JP2009099730A - Solder ball arrangement-side surface structure of package board, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder ball arrangement-side surface structure of a package board used for preventing a conductive element located in the surface structure from falling by lack of bonding strength by increasing a contact area of the surface structure to stick the conductive element, and to provide a method of manufacturing the same. <P>SOLUTION: The solder ball arrangement-side surface structure of a package board includes a chip arrangement side and a solder ball arrangement side facing each other on the package board, wherein first and second circuit layers are provided on the chip arrangement side and the solder ball arrangement side, respectively. A first insulation protective layer is formed on the chip arrangement side of the package board and the first circuit layer. The solder ball arrangement-side surface structure includes: a metal pad being part of the second circuit layer; a metal projecting edge circumferentially formed on the metal pad; and a second insulating protective layer located on the solder ball arrangement side of the package board, and having a second opening smaller than the outer diameter size of the metal projecting edge for exposing a partial surface of the metal projecting edge. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a solder ball arrangement side surface structure of a package substrate and a manufacturing method thereof, and more particularly to a package substrate having a metal convex edge on the surface of an electrical connection pad.

  With the development of the electronic industry, research and development of electronic products are gradually progressing toward multifunction and high performance. In order to meet the requirements for high integration and miniaturization of semiconductor packages, the package substrate on which semiconductor chips are mounted is changing from a single-layer board to a multi-layer board. In this space, the circuit area that can be used on the package substrate is increased by an interlayer connection, thereby meeting the demand for using an integrated circuit having a high density of electronic elements.

  Package substrates for mounting semiconductor chips are plastic ball grid array (PBGA) substrates, chip size package (CSP) substrates, and flip chip ball grid arrays (FCBGA). ) Includes substrates. Hereinafter, an FCBGA substrate technology for a semiconductor chip package will be described as an example. As shown in FIG. 1, the flip chip technique provides a package substrate 11 having a chip disposing side first surface 11a and a solder ball disposing side second surface 11b. A first conductive element having a large number of first electrical connection pads 111 to which the semiconductor chip 12 is electrically connected to the first surface 11a, and made of solder on the surface of the first electrical connection pad 111. 13a is formed, and the second surface 11b has a second electrical connection pad 112 for electrically connecting another electronic device, for example, a printed circuit board, to the surface of the second electrical connection pad 112. The second conductive element 13b made of solder is formed, the semiconductor chip 12 has a plurality of electrode pads 121, and the metal bumps 14 are formed on the surface of the electrode pads 121. Then, the metal bumps 14 of the semiconductor chip 12 are made to correspond to the first conductive elements 13a of the package substrate 11 by flip chip, and the first conductive elements 13a are melted to satisfy the first conductive conditions. The semiconductor chip 12 is electrically connected to the package substrate 11 by solder-flowing the conductive elements 13 a to the corresponding metal bumps 14.

  However, the contact area between the second electrical connection pad 112 and the second conductive element 13b on the second surface 11b of the package substrate 11 is limited to the size of the exposed area of the second electrical connection pad 112. In addition, since the contact area between the second conductive element 13b and the second electrical connection pad 112 is insufficient, the coupling force between them is reduced, and the second conductive element 13b is easily dropped. For example, in the package substrate 11, the pitch of the second electrical connection pads 112 to be electrically connected to the printed circuit board is reduced from 800 μm to 300 μm, and the aperture of the second electrical connection pads 112 is reduced. If the size is reduced from 500 μm to 250 μm, the area for electrical connection remains as a quarter, and the coupling force of the conductive elements is greatly reduced.

  2A to 2E show a conventional manufacturing method for increasing the contact area between the electrical connection pads on the solder ball arrangement side surface of the package substrate and the conductive element. As shown in FIG. 2A, an electrical connection pad 201 is provided on the surface of the package substrate 20 on the solder ball arrangement side, and an insulating protective layer 21 is formed on the surface and the surface of the electrical connection pad 201. An opening 210 for exposing a part of the surface of the electrical connection pad 201 is formed. As shown in FIG. 2B, a conductive layer 22 is formed on the insulating protective layer 21 and on the exposed surface of the electrical connection pad 201. Then, as shown in FIG. 2C, a resist layer 23 is formed on the conductive layer 22, and the resist layer 23 is formed with an annular opening 230 by an exposure / development patterning manufacturing process. The conductive layer 22 on the periphery of the opening 210 of the insulating protective layer 21 on 201 is exposed. Thereafter, as shown in FIG. 2D, a convex edge 24 is formed by the conductive layer 22 in contact with the peripheral edge of the opening 210 of the insulating protective layer 21 by the conductive layer 22 as a current conduction route of electroplating. . Finally, as shown in FIG. 2E, by removing the resist layer 23 and the conductive layer 22 covered thereby, the surface of the convex edge 24 and a part of the electrical connection pad 201 is exposed.

  However, the conductive layer 22 is provided between the convex edge 24 and the electrical connection pad 201, and the convex edge 24 is not directly coupled to the electrical connection pad 201, that is, the convex edge 24 and the electrical connection pad 201 are electrically connected. Since the connection pad 201 is not integrated, the bonding strength between the convex edge 24 and the electrical connection pad 201 is lowered. Further, in the manufacturing process, only the structural feature in which the convex edge 24 is brought into contact with the peripheral edge of the opening 210 of the insulating protective layer 21 is formed. For example, solder formed on the convex edge 24 and the electrical connection pad 201 later. Since a conductive element such as a ball is limited to a contact area that can be increased in a limited space, the solder ball is easily dropped.

  Therefore, in the prior art, it is extremely difficult in the industry to provide a structure that increases the coupling force between the electrical connection pad and the conductive element in order to avoid the problem of the conductive element falling off due to a decrease in the bonding area. It is a problem to be solved.

  Accordingly, in view of the circumstances as described above, the present invention provides a solder ball placement side surface structure of a package substrate and a manufacturing method thereof for increasing the contact area of the surface structure to which the conductive element is bonded. Objective.

  Another object of the present invention is to provide a solder ball arrangement side surface structure of a package substrate and a manufacturing method thereof for increasing the bonding force between the surface structure and a conductive element.

  In order to solve the above problems, the present invention has a chip arrangement side and a solder ball arrangement side facing each other, and has first and second circuit layers on the chip arrangement side and the solder ball arrangement side, respectively. In the solder ball arrangement side surface structure of the package substrate in which the first insulating protective layer is formed on the chip arrangement side and the first circuit layer of the package substrate, the surface structure on the solder ball arrangement side is the second structure. A metal pad that is a part of the circuit layer, a metal convex edge provided around the metal pad, and a part of the metal convex edge that is located on the solder ball placement side of the package substrate And a second insulating protective layer having a second opening smaller than the outer diameter size of the metal convex edge.

  Further, the present invention has a chip placement side and a solder ball placement side facing each other on the package substrate, and has first and second circuit layers on the chip placement side and the solder ball placement side, respectively. In the solder ball arrangement side surface structure of the package substrate in which the first insulating protective layer is formed on the chip arrangement side of the substrate and the first circuit layer, the surface structure on the solder ball arrangement side is the second circuit. A metal pad which is a part of the layer, a metal convex edge provided around the metal pad, and the metal pad which is located on the solder ball arrangement side of the package substrate and exposes the metal convex edge and the metal pad And a second insulating protective layer having a second opening larger than the first size.

  According to said structure, it has a surface treatment layer or an electroconductive element located on this metal pad and a metal convex edge, and this surface treatment layer is an organic solderability protective material (Organic Solderability Preservative, OSP), nickel / One of gold (Ni / Au), nickel / palladium / gold (Ni / Pd / Au), and tin / lead (Sn / Pb), or the surface treatment layer is made of gold (Au), It is one of the group consisting of silver (Ag), tin (Sn) and copper (Cu). The conductive element is a solder ball, and has a conductive layer between the surface of the package substrate and the metal pad.

  In the method of manufacturing the surface structure on the solder ball arrangement side of the package substrate according to the present invention, a core plate is prepared, and a first metal layer and a second metal layer are formed on two opposing surfaces of the core plate. A step in which metal bumps are formed on the second metal layer by electroplating, a third resist layer is formed on the first metal layer, and a part of the first metal layer. A third opening is formed to expose the surface of the second metal layer, a fourth resist layer is formed on the second metal layer and the metal bump, and a part of the surface of the second metal layer is exposed. A step of forming a fourth opening and a fifth opening for exposing a part of the surface of the metal bump, and a first step in the third and fourth openings of the third and fourth resist layers. And by removing the second metal layer, the opposing two of the core plates A first circuit layer, a second circuit layer, and a metal pad are formed on the surface, respectively, and the metal bumps are provided on the metal pad by removing the metal bumps in the fifth opening. A step of forming, a step of removing the third and fourth resist layers, a first insulating protective layer is formed on the core plate and the first circuit layer, and the first insulating protective layer is formed as an electrical connection pad. Forming a first opening for exposing a part of the surface of the circuit layer; and forming a second insulating protective layer on the core plate, the second circuit layer, and a metal pad thereon, Forming a second opening for exposing a part of the surface of the metal convex edge in the second insulating protective layer.

  According to said manufacturing method, this 2nd opening is smaller than the outer diameter of this metal convex edge, or this 2nd opening is larger than the outer diameter of this metal pad.

  The core plate is a two-layer or multi-layer circuit board or insulating plate having a dielectric layer on the surface, and the outer shape of the metal convex edge is any one of a circle, an ellipse, a rectangle, and an irregular shape. The outer shape of the pad is any one of a circle, an ellipse, a rectangle, and an irregular shape, and the outer diameter of the metal convex edge is smaller than the outer diameter of the metal pad.

  In the manufacturing method in which metal bumps are formed on the second metal layer by electroplating, the first and second resist layers are formed on the first metal layer and the second metal layer, respectively. Forming a second opening for exposing a part of the surface of the second metal layer in the resist layer; and on the second metal layer in the second opening of the second resist layer. A step of forming metal bumps by electroplating, and a step of exposing the first and second metal layers and the metal bumps by removing the first and second resist layers.

  According to the above manufacturing method, the metal bump in the fifth opening further includes a step of forming a metal layer on the metal pad by removing a part of the upper surface, and the metal convex edge And a surface treatment layer is formed on the metal layer, and the surface treatment layer is one of organic solderability protective material, nickel / gold, nickel / palladium / gold, tin / lead, or The surface treatment layer is one of a group consisting of gold, silver, tin and copper, and a conductive element which is a solder ball is formed on the surface treatment layer, or solder is formed on the metal convex edge and the metal layer. And a step of forming a conductive element which is a ball.

  In another embodiment according to the present invention, the metal bump in the fifth opening is completely removed to expose a part of the surface of the metal pad, and a surface treatment layer is formed on the metal convex edge and the metal pad. The surface treatment layer is one of organic solderability protective material, nickel / gold, nickel / palladium / gold, and tin / lead, or the surface treatment layer The layer is one of a group consisting of gold, silver, tin, and copper, and a conductive element that is a solder ball is formed on the surface treatment layer, or a solder ball is formed on the metal convex edge and the metal pad. And a step of forming a conductive element.

  The manufacturing method of the solder ball arrangement side surface structure of another package substrate according to the present invention includes a step of preparing a core plate, a step of forming a conductive layer on the surface of the core plate, and both surfaces of the core plate. First and second resist layers are formed on the respective conductive layers, and first and second openings are formed in the first and second resist layers to expose a part of the surface of the conductive layer. And a second circuit layer having a first circuit layer and a metal pad is formed by electroplating in the first and second openings of the first and second resist layers on both surfaces of the core plate, respectively. A third resist layer is formed on the surfaces of the first resist layer and the second circuit layer, and a fourth resist layer is formed on the surfaces of the second resist layer and the second circuit layer. A surface of a part of the metal pad on the fourth resist layer A step of forming an annular opening for exposure, a step of forming a metal convex edge on the surface of the metal pad by using the conductive layer as a current conduction route by electroplating, the second resist layer, a first Removing the resist layer and the conductive layer covered therewith, and removing the fourth resist layer, the third resist layer and the conductive layer covered thereby, the first circuit layer, the second A step of exposing a metal convex edge on the circuit layer and the metal pad; and a first insulating protective layer is formed on the core plate and the first circuit layer, and one of the first circuit layers is used as an electrical connection pad. Forming a first opening for exposing the surface of the portion, and forming a second insulating protective layer on the core plate, the second circuit layer and the metal pad thereon, A part of the surface of the metal convex edge is exposed to the insulating protective layer. Comprises the steps of a second opening of the order is formed, the.

  According to the above manufacturing method, the outer diameter of the second opening is smaller than the outer diameter of the metal convex edge, or the outer diameter of the second opening is larger than the outer diameter of the metal pad.

  The core plate is one of a two-layer or multilayer circuit board having a dielectric layer on the surface, a copper clad laminate (CCL), and an insulating board, and the outer shape of the metal convex edge is circular, elliptical Any one of a shape, a rectangle, and an irregular shape, and the outer shape of the metal pad is any one of a circle, an ellipse, a rectangle, and an irregular shape, and the outer diameter of the metal convex edge is the metal pad Is smaller than the outer diameter.

  Moreover, according to said manufacturing method, it further has the process of forming a surface treatment layer on this metal convex edge and a metal pad, and this surface treatment layer is an organic solderability protective material, nickel / gold, Or any one of nickel / palladium / gold and tin / lead, or the surface treatment layer is one of a group consisting of gold, silver, tin and copper, on the surface treatment layer Forming a conductive element that is a solder ball, or forming a conductive element that is a solder ball on the metal convex edge and the metal pad.

  The surface structure on the solder ball arrangement side of the package substrate according to the present invention has a large contact area on the surface of the metal pad by forming a metal convex edge on the surface of the metal pad. By adjusting the opening type, the bonding area of the conductive elements located on the surface of the electrical connection pad is increased, and a conventional conductive layer is not provided between the metal pad and the metal convex edge. As a result, it is possible to improve the bonding strength between the metal pad and the metal convex edge, and to prevent the conductive element formed on the metal pad and the metal convex edge from dropping later.

  In the following, specific embodiments of the present invention will be described with reference to specific embodiments. Those skilled in the art can easily understand the other advantages and effects of the present invention described in the specification.

[First embodiment]
3A to 3H (a) are cross-sectional views schematically showing a first embodiment of a method for manufacturing a solder ball arrangement side surface structure of a package substrate according to the present invention.

  As shown in FIG. 3A, first, a core plate 30 is prepared, and a first metal layer 31a and a second metal layer 31b are formed on both opposing surfaces of the core plate 30, and the core plate 30 2 layers having a dielectric layer, a multilayer circuit board or an insulating board. There are many techniques related to the circuit board manufacturing process, but since this is a manufacturing technique well known in the industry and not a technical feature of the present application, a detailed description thereof will be omitted.

  As shown in FIG. 3B, first and second resist layers 32a and 32b are formed on the first metal layer 31a and the second metal layer 31b, respectively, and the first and second resist layers 32a and 32b are formed. Is a photoresist layer (photoresist) such as a dry film or a liquid film photoresist, and is formed on the first metal layer 31a and the second metal layer 31b by printing, spin coating or bonding, and the like. Patterned by development or the like, a second opening 320b for exposing a part of the surface of the second metal layer 31b is formed in the second resist layer 32b.

  As shown in FIG. 3C, metal bumps 33 are formed by electroplating on the second metal layer 31b in the second opening 320b where the second resist layer 32b is exposed, using the second metal layer 31b as a current conduction route. Is formed.

  As shown in FIG. 3D, by removing the first and second resist layers 32a and 32b, the first and second metal layers 31a and 31b and the metal bumps 33 are exposed.

  As shown in FIG. 3E, a third resist layer 32c is formed in the first metal layer 31a, and a third opening 320c exposing a part of the surface of the first metal layer 31a is formed. A fourth resist layer 32d is formed on the second metal layer 31b and the metal bump 33, and the fourth opening 320d and the metal bump 33 for exposing a part of the surface of the second metal layer 31b are formed. A fifth opening 321d for exposing a part of the surface is formed.

  As shown in FIGS. 3F (a) and 3F (b), the first and second metal layers 31a in the third and fourth openings 320c and 320d of the third and fourth resist layers 32c and 32d, 31b is removed by etching, and the metal bumps 33 in the fifth opening 321d are removed, so that the first circuit layer 31a ′, the second circuit layer 31b ′, And the metal pad 310b ′ is formed, and by removing the thickness of a part of the metal bump 33, the metal convex edge 33 ′ is formed so as to be provided on the metal pad 310b ′. A metal layer 331 ′ (for example, as shown in FIG. 3F (a)) is formed on the metal pad 310b ′ in the metal convex edge 33 ′, or the metal bump 33 in the fifth opening 321d is formed. The core plate 30 and the first circuit layer are formed by forming the metal protrusions 33 ″ on the metal pads 310b ′ (for example, as shown in FIG. 3F (b)) by removing them completely. 31a 'and the second circuit layer 31b' constitute the package substrate 3, and the substrate 3 has two chip arrangement sides 3a and solder ball arrangement sides 3b facing each other, the chip arrangement side 3a and the solder ball arrangement side 3b has the first and second circuit layers 31a 'and 31b', respectively.

  As shown in FIG. 3G, the first circuit layer 31a ′, the second circuit layer 31b ′, the metal pad 310b ′, and the metal pad are removed by removing the third and fourth resist layers 32c and 32d. The metal convex edge 33 ′ provided around 310 b ′ is exposed.

  As shown in FIGS. 3H (a) and 3H (b), a first insulating protective layer 34a is formed on the core plate 30 and the first circuit layer 31a ′, and the first circuit is used as an electrical connection pad. By forming the first opening 340a for exposing a part of the surface of the layer 31a ', the semiconductor chip is electrically connected, and the core plate 30, the second circuit layer 31b' and A second insulating protective layer 34b is formed on the upper metal pad 310b ′, and a second opening 340b is formed. As shown in FIG. 3H (a), an SMD pad (Solder Mask Defined Pad, SMD Pad) is formed. As 37a, by making the size d2 of the second opening 340b smaller than the outer diameter size d1 of the metal convex edge 33 ′, a part of the surface of the metal convex edge 33 ′ is exposed. Alternatively, as shown in FIG. 3H (b), the size d4 of the second opening 340b ′ is larger than the size d3 of the metal pad 310b ′ as an NSMD pad (Non Solder Mask Defined Pad, SMD Pad, NSMD Pad) 37b. As a result, the metal pad 310b ′ and the metal convex edge 33 ′ are exposed.

  As shown in FIG. 3H (a), the package substrate 3 according to the present invention has a chip substrate arrangement side 3a and a solder ball arrangement side 3b facing each other. The placement side 3a and the solder ball placement side 3b have first and second circuit layers 31a ′ and 31b ′, respectively, and the first insulating protective layer 34a is provided on the chip placement side 3a and the first circuit layer 31a ′. The solder ball arrangement side surface structure includes a metal pad 310b ′ which is a part of the second circuit layer 31b ′, and a metal convex edge 33 ′ provided on the metal pad 310b ′. And a second insulating protective layer 34b having a second opening 340b located on the solder ball arrangement side 3b of the package substrate 3.

  According to the above structure, as the SMD pad 37a, the size of the second opening 340b is made smaller than the outer diameter size of the metal convex edge 33 ′, whereby a part of the surface of the metal convex edge 33 ′ is exposed. Is done. Alternatively, the size of the second opening 340b 'as the NSMD pad 37b is made larger than the size of the metal pad 310b' to expose the metal pad 310b 'and the metal convex edge 33'. The outer shape of the metal convex edge 33 ′ is any one of a circle, an ellipse, a rectangle and an irregular shape, and the outer shape of the metal pad 310b ′ is any one of a circle, an ellipse, a rectangle and an irregular shape. The outer diameter of the metal convex edge 33 ′ is smaller than the outer diameter of the metal pad 310b ′.

[Second Embodiment]
4A to 4G (a) are cross-sectional views schematically showing a second embodiment of the method for manufacturing the surface structure on the solder ball arrangement side of the package substrate according to the present invention.

As shown in FIG. 4A, first, a core plate 30 on both surfaces facing each other is prepared, and a conductive layer 301 is formed on the surface of the core plate 30. The core plate 30 is an insulating plate, a copper-clad laminate, or a two-layer or multilayer circuit board having a dielectric layer on the surface. There are many techniques related to the circuit board manufacturing process, but since this is a manufacturing technique well known in the industry and not a technical feature of the present application, a detailed description thereof will be omitted. As shown in FIG. 4B, first and second resist layers 32a and 32b are respectively formed on the conductive layers 301 on both surfaces of the core plate 30, and the first and second resist layers 32a and 32b are electrically conductive. First and second openings 320a and 320b for exposing a part of the surface of the layer 301 are formed.

  As shown in FIG. 4C, the conductive layer 301 serves as a current conduction route for electroplating to the first and second openings 320a and 320b of the first and second resist layers 32a and 32b on both surfaces of the core plate 30. Each of the first circuit layer 31a ′ and the second circuit layer 31b ′ is formed by electroplating, and the second circuit layer 31b ′ has a metal pad 310b ′.

  As shown in FIG. 4D, a third resist layer 32c is formed on the surfaces of the first resist layer 32a and the first circuit layer 31a ′, and the second resist layer 32b and the second circuit layer 31b ′. A fourth resist layer 32d is formed on the surface, and an annular opening 320d for exposing a part of the surface of the metal pad 310b ′ is formed in the fourth resist layer 32d.

  As shown in FIG. 4E, a metal convex edge 33 'is formed on the surface of the metal pad 310b' by electroplating using the conductive layer 301 as a current conduction route.

  As shown in FIG. 4F, the second resist layer 32b, the first resist layer 32a, and the conductive layer 301 covered thereby are removed, and the fourth resist layer 32d, the third resist layer 32c, and the same are removed. By removing the conductive layer 301 covered with, the first circuit layer 31a ′, the second circuit layer 31b ′, and the metal convex edge 33 ′ on the metal pad 310b ′ are exposed.

  As shown in FIGS. 4G (a) and 4G (b), a first insulating protective layer 34a is formed on the core plate 30 and the first circuit layer 31a ′, and the first insulating protective layer 34a is used as an electrical connection pad. By forming the first opening 340a for exposing a part of the surface of the circuit layer 31a ′, the semiconductor chip is electrically connected. Further, a second insulating protective layer 34b is formed on the core plate 30, the second circuit layer 31b ′ and the metal pad 310b ′ thereon, and as shown in FIG. 4G (a), as an SMD pad 37a. A second opening 340b is formed which is smaller than the outer diameter of the metal convex edge 33 ′ and exposes a part of the surface of the metal convex edge 33 ′. Alternatively, as shown in FIG. 4G (b), as the NSMD pad 37b, the size of the second opening 340b ′ is larger than the size of the metal pad 310b ′, whereby the metal pad 310b and the metal convex edge 33 ′. To expose. The outer shape of the metal convex edge 33 ′ is any one of a circle, an ellipse, a rectangle and an irregular shape, and the outer shape of the metal pad 310b ′ is any one of a circle, an ellipse, a rectangle and an irregular shape. The outer diameter of the metal convex edge 33 ′ is smaller than the outer diameter of the metal pad 310b ′.

  As shown in FIGS. 5A to 5C, a surface treatment layer 35 is formed on the SMD pad 37a. As shown in FIG. 5A, the surface treatment layer 35 is made of an organic solderable protective material, nickel / gold, nickel / palladium. The surface treatment layer 35 is any one of a group consisting of gold, silver, tin, and copper. As shown in FIG. 5B, a conductive element 36 as a solder ball is formed on the surface treatment layer 35, and as shown in FIG. 5C, a conductive element 36 as a solder ball is formed on the SMD pad 37a.

  As shown in FIGS. 6A to 6C, a surface treatment layer 35 is formed on the NSMD pad 37b. As shown in FIG. 6A, the surface treatment layer 35 is made of an organic solderable protective material, nickel / gold, nickel / palladium. The surface treatment layer 35 is any one of a group consisting of gold, silver, tin, and copper. As shown in FIG. 6B, a conductive element 36 that is a solder ball is formed on the surface treatment layer 35, and as shown in FIG. 6C, a conductive element 36 that is a solder ball is formed on the NSMD pad 37b.

  The surface structure on the solder ball arrangement side of the package substrate according to the present invention has a large contact area on the surface of the metal pad by forming a metal convex edge on the surface of the metal pad. By adjusting the opening type, the coupling area of the conductive elements located on the surface of the electrical connection pad is increased, and by not having a conventional conductive layer between the metal pad and the metal convex edge, It is possible to improve the bonding strength between the metal pad and the metal convex edge, and to prevent the conductive element formed on the metal pad and the metal convex edge from falling off.

  As described above, these embodiments are illustrative of the principles, effects, and functions of the present invention, and the present invention is not limited thereto. The substantial technical contents of the present invention are defined in the following claims. The present invention can be modified and changed in various ways by those skilled in the art without departing from the scope of the claims, and such modifications and changes are included in the technical scope of the present invention.

It is the figure which showed typically a mode that the semiconductor chip was mounted in the conventional package substrate surface. It is sectional drawing which showed the manufacturing method in which the convex edge was formed on the electrical connection pad of the conventional package substrate. It is sectional drawing which showed the manufacturing method in which the convex edge was formed on the electrical connection pad of the conventional package substrate. It is sectional drawing which showed the manufacturing method in which the convex edge was formed on the electrical connection pad of the conventional package substrate. It is sectional drawing which showed the manufacturing method in which the convex edge was formed on the electrical connection pad of the conventional package substrate. It is sectional drawing which showed the manufacturing method in which the convex edge was formed on the electrical connection pad of the conventional package substrate. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is another Example of FIG. 3F (a). It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 1st Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is another example of FIG. 3H (a). It is sectional drawing which showed the manufacturing method of the 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed manufacturing F method of 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is sectional drawing which showed the manufacturing method of the 2nd Example of the solder ball arrangement | positioning surface structure of the package board | substrate concerning this invention. It is another Example of FIG. 4G (a). It is an Example in which the surface treatment layer was formed on the metal pad and the metal convex edge of the SMD pad. 5B is an embodiment in which a conductive element is formed on the surface treatment layer of FIG. 5A. It is an Example in which the conductive element was formed on the metal pad and the metal convex edge of the SMD pad. It is an Example in which the surface treatment layer was formed on the metal pad and the metal convex edge of the NSMD pad. 6B is an example in which a conductive element is formed on the surface treatment layer of FIG. 6A. This is an example in which conductive elements are formed on a metal pad and a metal convex edge of an NSMD pad.

Explanation of symbols

11, 20, 3 Package substrate 11a First surface 11b Second surface 111 First electric connection pad 112 Second electric connection pad 12 Semiconductor chip 121 Electrode pad 13a First conductive element 13b Second conductive element 14 Metal bump 201 Electrical connection pad 21 Insulating protective layer 210 Opening 22, 301 Conductive layer 23 Resist layer 230, 320d Annular opening 24 Convex edge 3a Chip placement side 3b Solder ball placement side 30 Core plate 310b ′ metal pad 31a First metal layer 31a ′ first circuit layer 31b second metal layer 31b ′ second circuit layer 32a first resist layer 320a first opening 32b second resist layer 320b second opening 32c third resist layer 320c second 3 opening 32d 4th resist layer 320d 4th opening 321d 5th opening 33 Metal bump 33 'metal Convex edge 331 ′ metal layer 34a first insulating protective layer 340a first opening 34b second insulating protective layer 340b, 340b ′ second opening 35 surface treatment layer 36 conductive element 37a SMD pad 37b ′, NSMD pad

Claims (30)

There are a chip arrangement side and a solder ball arrangement side opposite to each other, first and second circuit layers are provided on the chip arrangement side and the solder ball arrangement side, respectively, and a first arrangement is provided on the chip arrangement side and the first circuit layer. In the solder ball arrangement side surface structure of the package substrate on which the insulating protective layer 1 is formed,
A metal pad that is part of the second circuit layer;
A metal convex edge provided around the metal pad;
A second insulating protective layer located on the solder ball placement side of the package substrate and having a second opening smaller than the outer diameter size of the metal convex edge for exposing a part of the surface of the metal convex edge;
A solder ball arrangement side surface structure of a package substrate, comprising:   2. The solder ball arrangement side surface structure of a package substrate according to claim 1, wherein an outer diameter of the metal convex edge is smaller than an outer diameter of the metal pad.   2. The solder ball placement side surface structure of a package substrate according to claim 1, further comprising a metal layer positioned on the metal pad in the metal convex edge.   The surface structure layer located on the said metal convex edge and a metal layer is further provided, The solder ball arrangement | positioning surface structure of the package board | substrate of Claim 3 characterized by the above-mentioned.   5. The solder ball of a package substrate according to claim 4, wherein the surface treatment layer is one of an organic solderability protective material, nickel / gold, nickel / palladium / gold, and tin / lead. Placement side surface structure.   The solder ball arrangement side surface structure of a package substrate according to claim 4, wherein the surface treatment layer is one of a group consisting of gold, silver, tin, and copper.   2. The surface structure on the solder ball arrangement side of the package substrate according to claim 1, further comprising a surface treatment layer located on the metal pad and the metal convex edge. 3. The surface structure on the solder ball arrangement side of the package substrate according to claim 1, further comprising a conductive layer positioned between the surface of the package substrate and the metal pad. There are a chip arrangement side and a solder ball arrangement side opposite to each other, first and second circuit layers are provided on the chip arrangement side and the solder ball arrangement side, respectively, and a first arrangement is provided on the chip arrangement side and the first circuit layer. In the solder ball arrangement side surface structure of the package substrate on which the insulating protective layer 1 is formed,
A metal pad that is part of the second circuit layer;
A metal convex edge provided around the metal pad;
A second insulating protective layer located on the solder ball arrangement side of the package substrate and having a second opening larger than the size of the metal pad for exposing the metal convex edge and the metal pad;
A solder ball arrangement side surface structure of a package substrate, comprising:   10. The solder ball arrangement side surface structure of a package substrate according to claim 9, wherein the outer diameter of the metal convex edge is smaller than the outer diameter of the metal pad.   The solder ball arrangement side surface structure of a package substrate according to claim 9, further comprising a metal layer positioned on the metal pad in the metal convex edge.   12. The solder ball placement side surface structure of a package substrate according to claim 11, further comprising a surface treatment layer located on the metal convex edge, the metal layer, and the metal pad.   The surface structure layer located on the said metal pad and a metal convex edge is further provided, The solder ball arrangement | positioning side surface structure of the package board | substrate of Claim 9 characterized by the above-mentioned.   The package structure according to claim 9, further comprising a conductive layer located between the surface of the package substrate and the metal pad. A method of manufacturing a surface structure on a solder ball arrangement side of a package substrate,
A step of preparing a core plate, and forming a first metal layer and a second metal layer on both opposing surfaces of the core plate;
Forming a metal bump on the second metal layer by electroplating;
A third resist layer is formed on the first metal layer, a third opening for exposing a part of the surface of the first metal layer is formed, and the second metal layer and the metal bump are formed. A fourth resist layer is formed thereon, and a fourth opening for exposing a part of the surface of the second metal layer and a fifth opening for exposing a part of the surface of the metal bump are provided. A process to be formed;
By removing the first and second metal layers in the third and fourth openings of the third and fourth resist layers, a first circuit layer and a second circuit layer are formed on both opposing surfaces of the core plate, respectively. A circuit layer and a metal pad are formed, and a metal bump is formed on the metal pad by removing the metal bump in the fifth opening, and
Removing the third and fourth resist layers;
A step of forming a first insulating protective layer on the core plate and the first circuit layer, and forming a first opening for exposing a part of the surface of the first circuit layer as an electrical connection pad. When,
A second insulating protective layer is formed on the core plate, the second circuit layer, and the metal pad thereover, and a second surface for exposing a part of the metal convex edge to the second insulating protective layer. Two openings are formed;
A method for manufacturing a surface structure on a solder ball arrangement side of a package substrate, comprising:   16. The method for manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 15, wherein the second opening is smaller than the outer diameter of the metal convex edge.   16. The method of manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 15, wherein the second opening is larger than the outer diameter of the metal pad.   16. The method for producing a surface structure on a solder ball arrangement side of a package substrate according to claim 15, wherein the core plate is one of a two-layer circuit board having a dielectric layer on its surface or a multilayer circuit board and an insulating board. .   16. The method of manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 15, wherein the outer diameter of the metal convex edge is smaller than the outer diameter of the metal pad. A manufacturing method in which metal bumps are formed on the second metal layer by electroplating,
First and second resist layers are formed on the first metal layer and the second metal layer, respectively, and a second surface for exposing a part of the surface of the second metal layer to the second resist layer is formed. Two openings are formed;
Forming a metal bump by electroplating on the second metal layer in the second opening of the second resist layer;
Exposing the first and second metal layers and metal bumps by removing the first and second resist layers;
The method for manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 15, comprising:   The solder ball placement side surface of the package substrate according to claim 15, wherein a metal layer is formed on the metal pad by removing a part of the thickness of the metal bump in the fifth opening. Structure manufacturing method.   The method for manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 21, further comprising a step of forming a surface treatment layer on the metal convex edge and the metal layer.   16. The manufacturing method of a solder ball arrangement side surface structure of a package substrate according to claim 15, wherein the metal bump in the fifth opening is completely removed to expose a part of the surface of the metal pad. Method.   The method for manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 23, further comprising a step of forming a surface treatment layer on the metal convex edge and the metal pad. A method of manufacturing a surface structure on a solder ball arrangement side of a package substrate,
A step of preparing a core plate;
A step of forming a conductive layer on the surface of the core plate;
First and second resist layers are respectively formed on the conductive layers on both surfaces of the core plate, and the first and second resist layers are exposed on the first and second resist layers. Forming a second opening;
Forming a first circuit layer and a second circuit layer having a metal pad by electroplating in the first and second openings of the first and second resist layers on both surfaces of the core plate, respectively;
A third resist layer is formed on the surfaces of the first resist layer and the first circuit layer, a fourth resist layer is formed on the surfaces of the second resist layer and the second circuit layer, and the fourth resist layer is formed. Forming an annular opening for exposing a part of the surface of the metal pad in the resist layer;
Forming a metal convex edge by electroplating on the surface of the metal pad using the conductive layer as a current conduction route;
Removing the second resist layer, the first resist layer and the conductive layer covered thereby, and removing the fourth resist layer, the third resist layer and the conductive layer covered thereby; Exposing the metal raised edges on the first circuit layer, the second circuit layer and the metal pad;
A step of forming a first insulating protective layer on the core plate and the first circuit layer, and forming a first opening for exposing a part of the surface of the first circuit layer as an electrical connection pad. When,
A second insulating protective layer is formed on the core plate, the second circuit layer, and a metal pad thereon, and a second surface for exposing a part of the surface of the metal convex edge to the second insulating protective layer. Two openings are formed;
A method for manufacturing a surface structure on a solder ball arrangement side of a package substrate, comprising:   26. The method for manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 25, wherein the second opening is smaller than the outer diameter of the metal convex edge.   26. The method of manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 25, wherein the second opening is larger than the outer diameter of the metal pad.   26. The solder ball arrangement side of the package substrate according to claim 25, wherein the core plate is one of a two-layer or multilayer circuit board having a dielectric layer on the surface, a copper-clad laminate, and an insulating board. Manufacturing method of surface structure.   26. The method of manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 25, wherein an outer diameter of the metal convex edge is smaller than an outer diameter of the metal pad.   26. The method of manufacturing a surface structure on a solder ball arrangement side of a package substrate according to claim 25, further comprising a step of forming a surface treatment layer on the metal convex edge and the metal pad.

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