JP2009160652A - High frequency induction heating apparatus, high frequency induction coil and heating method using magnetic material - Google Patents
High frequency induction heating apparatus, high frequency induction coil and heating method using magnetic material Download PDFInfo
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Abstract
【課題】自己発熱を軽減する高周波誘導コイルと磁性体を提供する。
【解決手段】高周波誘導加熱装置本体１に、透磁率が高く高周波領域での過電流損失の効率の高い磁性体１５を高周波誘導コイル１２の中に設け、循環型冷却水を備えた冷却ケースカバー１９を設け、発振コイルブロックカバー１４を装着したことを特徴とする高周波誘導加熱装置である。
【選択図】図１A high-frequency induction coil and a magnetic body that reduce self-heating are provided.
A high-frequency induction heating apparatus main body is provided with a magnetic body having a high magnetic permeability and a high efficiency of overcurrent loss in a high-frequency region in a high-frequency induction coil, and a cooling case cover provided with circulating cooling water. 19 is a high-frequency induction heating device characterized in that an oscillation coil block cover 14 is provided.
[Selection] Figure 1
Description
本発明は、高周波誘導加熱装置本体からなる高周波誘導コイルの中に磁性体を設け、自己発熱を軽減する為の冷却用の冷却水入口と冷却水出口及び高周波誘導加熱放出口を備えた冷却ケースカバーを設け、磁性体を設けた高周波誘導コイルを冷却ケースカバーに嵌入し、発振コイルブロックカバーに装着した高周波誘導加熱装置および高周波誘導加熱装置に用いる高周波誘導コイルにおいて被加熱体を部分的に加熱する為のシールド孔を設けたシールド板を高周波誘導コイルと被加熱体の間に設け、磁界を被加熱体が受ける面積を制限し加熱する加熱方法と高周波誘導加熱において、高周波誘導コイルの端面にて非接触で高周波誘導加熱を行う為の高周波誘導コイルと磁性体に関するものである。 The present invention provides a cooling case provided with a magnetic body in a high-frequency induction coil comprising a high-frequency induction heating device main body and having a cooling water inlet, a cooling water outlet, and a high-frequency induction heating discharge port for reducing self-heating. A high frequency induction coil provided with a cover and a magnetic material is fitted into the cooling case cover, and the object to be heated is partially heated in the high frequency induction heating device mounted on the oscillation coil block cover and the high frequency induction heating device. In a heating method and a high frequency induction heating in which a shield plate provided with a shield hole is provided between the high frequency induction coil and the heated body and the area to which the heated body is subjected is limited and heated, the end face of the high frequency induction coil The present invention relates to a high-frequency induction coil and a magnetic body for non-contact high-frequency induction heating.
（イ）従来、高周波誘導加熱装置及び加熱方法は、高周波電源とそれに直結接続された高周波誘導コイル（以下：コイル）を用い、コイルより発生する磁束により、披加熱体へ渦電流を誘導しその渦電流が被加熱体内部で流れる事による発熱を利用した加熱方法があった。
（ロ）図６を用いて、特許公開平１０−３２８８２０の高周波誘導加熱を用いた「ハンダコテの加熱構造およびハンダ付け装置」の例である。
これは、ハンダコテ１の内部には、コイル５６が巻回されたヒータ部となる特殊合金５７が配置されており、コイル５６は、図示しない高周波電源に接続されている。このコイル５６で特殊金属５７が加熱されハンダコテ１のコテ先へと熱伝導が行われハンダ付けが行われている、外部へ金属を用いた熱伝導で「接触型」の高周波誘導加熱の例で加熱の実施例であり、従来の高周波誘導加熱を用いたコテ先の加熱方法であった。
（ハ）その他［特許文献］抜粋による、
特許公開平１１−１０３２５［発明の名称］高周波誘導過熱式はんだ付け装置
特許公開平１１−２２１６７０［発明の名称］ハンダ鏝及び鏝先部材
特許公開２００４−３５１５０３［発明の名称］アルミニウム材のろう付方法及びろう付装置
特許公開平６−２９７１３７［発明の名称］ろう付用高周波誘導コイルとこれを用いたろう付方法などがあった。(B) Conventionally, a high-frequency induction heating apparatus and heating method uses a high-frequency power source and a high-frequency induction coil (hereinafter referred to as a coil) directly connected thereto, and induces eddy currents to the heating element by magnetic flux generated from the coil. There was a heating method using heat generated by eddy current flowing inside the object to be heated.
(B) FIG. 6 is an example of a “soldering iron heating structure and soldering apparatus” using high-frequency induction heating disclosed in Japanese Patent Publication No. 10-328820.
In this soldering iron 1, a
(C) Other [Patent Literature] extract
Patent Publication No. 11-10325 [Title of Invention] High-frequency induction overheating type soldering apparatus Patent Publication No. 11-221670 [Title of Invention] Solder iron and tip member Patent Publication No. 2004-351503 [Title of Invention] Brazing of aluminum material Method and Brazing Device Patent Publication No. 6-297137 [Title of Invention] There was a high frequency induction coil for brazing and a brazing method using the same.
その為に、次のような問題があった。
（イ）従来の高周波誘導加熱では、高周波電源に接続された高周波誘導コイル（以下：コイル）より発生する磁束により、披加熱体へ渦電流を誘導しその渦電流が被加熱体内部で流れる事による発熱を利用した加熱方法の為、磁束が集中するコイルの中心に被加熱体を設置している、コイルの端面での加熱を行う場合、磁束を端面に集中させることができない為、効率が悪く、コイルの中心に設置できない形状の被加熱体を非接触での加熱には課題が有った。
（ロ）十分な磁界を得る為には、印加する電流を増加しなければならなくなり、電流が増加することで自己発熱が増加してしまう、ゆえに、自己発熱を冷却する必要がある、その為にコイルをパイプ状の物をもちい、そのパイプの中に冷却水を循環させコイル自身の冷却をおこなうが、電流増加に伴い自己発熱が増加すると、パイプの径を太くし十分な冷却水流量の確保が必要とされ、コイルが大型化され磁束密度が減少し、更に電流を増加させなければならない課題が有った。
（ハ）電流増加に伴いコイルの発熱を減少させるためコイルの電気抵抗を減少させる必要から、コイルの電線径を太くしなければ成らない為、コイルの小型化が実現できず、加熱対象面積が広く成ってしまう難点が生じてきた。
（ニ）コイルの高周波電流の増加に伴い高周波電源からコイルまでの距離を最短で接続し電気抵抗を少なくする必要があり、従来の高周波誘導加熱装置では、高周波電源部からコイルが飛び出した形状で一体化させ最短距離で接続し、コイルと高周波電源部のを分離設置ができない課題があった。
（ホ）高周波電源からの高周波電力を同軸ケーブルを用いて延長するには、共振時の回路のインピーダンスが１Ω以下の非常に小さい値となる、その為、この線路を長くすると、同軸ケーブル自体の抵抗の方が共振インピーダンスより上回ってしまう為、線路の延長ができなかった。
（ヘ）複数の誘導加熱箇所が存在する場合、高周波電源部の形状の問題から設置間隔が制限され、高周波電源部とコイルを分離した高周波誘導加熱の利用が望まれている。
（ト）多品種を対象に一台の高周波誘導加熱を用いる場合、各品種の加熱対象箇所ごとに被加熱体とコイルとの距離と透磁率が異なる為、コイルのインダクタンスが変化しコイルの共振周波数が変わり、その都度整合の調整が必要であり自動的に整合を行う高周波誘導加熱装置が望まれている。Therefore, there were the following problems.
(B) In conventional high-frequency induction heating, an eddy current is induced in a heated body by a magnetic flux generated from a high-frequency induction coil (hereinafter referred to as a coil) connected to a high-frequency power source, and the eddy current flows inside the heated body. Because of the heating method using the heat generated by, the heating target is installed at the center of the coil where the magnetic flux concentrates. When heating the coil end face, the magnetic flux cannot be concentrated on the end face. Unfortunately, there was a problem in non-contact heating of a heated object having a shape that cannot be installed at the center of the coil.
(B) In order to obtain a sufficient magnetic field, the applied current must be increased, and the self-heating increases as the current increases. Therefore, it is necessary to cool the self-heating. The coil is pipe-like and the cooling water is circulated through the pipe to cool the coil itself.However, if self-heating increases as the current increases, the pipe diameter is increased and the cooling water flow rate is increased. As a result, there is a problem that the coil must be enlarged, the magnetic flux density is reduced, and the current must be increased.
(C) Since it is necessary to reduce the electrical resistance of the coil to reduce the heat generation of the coil as the current increases, the coil wire diameter must be increased. Difficulties that have become widespread have arisen.
(D) As the high frequency current of the coil increases, it is necessary to connect the distance from the high frequency power source to the coil as short as possible to reduce the electrical resistance. In the conventional high frequency induction heating device, the coil protrudes from the high frequency power source. There was a problem that they could be integrated and connected at the shortest distance, and the coil and the high frequency power supply unit could not be installed separately.
(E) To extend high-frequency power from a high-frequency power supply using a coaxial cable, the impedance of the circuit at resonance becomes a very small value of 1Ω or less. Therefore, if this line is lengthened, the coaxial cable itself Since the resistance exceeds the resonance impedance, the line could not be extended.
(F) When there are a plurality of induction heating locations, the installation interval is limited due to the problem of the shape of the high frequency power supply section, and the use of high frequency induction heating in which the high frequency power supply section and the coil are separated is desired.
(G) When using a single high-frequency induction heating for a variety of products, the distance between the object to be heated and the coil and the magnetic permeability are different for each heating target location of each product, so the coil inductance changes and the coil resonance There is a need for a high-frequency induction heating apparatus that automatically adjusts the frequency because the frequency changes and needs to be adjusted each time.
高周波誘導加熱装置本体に共振抑え上蓋と共振抑え下蓋及びコイル部固定ベース設け、コイル部固定ベースに誘導コイル部及びインピーダンス整合コイル部等の配線部品を設ける。高周波誘導加熱装置本体の一方に分離した高周波電源部に設けてある高周波発振出力部と同軸コネクタ付ケーブル（高周波電源からのエネルギーを伝える配線）により接続できるように設けた高周波電源入力端子を設け、高周波誘導加熱装置本体の出力側にあたる側に高周波回線と接続された発振接続端子を設ける。高周波誘導コイルと発振接続端子の間にオーリングを備えた発振コイルブロックカバーを設け、透磁率が高く、電気抵抗が高く高周波領域での過電流損失の効率の高い磁性体を高周波誘導コイルの中に設ける。自己発熱を冷却する為の循環型冷却用の冷却水入口と冷却水出口及び高周波誘導加熱放出口を備えた冷却ケースカバーを設け、磁性体を設けた高周波誘導コイルを高周波磁束誘導カバーに嵌入し、発振コイルブロックカバーに装着する。また冷却ケースカバー等は、非磁性体の材料で作成し、ケース内に冷却水を流すことによりコイル及び磁性体の全体冷却を行う。以上を特徴とする高周波誘導加熱装置である。および高周波誘導加熱装置に用いる高周波誘導コイルにおいて、被加熱体を部分的に加熱する為のシールド孔を設けたシールド板（０．１ｍｍ厚以上の銅板もしくは鉄板等）を高周波誘導コイルと被加熱体の間に設け磁界を被加熱体が受ける面積を制限し加熱することを特徴とする加熱方法である。
（１）直巻き（筒型）型に巻いた高周波誘導コイルの中に磁性体を入れ、各高周波誘導コイルの発生する磁界を端面に誘導する、高周波誘導コイル及び磁性体は冷却容器の中に密閉収納され、冷却水を循環させ高周波誘導コイル及び磁性体の全体を冷却する。
（２）被加熱体とコイル・磁性体が収納された冷却容器の間には、被加熱体で加熱の必要が無い部分に対してシールド板を設置し、シールド板で高周波誘導コイルの発生した磁界を受ける事で被加熱体への磁界の誘導を防いでいる。
（３）コイル冷却ケースカバーに直近またはケース（容器）と一体に共振回路と整合回路を収納し、共振回路は高周波誘導コイルとの直列共振を行い、その共振インピーダンスと高周波電源の出力インピーダンスとの整合を整合回路で行う。この位置で整合を行う事で高周波電源と高周波誘導コイル間の距離を問わず延長することができる。
（４）高周波電源の最終出力部に、高周波の反射波検出回路を設け、インピーダンスが不整合の場合、反射波が増加する点を利用し、反射波が一番少ない発振周波数になるよう、発振周波数を制御する。
（５）高周波誘導コイルは一般的にエナメル線等の絶縁型の電線を用いて高周波電源の発振周波数とコイルの外部に付属するコンデンサとの同調周波数で巻き数が決定される。コイルの中に用いる磁性体は、フェライトを用いる。また高周波でよく用いられるコア材として、Ｍｎ−Ｚｎ系、Ｎｉ−Ｚｎ系やカーボニル鉄ダスト、モリブデン・パーロイ、センダスト等の一般的材料を用いる
（６）材質の選択は、高周波誘導コイルの巻数と材質の持つ透磁率でインダクタンスが決定され、同調用の外部キャパシタンスで決定され、これらのキャパシタンスとインダクタンスで共振周波数が決定される。
（７）コアの形状、外形寸法は、丸型、楕円径、多角形、空芯コア等、被加熱体の加熱部分の形状に合わせて研磨等で加工して用いる。
（８）高周波誘導コイルと被加熱体の間にシールド板を設け、高周波誘導コイルから発する磁界の一部分のみを被加熱体に誘導し、設置するシールド板は、金属板を用い、磁界を誘導する部分にシールド孔を設けた形状とし、そのシールド孔を通過した磁界のみ被加熱体へ誘導される。The main body of the high-frequency induction heating apparatus is provided with a resonance suppression upper lid, a resonance suppression lower lid and a coil portion fixing base, and wiring components such as an induction coil portion and an impedance matching coil portion are provided on the coil portion fixing base. Provided with a high frequency power supply input terminal provided so that it can be connected to a high frequency oscillation output section provided in a high frequency power supply section separated on one side of the main body of the high frequency induction heating device and a cable with coaxial connector (wiring for transmitting energy from the high frequency power supply), An oscillation connection terminal connected to a high-frequency line is provided on the output side of the high-frequency induction heating apparatus main body. An oscillating coil block cover with an O-ring is provided between the high frequency induction coil and the oscillation connection terminal, and a magnetic material with high magnetic permeability, high electrical resistance and high overcurrent loss efficiency in the high frequency region is placed in the high frequency induction coil. Provided. A cooling case cover with cooling water inlet, cooling water outlet and high frequency induction heating discharge port for cooling the self-heating is provided, and a high frequency induction coil with magnetic material is fitted into the high frequency magnetic flux induction cover. Attach to the oscillation coil block cover. The cooling case cover or the like is made of a non-magnetic material, and the cooling of the coil and the magnetic material is performed by flowing cooling water through the case. This is a high-frequency induction heating apparatus characterized by the above. In a high-frequency induction coil used for a high-frequency induction heating apparatus, a shield plate (a copper plate or an iron plate having a thickness of 0.1 mm or more) provided with a shield hole for partially heating the heated object is used as the high-frequency induction coil and the heated object. The heating method is characterized in that heating is performed by limiting the area of the object to be heated and receiving the magnetic field.
(1) A magnetic material is placed in a high-frequency induction coil wound in a directly wound (tubular) type, and the magnetic field generated by each high-frequency induction coil is guided to the end face. The high-frequency induction coil and magnetic material are placed in a cooling container. It is hermetically sealed and circulates cooling water to cool the entire high frequency induction coil and magnetic body.
(2) Between the object to be heated and the cooling container in which the coil / magnetic material is housed, a shield plate is installed for the part to be heated that does not need to be heated, and a high frequency induction coil is generated on the shield plate. By receiving the magnetic field, induction of the magnetic field to the heated object is prevented.
(3) The resonance circuit and the matching circuit are housed in the coil cooling case cover immediately or integrally with the case (container), and the resonance circuit performs series resonance with the high frequency induction coil, and the resonance impedance and the output impedance of the high frequency power supply Matching is performed by a matching circuit. By performing matching at this position, the distance between the high-frequency power source and the high-frequency induction coil can be extended.
(4) A high-frequency reflected wave detection circuit is provided at the final output section of the high-frequency power supply, and when the impedance is mismatched, the point where the reflected wave increases is used so that the reflected wave has the lowest oscillation frequency. Control the frequency.
(5) A high-frequency induction coil generally uses an insulated wire such as an enamel wire, and the number of turns is determined by the oscillation frequency of a high-frequency power source and the tuning frequency of a capacitor attached to the outside of the coil. Ferrite is used as the magnetic material used in the coil. In addition, as a core material often used at high frequencies, general materials such as Mn—Zn, Ni—Zn, carbonyl iron dust, molybdenum perloy, and sendust are used. (6) Selection of the material depends on the number of turns of the high frequency induction coil. The inductance is determined by the magnetic permeability of the material, is determined by the external capacitance for tuning, and the resonance frequency is determined by these capacitance and inductance.
(7) The shape and outer dimensions of the core are processed by polishing or the like according to the shape of the heated portion of the heated object such as a round shape, an elliptical diameter, a polygonal shape, an air core, etc.
(8) A shield plate is provided between the high frequency induction coil and the heated body, and only a part of the magnetic field generated from the high frequency induction coil is guided to the heated body. The shield plate to be installed uses a metal plate to induce a magnetic field. The shape is such that a shield hole is provided in the portion, and only the magnetic field that has passed through the shield hole is guided to the object to be heated.
（イ）高周波誘導コイル（以下：コイル）の上部・下部の端面まで高周波誘導コイルが発生した磁界を効率良く誘導し、被加熱体内部で渦電流を発生させる必要があり、部分的に加熱する為に、被加熱体の対象に合わせた小径のコイルを用いる、それを実現する為のコイル及び、コイルから発せられた磁界の制御、及び高周波誘導コイルの冷却、誘導コイルの高周波電源からの分離設置及び、高周波電源部の発振周波数を変えることでのインピーダンス整合を自動で行うことが出来る。
（ロ）請求項２記載の発明は、高周波誘導コイルの形状を直巻き型（筒型）コイルとしコイルの巻数を増し発生する磁界を多く得ることが出来、その発生した磁界を高周波誘導コイルの中に磁性体を嵌入することでコイルの端面まで磁界を磁性体で誘導する事ができ、コイルの端まで磁界を誘導することが可能となる。
（ハ）請求項３記載の発明は、高周波誘導コイル及び磁性体の発熱対策による小型化への弊害に対し、高周波誘導コイル及び磁性体全体を冷却水の容器の中に入れ冷却しパイプ型の電線を用いない事で小型化することが可能になる。
（ニ）請求項４記載の発明は、高周波電源とインピーダンス整合回路を分離し、高周波電源から同軸コネクタ付ケーブルを用いて高インピーダンスで高周波を伝送し、高周波誘導コイルの部分にインピーダンス整合回路及び直列共振回路を分離する事で高周波電源と高周波誘導コイルの部分の距離を離して設置できる。
（ホ）請求項５記載の発明は、被加熱体の透磁率の影響に伴う高周波誘導コイルのインダクタンス変化で共振周波数が変化する事で発生する、高周波電源の出力インピーダンスと誘導コイル間の入力インピーダンスの不整合を高周波電源の発振周波数を自動追従させることインピーダンス整合を行うことができる。
（ヘ）請求項６記載の発明は、上記で高周波誘導コイルの両端まで誘導された磁界で被加熱体の加熱必要部分のみに磁界を誘導する為、高周波誘導コイルと被加熱体の間にシールド板を設け、不必要な部分の磁界をシールド板で受け、被加熱体の目的部分以外に磁界が到達できないようにすることができる。
（ト）高周波誘導加熱において高周波誘導コイルの両端を用いた加熱の場合、直巻き型でコイルを巻いた場合、コイル全体の磁界は多く発生するが両端の磁界は極めて少ない、この直巻きコイルの中に磁性体を入れる事で各コイルが発生した磁界をコイル両端まで誘導しコイルの中に被加熱体が置かれた状態と同様程度の磁界を両端より得る事ができる。
（チ）両端まで誘導された磁界が、それでも被加熱体の加熱を必要としない部分にかかる場合、高周波誘導コイルと被加熱体の間にシールド板を設けシールド板が不要な磁界を受けることで目的以外の場所へ磁界を受けることを防止する。
（リ）被加熱体の加熱対象部分がコイルより小さい場合、コイル自身もその形状程度の小型の物が求められ、冷却による小型化への弊害を高周波誘導コイル及び磁性体を冷却ケースカバーに嵌入し、冷却ケースカバー内部に冷却水を流し全体を冷却し冷却の問題を解決する。
（ヌ）同軸コネクタ付ケーブルで高周波伝送可能とする為、同軸コネクタ付ケーブルの固有インピーダンス５０Ω及び７５Ω等へ高周波電源側のインピーダンスを上げ高周波伝送を行い、直列共振回路の共振時のインピーダンスへの変換を整合回路で行うことで、高周波電源と誘導コイル部の分離及び延長が可能となる。小型化したコイルと高周波電源は同軸コネクタ付ケーブルで結び、コイル側にインピーダンス整合回路と直列共振回路を設け高周波電源と分離することで被加熱部分の多種多様な個所への加熱を可能とする。
（ル）高周波誘導コイルは被加熱体の透磁率の影響でインダクタンスが変化し共振周波数が変化する為、高周波電源と高周波誘導コイル間にインピーダンスの不整合が生じ、多種多様の被加熱体に対して無調整で実現できなかった。
（ヲ）不整合を防止するため、高周波電源の発振周波数をコイルの共振周波数に自動追従させる事により、インピーダンスを整合し反射波を最小限にした効率の良い誘導加熱を実現する。
（ワ）高周波誘導コイル両端へ磁界を効率的に誘導し、従来コイルの中で行っていた加熱を、高周波誘導コイルを近づける非接触で加熱を行う事が出来る。高周波誘導コイルが被加熱体の透磁率によりインダクタンスが変化し共振周波数が高周波電源の発振周波数と異なりインピーダンス不整合が発生した場合、高周波電源側の発振周波数を変える事で高周波誘導コイルの共振周波数と一致させインピーダンス整合を行う。
インピーダンス不整合が発生した場合、高周波回路では定在波と呼ばれる反射波が多くなる。この反射波をコイルで検出しダイオードで整流し発振回路へ直流電圧としてフィードバックし予め設定してある基準周波数に反射波の電圧を加減算し反射波が一番少ない周波数を発振回路で発振させ高周波電源と誘導コイル部のインピーダンスの整合を行う方法である。
（カ）高周波誘導コイルを被加熱体に近づけることで発生するコイルのインダクタンスの変化に対して高周波電源の発振周波数が自動追従しインピーダンス整合が常に取れている状態を保つ事ができる。
（ヨ）被加熱体の部分的加熱と、被加熱体の磁界到達部分内での非加熱対象個所を区分して加熱が行える事ができる。
（タ）高周波電源部とコイル間の距離を延長して加熱が行える事ができる。
（レ）高周波誘導コイル自身と高周波誘導コイルの中に設置する磁性体（本発明）の自己発熱を冷却することができる高周波誘導加熱装置及び加熱方法を提供するができる。
上記のように、本発明では高周波誘導加熱において高周波誘導コイル両端からの磁束を効率的に誘導させることにより、従来コイルの中での加熱処理は高周波誘導コイルを端面に近づける事で高周波誘導加熱がエネルギー効率が一段と向上が達成できる。さらに、被加熱体で加熱対象が点在する場合、シールド板を用い磁界の誘導を制限することで半田付けやろう付け等の更に絞り込んだスポット的な高周波誘導加熱の実現を達成できる。また、高周波誘導コイルと磁性体を冷却ケースカバー全体に冷却することにより、通常の電線が利用可能となり、従来のパイプ型電線での最小折り曲げ半径を意識すること無く部分の小型軽量化を達成できる。
コイル部のみを小型化を行っても、従来の高周波電源部と誘導コイルが一体化した高周波誘導加熱装置の構成では、その効果が薄いが、本発明では高周波電源部と誘導コイル部を分離し同軸コネクタ付ケーブルで高周波を伝送する事を実現しており、小型部品等の一つの工程で複数個所の高周波誘導加熱を達成できる。また、本発明では高周波誘導コイルに磁性体を内部に用いることでコイル両端での誘導加熱を効率的に実現できる。さらに、効率を高める為に、電気的要因である高周波電源部及び高周波誘導コイル部のインピーダンス整合を高周波電源部の発振周波数を誘導コイル部の反射波を用いて制御することで、電気的に終始一貫したインピーダンス整合が可能となり無駄な電力を消費しない効率的な高周波誘導加熱を達成できる。したがって、これらの発明が適用された装置でのハンダ付け、ろう付け等の分野においても、高周波誘導加熱のエネルギー効率を効果良く実施できる。
特に半田付けの場合の半田コテは常時加熱した状態にし、いつでも使用可能な状況で利用するのが一般的であるが、本発明を適用する事により半田付けを行う時間のみ高周波を誘導すれば良く、さらにエネルギー消費が削減できる効果が達成でき、高周波誘導加熱装置小型化が可能になりまた高周波誘導コイルと磁性体による加熱方法は極めて安全である。(B) It is necessary to efficiently induce the magnetic field generated by the high-frequency induction coil to the upper and lower end faces of the high-frequency induction coil (hereinafter referred to as the coil), and to generate eddy currents inside the heated body. Therefore, use a small-diameter coil that matches the target of the object to be heated, control the magnetic field generated from the coil, control the high-frequency induction coil, and separate the induction coil from the high-frequency power source. Impedance matching can be performed automatically by installing and changing the oscillation frequency of the high-frequency power supply unit.
(B) In the invention of claim 2, the shape of the high-frequency induction coil is a direct-winding (cylindrical) coil, the number of turns of the coil is increased, and a large amount of generated magnetic field can be obtained. By inserting a magnetic body therein, a magnetic field can be induced to the end face of the coil with the magnetic body, and a magnetic field can be induced to the end of the coil.
(C) The invention described in claim 3 is a pipe-type device in which the entire high frequency induction coil and magnetic body are cooled in a cooling water container in response to the adverse effect of miniaturization due to heat generation countermeasures of the high frequency induction coil and magnetic body. It is possible to reduce the size by not using an electric wire.
(D) The invention according to claim 4 separates the high-frequency power source and the impedance matching circuit, transmits high-frequency waves from the high-frequency power source using a cable with a coaxial connector, and the impedance matching circuit and the series in the portion of the high-frequency induction coil. By separating the resonance circuit, the high frequency power supply and the high frequency induction coil can be separated from each other.
(E) The invention according to claim 5 is that the output impedance of the high frequency power source and the input impedance between the induction coils, which are generated when the resonance frequency changes due to the inductance change of the high frequency induction coil due to the magnetic permeability of the heated object. The impedance matching can be performed by automatically following the mismatch of the oscillation frequency of the high frequency power source.
(F) In the invention according to
(G) In the case of heating using both ends of a high-frequency induction coil in high-frequency induction heating, when the coil is wound in a direct winding type, a large magnetic field is generated in the entire coil, but the magnetic field at both ends is extremely small. By inserting a magnetic material inside, the magnetic field generated by each coil can be guided to both ends of the coil, and a magnetic field of the same level as that in the state where the heated body is placed in the coil can be obtained from both ends.
(H) When a magnetic field induced to both ends is applied to a part that still does not require heating of the heated object, a shield plate is provided between the high frequency induction coil and the heated object, and the shield plate receives an unnecessary magnetic field. Prevent magnetic fields from being applied to places other than the intended purpose.
(I) If the part to be heated of the heated object is smaller than the coil, the coil itself is required to be small in size, and the high frequency induction coil and magnetic material are inserted into the cooling case cover to prevent downsizing due to cooling. Then, cooling water is poured inside the cooling case cover to cool the whole and solve the cooling problem.
(Nu) In order to enable high-frequency transmission with a cable with a coaxial connector, the impedance on the high-frequency power supply side is increased to 50Ω and 75Ω, etc., of the cable with the coaxial connector, and high-frequency transmission is performed to convert the series resonant circuit to the impedance at resonance. By using a matching circuit, it is possible to separate and extend the high-frequency power source and the induction coil unit. The miniaturized coil and high frequency power supply are connected by a cable with a coaxial connector, and an impedance matching circuit and a series resonance circuit are provided on the coil side to separate from the high frequency power supply, thereby enabling heating of various parts of the heated portion.
(Le) Since the inductance of the high frequency induction coil changes due to the magnetic permeability of the heated object and the resonance frequency changes, impedance mismatch occurs between the high frequency power supply and the high frequency induction coil, and it can be used against a wide variety of heated objects. It could not be realized without adjustment.
(V) In order to prevent mismatching, the induction frequency of the high frequency power supply is automatically followed by the resonance frequency of the coil to achieve efficient induction heating with matching impedance and minimizing the reflected wave.
(W) A magnetic field is efficiently induced to both ends of the high-frequency induction coil, and heating that has been performed in the conventional coil can be performed in a non-contact manner to bring the high-frequency induction coil closer. When the inductance of the high frequency induction coil changes due to the magnetic permeability of the heated object and the impedance mismatch occurs unlike the oscillation frequency of the high frequency power supply, the resonance frequency of the high frequency induction coil can be changed by changing the oscillation frequency on the high frequency power supply side. Impedance matching is performed by matching.
When impedance mismatching occurs, reflected waves called standing waves increase in the high-frequency circuit. This reflected wave is detected by a coil, rectified by a diode, fed back to the oscillation circuit as a DC voltage, and the reflected wave voltage is added to or subtracted from a preset reference frequency to oscillate the frequency with the least reflected wave in the oscillation circuit. And the impedance matching of the induction coil section.
(F) The oscillation frequency of the high-frequency power source automatically follows the change in inductance of the coil that occurs when the high-frequency induction coil is brought close to the object to be heated, so that impedance matching can always be maintained.
(Iv) It is possible to perform heating by dividing a part to be heated and a non-heating target part in a magnetic field reaching part of the object to be heated.
(T) Heating can be performed by extending the distance between the high-frequency power supply unit and the coil.
(L) It is possible to provide a high-frequency induction heating apparatus and a heating method capable of cooling the self-heating of the high-frequency induction coil itself and the magnetic body (the present invention) installed in the high-frequency induction coil.
As described above, in the present invention, high-frequency induction heating efficiently induces magnetic flux from both ends of the high-frequency induction coil so that the heat treatment in the conventional coil can be performed by bringing the high-frequency induction coil closer to the end face. Energy efficiency can be further improved. Further, when the object to be heated is scattered with the object to be heated, it is possible to achieve spot-like high-frequency induction heating such as soldering or brazing by limiting the induction of the magnetic field using a shield plate. In addition, by cooling the high-frequency induction coil and the magnetic body over the entire cooling case cover, a normal electric wire can be used, and the size and weight can be reduced without being aware of the minimum bending radius of the conventional pipe-type electric wire. .
Even if only the coil part is reduced in size, the effect of the conventional high-frequency induction heating apparatus in which the high-frequency power supply part and the induction coil are integrated is less effective. However, in the present invention, the high-frequency power supply part and the induction coil part are separated. High-frequency transmission is achieved with a cable with a coaxial connector, and high-frequency induction heating can be achieved at multiple locations in one process such as small parts. Further, in the present invention, induction heating at both ends of the coil can be efficiently realized by using a magnetic material in the high frequency induction coil. Furthermore, in order to increase efficiency, the impedance matching of the high frequency power supply unit and the high frequency induction coil unit, which is an electrical factor, is controlled electrically by controlling the oscillation frequency of the high frequency power supply unit using the reflected wave of the induction coil unit. Consistent impedance matching is possible, and efficient high frequency induction heating without consuming wasteful power can be achieved. Therefore, the energy efficiency of high-frequency induction heating can be effectively implemented even in the fields of soldering, brazing and the like in apparatuses to which these inventions are applied.
In particular, the soldering iron in the case of soldering is generally used in a state where it is always heated and can be used at any time. However, by applying the present invention, it is sufficient to induce a high frequency only during the soldering time. Furthermore, the effect of reducing energy consumption can be achieved, the high-frequency induction heating apparatus can be downsized, and the heating method using the high-frequency induction coil and the magnetic material is extremely safe.
以下、本発明の実施の形態について説明する。
（イ）高周波誘導加熱装置本体（１）に共振抑え上蓋（２）と共振抑え下蓋（３）及びコイル部固定ベース（４）設け、コイル部固定ベース（４）に誘導コイル部（５）及びインピーダンス整合コイル部（６）等の配線部品を設ける。
（ロ）高周波誘導加熱装置本体（１）の一方に分離した高周波電源部（７）に設けてある高周波発振出力部（８）と同軸コネクタ付ケーブル（９）（高周波電源からのエネルギーを伝える配線）により接続できるように設けた高周波電源入力端子（１０）を設け、高周波誘導加熱装置本体（１）の出力側にあたる側に高周波回線と接続された発振接続端子（１１）を設け、高周波誘導コイル（１２）と発振接続端子（１１）の間にオーリング（１３）を備えた発振コイルブロックカバー（１４）を設け、透磁率が高く、電気抵抗が高く高周波領域での過電流損失の効率の高い磁性体（１５）を高周波誘導コイル（１２）の中に嵌入し、自己発熱を軽減する為の循環型冷却用の冷却水入口（１６）と冷却水出口（１７）及び高周波誘導加熱放出口（１８）を備えた冷却ケースカバー（１９）を設け、磁性体 （１５）を設けた高周波誘導コイル（１２）を冷却ケースカバー（１９）に挿入し、発振コイルブロックカバー（１４）に装着する。
本発明は以上のような構成で、これを使用するときは、高周波誘導加熱装置に用いる高周波誘導コイル（１２）において、被加熱体を部分的に加熱する為の適度なシールド孔（２１）を設けたシールド板（２０）を高周波誘導コイル（１２）と被加熱体の間に設け磁界を被加熱体が受ける面積を制限し加熱することにより、シールド孔（２１）を通過した磁界のみ非加熱体へ誘導される。
図４、図５の実施例を持って説明する。
（イ）冷却ケースに収められた磁性体に巻かれた高周波誘導コイルが冷却ケースの中に収納され冷却水が循環している。この冷却ケースの下に不要な磁界を防ぐシールド板が設置され、その下に加熱対象となるクリーム半田、及びプリント基板、半田付け対象となるモーター等がある。
（ロ）モーター等にプリント板とクリーム半田が実装された状態で、高周波誘導コイルの下に位置させ、その後高周波電源より高周波を高周波誘導コイルに印加する事で、高周波誘導コイルより磁界が発生しクリーム半田及びプリント基板の銅箔へと磁界が誘導され渦電流が発生し、クリーム半田及びプリント板の銅箔が自己発熱しクリーム半田の融点に達すると半田が溶け、半田付けが完了する。なお、本実施形態では、プリント基板及びクリーム半田及びモーターで説明を行ったが、加熱処理を行う対象物であれば何でも良い。
（ハ）従来の高周波誘導加熱ではコイルの中に被加熱対象物を位置させる事で加熱を行っており、コイル端面での加熱利用は少ない。
コイル端面でなければ実現できない場合として、ハンダ付け及びろう付けがある。
（二）特にハンダ付けの場合、環境問題より鉛フリーのハンダ付けが世界的に要求され、現在。市販のハンダも鉛フリー化が進んでいる。
この鉛フリーのハンダは融点が高い問題があり、従来の半田コテを用いたハンダ付はできず、コテ先温度を従来の物より約１００℃高温でないと溶けない、その為、高温のハンダコテの場合、コテ先の酸化が激しくメンテナンス等の問題がある。
また、ハンダコテを用いた場合ハンダコテを常時熱しておかなければ成らず、待機時間中でも電力消費をしておりエネルギー効率が悪い。
（ホ）本発明の高周波誘導加熱を用いることで、酸化部分が無い為、メンテナンスフリーとなり作業と品質の著しい向上が期待でき、さらに、高周波誘導加熱の場合、溶解する時間だけ高周波を発生させ、待機時間中での電力消費が少ない等の環境効果も期待できる。
本発明の方法での実験では、出力５０Ｗ以下の出力でもハンダの熔解を実現しており本発明での産業上の利用の可能性は大である。Embodiments of the present invention will be described below.
(A) The high frequency induction heating device main body (1) is provided with a resonance suppression upper lid (2), a resonance suppression lower lid (3) and a coil portion fixing base (4), and the coil portion fixing base (4) is provided with an induction coil portion (5). And wiring components such as the impedance matching coil section (6).
(B) A high-frequency oscillation output section (8) provided in a high-frequency power supply section (7) separated on one side of the high-frequency induction heating device body (1) and a cable with a coaxial connector (9) (wiring for transmitting energy from the high-frequency power supply) The high frequency power supply input terminal (10) provided so that it can be connected to the high frequency induction heating apparatus body (1) is provided, and the oscillation connection terminal (11) connected to the high frequency line is provided on the side corresponding to the output side of the high frequency induction heating device body (1). An oscillating coil block cover (14) having an O-ring (13) is provided between (12) and the oscillating connection terminal (11), and the magnetic permeability is high, the electric resistance is high, and the efficiency of overcurrent loss in a high frequency region is improved. A high magnetic body (15) is inserted into the high-frequency induction coil (12), and the cooling water inlet (16) and the cooling water outlet (17) for circulating cooling to reduce self-heating and high-frequency induction heating discharge. A cooling case cover (19) provided with (18) is provided, and a high-frequency induction coil (12) provided with a magnetic body (15) is inserted into the cooling case cover (19) and attached to the oscillation coil block cover (14). .
The present invention is configured as described above. When this is used, an appropriate shield hole (21) for partially heating the object to be heated is provided in the high frequency induction coil (12) used in the high frequency induction heating device. Only the magnetic field that has passed through the shield hole (21) is unheated by providing the shield plate (20) provided between the high-frequency induction coil (12) and the body to be heated to limit the area that the body to be heated receives. Guided to the body.
A description will be given with the embodiment shown in FIGS.
(A) A high-frequency induction coil wound around a magnetic body housed in a cooling case is housed in the cooling case, and cooling water circulates. A shield plate for preventing an unnecessary magnetic field is installed under the cooling case, and a cream solder to be heated, a printed board, a motor to be soldered, and the like are provided below the shield plate.
(B) When a printed board and cream solder are mounted on a motor, etc., the magnetic field is generated from the high frequency induction coil by placing it under the high frequency induction coil and then applying a high frequency to the high frequency induction coil from a high frequency power supply. A magnetic field is induced to the cream solder and the copper foil of the printed board to generate an eddy current. When the cream solder and the copper foil of the printed board self-heats and reaches the melting point of the cream solder, the solder melts and the soldering is completed. In the present embodiment, the printed circuit board, the cream solder, and the motor have been described. However, any object may be used as long as the object is subjected to heat treatment.
(C) In conventional high-frequency induction heating, heating is performed by positioning an object to be heated in the coil, and heating at the coil end face is small.
Soldering and brazing are examples of cases that cannot be realized without the coil end face.
(2) Especially in the case of soldering, lead-free soldering is required worldwide due to environmental problems. Commercially available solder is also becoming lead-free.
This lead-free solder has a problem of high melting point, and cannot be soldered using a conventional soldering iron, and the soldering tip temperature does not melt unless it is about 100 ° C. higher than the conventional one. In this case, oxidation of the iron tip is severe and there are problems such as maintenance.
In addition, when using a soldering iron, the soldering iron must be constantly heated, and power is consumed even during standby time, resulting in poor energy efficiency.
(E) By using the high frequency induction heating of the present invention, since there is no oxidation portion, maintenance and free operation can be expected, and in the case of high frequency induction heating, a high frequency is generated only during the melting time, Environmental effects such as low power consumption during standby time can also be expected.
In the experiment by the method of the present invention, the melting of the solder is realized even at an output of 50 W or less, and the industrial application potential of the present invention is great.
１ 高周波誘導加熱装置本体
２ コイル部固定ベース
３ 共振抑え上蓋
４ 共振抑え下蓋
５ 誘導コイル部
６ インピーダンス整合コイル部
７ 高周波電源部
８ 高周波発振出力部
９ 同軸コネクタ付ケーブル
１０ 高周波電源入力端子
１１ 発振接続端子
１２ 高周波誘導コイル
１３ オーリング
１４ 発振コイルブロックカバー
１５ 磁性体
１６ 冷却水入口
１７ 冷却水出口
１８ 高周波誘導加熱放出口
１９ 冷却ケースカバー
２０ シールド板
２１ シールド孔DESCRIPTION OF SYMBOLS 1 High frequency induction heating apparatus main body 2 Coil part fixed base 3 Resonance suppression upper cover 4 Resonance suppression lower cover 5
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008025720A JP2009160652A (en) | 2008-01-08 | 2008-01-08 | High frequency induction heating apparatus, high frequency induction coil and heating method using magnetic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008025720A JP2009160652A (en) | 2008-01-08 | 2008-01-08 | High frequency induction heating apparatus, high frequency induction coil and heating method using magnetic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2009160652A true JP2009160652A (en) | 2009-07-23 |
Family
ID=40963853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008025720A Pending JP2009160652A (en) | 2008-01-08 | 2008-01-08 | High frequency induction heating apparatus, high frequency induction coil and heating method using magnetic material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009160652A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012018110A1 (en) * | 2010-08-06 | 2012-02-09 | アロニクス株式会社 | Solar cell element connecting apparatus |
| KR101312817B1 (en) | 2012-03-16 | 2013-09-27 | 허성종 | High frequency gun |
| CN106238848A (en) * | 2016-08-22 | 2016-12-21 | 京信通信技术(广州)有限公司 | Hardware and PCB non-contact thermal Sn-coupled SSBR method |
| CN106270864A (en) * | 2016-08-22 | 2017-01-04 | 京信通信技术(广州)有限公司 | Hardware and handware non-contact thermal Sn-coupled SSBR method |
| WO2018036227A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Method for non-contact heating and tin brazing of metal structural member and coaxial cable |
| CN108556306A (en) * | 2018-05-14 | 2018-09-21 | 应达工业（上海）有限公司 | A kind of heavy duty barrel rotational oscillation formula induction heating system |
| CN120791058A (en) * | 2025-09-10 | 2025-10-17 | 沃沛斯(常州)能源科技有限公司 | Photovoltaic module reprocesses device |
-
2008
- 2008-01-08 JP JP2008025720A patent/JP2009160652A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012018110A1 (en) * | 2010-08-06 | 2012-02-09 | アロニクス株式会社 | Solar cell element connecting apparatus |
| KR101312817B1 (en) | 2012-03-16 | 2013-09-27 | 허성종 | High frequency gun |
| CN106238848A (en) * | 2016-08-22 | 2016-12-21 | 京信通信技术(广州)有限公司 | Hardware and PCB non-contact thermal Sn-coupled SSBR method |
| CN106270864A (en) * | 2016-08-22 | 2017-01-04 | 京信通信技术(广州)有限公司 | Hardware and handware non-contact thermal Sn-coupled SSBR method |
| WO2018036227A1 (en) * | 2016-08-22 | 2018-03-01 | 京信通信技术(广州)有限公司 | Method for non-contact heating and tin brazing of metal structural member and coaxial cable |
| CN108556306A (en) * | 2018-05-14 | 2018-09-21 | 应达工业（上海）有限公司 | A kind of heavy duty barrel rotational oscillation formula induction heating system |
| CN108556306B (en) * | 2018-05-14 | 2023-11-14 | 应达工业（上海）有限公司 | Heavy-load charging barrel rotary oscillation type induction heating system |
| CN120791058A (en) * | 2025-09-10 | 2025-10-17 | 沃沛斯(常州)能源科技有限公司 | Photovoltaic module reprocesses device |
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