JP2009038147A - Electronic component mounting device - Google Patents

Abstract

An object of the present invention is to provide a plurality of suction nozzles so that the mutual interference of the suction nozzles does not occur even when the interval between the suction nozzles becomes narrow.
When a nozzle shaft 22 is lowered along a guide cylinder 24 via a bearing 23 by a nozzle lifting device, the nozzle shaft 22 is lowered together with the urging force of a spring 27. Even if the suction nozzle 15 is lowered and the upper portion of the protective cylinder 28 is positioned above the upper end of the spring 27, the spring 27 is not exposed to the outside even if the nozzle shaft 22 and the suction nozzle 15 are lowered. Thus, the protection cylinder 28 protects. Thereby, even if the arrangement | positioning space | interval becomes narrow by arranging the several nozzle body 21 in the space S in parallel with few clearance gaps, the mutual interference of the nozzle body 21 including the spring 27 is carried out. Can be prevented.
[Selection] Figure 4

Description

  The present invention relates to an electronic component mounting apparatus that includes a mounting head in which a plurality of suction nozzles are arranged in parallel, and that mounts an electronic component taken out from the component supply device by the suction nozzle onto a printed circuit board.

This type of electronic component mounting apparatus is widely known from Patent Document 1 and the like. In general, a plurality of suction nozzles are provided at predetermined intervals on the peripheral edge of the mounting head. However, when a large number of suction nozzles are provided, the arrangement interval between them becomes narrow.
JP 2007-36163 A

  However, when the interval between the suction nozzles is narrowed, when the spring that urges the suction nozzle in the raised state is wound around, the spring spreads in the lateral direction when the spring contracts. As a result, it interferes with the spring for the adjacent suction nozzle.

  In view of the above, an object of the present invention is to provide a plurality of suction nozzles so that mutual interference of the suction nozzles does not occur even when the interval between the suction nozzles is reduced.

  For this reason, the first invention is provided in an electronic component mounting apparatus that includes a mounting head in which a plurality of suction nozzles are arranged side by side and mounts an electronic component taken out from the component supply device by the suction nozzle onto a printed circuit board. A spring for energizing the suction nozzles to be lowered is wound around the suction nozzles to protect the springs from being exposed to the outside even when the suction nozzles are moved up and down. A protective cylinder is provided.

  According to a second aspect of the present invention, there is provided an electronic component mounting apparatus including a mounting head in which a plurality of suction nozzles are arranged in parallel, and mounting an electronic component taken out from the component supply device by the suction nozzle on a printed circuit board. The suction nozzle is provided at the lower end of each nozzle shaft in which a vacuum passage for suction of electronic parts is formed, and a spring that energizes the suction nozzle to be lowered is wound around the nozzle shaft. A protective cylinder is provided to protect the springs from being exposed to the outside even when the nozzle shaft and the suction nozzle are raised and lowered.

  According to a third aspect of the present invention, there is provided an electronic component mounting apparatus including a mounting head in which a plurality of suction nozzles are arranged in parallel, and mounting an electronic component taken out from the component supply device by the suction nozzle on a printed circuit board. A spring that biases each suction nozzle to descend is provided so as to be wound around each suction nozzle, and each spring is housed in a protective cylinder.

  According to a fourth aspect of the present invention, there is provided an electronic component mounting apparatus including a mounting head in which a plurality of suction nozzles are arranged in parallel, and mounting an electronic component taken out from the component supply device by the suction nozzle onto a printed circuit board. The suction nozzle is provided at the lower end of each nozzle shaft in which a vacuum passage for suction of electronic parts is formed, and a spring that energizes the suction nozzle to be lowered is wound around the nozzle shaft. It is provided to rotate, and each of the springs is housed in a protective cylinder.

  The present invention can provide a plurality of suction nozzles so that mutual interference of the suction nozzles does not occur even when the interval between the suction nozzles is reduced. In addition, it is possible to prevent a situation in which an electronic component is accidentally sandwiched when the suction nozzle is lowered.

  Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the accompanying drawings. 1 is a plan view of the electronic component mounting apparatus 1, FIG. 2 is a front view of a lower main body of the electronic component mounting apparatus 1, and FIG. 3 is a right side view of the electronic component mounting apparatus 1 on the base 2 of the apparatus 1. On the feeder bases 3A, 3B, 3C, and 3D, a plurality of component supply units 3 that supply various electronic components one by one to the component take-out position (component suction position) are fixed in parallel and detachable in a stationary state. ing. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 sequentially conveys the printed circuit board P received from the upstream to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by the positioning unit 5 by the positioning unit 5, it is conveyed to the discharge conveyor 6. The

  Reference numeral 8 denotes a pair of front and rear beams which are provided in the left and right portions of the mounting apparatus 1 and which are long in the X direction, and sliders 11 fixed to the beams 8 along the pair of left and right guides 10 by driving the linear motors 9. By sliding, the printed circuit board P on the positioning unit 5 and the component take-out position above the component supply unit 3 are individually moved in the Y direction. The linear motor 9 includes a pair of upper and lower stators 9A fixed to the base 2 and a mover 9B fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along a guide 13 by a linear motor 14 in the longitudinal direction (X direction). As shown in FIG. 3, the linear motor 14 includes a pair of front and rear stators 14A fixed to the beam 8, and a mover 14B provided between the stators 14A and provided on the mounting head body 7. Composed.

  Each mounting head body 7 includes a mounting head 16 having a suction nozzle 15 biased downward by 15 springs 27. Each mounting head 16 of each mounting head body 7 is provided with a board recognition camera, and images a positioning mark attached to the printed board P being positioned.

  Hereinafter, the mounting head 16 will be described. The head lifting device includes a guide for guiding the mounting head 16 when the mounting head 16 is moved up and down, a head lifting motor that drives the ball screw to rotate and lifts the mounting head 16 via a lifting nut, and a head lifting motor to which the head lifting motor is attached. It is comprised from the support body etc. which support the upper part of rotation freely. Then, the ball screw is rotated by the rotation of the head elevating motor to raise and lower the elevating nut. As a result, the mounting head 16 is raised and lowered while being guided by the guide.

  In addition, a nozzle support 20 that supports each of the suction nozzles 15 arranged on the circumference at a predetermined interval for every predetermined angle so as to move up and down is provided below the mounting head 16, and further, the mounting head. 16 is provided with an outer cylindrical body, and a nozzle rotation motor for θ rotation of the suction nozzle 15 is provided between the outer cylindrical body and the nozzle support 20. And the rotor of this nozzle rotation motor is provided in the outer peripheral surface of the nozzle support body 20, and the nozzle support body 20 is rotatably provided in the (theta) direction inside the stator provided in the said outer cylinder.

  Further, the suction nozzle 15 selected by the nozzle selection device is moved up and down by a predetermined stroke by the nozzle lifting device provided in the mounting head 16. The nozzle support 20 is formed with a space S for arranging a plurality of nozzle bodies 21 to be described later at a predetermined interval. That is, the nozzle support 20 has a circular outer shape when the bottom surface is viewed in plan, and the space S is a circular center concentric with the outer circle when the bottom surface of the nozzle support 20 is viewed in plan. It is formed by a groove having a constant width and a constant depth provided around the periphery of the part. In FIG. 6, two nozzle bodies 21 are shown, and the description of the other nozzle bodies 21 is omitted.

  The nozzle body 21 disposed in the space S is attached to the suction nozzle 15 provided with an air passage 15A in the central portion for sucking and holding electronic components, and the suction nozzle 15 is detachably attached to the lower end portion. A nozzle shaft body 22 having an air passage 22A communicating with the air passage 15A of the suction nozzle 15 at the center and moving up and down by the nozzle lifting device, and a guide for guiding the up and down movement through a bearing 23 outside the nozzle shaft body 22. Between the cylindrical body (ball spline) 24 and the first step portion 25 formed on the nozzle shaft body 22 so as to surround the nozzle shaft body 22 and the step portion 26 formed on the guide cylinder body 24. A coiled spring 27 that is stretched to urge the nozzle shaft body 22 and the suction nozzle 15 to descend, and a lower end is fixed on the second step portion 29 formed on the nozzle shaft body 22. Provided on the outside of the guide cylinder body 24 is and a protective pipe 28 which covers the spring 27. When the spring 27 is housed in the protective cylinder 28 and the nozzle shaft body 22 and the suction nozzle 15 are raised or lowered along the guide cylinder 24, the protective cylinder 28 is not attached to the spring 27. Protect from exposure to the outside.

  When the nozzle shaft body 22 and the suction nozzle 15 are raised, the spring 27 contracts and is kept biased so as to be lowered. When the nozzle shaft body 22 and the suction nozzle 15 are lowered by the nozzle elevating device, the protective cylinder 28 is lowered together with the urging force of the spring 27, but the spring 27 is extended. Even when the suction nozzle 15 is lowered, the upper part of the protective cylinder 28 with the lower end fixed is positioned above the upper end of the spring 27 so that the nozzle shaft 22 and the suction nozzle 15 are moved up and down. The spring 27 is protected from being exposed to the outside.

  Thereby, even if the mutual arrangement | positioning space | interval becomes narrow by arranging the several nozzle body 21 in the said space S side by side with few clearance gaps, the nozzle body 21 (including the spring 27) of Mutual interference can be prevented, and particularly when the spring 27 contracts, even if it spreads laterally and buckles, interference with the spring 27 for the adjacent nozzle body 21 can be prevented. Further, since the spring 27 is protected from being exposed to the outside by the protective cylinder 28, it is possible to prevent dust from adhering to the spring 27. In addition, it is conceivable that the upper end of the protective cylinder 28 is fixed to the guide cylinder 24 and the lower end is not fixed (free state). In this case, the suction nozzle 15 is raised when the suction nozzle 15 is raised. When the lower end of the guide cylinder 24 needs to be positioned above the lower end, and the vertical dimension of the guide cylinder 28 cannot be sufficiently secured, the nozzle shaft body 22 and the suction nozzle 15 are Although the spring 27 is exposed to the outside and dust is attached to the spring 27, the protective cylinder 28 is formed on the second step portion 29 formed on the nozzle shaft body 22 as in the present embodiment. The effect as described above can be obtained by fixing the lower end to the surface.

  The communication between the air passage 15A of the suction nozzle 15 and the air passage 22A of the nozzle shaft body 22 is switched between the evacuation passage or the air blow passage by a passage switching body (not shown). That is, when the passage switching body is in one state, it communicates with the evacuation passage, the air blow passage is shut off, and the air passage 15A of the suction nozzle 15 communicates with the vacuum source via the evacuation passage. The suction nozzle 15 maintains vacuum suction of electronic components. When the passage switching body is in the other state, the evacuation passage is shut off and the air blow passage is communicated to stop the vacuum suction of the electronic component by the suction nozzle 15 and supply air to the air passage 15A of the suction nozzle 15 Air from the source is blown through the air blow passage.

  A component recognition camera 30 captures an image of the electronic component sucked and held by the suction nozzle 15, and a recognition processing device performs a recognition process on the captured image.

  Next, the operation of sucking and mounting electronic components by the electronic component mounting apparatus 1 will be described in detail below with the above configuration. First, when the work manager presses the operation start switch portion of the touch panel switch displayed on the monitor, the control device first returns the nozzle rotation motor to the origin position, and the printed circuit board P is transferred from the upstream device via the supply conveyor 4. Then, it is carried into the positioning unit 5 and the positioning operation is started by the positioning mechanism.

  Next, the control device performs an electronic component suction operation in accordance with the mounting data stored in the storage device. That is, the suction nozzle corresponding to the component type of the electronic component according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the storage device, the rotation angle position about the vertical axis, the arrangement number, and the like are designated. The electronic component 15 to be mounted is picked up and taken out from the predetermined component supply unit 3.

  At this time, the linear motors 9 and 14 are controlled by the control device so that the suction nozzle 15 of each mounting head 16 of each mounting head body 7 above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven to move each beam 8 along a pair of guides 10, and in the X direction, the linear motor 14 is driven to move each mounting head along the guide 13. The body 7 moves.

  Since each predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the head lifting motor rotates, and the mounting head 16 moves down to a predetermined height along the guide. Next, when a suction nozzle (hereinafter referred to as “first suction nozzle”) 15 that first sucks an electronic component is deviated from a predetermined suction position, the control device moves the first suction nozzle 15 to the suction position. A signal for movement is output to rotate the nozzle rotation motor, and the nozzle support 20 of the mounting head 16 is rotated by θ.

  Then, after the first suction nozzle 15 has moved to the suction position, it is output to the nozzle lifting / lowering motor, and the nozzle lifting / lowering motor 51 is driven to lower the first suction nozzle 15 and lower the electronic component from the component supply unit 3. . When the suction operation of the electronic component by the first suction nozzle 15 is completed, the nozzle lifting motor is reversed to raise the first suction nozzle 15.

  And when electronic components can be chain-sucked by the mounting head 16, as in the case of the first suction nozzle, among the 15 suction nozzles 15 provided on the nozzle support 20 as described above, that is, the second suction nozzle. The remaining selected suction nozzles of the 15th to 15th suction nozzles are also subjected to multi-chain suction (as many electronic components as possible are continuously sucked).

  Thereafter, a component recognition operation such as imaging of an electronic component by the component recognition camera 30 and a recognition process of the recognition processing device is performed, and the mounting operation to the printed circuit board P is performed. That is, the control device controls the linear motors 9 and 14 so that the suction nozzle 15 moves to the mounting coordinate position on the printed circuit board P positioned by the positioning unit 5 in consideration of the recognition processing result from the recognition processing device. In the Y direction, the linear motor 9 is driven to move the beams 8 along the pair of guides 10, and in the X direction, the linear motor 14 is similarly driven to move the mounting head bodies 7 along the guides 13. The electronic component is mounted on the printed circuit board P by controlling the nozzle rotation motor, the head lifting motor, and the nozzle lifting motor.

  In this case, the operation when the suction nozzle 15 moves up and down when the electronic component is taken out from the component supply unit 3 by the suction nozzle 15 and the electronic component is mounted on the printed board P will be described with reference to FIG.

  The right suction nozzle 15 in FIG. 4 shows the raised state, and the left suction nozzle 15 shows the lowered state when taking out the electronic component or mounting the electronic component on the printed circuit board P. That is, when the nozzle shaft body 22 and the suction nozzle 15 are raised, the spring 27 contracts and is kept biased so as to descend, and the spring 27 spreads laterally and buckles. However, the protection cylinder 28 protects the spring 27 from being exposed to the outside, and can prevent interference with the adjacent nozzle body 21, particularly the spring 27.

  In addition, when the nozzle shaft body 22 is lowered along the guide cylinder 24 via the bearing 23 by the nozzle lifting device, the nozzle shaft body 22 is lowered together with the urging force of the spring 27. Even when the suction nozzle 15 is lowered due to the extension 27, the upper portion of the protective cylinder 28 is located above the upper end of the spring 27, so that the spring 27 remains even if the nozzle shaft 22 and the suction nozzle 15 are lowered. Is protected by the protective cylinder 28 so as not to be exposed to the outside. Thereby, even if the mutual arrangement | positioning space | interval becomes narrow by arranging the several nozzle body 21 in the said space S side by side with few clearance gaps, the nozzle body 21 (including the spring 27) of Mutual interference can be prevented. In addition, when the suction nozzle 15 is lowered, it is possible to prevent the occurrence of a situation in which the spring 27 sandwiches an electronic component that is mistakenly mounted on the printed circuit board P.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a front view of an electronic component mounting apparatus. It is a right view of an electronic component mounting apparatus. It is a side view of the mounting head body which cut the nozzle body vertically. It is a schematic bottom view of a mounting head. It is a partial cross section top view of a mounting head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 7 Mounting head body 15 Adsorption nozzle 16 Mounting head 20 Nozzle support body 21 Nozzle body 22 Nozzle shaft body 27 Spring 28 Protection cylinder body

Claims (4)

  In an electronic component mounting apparatus that includes a mounting head in which a plurality of suction nozzles are arranged in parallel and mounts an electronic component taken out from the component supply device by the suction nozzle onto a printed circuit board, the suction nozzles in the raised state are lowered. A spring that is energized so as to be wound around each of the suction nozzles, and a protective cylinder that protects the springs from being exposed to the outside even when the suction nozzle is raised or lowered. A characteristic electronic component mounting device.   In an electronic component mounting apparatus that includes a mounting head in which a plurality of suction nozzles are arranged in parallel and mounts an electronic component taken out from the component supply device by the suction nozzle on a printed circuit board. The suction nozzle is provided at the lower end of each nozzle shaft in which a vacuum passage is formed, and a spring for energizing the suction nozzle to be lowered is wound around the nozzle shaft. An electronic component mounting apparatus comprising a protective cylinder for protecting the springs from being exposed to the outside even when the nozzle shaft and the suction nozzle are moved up and down.   In an electronic component mounting apparatus that includes a mounting head having a plurality of suction nozzles arranged side by side and mounts an electronic component taken out from the component supply device by the suction nozzle onto a printed circuit board, the suction nozzles in the raised state are lowered. An electronic component mounting apparatus comprising: a spring that is energized so as to wind around each of the suction nozzles, and the springs are housed in a protective cylinder.   In an electronic component mounting apparatus that includes a mounting head in which a plurality of suction nozzles are arranged in parallel and mounts an electronic component taken out from the component supply device by the suction nozzle on a printed circuit board. The suction nozzle is provided at the lower end of each nozzle shaft in which a vacuum passage is formed, and a spring for energizing the suction nozzle to be lowered is wound around the nozzle shaft. An electronic component mounting apparatus, wherein each of the springs is housed in a protective cylinder.