JP2009038362A - Three-dimensional printed wiring board and manufacturing method thereof - Google Patents

Abstract

[PROBLEMS] To easily implement small-sized, low-profile, three-dimensional mounting that supports high-functionality and multi-pin semiconductors, which are necessary to realize small, thin, lightweight, high-definition, multi-functionality, etc. of mobile devices. An object is to provide a package form to be realized.
An upper substrate (1), a lower substrate (2), and a connection layer (3) connecting these substrates are formed, and the upper substrate (1) and the lower substrate (2) are mutually connected to form a recess (4). The connection layer 3 is made of an insulating material containing a resin, and a through hole is formed at a predetermined position of the connection layer 3, and a via 7 filled with the conductive paste 6 is formed in the through hole. The three-dimensional printed wiring board 15 is provided with a metal film 14 so as to cover the opening of the upper substrate 1 in which the recess 4 is formed.
[Selection] Figure 2

Description

  The present invention relates to a three-dimensional printed wiring board widely used in various electronic devices such as personal computers, mobile communication telephones, and video cameras, and a method for manufacturing the same.

  In recent years, small electronic devices in which a plurality of electronic components are mounted and mounted on a high-density wiring board, or modules constituting the electronic devices have been rapidly spread. Conventionally, this type of module has a structure in which an electronic component is covered with a metal case or a structure accommodated in the entire metal case for the purpose of protection from electromagnetic field or electrostatic field noise.

  An electronic component built-in module covered with a conventional metal case will be described with reference to FIG.

  In FIG. 13, an electronic component built-in module 101 is obtained by mounting various electronic components 103 a, 103 b, and 103 c on the upper surface of a substrate 102. These various electronic components 103a, 103b, and 103c are connected to the electrode pattern formed on the surface of the substrate 102 by means such as die bonding and wire bonding or by soldering. Through-hole electrodes 107a, 107b, 107c, and 107d connected to the lower surface of the substrate 102 are formed at four corners of the side surface of the substrate 102, and one of the through-hole electrodes 107a is configured as a ground connection terminal. The through-hole electrode 107a is electrically connected to the ground line of the motherboard when the electronic component built-in module 101 is mounted on the motherboard (not shown). Further, on the upper surface of the substrate 102, a grounding electrode pattern 106 that is electrically connected to the through-hole electrode 107a is formed in addition to the electrode pattern described above.

  And the upper surface of the board | substrate 102 with which various electronic components 103a, 103b, and 103c were mounted is sealed with the sealing body 108 which consists of an epoxy resin.

  Thereafter, a metal layer 120 is formed on the entire surface of the sealing body 108, and the nickel plating layer 120 is also deposited on the one end 109 of the ground electrode pattern 106 exposed from the sealing body 108. As a result, the nickel plating layer 120 is electrically connected to the grounding electrode pattern 106 and the through-hole electrode 107a and is grounded to the ground line of the mother board, so that the electronic components 103a to 103c are shielded from external electromagnetic field noise. be able to. Furthermore, when the plating thickness of the nickel plating layer 120 is formed with a thickness comparable to that of a shield cover made of a conventional metal cap, a desired shielding effect can be obtained.

For example, Patent Document 1, Patent Document 2, and Patent Document 3 are known as prior art document information relating to the invention of this application.
Japanese Patent Laid-Open No. 11-163583 Japanese Patent Laid-Open No. 2001-24312 JP 2001-168493 A

  In the conventional configuration as shown in FIG. 13, a component must be mounted on a substrate, the entire substrate must be resin-sealed to form a metal film, and a shield structure may be partially formed on the substrate. It was difficult.

  The present invention has been made in view of the above problems, and a three-dimensional printed wiring that can form a shield structure in a part of a substrate or a plurality of independent locations by forming a metal film partially on the substrate. A board is provided.

  In order to achieve the above object, the present invention comprises an upper substrate, a lower substrate, and a connection layer connecting these substrates, and the upper substrate and the lower substrate form a recess. The connection layer is an insulating material containing a resin, the through layer is formed at a predetermined position of the connection layer, and the through hole has a via filled with a conductive paste. A three-dimensional printed wiring board characterized in that a metal film is provided so as to cover an opening in which the concave portion of the upper substrate is formed. With such a configuration, a metal is partially formed on the substrate. Since a film can be formed and a recess is further provided, a thin printed wiring board can be realized by mounting a component in the recess.

  As described above, the present invention enables multi-pin connection between substrates and increases the wiring density in the substrate, so that the mobile device is small, thin, lightweight, high-definition, multifunctional, etc. Therefore, it is possible to provide a mounting form that can easily realize a small size, a low profile, and a three-dimensional mounting corresponding to the high-functionality and multi-pin semiconductors necessary for realizing the above.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing an example of a mounting form of a three-dimensional printed wiring board according to an embodiment of the present invention. The three-dimensional printed wiring board according to the present embodiment is composed of an upper substrate 1, a lower substrate 2, and a connection layer 3 having wiring formed on the surface layer and having different shapes, and the upper substrate 1 and the lower substrate 2 are different. Since it has a shape, a recess 4 serving as a cavity is formed as shown in FIG. The connection layer 3 desirably has a thickness of 30 to 300 μm. If the thickness is less than 30 μm, the embedding property of the wiring is deteriorated, and if it exceeds 300 μm, the small diameter ratio of the via for maintaining the aspect ratio of the via becomes difficult, and the connection reliability is impaired.

  As shown in FIG. 1B, by mounting the mounting component 5 in the recess 4, the total thickness of the mounting body can be reduced.

  The three-dimensional printed wiring board of this invention is demonstrated using FIG. As shown in FIG. 2, a metal film 14 is provided so as to cover the upper substrate 1 and the opening of the recess 4 as shown in FIG. By providing the metal film 14 so as to cover the recess 4, it is possible to protect the wiring and electronic components in the recess 4 from electromagnetic field noise and electrostatic solution noise from the outside. Moreover, even if the total thickness of the three-dimensional printed wiring board can be reduced by providing the recesses 4 and the total thickness of the three-dimensional printed wiring board is reduced by providing the metal film 14, the lower substrate 2 is particularly a film substrate. Even so, the metal film 14 can ensure the rigidity of the entire substrate, and if the metal film 14 and the upper substrate 1 are electrically connected, partial shielding can be easily performed. Moreover, since the metal film 14 can be provided at an arbitrary position on the upper substrate 1 by having the concave portion 4, the degree of freedom in design can be improved.

  As shown in FIG. 2B, in the present invention, it is also possible to fill the recess 4 with a filling resin 16 to form a three-dimensional printed wiring board.

  An enlarged cross-sectional view of the connection layer 3 in this embodiment is shown in FIG. The connection layer 3 is an insulating material in which an inorganic filler is dispersed in a thermosetting resin. A through hole is formed at a predetermined position of the connection layer 3, and the conductive paste 6 is filled in the through hole. A via 7 is provided.

  In the present invention, the inorganic filler in the connection layer 3 is preferably composed of at least one of silica, alumina, and barium titanate. Moreover, it is preferable that the particle size of the inorganic filler in the connection layer 3 is 1 to 15 μm, and the content of the inorganic filler is 70 to 90% by weight. If the content of the inorganic filler is less than 70%, the amount of the inorganic filler forming the connection layer 3 is less than the amount of the thermosetting resin and is in a rough state, and when the thermosetting resin flows during the press, At the same time, the inorganic filler also flows, and if it exceeds 90%, the resin amount of the connection layer 3 becomes too small, and the embeddability and adhesion of the wiring may be impaired.

  The conductive paste 6 used for the printed wiring board of the present invention is composed of copper, silver, gold, palladium, bismuth, tin, and alloys thereof, and preferably has a particle size of 1 to 20 μm.

  Next, the manufacturing process of the three-dimensional printed wiring board of this Embodiment is demonstrated in detail using FIGS.

  First, as shown in FIG. 3A, the PET film 8 is attached to both surfaces of the connection layer 3. Next, as shown in FIG. 3B, the connection layer 3 is cut into the shape of the upper substrate 1, and the through holes 9 are formed at positions where the wirings of the upper substrate 1 and the lower substrate 2 are connected. Thereafter, as shown in FIG. 3C, the through-hole 9 is filled with a conductive paste 6 made of copper or a copper alloy, and a via 7 is formed. Next, as shown in FIG. 3D, in order to bond the connection layer 3 to either the upper substrate 1 or the lower substrate 2, the PET film 8 on one surface is peeled off. Here, the lower PET film is peeled off in order to adhere to the lower substrate 2 first, but the upper PET film may be peeled off first.

  Next, as shown in FIG. 4 (A), the connection layer 3 is overlaid while being aligned with a desired position of the lower substrate 2, and as shown in FIG. 4 (B), the connection layer 3 is arranged. Temporarily fix on the wiring 10 formed on the lower substrate 2. The wiring 10 is embedded in the connection layer 3 during this lamination. By doing so, the conductive paste 6 is compressed, so that the connectivity with the wiring 10 is improved. Thereafter, as shown in FIG. 4C, the PET film 8 on the surface that has not been peeled off first is peeled off.

  In the present invention, it is preferable that a solder resist is formed in advance on the surface of the lower substrate 2 before the connection layer 3 is disposed. Further, at least connection is made in the surface layer wiring formed on the lower substrate 2 after the solder resist is formed. More preferably, the area in contact with the layer is roughened.

  Next, as shown in FIG. 5A, the upper substrate 1 is placed on the connection layer 3, and as shown in FIG. 5B, the layers are laminated while being heated and pressurized in the same manner as in the step of FIG. The wiring 10 is embedded in the connection layer 3 during this lamination. By doing so, the conductive paste 6 is further compressed, so that the connectivity with the wiring 10 is greatly improved.

  Further, as shown in FIG. 6, a mounting component 5 such as CSP or BGA is mounted in the recess 4 and filled with a filling resin 16. Then, the metal film 14 is formed on the surface, that is, the opening for forming the concave portion 4 of the upper substrate 1 by plating, thereby completing the three-dimensional printed wiring board 15 of the present invention. With this structure, even if the lower substrate 2 is an extremely thin substrate such as a film substrate, the metal film 14 can ensure the rigidity of the three-dimensional printed wiring board 15 and can be electrically connected to the upper substrate 1. If this is taken, partial shielding is easily possible. The metal film 14 may be formed by attaching a metal foil on the upper substrate 1. In this case, a structure in which the filling resin 16 is not filled is also possible.

  In the present embodiment, the via 7 formed in the connection layer 3 is not necessarily required depending on the substrate design, and a structure without the via 7 may be used.

  In the three-dimensional printed wiring board 15 of the present invention, if the filling resin 16 is filled in the recess 4, the mounting component 5 is built in the filling resin 16. As a result, the mounting component 5 is easily analyzed. It becomes an impossible structure. In addition, when the adhesive strength between the filling resin 16 and the mounting component 5 is larger than the breaking strength of the mounting component 5 itself, the mounting component 5 is bonded to the filling resin 16 with an adhesive strength stronger than its own breaking strength. Therefore, if the mounting component 5 is peeled off in order to separate from the filling resin 16, the mounting component 5 is destroyed. When the mounting component 5 is destroyed in this way, the information held by the mounting component 5 cannot be tampered with or analyzed, and as a result, no information is leaked. As a result, such mounting components 5 are provided with physical security, and a mounting body with improved information reliability can be provided by the structure of the present invention.

  Further, since the mounting component 5 is bonded to the filling resin 16 with an adhesive strength stronger than the connection strength to the wiring 10, if the mounting component 5 is peeled off in order to separate from the filling resin 16, the mounting component 5 and the wiring The electrical connection with the terminal 10 is interrupted, and the mounting component 5 cannot be operated. Therefore, it is possible to provide a mounting body with improved information reliability.

  Further, since the filling resin 16 has a residual stress larger than the breaking strength of the mounting component 5, the mounting component 5 can be analyzed by grinding or polishing the mounting component 5 in order to analyze the mounting component 5. When the filling resin 16 is removed, the residual stress is released. However, since this stress is substantially larger than the breaking strength of the mounting component 5, the mounting component 5 is broken when the residual stress is released, Security can be added. As a result, the information of the mounted component 5 is protected without being leaked. Therefore, such a structure can provide a mounting body with improved information reliability.

  Further, since the filling resin 16 has a residual stress larger than the connection strength between the mounting component 5 and the wiring 10 connected thereto, the mounting component 5 can be scraped in order to analyze the mounting component 5. If the filler resin 16 around the mounting component 5 is removed by polishing, the residual stress is released, but since this stress is greater than the connection strength between the mounting component 5 and the wiring 10, these stresses The connection between them is broken, and the mounted component 5 cannot be operated. Therefore, with such a structure, physical security can be added, and a mounting body with improved information reliability can be provided.

  The thermal expansion coefficient of the connection layer 3 of the present invention is desirably equal to or lower than that of the upper substrate 1 and the lower substrate 2, that is, 65 ppm / ° C. or lower.

  When it exceeds 65 ppm / ° C. or higher than the thermal expansion coefficients of the upper substrate 1 and the lower substrate 2, warping or deformation of the three-dimensional printed wiring board may easily occur due to deformation of the connection layer 3.

  In addition, the glass transition point (DMA method Dynamic Mechanical Analysis dynamic viscoelasticity measurement method) of the connection layer 3 is desirably 185 ° C. or higher or higher by 10 ° C. or more than the upper substrate 1 and the lower substrate 2. If the temperature is less than 185 ° C. or the difference is less than 10 ° C., the substrate warpage or undulation may become a complicated shape or become irreversible in a process requiring a high temperature such as reflow.

  Moreover, the connection layer 3 uses the structure which does not contain core materials, such as a woven fabric, a nonwoven fabric, and a film. When the core material is included, it is difficult to embed the wiring patterns formed on the upper and lower printed wiring board surfaces as described above.

  The minimum melt viscosity of the connection layer 3 is suitably 1000 to 100,000 Pa · s as shown in the melt viscosity curve of FIG. If the pressure is less than 1000 Pa · s, the resin flow becomes large and may flow into the recess 4. If the pressure exceeds 100000 Pa · s, poor adhesion to the printed wiring board or poor embedding in the wiring 10 occurs. There is a fear.

  The connection layer 3 may contain a colorant. In this case, mountability and light reflectivity are improved.

  Moreover, in order to suppress the resin flow of the connection layer 3, that is, it is necessary to prevent the resin from flowing into the recess 4, it is desirable that the connection layer 3 contains an elastomer for suppressing the resin flow. .

  The upper substrate 1 and the lower substrate 2 are not particularly limited as long as they are resin substrates such as through-hole wiring boards and all-layer IVH structure ALIVH wiring boards, and even double-sided boards are multilayer boards. May be. Also, a plurality of printed wiring boards and connection layers may be laminated alternately.

  The insulating material used for the upper substrate 1 and the lower substrate 2 is a composite of glass woven fabric and epoxy resin, but is selected from organic fibers, glass fibers, and alumina fibers selected from aramid and wholly aromatic polyesters. When composed of a composite material of a woven fabric composed of any of inorganic fibers and a thermosetting resin, p-aramid, polyimide, poly-p-phenylene benzobisoxazole, wholly aromatic polyester, PTFE, polyether A case where it is made of a composite material of a non-woven fabric and a thermosetting resin composed of organic fibers and glass fibers selected from sulfone and polyetherimide, and inorganic fibers selected from alumina fibers; and p-aramid and poly-p- Phenylenebenzobisoxazole, wholly aromatic polyester, polyetherimide, polyether keto Using a composite material in which a thermosetting resin layer is formed on both sides of a synthetic resin film of at least one of polyether ether ketone, polyethylene terephthalate, polytetrafluoroethylene, polyether sulfone, polyester terephthalate, polyimide and polyphenylene sulfide An insulating material may be formed.

  As the thermosetting resin, at least one thermosetting resin selected from an epoxy resin, a polybutadiene resin, a phenol resin, a polyimide resin, a polyamide resin, and a cyanate resin can be used.

(Embodiment 2)
Embodiment 2 of the present invention will be described below with reference to the drawings. In addition, about what has the same structure as Embodiment 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  FIG. 8 is a perspective view showing an example of a mounting form of the three-dimensional printed wiring board in the embodiment of the present invention. The three-dimensional printed wiring board of the present embodiment has the same configuration as the three-dimensional printed wiring board of the first embodiment. A feature of the second embodiment is that the connection layer 3 is an insulating material made of a thermoplastic resin, and the connection layer 3 has a via filled with a conductive paste. The connection layer 3 desirably has a thickness of 30 to 300 μm.

  In the three-dimensional printed wiring board of the present invention, as in the first embodiment, a metal film 14 is provided so as to cover the upper substrate 1 and the openings of the recesses 4 as shown in FIG. By providing a metal film so as to cover the recess, the wiring and electronic components in the recess 4 can be protected from external electromagnetic noise and electrostatic field noise. Moreover, even if the total thickness of the three-dimensional printed wiring board can be reduced by providing the concave portion 4 and the total thickness of the three-dimensional printed wiring board is thin by providing a metal film, the lower substrate 2 is particularly a film substrate. Even if it exists, while it becomes possible to ensure the rigidity of the whole board | substrate with the metal film 14, if the conduction | electrical_connection with the metal film 14 and the upper board | substrate 1 is taken, a partial shield will be attained easily. Moreover, since the metal film can be provided at an arbitrary position on the substrate by having the concave portion 4, the degree of design freedom can be improved.

  Further, as in the first embodiment, as shown in FIG. 9B, it is also possible to fill the recess 4 with a filling resin 16 to form a three-dimensional printed wiring board.

  An enlarged cross-sectional view of the connection layer 3 in the present embodiment is shown in FIG. The connection layer 3 is made of an insulating material made of a thermoplastic resin. A through hole is formed at a predetermined position of the connection layer 3, and the through hole has a via 7 filled with a conductive paste 6. .

  Next, the manufacturing process of the three-dimensional printed wiring board of this Embodiment is demonstrated in detail using FIG.

  First, since the connection layer 3 in the present embodiment does not have adhesiveness, the adhesive layer 12 made of a thermosetting resin having a thickness of 1 to 10 μm is formed as a temporary fixing means for attaching the cover film 13. In addition, since a pinhole will generate | occur | produce when thickness is less than 1 micrometer, when it exceeds 10 micrometers, there exists a possibility that the cover film 13 may not be peeled in a post process. After forming the adhesive layer 12, cover films 13 are attached to both surfaces of the connection layer 3. This state is shown in FIG. Note that the adhesive layer 12 may be attached to the connection layer described in Embodiment 1, that is, a layer made of an insulating material in which an inorganic filler is dispersed in a thermosetting resin.

  The adhesive layer 12 preferably has no tackiness at room temperature in order to improve laminating properties. Next, as shown in FIG. 10B, the connection layer 3 is cut into the shape of the upper substrate 1, and a through hole 9 is formed at a position where the wiring of the upper substrate 1 and the lower substrate 2 are connected. Next, as shown in FIG. 10C, the through-hole 9 is filled with a conductive paste 6 made of copper or a copper alloy, and a via 7 is formed. Next, as shown in FIG. 10D, in order to adhere the connection layer 3 to the upper substrate 1 and the lower substrate 2, the cover films 13 on both sides are peeled off.

  Next, as shown in FIG. 11A, the connection layer 3 is disposed at a desired position on the upper substrate 1 and the lower substrate 2, and as shown in FIG. And they are stacked so as to be sandwiched between the lower substrates 2 and laminated while being heated and pressurized. The wiring 10 is embedded in the connection layer 3 during this lamination. By doing so, the conductive paste 6 is further compressed, so that the connectivity with the wiring 10 is greatly improved. In this embodiment, the stacking method shown in FIGS. 4 and 5 of Embodiment 1 may be used.

  Furthermore, as shown in FIG. 12, mounting parts 5 such as CSP and BGA are mounted in the recesses 4 and filled with a filling resin, and the filling resin is filled. Then, the metal film 14 is formed on the surface, that is, the opening for forming the concave portion 4 of the upper substrate 1 by plating, thereby completing the three-dimensional printed wiring board 15 of the present invention. With this structure, even if the lower substrate 2 is an extremely thin substrate such as a film substrate, the metal film 14 can ensure the rigidity of the three-dimensional printed wiring board 15 and can be electrically connected to the upper substrate 1. If this is taken, partial shielding is easily possible. The metal film 14 may be formed by attaching a metal foil on the upper substrate 1.

  Similarly to the first embodiment, the via 7 formed in the connection layer 3 in this embodiment is not necessarily required depending on the substrate design, and may have a structure without the via 7.

  In the three-dimensional printed wiring board 15 of the present embodiment, as in the first embodiment, if the filling resin 16 is filled in the recess 4, the mounting component 5 is built in the filling resin 16. As a result, the mounting component 5 has a structure that cannot be easily analyzed. In addition, when the adhesive strength between the filling resin 16 and the mounting component 5 is larger than the breaking strength of the mounting component 5 itself, the mounting component 5 is bonded to the filling resin 16 with an adhesive strength stronger than its own breaking strength. Therefore, if the mounting component 5 is peeled off in order to separate from the filling resin 16, the mounting component 5 is destroyed. When the mounting component 5 is destroyed in this way, the information held by the mounting component 5 cannot be tampered with or analyzed, and as a result, no information is leaked. As a result, such mounting components 5 are provided with physical security, and a mounting body with improved information reliability can be provided by the structure of the present invention.

  Further, since the mounting component 5 is bonded to the filling resin 16 with an adhesive strength stronger than the connection strength to the wiring 10, if the mounting component 5 is peeled off in order to separate from the filling resin 16, the mounting component 5 and the wiring The electrical connection with the terminal 10 is interrupted, and the mounting component 5 cannot be operated. Therefore, it is possible to provide a mounting body with improved information reliability.

  Further, since the filling resin 16 has a residual stress larger than the breaking strength of the mounting component 5, the mounting component 5 can be analyzed by grinding or polishing the mounting component 5 in order to analyze the mounting component 5. When the filling resin 16 is removed, the residual stress is released. However, since this stress is substantially larger than the breaking strength of the mounting component 5, the mounting component 5 is broken when the residual stress is released, Security can be added. As a result, the information of the mounted component 5 is protected without being leaked. Therefore, such a structure can provide a mounting body with improved information reliability.

  Further, since the filling resin 16 has a residual stress larger than the connection strength between the mounting component 5 and the wiring 10 connected thereto, the mounting component 5 can be scraped in order to analyze the mounting component 5. If the filler resin 16 around the mounting component 5 is removed by polishing, the residual stress is released, but since this stress is greater than the connection strength between the mounting component 5 and the wiring 10, these stresses The connection between them is broken, and the mounted component 5 cannot be operated. Therefore, with such a structure, physical security can be added, and a mounting body with improved information reliability can be provided.

  In the first embodiment also, the adhesive layer 12 may be formed before the PET film 8 is formed on the connection layer 3, and in this case, the effect of preventing the material of the connection layer 3 from being crushed can be obtained.

  As the thermoplastic resin of the connection layer 3 in the present embodiment, PPS (polyphenylene sulfide), PEEK (polyether ether ketone), PES (polyether sulfone), thermoplastic polyimide, or the like is used.

  The thermal expansion coefficient of the connection layer 3 of the present invention is desirably equal to or lower than that of the upper substrate 1 and the lower substrate 2, that is, 65 ppm / ° C. or lower.

  The glass transition point (DMA method) of the connection layer 3 is preferably 185 ° C. or higher or higher by 10 ° C. or more than the upper substrate 1 and the lower substrate 2.

  Moreover, the connection layer 3 uses the structure which does not contain core materials, such as a woven fabric, a nonwoven fabric, and a film. When the core material is included, it is difficult to embed the wiring patterns formed on the upper and lower printed wiring board surfaces as described above.

  As in the first embodiment, the minimum melt viscosity of the connection layer 3 is suitably 1000 to 100,000 Pa · s as shown in the melt viscosity curve of FIG.

  The upper substrate 1 and the lower substrate 2 are not particularly limited as long as they are resin substrates such as through-hole wiring boards and all-layer IVH structure ALIVH wiring boards, and even double-sided boards are multilayer boards. May be. Also, a plurality of printed wiring boards and connection layers may be laminated alternately.

  The insulating material used for the upper substrate 1 and the lower substrate 2 is a composite of glass woven fabric and epoxy resin, but is selected from organic fibers, glass fibers, and alumina fibers selected from aramid and wholly aromatic polyesters. When composed of a composite material of a woven fabric composed of any of inorganic fibers and a thermosetting resin, p-aramid, polyimide, poly-p-phenylene benzobisoxazole, wholly aromatic polyester, PTFE, polyether A case where it is made of a composite material of a non-woven fabric and a thermosetting resin composed of organic fibers and glass fibers selected from sulfone and polyetherimide, and inorganic fibers selected from alumina fibers; and p-aramid and poly-p- Phenylenebenzobisoxazole, wholly aromatic polyester, polyetherimide, polyether keto Using a composite material in which a thermosetting resin layer is formed on both sides of a synthetic resin film of at least one of polyether ether ketone, polyethylene terephthalate, polytetrafluoroethylene, polyether sulfone, polyester terephthalate, polyimide and polyphenylene sulfide An insulating material may be formed.

  As the thermosetting resin, at least one thermosetting resin selected from an epoxy resin, a polybutadiene resin, a phenol resin, a polyimide resin, a polyamide resin, and a cyanate resin can be used.

  The three-dimensional printed wiring board according to the present invention can be formed with a thin total board thickness as a mounting body after component mounting, so that it is small, thin, lightweight, high definition, multifunctional such as a personal computer, a digital camera, a mobile phone, etc. It can be used as a package substrate for dealing with the above and the like, and can be applied to applications related to these mounting substrates as one of the methods for easily realizing a low-profile and three-dimensional mounting of a semiconductor package.

The perspective view which shows an example of the three-dimensional printed wiring board in Embodiment 1 of this invention. The perspective view and sectional drawing which show an example of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 1 of this invention Sectional drawing which shows an example of the three-dimensional printed wiring board in Embodiment 1 of this invention The figure which shows the melt viscosity of the connection layer of the three-dimensional printed wiring board in Embodiment 1, 2 of this invention The perspective view which shows an example of the three-dimensional printed wiring board in Embodiment 2 of this invention. The perspective view and sectional drawing which show an example of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional drawing which shows the manufacturing process of the three-dimensional printed wiring board in Embodiment 2 of this invention Sectional drawing which shows an example of the three-dimensional printed wiring board in Embodiment 2 of this invention Diagram showing a conventional printed wiring board

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Upper substrate 2 Lower substrate 3 Connection layer 4 Recessed part 5 Mounting component 6 Conductive paste 7 Via 8 PET film 9 Through-hole 10 Wiring 12 Glue layer 13 Cover film 14 Metal film 15 Three-dimensional printed wiring board 16 Filling resin

Claims (15)

The upper substrate, the lower substrate, and a connection layer that connects between these substrates, the upper substrate and the lower substrate have different shapes to form a recess, the connection layer is An opening made of an insulating material containing a resin, having a through-hole formed at a predetermined position of the connection layer, and having a via filled with a conductive paste in the through-hole and forming the concave portion of the upper substrate A three-dimensional printed wiring board characterized in that a metal film is provided so as to cover the top. A mounting component is mounted in the recess and a filling resin is filled in the recess, and an adhesive strength between the filling resin and the mounting component is larger than a breaking strength of the mounting component itself. The three-dimensional printed wiring board according to claim 1. A mounting component is mounted in the recess and filled with a filling resin, and an adhesive strength between the filling resin and the mounting component is between the mounting component and the wiring pattern connected thereto. The three-dimensional printed wiring board according to claim 1, wherein the three-dimensional printed wiring board is greater than connection strength. 2. The three-dimensional printed wiring according to claim 1, wherein a mounting component is mounted in the recess and a filling resin is filled in the recess, and the filling resin has a residual stress larger than a breaking strength of the mounting component. Board. A mounting component is mounted in the recess, and a filling resin is filled in the recess, and the filling resin has a residual stress larger than a connection strength between the mounting component and a wiring pattern connected thereto. The three-dimensional printed wiring board according to claim 1. The three-dimensional printed wiring board according to claim 1, wherein the connection layer is formed by dispersing an inorganic filler in a thermosetting resin. The three-dimensional printed wiring board according to claim 1, wherein the connection layer is made of a thermoplastic resin.  The three-dimensional printed wiring board according to claim 1, wherein the connection layer does not include a core material. The three-dimensional printed wiring board according to claim 1, wherein the lower substrate is a film substrate. The three-dimensional printed wiring board according to claim 1, wherein the connection layer contains a colorant. A connection layer having an insulating material containing a resin for adhering between the upper substrate and the lower substrate on which wiring is formed on the surface layer and the substrate is prepared, and the upper substrate and the connection are formed to form a recess. Cutting the layer into a desired shape, forming a through hole at a predetermined position of the connection layer, filling the through hole with a conductive paste, and on the lower substrate or the upper substrate A step of superposing the connection layer on the connection layer, a step of superimposing the other substrate on the connection layer, and a layering process while heating and pressurizing the lower substrate, the connection layer, and the upper substrate. And a step of forming a metal film on the opening in which the concave portion is formed. A method for manufacturing a three-dimensional printed wiring board, comprising: Before preparing a connection layer having an insulating material containing a resin for connecting between the upper and lower substrates on which wiring is formed on the surface layer and the substrates, a solder resist is previously formed on the surface of the lower substrate. The manufacturing method of the three-dimensional printed wiring board of Claim 11 provided with the process of forming. The manufacturing method of the three-dimensional printed wiring board of Claim 12 provided with the process of previously forming a soldering resist on the surface of an upper board | substrate. Before the step of laminating the lower substrate, the connection layer, and the upper substrate, the method includes a step of roughening at least a region in contact with the connection layer in a surface wiring formed in advance on the lower substrate. Item 12. A method for producing a three-dimensional printed wiring board according to Item 11. A step of roughening at least a region in contact with the connection layer in a surface layer wiring formed in advance on the upper substrate before the step of laminating the lower substrate, the connection layer, and the upper substrate. The manufacturing method of the three-dimensional printed wiring board of 11.

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