JP2009027006A - A heat insulating structure, a heat insulating device, a heat sink, a driving device, a stage device, an exposure apparatus, and a device manufacturing method. - Google Patents

Abstract

To provide a heat insulating structure, a heat insulating device, a heat sink, a driving device, a stage device, an exposure apparatus, and a device manufacturing method having a high heat insulating capability.
A frame member provided at a predetermined interval from a heat source and surrounding at least a part of the heat source, and a surface of the frame member including a surface opposite to the heat source. A heat radiation restricting layer made of a material that is provided in the heat source side region and restricts heat radiation to the outside of the frame member.
[Selection] Figure 5

Description

  The present invention relates to a heat insulating structure, a heat insulating device, a heat sink, a driving device, a stage device, an exposure apparatus, and a device manufacturing method.

Many linear motors that can be driven in a non-contact manner are used as stage drive devices.
Heat generation from a linear motor in which a coil body that generates heat when energized is used in this type of linear motor causes thermal deformation of surrounding members and devices and changes in air temperature. For example, the exposure apparatus is used in an environment where the temperature is controlled to be constant, and it is desired to suppress the amount of heat generated from the linear motor. This is because there is a risk of causing an error in the measurement value by changing the temperature of the air on the optical path of the interferometer used for detecting the position of the stage of the exposure apparatus or the influence of the thermal deformation. Therefore, conventionally, for example, a technique has been disclosed in which a coil body is accommodated in a cooling jacket and the heat generated from the coil body is absorbed by the cooling liquid by circulating the cooling liquid in the cooling jacket. (For example, refer to Patent Document 1).
JP 2003-333822 A

High speed and high acceleration are particularly required for stage driving. When trying to realize high speed and high acceleration driving, the amount of current flowing through the coil body increases, and the amount of heat generated from the linear motor increases accordingly. For this reason, the structure with higher heat insulation capability is calculated | required. Further, not only the heat insulation structure of the linear motor but also other members (for example, the flange of the lens barrel) in the exposure apparatus are similarly required to improve the heat insulation capacity.
In view of such circumstances, an object of the present invention is to provide a heat insulating structure, a heat insulating device, a heat sink, a driving device, a stage device, an exposure apparatus, and a device manufacturing method having high heat insulating capability.

  In the heat insulation structure according to the present invention, in order to solve the above problems, the following configurations corresponding to the respective drawings shown in the embodiments are adopted. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  The heat insulating structure (83) according to the present invention is provided with a predetermined space between the heat source (C) and a frame member (CJ) surrounding at least a part of the heat source (C), and the frame member ( CJ) is provided in a region closer to the heat source (C) than the surface (182d) including the surface (182d) on the side opposite to the heat source (C), and is disposed outside the frame member (CJ). And a heat radiation regulation layer (82b) made of a material that regulates heat radiation.

  According to the present invention, heat radiation to the outside of the frame member is regulated by the heat radiation regulation layer provided in a region closer to the heat source than the surface including the surface opposite to the heat source in the frame member, and heat is transmitted to the frame. It will be trapped inside the member. For this reason, the heat generated by the heat source is confined inside the frame member without being radiated to the outside of the frame member.

The heat insulating device (84) according to the present invention includes the heat insulating structure (83) and a refrigerant supply that supplies a refrigerant between the heat source (C) and the frame member (CJ) in the heat insulating structure (83). And a device (2).
According to the present invention, the heat confined inside the frame member is exhausted by the refrigerant supplied between the heat source and the frame member in the heat insulating structure by the refrigerant supply device.

A heat sink (900) according to the present invention includes the heat insulating device (84).
In the driving device (XLM1) according to the present invention, a coil unit (CU) is provided in one of the fixed unit (80) and the moving unit (90), and the fixed unit (80) and the moving unit (90). The drive unit (XLM1) is provided with a magnetizing unit (76) on the other side, and the heat insulation device (84) is used for heat insulation of the coil unit (CU).
ADVANTAGE OF THE INVENTION According to this invention, the heat by a coil unit (CU) can be thermally insulated or exhausted effectively, and it becomes possible to suppress the thermal deformation of a surrounding member and apparatus, and the change of ambient air temperature. .

A stage apparatus (RST, WST) according to the present invention includes the above-described driving apparatus.
An exposure apparatus (EX) according to the present invention is an exposure apparatus (EX) that exposes a substrate (W) with exposure light through a mask (R) having a pattern, and moves while holding the mask (R). And a substrate stage device (WST) having a substrate stage that moves while holding the substrate (W), the mask stage device (RST) and the substrate stage device. At least one of (WST) is the above-described stage device (RST, WST).
The device manufacturing method according to the present invention includes exposing the substrate (W) using the exposure apparatus (EX) and developing the exposed substrate (W).
According to the present invention, a device can be efficiently manufactured.

  According to the present invention, the heat insulation capability can be increased.

  Embodiments of a heat insulating structure, a heat insulating device, a driving device, a stage device, and an exposure device according to the present invention will be described below with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set in the drawing as needed, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. This XYZ orthogonal coordinate system is set so that the X-axis and the Z-axis are parallel to the paper surface, and the Y-axis is set to a direction perpendicular to the paper surface. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. Further, it is assumed that the synchronous movement direction (scanning direction) of the wafer W and the reticle R at the time of exposure is set in the Y direction.

[First Embodiment]
FIG. 1 is a view showing a schematic configuration of an exposure apparatus EX of the present embodiment. FIG. 2 is a block diagram showing the main configuration of the control system of the exposure apparatus EX.

  As shown in FIG. 1, the exposure apparatus EX is a step-and-scan projection exposure apparatus, that is, a so-called scanning stepper. The exposure apparatus EX includes an illumination system 10, a reticle stage RST that holds a reticle R as a mask, a projection unit PU, a stage device 50 having a wafer stage WST and a measurement stage MST, and a control system thereof. On wafer stage WST, wafer W as a substrate is placed. Further, as shown in FIG. 2, the control system is configured around a main control device 20 composed of a microcomputer (or a workstation) that comprehensively controls the entire apparatus. .

  As shown in FIG. 1, the illumination system 10 illuminates a slit-shaped illumination area on a reticle R defined by a reticle blind (not shown) with illumination light (exposure light) IL as an energy beam with substantially uniform illuminance. . Here, as the illumination light IL, for example, ArF excimer laser light (wavelength 193 nm) is used.

  On reticle stage RST, reticle R on which a circuit pattern or the like is formed on its pattern surface (lower surface in FIG. 1) is fixed, for example, by vacuum suction. The reticle stage RST can be finely driven in an XY plane perpendicular to the optical axis of the illumination system 10 (corresponding to the optical axis AX of the projection optical system PL described later) by a reticle stage driving unit including a linear motor, for example. It can be driven at a scanning speed specified in a predetermined scanning direction (here, the Y-axis direction which is the left-right direction in the paper surface in FIG. 1).

  The position (including rotation around the Z axis) of the reticle stage RST in the stage moving plane is moved by a reticle laser interferometer (hereinafter referred to as a reticle interferometer) 116 to a movable mirror 15 (actually orthogonal to the Y axis direction). For example, a Y movable mirror having a reflecting surface and an X moving mirror having a reflecting surface orthogonal to the X-axis direction are provided). The measurement value of reticle interferometer 116 is sent to main controller 20 (see FIG. 2), and main controller 20 determines the X axis direction and Y axis of reticle stage RST based on the measurement value of reticle interferometer 116. The position (and speed) of the reticle stage RST is calculated by calculating the direction and the position in the θZ direction (rotation direction around the Z axis) and controlling the reticle stage drive unit 11 (see FIG. 2) based on the calculation result. To control.

  The projection unit PU includes a lens barrel 40 and a projection optical system PL composed of a plurality of optical elements held in the lens barrel 40 in a predetermined positional relationship. As the projection optical system PL, for example, a refractive optical system including a plurality of lenses (lens elements) having a common optical axis AX in the Z-axis direction is used.

  Further, in the exposure apparatus EX of the present embodiment, in order to perform exposure applying the liquid immersion method, a lens (hereinafter referred to as a front lens) as an optical element on the most image plane side (wafer W side) constituting the projection optical system PL. In the vicinity of 91, a liquid supply nozzle 51A and a liquid recovery nozzle 51B constituting the liquid immersion device 132 are provided.

  The liquid supply nozzle 51A is connected to the other end of a supply pipe (not shown) whose one end is connected to a liquid supply device 288 (see FIG. 2), and one end of the liquid recovery nozzle 51B is liquid recovery. The other end of a collection pipe (not shown) connected to the device 292 (see FIG. 2) is connected.

  As the liquid, ultrapure water (hereinafter simply referred to as “water” unless otherwise required) through which ArF excimer laser light (light having a wavelength of 193 nm) is transmitted is used here.

  The refractive index n of water is approximately 1.44. In this water, the wavelength of the illumination light IL is shortened to 193 nm × 1 / n = about 134 nm.

  The liquid supply device 288 opens a valve connected to the supply pipe at a predetermined opening degree according to an instruction from the main control device 20, and supplies water between the leading ball 91 and the wafer W through the liquid supply nozzle 51A. To do. At this time, the liquid recovery apparatus 292 opens a valve connected to the recovery pipe at a predetermined opening degree in response to an instruction from the main control apparatus 20, and connects the leading ball 91 and the wafer W via the liquid recovery nozzle 51 </ b> B. Water is recovered in the interior of the liquid recovery device 292 (liquid tank). At this time, the main controller 20 always makes the amount of water supplied from the liquid supply nozzle 51 </ b> A between the front lens 91 and the wafer W equal to the amount of water recovered through the liquid recovery nozzle 51 </ b> B. In this manner, a command is given to the liquid supply device 288 and the liquid recovery device 292. Accordingly, a certain amount of water Lq (see FIG. 1) is held between the front ball 91 and the wafer W. In this case, the water Lq held between the leading ball 91 and the wafer W is always replaced.

  As is apparent from the above description, the liquid immersion device 132 of this embodiment includes the liquid supply device 288, the liquid recovery device 292, the supply pipe, the recovery pipe, the liquid supply nozzle 51A, the liquid recovery nozzle 51B, and the like. It is a configured local immersion apparatus.

FIG. 3 is an external perspective view of the stage apparatus 50.
The stage device 50 includes a frame caster FC, a base board (surface plate) 12 provided on the frame caster FC, and an upper surface (moving surface) 12a of the base board 12 disposed above the base board 12. Interferometer system 118 (see FIG. 2) including moving wafer stage WST and measurement stage MST, interferometers 16 and 18 for detecting the positions of these stages WST and MST, and stage drive unit for driving stages WST and MST 124 (see FIG. 2). On wafer stage WST, wafer W as a substrate is placed.

  The frame caster FC has a substantially flat plate shape in which protrusions FCa and FCb projecting upward with the Y-axis direction as the longitudinal direction are integrally formed in the vicinity of both ends in the X-axis direction. The base board (surface plate) 12 is disposed on a region sandwiched between the protrusions FCa and FCb of the frame caster FC. The upper surface 12a of the base board 12 is finished with very high flatness, and serves as a guide surface when the wafer stage WST and the measurement stage MST are moved along the XY plane.

  Wafer stage WST includes a wafer stage main body 28 disposed on base board 12 and a wafer table WTB mounted on wafer stage main body 28 via a Z / tilt drive mechanism (not shown). The Z / tilt drive mechanism is actually configured to include three actuators (for example, a voice coil motor and an EI core) that support the wafer table WTB at three points on the wafer stage main body 28, and drive each actuator. By adjusting, the wafer table WTB is finely driven in the three-degree-of-freedom directions of the Z-axis direction, the θx direction (the rotation direction around the X axis), and the θy direction (the rotation direction around the Y axis).

  The wafer stage main body 28 is configured by a hollow member having a rectangular cross section and extending in the X-axis direction. A plurality of, for example, four static gas bearings (not shown), for example, air bearings, are provided on the lower surface of the wafer stage main body 28, and the wafer stage WST is several μm above the guide surface 12a via these air bearings. It is levitated and supported without contact through a clearance of a certain degree.

  Above the protrusions FCa and FCb of the frame caster FC, Y-axis stators 86 and 87 extending in the Y-axis direction are disposed. These Y-axis stators 86 and 87 are levitated and supported by a static gas bearing (not shown) provided on each lower surface, for example, an air bearing, with a predetermined clearance from the upper surfaces of the protrusions FCa and FCb. Has been. This is because the stators 86 and 87 move as counter masses in the opposite direction due to the reaction force generated by the movement of wafer stage WST and measurement stage MST in the Y direction, and this reaction force is canceled by the law of conservation of momentum. is there. In this embodiment, the Y-axis stators 86 and 87 are configured as magnetic pole units including a plurality of permanent magnet groups.

  Inside the wafer stage main body 28, a magnet unit 90 having a permanent magnet group as a mover in the X-axis direction is provided. An X guide bar XG1 extending in the X axis direction is inserted into the internal space of the magnet unit 90. The X guide bar XG1 is provided with a stator 80 for the X axis. The X-axis stator 80 is configured by a coil unit CU including a plurality of coil bodies (heat sources) C arranged at predetermined intervals along the X-axis direction. In this case, a moving magnet type X-axis linear motor (linear motor) XLM1 that drives wafer stage WST in the X-axis direction is configured by magnet unit 90 and X-axis stator 80 formed of coil unit CU. Yes.

FIG. 4 is a diagram showing a planar configuration of the X-axis linear motor XLM1 in which the stator 80 and the mover 90 are combined. FIG. 5 is a diagram showing a cross-sectional configuration of the stator 80 as seen from the YZ plane.
As shown in these drawings, the stator 80 is a coil body having a substantially oval shape (0-shape) in plan view arranged in a plurality in the X-axis direction, which is the relative movement direction of the stator 80 and the mover 90. C and a coil jacket (frame member) CJ that surrounds and accommodates the coil body C. The plurality of coil bodies C are integrally formed of a synthetic resin such as an epoxy resin.

  A coil jacket CJ as a frame member is provided so as to surround the coil body C. The coil jacket CJ includes a side member 81 and a plate member 82, as shown in FIG.

  The side member 81 is disposed so as to face the side surface of the coil body C in the Y direction. Examples of the material for forming the side member 81 include polycarbonate resin, polyphenylene sulfide resin, polyether ether ketone resin, polypropylene resin, polyacetal resin, glass fiber filled epoxy resin, glass fiber reinforced thermosetting plastic (GFRP), and carbon fiber reinforced. Examples thereof include a synthetic resin such as a thermosetting plastic (CFRP), a non-conductive and non-magnetic material such as a ceramic material, or a metal such as stainless steel and aluminum.

  The plate member 82 is provided so as to be in close contact with the upper end surface and the lower end surface of the side member 81, and an inner space S is formed by the side member 81 and the plate member 82. The plate-like member 82 includes a base material 82a made of any one of the above-mentioned materials listed as the forming material of the side member 81, and a heat dissipation regulation layer 82b formed on the surface 82c on the coil body C side of the base material 82a. And have.

  The heat radiation regulation layer 82b is a layer made of a material that regulates the movement of heat, and has a thickness of about several tens of μm. Examples of the material that regulates the movement of heat include a material that reflects heat. Examples of the material that reflects heat include materials having high heat reflectivity such as titanium oxide, titanium alloy, aluminum oxide, and aluminum alloy. Of course, other materials may be used as long as they have a high heat reflectivity. The heat radiation restricting layer 82b is formed on almost the entire surface 82c of the base member 82a facing the coil body C in each plate member 82. It is preferable that the formation region of the heat radiation restriction layer 82b in a plan view is provided in a region including at least the coil body C in the plan view. The heat dissipation restriction layer 82b is formed by a technique such as sputtering.

  For the internal space S of the stator 80, the refrigerant whose temperature is adjusted from the cooling device 2 (see FIG. 2) via the refrigerant supply port (supply part) 80a provided at the + X side end of the stator 80. It comes to be supplied. The refrigerant that has recovered the heat generated from the coil body C by heat exchange is discharged from the refrigerant discharge port 80 b provided at the −X side end of the stator 80 and returned to the cooling device 2. The driving of the cooling device 2 is controlled by the main controller 20 (see FIG. 2).

  In addition, as a refrigerant | coolant used, it is a liquid or gas, and especially an inactive thing can apply preferably. As the refrigerant, pure water may be used, hydrofluoroether (for example, “Novec HFE”: manufactured by Sumitomo 3M Limited), fluorine-based inert liquid (for example, “Fluorinert”: manufactured by Sumitomo 3M Limited), etc. May be used.

  As described above, the side surface member 81 and the plate-like member 82 (the base material 82a and the heat dissipation restriction layer 82b) constitute the heat insulating structure 83 according to the present embodiment. Further, the heat insulating device 84 is configured by the heat insulating structure 83 and the cooling device 2 as the refrigerant supply device that supplies the refrigerant to the internal space S through the refrigerant supply port 80a and discharges the refrigerant from the refrigerant discharge port 80b. ing.

  The magnet unit 90 includes a plurality of magnets (magnetization units) 76 and includes a yoke portion (not shown) provided with the stator 80 interposed therebetween. Each of the magnets 76 is a permanent magnet, and a plurality of magnets 76 are attached to the yoke portion in the Y-axis direction, and magnets having different magnetic poles are alternately arranged. Further, the magnet 76 is arranged such that different magnetic poles face each other across the stator 80.

  For example, movers 88 and 89 each composed of an armature unit containing a plurality of armature coils arranged at predetermined intervals along the Y-axis direction are fixed to both ends of the X-axis stator 80 in the longitudinal direction. Has been. Each of these movers 88 and 89 is inserted into the Y-axis stators 86 and 87 described above from the inside. That is, in the present embodiment, a moving coil type Y-axis linear driving the wafer stage WST in the Y-axis direction by the movers 88 and 89 made of an electric unit and the Y-axis stators 86 and 87 made of a magnet unit. A motor YLM1 is configured. As the Y-axis linear motor YLM1, a moving magnet type linear motor may be used instead of the moving coil type linear motor. In the present embodiment, the fine movement mechanism (not shown) that drives the Y-axis linear motor YLM1, the X-axis linear motor XLM1, and the wafer table WTB constitutes a part of the stage drive unit 124 shown in FIG. Various drive mechanisms constituting the stage drive unit 124 are controlled by the main controller 20 shown in FIG.

  A wafer holder 70 that holds the wafer W is provided on the wafer table WTB. Wafer holder 70 includes a plate-like main body and an auxiliary plate having liquid repellency (water repellency) fixed to the upper surface of the main body and having a circular opening larger than the diameter of wafer W at the center thereof. Yes. A large number (a plurality) of pins are arranged in the region of the main body portion inside the circular opening of the auxiliary plate, and the wafer W is vacuum-sucked while being supported by the large number of pins. In this case, when the wafer W is vacuum-sucked, the surface of the wafer W and the surface of the auxiliary plate are formed so as to have substantially the same height. Note that liquid repellency may be imparted to the surface of wafer table WTB without providing an auxiliary plate.

  Further, as shown in FIG. 3, a reflection surface 17X perpendicular to the X-axis direction is extended in the Y-axis direction at one end (+ X side end) of the wafer table WTB in the Y-axis direction, and one end in the Y-axis direction. At (+ Y side end), a reflecting surface 17Y orthogonal to the Y-axis direction is extended in the X-axis direction. Interferometer beams (length measuring beams) from the X-axis interferometer 46 and the Y-axis interferometer 18 constituting the interferometer system 118 are respectively projected onto the reflecting surfaces 17X and 17Y. The reference position of each reflecting surface by receiving the reflected light (generally, a fixed mirror is arranged on the side surface of the projection unit PU described later and the side surface of the off-axis alignment system ALG, and that is used as the reference surface). The displacement in the measurement direction from is detected.

  In stage device 50 configured as described above, wafer stage WST is driven in the X-axis direction by driving X-axis linear motor XLM1, and X-axis linear motors XLM1 and XLM1 and XLM are driven by a pair of Y-axis linear motors YLM1. Driven in the Y-axis direction integrally with the guide bar XG1. Wafer stage WST is also rotationally driven in the θz direction by slightly varying the driving force in the Y-axis direction generated by Y-axis linear motor YLM1. Therefore, by driving the three actuators supporting the wafer table WTB, the X-axis linear motor XLM1 and the Y-axis linear motor YLM1, the wafer table WTB is not in the six degrees of freedom direction (X, Y, Z, θx, θy, θz). It can be finely driven by contact.

  Here, when the wafer stage WST is driven in the X-axis direction along the moving surface 12a using the X guide bar XG1 as a guide, the coil 90 is energized, whereby the mover 90 in the X-axis linear motor XLM1 is moved. It moves relative to the stator 80. At this time, the coil body C generates heat when energized, but heat from the coil body C is reflected in the internal space S by the heat dissipation restriction layer 82b, and heat exchange with the refrigerant circulating in the internal space S of the coil jacket CJ occurs. The heat is recovered.

  Further, the measurement stage MST provided in the stage apparatus 50 is similar to the wafer stage WST, as shown in FIG. 1, and the measurement stage main body 52 disposed on the base board 12 and the measurement main body 52 are not mounted on the measurement main body 52. And a measurement table MTB mounted via the illustrated Z / tilt drive mechanism. The Z / tilt drive mechanism includes three actuators (for example, a voice coil motor and an EI core) that support the measurement table MTB at three points on the measurement stage main body 52, and adjusts the drive of each actuator. Thus, the measurement table MTB is finely driven in the three-degree-of-freedom directions of the Z-axis direction, the θx direction, and the θy direction.

  The measurement stage main body 52 is configured by a hollow member having a rectangular cross section and extending in the X-axis direction. A plurality of, for example, four static gas bearings (not shown), for example, air bearings, are provided on the lower surface of the measurement stage main body 52, and the measurement stage MST is several μm above the guide surface 12a via these air bearings. It is levitated and supported without contact through a clearance of a certain degree. Inside the measurement stage main body 52, a magnet unit 54 having a permanent magnet group as a mover in the X-axis direction is provided. An X-axis X guide bar XG2 extending in the X-axis direction is inserted into the internal space of the magnet unit 54. An X-axis stator 81 is provided on the X guide bar XG2. The X-axis stator 81 is constituted by a coil unit that houses a plurality of armature coils (coil bodies) arranged at predetermined intervals along the X-axis direction. In this case, a moving magnet type X-axis linear motor XLM2 for driving the measurement stage MST in the X-axis direction is constituted by the magnet unit 54 and the X-axis stator 81 formed of a coil unit. In addition, although illustration is abbreviate | omitted, also in the X-axis linear motor XLM2, similarly to linear motor XLM1 mentioned above, the heat-radiation restriction layer is provided in the plate-shaped member which comprises the stator 81. FIG.

  The measurement stage MST is driven in the X-axis direction by the X-axis linear motor XLM2, and is driven in the Y-axis direction integrally with the X-axis linear motor XLM2 by the pair of Y-axis linear motors YLM2. Further, the measurement stage MST is also rotationally driven in the θz direction by slightly varying the driving force in the Y axis direction generated by the Y axis linear motor YLM2. Accordingly, by driving the three actuators supporting the measurement table MTB, the X-axis linear motor XLM2 and the Y-axis linear motor YLM2, the measurement table MTB does not move in the six degrees of freedom direction (X, Y, Z, θx, θy, θz). It can be finely driven by contact.

  The measurement table MTB further includes measuring instruments for performing various measurements related to exposure. More specifically, a plate 109 made of a glass material such as quartz glass is provided on the upper surface of the measurement table MTB. The surface of the plate 109 is coated with chrome over the entire surface, and is disclosed in a region for a measuring instrument at a predetermined position or in JP-A-5-21314 (corresponding US Pat. No. 5,243,195). A reference mark region FM in which a plurality of reference marks are formed is provided.

  In the present embodiment, it is used for the measurement using the illumination light IL in response to the immersion exposure for exposing the wafer W with the exposure light (illumination light) IL through the projection optical system PL and water. In the above illuminance monitor, illuminance unevenness measuring instrument, aerial image measuring instrument, wavefront aberration measuring instrument, etc., the illumination light IL is received through the projection optical system PL and water. Therefore, a water repellent coat is applied to the surface of the plate 109.

  At one end (−Y side end) in the Y-axis direction of the measurement table MTB (plate 109), a reflecting surface 117Y orthogonal to the Y-axis direction (extending in the X-axis direction) is formed by mirror finishing. In addition, a reflection surface 117X orthogonal to the X-axis direction (extending in the Y-axis direction) is formed at one end (+ X side end) in the X-axis direction of the measurement table MTB by mirror finishing.

  As shown in FIG. 1, an interferometer beam (measurement beam) from the Y-axis interferometer 16 constituting the interferometer system 118 is projected onto the reflection surface 117Y, and the interferometer 16 receives the reflected light. Thus, the displacement of the reflecting surface 117Y from the reference position is detected.

  Further, the interferometer beam from the X-axis interferometer 46 that constitutes the interference system 118 is projected onto the reflection surface 117X, and the interferometer 46 receives the reflected light so that the reference surface of the reflection surface 117X is separated from the reference position. Detect displacement.

  In the exposure apparatus EX of the present embodiment, the holding member that holds the projection unit PU is provided with an off-axis alignment system (hereinafter referred to as an alignment system) ALG. As this alignment system ALG, for example, the target mark is irradiated with a broadband detection light beam that does not sensitize the resist on the wafer, and the target mark image formed on the light receiving surface by the reflected light from the target mark and an index (not shown) An image processing system FIA (Field Image Alignment) system that captures an image of (an index pattern on an index plate provided in the alignment system ALG) using an image sensor (CCD or the like) and outputs the image signals. These sensors are used. An imaging signal from the alignment system ALG is supplied to the main controller 20 shown in FIG.

  In the exposure apparatus EX according to the present embodiment, although not shown in FIG. 1, for example, Japanese Patent Laid-Open No. 6-283403 (corresponding to US Pat. No. 5), which includes an irradiation system 90a and a light receiving system 90b (see FIG. 2). , 448, 332) and the like, an oblique incidence type multi-point focal position detection system similar to that disclosed in Japanese Patent Laid-Open No.

Next, a parallel processing operation using wafer stage WST and measurement stage MST will be briefly described.
During this parallel processing operation, the main controller 20 controls the opening and closing of the valves of the liquid supply device 288 and the liquid recovery device 292 of the liquid immersion device 132 as described above, and the front lens 91 of the projection optical system PL is controlled. There is always water underneath.

  When step-and-scan exposure is performed on wafer W on wafer stage WST, measurement stage MST stands by at a predetermined standby position where it does not collide (contact) with wafer stage WST.

  The above exposure operation is performed based on the result of wafer alignment such as enhanced global alignment (EGA) performed in advance by the main controller 20 and the baseline measurement result of the latest alignment system ALG. Inter-shot moving operation in which wafer stage WST is moved to the scanning start position (acceleration start position) for exposure of each upper shot area, and the pattern formed on reticle R for each shot area are transferred by the scanning exposure method. This is performed by repeating the scanning exposure operation. The above exposure operation is performed in a state where water is held between the front lens 91 and the wafer W.

  Then, at the stage where the exposure to wafer W is completed on wafer stage WST side, main controller 20 controls Y-axis linear motor YLM2 and X-axis linear motor XLM2 to change measurement stage MST (measurement table MTB). The measurement table MTB is moved to a position where the + Y side surface of the measurement table MTB contacts the −Y side surface of the wafer table WTB. Note that the measurement table MTB and wafer table WTB may be separated from each other in the Y-axis direction by, for example, about 300 μm (a gap in which water does not leak due to surface tension) to maintain a non-contact state.

  Next, main controller 20 drives both stages WST and MST in the + Y direction while maintaining the positional relationship between wafer table WTB and measurement table MTB in the Y-axis direction, leading lens 91 of projection unit PU and wafer W. As the wafer stage WST and measurement stage MST move to the + Y side, the water held between the wafer W and the wafer holder 70 is sequentially moved on the measurement table MTB. Thereby, it will be in the state where water was held between measurement stage MST and tip ball 91.

  Thereafter, main controller 20 controls the driving of linear motors XLM1 and YLM1 to move wafer stage WST to a predetermined wafer exchange position and perform wafer exchange. At the same time, measurement stage MST is moved to the measurement stage MST. The predetermined measurement used (for example, baseline measurement of alignment system ALG performed after reticle replacement on reticle stage RST) is performed as necessary.

  After that, main controller 20 drives wafer stages WST and MST simultaneously in the -Y direction while maintaining the positional relationship between wafer stage WST and measurement stage MST in the Y-axis direction, and wafer stage WST. After moving the (wafer) below the projection optical system PL, the measurement stage MST is retracted to a predetermined position.

  Then, main controller 20 executes a step-and-scan exposure operation on a new wafer in the same manner as described above, and sequentially transfers the reticle pattern to a plurality of shot areas on the wafer.

  In the present embodiment, heat radiation to the outside of the coil jacket CJ is regulated by the heat radiation regulation layer 82b provided on the surface 82c of the plate-like member 82 constituting the coil jacket CJ, and the heat is confined inside the coil jacket CJ. It will be. For example, when the heat radiation restriction layer 82b is made of a material that reflects heat, the heat from the coil body C is reflected to the internal space S. Therefore, the heat generated in the coil body C is confined inside the coil jacket CJ without being radiated to the outside of the coil jacket CJ. Further, by supplying the coolant to the internal space S between the coil body C and the coil jacket CJ in the heat insulating structure 83 by the cooling device 2, the heat trapped inside the coil jacket CJ is exhausted by the coolant. It will be. Thus, the heat insulation structure 83 and the heat insulation apparatus 84 which have high heat insulation capability can be obtained.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 6 is a diagram showing a cross-sectional configuration of the stator 180 according to the present embodiment, and corresponds to FIG. 5 of the first embodiment.
As shown in the figure, the stator 180 has a coil body C constituting the coil unit CU and a coil jacket CJ that accommodates the coil body C, and the coil jacket CJ surrounds the coil body C. It is provided as follows. Similar to the first embodiment, the coil jacket CJ includes a side member 181 and a plate member 182.

  The heat dissipation restriction layer 182b of this embodiment is a layer made of a material that reflects heat. Examples of the material of the heat dissipation regulating layer 182b include the same heat reflecting material (for example, titanium oxide) as that of the first embodiment. The heat radiation regulating layer 182b is formed over substantially the entire surface 182d opposite to the coil body C of the base member 182a of each plate-like member 182.

  In the present embodiment, the heat insulating structure 183 is configured by the side surface member 181 and the plate-like member 182 (the base material 182a and the heat radiation regulating layer 182b). The heat insulating device 184 is configured by the heat insulating structure 183 and the cooling device 102 that supplies the refrigerant to the internal space S.

  According to the present embodiment, the heat from the coil body C is reflected to the inner space S side of the coil jacket CJ by the heat radiation regulating layer 182b provided on the surface 182d opposite to the coil body C of the base material 182a. Therefore, the heat from the coil body C can be prevented from being radiated to the outside of the coil jacket CJ. Thus, the heat insulation structure 183 and the heat insulation apparatus 184 which have high heat insulation capability can be obtained.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 7 is a diagram showing a cross-sectional configuration of the stator 280 according to the present embodiment, and corresponds to FIG. 5 of the first embodiment.
As shown in the figure, the plate-like member 282 of the present embodiment has a configuration in which a heat radiation regulating layer 282b is formed inside a plate-like base material 282a, and the heat from the coil body C is the base material. It is regulated inside 282a. The heat radiation regulation layer 282b is made of a material that reflects heat. As a specific material of the heat radiation regulating layer 282b, the same heat reflective material as in the first embodiment can be cited.

  In the present embodiment, the heat insulating structure 283 is configured by the side surface member 281 and the plate-like member 282 (the base material 282a and the heat radiation regulating layer 282b). In addition, a heat insulating device 284 is configured by the heat insulating structure 283 and the cooling device 212 when the refrigerant is supplied to the internal space S.

  According to the present embodiment, since the heat transfer from the coil body C is regulated by the heat radiation regulation layer 282b provided inside the base material 282a, the heat from the coil body C is radiated to the outside of the coil jacket CJ. Can be prevented. Thus, the heat insulation structure 283 and the heat insulation apparatus 284 which have high heat insulation capability can be obtained.

  In the present embodiment, the configuration of the plate-like member 282 in which the heat dissipation restriction layer 282b is completely covered with the base material 282a has been described, but the present invention is not limited to this. For example, the plate-like member 282 may include two base materials 282a, and the heat dissipation restriction layer 282b may be sandwiched between the two base materials 282a. According to this configuration, the plate-like member 282 having the configuration of the present embodiment can be easily formed.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 8 is a diagram showing a cross-sectional configuration of the stator 380 according to the present embodiment, and corresponds to FIG. 5 of the first embodiment.
As shown in the figure, the heat dissipation restriction layer 383 of the present embodiment is provided in an internal space S formed by a side member 381 and a plate-like member 382. In the example shown in FIG. 8, the heat radiation regulation layer 383 is provided at four locations so as to face the upper surface, the lower surface, and the side surface of the coil body C, and the heat radiation is regulated in the internal space S. As the heat radiation regulating layer 383, a structure made of a material that reflects heat as in the above-described embodiment can be used. Further, the heat radiation regulation layer 383 may be configured using a material that absorbs heat. As a specific material of the heat radiation regulating layer 383, a heat reflective material similar to that of the first embodiment can be used in a configuration made of a material that reflects heat. On the other hand, in the case of using a material that absorbs heat, a material having a high heat absorption rate such as carbon fiber reinforced thermosetting plastic (CFRP) can be used.

  In the present embodiment, the heat insulating structure 384 is configured by the side member 381, the plate-like member 382, and the heat dissipation restriction layer 383. Further, the heat insulating device 385 is configured by the heat insulating structure 384 and the cooling device 302 when the refrigerant is supplied to the internal space S.

  According to the present embodiment, since the heat transfer from the coil body C is regulated by the heat radiation regulation layer 383 provided in the internal space S, the heat from the coil body C is radiated to the outside of the coil jacket CJ. Can be prevented. Thus, the heat insulation structure 384 and the heat insulation apparatus 385 which have high heat insulation capability can be obtained.

[Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 9 is a diagram showing a cross-sectional configuration of the stator 480 according to the present embodiment, and corresponds to FIG. 5 of the first embodiment.
In the present embodiment, the heat insulating structure 483 is configured by the side member 481 and the plate-like member 482 (the base material 482a, the heat radiation regulating layer 482b, and the heat radiation regulating layer 482c). In addition, a heat insulating device 484 is configured by the heat insulating structure 483 and the cooling device 402 when the refrigerant is supplied to the internal space S.

  According to the present embodiment, the movement of heat from the coil body C is regulated by the two layers of the heat radiation regulation layer 482b and the heat radiation regulation layer 482c provided on the surface 482d of the base 482a. Can be prevented from being radiated to the outside of the coil jacket CJ. Thus, the heat insulation structure 483 and the heat insulation apparatus 484 which have high heat insulation capability can be obtained. In the present embodiment, an example in which two heat dissipation restriction layers are formed has been described. However, the present invention is not limited to this. For example, a structure in which three or more heat dissipation restriction layers are provided may be used.

[Sixth Embodiment]
Next, a sixth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 10 is a diagram illustrating a cross-sectional configuration of the stator 580 according to the present embodiment, and corresponds to a cross section viewed from the XZ plane in FIG. 4 of the first embodiment.
As shown in the figure, in the present embodiment, a partition plate 583 for partitioning the interior space S is provided. One partition plate 583 is provided above and below the coil body C. By these partition plates 583, the space above the coil unit CU and the space below the coil unit CU in the internal space S are partitioned. In this case, the refrigerant supplied into the internal space S by the cooling device 502 circulates in each space partitioned by the partition plate 583.

  Further, in the present embodiment, the heat radiation restricting layer 584 is provided on the surface 583a of each partition plate 583 opposite to the coil body C, respectively. The heat radiation regulation layer 584 is provided over almost the entire surface 583a of the partition plate 583 opposite to the coil body C, and the heat from the coil body C is disposed on the partition board 583. 584 is regulated. Each of the heat dissipation regulation layers 584 may be made of a material that reflects heat, or may be made of a material that absorbs heat.

  In the present embodiment, the heat insulating structure 585 is configured by the side member 581, the plate-like member 582, the partition plate 583, and the heat dissipation restriction layer 584. Further, the heat insulating device 586 is configured by the heat insulating structure 585 and the cooling device 502 when the refrigerant is supplied to the internal space S. Although not shown, the cooling device 502 is also connected to the internal space S below the coil unit CU.

  According to this embodiment, since the internal space S is partitioned by the partition plate 583 and circulates in the space where the refrigerant is partitioned by the cooling device 502, the heat from the coil body C is transferred to the stator. Heat dissipation to the outside of 580 can be prevented. Moreover, since the heat transfer from the coil body C is regulated by the heat radiation regulation layer 584 provided on the surface 583a opposite to the coil body C of the partition plate 583, the heat from the coil body C is applied to the coil jacket CJ. It is possible to more reliably prevent the heat from being radiated to the outside. Thus, the heat insulation structure 585 and the heat insulation apparatus 586 which have high heat insulation capability can be obtained.

[Seventh Embodiment]
Next, a seventh embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 11 is a diagram illustrating a cross-sectional configuration of the stator 680 according to the present embodiment, and corresponds to a cross section in the X direction in FIG. 4 of the first embodiment.
As shown in the figure, in the present embodiment, a partition plate 683 for partitioning the interior space S is provided at the same position as in the sixth embodiment. Further, in the present embodiment, the heat radiation restricting layer 684 is provided inside each partition plate 683. Therefore, the heat from the coil body C is regulated by the heat radiation regulation layer 684 provided inside the partition plate 683. The heat radiation restriction layer 684 may be made of a material that reflects heat or may be made of a material that absorbs heat.

  In the present embodiment, the heat insulating structure 685 is configured by the side member 681, the plate-like member 682, the partition plate 683, and the heat dissipation restriction layer 684. Further, the heat insulating device 686 is configured by the heat insulating structure 685 and the cooling device 602 when the refrigerant is supplied to the internal space S. Although not shown, the cooling device 602 is also connected to the internal space S below the coil unit CU.

  According to this embodiment, since the internal space S is partitioned by the partition plate 683 and circulates in the space where the refrigerant is partitioned by the cooling device 602, the heat from the coil body C is transferred to the stator. Heat can be prevented from being radiated to the outside of 680. In addition, since the heat transfer from the coil body C is restricted by the heat radiation restriction layer 684 provided inside the partition plate 683, it is possible to prevent the heat from the coil body C from being radiated to the outside of the coil jacket CJ. it can. Thus, the heat insulation structure 685 and the heat insulation apparatus 686 which have high heat insulation capability can be obtained.

  In the present embodiment, the configuration in which the heat dissipation restriction layer 684 is completely covered with the partition plate 683 has been described, but the present invention is not limited to this. For example, the partition plate 683 may have a configuration in which two substrates are attached, and the heat dissipation restriction layer 684 may be configured to be sandwiched between the two substrates. According to this configuration, the partition plate 684 having the configuration of the present embodiment can be easily formed.

[Eighth Embodiment]
Next, an eighth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 12 is a diagram showing a cross-sectional configuration of the stator 780 according to the present embodiment, and corresponds to a cross section in the X direction in FIG. 4 of the first embodiment.
As shown in the figure, in the present embodiment, a partition plate 783 for partitioning the interior space S is provided at the same position as in the sixth and seventh embodiments. In the present embodiment, the heat radiation restricting layer 784 is provided on the surface 783a of the partition plate 783 on the coil body C side. The heat radiation restricting layer 784 is provided on almost the entire surface of the surface 783 a of the partition plate 783. Therefore, the heat from the coil body C is regulated by the heat radiation regulation layer 784 provided on the partition plate 783. The heat radiation restriction layer 784 may be made of a material that reflects heat, or may be made of a material that absorbs heat.

  In the present embodiment, the heat insulating structure 785 is configured by the side member 781, the plate-like member 782, the partition plate 783, and the heat dissipation restriction layer 784. In addition, a heat insulating device 786 is configured by the heat insulating structure 785 and the cooling device 702 when the refrigerant is supplied to the internal space S. Although not shown, the cooling device 702 is also connected to the internal space S below the coil unit CU.

  According to this embodiment, since the internal space S is partitioned by the partition plate 783 and circulates in the space where the refrigerant is partitioned by the cooling device 702, the heat from the coil body C is transferred to the stator. Heat can be prevented from being radiated to the outside of 780. In addition, since the heat transfer from the coil body C is restricted by the heat radiation restricting layer 784 provided on the surface 783a of the partition plate 783 facing the coil body C, the heat from the coil body C is outside the coil jacket CJ. Heat can be prevented. Thus, the heat insulation structure 785 and the heat insulation apparatus 786 which have high heat insulation capability can be obtained.

In the sixth to eighth embodiments, when the heat radiation restriction layers 584, 684, and 784 are configured using a material that absorbs heat, the heat absorbed by the heat radiation restriction layers 584, 684, and 784 is the side members 581, 681, It is necessary to configure so that heat is not transmitted to the outside of the coil jacket CJ by being transmitted to 781 and the plate-like members 582, 682, 782.
[Ninth Embodiment]
Next, a ninth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the description of the same elements as those of the first embodiment described above is simplified or omitted.

FIG. 13 is a diagram showing a cross-sectional configuration of the stator 880 according to the present embodiment, and corresponds to FIG. 5 of the first embodiment.
As shown in the figure, the side member 881 has a base material 881a and a heat dissipation restriction layer 881b. The heat radiation regulating layer 881b is provided on almost the entire surface 881c of the base material 881a facing the coil body C, for example. Therefore, the heat from the coil body C is regulated by the surface 881c of the base material 881a of the side member 881. Each of the heat dissipation regulation layers 881b is configured using a material that reflects heat. .

  In the present embodiment, the heat insulating structure 883 is configured by the side surface member 881 (the base material 881a and the heat radiation regulating layer 881b) and the plate-like member 882. Further, the heat insulating device 884 is configured by the heat insulating structure 883 and the cooling device 802 when the refrigerant is supplied to the internal space S.

  According to this embodiment, since the heat transfer from the coil body C is regulated by the heat radiation regulating layer 881b provided on the surface 881c of the side member 881 that faces the coil body C, the heat from the coil body C is reduced. Heat dissipation to the outside of the coil jacket CJ can be prevented. In this way, the heat insulating structure 883 and the heat insulating device 884 having high heat insulating ability can be obtained.

  In the present embodiment, the heat radiation regulating layer 881b is provided on the surface 881c of the base material 881a. However, the present invention is not limited to this. For example, as shown by a broken line in the figure, it may be provided inside the base material 881a. Moreover, you may provide on the surface 881d on the opposite side to the coil body C among the base materials 881a. Further, any one or a plurality of configurations shown in FIGS. 5 to 9 may be combined. For example, the side member 881 and the plate-like member 882 may be configured to have a heat dissipation restriction layer so as to surround the coil body C from four directions.

[Tenth embodiment]
Next, a tenth embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 14, the heat sink 900 has a substantially rectangular parallelepiped shape, and is attached to the flange portion of the lens barrel 40. In the present embodiment, the flange portion of the lens barrel 40 serves as a heat source. The heat sink 900 is formed of a metal such as iron, aluminum, or stainless steel, and has a box-like member 901 having an internal space, and a pumice-like hollow member 902 that is disposed in the internal space S of the box-like member 901 and is made of aluminum or the like. And have. The hollow member 902 is brazed to the inner wall of the box-shaped member 901. The box-shaped member 901 is attached with a flow path 904 such as a tube for circulating a temperature adjusting liquid.

  The box-shaped member 901 is provided with a connection portion 901a for connecting to the flange portion. The connection portion 901a and the flange portion are connected by sandwiching a material 903 having a good thermal conductivity such as a heat conductive rubber sheet or a thermal silicon compound. By this connection, the thermal resistance when heat is transferred from the lens barrel 40 to the heat sink 900 can be reduced.

  In the present embodiment, the heat radiation restricting layer 905 is formed on the inner surface of the box-shaped member 901 on the surface 901 b opposite to the flange portion of the lens barrel 40. The heat radiation restriction layer 905 is formed over substantially the entire surface 901b, and is made of the heat reflecting material described in the first embodiment. Therefore, the heat from the lens barrel 40 is regulated on the surface 901b of the box-shaped member 901.

  According to the present embodiment, since the heat radiation restriction layer 905 is provided on the surface 901b of the box-shaped member 901, it is possible to prevent the heat from the flange portion of the lens barrel 40 from being radiated to the outside of the heat sink 900. . The position where the heat radiation regulating layer 905 is provided is not limited to the surface 901 of the box-shaped member 901. For example, the inner surface of the box-shaped member 901 other than the above, the inside space S, the outer surface of the box-shaped member 901, etc. A heat dissipation restriction layer 905 may be provided.

As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.
For example, the heat radiation restricting layer may be arranged at a plurality of positions by appropriately combining from the positions described in the above embodiment. Further, it may be configured such that only one of the pair of plate-like members is provided with a heat dissipation restriction layer and the other is not provided with a heat dissipation restriction layer. The same applies to the side member, and a configuration may be adopted in which the heat radiation restriction layer is provided only on one side member and the heat radiation restriction layer is not provided on the other side member.

  Moreover, although the heat insulation structure and the heat insulation apparatus were demonstrated to the coil unit or the flange part of the lens-barrel 40 in the said embodiment, in addition to this, for example, it is applicable also in the heat-emitting part of an optical sensor.

Moreover, although the said embodiment demonstrated using the example of the three-phase motor, even if it is a single phase motor, if installation space can be ensured, it is applicable.
In each of the above embodiments, the refrigerant flows in the coil jacket that houses the coil unit in any case. However, the present invention is not limited to this. The present invention can also be applied to a linear motor.

  In the above embodiment, the stage apparatus 50 is configured to include both the wafer stage WST and the measurement stage MST. However, only the wafer stage WST may be configured. In the above-described embodiment, the exposure apparatus EX is configured to apply the present invention to the stage apparatus 50 on the wafer W side. However, the present invention can also be applied to a linear motor of the reticle stage RST on the reticle R side.

  The present invention can also be applied to a twin stage type exposure apparatus provided with a plurality of wafer stages. The structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407. Furthermore, the present invention may be applied to the wafer stage disclosed in Japanese Patent Application No. 2004-168482 filed earlier by the present applicant.

  In addition, as a board | substrate hold | maintained at a moving stage in said each embodiment, it is used with not only the semiconductor wafer for semiconductor device manufacture but the glass substrate for display devices, the ceramic wafer for thin film magnetic heads, or exposure apparatus. A mask or reticle master (synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, a scanning exposure apparatus that does not use an immersion method, or a step-and-repeat method in which the pattern of the reticle R is collectively exposed while the reticle R and the wafer W are stationary, and the wafer W is sequentially moved stepwise. The present invention can also be applied to a projection exposure apparatus (stepper). The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the wafer W. Furthermore, the present invention can also be applied to an exposure apparatus that exposes a pattern on the wafer W by projecting spot light by the projection optical system PL without using the mask M.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the wafer W, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  As a drive mechanism of each stage WST, RST, a planar motor that drives each stage WST, RST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, one of the magnet unit and the armature unit may be connected to the stages WST and RST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages WST and RST.

  As shown in FIG. 15, a microdevice such as a semiconductor device includes a step 201 for performing a function / performance design of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

1 is a schematic diagram showing a configuration of an exposure apparatus according to a first embodiment of the present invention. It is a perspective view which shows the structure of the stage apparatus which concerns on this embodiment. It is a top view which shows schematic structure of the X-axis linear motor which concerns on this invention. It is sectional drawing of the same X-axis linear motor. It is a cross-sectional top view of the stator of the X-axis linear motor. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 4th Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 5th Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 6th Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 7th Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 8th Embodiment of this invention. It is sectional drawing which shows the structure of the stator of the exposure apparatus which concerns on 9th Embodiment of this invention. It is a figure which shows the structure of the heat sink which concerns on 10th Embodiment of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

C ... Coil body, CJ ... Coil jacket (frame member), EX ... Exposure device, R ... Reticle (mask), XLM1 ... X-axis linear motor (drive device), W ... Wafer (substrate), 50 ... Stage device, 76 ... Magnet (magnetization unit), CU ... Coil unit, C ... Coil, 82b ... Heat dissipation regulation layer

Claims (18)

A frame member provided at a predetermined interval between the heat source and surrounding at least a part of the heat source;
A heat radiation regulation layer made of a material that regulates heat radiation to the outside of the frame member, provided in a region closer to the heat source than the surface including the surface opposite to the heat source of the frame member. Thermal insulation structure.   2. The heat insulation structure according to claim 1, wherein the heat radiation regulation layer reflects heat from the heat source to the heat source side to regulate heat radiation from the outside of the frame member. The heat insulation structure according to claim 1, wherein the heat dissipation restriction layer absorbs heat from the heat source and restricts heat dissipation from the outside of the frame member. The heat insulation structure according to any one of claims 1 to 3, wherein the heat radiation restriction layer is provided on a surface of the frame member opposite to the heat source. The heat insulation structure according to any one of claims 1 to 4, wherein the heat dissipation restriction layer is provided inside the frame member. The heat insulation structure according to any one of claims 1 to 5, wherein the heat dissipation restriction layer is provided on a surface of the frame member facing the heat source. The heat insulation structure according to any one of claims 1 to 6, wherein the heat dissipation restriction layer is provided in a region between the frame member and the heat source. The heat-insulating structure according to any one of claims 1 to 7, wherein a plurality of the heat dissipation regulation layers are laminated. Provided in a region between the frame member and the heat source, further comprising a partition member for partitioning the region;
The heat insulation structure according to claim 7, wherein the heat radiation restriction layer is provided on a surface of the partition member opposite to the heat source. Provided in a region between the frame member and the heat source, further comprising a partition member for partitioning the region;
The heat insulation structure according to claim 7, wherein the heat dissipation restriction layer is provided inside the partition member. Provided in a region between the frame member and the heat source, further comprising a partition member for partitioning the region;
The heat insulation structure according to claim 7, wherein the heat dissipation restriction layer is provided on a surface of the partition member that faces the heat source. The heat insulation structure according to claim 1, wherein the heat dissipation restriction layer includes titanium oxide as a main component. The heat insulating structure according to any one of claims 1 to 12,
The heat insulation apparatus which comprises the refrigerant | coolant supply apparatus which supplies a refrigerant | coolant between the said heat source and the said frame member among the said heat insulation structures.   A heat sink comprising the heat insulating device according to claim 13. A driving device in which a coil unit is provided in one of the fixed part and the moving part, and a magnetizing unit is provided in the other of the fixed part and the moving part,
The drive device which uses the heat insulation apparatus of Claim 13 for the heat insulation of the said coil unit.   A stage device comprising the drive device according to claim 15. An exposure apparatus that exposes a substrate with exposure light through a mask having a pattern,
A mask stage device having a mask stage that moves while holding the mask;
A substrate stage device having a substrate stage that moves while holding the substrate;
The exposure apparatus according to claim 16, wherein at least one of the mask stage apparatus and the substrate stage apparatus. Exposing the substrate using the exposure apparatus of claim 17;
And developing the exposed substrate.

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