC for 5 minutes. A 10 μm film-like circuit connecting material (conductive adhesive layer) was obtained.
The formed insulating adhesive layer and conductive adhesive layer were bonded using a laminator to obtain an adhesive film sandwiched between PET films.

(Example 2)
An adhesive film with a PET film was obtained in the same manner as in Example 1 except that the formation of the conductive adhesive layer was changed as follows.
50 g of bisphenol A type phenoxy resin is dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to form a first solution having a solid content of 40% by mass, while 50 g of bisphenol A / F copolymer type phenoxy resin is obtained. Was dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to obtain a second solution having a solid content of 45% by mass.

  The first and second solutions described above were mixed, and a bisphenol F type liquid epoxy resin was further added to the mixed solution. These were blended such that bisphenol A type phenoxy resin: bisphenol A / F copolymerization type phenoxy resin: bisphenol F type liquid epoxy had a solid content mass ratio of 30:30:40 to prepare an adhesive composition-containing liquid. .

  10 vol% of conductive particles were mixed and dispersed in the obtained adhesive composition-containing liquid, and 2.4 g of aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connecting material-containing liquid. And after apply | coating this circuit connection material containing liquid to the 75-micrometer-thick polyethylene terephthalate (PET) film which surface-treated one side using a coating device, it dried by hot-air drying at 70 degreeC for 5 minutes on PET film. A film-like circuit connecting material (conductive adhesive layer) having a thickness of 10 μm was obtained.

(Example 3)
An adhesive film with a PET film was obtained in the same manner as in Example 1 except that the formation of the conductive adhesive layer was changed as follows.
50 g of bisphenol A type phenoxy resin is dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to form a first solution having a solid content of 40% by mass, while 50 g of bisphenol A / F copolymer type phenoxy resin is obtained. Was dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to obtain a second solution having a solid content of 45% by mass.

  The first and second solutions described above were mixed, and a bisphenol F type liquid epoxy resin was further added to the mixed solution. These were blended so that bisphenol A type phenoxy resin: bisphenol A / F copolymerization type phenoxy resin: bisphenol F type liquid epoxy had a solid mass ratio of 25:25:50, and an adhesive composition-containing liquid was prepared. .

  10 vol% of conductive particles were mixed and dispersed in the obtained adhesive composition-containing liquid, and 2.4 g of aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connecting material-containing liquid. And after apply | coating this circuit connection material containing liquid to the 75-micrometer-thick polyethylene terephthalate (PET) film which surface-treated one side using a coating device, it dried by hot-air drying at 70 degreeC for 5 minutes on PET film. A film-like circuit connecting material (conductive adhesive layer) having a thickness of 10 μm was obtained.

Example 4
An adhesive film with a PET film was obtained in the same manner as in Example 1 except that the formation of the conductive adhesive layer was changed as follows.
50 g of low Tg phenoxy resin is dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to form a first solution having a solid content of 40% by mass, while 50 g of bisphenol A / F copolymer phenoxy resin is added. And dissolved in a mixed solvent of toluene and ethyl acetate at a mass ratio of 50:50 to obtain a second solution having a solid content of 45% by mass.

  The first and second solutions described above were mixed, and a bisphenol A type liquid epoxy resin and a bisphenol F type liquid epoxy resin were further added to the mixed solution. These are blended so that the low Tg phenoxy resin: bisphenol A / F copolymerization type phenoxy resin: bisphenol A type liquid epoxy: bisphenol F type liquid epoxy has a solid content mass ratio of 30: 30: 20: 20, and an adhesive. A composition-containing liquid was prepared.

  10 vol% of conductive particles were mixed and dispersed in the obtained adhesive composition-containing liquid, and 2.4 g of aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connecting material-containing liquid. And after apply | coating this circuit connection material containing liquid to the 75-micrometer-thick polyethylene terephthalate (PET) film which surface-treated one side using a coating apparatus, thickness is formed on PET film by hot-air drying for 70 degreeC for 5 minutes. A 10 μm film-like circuit connecting material (conductive adhesive layer) was obtained.

(Comparative Example 1)
An adhesive film with a PET film was obtained in the same manner as in Example 1 except that the formation of the conductive adhesive layer was changed as follows.
50 g of bisphenol A type phenoxy resin is dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to form a first solution having a solid content of 40% by mass, while 50 g of bisphenol A / F copolymer type phenoxy resin Was dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to obtain a second solution having a solid content of 45% by mass.

  The first and second solutions described above were mixed, and a bisphenol F type liquid epoxy resin was further added to the mixed solution. These were blended so that bisphenol A type phenoxy resin: bisphenol A / F copolymerization type phenoxy resin: bisphenol A type liquid epoxy had a solid content mass ratio of 30:30:40 to prepare an adhesive composition-containing liquid. .

  10 vol% of conductive particles were mixed and dispersed in the obtained adhesive composition-containing liquid, and 2.4 g of aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connecting material-containing liquid. And after apply | coating this circuit connection material containing liquid to the 75-micrometer-thick polyethylene terephthalate (PET) film which surface-treated one side using a coating apparatus, thickness is formed on PET film by hot-air drying for 70 degreeC for 5 minutes. A 10 μm film-like circuit connecting material (conductive adhesive layer) was obtained.

(Comparative Example 2)
An adhesive film with a PET film was obtained in the same manner as in Example 1 except that the formation of the conductive adhesive layer was changed as follows.
50 g of low Tg phenoxy resin is dissolved in a mixed solvent of toluene and ethyl acetate having a mass ratio of 50:50 to form a first solution having a solid content of 40% by mass, while 50 g of bisphenol A / F copolymer phenoxy resin is added. And dissolved in a mixed solvent of toluene and ethyl acetate at a mass ratio of 50:50 to obtain a second solution having a solid content of 45% by mass.

  The first and second solutions described above were mixed, and a bisphenol F type liquid epoxy resin was further added to the mixed solution. These were blended so that the low Tg phenoxy resin: bisphenol A / F copolymerization type phenoxy resin: bisphenol F type liquid epoxy had a solid content mass ratio of 30:20:50 to prepare an adhesive composition-containing liquid.

  10 vol% of conductive particles were mixed and dispersed in the obtained adhesive composition-containing liquid, and 2.4 g of aromatic sulfonium salt was added as a latent curing agent to prepare a circuit connecting material-containing liquid. And after apply | coating this circuit connection material containing liquid to the 75-micrometer-thick polyethylene terephthalate (PET) film which surface-treated one side using a coating apparatus, thickness is formed on PET film by hot-air drying for 70 degreeC for 5 minutes. A 10 μm film-like circuit connecting material (conductive adhesive layer) was obtained.

(Transfer of adhesive film to circuit member)
Using the adhesive films of Examples 1 to 4 and Comparative Examples 1 and 2, the adhesive film was transferred to the circuit member. Specifically, the adhesive film was first cut into a predetermined size (2.5 mm × 30 mm), and the PET film on the conductive adhesive layer side was peeled and removed to expose the surface of the conductive adhesive layer.

  Next, an ITO film is formed by vapor deposition on a glass with a thickness of 0.5 mm, and the surface of the conductive adhesive layer of the adhesive film is opposed to the surface of the ITO film using an ITO substrate (surface resistance <20Ω □). Then, the adhesive film was temporarily fixed to the ITO substrate by applying heat and pressure from the separator side in the laminating direction under the conditions of 70 ° C., 1 MPa, and 2 seconds.

Thereafter, the other PET film was peeled off from the adhesive film to produce a circuit member to which the adhesive film was transferred.
The above transfer process was performed 10 times for each example and comparative example, and the number of successful transfers was recorded. The results are shown in Table 1.

(Measurement of adhesion between circuit members and conductive adhesive layers)
Using the circuit member described above, the adhesion force between the circuit member and the conductive adhesive layer was measured. Specifically, first, an adhesive tape having a predetermined size (2.0 mm × 25 mm) is stuck on the surface of the adhesive film on the circuit member so as not to stretch during the tensile test so as not to protrude from the adhesive film. Was measured together with an adhesive tape using a tensile tester at a test temperature of 23 ° C., a peel angle of 90 °, and a peel rate of 50 mm / min, and the measured values were converted to N / m. The results are shown in Table 1.

(Measurement of adhesion between separator and insulating adhesive layer)
Using the circuit member to which the adhesive film before the PET film was peeled and removed in the above-mentioned circuit member was used, the adhesion between the separator and the insulating adhesive layer was measured. Using a tensile tester, the separator was peeled from the adhesive film at a test temperature of 23 ° C., a peel angle of 90 °, and a peel speed of 50 mm / min, and the measured value was converted to N / m. The results are shown in Table 1.

(Evaluation of back transfer phenomenon)
The back surface transfer phenomenon was evaluated using the adhesive films of Examples 1 to 4 and Comparative Examples 1 and 2. Specifically, after peeling off and removing the PET film on the conductive adhesive layer side of each adhesive film, the adhesive film was cut into a predetermined size (1.5 mm × 100 m) and wound into a reel product shape.

  Next, the reel product is left in an environmental test bath at 30 ° C. and 70% RH for one day, and the adhesive film with a separator is pulled out from the reel after the stand at a speed of 0.1 m / s, and the adhesive film is formed by rear surface transfer. The presence or absence of peeling or dropping off from the separator was confirmed. The results are shown in Table 1.

Claims (10)

  In an adhesive composition for circuit connection, wherein a conductive adhesive layer containing conductive particles and an insulating adhesive layer are laminated, and a separator (support material) is in close contact with the insulating adhesive layer, a circuit member By the tensile peeling test between the circuit member and the conductive adhesive layer in the process of sticking the conductive adhesive layer by pressure bonding from the separator side under a predetermined condition and transferring the adhesive composition by removing the separator An adhesive composition for circuit connection having an adhesion force of 20 to 200 N / m at a test temperature of 23 ° C., a peeling angle of 90 °, and a peeling speed of 50 mm / min.   In the step of transferring the adhesive composition, the adhesion by the tensile peel test between the separator and the insulating adhesive layer is 4 to 40 N / m at a test temperature of 23 ° C., a peel angle of 90 °, and a peel speed of 50 mm / min. The adhesive composition for circuit connection according to claim 1, wherein the adhesive composition is smaller than the adhesion between the circuit member and the conductive adhesive layer.   The adhesive composition for circuit connection according to claim 1 or 2, wherein the conductive adhesive layer containing the conductive particles contains a bisphenol F type liquid epoxy resin having a molecular weight of 1000 or less as an essential component.   The adhesive composition according to any one of claims 1 to 3, wherein the adhesive composition is used for electrically connecting the connection terminals facing each other, and the cured product of the adhesive composition is stored at a frequency of 10 Hz at 40 ° C. The adhesive composition for circuit connection according to any one of claims 1 to 3, wherein the elastic modulus E 'is 0.5 to 2.5 GPa.   The adhesive composition for circuit connection according to any one of claims 1 to 4, wherein the insulating adhesive layer and / or the conductive adhesive layer contains a film forming material, an epoxy resin, and a latent curing agent.   The first circuit member having the first connection terminal and the second circuit member having the second connection terminal are arranged so that the first connection terminal and the second connection terminal are opposed to each other, and the first and second connection members are arranged to face each other Between the one connection terminal and the second connection terminal, the adhesive composition for circuit connection according to any one of claims 1 to 5 is interposed, and the first connection terminal and the first arranged opposite to each other by heating and pressing. A circuit member connection structure for electrically connecting two connection terminals.   The circuit member connection structure according to claim 6, wherein at least one of the first and second circuit members is an IC chip.   At least one surface of the first and second connection terminals is made of gold, silver, tin, platinum group metal, aluminum, titanium, molybdenum, chromium, indium-tin oxide (ITO), and indium-zinc oxide. The circuit member connection structure according to claim 6 or 7, comprising at least one selected from the group consisting of (IZO).   The surface of at least one among said 1st and 2nd circuit members is a coating or adhesion process by at least 1 type chosen from the group which consists of a silicon nitride, a silicone compound, and a polyimide resin. The connection structure of the circuit member described in 1.   The first circuit member having the first connection terminal and the second circuit member having the second connection terminal are arranged to face each other after the first connection terminal and the second connection terminal are arranged to face each other. Between the first connection terminal and the second connection terminal, the adhesive composition for circuit connection according to any one of claims 1 to 5 is interposed, and the first connection terminal disposed oppositely by heating and pressurizing. A circuit member connection method, wherein the second connection terminal is electrically connected.