JP2009010117A - Shield structure of electronic equipment - Google Patents

Abstract

An electronic device shield structure that reduces the influence of radio wave interference in a shield case and provides a low-cost electronic device shield structure that is easy to assemble.
In a shield structure of an electronic apparatus having a printed circuit board 12 on which radio wave generating components 16A and 16B that generate electromagnetic waves are disposed, and a shield case 11 in which the printed circuit board 12 is installed, the shield case 11 is mounted. A groove is formed, and a flat shield plate 18 for blocking the propagation of radio waves is mounted in the mounting groove, and the shield plate 18 is fixed to the shield case 11 by an elastic shield member 17A.
[Selection] Figure 8

Description

  The present invention relates to a shield structure for an electronic device, and more particularly to a shield structure for an electronic device that reduces the influence of radio wave interference in a shield case.

  For example, an electronic device using a high frequency such as an RF high power amplifier has a radio wave generating component mounted therein. For this reason, a shield structure is adopted in which the radio wave generating component is accommodated in a shield case so that the radio wave generated by the radio wave generating component does not leak to the outside as noise.

  FIG. 1 shows an electronic apparatus employing such a shield structure. 1A is a plan view with the case lid 3 removed, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A. In the electronic device shown in the figure, a printed circuit board 2 is disposed inside a shield case 1.

  Two radio wave generating components 6A and 6B are disposed on the printed circuit board 2. The shield case 1 is provided with input and output RF connectors 4 and 4. Further, the case lid 3 is fixed to the shield case 1 by a set screw 5.

  In the configuration shown in FIG. 1, it is possible to prevent leakage of radio waves generated by the radio wave generating components 6A and 6B from the shield case 1 to the outside. However, in the shield structure shown in FIG. 1, mutual interference occurs between the radio wave generating components 6A and 6B, which may prevent the radio wave generating components 6A and 6B from operating properly. In such a case, it is necessary to provide a shield structure in the shield case 1 so that the radio wave generating parts 6A and 6B do not affect each other.

  2 to 5 show a conventional shield structure of this type. 2 to 3, the components corresponding to those shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is partially omitted.

  The shield structure shown in FIGS. 2 and 3 is a shield structure by cut-off attenuation. This shield structure utilizes the property that radio waves hardly pass (attenuate) through narrow gaps. Here, the “width” is the distance between the inner walls in the direction orthogonal to the direction in which the radio waves of the shield case 1 are transmitted and received.

  In the shield structure shown in FIG. 1, the width dimension of the passage through which radio waves pass (hereinafter referred to as radio wave passage) is the length indicated by the arrow D1 in the drawing. On the other hand, in the shield structure shown in FIG. 2 (A), the extending portion 1a is formed in the shield case 1, so that the width of the radio wave path is set to the arrow D2 or D3 (D2 <D3 <D1) in the figure. In the shield structure shown in FIG. 3, the shield case 1 has a horizontally long shape, so that the area of the printed board 2 is substantially the same as that shown in FIG. (D4 <D1).

  Since the attenuation of the radio wave propagating in the shield case 1 is determined by the width of the radio wave path, as shown in FIGS. 2 and 3, the width D2 to D4 of the radio wave path is determined from the width D1 of the radio wave path shown in FIG. By narrowing, the radio waves generated by the radio wave generating parts 6A and 6B are attenuated and propagated in the shield case 1, thereby reducing the radio wave interference between the radio wave generating parts 6A and 6B.

  The shield structure shown in FIG. 4 is disclosed in, for example, Patent Documents 1 and 2, and is a shield structure using a case provided separately from the shield case. In the example shown in FIG. 4, an internal shield case 7 (enlarged in FIG. 4C) covering the radio wave generating component 6 </ b> A is attached to the printed board 2 with a set screw 5.

  In this way, by covering the radio wave generating component 6A that generates radio waves with the inner shield case 7, it is possible to prevent radio wave interference between the radio wave generating components 6A and 6B. The inner shield case 7 can be attached not only to a source of radio waves but also to a place where interference is not desired.

  The shield structure shown in FIG. 5 is disclosed in, for example, Patent Documents 3 and 4, and is a shield structure using a shield plate (wall). The shield plate 9 is formed by bending a conductive metal into an L shape, and the bent horizontal portion is fixed to the shield case 1 using a set screw 5. Further, the upper end portion of the vertical portion of the electromagnetic shield material 8 is connected to the case lid 3 via the electromagnetic shield material 8.

  In this shield structure, since the shield plate 9 is interposed between the radio wave generating components 6A and 6B, the width of the radio wave path existing between them is extremely narrow. Therefore, as described with reference to FIGS. 2 and 3, the radio waves generated by the radio wave generating components 6 </ b> A and 6 </ b> B can be attenuated in the shield case 1.

Further, in this shield structure, each radio wave generating component 6A, 6B is configured to be located in a room defined by the shield case 1 and the shield plate 9. This is equivalent to the structure described with reference to FIG. 4 in which a separate shielding case is provided for each of the radio wave generating components 6A and 6B. Therefore, mutual interference can be prevented by the radio waves between the radio wave generating components 6A and 6B.
Japanese Patent Laid-Open No. 2005-244067 Japanese Utility Model Publication No. 07-036498 Japanese Patent Laid-Open No. 11-121962 Japanese Patent Laid-Open No. 11-097874

  However, in the shield structure by cut-off attenuation described with reference to FIGS. 2 and 3, when the attenuation amount is desired to be larger, the width of the shield case 1 has to be narrowed as the frequency of the radio wave becomes higher. You will have to make it thinner. Further, as shown in FIG. 2, when the extending portion 1a is formed in the shield case 1, the printed circuit board 2 also needs to correspond to the shape of the shield case 1 (the shape having the extending portion 1a). For this reason, the board shape of the printed circuit board 2 becomes complicated, the degree of freedom in circuit mounting becomes inconvenient, and the board strength of the printed circuit board 2 is lost.

  In addition, in the shield structure with the case described with reference to FIG. 4, a structure having a high shielding effect can be realized. However, the higher the shielding property and the wider the shield range, the higher the cost. There is a problem.

  Furthermore, the shield structure using the shield plate (wall) described with reference to FIG. 5 can realize a structure having a high shielding effect, but has a problem that an operation cost related to mounting is generated. Specifically, in the example shown in FIG. 5, in order to fix the shield plate 9 to the shield case 1, a step of bending the shield plate 9 into an L shape, and a screw hole for fastening the set screw 5 to the shield case 1 are provided. A step of processing and a step of fastening the set screw 5 after positioning the shield plate 9 on the shield case 1 are necessary.

  Further, in place of this method, the method of fixing the shield plate 9 to the shield case 1 by soldering does not generate screw hole processing, but instead performs plating processing for soldering and flux application processing. Newly generated and the process becomes complicated.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a shield structure for an electronic device that has a high shielding property and has a low cost and good assemblability.

From the first aspect of the present invention, the above problem is
A substrate on which an electronic device that generates electromagnetic waves or is affected by electromagnetic waves is disposed;
In the shield structure of an electronic device having a shield case in which the substrate is installed,
A mounting groove is formed in the shield case, a flat shield plate for blocking the spatial propagation of the electromagnetic wave is mounted in the mounting groove, and the shield plate is mounted on the shield case by an elastic shield member. This can be solved by a shield structure of an electronic device, wherein the shielding plate is pressed by a case lid.

  In the above invention, it is preferable that flanges are formed on both sides of the shielding plate, and the shielding plate is attached to the shield case by inserting the flanges into the attachment groove.

  In the above invention, the shield member is preferably disposed between the substrate and the shielding plate.

  According to the present invention, complicated machining (bending, cutting, etc.) can be omitted by making the shielding plate a simple flat plate shape, thereby reducing the cost.

  In addition, by forming a mounting groove in the shield case and inserting the shielding plate into the mounting groove, the shielding plate is supported by the shield case, thereby reducing the time-consuming manufacturing man-hours such as screwing and soldering. It can be omitted.

  Further, since the shield plate is fixed to the shield case by an elastic shield member, the electrical connection between the shield plate and the shield member is improved, and the shielding property against electromagnetic waves can be improved. Furthermore, since the shield member can be elastically deformed to absorb mechanical tolerances and processing errors of the shield plate, etc., it is possible to securely fix the shield plate to the shield case even if tolerances and errors exist. It becomes.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  6 to 8 are diagrams for explaining a shield structure of an electronic apparatus according to an embodiment of the present invention. FIG. 6 is a perspective view showing a basic configuration of an electronic device 10 to which a shield structure according to an embodiment of the present invention is applied. FIG. 7 is a cross-sectional view showing the basic configuration of the electronic device 10 (in FIG. 8A). 8A is a plan view of the electronic device 10 with the case lid 13 removed, and FIG. 8B is a DD view in FIG. 8A. It is sectional drawing which follows a line. 6 and 7, the illustration of the RF connector 14 and the radio wave generating components 16A and 16B is omitted for the sake of illustration.

  The electronic device 10 is, for example, an RF high-power amplifier that uses high frequency. In short, the shield case 11, the printed circuit board 12, the case lid 13, the RF connectors 14A and 14B, the radio wave generating components 16A and 16B, and the shield constituting the shield structure. It has a member 17A, a shielding plate 18 and the like.

  The shield case 11 is a case with a bottom and a rectangular shape, and for example, aluminum, stainless steel, copper alloy or the like can be selected as the material. In the present embodiment, aluminum is used as the material of the shield case 11, and it is molded by aluminum die casting. In addition, a mounting groove 19 is formed at a substantially upper central position of the side wall of the shield case 11, which will be described later for convenience of explanation.

  The RF connectors 14 </ b> A and 14 </ b> B are disposed on the side wall portion on the short side of the shield case 11. The RF connector 14A is an input-side connector, and the RF connector 14B is an output-side connector. The RF connectors 14A and 14B serve as external terminals, and the electronic device 10 is connected to an external device (not shown) via the RF connectors 14A and 14B.

  The printed circuit board 12 is disposed at the bottom in the shield case 11. Various electronic components constituting an RF high power amplifier are mounted on the printed board 12, and the RF connectors 14A and 14B described above are connected. In addition, these electronic components include radio wave generating components 16A and 16B that generate electromagnetic waves (hereinafter, referred to as radio waves in this embodiment because radio waves are mainly a problem in this embodiment) by operating (FIG. 8).

  The case lid 13 is a plate made of the same material as the shield case 11, for example, and closes the upper opening of the shield case 11. The case lid 13 is fixed to the shield case 11 using a set screw 15. As a result, the printed circuit board 12 has a structure in which the shield case 11 and the case lid 13 are electromagnetically shielded from the outside.

  Thus, the electronic device 10 has a structure in which the printed circuit board 12 is housed in the internal space formed by the shield case 11 and the case lid 13 and is electromagnetically shielded from the outside. As described above, when there are a plurality of radio wave generating parts 16A and 16B, the radio wave generating parts 16A and 16B may interfere with each other and hinder proper operation. For this reason, the electronic apparatus 10 according to the present embodiment is also provided with a shield structure for preventing mutual interference between the radio wave generating components 16A and 16B.

  Hereinafter, a shield structure for preventing mutual interference between the radio wave generating components 16A and 16B will be described.

  In this embodiment, the shield structure is realized by the shielding plate 18 and the shield member 17A. The shielding plate 18 is a flat plate member, and a metal such as aluminum or copper alloy having conductivity is selected as the material. Moreover, the shielding board 18 is made into the shape which the collar part 20 extended to the side part of the rectangular main-body part 21, as shown in FIG.6 and FIG.7. Since the shielding plate 18 is a flat member having a simple shape as described above, it can be easily molded by press molding. Therefore, complicated machining (bending, cutting, etc.) can be omitted, and the shielding plate 18 can be manufactured with high productivity and low cost.

  Further, the flange portion 20 formed on the shielding plate 18 is configured to be mountable in the mounting groove 19 formed in the shield case 11. The shield plate 18 is supported by the shield case 11 by inserting and attaching the collar portion 20 to the attachment groove 19.

  On the other hand, the shield member 17A uses conductive silicon which is a conductive resin in this embodiment. Conductive silicon is conductive and elastically deformable. The shield member 17A is disposed so as to be interposed between the lower end portion of the shielding plate 18 and the printed circuit board 12, as shown in FIGS. Further, a ground via pattern (not shown) is provided at a position where the shield member 17A of the printed circuit board 12 is disposed, and thus the shield plate 18 is grounded via the shield member 17A.

  In addition, the mounting groove 19 is formed in the shield case 11. However, when the shield case 11 is molded by die casting, the mounting groove 19 can be formed at the same time. In this case, it is not necessary to separately provide a process for forming the mounting groove 19, and the manufacturing process can be simplified and the cost can be reduced.

  On the other hand, it is also possible to form the mounting groove 19 using an end mill after the shield case 11 is formed. In this case, the depth and width of the mounting groove 19 can be set as appropriate, and therefore effective when the shielding plate 18 having various aspects is used.

  Next, a method for assembling a shield structure composed of the shield member 17A and the shield plate 18 will be described.

  To assemble the shield structure, first, a shield member 17A made of conductive silicon is disposed at a predetermined position on the printed circuit board 12 where the shield plate 18 is mounted. At this time, the shield member 17A is electrically connected to the ground via pattern of the printed circuit board 12 as described above.

  Subsequently, the shield plate 18 is attached to the shield case 11 by inserting the flange portion 20 into the attachment groove 19. The arrangement position of the shield member 17A is set in the middle of the path in which the radio wave propagates between the radio wave generating component 16A and the radio wave generating component 16B.

  Since the mounting process of the shielding plate 18 to the shield case 11 is a process of simply inserting the flange 20 into the mounting groove 19, it can be performed very easily. Further, since it is possible to omit the time-consuming manufacturing steps such as screwing and soldering, the cost can be reduced.

  With the shielding plate 18 attached to the shield case 11, the lower end portion of the shielding plate 18 is in a state of riding on the upper portion of the shielding member 17A. When the case lid 13 is not fixed, the upper end portion of the shielding plate 18 is configured to slightly protrude from the upper surface of the shield case 11.

  Next, the case lid 13 is fixed to the shield case 11. The case lid 13 is fixed to the shield case 11 by placing the case lid 13 on the upper surface of the shield case 11 and then fastening the radio wave generating component 16. When fixing the case lid 13, the case lid 13 presses the upper end portion of the shielding plate 18 protruding from the upper surface of the shield case 11 as described above.

  Thereby, the shield member 17A is pressed and elastically deformed by the shielding plate 18, and the lower end portion of the shielding plate 18 is in a state of being bitten into the shield member 17A. For this reason, the electrical connection between the shield member 17A and the shielding plate 18 is improved, and the shielding property between the shield member 17A and the shielding plate 18 can be improved.

  Further, the elastic restoring force is generated by the elastic deformation of the shield member 17A (indicated by an arrow F in FIG. 7). This elastic restoring force F acts as a force for pressing the shielding plate 18 against the case lid 13.

  Thus, when the shielding plate 18 is pressed against the case lid 13, the electrical connection between the shielding plate 18 and the case lid 13 can be reliably performed. Furthermore, even if there are mechanical tolerances and processing errors in the shielding plate 18, the shield case 11 (including the mounting groove 19), the printed circuit board 12, etc., the processing error and the like are caused by the elastic deformation of the shield member 17A. Is absorbed, so that the shielding plate 18 can be securely fixed to the shielding case 11.

  Next, the function of the shield structure assembled as described above will be described.

  In the shield structure according to the present embodiment, the shielding plate 18 is disposed between the radio wave generating component 16A and the radio wave generating component 16B. With this configuration, with respect to the shielding effect due to cut-off attenuation, the width of the radio wave path is only the width ΔW (shown in FIG. 7) of the minute separation portion between the shield plate 18 and the shield case 11, and the radio wave generating component 16A. , 16B, the cut-off attenuation of radio waves can be efficiently achieved.

  Since the shield member 17A is set in the middle of the radio wave propagation path between the radio wave generating components 16A and 16B, the radio wave generating components 16A and 16B are respectively two electromagnetic chambers defined by the shielding plate 18. It is the composition arranged in. This is an equivalent configuration in which a shield case is provided for each of the radio wave generating components 16A and 16B, and therefore it is possible to effectively prevent the occurrence of interference between the radio wave generating components 16A and 16B.

  As described above, according to the shield structure according to the present embodiment, it is possible to realize a shield effect and a low cost that have been difficult to achieve in the past, and a simple shield plate 18 is used to fix by the mounting groove 19 and the shield member 17A. It is characterized by. With this effect and operation, it has become possible to provide a radio wave shield structure that can realize a high-efficiency shielding effect by realizing an easy-to-assemble assembly with inexpensive parts.

  Next, a modified example of the above shield structure will be described.

  9 to 12 show first to fourth modifications of the shield structure described with reference to FIGS. 6 to 8. 9 to 12, the same reference numerals are given to the components corresponding to those shown in FIGS. 6 to 8, and the description thereof is omitted.

  FIG. 9 is a diagram illustrating a first modification. 6 to 8, the shield member 17 </ b> A is configured to be interposed between the lower end portion of the shielding plate 18 and the printed board 12. On the other hand, this modification is characterized in that a shield member 17B is disposed between the upper end portion of the shielding plate 18 and the case lid 13. Thus, even if the shield member 17B is configured to be interposed between the upper end portion of the shielding plate 18 and the case lid 13, the same effects as those of the embodiment shown in FIGS. 6 to 8 can be obtained.

  FIG. 10 is a diagram illustrating a second modification. In this modification, a shield member 17A is provided between the lower end portion of the shielding plate 18 and the printed circuit board 12, and a shield member 17B is also provided between the upper end portion of the shielding plate 18 and the case lid 13. It is what.

  With this configuration, electrical connection between the shielding plate 18 and the shielding case 12 and between the shielding plate 18 and the case lid 13 can be more reliably performed, and the shielding performance can be improved. Further, since the shield members 17A and 17B generate elastic restoring force above and below the shielding plate 18, the shielding plate 18 can be reliably held by the shield case 11 (including the case lid 13) by this elastic restoring force.

  FIG. 11 is a diagram illustrating a third modification. In the embodiment shown in FIGS. 6 to 8, the mounting groove 19 is formed in the shield case 11, the flange portion 20 is formed in the shielding plate 18, and the flange portion 20 is inserted and mounted in the mounting groove 19. Is configured to be supported by the shield case 11.

  On the other hand, in the present modification, the mounting groove 19 is formed up to the bottom surface of the shield case 11 or the vicinity of the bottom surface (for example, up to the processing limit position by the end mill), thereby shielding the shield plate 18 without forming the flange portion 20. It is characterized in that it can be attached to the case 11.

  With this configuration, the shape of the shielding plate 18 can be made a simpler rectangular shape (rectangular shape), and the layout setting of the punching position during pressing can be facilitated. Moreover, since it becomes a target shape with respect to each direction of up, down, left, and right, the mounting direction is not limited, and therefore, the mounting work of the shield case 11 to the mounting groove 19 can be further facilitated.

  FIG. 12 is a diagram illustrating a fourth modification. In the embodiment shown in FIGS. 6 to 8, an example in which conductive silicon, which is a conductive resin, is used as the shield member 17A is shown. However, the shield member 17A is not limited to the conductive resin as long as it is elastically deformable and has shielding properties.

  This modification is characterized in that a spring member is used as the shield member 17 </ b> C interposed between the shielding plate 18 and the printed board 12. The shield member 17C is formed by pressing a conductive metal (for example, copper alloy).

  FIG. 13 is an enlarged view of the shield member 17C. As shown in the figure, the shield member 17C has a structure in which a base portion 21, a contact portion 22, a spring portion 23, a locking portion 24, and the like are integrally formed. The base portion 21 is fixed to the ground via pattern of the printed circuit board 12 by soldering or the like. The spring portion 23 is elastically deformed so that the contact portion 22 can be displaced with respect to the base portion 21 in the directions of arrows G1 and G2 in the figure. The spring portion 23 normally urges the contact portion 22 in the direction of the arrow G1 in the drawing, but the displacement of the spring portion 23 is restricted by the end portion 25 engaging with the locking portion 24.

  As shown in FIG. 12A, the shield member 17 </ b> C having the above-described configuration has a configuration in which a large number are arranged on the printed circuit board 12 along the lower end portion of the shielding plate 18. When the shielding plate 18 is attached to the shield case 11, the lower end portion of the shielding plate 18 comes into contact with the contact portion 22 of the shield member 17C and the spring portion 23 is elastically deformed, and the contact portion 22 is moved in the direction of the arrow G2. Move to. As a result, the shield member 17C is electrically connected to the shield plate 18, and the shield plate 18 is pressed toward the case lid 13 by the elastic restoring force of the spring portion 23. Therefore, the embodiment shown in FIGS. It is possible to achieve the same effects as the above.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described above, and various modifications can be made within the scope of the present invention described in the claims. It can be modified and changed.

  Specifically, in the above-described embodiment, the configuration example in which the radio wave generating parts 16A and 16B that generate radio waves are provided in the shield case 11 has been described. The present invention can be applied even in the case where electronic components that are susceptible to being received are mixedly mounted inside the shield case 11.

Regarding the above description, the following items are further disclosed.
(Appendix 1)
A substrate on which an electronic device that generates electromagnetic waves or is affected by electromagnetic waves is disposed;
In the shield structure of an electronic device having a shield case in which the substrate is installed,
A mounting groove is formed in the shield case, a flat shielding plate for blocking the spatial propagation of the electromagnetic wave is mounted in the mounting groove, and the shielding plate is fixed to the shield case by an elastic shield member. Shield structure for electronic equipment characterized by the above.
(Appendix 2)
The electron according to claim 1 or 2, wherein the shield plate has flanges formed on both sides, and the shield plate is attached to the shield case by inserting the flange into the attachment groove. Equipment shield structure.
(Appendix 3)
The shield structure for an electronic device according to appendix 1 or 2, wherein the shield member is disposed between the substrate and the shielding plate.
(Appendix 4)
The shield case has a lid that covers the opening,
The shield structure for an electronic device according to any one of appendices 1 to 3, wherein the shield member is disposed between the lid and the shielding plate.
(Appendix 5)
The shield structure for an electronic device according to any one of appendices 1 to 3, wherein the shielding plate is connected to a ground electrode formed on the substrate.

  Since the present invention forms a radio wave shielding structure based on a basic shield structure in high-frequency circuit design, it can be applied as a shield structure for electronic equipment using a wide range of frequencies from low-frequency circuits to high-frequency circuits. .

FIG. 1 is a view for explaining a shield structure as a first conventional example. FIG. 2 is a view for explaining a shield structure which is a second conventional example. FIG. 3 is a view for explaining a shield structure which is a third conventional example. FIG. 4 is a diagram for explaining a shield structure which is a fourth conventional example. FIG. 5 is a view for explaining a shield structure which is a fifth conventional example. FIG. 6 is a perspective view for explaining a shield structure according to an embodiment of the present invention. FIG. 7 is a cross-sectional view for explaining a shield structure according to an embodiment of the present invention. 8A and 8B are diagrams for explaining a shield structure according to an embodiment of the present invention. FIG. 8A is a plan view, and FIG. 8B is a cross section taken along the line DD in FIG. 8A. FIG. FIG. 9 is a cross-sectional view showing a shield structure as a first modification. FIG. 10 is a cross-sectional view showing a shield structure as a second modification. FIG. 11 is a cross-sectional view showing a shield structure as a third modification. 12A and 12B are diagrams for explaining a shield structure according to a fourth modification. FIG. 12A is a plan view, and FIG. 12B is a cross-sectional view taken along line FF in FIG. is there. FIG. 13 is an enlarged view showing a shield member used in the shield structure according to the fourth modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic device 11 Shield case 12 Printed circuit board 13 Case lid | cover 16A, 16B Radio wave generation components 17A-17C Shield member 18 Shielding board 19 Mounting groove 20 Buttocks

Claims (3)

A substrate on which an electronic device that generates electromagnetic waves or is affected by electromagnetic waves is disposed;
In the shield structure of an electronic device having a shield case in which the substrate is installed,
A mounting groove is formed in the shield case, a flat shield plate for blocking the spatial propagation of the electromagnetic wave is mounted in the mounting groove, and the shield plate is mounted on the shield case by an elastic shield member. A shielding structure for an electronic device, wherein the shielding plate is pressed by a case lid.   2. The electronic apparatus according to claim 1, wherein the shield plate has flanges formed on both sides, and the shield plate is attached to the shield case by inserting the flanges into the attachment groove. Shield structure.   The shield structure for an electronic device according to claim 1, wherein the shield member is disposed between the substrate and the shielding plate.

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