JP2009147240A - Substrate support apparatus, substrate support method, substrate processing apparatus, substrate processing method, and manufacturing method of display device constituent member - Google Patents

Abstract

Provided are a substrate processing apparatus and a substrate support apparatus that can perform positioning by moving a substrate to an arbitrary position while the substrate is supported by an air levitation device.
An X-direction moving device 5 and an air levitation device 11 of a substrate processing apparatus 1 are installed in a X direction of a base member 24. The Y-direction moving device 9 and the air levitation device 13 are installed in the Y direction of the base member 15. The suction disk 4 is provided on the base member 15 via the Y-direction moving device 9 and is movable in the Y direction. The air levitation device 13 is fixedly installed on the base member 15 and does not move in the Y direction. The base member 15 is provided on the base member 24 via the X direction moving device 5 and is movable in the X direction. In the substrate processing apparatus 1, the distance 51 in the Y direction between the air levitation apparatus 11 and the air levitation apparatus 13 may be any distance that does not affect the movement in the X direction, and it is not necessary to secure a movement space in the Y direction. .
[Selection] Figure 1

Description

  The present invention relates to a substrate processing apparatus that processes a substrate such as a glass substrate, and a substrate support apparatus that supports the substrate.

Conventionally, a substrate processing apparatus places a thin plate-like substrate (work) such as a glass substrate on a stage, performs positioning through the stage, and performs precision patterning on the substrate. When pattern formation is performed on a substrate, considerable accuracy is required, and it is required to accurately place the substrate to be processed at a predetermined position on the surface plate.
In recent years, in the field of displays such as liquid crystal color filters, the size of glass substrates, such as G7 generation (1870 mm × 2200 mm) and G8 generation (2200 mm × 2600 mm), has increased, and the weight of the apparatus, the apparatus cost, etc. tend to increase. is there.
Further, there has been proposed a substrate processing apparatus that reduces the weight and cost of the apparatus while maintaining the processing accuracy by supporting the substrate using an air levitation device in the processing region (see, for example, [Patent Document 1]). .).

JP 2007-150280 A

However, the conventional substrate processing apparatus can transport the substrate to the processing region while the substrate is supported by the air levitation device, but cannot move the substrate in the direction perpendicular to the transport direction. If the position of the substrate is deviated from the reference position in the direction perpendicular to the transport direction, it is necessary to control the processing position separately.
Even if the entire air levitation device is moved in a direction perpendicular to the conveying direction, it is necessary to secure a moving space. In this area of the moving space, the substrate is not supported, and the substrate is bent, which causes processing. There is a problem of affecting.

  The present invention has been made in view of the above problems, and a substrate processing apparatus and a substrate that can be positioned by moving the substrate to an arbitrary position while the substrate is supported by an air levitation device. An object is to provide a support device.

  In order to achieve the above-mentioned object, a first invention is a substrate support device for supporting a substrate, wherein a suction disk for sucking a partial region of the substrate and a first base member fixed in a first direction. A first air levitation device that is installed and supports a part of the substrate in a non-contact manner by an air levitation method; and a portion of the substrate that is fixedly installed in a second direction of the second base member by an air levitation method. A second air levitation device for supporting the contact; a first direction moving device for moving and positioning the second base member in the first direction relative to the first base; and the suction plate with respect to the second base. And a second direction moving device that moves and positions in the second direction.

  In the substrate support device according to the first aspect of the present invention, a partial area of the substrate is adsorbed by the suction disk, and the partial area of the substrate is aired by the first air levitation device fixedly installed in the first direction of the first base member. Non-contact support is performed by a floating method, and a part of the substrate is non-contact supported by an air floating method by a second air floating device fixedly installed in the second direction of the second base member. The two base members are moved and positioned in the first direction with respect to the first base, and the suction disk is moved and positioned in the second direction with respect to the second base by the second direction moving device.

The first direction is, for example, the substrate transport direction (X direction), and the second direction is, for example, a direction perpendicular to the transport direction (Y direction).
Alternatively, the suction of the substrate by the suction disk may be canceled and the substrate may be positioned by rotating in the horizontal plane.
In addition, the first air levitation device and the second air levitation device may perform air suction and air suction to position the substrate in the vertical direction.
Moreover, it is desirable that the first air levitation device and the second air levitation device support the substrate in a non-contact manner at the same vertical position.

  In the substrate processing apparatus of the first invention, the distance in the second direction between the first air levitation apparatus and the second air levitation apparatus may be any distance that does not affect the movement in the first direction. There is no need to secure a moving space. Thereby, the bending of the board | substrate in the clearance gap between a 1st air levitation apparatus and a 2nd air levitation apparatus can be prevented, and the precision of the process processing with respect to a board | substrate can be maintained. In addition, since the substrate processing apparatus supports a part of the substrate by the suction plate and the other part of the substrate by the first air levitation device and the second air levitation device, the size of the suction plate can be reduced. It is possible to reduce the device weight and the device manufacturing cost.

  According to a second aspect of the present invention, there is provided a substrate support method for supporting a substrate, wherein an adsorption step of adsorbing a partial area of the substrate by an adsorption disk, and a partial area of the substrate in a first direction of the first base member. A first air levitation step for supporting the region in a non-contact manner by an air levitation method; a second air levitation step for supporting a portion of the substrate in a second direction of the second base member in a non-contact manner by an air levitation method; A first direction moving step for positioning the second base member by moving the second base member in the first direction with respect to the first base, and a positioning by moving the suction plate in the second direction with respect to the second base. And a second direction moving step.

  The second invention relates to a substrate support method for supporting a substrate.

  A third invention is a substrate processing apparatus for processing a substrate, wherein a suction disk for sucking a part of the substrate and a first base member fixedly installed in a first direction of a part of the substrate. A first air levitation device that supports a region in a non-contact manner by an air levitation method, and a second air levitation device that is fixedly installed in a second direction of the second base member and supports a part of the substrate in a non-contact manner by an air levitation method. A first direction moving device that moves and positions the second base member in the first direction relative to the first base; and moves the suction plate in the second direction relative to the second base. A substrate processing apparatus comprising: a second direction moving device for positioning the substrate; and a processing device for processing the substrate.

  A third invention relates to a substrate processing apparatus that supports a substrate by the substrate support apparatus of the first invention and performs processing on the substrate by the processing apparatus. The substrate processing apparatus is an apparatus that performs processing on a substrate by a processing apparatus such as an inkjet head, a die coat, or a laser irradiation head. The substrate processing apparatus is, for example, a coater, an ink jet apparatus, a laser drawing apparatus, or the like.

  A fourth invention is a substrate processing method for processing a substrate, wherein an adsorption step of adsorbing a partial area of the substrate by an adsorption disk, A first air levitation step for supporting the region in a non-contact manner by an air levitation method; a second air levitation step for supporting a portion of the substrate in a second direction of the second base member in a non-contact manner by an air levitation method; A first direction moving step for positioning the second base member by moving the second base member in the first direction with respect to the first base, and a positioning by moving the suction plate in the second direction with respect to the second base. A substrate processing method comprising: a second direction moving step; and a processing step of processing the substrate.

  The fourth invention relates to a substrate processing method for processing a substrate.

  5th invention is a manufacturing method of the display apparatus structural member which manufactures the structural member of a display apparatus using the board | substrate processing method of 4th invention. The display device constituent member is, for example, an organic EL (Organic ElectroLuminescence) element or a color filter.

  According to the present invention, it is possible to provide a substrate processing apparatus and a substrate support apparatus that can perform positioning by moving the substrate to an arbitrary position while the substrate is supported by the air levitation device.

  Hereinafter, preferred embodiments of a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

(1. Configuration of the substrate processing apparatus 1)
First, the configuration of the substrate processing apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic perspective view of the substrate processing apparatus 1.
2 and 3 are YZ plane sectional views of the substrate processing apparatus 1.
4 and 5 are XZ plane sectional views of the substrate processing apparatus 1.
2 is a YZ plane cross-sectional view at the position of the Y-direction moving device 9, and FIG. 3 is a YZ plane cross-sectional view at the position of the air levitation device 13. 4 is an XZ plane cross-sectional view at the position of the X-direction moving device 5, and FIG. 5 is an XZ plane cross-sectional view at the position of the air levitation device 11.
The X direction indicates the conveyance direction of the substrate 3, the Y direction indicates the movement direction of the processing device 17 and the width direction of the substrate 3 or the suction plate 4, the Z direction indicates the vertical rotation axis, and the θ direction indicates the rotation direction. Show. The X axis, the Y axis, and the Z axis are perpendicular to each other.

  The substrate processing apparatus 1 includes a suction plate 4, an X-direction moving device 5, a Y-direction moving device 9, a θ-direction rotating device 7, an air levitation device 11, an air levitation device 13, a processing device 17, a Y-direction movement device 19, and an alignment camera. 21, a gantry 23, a base member 15, a base member 24, and the like.

The X direction moving device 5 and the air levitation device 11 are installed in the X direction of the base member 24. The Y-direction moving device 9 and the air levitation device 13 are installed in the Y direction of the base member 15.
The suction disk 4 is provided on the base member 15 via the Y-direction moving device 9 and is movable in the Y direction. The air levitation device 13 is fixedly installed on the base member 15 and does not move in the Y direction. The base member 15 is provided on the base member 24 via the X direction moving device 5 and is movable in the X direction. The air levitation device 11 is fixedly installed on the base member 24.

The substrate processing apparatus 1 is an apparatus that forms a fine-pitch pattern such as a color filter or an electronic circuit by processing the substrate 3 with a processing apparatus 17.
The substrate 3 is an object to be processed, and is, for example, a substrate such as a glass substrate, a silicon wafer, or a printed substrate.

  The X direction moving device 5 and the Y direction moving device 9 are devices for moving and positioning the substrate 3 in the X direction and the Y direction, respectively. The X direction moving device 5 and the Y direction moving device 9 include a guide mechanism and a moving actuator. The guide mechanism is, for example, a slider and a slide rail. The moving actuator is, for example, a step motor, a servo motor, or a linear motor.

  The suction disk 4 is a device that sucks and supports the substrate 3. The adsorption of the substrate 3 is performed by reducing the pressure or vacuum of the air between the adsorption plate 4 and the substrate 3 (vacuum, intake air). The suction board 4 is provided with a small hole (not shown) for sucking air. The suction disk 4 is connected to the base member 15 via the Y-direction moving device 9 and is movable in the Y direction with respect to the base member 15.

The air levitation device 11 and the air levitation device 13 are air floats, and are devices that support the substrate 3 in a non-contact manner by pushing up or sucking the substrate 3 with air pressure. The air levitation device 11 and the air levitation device 13 can be composed of a plurality of air float units, porous plates, and the like. The air levitation device 11 and the air levitation device 13 achieve a predetermined Z-direction accuracy (relative distance accuracy between the substrate 3 and the processing device 17).
The heights of the air supply surfaces of the air levitation device 11 and the air levitation device 13 are determined so as to support the substrate 3 in the same Z-direction position in a non-contact manner, and are determined according to the air levitation amount. When the air levitation amount is the same between the air levitation device 11 and the air levitation device 13, the height of the air supply surface is also the same. When one air levitation amount is large, the height of the air supply surface is increased accordingly. When the height of the air supply is reduced and one of the air flying heights is small, it is desirable to increase the height of the air supply surface accordingly.

  The interval 51 is an interval in the Y direction between the air levitation device 11 and the air levitation device 13. The air levitation amount 52 is a difference between the height of the air supply surface of the air levitation device 11 and the air levitation device 13 and the height of the suction surface of the suction disk 4. The smaller the air flying height 52, the better the accuracy in the Z direction. However, as the air flying height 52 decreases, the vertical straightness of the X direction moving device 5 and the Y direction moving device 9 also needs to be improved.

  The θ-direction rotating device 7 is a device that performs positioning by rotating the substrate 3 in the θ direction within a horizontal plane. The θ-direction rotating device 7 rotates the substrate 3 in the θ direction in a horizontal plane by pushing and pulling the end of the substrate 3 in a state where the suction of the substrate 3 by the suction disk 4 is released, for example.

  The processing device 17 is a device that performs processing on the substrate 3, and is, for example, an inkjet head unit, a die coat unit, a laser irradiation head unit, or the like. The processing device 17 is provided in the gantry 23 via the Y-direction moving device 19. The Y-direction moving device 19 performs positioning by moving the processing device 17 in the Y direction.

  The alignment camera 21 is a camera that captures an image of a predetermined portion (such as an alignment mark or a pattern formed on the substrate) of the substrate 3 in order to detect the XY coordinates and the θ direction angle of the substrate 3. The alignment camera 21 is fixedly supported on the frame 20 of the substrate processing apparatus 1. A plurality of alignment cameras 21 may be provided, or alignment cameras 21 having different fields of view (for example, for high accuracy and coarse accuracy) may be provided.

(2. Process control)
Next, process control of the substrate processing apparatus 1 will be described with reference to FIG.
FIG. 6 is a diagram showing a flow of process control of the substrate processing apparatus 1.
A captured image of the alignment camera 21 is input to the image processing device 37. The image processing device 37 performs a process of extracting the θ direction angle and XY coordinates of the substrate 3 based on the captured image. The stage controller 39 compares the extracted data with predetermined data to calculate their deviation, and calculates the control amount so as to reduce the deviation.

The servo amplifier θ41 sends a control signal to the θ-direction rotating device 7 based on the θ-direction control amount sent from the stage controller 39. The θ direction rotating device 7 performs alignment of the substrate 3 in the θ direction.
The servo amplifier X43 sends a control signal to the X-direction moving device 5 based on the X-direction control amount sent from the stage controller 39. The X direction moving device 5 moves the substrate 3 in the X direction.
The servo amplifier Y45 sends a control signal to the Y-direction moving device 9 and the Y-direction moving device 19 based on the Y-direction control amount sent from the stage controller 39. The Y-direction moving device 9 moves the substrate 3 in the Y direction. The Y direction moving device 19 moves the processing device 17 in the Y direction. When the Y-direction moving device 9 controls the Y-direction reference position, the Y-direction moving device 19 does not need to control the Y-direction reference position.
The process system 47 adjusts the processing timing of the processing apparatus 17 based on the control amount sent from the stage controller 39.

(3. Operation of substrate processing apparatus 1)
Next, the operation of the substrate processing apparatus 1 will be described with reference to FIG.

FIG. 7 is a flowchart showing the operation of the substrate processing apparatus 1.
The substrate processing apparatus 1 sequentially performs each process of a conveyance process (step 1001), a correction amount calculation process (step 1002), a positioning process (step 1003), and a processing process (step 1004).

(3-1. Conveying process: Step 1001)
The substrate processing apparatus 1 adsorbs and fixes a part of the substrate 3 by the suction disk 4 and levitates the other part of the substrate 3 by the air levitation device 11 and the air levitation device 13 to support it in a non-contact manner. The substrate processing apparatus 1 moves the substrate 3 in the X direction by the X direction moving device 5 and conveys the substrate 3 below the processing apparatus 17.

(3-2. Correction amount calculation process: Step 1002)
The substrate processing apparatus 1 images an alignment mark attached to the substrate 3 by the alignment camera 21, and calculates an X direction deviation amount, a Y direction deviation amount, and a θ direction correction amount based on the XY coordinates of the alignment mark.

(3-3. Positioning process: Step 1003)
The substrate processing apparatus 1 uses the X-direction moving device 5, the Y-direction moving device 9, and the θ-direction rotating device 7 based on the X-direction deviation amount, the Y-direction deviation amount, and the θ-direction correction amount. The substrate 3 is positioned at a predetermined reference position in the θ direction.

(3-4. Processing: Step 1004)
The substrate processing apparatus 1 performs processing on the substrate 3 by the processing apparatus 17 while moving the substrate 3 and the processing apparatus 17 in the X direction and the Y direction by the X direction moving apparatus 5 and the Y direction moving apparatus 19, respectively.

  In addition, in order to improve the relative distance accuracy (Z direction accuracy) between the substrate 3 and the processing device 17, a sensor for measuring the position of the substrate 3 is provided on the processing device 17 side, and feedback is performed in real time. 11 and the air pressure of the air levitation device 13 may be controlled.

  Through the above-described process, the substrate processing apparatus 1 sucks and fixes a part of the substrate 3 by the suction disk 4 and levitates the other part of the substrate 3 by the air levitation device 11 and the air levitation device 13 to support it in a non-contact manner. Then, the substrate 3 is transported in the X direction by the X direction moving device 5, and the substrate 3 is positioned at a predetermined reference position by the X direction moving device 5, the Y direction moving device 9 and the θ direction rotating device 7. 11 and the air levitation device 13 process the substrate 3 while maintaining the accuracy in the Z direction.

(4. Movement of substrate 3 in Y direction)
Next, the movement of the substrate 3 in the Y direction will be described with reference to FIGS.

(4-1. Spacing between the air levitation device 11 and the air levitation device 13)
FIG. 8 is a YZ plane sectional view of the substrate processing apparatus 1 at the position of the Y-direction moving device 9.
FIG. 9 is a diagram of the substrate processing apparatus 1 viewed from the Z direction.
As shown in FIGS. 8 and 9, the Y-direction moving device 9 moves the substrate 3 in the Y direction by moving the suction plate 4 in the Y direction, but the air levitation device 13 is moved in the Y direction. Absent. By moving the substrate 3 in the Y direction by the Y-direction moving device 9, the interval 51 in the Y direction between the air levitation device 11 and the air levitation device 13 does not change.

  As described above, the distance 51 in the Y direction between the air levitation device 11 and the air levitation device 13 may be any distance that does not affect the movement in the X direction, and is the minimum necessary distance regardless of the movement in the Y direction. It can be. Thereby, it can prevent that the board | substrate 3 deform | transforms and bends in the clearance gap between the air levitation apparatus 11 and the air levitation apparatus 13. FIG.

(4-2. Support area of substrate 3 by air levitation device)
FIG. 10 is a diagram illustrating a support region of the substrate 3 by the air levitation device 11 and the air levitation device 13.
FIG. 10A shows a support region of the substrate 3a before moving in the Y direction. FIG. 10B shows the support area of the substrate 3b after movement in the Y direction.

The area | region 53a and area | region 53b of the board | substrate 3a and the board | substrate 3b are area | regions non-contact supported by the air levitation apparatus 13 shown in FIG. The areas of the region 53a and the region 53b do not change before and after the movement in the Y direction.
The regions 56a and 56b of the substrate 3a and the substrate 3b are regions that are sucked and supported by the suction disk 4 shown in FIG. The areas of the region 56a and the region 56b do not change before and after the movement in the Y direction.

The region 54-1a and the region 54-2a of the substrate 3a before moving in the Y direction are regions that are supported in a non-contact manner by the air levitation device 11-1 and the air levitation device 11-2 shown in FIG.
The region 54-1b and the region 54-2b of the substrate 3b after moving in the Y direction are regions that are supported in a non-contact manner by the air levitation device 11-1 and the air levitation device 11-2 shown in FIG. 9, respectively.
Since the region 54-2a becomes the region 54-2b after moving in the Y direction, the support area becomes small. However, since the region 54-1a becomes the region 54-1b after moving in the Y direction, the support area becomes large. The sum of the areas of the region 54-1a and the region 54-2a and the sum of the areas of the region 54-1b and the region 54-2b are the same area.

  As described above, since the support area of the substrate 3 does not change before and after the movement in the Y direction, the movement in the Y direction does not cause deformation of the substrate 3 or impair the accuracy in the Z direction.

(4-3. Comparison with the substrate processing apparatus 101 that moves the entire air levitation apparatus in the Y direction)
FIG.11 and FIG.12 is a figure which shows the board | substrate processing apparatus 101 as a comparative example with the board | substrate processing apparatus 1 which concerns on embodiment of this invention. FIG. 11 is a YZ plane sectional view of the substrate processing apparatus 101 in the Y-direction moving apparatus 109. FIG. 12 is a diagram of the substrate processing apparatus 101 viewed from the Z direction.

  The substrate processing apparatus 101 includes a suction plate 104, an X direction moving apparatus 105, a Y direction moving apparatus 109, an air levitation apparatus 111, an air levitation apparatus 113, and the like. The suction plate 104, the X-direction moving device 105, the Y-direction moving device 109, the air levitation device 111, and the air levitation device 113 of the substrate processing apparatus 101 are the suction plate 4, the X-direction movement device 5, and Y of the substrate processing apparatus 1, respectively. It corresponds to the direction moving device 9, the air levitation device 11, and the air levitation device 13.

  In the substrate processing apparatus 101, both the suction plate 104 and the air levitation device 113 are fixedly installed on the base member 115. The base member 115 is provided on the base member 116 via the Y-direction moving device 109 and is movable in the Y direction. The base member 116 is provided on the base member 124 via the X direction moving device 105 and is movable in the X direction. The suction plate 104 and the air levitation device 113 move together with the base member 115 in the Y direction.

As described above, in the substrate processing apparatus 101, not only the suction plate 104 but also the air levitation apparatus 113 moves in the Y direction together with the base member 115. Therefore, the air levitation apparatus 111 and the air levitation apparatus 113 are arranged in the Y direction. It is necessary to secure an interval 151 as a moving space.
On the other hand, in the substrate processing apparatus 1 according to the embodiment of the present invention, the suction plate 4 is provided on the base member 15 via the Y-direction moving device 9, and the air levitation device 13 is fixedly installed on the base member 15. The suction disk 4 can move in the Y direction, but the air levitation device 13 and the base member 15 do not move in the Y direction. Therefore, it is not necessary to secure a moving space in the Y direction between the air levitation device 11 and the air levitation device 13.

FIG. 13 is a view showing the substrate 3 supported by the air levitation device of the substrate processing apparatus 1 according to the embodiment of the present invention.
FIG. 14 is a diagram showing the substrate 3 supported by the air levitation device of the substrate processing apparatus 101 as a comparison target.

  In the substrate processing apparatus 101, it is necessary to secure a space 151 as a movement space in the Y direction between the air levitation apparatus 111 and the air levitation apparatus 113. In the substrate processing apparatus 1 according to the embodiment of the present invention, It is not necessary to secure a moving space in the Y direction between the levitation device 11 and the air levitation device 13.

As shown in FIG. 13, in the substrate processing apparatus 1, it is not necessary to secure a movement space in the Y direction with respect to the interval 51 in the Y direction between the air levitation apparatus 11 and the air levitation apparatus 13. Since the interval 51 in the substrate processing apparatus 1 is smaller than the interval 151 in the substrate processing apparatus 101, the substrate 3 does not bend.
On the other hand, as shown in FIG. 14, in the substrate processing apparatus 101, the Y-direction interval 151 between the air levitation apparatus 111 and the air levitation apparatus 113 changes as the substrate 3 moves in the Y direction. It is necessary to ensure. Since the interval 151 in the substrate processing apparatus 101 is larger than the interval 51 in the substrate processing apparatus 1, the substrate 3 is deformed to cause bending 119.

(5. Air float configuration and control)
Next, the configuration and control of the air float unit will be described with reference to FIGS. 15 and 16.
FIG. 15 is a diagram illustrating an aspect of the arrangement of the air float units.
FIG. 16 is a diagram illustrating one mode of air float block control.
The configuration and control of the air levitation device 11 and the air levitation device 13 can take various forms.

  As shown in FIG. 15, the air levitation device 11 and the air levitation device 13 may be configured by arranging a plurality of air float units 61 and air float units 62. It is desirable to arrange the air float unit 61 and the air float unit 62 according to the required accuracy.

  As shown in FIG. 16, when an integrated air float is used, an air flow path (air system) is provided for each of the plurality of blocks 63 and 64 to control the air region range, air flow rate, and air pressure. May be.

  Thus, the Z direction accuracy of the substrate 3 can be adjusted by controlling the air flow rate and air pressure of the air float. For example, even when unevenness or inclination exists on the surface of the substrate supported by the air float, the accuracy can be improved by controlling the air flow rate and air pressure in the vicinity of the region. In the case of a stone surface plate, it is difficult to improve the position accuracy after installation.

(6. Color filter manufacturing method)
Next, a color filter manufacturing method using the substrate processing apparatus 1 of the present invention will be described with reference to FIG.
FIG. 17 is a diagram illustrating a color filter manufacturing method in the substrate processing apparatus 1.

As shown in FIG. 17A, the light shielding layer 201 is formed on the substrate 3. The light shielding layer 201 is a partition wall. The light shielding layer 201 forms an opening corresponding to each pixel.
As shown in FIG. 17B, in the substrate processing apparatus 1 of the present invention, the opening portion provided by the light-shielding layer 201 on the substrate 3 and the nozzle position of the inkjet head of the processing apparatus 17 are aligned and processed. Ink 202 is ejected from the inkjet head of the apparatus 17. The ink 202 contains a colorant such as a dye or a pigment. Ink 202 is applied to the opening to form a colored layer 203. At this stage, the colored layer 203 contains moisture and a solvent component and is in a wet state (wet state).
As shown in FIG. 17C, the substrate 3 is heated and dried to remove moisture and solvent components contained in the colored layer 203. Thereafter, the substrate 3 is further heated at a high temperature, and the entire colored layer 203 is cured.
As shown in FIG. 17D, a protective layer 204 is formed on the colored layer 203 as necessary.

  Through the above process, the color filter is manufactured by applying the ink 202 to the opening formed in the substrate 3 in the substrate processing apparatus 1.

(7. Manufacture of display devices)
Next, manufacturing of the display device will be described with reference to FIG.
FIG. 18 is a diagram showing the display device 211 manufactured through the processing by the substrate processing apparatus 1. Here, a liquid crystal display panel will be described as the display device 211.
The color filter substrate 212 is a color filter manufactured through processing by the substrate processing apparatus 1. On the color filter substrate 212, a spacer 216 for securing a space for enclosing the liquid crystal 217 is formed.
The array substrate 213 is an array substrate such as a TFT (Thin Film Transistor).
The display device 211 is manufactured by bonding the color filter substrate 212 and the array substrate 213, providing the sealant 214 around the substrate, and enclosing the liquid crystal 217 between the substrates.

(8. Effect)
As described above, in the substrate processing apparatus 1 according to the embodiment of the present invention, the interval 51 in the Y direction between the air levitation device 11 and the air levitation device 13 is an interval that does not affect the movement in the X direction. Well, it is not necessary to secure a moving space in the Y direction. Thereby, the bending of the board | substrate 3 in the clearance gap between the air levitation apparatus 11 and the air levitation apparatus 13 can be prevented, and the precision of the process process with respect to the board | substrate 3 can be maintained. In addition, since the substrate processing apparatus 1 supports a part of the substrate 3 by the suction plate 4 and supports the other part of the substrate 3 by the air levitation device 11 and the air levitation device 13, the size of the suction plate 4 is reduced. It is possible to reduce the device weight and the device manufacturing cost.

(9. Other)
In the above-described embodiment, the number of axes of the X-direction moving device 5 and the Y-direction moving device 9 is illustrated as being two axes, but is not limited thereto. Regarding the number of axes, at least one axis may be provided according to the size, shape, and weight of the substrate 3. The installation position is not limited, and the X-direction moving device 5 and the Y-direction moving device 9 may be arranged at the center and end portions of the base member 24 and the base member 15 and other positions, respectively.
Moreover, although the board | substrate processing apparatus 1 which processes the board | substrate 3 was demonstrated in the above-mentioned embodiment, it can also apply to the inspection apparatus which test | inspects inspection objects, such as a board | substrate and printed matter.

  The preferred embodiments of the substrate processing apparatus according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of substrate processing apparatus 1 YZ plane sectional view of substrate processing apparatus 1 (position of Y-direction moving apparatus 9) YZ plane sectional view of substrate processing apparatus 1 (position of air levitation apparatus 13) XZ plane sectional view of the substrate processing apparatus 1 (position of the X direction moving apparatus 5) XZ plane sectional view of substrate processing apparatus 1 (position of air levitation apparatus 11) The figure which shows the flow of the process control of the substrate processing apparatus 1 Flow chart showing the operation of the substrate processing apparatus 1 YZ plane sectional view of substrate processing apparatus 1 (position of Y-direction moving apparatus 9) The figure which looked at substrate processing device 1 from the Z direction The figure which shows the support area | region of the board | substrate 3 by the air levitation apparatus 11 and the air levitation apparatus 13 YZ plane sectional view of substrate processing apparatus 101 (position of Y direction moving apparatus 109) The figure which looked at substrate processing device 101 from the Z direction The figure which shows the board | substrate 3 supported by the air levitation apparatus of the board | substrate processing apparatus 1. FIG. The figure which shows the board | substrate 3 supported by the air levitation | floating apparatus of the board | substrate processing apparatus 101. FIG. The figure which shows the one aspect | mode of arrangement | positioning of an air float unit The figure which shows the one aspect | mode of block control of an air float The figure which shows the color filter manufacturing method in the board | substrate processing apparatus 1 The figure which shows the display apparatus 211 manufactured through the process by the board | substrate processing apparatus 1.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Substrate processing device 3 ......... Substrate 4 ......... Suction board 5 ......... X direction moving device 7 ......... θ direction rotating device 9, 19 ......... Y direction moving device 11, 13 ......... Air levitation device 15, 24 ......... Base member 17 ......... Processing device 20 ......... Frame 21 ......... Alignment camera 23 ......... Gantry 37 ......... Image processing device 39 ......... Stage controller 41 ......... Servo amplifier θ
43 ......... Servo Amplifier X
45 ......... Servo amplifier Y
47... Process system 51... Y-interval between air levitation device 11 and air levitation device 52... Air levitation amount 53 ...... Region of substrate 3 supported by air levitation device 13. 1, 54-2, 55-1, 55-2 ......... Area 3 of the substrate 3 supported by the air levitation device 11 61,62 ......... Air float units 63, 64 ......... Block 201 ......... Light shielding layer 202 ......... Ink 203 ......... Colored layer 204 ......... Protective layer 211 ......... Display device 212 ......... Color filter substrate 213 ......... Array substrate

Claims (22)

A substrate support device for supporting a substrate,
A suction plate for sucking a partial region of the substrate;
A first air levitation device fixedly installed in a first direction of the first base member and supporting a part of the substrate in a non-contact manner by an air levitation method;
A second air levitation device fixedly installed in the second direction of the second base member and supporting a part of the substrate in a non-contact manner by an air levitation method;
A first direction moving device that moves and positions the second base member in the first direction with respect to the first base;
A second direction moving device that moves and positions the suction plate in the second direction with respect to the second base;
A substrate support apparatus comprising:   The substrate support device according to claim 1, further comprising a rotating device that releases the suction of the substrate by the suction disk and rotates and positions the substrate in a horizontal plane.   3. The substrate support device according to claim 1, wherein the first air levitation device and the second air levitation device perform air suction together with air blow to position the substrate in a vertical direction. 4.   4. The substrate according to claim 1, wherein the first direction is a transport direction of the substrate, and the second direction is a direction perpendicular to the transport direction. 5. Support device.   5. The substrate support apparatus according to claim 1, wherein the first air levitation device and the second air levitation device support the substrate in a non-contact manner at the same vertical position. . A substrate support method for supporting a substrate,
An adsorption step of adsorbing a partial area of the substrate by an adsorption plate;
A first air levitation step for supporting a part of the substrate in a first direction of the first base member in a non-contact manner by an air levitation method;
A second air levitation step of supporting a part of the substrate in a second direction of the second base member in a non-contact manner by an air levitation method;
A first direction moving step of positioning the second base member by moving the second base member in the first direction with respect to the first base;
A second direction moving step for positioning the suction disk in the second direction with respect to the second base;
A substrate support method comprising the steps of:   The substrate support method according to claim 6, further comprising a rotation step of releasing the suction of the substrate by the suction disk and positioning the substrate in a horizontal plane.   8. The substrate support method according to claim 6, wherein in the first air levitation step and the second air levitation step, air is sucked together with air blow to position the substrate in a vertical direction. 9.   The substrate according to any one of claims 6 to 8, wherein the first direction is a transport direction of the substrate, and the second direction is a direction perpendicular to the transport direction. Support method.   The substrate support method according to any one of claims 6 to 9, wherein the first air levitation step and the second air levitation step support the substrate in a non-contact manner at the same vertical position. . A substrate processing apparatus for processing a substrate,
A suction plate for sucking a partial region of the substrate;
A first air levitation device fixedly installed in a first direction of the first base member and supporting a part of the substrate in a non-contact manner by an air levitation method;
A second air levitation device fixedly installed in the second direction of the second base member and supporting a part of the substrate in a non-contact manner by an air levitation method;
A first direction moving device that moves and positions the second base member in the first direction with respect to the first base;
A second direction moving device that moves and positions the suction plate in the second direction with respect to the second base;
A processing apparatus for processing the substrate;
A substrate processing apparatus comprising:   The substrate processing apparatus according to claim 11, further comprising: a rotating device that releases the suction of the substrate by the suction disk and rotates and positions the substrate in a horizontal plane.   The substrate processing apparatus according to claim 11, wherein the first air levitation device and the second air levitation device perform air suction together with air blowing to position the substrate in the vertical direction.   The substrate according to claim 11, wherein the first direction is a transport direction of the substrate, and the second direction is a direction perpendicular to the transport direction. Processing equipment.   The substrate processing apparatus according to any one of claims 11 to 14, wherein the first air levitation device and the second air levitation device support the substrate in a non-contact manner at the same vertical position. . A substrate processing method for processing a substrate,
An adsorption step of adsorbing a partial area of the substrate by an adsorption plate;
A first air levitation step for supporting a part of the substrate in a first direction of the first base member in a non-contact manner by an air levitation method;
A second air levitation step of supporting a part of the substrate in a second direction of the second base member in a non-contact manner by an air levitation method;
A first direction moving step of positioning the second base member by moving the second base member in the first direction with respect to the first base;
A second direction moving step for positioning the suction disk in the second direction with respect to the second base;
A processing step of processing the substrate;
A substrate processing method comprising:   The substrate processing method according to claim 16, further comprising a rotation step of releasing the suction of the substrate by the suction disk and positioning the substrate in a horizontal plane.   18. The substrate processing method according to claim 16, wherein in the first air levitation step and the second air levitation step, air is sucked together with air blow to position the substrate in a vertical direction.   The substrate according to any one of claims 16 to 18, wherein the first direction is a transport direction of the substrate, and the second direction is a direction perpendicular to the transport direction. Processing method.   The substrate processing method according to claim 16, wherein the first air levitation step and the second air levitation step support the substrate in a non-contact manner at the same vertical position. .   The substrate processing apparatus according to claim 11, wherein the processing performed by the processing apparatus includes a coating process or a laser drawing process.   The manufacturing method of the display apparatus structural member which manufactures the structural member of a display apparatus using the board | substrate processing method of Claim 16-20.

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