JP2009004443A - LED light emitting device, LED display device, and method of manufacturing LED light emitting device - Google Patents

Abstract

An LED light-emitting device that can be mounted with an optical axis direction of a light-emitting diode inclined with respect to a mounting substrate in an arbitrary direction, a manufacturing method thereof, and an LED display device to which such an LED light-emitting device is applied. .
An LED light emitting device includes a first lead frame on which a light emitting diode is placed, a second lead frame connected to the light emitting diode via a wire such as a gold wire, and the light emitting diode. And a molded resin portion 15 for deriving the first lead frame 11 and the second lead frame 12 from opposite directions. When the first lead frame 11 and the second lead frame 12 are connected to the mounting substrate 20, the substrate facing surface 15 ss facing the mounting substrate 20 of the molding resin portion 15 is inclined with respect to the mounting substrate 20 at an inclination angle θ. The bent portions 11bf, 11bs, and 12bf are bent in this manner.
[Selection] Figure 1

Description

  The present invention relates to an LED light emitting device in which a light emitting diode (LED) is mounted, an LED display device in which the LED light emitting device is arranged on a mounting substrate, and a method for manufacturing the LED light emitting device.

  From the viewpoint of power consumption, life, reliability, and the like, LED light emitting devices to which light emitting diodes are applied are applied to display devices and the like.

  The LED light-emitting device is protected with a resin portion in order to protect the light-emitting diode. The lead frame may be bent with respect to the resin portion for mounting on the mounting substrate (see, for example, Patent Document 1 to Patent Document 5).

  Based on FIG. 8 and FIG. 9, the LED light-emitting device which concerns on a prior art example is demonstrated.

  FIG. 8 is a front view showing a light emitting surface of a conventional LED light emitting device. FIG. 9 is a side view showing a side surface of the LED light emitting device shown in FIG. 8 mounted on a mounting board as viewed from the direction of the arrow X.

  An LED light emitting device 101 according to a conventional example includes a light emitting diode 110, a first lead frame 111 on which the light emitting diode 110 is mounted, a second lead frame 112 connected to the light emitting diode 110 via a wire, and a light emitting diode. 110 is provided with a molding resin portion 115 for deriving the first lead frame 111 and the second lead frame 112 by defining a recess 115c in which the 110 is disposed.

  The light emitting diode 110 is die-bonded to the first lead frame 111 with a conductive adhesive such as silver paste and connected to the second lead frame 112 via a wire such as a gold wire.

  The molding resin portion 115 for leading out the first lead frame 111 and the second lead frame 112 is formed by, for example, insert molding, and is also formed with a recess 115c. The inside of the recess 115 c is sealed with a sealing portion 116 to protect the light emitting diode 110. As the casting resin, an epoxy resin or a silicone resin is used, which is a transparent or milky white resin mixed with a diffusing agent.

  The LED light emitting device 101 shown in FIGS. 8 and 9 has a so-called surface mount type structure. That is, when the first lead frame 111 and the second lead frame 112 led out from the molded resin portion 115 are connected to the mounting substrate 120, the molded resin portion 115 is placed on the mounting substrate 120 in a planar shape. It is constituted as follows. That is, the first lead frame 111 and the second lead frame 112 are bent symmetrically so as to form a symmetrical arrangement.

Therefore, in the LED light emitting device 101 according to the conventional example, the optical axis of the light emitting diode 110 is perpendicular to the mounting substrate 120. That is, the LED light emitting device 101 according to the conventional example is configured as a planar LED light emitting device in which the molding resin portion 115 (the substrate facing surface facing the mounting substrate 120) is arranged in parallel to the mounting substrate 120.
JP-A-3-73578 Japanese Patent Laid-Open No. 11-87780 JP 2002-270902 A JP 2004-214436 A JP 2005-317661 A

  A conventional LED light emitting device 101 is a flat LED light emitting device in which lead frames (first lead frame 111 and second lead frame 112) are bent symmetrically with respect to each other, and a molding resin portion 115 is arranged in parallel to the mounting substrate 120. Since it is configured as an apparatus, there is a problem that the direction of the light emitting surface relative to the mounting substrate 120 (the optical axis of the light emitting diode 110) cannot be freely controlled.

  The present invention has been made in view of such a situation, and the first lead frame and the second lead are arranged so that the optical axis of the LED light emitting device (light emitting diode) connected to the mounting substrate is inclined with respect to the mounting substrate. An object of the present invention is to provide an LED light-emitting device that can be mounted by tilting the optical axis direction of the light-emitting diode with respect to the mounting substrate in an arbitrary direction by providing a bent portion by bending the frame.

  Further, the present invention provides a mounting substrate including a planar LED light emitting device in which the optical axis direction of the light emitting diode is perpendicular to the mounting substrate and an LED light emitting device in which the optical axis direction of the light emitting diode is inclined with respect to the mounting substrate. Another object of the present invention is to provide an LED display device having excellent display characteristics with a wide irradiation range with respect to the irradiated object.

  In addition, the present invention provides a bending in which the first lead frame and the second lead frame are bent so that the optical axis of the LED light emitting device (light emitting diode) is inclined with respect to the mounting substrate before the LED light emitting device is mounted on the mounting substrate. It is an object of the present invention to provide a method of manufacturing an LED light emitting device that can be mounted with an optical axis direction of a light emitting diode with respect to a mounting substrate inclined in an arbitrary direction by including a lead frame forming step of providing a portion.

  The LED light emitting device according to the present invention includes a light emitting diode, a first lead frame on which the light emitting diode is mounted, a second lead frame connected to the light emitting diode through a wire, and the light emitting diode. An LED light-emitting device comprising a molded resin portion that defines a recess and leads the first lead frame and the second lead frame from opposite directions, wherein the first lead frame led out from the molded resin portion and The second lead frame includes a bent portion that is bent so that a substrate facing surface of the molding resin portion facing the mounting substrate is inclined with respect to the mounting substrate when connected to the mounting substrate. And

  With this configuration, it is possible to obtain an LED light-emitting device that can irradiate at an irradiation angle as required by tilting the optical axis formed by the light-emitting diode with respect to the mounting substrate in an arbitrary direction at a predetermined inclination angle. Moreover, since a space is provided between the mounting substrate and the substrate facing surface, it is possible to improve the heat dissipation characteristics.

  In the LED light emitting device according to the present invention, the length of the first lead frame is longer than the length of the second lead frame.

  With this configuration, the first lead frame on which the light emitting diode is mounted can be made to act as a heat radiating portion, so that an LED light emitting device having good heat dissipation and excellent heat dissipation characteristics can be obtained.

  Moreover, in the LED light emitting device according to the present invention, a plurality of the first lead frames and the second lead frames are arranged.

  With this configuration, a plurality of light emitting diodes corresponding to the pair of the first lead frame and the second lead frame can be mounted, and an LED light emitting device that emits multicolor light can be obtained.

  In the LED light-emitting device according to the present invention, the bent portion has a cut portion.

  With this configuration, the bent portion can be easily formed with high accuracy.

  In the LED light-emitting device according to the present invention, the bent portion has a sinusoidal bent portion bent in a sinusoidal shape.

  With this configuration, the bent portion can be easily formed with high accuracy.

  In the LED light emitting device according to the present invention, the bent portion is formed so that an optical axis of the light emitting diode is inclined by about 45 degrees with respect to the mounting substrate.

  With this configuration, irradiation can be performed in a direction parallel to the mounting substrate, and irradiation over a wide area at a wide angle is possible.

  In the LED light emitting device according to the present invention, the pedestal portion of the molded resin portion on which the substrate facing surface is formed has a position where the first lead frame and the second lead frame are fixed as a base and faces the substrate. It has a trapezoidal shape with the surface as the upper side.

  With this configuration, a bent portion having a bending angle corresponding to the trapezoidal shape can be obtained, and the bent portion can be easily formed with high accuracy.

  The LED display device according to the present invention includes a planar LED light emitting device in which the optical axis of the light emitting diode is perpendicular to the mounting substrate, and an LED light emitting device in which the optical axis of the light emitting diode is inclined with respect to the mounting substrate; Is arranged on a mounting substrate, wherein the LED light emitting device is the LED light emitting device according to the present invention.

  With this configuration, it is possible to provide an LED display device that can perform efficient irradiation corresponding to the shape of the irradiated object and has excellent display characteristics with a wide irradiation range.

  The method for manufacturing an LED light-emitting device according to the present invention includes a light-emitting diode, a first lead frame on which the light-emitting diode is mounted, a second lead frame connected to the light-emitting diode via a wire, A method for manufacturing an LED light-emitting device, comprising: a first resin frame for deriving the first lead frame and the second lead frame from opposite directions by defining a recess in which the light emitting diode is disposed, wherein the first lead frame and A lead frame preparation step for preparing the second lead frame, a molding resin portion forming step for forming the molding resin portion, and after forming the molding resin portion, the light emitting diode is placed on the first lead frame. Connecting the light-emitting diode to the second lead frame with a wire, and after the connecting step, the molded resin portion 1 When the first lead frame and the second lead frame derived from are connected to a mounting substrate, the substrate facing surface of the molding resin portion facing the mounting substrate is inclined with respect to the mounting substrate. And a lead frame forming step of forming a bent portion by bending the first lead frame and the second lead frame.

  With this configuration, an LED light-emitting device capable of irradiating at an irradiation angle as required by tilting the optical axis formed by the light-emitting diode in a predetermined tilt angle in an arbitrary direction with respect to the mounting substrate is made to correspond to the mounting substrate. Since it becomes possible to form, it can be set as the manufacturing method of the LED light-emitting device excellent in productivity and versatility.

  According to the LED light emitting device and the manufacturing method thereof according to the present invention, the first lead frame and the second lead frame are configured so that the optical axis of the LED light emitting device (light emitting diode) connected to the mounting substrate is inclined with respect to the mounting substrate. Since the bent portion is provided by bending the light emitting diode, an LED light emitting device that can be mounted with the optical axis direction of the light emitting diode with respect to the mounting substrate inclined in an arbitrary direction can be easily provided.

  That is, according to the LED light emitting device of the present invention, it becomes possible to efficiently irradiate the irradiated object with the irradiation light at an angle unique to the irradiated object. Moreover, according to the manufacturing method of the LED light-emitting device which concerns on this invention, it becomes possible to set it as the manufacturing method of the LED light-emitting device excellent in productivity and versatility.

  In addition, according to the LED display device of the present invention, the planar LED light emitting device in which the optical axis direction of the light emitting diode is perpendicular to the mounting substrate, and the LED in which the optical axis direction of the light emitting diode is inclined with respect to the mounting substrate. Since the light emitting device is arranged on the mounting substrate, there is an effect that it is possible to provide an LED display device capable of efficient irradiation corresponding to the shape of the irradiated object and having excellent display characteristics with a wide irradiation range. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
Based on FIG. 1 thru | or FIG. 3, the LED light-emitting device which concerns on Embodiment 1 of this invention, and its manufacturing method are demonstrated.

  FIG. 1 is a side view showing a side state with respect to the light emitting surface of the LED light emitting device according to Embodiment 1 of the present invention.

  The LED light-emitting device 1 according to the present embodiment includes a light-emitting diode 10 (see FIG. 4; FIGS. 1 to 3 are side views and are not shown because they do not appear on the side surface), and the light-emitting diode 10. A first lead frame 11 is defined by defining a first lead frame 11 on which is mounted, a second lead frame 12 connected to the light emitting diode 10 via a wire such as a gold wire, and a recess 15c in which the light emitting diode 10 is disposed. 11 and the second lead frame 12 are provided with a molded resin portion 15 that leads out from opposite directions.

  When the first lead frame 11 and the second lead frame 12 led out from the molded resin portion 15 are connected to the mounting substrate 20, the substrate facing surface 15 ss facing the mounting substrate 20 of the molded resin portion 15 is formed on the mounting substrate 20. On the other hand, there are provided bent portions 11bf, 11bs, and 12bf that are bent so as to be inclined at an inclination angle θ (the same applies to the following drawings and will not be described as appropriate).

  That is, the first lead frame 11 and the second lead frame 12 are bent so that the lengths of the first lead frame 11 and the second lead frame 12 are different from each other, so that bent portions 11bf, 11bs, and 12bf are provided.

  With this configuration, the optical axis Lax formed by the light-emitting diode 10 (LED light-emitting device 1) is inclined with respect to the mounting substrate 20 in an arbitrary direction at a predetermined inclination angle θ, and irradiation is performed at an irradiation angle as necessary. LED light-emitting device 1 that can be used. In addition, since a space is provided between the mounting substrate 20 and the substrate facing surface 15ss, air convection can be increased, so that the heat dissipation characteristics of the LED light emitting device 1 can be improved.

  As described above, the LED light-emitting device 1 according to the present embodiment includes the light-emitting diode 10, the first lead frame 11 on which the light-emitting diode 10 is placed, and the second lead connected to the light-emitting diode 10 via wires. A frame 12 and a molded resin portion 15 that defines a recess 15c in which the light emitting diode 10 is disposed and leads the first lead frame 11 and the second lead frame 12 from opposite directions to each other, and is manufactured by the following manufacturing method. Is possible.

  That is, the manufacturing method of the LED light emitting device 1 according to the present embodiment includes a lead frame preparation step for preparing the first lead frame 11 and the second lead frame 12, and a molding resin portion forming step for forming the molding resin portion 15. After forming the molded resin portion 15, a connecting step of placing the light emitting diode 10 on the first lead frame 11 and connecting the light emitting diode 10 to the second lead frame 12 with a wire, and after the connecting step, the molded resin portion When the first lead frame 11 and the second lead frame 12 derived from 15 are connected to the mounting substrate 20, the substrate facing surface 15 ss facing the mounting substrate 20 of the molding resin portion 15 is inclined with respect to the mounting substrate 20. Bending portions 11bf, 11bs, 12b obtained by bending the first lead frame 11 and the second lead frame 12 so as to be inclined at θ. Forming a and a lead frame forming step.

  Therefore, according to the manufacturing method of the LED light emitting device 1 according to the present embodiment, the optical axis Lax formed by the light emitting diode 10 is inclined with respect to the mounting substrate 20 in an arbitrary direction at a predetermined inclination angle θ as necessary. Since the LED light emitting device 1 capable of irradiating at a different irradiation angle can be formed in correspondence with the mounting substrate 20, the manufacturing method of the LED light emitting device 1 excellent in productivity and versatility can be obtained. .

  The length of the first lead frame 11 is longer than the length of the second lead frame 12. Note that the length of the lead frame is compared with the length from the molding resin portion 15 to the position where it is connected to the mounting substrate 20.

  By making the length of the lead frame different between the first lead frame 11 and the second lead frame 12, the first lead frame 11 on which the light emitting diode 10 is placed can be made to act as a heat radiating portion. The LED light-emitting device 1 having good heat dissipation and excellent heat dissipation characteristics can be obtained.

  In the lead frame preparation step, a metal plate is punched to prepare a lead frame including the first lead frame 11 and the second lead frame 12.

  In the molding resin portion forming step, lead frames (first lead frame 11 and second lead frame 12) are arranged in an insert molding die and insert molding (parts of different materials such as metal parts embedded in a plastic molded body in advance is gold. A molding method is performed in which the resin is placed in a mold and filled with resin by injection molding or the like.

  In insert molding, an epoxy white resin is applied. That is, the light from the light emitting diode 10 is reflected without being absorbed by the molding resin portion 15.

  By insert molding, a recess 15c in which the light emitting diode 10 is disposed is defined, and a molding resin portion 15 for fixing the first lead frame 11 and the second lead frame 12 is formed. The side surface of the recess 15c is formed to constitute a reflection surface that reflects the emitted light from the light emitting diode 10 in the direction of the optical axis Lax.

  The molded resin portion 15 is composed of a cover portion 15s that forms the outer periphery of the recess 15c (outside shape on the light emitting surface side of the LED light emitting device 1) and a pedestal portion 15b that forms the substrate facing surface 15ss. The first lead frame 11 and the second lead frame 12 are fixed between 15b.

  In the recess 15c, the leading ends of the first lead frame 11 and the second lead frame 12 are exposed so that the light emitting diode 10 can be connected.

  In the connecting step, the light emitting diode 10 is connected to the tips of the first lead frame 11 and the second lead frame 12 exposed in the recess 15c. That is, a light-emitting diode 10 is die-bonded to the first lead frame 11 by applying a conductive adhesive such as silver paste, and the second lead frame 12 is connected to the light-emitting diode 10 via a wire.

  The inside of the recess 15c is sealed with a sealing portion 16 to protect the light emitting diode 10 (sealing step). The sealing part 16 is mainly cast by a potting method. As the casting resin, an epoxy resin or a silicone resin is used, which is a transparent or milky white resin mixed with a diffusing agent.

  Formation by transfer molding, injection molding, or the like is also possible, and the light emitting surface can be formed into an arbitrary shape (for example, a convex lens shape). The sealing portion 16 can also be formed in a lid shape (for example, a convex lens-like lid material) at the surface end of the concave portion 15c.

  The lead frame preparation process, the molded resin portion forming process, the connecting process, and the sealing process described above are manufactured in such a manner that a plurality of LED light emitting devices 1 are collectively processed by applying a multiple lead frame (not shown). Is possible. Generally, the process is performed in a batch manner in which a large number of LED light emitting devices 1 are simultaneously formed at once.

  Therefore, after finishing the lead frame preparation process, the molding resin portion forming process, the connection process, and the sealing process described above, the LED light emitting device 1 is individually cut from the multiple lead frame (separation process), and individual LED light emission is performed. The apparatus 1 is completed once.

  In the manufacturing method of the LED light-emitting device 1 which concerns on this Embodiment, the lead frame forming process mentioned above is further provided. That is, the first lead frame 11 and the second lead frame 12 led out from the molding resin portion 15 are formed.

  When the LED light emitting device 1 is mounted on the mounting substrate 20, the light emitting surface of the LED light emitting device 1 (the optical axis Lax of the light emitting diode 10) is mounted with an inclination angle θ with respect to the surface of the mounting substrate 20. The lead frames (the first lead frame 11 and the second lead frame 12) are processed.

  Therefore, since the LED light-emitting device 1 having an arbitrary inclination angle θ can be formed simply by changing the bending method (bending angle) of the lead frame during forming, the LED light-emitting device 1 as a component can be shared. It becomes possible.

  The first lead frame 11 includes a bent portion 11bf that is a first bent portion and a bent portion 11bs that is a second bent portion. The bent portion 11bf is formed so as to form a linear portion with the bent portion 11bs in order to incline the molding resin portion 15 (optical axis Lax), and the bent portion 11bs mounts the first lead frame 11 on the mounting substrate 20 ( As a bent portion for connection). That is, the first lead frame 11 is connected to the mounting substrate 20 at the tip of the bent portion 11bs.

  The second lead frame 12b has a bent portion 12bf which is a first bent portion. The bent portion 12bf bent to correspond to the bent portion 11bf is a bent portion for mounting (connecting) the second lead frame 12 to the mounting substrate 20. That is, the second lead frame 12 is connected to the mounting substrate 20 at the tip of the bent portion 12bf.

  Accordingly, the tip end portion of the first lead frame 11 ahead of the bent portion 11bs and the tip end portion of the second lead frame 12 ahead of the bent portion 12bf are connected to the mounting substrate 20, but the first lead frame 11 is bent. The molding resin portion 15 (optical axis Lax) is inclined due to the presence of the straight portion between the portion 11bf and the bent portion 11bs.

  That is, the first lead frame 11 has a lead portion that is longer than the second lead frame 12 by the length between the bent portion 11bf and the bent portion 11bs. As a result, the bent portion 11bf and the bent portion 11bs The molded resin portion 15 (optical axis Lax) can be tilted with respect to the mounting substrate 20 according to the length between the two.

  Further, since the bent portion 12bf shown in FIG. 1 is bent toward the side corresponding to the substrate facing surface 15ss, the wiring area of the mounting substrate 20 can be reduced. The same effect can be obtained when the bent portion 11bs is bent to the side corresponding to the substrate facing surface 15ss opposite to the illustrated direction.

  The pedestal portion 15b of the molding resin portion 15 on which the substrate facing surface 15ss is formed has a trapezoidal shape with the position where the first lead frame 11 and the second lead frame 12 are fixed as the base and the substrate facing surface 15ss as the top side. Is desirable.

  With this configuration, the lead frame (the first lead frame 11 or the second lead frame 12) can be bent along the trapezoid hypotenuse, so that the bent portion has a bend angle corresponding to the trapezoid hypotenuse. 11bf and 12bf can be obtained, and the bent portions 11bf and 12bf can be formed with high accuracy and ease.

  The bent portions 11bf, 11bs, and 12bf are preferably formed so that the optical axis Lax formed by the light emitting diode 10 is inclined by about 45 degrees with respect to the mounting substrate 20. With this configuration, irradiation can be performed in a direction parallel to the mounting substrate 20, and irradiation (display) can be performed on a wide area at a wide angle.

  2 and 3 are side views showing modifications in which the bent state of the lead frame of the LED light emitting device shown in FIG. 1 is changed. Since it is basically the same as that of FIG.

  In the LED light emitting device 1 shown in FIG. 2, unlike the case of FIG. 1, the bent portion 12bf is bent outward so as not to correspond to the substrate facing surface 15ss. Therefore, the second lead frame 12 can be easily aligned with high accuracy.

  Since the LED light emitting device 1 shown in FIGS. 1 and 2 is a surface mount type, the shape of the mounting substrate 20 can be simplified and thinned. That is, it becomes possible to make the shape of the back surface side of the mounting substrate 20 into a flat shape without unevenness. Further, since it is a surface mount type, the inclination angle θ can be easily and accurately controlled by bending the first lead frame 11 and the second lead frame 12.

  In the LED light emitting device 1 shown in FIG. 3, unlike the case of FIGS. 1 and 2, the LED light emitting device 1 is not a surface mount type, but is bent by only two bent portions 11 bf and 12 bf, so that the DIP (Dual Inline Package) is used. ) It is configured as a type. Even in the case of the DIP type, the optical axis Lax formed by the light emitting diode 10 can be inclined with respect to the mounting substrate 20 as in the case of FIGS.

  In addition, in order to perform positioning with respect to the mounting substrate 20 with high accuracy, it is desirable that an appropriate protrusion is formed in the middle of the first lead frame 11 and the second lead frame 12 so as to be positioned with respect to the mounting substrate 20. .

<Embodiment 2>
FIG. 4 is a front view showing a light emitting surface of the LED light emitting device according to Embodiment 2 of the present invention. Since the basic configuration is the same as that of the LED light emitting device 1 in the first embodiment, different configurations will be mainly described.

  In the LED light emitting device 1 according to the present embodiment, a plurality of first lead frames 11 and a plurality of second lead frames 12 are arranged. FIG. 4 shows a case where three pairs of the first lead frame 11 and the second lead frame 12 are arranged. Therefore, a plurality of light emitting diodes 10 corresponding to the pair of the first lead frame 11 and the second lead frame 12 can be mounted, and the LED light emitting device 1 that emits multicolor light can be obtained. It should be noted that the number of pairs is not limited to three and can be increased.

  When the lead frame pairs (the first lead frame 11 and the second lead frame 12) are three pairs, it is possible to mount three chips each having a different light emission color, so that the light emission color is composed of three primary colors. By controlling the current independently, full color display can be realized.

  The LED light emitting device 1 shown in the first embodiment can have a form in which one of the three pairs is taken out, and has a form in which two of the three pairs are taken out. Is also possible.

<Embodiment 3>
FIG. 5 is a side view transparently showing a side surface of the LED display device according to Embodiment 3 of the present invention. Since the basic configuration is the same as that of the LED light-emitting device 1 in the first and second embodiments, different configurations will be mainly described.

  The LED display device 2 according to the present embodiment includes a planar LED light emitting device 1f in which the optical axis Lax (see the first embodiment) of the light emitting diode 10 is perpendicular to the mounting substrate 20, and the optical axis Lax of the light emitting diode 10. The LED light emitting device 1 that is inclined with respect to the mounting substrate 20 is juxtaposed (arranged) together with the mounting substrate 20.

  As the LED light-emitting device 1, the LED light-emitting device 1 described in other embodiments can be applied as it is. Further, the conventional flat LED light emitting device 1f can be applied as it is.

  With this configuration, the LED display device 2 having excellent display characteristics with a wide irradiation range with respect to the irradiated object can be obtained. Further, the LED light emitting device 1 can be shared as a common component in the manufacturing process of the LED display device 2 up to the lead frame forming step.

<Embodiment 4>
Based on FIG. 6, FIG. 7, the LED light-emitting device which concerns on Embodiment 4 of this invention is demonstrated.

  The LED light emitting device 1 according to the present embodiment has a shape related to the bent portions 11bf, 11bs, and 12bf of the lead frames (first lead frame 11 and second lead frame 12) of the LED light emitting device 1 shown in the first embodiment. It is the modification which deform | transformed. Since it is basically the same as that of FIG.

  For convenience of explanation, a modification example of the bent portion 11bf that is the first bent portion of the first lead frame 11 will be described, but the present invention can be similarly applied to the other bent portions 11bs and 12bf.

  6A and 6B are side views showing a modification of the bent portion of the lead frame of the LED light emitting device according to Embodiment 4 of the present invention, where FIG. 6A shows a state before bending, and FIG. 6B shows a state after bending. Indicates the state.

  In the first lead frame 11 shown in FIG. 6, the bent portion 11bf has a cut portion 11v cut out in the bending direction. Therefore, the bent portion 11bf can be easily formed with high accuracy. Due to the presence of the cut portion 11v, the bent portion 11bf can be easily bent with a small pressure, so that the stress applied to the molded resin portion 15 can be suppressed.

  FIG. 7 is a side view showing a state before bending of a modified example of the bent portion of the lead frame of the LED light emitting device according to Embodiment 4 of the present invention.

  In the first lead frame 11 shown in FIG. 7, the bent portion 11bf has a sine wave bent portion 11w bent in a sine wave shape. The original bent portion of the sine wave-shaped bent portion 11w can be diverted and bent, and the same effect as in the case of FIG. 6 can be obtained by this configuration.

It is a side view which shows the side surface state with respect to the light emission surface of the LED light-emitting device which concerns on Embodiment 1 of this invention. It is a side view which shows the modification which changed the bending state of the lead frame of the LED light-emitting device shown in FIG. It is a side view which shows the modification which changed the bending state of the lead frame of the LED light-emitting device shown in FIG. It is a front view which shows the light emission surface of the LED light-emitting device concerning Embodiment 2 of this invention. It is a side view which shows transparently the side surface of the LED display apparatus which concerns on Embodiment 3 of this invention. It is a side view which shows the modification with respect to the bending part of the lead frame of the LED light-emitting device concerning Embodiment 4 of this invention, (A) shows the state before bending, (B) shows the state after bending. It is a side view which shows the state before the bending of the modification with respect to the bending part of the lead frame of the LED light-emitting device which concerns on Embodiment 4 of this invention. It is a front view which shows the light emission surface of the LED light-emitting device which concerns on a prior art example. It is a side view which shows the side which looked at the state which mounted the LED light-emitting device shown in FIG. 8 on the mounting board | substrate from the arrow X direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED light-emitting device 1f Flat type LED light-emitting device 2 LED display device 10 Light emitting diode 11 1st lead frame 11bf Bending part 11bs Bending part 11v Cutting part 11w Wave-like bending part 12 2nd lead frame 12bf Bending part 15 Molding resin part 15b Base part 15c Concave portion 15s Surface mounting portion 15ss Substrate facing surface 16 Sealing portion 20 Mounting substrate 21 Resin sealing portion Lax Optical axis θ Inclination angle

Claims (9)

A first lead frame on which the light emitting diode is mounted; a second lead frame connected to the light emitting diode via a wire; and a recess in which the light emitting diode is disposed to define the first lead. An LED light-emitting device comprising a frame and a molded resin portion that leads the second lead frame from opposite directions,
When the first lead frame and the second lead frame derived from the molding resin portion are connected to a mounting substrate, a substrate facing surface of the molding resin portion that faces the mounting substrate faces the mounting substrate. An LED light emitting device comprising a bent portion bent so as to be inclined.   The LED light emitting device according to claim 1, wherein a length of the first lead frame is longer than a length of the second lead frame.   3. The LED light emitting device according to claim 1, wherein a plurality of the first lead frames and the second lead frames are arranged.   The LED light-emitting device according to claim 1, wherein the bent portion includes a cut portion.   The LED light-emitting device according to claim 1, wherein the bent portion includes a sinusoidal bent portion bent into a sinusoidal shape.   6. The bent portion according to claim 1, wherein the bent portion is formed so that an optical axis of the light emitting diode is inclined by about 45 degrees with respect to the mounting substrate. LED light emitting device.   The pedestal portion of the molded resin portion on which the substrate facing surface is formed has a trapezoidal shape with the position where the first lead frame and the second lead frame are fixed as the base and the substrate facing surface as the top side. The LED light-emitting device according to claim 1, wherein the LED light-emitting device is a light-emitting device. An LED display device in which a planar LED light-emitting device in which the optical axis of the light-emitting diode is perpendicular to the mounting substrate and an LED light-emitting device in which the optical axis of the light-emitting diode is inclined with respect to the mounting substrate are arranged on the mounting substrate. And
The LED display device according to claim 1, wherein the LED light-emitting device is the LED light-emitting device according to claim 1. A first lead frame on which the light emitting diode is mounted; a second lead frame connected to the light emitting diode through a wire; and a recess in which the light emitting diode is disposed to define the first lead. A method of manufacturing an LED light-emitting device comprising a frame and a molded resin portion that leads the second lead frame from opposite directions,
A lead frame preparation step of preparing the first lead frame and the second lead frame;
A molding resin portion forming step for forming the molding resin portion;
After forming the molded resin portion, a connecting step of placing the light emitting diode on the first lead frame and connecting the light emitting diode to the second lead frame with a wire;
After the connecting step, when the first lead frame and the second lead frame led out from the molding resin portion 15 are connected to the mounting substrate, a substrate facing surface facing the mounting substrate of the molding resin portion is the And a lead frame forming step of forming a bent portion by bending the first lead frame and the second lead frame so as to be inclined with respect to the mounting substrate.

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