JP2009030444A - Control device of vehicular fuel pump - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a control device of a vehicular fuel pump capable of minimizing enlargement even if a noise filter circuit is arranged. <P>SOLUTION: A heat sink 13 is divided into a heat sink body 15 and a sub-heat sink 16, and components 3, 5, 7, 9 and 11 of a control circuit including the noise filter circuit, are respectively mounted on the heat sink body 15 and the sub-heat sink 16, and the heat sink body 15 and the sub-heat sink 16 are joined. Thus, since the components of the control circuit vertically overlap with each other, the footprint of the control device 1 can be reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a control device for a vehicle fuel pump that supplies fuel stored in a fuel tank of a vehicle to the outside.

In a control device for a fuel pump for a vehicle, switching noise generated from the control circuit adversely affects the in-vehicle radio when arranged in the passenger compartment. It is carried out on a lid that closes the opening of the fuel tank. As a result, the load line from the control circuit that becomes a noise source can be shortened, and the control device can be arranged outside the passenger compartment. It was possible to achieve both noise reduction. In this case, although the switching noise is radiated from the fuel pump itself located in the fuel tank, the switching noise from the fuel tank does not become a problem because it is shielded by the metal tank.
JP 2005-155602 A

However, in recent years, since the fuel tank is being changed from metal to plastic, in the plastic fuel tank, switching noise from the fuel pump itself located in the fuel tank penetrates the fuel tank and further to the ground. It is reflected and picked up as noise by the radio antenna.
This problem can be solved by providing a noise filter in the control device, as has been done in the past, but because the coils and capacitors that make up the noise filter are large, the control device becomes larger and has a larger installation area. Need to.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a vehicle fuel pump control device that can prevent an increase in size even if a noise filter is provided.

  According to the first aspect of the present invention, a sub heat sink is provided to face the heat sink body, and at least a part of the noise filter circuit component is arranged on the sub heat sink side among the control circuit component and the noise filter circuit component. Since the remaining noise filter circuit components and control circuit components are arranged on the heat sink body side, the control circuit and noise filter circuit components can be partially stacked in two stages, A small control device that does not require a large installation area can be obtained.

In the invention of claim 2, since the heat sink main body and the sub heat sink are separate bodies, the assembly of components to each is facilitated.
In the invention of claim 3, the heat sink body and the sub heat sink are each unitized with other components, so that the assembly is facilitated.
In the invention according to claim 4, since the heat sink body and the sub heat sink are integrally formed, the coupling step between them can be omitted.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2 show a control device 1 for a fuel pump for a vehicle, and FIG. 4 shows a configuration of a control circuit 2 that the control device 1 has. As can be understood from FIG. 4, the control circuit 2 is composed mainly of a control IC 3. The control IC 3 is formed by resin molding a power MOS as a switching element and an IC for controlling the power MOS.

  The input terminal of the control IC 3 is connected to the control terminal FPC and the diagnosis terminal DI of the control device 1. The control terminal FPC is a terminal to which a control signal for the control IC 3 is input from the engine ECU 4, and the diagnosis terminal DI is a terminal for diagnosing the control IC 3 by the engine ECU 4. The power supply terminal of the control IC 3 is connected to the power supply terminal + B of the control device 1 via the first coil 5 and is connected to the positive terminal of the vehicle battery 6 through the power supply terminal + B.

  The ground terminal of the control IC 3 is connected to the ground terminal E of the control device 1 and is grounded to the vehicle body through the ground terminal E. The output terminal of the control IC 3 is connected to the negative terminal FP− of the control device 1 through the second coil 7 and is connected to the negative terminal of the fuel pump 8 through the negative terminal FP−. The positive terminal of the fuel pump 8 is connected to the positive terminal FP + of the control device 1 and is connected to the power supply terminal + B of the control device 1 through the positive terminal FP +.

  The first electrolytic capacitor 9 is connected between the power supply terminal of the control IC 3 and the ground terminal, and the second terminal between the power supply terminal + B and the positive terminal FP + of the control device 1 and the ground terminal E is the second. The film capacitor 11 is connected between the negative terminal FP− of the control device 1 and the ground terminal E. The first and second electrolytic capacitors 9 and 10 and the film capacitor 11 together with the first and second coils 5 and 7 form a noise filter circuit 12 for absorbing switching noise of a power MOS included in the control IC 3. is doing. Note that the electrical and electronic components shown in FIG. 4 are the main components constituting the control circuit of the control device 1, and the control device 1 actually includes a number of other electrical and electronic components.

  As shown in FIGS. 1 and 2, the control device 1 includes a heat sink 13 made of a material having excellent thermal conductivity, such as aluminum, and the control terminal FPC, the iagnosis terminal DI, and the power supply terminal. + B, ground terminal E, negative terminal FP−, plastic connector housing 14 in which positive terminal FP + is insert-molded, and the above-described electrical and electronic parts 3, 5, 7, 9 to 11 are attached.

  The heat sink 13 includes a heat sink main body 15 and a sub heat sink 16 that is about half the size of the heat sink main body 15 and is disposed to face the heat sink main body 15. At one end of the heat sink body 15 and the sub heat sink 16, connection portions 15a and 16a project in an L shape. As shown in FIG. 3, one of the connection portions 15a and 16a, for example, the heat sink body 15 A plurality of pins (coupling means) 15b are integrally projected on the connecting portion 15a, and a plurality of fitting holes (coupling means) 16b are formed on the other connecting portion 16a. Then, by fitting the pin 15b into the fitting hole 16b, the heat sink body 15 and the sub heat sink 16 are coupled to each other via the connection portions 15a and 16a. In this embodiment, an adhesive (coupling means) is further applied to the mating surfaces of the connecting portions 15a and 16a, and the heat sink body 15 and the sub heat sink 16 are bonded by adhesion. The heat sink body 15 and the sub heat sink 16 each have a plurality of heat radiation fins 15c, 16c.

  The connector housing 14 integrally has a case portion 17 as a component mounting portion. The case portion 17 includes a control terminal FPC, an ignorosis terminal DI, a power supply terminal + B, a ground terminal E, a negative terminal FP−. The conductive path 18 connected to the positive terminal FP + or connected to the electric and electronic parts constituting the control device 1 is embedded and integrated by insert molding. The case portion 17 is bonded on the mounting surface (the upper surface in FIG. 1) of the heat sink body 15 such that the connector housing 14 is located on the opposite side of the connection portion 15a and protrudes outward from the heat sink body 15. Fixed by.

  The film capacitor 11, the first electrolytic capacitor 9, and other electric and electronic parts are bonded to the case portion 17, and the respective terminal portions are connected to the conductive path 18 by soldering or the like. The case portion 17 is about half the size of the heat sink body 15, and when the case portion 17 is fixed on the mounting surface of the heat sink body 15, the case portion 17 occupies half of the mounting surface of the heat sink body 15. . The half of the mounting surface of the heat sink body 15 on the side of the connecting portion 15a is excluded from the occupation of the case portion 17, and the control IC 3 is fixed to this portion by adhesion or the like.

  On the other hand, a plastic base 19 is fixed to the mounting surface (the lower surface in FIG. 1) of the sub heat sink 16 by adhesion or the like. On this pedestal 19, at least some of the components of the noise filter circuit 12, for example, the first and second coils 5 and 7 and the second electrolytic capacitor 10 are mounted. The pedestal 19 is provided with a large number of cavities for improving the cooling performance.

  Next, the assembly procedure of the control device 1 will be described. The film capacitor 11, the first electrolytic capacitor 9, and other electric and electronic parts are bonded to the case portion 17, and the terminal portion is connected to the conductive path 18 by soldering or the like. Further, the pedestal 19 is bonded to the mounting surface of the sub heat sink 16 with a heat conductive adhesive, and the first and second coils 5 and 7 and the second electrolytic capacitor 10 are set on the pedestal 19. Are filled with an adhesive having a high thermal conductivity or a high thermal conductive gel G. At this time, the terminals 20 such as the first and second coils 5 and 7 and the second electrolytic capacitor 10 are projected from the base 19.

  On the other hand, the control IC 3 is fixed to a predetermined position on the half of the connection portion 15a on the mounting surface of the heat sink body 15 by bonding or the like. Next, the case portion 17 integrated with the connector housing 14 is fixed to the half of the mounting surface of the heat sink body 15 on the opposite side of the connection portion 15a by bonding or the like. Then, the lead frame 21 of the control IC 3 is connected to the conductive path 18 of the case portion 17 by soldering or the like.

Thereafter, the sub heat sink 16 is made to face the heat sink body 15, the pin 16b of the connection portion 16a of the heat sink body 15 is fitted into the fitting hole 16b of the connection portion 16a, and the butted surfaces of the connection portions 16a and 16a are brought together. Are bonded together. Then, the terminals 20 such as the first and second coils 5 and 7 and the second electrolytic capacitor 10 mounted on the pedestal 19 are connected to the conductive path 18 of the case portion 17 by soldering or the like.
Finally, a cover 22 made of a metal plate that covers the entire component on the mounting surface of the heat sink body 15 including the sub heat sink 16 is placed on the heat sink body 15, and the cover 22 is fixed to the heat sink body 15 with screws 23.

  As described above, according to the present embodiment, the control IC 3 and some of the components constituting the noise filter circuit 12, that is, the first and second coils 5 and 7 and the second electrolytic capacitor 10 are arranged in two stages. Since the structure is superposed, even if the parts 5, 7, and 10 are large, the exclusive area of the control device 1 as a whole can be reduced. Further, the control IC 3 and a part of the components constituting the noise filter circuit 12, that is, the first and second coils 5 and 7 and the second electrolytic capacitor 10 are superposed. Since the heat dissipation (cooling) is ensured by the heat sink body 15 and the sub heat sink 16, each can be prevented from becoming an abnormally high temperature.

  5 and 6 show a second embodiment of the present invention. This embodiment differs from the first embodiment described above in that the heat sink body 15 and the sub heat sink 16 are integrally formed in a substantially U shape. Therefore, since the heat sink main body 15 and the sub heat sink 16 cannot be separated, the assembly procedure first sets the first and second coils 5 and 7 and the second electrolytic capacitor 10 on the base 19.

  On the other hand, the control IC 3 is bonded to the mounting surface of the heat sink body 15. Then, a pedestal 19 with the first and second coils 5 and 7 and the second electrolytic capacitor 10 assembled thereto is inserted from the lateral direction into the space between the heat sink body 15 and the sub heat sink 16, and the pedestal 19 is inserted into the sub heat sink. It fixes to the mounting surface of 16 by adhesion etc. Then, between the heat sink body 15 and the sub heat sink 16, a closing plate 24 for closing the space between the two from the lateral direction is attached, and then an adhesive having a high thermal conductivity or a high thermal conductive gel G is placed in the space. Fill. Thus, the first and second coils 5 and 7 and the second electrolytic capacitor 10 are integrated with the pedestal 19 and the pedestal 19 is fixed to the sub heat sink 16. The control IC 3 is also embedded in an adhesive having a high thermal conductivity or a high thermal conductive gel.

  Next, the case portion 17 on which the film capacitor 11, the first electrolytic capacitor 9, and other electric and electronic components are mounted is bonded to the mounting surface of the heat sink body 15, and the control IC 3 and the second IC are connected to the conductive path 18 of the case portion 17. The first and second coils 5 and 7, the second electrolytic capacitor 10 and the like are soldered. Finally, the cover 22 is fixed with screws 23.

  As described above, according to the present embodiment, the step of integrating the heat sink body 15 and the sub heat sink 16 can be omitted.

The present invention is not limited to the embodiments described above and shown in the drawings, and can be expanded or changed as follows.
In the first embodiment, the control IC 3 may not be used, and the power MOS and the power MOS control IC may be divided into two parts.
In the first embodiment, the heat sink body 15 and the sub heat sink 16 may be joined by welding (joining means) of the connecting portions 15a and 15a.
Of the electric and electronic parts constituting the control circuit 2 (including the noise filter circuit 12), the parts arranged on the heat sink body 15 side and the parts arranged on the sub heat sink 16 side are the first embodiment. It is not limited to the example.
The fins of the heat sink body 15 and the sub heat sink 16 may be pins.
A liquid cooling structure may be adopted in which a flow path is formed in the heat sink main body 15 and the sub heat sink 16 and a cooling liquid, for example, fuel supplied to the engine is allowed to flow in the flow path.

The longitudinal cross-sectional view of the control apparatus which shows the 1st Embodiment of this invention Partially broken plan view Sectional drawing which shows the coupling structure of a heat sink main body and a sub heat sink Circuit diagram of control circuit A longitudinal sectional view showing a second embodiment of the present invention Perspective view

Explanation of symbols

  In the drawings, 1 is a control device, 2 is a control circuit, 3 is a control IC, 5 is a first coil, 7 is a second coil, 9 and 10 are first and second electrolytic capacitors, and 11 is a film capacitor. , 12 is a noise filter circuit, 13 is a heat sink, 14 is a connector housing, 15 is a heat sink body, 16 is a sub heat sink, 17 is a case portion, 18 is a conductive path, 19 is a pedestal, and 22 is a cover.

Claims (4)

A control device for a fuel pump for a vehicle, wherein the control device has a fuel pump control circuit and a noise filter circuit.
A heat sink body,
A sub heat sink provided to face the heat sink body,
A connector provided on the heat sink body and having an external connection terminal for connection to the outside;
A circuit board provided on the heat sink body and having a conductive path for connecting between the control circuit component and the noise filter circuit component and the external connection terminal of the connector;
Among the components of the control circuit and the noise filter circuit, at least a part of the components of the noise filter is arranged on the sub heat sink side, and the remaining components of the noise filter and components of the control circuit are A control apparatus for a fuel pump for a vehicle, which is disposed on a heat sink body side. The control device for a fuel pump for a vehicle according to claim 1,
A control device for a fuel pump for a vehicle, wherein the heat sink main body and the sub heat sink are separated from each other and are coupled by coupling means. The control apparatus for a fuel pump for a vehicle according to claim 2,
The heat sink body is unitized with the components arranged on the heat sink body side among the connector, the circuit board, the components of the control circuit and the components of the noise filter circuit,
The control device for a fuel pump for a vehicle, wherein the sub heat sink is unitized together with components arranged on the sub heat sink side among the components of the control circuit and the components of the noise filter circuit. The control device for a fuel pump for a vehicle according to claim 1,
The control device for a fuel pump for a vehicle, wherein the heat sink body and the sub heat sink are integrally formed.

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