JP2009026028A - Hybrid type ic card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hybrid type IC card having high durability to prevent internal portion electrically connected from being separated due to an expected bending stress, and to provide a method for manufacturing the same. <P>SOLUTION: The method includes steps of connecting metal plates 13 to two end portions of an antenna coil 12 wound in a card board 11 by resistance welding, respectively; providing grooved portions 13a on top faces of the other ends of the metal plates 13, and arranging the groove-formed portions to face antenna connection-terminals 18 of COB including an IC module 16 and a small substrate 17, respectively; and inserting the COB into a perforated portion 15 on the card board 11 and applying pressure and heat, thereby soldering and connecting the grooved portions 13a of the metal plates 13 and the antenna connection-terminals 18. This configuration has large soldered area on the metal plates 13, thereby achieving highly reliable electrical-connection. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a hybrid IC card that can send and receive information signals to and from an external device by both contact and non-contact means.

  The IC card communication means for transmitting and receiving information signals to and from an external device includes a method of providing a contact terminal made of metal foil on the surface of the IC card and communicating with the external device by wire, and the inside of the base material of the IC card There are both methods in which an antenna coil is installed to communicate with an external device wirelessly. In order to expand the use of IC cards, it is desirable to use cards that are compatible with various external devices. Therefore, by providing both a contact terminal made of metal foil and an antenna coil inside the card on a single IC card, transmission and reception can be performed with both contact-type and non-contact-type external devices regardless of the method of the external device. A hybrid IC card that can be used has been developed.

  A conventional configuration example of a hybrid IC card will be described with reference to FIGS. Patent Document 1 describes a configuration in which two terminal terminals provided in an antenna coil are soldered to two terminals of an IC module built in a hybrid IC card. FIG. 3 is a diagram showing a configuration of a conventional example of a hybrid IC card in Patent Document 1, FIG. 3 (a) is a top view showing the assembly structure, and FIG. 3 (b) is an A view of FIG. 3 (a). It is sectional drawing in -A. 3 (a) and 3 (b) show a state before the IC module is attached to the hybrid IC card, FIG. 3 (b) shows a separated state, and FIG. IC module is not described.

  As shown in FIGS. 3 (a) and 3 (b), slightly to the left of the center of the card base 31 containing the antenna coil 32 (indicated by a dotted line since it is not directly visible from the top surface in FIG. 3 (a)). Is provided with a drilling section 35 for mounting the IC module 36. The perforated portion 35 is composed of two dents with different depths, and the terminal terminals 33 of the antenna coil 32 are exposed at two locations in the shallow dent region. The conventional example shown in FIG. 3 is characterized in that the terminal terminal 33 is formed in a spiral shape. The deep recessed portion of the punching portion 35 is a space in which the IC module 36 is fitted, and in FIG. 3B, the adhesive 34 is injected into the bottom portion. For the formation of the perforated portion 35, a method of forming the card base material 31 once with a resin and then cutting it is preferable. The adhesive 34 is filled in the gap with the card base 31 after the IC module 36 is inserted, and the IC module 36 is bonded and fixed to the card base 31. The two terminal terminals 33 of the antenna coil 32 are each formed in a spiral shape, and this shape plays a certain role for improving the reliability in electrical connection with the IC module 36.

  A small substrate 37 is connected and fixed to the upper side of the IC module 36 in FIG. 3B, and both constitute a COB (Chip On Board). External terminals 40 that are metal contacts for using the hybrid IC card as a contact IC card are formed on the surface of the small substrate 37 (upper surface in FIG. 3B). In addition, antenna joint terminals 38 are provided at two locations around the IC module 36 in the small substrate 37, and preliminary solder 39 is formed on the surface thereof. The antenna joining terminal 38 and the terminal terminal 33 of the antenna coil 32 are electrically connected by the preliminary solder 39 when the IC module 36 is joined.

  In FIG. 3B, when the COB including the IC module 36 is inserted and fixed to the punching portion 35 of the card base 31, the punching portion 35 is first set in the direction of the arrow in FIG. Then, COB is inserted, and then the preliminary solder 39 is melted by pressurizing and heating the vicinity of the contact portion, and the terminal terminal 33 of the antenna coil 32 and the antenna junction terminal 38 are electrically connected. In this case, if hot melt or thermosetting resin is used as the adhesive 34, soldering between the two contacts and bonding and fixing of the COB to the card base 31 with the resin can be performed simultaneously by one pressurization and heating. This is an excellent method for connecting COB into the card base 31. The card base 31 may have a laminated structure composed of a plurality of resin layers.

  On the other hand, Patent Document 2 describes a configuration different from Patent Document 1 for incorporating an IC module into a hybrid IC card. 4 is a diagram showing a configuration of a conventional example of a hybrid IC card in Patent Document 2, FIG. 4 (a) is a top view showing the assembly structure, and FIG. 4 (b) is a diagram A of FIG. 4 (a). It is sectional drawing in -A. FIG. 4 shows a state after assembly of the hybrid IC card is different from FIG. 3, and both the IC module is fixed to the card base in FIGS. 4 (a) and 4 (b).

  As shown in FIG. 4A, an antenna coil 45 (indicated by a dotted line because it is not directly visible from the upper surface in FIG. 4A) is embedded in the card substrate 41. The two terminal terminals 46 are connected to the IC module 47. However, in FIG. 4A, only the external terminal 51 exposed on the upper surface of the hybrid IC card is visible, and the IC module 47 hidden underneath is not shown. On the other hand, as shown in FIG. 4 (b), the card base 41 has a laminated structure composed of three resin layers of a front surface layer 42, an antenna sheet 43 and a back surface layer 44. FIG. 2 shows a cross section of an antenna coil 45 embedded in a hybrid IC card. An IC module 47 is provided on the upper left side of FIG. 4B, and an external terminal 51 of a metal terminal, which is a contact point to an external device, is provided above the IC module 47 and exposed from the surface layer. .

  The IC module 47 is arranged so that the main body part fits into the recess of the socket 48 installed on the lower side. The socket 48 is provided with two through holes 49 through which the connection members 50 penetrate, respectively, to electrically connect the two terminal terminals 46 of the antenna coil 45 and the IC module 47. . The two electrical contacts provided on the IC module 47 and the connection member 50 and the connection member 50 and the two terminal terminals 46 are firmly connected by resistance welding. Only the peripheral portion of the IC module 47 is supported by being bonded to the edge portion of the socket 48, and the main body portion fitted in the recess of the socket 48 is not fixed to the socket 48. The socket 48 is formed of the same type of resin as the card base 41, and an adhesive is applied to the entire bottom surface of the socket 48 and fixed to the antenna sheet 43. The connecting member 50 is a flexible wire-like metal bar. When an external force is applied to the hybrid IC card and it bends, etc., the connecting member 50 is slightly deformed, so that the IC module 47 and the terminal end are deformed. The breakage of the connection portion with the terminal 46 can be prevented.

JP 2004-62635 A JP 2003-132322 A

  In the hybrid IC card described in Patent Document 1 described above, even if the soldering joint is performed by processing the terminal terminal of the antenna coil into a spiral shape in the hybrid IC card, the connection location is an external force. It is constructed so as to keep a sufficient connection strength against the bending stress due to. This configuration is based on dimensional standards (85.6 mm × 54.0 mm ×) for conventional general cash cards, credit cards, etc. using PETG (polyethylene terephthalate copolymer) or PVC (polyvinyl chloride) as a card substrate. When applied to a card of 0.76 mm), it has sufficient reliability against bending stress due to external force assumed in normal use. However, when applied to thin cards, which are being considered as future standards, or when used for applications that require durability, the connection between the IC module and the terminal terminal of the antenna coil is more stringent. May be necessary.

  The hybrid IC card described in Patent Document 2 is a solution to the enhancement of reliability among the above requirements. By connecting the IC module and the terminal terminal of the antenna coil only by resistance welding, the reliability of bending stress due to external force is improved. However, the hybrid IC card having this configuration has the following two problems.

  The first problem is an increase in the thickness of the card in the area where the IC module is installed. As shown in FIG. 4, the hybrid IC card described in Patent Document 2 has a configuration in which the main body of the IC module is fitted into a recess of a socket disposed immediately below the IC module, and the card has the thickness of the socket. The lower limit of the overall thickness is inevitably increased. In a conventional general card dimensional standard, this thickness is 0.76 mm. Therefore, it is possible to fit the thickness of the card within this standard. It is impossible to apply this configuration as long as a socket is used. At present, there is a request for reducing the thickness to about 0.4 mm to 0.5 mm depending on the use of the hybrid IC card, and a card that can be used in such a case is also required.

  The second problem is a problem of damage that occurs around the connecting member welded to the electrical contact of the IC module and the terminal terminal of the antenna coil due to resistance welding. The resistance welding between the electrical contact of the IC module and the connection member is not particularly problematic because it is performed before the IC module is installed in the socket. However, when connecting between the other end of the connecting member inserted into the through hole of the socket and the terminal terminal of the antenna coil, the antenna is embedded in the antenna sheet and only the surface thereof is exposed from the antenna sheet. It is necessary to perform resistance welding by directly applying high heat to the terminal terminal of the coil.

  In this case, the antenna sheet around the connection part between the two, and depending on the case, the upper part of the back layer underneath may be affected by heat, and the alteration or deformation of the resin that forms the card base, Curing may occur. If the connection between the two is ultrasonic bonding, the influence of heat is reduced, but instead, a large local pressurization with a jig is required, so there is still a concern about the influence on the tissue. Moreover, in the electrical connection by soldering joining or a conductive adhesive, since the connection area of both is structurally quite small, it is difficult to make a connection with sufficient strength.

  Accordingly, an object of the present invention is a hybrid IC card including an IC module and an antenna coil in a card base material, and a problem in electrical connection between an electrical contact of the IC module and a terminal terminal of the antenna coil. Is the solution. That is, it is to propose a connection method in which the connection portion has sufficient reliability against peeling even when the card is used for an application requiring particularly durability. In addition, this hybrid IC card is required to have a configuration in which the lower limit of the card thickness is not increased by a structure such as a socket provided in the direction perpendicular to the surface of the card with respect to the IC module.

  Conventionally, the electrical contact of the IC module and the terminal terminal of the antenna coil have been electrically connected by resistance welding, ultrasonic bonding, soldering, or conductive adhesive. Among them, resistance welding and ultrasonic bonding can be performed firmly even in a small bonding area, but the reason is that the vicinity of the connection point becomes high temperature at the time of bonding, or the jig needs to be pressure-welded at the time of connection Therefore, it may not be possible depending on the structure of the connection location. On the other hand, there are few such restrictions in connection by soldering or conductive adhesive, but there is a problem that a certain area is required as a connection region in order to obtain a sufficient connection strength at the connection location.

  In Patent Document 1, the terminal terminal of the antenna coil and the electrical contact of the IC module are directly connected, and soldering is employed as a connection means. On the other hand, in patent document 2, the connection member which consists of metal wires is interposed between both, and it is set as the connection by resistance welding. The present invention is a further improvement of the method described in Patent Document 1, and the point of adopting solder connection is the same as in Patent Document 1. However, the hybrid type IC that can solve the above-mentioned problems can be achieved by expanding the area of the connection part related to soldering by interposing the connecting member between the terminal terminal of the antenna coil and the electrical contact of the IC module directly without interfacing between them. The card is realized.

  In order to solve the above problems, in the present invention, two metal plates each having a plurality of grooves formed on the surface of at least one end thereof are provided, two electrical contacts provided in the IC module, and grooves of the two metal plates are provided. The formed surface is joined by soldering. The surface area of the metal plate in which the groove is formed is wider than the terminal terminal of the spiral antenna coil in Patent Document 1, and sufficient bonding strength can be obtained by soldering bonding with the electrical contact of the IC module. The grooves on the surface of the metal plate are preferably lattice-shaped grooves because the formation method is easy. The effect of this groove is to further increase the surface area of the soldering region of the metal plate as compared with the case where no groove is provided, and contributes to the improvement of the soldering joint strength. As the material of the metal plate, a copper plate is suitable in terms of soldering characteristics and ease of welding described later, and the surface thereof may be plated with a metal having excellent solder wettability.

  Of the metal plate in which the groove is formed, the terminal terminal of the antenna coil is connected by resistance welding to the end portion on the side not involved in soldering with the electrical contact of the IC module. The connection by resistance welding is performed before the antenna coil is embedded in the card base material constituting the hybrid IC card, and therefore the resistance welding does not damage the card base material around the welded portion. Polyurethane-coated copper wire is suitable for the antenna coil. However, when welding the antenna coil with this coated copper wire, the polyurethane coating is decomposed and removed by heating by resistance welding. The process of peeling off can be omitted.

  Since there are two terminal terminals of the antenna coil, it is necessary to install two metal plates provided with grooves on a part of the surface. The relative positions of the two metal plates are arbitrary, and may be provided so as to support the IC module from both sides with the IC module sandwiched therebetween, or two metal plates are arranged in the vicinity of one side surface of the IC module. It may be provided. In the configuration and manufacturing method of the hybrid IC card according to the present invention, the introduction of the metal plate, the soldering connection between the electrode terminal of the IC module and the metal plate, and the resistance between the terminal terminal of the antenna coil and the metal plate The portions other than the portion related to the execution of welding are almost the same as those in the case of Patent Document 1.

  The hybrid IC card manufacturing method using the metal plate provided with a plurality of grooves on at least a part of the surface as described above is, for example, as follows. First, an antenna coil is produced by using a polyurethane-coated copper wire or the like, and a metal plate having a groove on a part of its surface is connected to the two terminal terminals by resistance welding. At this time, it is necessary to leave a surface provided with a groove in a region where resistance welding is not performed. A copper plate or the like is suitable for the metal plate. Next, a board thinner than the finished card is first formed using a material such as a resin as a card base. An antenna coil in which a metal plate is welded to the terminal terminal is mounted on the surface of the thin plate, and further covered with the same kind of material as that of the thin plate, thereby producing a card substrate incorporating the antenna coil.

  Next, the card base material is cut to expose the surface on which the grooves of the two metal plates are provided, and a concave portion for incorporating COB into the card base material is formed. After filling the bottom of this recess with an organic adhesive, insert COB with pre-solder at two electrical contacts into this recess, and pressurize and heat to join the two metal plates. To do. At the same time, the adhesive at the bottom of the recess is filled around the IC module by pressing the IC module, and the IC module is fixed inside the card. At this time, the COB is provided with a metal terminal to be used as a contact IC card on one side of the small board, and an IC module is fixed to the center of the opposite side of the small board, and the metal plate is provided around the periphery. It is preferable to have a shape provided with two electrical contacts for performing soldering connection. The hybrid IC card after the COB is fixed to the concave portion of the card base is a resin card with a flat surface, in which only the metal terminal is exposed on one side and nothing can be seen from the outside. It is.

  That is, the present invention includes both an antenna coil and an external contact terminal, a function for transmitting and receiving data to and from an external device by the antenna coil in a non-contact manner, and a function for transmitting and receiving data to and from an external device via the external contact terminal The hybrid IC card includes two metal plates therein, the IC module includes two electrical contacts, and the antenna coil includes two antenna coils. Two termination terminals, the two termination terminals being electrically connected to the two metal plates, respectively, the two metal plates each having a plurality of grooves in at least a partial region of the surface thereof, and the IC Two electrical contacts provided in the module are electrically connected to partial areas provided with a plurality of grooves on the surfaces of the two metal plates, respectively. Is a hybrid type IC card to be characterized.

  Further, the present invention is the hybrid IC card characterized in that the plurality of grooves provided in the partial areas of the two metal plates are grooves formed in a lattice shape.

  Further, the present invention is the hybrid IC card, wherein the two metal plates are respectively installed at positions facing each other with the IC module interposed therebetween.

  Furthermore, the present invention is a hybrid IC card, wherein the two metal plates are installed in parallel in the vicinity of one side surface of the IC module.

  Furthermore, the present invention is a hybrid IC card characterized in that the terminal terminal provided in the antenna coil and the metal plate are electrically connected by welding.

  Furthermore, the present invention is a hybrid IC card characterized in that welding between the terminal terminal and the metal plate is resistance welding.

  Furthermore, the present invention is the hybrid IC card, wherein the terminal terminal provided in the antenna coil and the metal plate are electrically connected by ultrasonic bonding.

  Furthermore, the present invention is a hybrid characterized in that a partial region including a plurality of grooves on the surface of the metal plate and an electrical contact included in the IC module are electrically connected to each other by solder bonding. Type IC card.

  Furthermore, the present invention is a hybrid IC card, wherein the antenna coil is made of a polyurethane-coated copper wire.

  Furthermore, the present invention is the hybrid IC card, wherein the metal plate is a copper plate.

  Further, according to the present invention, two metal plates each having a plurality of grooves formed in at least a partial region of the surface thereof are respectively resistance-welded to each termination terminal of an antenna coil having two termination terminals by resistance welding. Connected, formed a card containing the antenna coil and the metal plate therein, cut the card to provide a recess, and a partial region formed with a plurality of grooves on the surface of the two metal plates The two sheets are exposed in the recess, an IC module having two electrical contacts in the periphery is installed in the recess, and the two electrical contacts of the IC module are exposed in the recess. A method of manufacturing a hybrid IC card, characterized in that a plurality of grooves on the surface of the metal plate are joined to each other by soldering.

  According to the present invention, it is possible to provide a hybrid IC card in which an internal electrical connection portion does not peel off due to a bending stress caused by an external force assumed in use of the card, and a manufacturing method thereof. The durability against bending stress due to this external force is not limited to the conventional hybrid IC card having a general thickness, but also in the case of a thinner card or a card that is used for a particularly demanding durability. Even in this case, it can be obtained with sufficient reliability. This configuration is realized by the method of interposing a metal plate proposed in the present invention when the terminal terminal of the antenna coil built in the hybrid IC card is connected to the IC module.

  That is, two metal plates having a plurality of grooves formed on the surface of at least one end are introduced, and the electrical contacts of the IC module and the grooved surfaces of the metal plate are joined by soldering. The groove on the surface of the metal plate is preferably a lattice-like groove because the forming method is easy. The surface of the metal plate at the connection location is originally wider than the case where the electrical contact is directly connected to the terminal terminal of the antenna coil, and the surface area is further increased by providing the groove on the surface. Due to this large surface area, sufficient adhesive strength can be obtained even by soldering. On the other hand, the terminal terminal of the antenna coil and the metal plate are connected by resistance welding, but since this process is performed before the antenna coil is embedded in the card base, Does no damage. Both are connected with sufficient strength by resistance welding. With the above configuration, it is possible to provide a configuration of a hybrid IC card having sufficient durability required against an external force and a manufacturing method thereof.

  Hereinafter, a hybrid IC card according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing an example of a first embodiment of a hybrid IC card according to the present invention. FIG. 1A is a top view of the hybrid IC card, and FIG. It is sectional drawing in AA of a). FIGS. 1 (a) and 1 (b) show a state before the COB is mounted. In FIG. 1 (b), both are still separated, and FIG. 1 (a) shows the COB. Absent.

  As shown in FIGS. 1A and 1B, the center of the card base 11 containing the antenna coil 12 (indicated by a dotted line because it is not directly visible from the top surface in FIG. 1A) is slightly left. Are provided with a punching section 15 for mounting a COB comprising an IC module 16 and a small substrate 17. The card substrate 11 has a composite structure in which a plurality of resin layers are laminated, and the antenna coil 12 is also disposed between the resin layers inside. The punching portion 15 is formed by cutting the surface after the card base material 11 is laminated, and a mechanical milling method or the like is suitable as the method. The depth of the punching portion 15 is set in two stages, and a groove processing portion 13a of the metal plate 13 to be described later is exposed on the bottom surface of the region cut into a shallow shelf shape. Further, an adhesive 14 such as hot melt or thermosetting resin is injected into the bottom of the deep dent region, and is used for connection and fixing with a COB including the IC module 16 described later. In the case of the first embodiment, as shown in FIG. 1 (a), the deeply recessed region of the drilling portion 15 is provided so as to be almost symmetrical in the center of the region cut into a shallow shelf. It has been.

  Here, the two terminal terminals of the antenna coil 12 are joined to one end of each of the two metal plates 13 by resistance welding. A grooved portion 13 a exists on the surface of the other end of each metal plate 13. As shown in FIG. 1 (a), in the case of the first embodiment, the metal plates 13 are arranged one by one in the shallow shelf-like left and right regions of the perforated portion 15, and are deeply recessed regions. Is sandwiched from both sides. The groove processing portion 13a is formed by forming a plurality of grooves at one end of the metal plate 13, and is preferably a vertical and horizontal grid-like groove from the viewpoint of easy formation. A small substrate 17 is connected and fixed to the upper side of the IC module 16 in FIG. 1B as in the conventional example described in Patent Document 1, and the IC module 16 and the small substrate 17 constitute a COB. External terminals 20 that are metal contacts are formed on the surface of the small substrate 17 (upper surface in FIG. 1B). Electricity with an external device when the hybrid IC card is used as a contact IC card is used. A contact, typically a gold contact. Antenna joint terminals 18 are provided at two locations on the periphery of the IC module 16 in the small substrate 17, and preliminary solder 19 is applied to the surface thereof.

  As shown in FIG. 1B, the two antenna connecting terminals 18 are opposed to the groove processing portions 13a of the two metal plates 13, respectively. The pre-solder 19 is melted and soldered and joined by pressurizing and heating. The area of the metal plate 13 that is involved in this soldering joining can be structurally sufficiently larger than the terminal portion of the antenna coil 12 in the conventional example described in Patent Document 1, for example. In addition, the groove processed portion 13a provided on the surface has a role of further increasing the surface area, and the unevenness of the surface caused by the groove formation further improves the soldering strength and prevents peeling at the connection point. Is effective for.

  Here, a deep dent-shaped region in the perforated portion 15 is a space in which the IC module 16 is fitted. When the COB including the IC module 16 is inserted and fixed in the punching portion 15 of the card base 11, the COB is first inserted and pressurized in the direction of the arrow in FIG. The pre-solder 19 is melted by heating the vicinity of this region as it is, and the terminal terminal of the antenna coil 12 and the antenna joint terminal 18 are electrically connected.

  On the other hand, a layer of the adhesive 14 made of the above material is provided on the bottom of the perforated portion 15, and this layer is fixed by a series of pressure heating and subsequent cooling at this time. It is possible to join them by the same process as the attachment. When this layer is a thermosetting resin, it wraps around the IC module 16 in which the adhesive 14 is inserted and flows into the gap with the card substrate 11 by the first pressurization in the case of hot melt. To do. As a result, the perforated portion 15 is filled with the IC module 16 and the adhesive 14 without any gap and is bonded to each other. That is, it is a method that can simultaneously perform soldering and COB adhesion and fixing, and is an excellent method for connecting COB into the card substrate 11. The adhesive 14 has a certain degree of flexibility because it is necessary to protect the IC module 16 by resisting bending stress due to external force applied to the hybrid IC card and to prevent the card base 11 from being damaged. It is desirable.

  FIG. 2 is a diagram showing an example of the second embodiment of the hybrid IC card according to the present invention. FIG. 2A is a top view of the hybrid IC card, and FIG. It is sectional drawing in AA. 2 (a) and 2 (b) show a state before the COB is mounted as in the case of FIG. 1, and both are still separated in FIG. 2 (b), and FIG. ) Does not describe COB.

  In the second embodiment shown in FIG. 2, the material of each element is the same as that in the first embodiment, and the configuration is almost similar. The difference in configuration from the case of the first embodiment is the shape of the punched portion 25 and the arrangement of the metal plate 23. In FIG. 2 (a), a hole for mounting the IC module 26 is located slightly in the center of the card substrate 21 containing the antenna coil 22 [indicated by a dotted line since it cannot be directly seen from the top surface in FIG. 2 (a)]. Although the processing unit 25 is provided, of the depth regions set in two steps, the deep dent region is not provided in the center of the region cut into a shallow shelf shape, but is provided on the right side of the drawing. ing. Two metal plates 23 are arranged in a wide area on the left side of the figure in the shallow shelf-like area, and are not installed in the narrow area on the right side of the figure. Each of the grooved portions 23a provided on the surfaces of the two metal plates 23 is exposed in a wide area on the left side of the perforated portion 25 in the drawing. The antenna joint terminal 28 is provided with preliminary solder 29.

  In FIG. 2B, the IC module 26 is provided so as to be biased to the right side of the drawing with respect to the small substrate 27 in the COB. The antenna joint terminal 28 is provided only on the left side of the IC module 26, and the installation position thereof is a position facing the groove processing portion 23a of the two metal plates 23, respectively. A layer of an adhesive 24 such as a hot melt or a thermosetting resin is provided in a deep dent region of the punched portion 25. An external terminal 30 which is a gold contact is formed on the upper surface of the COB small substrate 27 in the drawing, and this is an electrical contact with an external device when used as a contact type IC card.

  When the COB including the IC module 26 is inserted and fixed in the punching section 25, the COB is first inserted in the direction of the arrow in FIG. The applied preliminary solder is melted and soldered and joined to the grooved portions 23a of the two metal plates 23 provided at opposing positions. At the same time, the adhesive 24 is wrapped around the IC module 26 to fill the gap with the card substrate 21. Since the electrical contact between the COB and the metal plate 23 is only on the left side of FIG. 2B, the COB is configured like a cantilever with respect to the card substrate 21. However, the gap between the two is filled with the adhesive 24, so that the two are joined with sufficient strength. Therefore, even if a bending stress due to an external force is applied after the assembly of the hybrid IC card, the card substrate of the COB It is possible to prevent the peeling from the 21 punching portions 25.

  A hybrid IC card based on the first and second embodiments of the present invention was fabricated, and a reliability test was performed to verify the durability of the card against bending stress.

Example 1
As a hybrid IC card based on the first embodiment of the present invention, a card having the shape shown in FIG. 1 was produced and durability against external force was verified. The produced card is a resin card (hereinafter referred to as a normal card) having a size of 85.6 mm × 54.0 mm × 0.76 mm, which is the same as a general credit card. The card substrate is PETG, and the dimensions of the COB embedded in the perforated part at the center of the card are 10 mm square for IC module, 300 μm thick, 18 mm × 12 mm for small board, 200 μm thick, card surface The gold contact exposed to 10 mm is 10 mm × 10 mm.

  The antenna coil inside the card base is a polyurethane coated copper wire having a diameter of 160 μm and three turns, and the two metal plates resistance-welded at both ends are copper plates, which are 5 mm long × 2 mm wide × 100 μm thick. Metal plating is not provided. Lattice-like grooves are carved on the surface of a 2 mm × 2 mm region from an end different from the region where resistance welding is performed, and these grooves are approximately 200 μm apart, 20 μm wide, and 10 μm deep. This region is joined by soldering to two antenna joint terminals provided on the left and right of the IC module in the COB. The perforated portion is filled with a hot melt adhesive having some flexibility even at room temperature, and the COB is bonded by this adhesive. In the first embodiment, the 16 MHz band is used as a frequency band for non-contact communication with an external device. However, the present invention can be similarly applied to the case of using a general 13 MHz band in the use of a non-contact card. .

  A normal card having this configuration was produced by the following method. First, a plurality of sheets made of PETG were laminated to form a card substrate. At this time, an antenna coil is prepared by joining a copper metal plate by resistance welding to two terminal portions of the polyurethane-coated copper wire wound three turns, and the inside of the card base material is laminated together with the metal plate. Installed. Next, the card base material was cut by a mechanical milling method to form a perforated portion in the card base material. This perforated part is a concave part having two levels of depth, and has a deep concave-shaped region in the center part. Further, a perforated portion is formed in the region cut into a shallow shelf around the surface so that the surface of the region of the two metal plates provided with the grid-like grooves is exposed. Next, an adhesive layer capable of obtaining fluidity by heating and filling a gap in the perforated portion was provided in a deep concave region at the center of the perforated portion. This adhesive is hot melt, but a thermosetting resin or the like may be used instead.

  On the other hand, an IC module was mounted on a small substrate, and an electric contact of the IC module was drawn out to the surface around the IC module of the small substrate to produce a COB as an antenna junction terminal. A via hole was provided in the small substrate, and an external terminal with a gold contact was provided on the opposite surface of the small substrate for electrical connection to an external device via the via hole. On the other hand, preliminary soldering with lead-free solder is applied to the antenna joint terminal. The COB was inserted into the punching portion of the card base and pressurized, and the temperature was raised to a constant temperature equal to or higher than the solder melting temperature to fix the connection. By this pressurization and heating, the two antenna joint terminals, each of which is pre-soldered, and the grooved portions of the two metal plates are soldered and joined to each other. Connected and fixed in the material. By this method, a total of 300 ordinary cards having the above dimensions were produced. In the initial state, none of the cards had any problems in appearance, dimensions, and electrical characteristics as an IC card.

  The hybrid IC card produced in this way is bent by a test method based on the method described in JISX6305-1 “Test method for identification card—Part 1: Test for general characteristics” of Japanese Industrial Standards. The test was conducted. That is, one long side of a normal card manufactured at room temperature was fixed, the opposite long side was gripped, and bending stress was applied in a direction perpendicular to the surface of the card to cause the card to warp. At this time, the amount of warpage of the ordinary card was set to 10 mm. This bending stress was applied to one side at a rate of 30 times per minute, and was continuously performed 250 times in total.

  Next, bending stress was applied in the opposite direction to the same long side of the card, and the card was warped by 10 mm on the opposite side of the card at the same frequency. When that is done, this time, fix the short side of the normal card, grab the opposite opposite short side, and apply bending stress at a rate of 30 times per minute in the direction perpendicular to the card surface. This time, the card was warped by 20 mm. Thereafter, similarly, the card was warped 20 mm in the reverse direction at the same frequency. A series of bending stresses were applied 250 times in order to 100 ordinary cards, 1000 times in total. After the test, the appearance of each card was inspected, and changes in electrical characteristics before and after the stress test in contact communication and non-contact communication with external devices were evaluated. Hereinafter, this series of bending tests is referred to as a normal test.

  Subsequent to the test by the method described in JIS X6305-1, a card bending test by two kinds of methods under more severe conditions was performed. In the first method, the number of tests in each of the four types of conditions in the normal test is increased from 250 times to 1000 times for 100 new ordinary cards. Actually, after performing the bending test under the four conditions of 250 times for each of the normal tests, the same series of tests were performed three times in succession before and after the appearance inspection of each card and the stress test for electrical characteristics. An evaluation of changes was made. Hereinafter, this is described as severe test 1.

  Similarly, the second method is to increase the amount of warpage given to the card in four kinds of bending tests in the normal test for 100 new normal cards. In this test, the amount of warping when the long side of the card is fixed is increased to 15 mm, and the amount of warping when the short side of the card is fixed is increased to 30 mm. The number of bending tests is 250 for each condition, a total of 1000 times, which is the same as the normal test, and the frequency of applying bending stress is the same as the normal test at a rate of 30 times per minute. After completion of these series of bending tests, the appearance of each card was inspected and the electrical characteristics were measured to evaluate the changes before and after the stress test. Hereinafter, this is described as severe test 2.

(Example 2)
As in the case of Example 1, as a hybrid IC card based on the first embodiment of the present invention, a card having a thickness smaller than that of a normal card (hereinafter referred to as a thin card) is manufactured, and durability against external force is verified. did. The conditions of the manufactured card, such as the internal configuration, shape and dimensions other than the thickness, and manufacturing method are all the same as for a normal card, and the frequency band used for non-contact communication is 16 MHz. Are the same. The size of the thin card is 85.6 mm × 54.0 mm, which is the same as that of the normal card, but the thickness is 0.50 mm. In order to realize this thickness, the thickness is thinner than that of the normal card. A 200 μm IC module and a 150 μm small substrate are used. 300 thin cards were produced by the same method as the ordinary card of Example 1, and the same three tests of normal test, severe test 1 and severe test 2 as in the case of Example 1 were carried out 100 pieces each. The change in electrical characteristics before and after the appearance inspection and stress test was evaluated, respectively.

(Example 3)
Furthermore, a hybrid IC card based on the second embodiment of the present invention was manufactured, and durability against external force was verified. The produced card has the shape shown in FIG. 2 and has the same external dimensions as the card in Example 1 and is also a normal card. Its internal structure, shape and size, and manufacturing method are similar to those of the ordinary card in the first embodiment, but the shape and size of the punched portion of the COB and the corresponding card base material, and the installation of two metal plates made of copper Only the position is different. The IC module in the COB is 10 mm square with a thickness of 300 μm, the small substrate is 15 mm × 12 mm and the thickness is 200 μm, and the punched portion provided on the card base is not symmetrical as in FIG. Of these, the deep dent-shaped region is biased to the right side of the figure. Of the region cut into a shallow shelf, two metal plates are arranged side by side in the region on the left side of the figure. The other components of the card used are the same as those of the ordinary card in the first embodiment. 300 cards were produced in the same manner as in Example 1, and the same three tests, Normal Test, Severe Test 1, and Severe Test 2 were conducted as in Example 1, 100 each. The changes in electrical characteristics before and after the appearance inspection and stress test were evaluated.

Example 4
As in the case of Example 3, as a hybrid IC card based on the second embodiment of the present invention, a thin card having a thickness smaller than that of a normal card was manufactured, and durability against external force was verified. Each condition such as the internal configuration and thickness of the manufactured card other than the thickness, the manufacturing method, the frequency band used, and the like are all the same as in the case of the ordinary card described in the third embodiment. However, the thickness is 0.50 mm, which is the same as in the second embodiment. In order to realize this thickness, an IC module having a thickness of 200 μm and a small substrate having a thickness of 150 μm are used as in the case of the second embodiment. 300 thin cards were produced by the same method as the ordinary card of Example 3, and the same three tests of normal test, severe test 1 and severe test 2 as in Example 1 were carried out for each 100 pieces. The change in electrical characteristics before and after the appearance inspection and stress test was evaluated, respectively.

  The results of the reliability test of the hybrid IC card carried out in Examples 1 to 4 are shown in Table 1. There are three types of reliability tests: normal test, severe test 1 and severe test 2, and after each test, the appearance evaluation and the evaluation of changes in electrical characteristics are performed for 100 hybrid IC cards. Went. Of these, the external appearance evaluation is to inspect whether there are any abnormalities such as occurrence of cracks, cracks, and bulging, and the electrical characteristics are evaluated by both contact and non-contact communication with external devices. Then, it was evaluated whether a series of data transmission / reception as an IC card could be performed without any problems, and compared with the evaluation results before each reliability test was performed. In Table 1, items with an evaluation result of “◯” indicate that there was no problem (passed) in the total number of 100 cards, and the numbers are the number of cards that did not pass in 100 cards. Is shown.

  According to Table 1, in the normal cards of Example 1 and Example 3, not only the normal test but also all the tests performed in the severe test 1 and the severe test 2 passed. Therefore, the hybrid IC card according to the first and second embodiments of the present invention is sufficiently reliable even when it is used for an application that requires durability in comparison with the conventional application. It turns out that it has sex. In addition, in the thin cards of Example 2 and Example 4, although some of the cards were rejected in some severe tests, all the cards passed in the normal test. Therefore, even if the hybrid IC card manufactured based on the first and second embodiments of the present invention is thinner, it has sufficient reliability in general applications. I understand that.

  As described above, according to the hybrid IC card according to the embodiment of the present invention, a highly reliable hybrid in which an internal electrical connection portion does not peel off due to an external force assumed in use of the card. A type IC card and a method for manufacturing the same can be provided. The durability against this external force is not only in the case of conventional hybrid IC cards with a general thickness, but also in the case of thinner cards, and in the case of cards that are used especially for applications that require durability. Even so, it can be obtained with sufficient reliability. Further, the description of the above example is for explaining the effect in the case of the embodiment of the present invention, thereby limiting the invention described in the claims or reducing the scope of the claims. Not what you want. Moreover, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim.

The figure shown about the example of 1st Embodiment of the hybrid type IC card of this invention. FIG. 1A is a top view, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. The figure shown about the example of 2nd Embodiment of the hybrid type IC card of this invention. 2A is a top view, and FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A. The figure which shows the structure of the prior art example of a hybrid type IC card. 3A is a top view, and FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A. The figure which shows the structure of the prior art example of a hybrid type IC card. 4A is a top view, and FIG. 4B is a cross-sectional view taken along line AA in FIG. 4A.

Explanation of symbols

11, 21, 31, 41 Card base material 42 Surface layer 43 Antenna sheet 44 Back surface layers 12, 22, 32, 45 Antenna coils 33, 46 Termination terminals 13, 23 Metal plates 13a, 23a Groove processing portions 14, 24, 34 Adhesion Agents 15, 25, 35 Perforated portions 16, 26, 36, 47 IC modules 17, 27, 37 Small substrates 18, 28, 38 Antenna joint terminals 19, 29, 39 Pre-solder 20, 30, 40, 51 External terminals 48 Socket 49 Through hole 50 Connection member

Claims (11)

It has both an antenna coil and an external contact terminal, and has both a function of transmitting and receiving data to and from an external device through the antenna coil, and a function of transmitting and receiving data to and from an external device through the external contact terminal, A hybrid IC card having an IC module,
The hybrid IC card has two metal plates inside,
The IC module comprises two electrical contacts,
The antenna coil includes two terminal terminals, and the two terminal terminals are electrically connected to the two metal plates, respectively.
Each of the two metal plates includes a plurality of grooves in at least a partial region of the surface thereof,
The hybrid IC card, wherein two electrical contacts provided in the IC module are electrically connected to partial areas having a plurality of grooves on the surfaces of the two metal plates, respectively.   2. The hybrid IC card according to claim 1, wherein the plurality of grooves provided in a partial region of the two metal plates are grooves formed in a lattice shape.   3. The hybrid IC card according to claim 1, wherein the two metal plates are installed at positions facing each other with the IC module interposed therebetween. 4.   3. The hybrid IC card according to claim 1, wherein the two metal plates are arranged in parallel in the vicinity of one side surface of the IC module. 4.   5. The hybrid IC card according to claim 1, wherein the terminal terminal included in the antenna coil and the metal plate are electrically connected to each other by welding. 6.   6. The hybrid IC card according to claim 5, wherein welding between the terminal terminal and the metal plate is resistance welding.   5. The hybrid IC card according to claim 1, wherein the terminal terminal included in the antenna coil and the metal plate are electrically connected to each other by ultrasonic bonding. 6.   The partial region including a plurality of grooves on the surface of the metal plate and the electrical contact included in the IC module are electrically connected to each other by soldering joining. A hybrid IC card according to claim 1.   9. The hybrid IC card according to claim 1, wherein the antenna coil is made of polyurethane-coated copper wire.   The hybrid IC card according to claim 1, wherein the metal plate is a copper plate. Two metal plates each having a plurality of grooves formed in at least a part of the surface thereof are connected to each terminal terminal of the antenna coil having two terminal terminals by resistance welding one by one,
Forming a card containing the antenna coil and the metal plate therein;
The card is cut to provide a recess, and a partial region in which a plurality of grooves on the surface of the two metal plates is formed is exposed in the recess,
An IC module having two electrical contacts on the periphery is placed in the recess,
The two electrical contacts of the IC module are respectively joined by soldering to partial areas exposed in the recesses where a plurality of grooves are formed on the surfaces of the two metal plates. Manufacturing method of hybrid IC card.

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