JP2009092652A - Method for evaluating remaining life of metal material and method for evaluating deformation - Google Patents

Abstract

The present invention provides a remaining life evaluation method and a deformation amount evaluation method for a metal material that can stably and accurately evaluate a material life and a deformation amount over a wide range.
The crystal orientation distribution measuring means measures the crystal orientation distribution with respect to the progress of material life of the test material, the crystal orientation distribution is quantified by the crystal orientation distribution quantifying means, and the quantified crystal orientation distribution and material life are measured. The first master curve representing the relationship with the degree of progress is derived by the master curve deriving means and stored in the database. Subsequently, the crystal orientation distribution measuring means measures the crystal orientation distribution of the investigation material that is made of the same material as the test material and performs the remaining life evaluation, and the crystal orientation distribution quantifying means quantifies the crystal orientation distribution. Subsequently, the data on the first master curve stored in the database is read by the remaining life determination means, and the quantified crystal orientation distribution of the survey material is applied to the first master curve to determine the remaining life of the survey material. To do.
[Selection] Figure 3

Description

  The present invention relates to a remaining life evaluation method for evaluating a remaining life of a metal material constituting an equipment component such as a gas turbine, for example, and a deformation amount evaluation method for evaluating a deformation amount.

  Conventionally, heat-resistant steel, Ni-base heat-resistant alloys, and the like have been used as metal materials that constitute equipment parts such as gas turbines. As a method for evaluating the remaining life of such a metal material, for example, an A-parameter method for evaluating voids on grain boundaries generated in the creep process, and a metallographic method for evaluating the remaining life from a change in the form of precipitates There are mechanical testing methods that evaluate creep tests by collecting creep test specimens from parts of equipment, hardness methods that evaluate from changes in material hardness, and electrical resistance methods that evaluate from changes in electrical resistance. .

  However, the evaluation method described above has the following problems.

  The A-parameter method can be applied only at the final stage of the lifetime in which creep voids are generated and grow, and cannot be applied to materials that are unlikely to generate creep voids. The metallographic method cannot be applied to materials used in an environment in which the precipitate morphology is unlikely to change (temperature range in which the precipitate morphology hardly changes). In the case of a material used in a sufficiently high temperature range), the measurement error becomes large, and furthermore, it cannot be applied to a material in which no precipitate is generated. The mechanical test method requires a long time for the test, and the collection of the test piece from the equipment part has many geometric restrictions, and it may be difficult to collect the test piece from the site where the creep damage is most severe. In the hardness method, a measurement error becomes large in a material having a small change in hardness with respect to the deformation amount of the material. The electrical resistance method is sensitive to changes in the resistance value, is susceptible to noise, and tends to increase measurement errors.

  Therefore, in recent years, for example, a remaining life evaluation method as shown in Patent Document 1 has been proposed. In this evaluation method, first, a material life acceleration test (for example, fatigue test) of a test material of a specific material is performed in advance, and crystal orientation difference data for a certain material life progress is collected in advance. A master curve representing the relationship between the degree of progress and the crystal orientation difference is created. Measure the crystal orientation difference between the test material and the test material of the same kind as the test material where the material life has actually progressed, and assign this value to the master curve to predict the progress of the material life of the test material and break it. Predict the remaining life span.

  In this evaluation method, the crystal orientation difference in a crystal grain is measured using an EBSP (Electron Back-Scatter Diffraction Pattern) method, and a KAM (Kernel Average Misorientation) value derived from the value is used as a material. It is a method of associating with the progress of life.

However, the difference in crystal orientation between any two points in the grain is only a few degrees even in materials at the end of life, so that sufficient evaluation accuracy can be obtained only at the end of life of the material, as well as measurement errors. It is difficult to ensure the stability and reliability of data.
JP 2004-3922 A

  An object of the present invention is to provide a remaining life evaluation method and a deformation amount evaluation method for a metal material that can be evaluated with high accuracy and stability over a wide range of material life and deformation amount.

  In the method for evaluating the remaining life of a metal material according to one aspect of the present invention, the crystal orientation distribution measuring unit measures the crystal orientation distribution with respect to the progress of the material life of the test material, and the measured crystal orientation distribution is quantified. A storage step in which the master curve derivation means derives a first master curve representing the relationship between the quantified crystal orientation distribution and the progress of the material life and stores it in the database; The crystal orientation distribution measuring means measures the crystal orientation distribution of the investigation material for the remaining life evaluation made of the same material, the crystal orientation distribution quantifying means quantifies the measured crystal orientation distribution, and the storage The data of the first master curve stored in the step is read from the database by the remaining life determination means, and the measurement step is added to the read first master curve. By applying a crystal orientation distribution of the quantified the investigated material flop, is characterized by comprising: a determination step of determining remaining life of the study material.

  In the metal material deformation amount evaluation method according to one aspect of the present invention, the crystal orientation distribution measuring unit measures the crystal orientation distribution with respect to the deformation amount of the test material, and the crystal orientation distribution quantifying unit quantifies the measured crystal orientation distribution. The first master curve representing the relationship between the quantified crystal orientation distribution and the deformation amount of the test material is derived by the master curve deriving means and stored in the database; and from the same material as the test material The crystal orientation distribution measuring means measures the crystal orientation distribution of the investigation material for which the deformation amount is evaluated, and the measured crystal orientation distribution is quantified by the crystal orientation distribution quantifying means, and stored in the storing step. The first master curve data is read from the database by the deformation amount determining means, and the read first master curve is quantified in the measurement step. By fitting the crystal orientation distribution of the survey material is characterized by comprising: a determination step of determining the amount of deformation of the study material.

  According to the above configuration, the material life and the deformation amount can be evaluated stably with high accuracy over a wide range.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In addition, although embodiment of this invention is described below based on drawing, those drawings are provided for illustration and this invention is not limited to those drawings.

  The crystal orientation of the metal material can be measured by the EBSP method. The EBSP method is a method of measuring a crystal orientation at an arbitrary point of a metal material by analyzing a Kikuchi line pattern in SEM reflection electron diffraction. An OIM (ORIENTATION IMAGING MICROSCOPY) system has been developed as a fully automatic analysis system for crystal orientation using this method. The OIM system is a system that measures crystal orientations of a large number of measurement points (usually tens of thousands to hundreds of thousands) that are regularly arranged at intervals of several μm of a metal material. Thereby, the information of the crystal orientation of the whole observation surface can be obtained as surface information. Using this OIM system, the relationship between the progress of creep damage and the change in crystal orientation distribution is shown in Fig. 1 using a solid solution strengthened Ni-base heat-resistant superalloy (HASTELLOY X, HASTELLOY is a registered trademark) with a face-centered cubic structure. Shown in

  Fig. 1 shows a test material with a creep life consumption rate of 0% (new material), a test material with a creep life consumption rate of 100% (creep fracture material), and a test material with a life consumption rate between them (creep interruption material) Is a reverse pole figure seen from the direction of the stress axis. For each of the three test materials, a test piece was cut out from the site to be evaluated, polished and placed on the SEM, and the crystal orientation distribution viewed from the stress axis direction was measured by the OIM system. The creep life consumption rate is calculated from the ratio of the creep time to the rupture life.

  As shown in FIG. 1, the crystal orientation distribution changes as creep damage progresses in the order of new material, creep interrupted material, and creep rupture material. Specifically, the ratio of crystal grains having a <101> crystal orientation with respect to the stress axis direction is decreased, the ratio of crystal grains having a <111> crystal orientation is increased, and the crystal orientation of <001> is increased. The ratio of crystal grains is increasing. This change in crystal orientation distribution is related to the Schmid factor. A crystal grain having a crystal orientation in the vicinity of <101> rotates with the deformation, and as a result, the Schmitt factor increases and further deforms. With this deformation, crystal grains having a crystal orientation in the vicinity of <101> are preferentially deformed to change the crystal orientation, and crystal grains having a crystal orientation in the vicinity of <101> are reduced.

The present inventors have devised a crystal orientation distribution parameter P _{<uv w>, x} as a parameter for quantifying the change in the crystal orientation distribution accompanying the progress of such creep damage. The ratio of the number of measurement points where the angle between the stress axis and the specific crystal orientation <uvw> is within X ° with respect to the number of all measurement points is defined as the crystal orientation distribution parameter P _{<uv w>, x} . .

Here, FIG. 2 shows a graph in which the crystal orientation distribution parameter P _{<1 0 1>, x} when the crystal orientation with respect to the stress axis direction is <101> is plotted against the creep life consumption rate.

FIG. 2 is a master curve showing the correlation between the crystal orientation distribution parameter P _{<1 0 1>, x} and the creep life consumption rate. From FIG. 2 and the Schmitt factor distribution _, the angle X in the crystal orientation distribution parameter P _{<1 0 1>, x} is preferably about 15 °. Hereinafter, in this embodiment, the angle X is 15 °.

Therefore, a consumption life test of the test material is performed in advance, and the change in the crystal orientation distribution with the progress of creep damage is quantified by the crystal orientation distribution parameter P _{<uv w>, 15} , and this crystal orientation distribution parameter P _{< If} a master curve showing the correlation between _{uv w>, 15} and creep life consumption rate (material life progress) is prepared in advance, the crystal orientation of the investigation material to be measured that actually caused the material life progress By measuring the distribution parameter P _{<uv w>, 15} and applying it to the master curve, it is possible to estimate the creep life consumption rate of the investigation material and predict the remaining life of the material.

[Method for evaluating remaining life of metal materials]
Hereinafter, the remaining life evaluation method according to this embodiment will be described. Here, a remaining life evaluation apparatus used in this evaluation method will be described.

  FIG. 3 is a remaining life evaluation apparatus used in the remaining life evaluation method according to the present embodiment.

  The remaining life evaluation apparatus 10 is configured by a computer or the like that executes a program stored in the program database 20 by the control means 30.

  The control means 30 is composed of arithmetic means such as a CPU that executes various arithmetic processes inside, a non-volatile memory such as a ROM that stores system information and the like, and a semiconductor memory such as a RAM that stores information that can be updated. Storage means, and various control operations inside and control means for controlling information exchange with the outside. Further, the control means 30 executes various information processing according to the input from the input / output interface 40, the contents of the installed program, etc., and executes various arithmetic processes in the operation described later. , Responsible for controlling each component.

  In addition, the remaining life evaluation apparatus 10 includes a keyboard or pointing device that is generally provided with a computer or the like, and receives an input or selection input by a user or the like and supplies the input / output interface 40 to the control means 30 or the like. It has. Furthermore, the remaining life evaluation apparatus 10 includes a display unit 60 configured to display predetermined information under the control of the control unit 30 and configured by a liquid crystal display, a CRT display, or the like. In addition, the remaining life evaluation apparatus 10 includes a program database 20 and a calculation database 50 that are configured by storage means such as a hard disk.

The calculation database 50 stores data necessary for executing calculations related to life evaluation. For example, data related to various master curves derived by the master curve deriving means 24 described later (for example, crystal orientation distribution parameter P _{<uv w>, 15} and the data indicating the correlation between the creep life consumption rate, etc.). The data stored in the calculation database 50 can store other data as necessary.

  Each component described above is connected by a system bus 70.

  Next, various functional means stored in the program database 20 will be described.

  The program database 20 stores crystal orientation distribution measuring means 21, GAM value measuring means 22, crystal orientation distribution quantifying means 23, master curve deriving means 24, and remaining life determining means 25 as functional means.

  The crystal orientation distribution measuring means 21 measures the crystal orientation distribution of the test material and the investigation material, and includes an OIM system using the EBSP method. Based on the crystal orientation information of the entire observation surface acquired by SEM, the crystal orientation distribution is measured for a specific crystal orientation <uvw> viewed from the stress axis direction.

  The GAM value measuring means 22 measures a GAM (Grain Average Misorientation) value of the test material or the investigation material. Normally, in a measuring instrument using the EBSP method, the GAM value measuring means 22 also includes an OIM system. Therefore, the GAM value measuring means 22 can be replaced by the crystal orientation distribution measuring means 21.

The crystal orientation distribution quantifying means 23 quantifies the crystal orientation distribution measured by the crystal orientation distribution measuring means 21 with crystal orientation distribution parameters P _{<uv w>, 15} .

The master curve deriving means 24 derives various master curves based on the crystal orientation distribution parameters P _{<uv w>, 15} quantified by the crystal orientation distribution quantifying means 23. A master curve representing the correlation between P _{<uv w>, 15} and the creep life consumption rate, and a master curve representing the correlation between the GAM value and the creep life consumption rate are derived.

The remaining life determination means 25 reads master curve data (for example, data _indicating the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep life consumption rate) from the calculation database 50 according to the purpose. Based on the master curve data and the crystal orientation distribution parameter P _{<uv w>, 15 of} the investigation material quantified by the crystal orientation distribution quantification means 23, the creep life consumption rate of the investigation material is estimated. The remaining life is determined.

  Note that various functional means in the remaining life evaluation apparatus 10 described above may be realized as a program stored in a storage device such as an appropriate program database 20 such as a memory or an HDD (Hard Disk Drive) as described above. It may be realized as hardware. When implemented as a program, the control means 30 of the remaining life evaluation apparatus 10 reads the corresponding program from the program database 20 into the memory of the control means 30 and executes it in accordance with program execution.

  A method for evaluating the remaining life of a metal material according to an embodiment of the present invention will be described with reference to FIG. FIG. 4 is a flowchart for explaining an example of the remaining life evaluation method according to the embodiment of the present invention.

  First, as a test material, a new material made of a solid solution strengthened Ni-base heat-resistant superalloy having a face-centered cubic structure (Hastelloy X, Hastelloy is a registered trademark), a creep interruption material, and a creep rupture material are prepared. For each of the test materials, new material, creep interrupted material, and creep rupture material, a test piece is cut out from the evaluation target part, polished, and placed in the SEM, and the crystal orientation information of the entire observation surface is input / output interface 40. To enter.

  Subsequently, the remaining life evaluation apparatus 10 causes the crystal orientation distribution measuring means 21 to function by the control means 30, and the crystal orientation distribution measuring means 21 is based on the crystal orientation information of the entire observation plane acquired from the input / output interface 40. The crystal orientation distribution is measured (step S101). As described in FIG. 1, the ratio of crystal grains having a <101> crystal orientation with respect to the stress axis direction is decreased, the ratio of crystal grains having a <111> crystal orientation is increased, and <001> Since the ratio of crystal grains having crystal orientation is increasing, <101>, <111>, and <001> are selected as crystal orientations with respect to the stress axis direction.

In the remaining life evaluation apparatus 10, the control unit 30 causes the crystal orientation distribution quantifying unit 23 to function, and the crystal orientation distribution quantifying unit 23 has three orientations (<101>, <111>, <001>). Are quantified with crystal orientation distribution parameters P _{<1 0 1>, 15} , crystal orientation distribution parameters P _{<1 1 1>, 15} and crystal orientation distribution parameters P _{<0 0 1>, 15} (step S102).

Subsequently, the master curve deriving means 24 uses the crystal orientation distribution parameter P _{<1 0 1>, 15} , the crystal orientation distribution parameter P _{<1 1 1>, 15} quantified by the crystal orientation distribution quantifying means 23, the crystal orientation Based on the distribution parameters P _{<0 0 1>, 15} , a master curve (see FIGS. 5, 6, and 7) showing a correlation with the creep life consumption rate is derived (step S103). FIG. 5 is a graph showing the correlation between the crystal orientation distribution parameter P _{<1 0 1>, 15} and the creep life consumption rate. FIG. 6 is a graph showing the correlation between the crystal orientation distribution parameter P _{<1 1 1>, 15} and the creep life consumption rate. FIG. 7 is a graph showing the correlation between the crystal orientation distribution parameter P _{<0 0 1>, 15} and the creep life consumption rate. The master curve may be derived for at least one of <101>, <111>, and <001>, but it is preferable to derive master curves in all three directions as in the present embodiment. . Data indicating the correlation between the crystal orientation distribution parameter P _{<1 0 1>, 15} derived by the master curve deriving means 24 and the creep life consumption rate, the crystal orientation distribution parameter P _{<1 1 1>, 15} and the creep life consumption Data representing the correlation with the rate, and data representing the correlation between the crystal orientation distribution parameter P _{<0 0 1>, 15} and the creep life consumption rate are stored in the calculation database 50 (step S104).

  Next, the test piece is made of the same kind of material as the test material described above, and the test piece is cut out from the evaluation target portion of the investigation material to be measured whose material life is actually progressing. Embedded in the resin), polished, and placed on the SEM for observation, and information on the crystal orientation of the entire observation surface is input to the input / output interface 40. When cutting out the test piece from the evaluation target site, it is preferable to cut out the test piece so that the plane perpendicular to the main stress axis direction becomes the observation plane. The shape of the test piece is not limited, and may be, for example, a cylindrical shape, a rectangular parallelepiped shape, or a wedge shape. The observation surface may have an area of about several mm × several mm. If the observation surface of the test piece is too small, the number of crystal grains to be measured is too small and the measured data tends to vary. In addition, when the test piece is polished, the strain applied to the test piece surface during polishing may cause a slight shift in crystal orientation in the crystal grains. It is preferable to elute.

  Subsequently, similarly to the test material, the crystal orientation distribution measuring means 21 measures the crystal orientation distribution (step S105). Similar to the test material, <101>, <111>, <001> are selected as crystal orientations with respect to the stress axis direction.

Subsequently, in the same manner as the test material, the crystal orientation distribution quantifying means 23 converts the crystal orientation distribution of the investigation material measured by the crystal orientation distribution measuring means 21 into crystal orientation distribution parameters P _{<1 0 1>, 15} , Quantification is performed using the orientation distribution parameter P _{<1 1 1>, 15} and the crystal orientation distribution parameter P _{<0 0 1>, 15} (step S106).

Next, the remaining life determination means 25 receives data indicating the correlation between the crystal orientation distribution parameter P _{<1 0 1>, 15} and the creep life consumption rate from the calculation database 50, and the crystal orientation distribution parameter P _{<1 1 1>. , 15} and the data representing the correlation between the creep life consumption rate and the data indicating the correlation between the crystal orientation distribution parameter P _{<0 0 1>, 15} and the creep life consumption rate, and the crystal orientation distribution in these master curves Crystal orientation distribution parameters P _{<1 0 1>, 15 of} the investigation material quantified by the quantification means 23, crystal orientation distribution parameters P _{<1 1 1>, 15} , crystal orientation distribution parameters P _{<0 0 1>, 15} Are substituted respectively to determine the remaining life (step S107). In the present embodiment, since the master curves are derived for the three directions <101>, <111>, and <001>, respectively, one master curve having the best correlation with the creep life consumption rate is obtained on the master curve. Select to estimate the creep life consumption rate of the survey material. Alternatively, when the degree of correlation is the same for all master curves, the creep life consumption rate obtained from each master curve is estimated by averaging.

As described above, the remaining life evaluation method of the metal material according to the present embodiment measures the crystal orientation distribution using the EBSP method _, and quantifies the crystal orientation distribution with the crystal orientation distribution parameter P _{<uv w>, 15} . The progress of the material life of the investigation material is estimated from the master curve representing the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep life consumption rate.

According to this evaluation method, the crystal orientation distribution parameter P _{<uv w>, 15} has a good correlation with the creep life consumption rate from the early life to the middle life. Can be predicted.

  In addition, even if the evaluation target part of the investigation material is a complex shape or thin part, the test piece only needs to have a size of about several millimeters, so it is easy to collect the test piece, and the local damage state of the material Can also be evaluated by the evaluation method of the present invention.

The remaining life of the investigation material was evaluated using a master curve (see FIGS. 5 to 7) showing the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep life consumption rate. Thus, it can also evaluate using a GAM value.

FIG. 8 is a master curve showing the correlation between the GAM value and the creep life consumption rate. The GAM value is defined by the following formula:

In the formula, B _k represents an average value of orientation differences between all adjacent two points included in the k th crystal grain, A _k represents an area of the k th crystal grain, and A represents all crystal grains in the measurement region. The area (ΣA _k ) is represented, and m represents the number of crystal grains.

  The GAM value has a good correlation with the creep life consumption rate from the middle to the end of the life, and the remaining life can be estimated with high accuracy from the middle to the end of the life.

As described above, since the crystal orientation distribution parameter P _{<uv w>, 15} has a good correlation with the creep life consumption rate from the beginning to the middle of the lifetime, the crystal orientation distribution parameter P _{<uv w>, 15} and the GAM value are expressed as follows. By combining, it is possible to evaluate with a high accuracy over a wider life span.

Hereinafter, the remaining life evaluation method using the crystal orientation distribution parameter P _{<uv w>, 15} and the GAM value will be described with reference to FIG. 4 using the remaining life evaluation apparatus of FIG. Since the remaining life evaluation method using the crystal orientation distribution parameter P _{<uv w>, 15} is as described above, it will be described here with some simplification or some omission.

  First, as a test material, a new material, a creep interruption material, and a creep rupture material are prepared, each test piece is cut out from the evaluation target portion, polished, and placed on the SEM, and information on the crystal orientation of the entire observation surface is obtained. Input to the input / output interface 40.

  Subsequently, the crystal orientation distribution measuring unit 21 measures the crystal orientation distribution based on the crystal orientation information of the entire observation surface acquired from the input / output interface 40 (step S101). <101>, <111>, <001> are selected as crystal orientations with respect to the stress axis direction.

With respect to the crystal grains having these three crystal orientations, the crystal orientation distribution quantifying means 23 quantifies the crystal orientation distribution with the crystal orientation distribution parameter P _{<uv w>, 15} (step S102), and the master curve deriving means 24 uses the crystals. A master curve (see FIGS. 5 to 7) showing the correlation between the orientation distribution parameter P _{<uv w>, 15} and the creep life consumption rate is derived (step S103). <Uvw> corresponds to <101>, <111>, and <001>.

  Subsequently, the GAM value measuring means 22 measures the GAM value of the test piece of the test material, and the master curve deriving means 24 derives a master curve (see FIG. 8) indicating the correlation between the GAM value and the creep life consumption rate. To do.

Data representing the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep life consumption rate, and data representing the correlation between the GAM value and the creep life consumption rate are stored in the calculation database 50 (step S104).

  Next, a test piece is cut out from the evaluation target portion of the investigation material, this test piece is embedded in a resin (for example, a conductive SEM observation resin), polished, placed in the SEM, and the crystal orientation of the entire observation surface Is input to the input / output interface 40.

Subsequently, similarly to the test material, the crystal orientation distribution measuring means 21 measures the crystal orientation distribution (step S105), and the crystal orientation distribution quantifying means 23 _{converts the} crystal orientation distribution into the crystal orientation distribution parameter P _{<uv w>,} Quantify with ₁₅ (step S106).

  Subsequently, similarly to the test material, the GAM value measuring means 22 measures the GAM value of the investigation material.

Next, the remaining life determination means 25 receives, from the calculation database 50, master curve data (see FIGS. 5 to 7) indicating the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep life consumption rate. , Master curve data (see FIG. 8) showing the correlation between the GAM value and the creep life consumption rate is acquired, and the crystal orientation distribution parameters of the investigation material quantified by the crystal orientation distribution quantification means 23 in these master curves P _{<uv w>, 15} and the GAM value of the investigation material measured by the GAM value measuring means 22 are substituted, respectively, the creep life consumption rate of the investigation material is estimated, and the remaining life is determined (step S107). Study material measurement-obtained crystal orientation distribution parameter P _{<uv w>, 15} is previously prepared crystal orientation distribution parameter P _{<uv w>,} master curve (diagram showing the correlation between the ₁₅ and the creep life consumption rate 5 to 7), if the correlation with the creep life consumption rate is located in a low region, it is supplemented with a master curve (see FIG. 8) showing the correlation between the GAM value and the creep life consumption rate. Thereby, it is possible to evaluate the remaining life with high accuracy in a wider life span.

[Method for evaluating deformation of metal material]
Next, a deformation amount evaluation method for a metal material according to an embodiment of the present invention will be described using the deformation amount evaluation apparatus shown in FIG. The deformation amount evaluation apparatus 100 of FIG. 9 is substantially the same as the remaining life evaluation apparatus shown in FIG. 3 except that a deformation amount determination means 26 is provided instead of the remaining life determination means. The same components are denoted by the same reference numerals, and the description thereof is simplified or omitted.

Here, based on the crystal orientation distribution parameter P _{<uv w>, 15} quantified by the crystal orientation distribution quantifying means 23, the master curve deriving means 24, for example, the crystal orientation distribution parameter P _{<uv w>, 15} And a master curve representing the correlation between the creep strain amount and the GAM value and the creep strain amount.

The deformation amount determination means 26 reads out master curve data (for example, data representing the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep strain amount) from the calculation database 50 according to the purpose. Based on the data of the master curve and the crystal orientation distribution parameter P _{<uv w>, 15 of} the investigation material quantified by the crystal orientation distribution quantifying means 23, the deformation amount of the investigation material is determined. .

  A deformation amount evaluation method using the deformation amount evaluation apparatus 100 will be described with reference to FIG. FIG. 10 is a flowchart for explaining an example of the deformation amount evaluation method according to the embodiment of the present invention. The remaining life evaluation method described above is the remaining life evaluation method, except that the creep strain amount is used instead of the creep life consumption rate, and the deformation amount is evaluated instead of evaluating the remaining life. The description of the same part is simplified or omitted.

  First, a new material, a creep interruption material, and a creep rupture material are prepared as test materials, each test piece is cut out from the evaluation target part, polished and placed on the SEM, and information on the crystal orientation of the entire observation surface is input. Input to the output interface 40.

  Subsequently, the crystal orientation distribution measuring unit 21 measures the crystal orientation distribution based on the crystal orientation information of the entire observation surface acquired from the input / output interface 40 (step S201). <101>, <111>, <001> are selected as crystal orientations with respect to the stress axis direction.

Regarding these three crystal orientations, the crystal orientation distribution quantifying means 23 quantifies the crystal orientation distribution with the crystal orientation distribution parameter P _{<uv w>, 15} (step S202), and the master curve deriving means 24 uses the crystal orientation distribution parameter P. A master curve (see FIGS. 11, 12, and 13) showing the correlation between _{<uv w>, 15} and the amount of creep strain is derived (step S203). <Uvw> corresponds to <101>, <111>, <001>.

Data indicating the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the amount of creep strain is stored in the calculation database 50 (step S204).

  Next, the test piece is cut out from the evaluation target portion of the investigation material made of the same kind of material as the test material described above, this test piece is embedded in a resin (for example, a conductive SEM observation resin), and polished. Arranged in the SEM, information on the crystal orientation of the entire observation surface is input to the input / output interface 40.

Subsequently, similarly to the test material, the crystal orientation distribution measuring means 21 measures the crystal orientation distribution of the investigation material (step S205), and the crystal orientation distribution quantifying means 23 _{converts the} crystal orientation distribution into the crystal orientation distribution parameter P _<uv. Quantify with _{w>, 15} (step S206).

Next, the deformation amount determination means 26 _reads from the calculation database 50 master curve data indicating the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep strain amount (see FIGS. 11, 12, and 13). ) And substituting the crystal orientation distribution parameters P _{<uv w>, 15} of the investigation material quantified by the crystal orientation distribution quantification means 23 into these master curves, and estimating the creep strain amount of the investigation material, The amount of deformation is determined (step S207).

  In the present embodiment, since the master curves are derived for each of the three directions <101>, <111>, and <001>, the master curve having the best correlation with the amount of creep strain is selected on the master curve, Estimate the amount of creep strain of the investigation material. Alternatively, when the degree of correlation is the same for all master curves, the creep strain amount obtained from each master curve is averaged and estimated.

As described above, the deformation evaluation method of the metal material according to the present embodiment quantifies the change in the crystal orientation distribution with the crystal orientation distribution parameter P _{<uv w>, 15} , and this crystal orientation distribution parameter P _{<uv w >, 15} and a master curve showing the correlation between the creep strain amount and a crystal orientation distribution parameter P _{<uv w>, 15} of the investigation material are measured and applied to the master curve. The amount of deformation of the investigation material is estimated. According to this evaluation method, the crystal orientation distribution parameter P _{<uv w>, 15} has a good correlation with the creep strain amount in the range excluding the high strain region, so the deformation amount can be accurately predicted in such a wide range. can do.

In addition, although deformation amount was evaluated using the master curve (refer FIGS. 11-13) which shows the correlation with crystal orientation distribution parameter P _{<uv w>, 15} and a creep strain amount, As shown, it can also be evaluated using GAM values.

FIG. 14 is a diagram showing the correlation between the GAM value and the creep strain amount. The GAM value has a good correlation with the amount of creep strain in the high strain region. On the other hand, the crystal orientation distribution parameter P _{<uv w>, 15} has a good correlation with the amount of creep strain in the range excluding the high strain region as described above. Therefore, by combining the crystal orientation distribution parameter P _{<uv w>, 15} and the GAM value, the deformation amount can be evaluated with high accuracy over a wider range.

Hereinafter, a deformation amount evaluation method using the crystal orientation distribution parameter P _{<uv w>, 15} and the GAM value will be described with reference to FIG. Since the deformation amount evaluation method using the crystal orientation distribution parameter P _{<uv w>, 15} is as described above, it will be described here with some simplifications or some omissions.

  First, a new material, a creep interruption material, and a creep rupture material are prepared as test materials, each test piece is cut out from the evaluation target part, polished and placed on the SEM, and information on the crystal orientation of the entire observation surface is input. Input to the output interface 40.

  Subsequently, the crystal orientation distribution measuring means 21 measures the crystal orientation distribution (step S201). <101>, <111>, <001> are selected as crystal orientations with respect to the stress axis direction.

With respect to these three crystal orientations, the crystal orientation distribution quantifying means 23 quantifies the crystal orientation distribution with the crystal orientation distribution parameter P _{<uv w>, 15} (step S202), and the master curve deriving means 24 uses the crystal orientation distribution parameter P. A master curve (see FIGS. 11 to 13) showing the correlation between _{<uv w>, 15} and the amount of creep strain is derived (step S203). <Uvw> corresponds to <101>, <111>, <001>.

  Subsequently, the GAM value measuring means 22 measures the GAM value of the test piece of the test material, and the master curve deriving means 24 derives a master curve (see FIG. 14) indicating the correlation between the GAM value and the creep strain amount. .

Data indicating the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep strain amount (see FIGS. 11 to 13), and data indicating the correlation between the GAM value and the creep strain amount (see FIG. 14). Is stored in the calculation database 50 (step S204).

  Next, a test piece is cut out from the evaluation target portion of the investigation material, this test piece is embedded in a resin (for example, a conductive SEM observation resin), polished, placed on the SEM, and a crystal on the entire observation surface. The direction information is input to the input / output interface 40.

Subsequently, similarly to the test material, the crystal orientation distribution measuring means 21 measures the crystal orientation distribution (step S205), and the crystal orientation distribution quantifying means 23 _{converts the} crystal orientation distribution to the crystal orientation distribution parameter P _{<uv w>,} Quantify at step ₁₅ (step S206).

  Subsequently, similarly to the test material, the GAM value measuring means 22 measures the GAM value of the investigation material.

Subsequently, the deformation amount determining means 26 receives, from the calculation database 50, master curve data (see FIGS. 11 to 13) indicating the correlation between the crystal orientation distribution parameter P _{<uv w>, 15} and the creep strain amount; Master curve data (see FIG. 14) indicating the correlation between the GAM value and the amount of creep strain is acquired, and the crystal orientation distribution parameter P _<of the investigation material quantified by the crystal orientation distribution quantification means 23 in these master curves. _By substituting _{uv w>, 15} and the GAM value of the investigation material measured by the GAM value measuring means 22, the creep strain amount of the investigation material is determined (step S207). A master curve (FIG. 11) in which the crystal orientation distribution parameter P _{<uv w>, 15} obtained by measuring the investigation material indicates the correlation between the previously prepared crystal orientation distribution parameter P _{<uv w>, 15} and the amount of creep strain. When the correlation with the creep strain amount is located in a region where the correlation is low, the master curve (see FIG. 14) indicating the correlation between the GAM value and the creep strain amount is complemented. Thereby, the deformation amount can be evaluated with high accuracy in a wider range.

  As described above, the remaining life evaluation method of the metal material according to the present invention, the deformation amount evaluation method, the deformation direction of the material is already known, but when the deformation direction of the investigation material is unknown, The deformation direction can be determined using a pole figure as shown in FIG. In this case, in the remaining life evaluation apparatus of FIG. 3 or the deformation amount evaluation apparatus of FIG. 9, a deformation direction determination means is added as a function means to the program database 20 and is used for the determination of the deformation direction. The deformation direction determination means derives the pole figure of FIG. 15 based on the crystal orientation distribution measured by the crystal orientation distribution measurement means 21, and determines the main deformation direction of the investigation material from this pole figure.

  FIG. 15 is a pole figure for {001}, {011} and {111} in the new material and the creep rupture material. Prepare new materials and creep rupture materials made of Hastelloy X (Hastelloy is a registered trademark), cut out test pieces from the evaluation target parts, polish them, place them on the SEM, and enter the crystal orientation information of the entire observation surface. Input to the output interface 40. Based on the crystal orientation information of the entire observation surface acquired from the input / output interface 40, the crystal orientation distribution measuring means 21 measures the crystal orientation distribution, and based on this crystal orientation distribution, the deformation direction determining means is shown in FIG. A pole figure like this is derived. In the creep rupture material of FIG. 15, the strength of {011} is low and the strength of {111} and {001} is high. Such a direction is the RD direction in the pole figure, and this direction can be determined as the main creep deformation direction.

  In FIG. 15, a remarkable distribution is recognized in the pole figure. However, when such a distribution is not recognized and the GAM value is small, it can be estimated that the deformation is small. On the other hand, if no significant distribution is found in the pole figures such as {011}, {111}, and {011} despite the large GAM value, it can be estimated that the deformation is multiaxial. Here, creep deformation has been described as an example, but other than this, the present invention can be similarly applied to plastic deformation (tensile, compression, bending, etc.).

When the deformation direction of the investigation material is unknown, by estimating the deformation direction of the investigation material, the crystal orientation distribution with respect to that direction can be measured _, and derivation of the crystal orientation distribution parameter P _{<uv w>, 15} that is quantified Is possible. Thereby, if the remaining life evaluation method and the deformation amount evaluation method described above are applied, the progress of the material life and the deformation amount can be predicted.

  Next, a method for evaluating the remaining life of a metal material according to another embodiment will be described. In this embodiment, the evaluation accuracy in the above-described embodiment can be further improved. FIG. 16 shows the results of data evaluation on the correlation data between the crystal orientation distribution and creep damage shown in FIG. 3 by extracting relatively large crystal grains and small crystal grains within the measurement field of view. In FIG. 16, when the solid line is a large crystal grain, the dotted line is a small crystal grain. As shown in FIG. 16, the parameter P changes more sensitively to creep damage in the larger crystal grains.

  Therefore, in the above-described embodiment, by extracting only data of crystal grains having a specific size (in this case, only data of crystal grains having a size larger than a predetermined size) and evaluating the data, The evaluation accuracy of the creep remaining life can be improved. As described above, the change in crystal orientation distribution is thought to be due to the activity of a specific slip system based on the Schmitt factor, but the deformation of each crystal grain is constrained by the shape of the entire specimen (depending on the adjacent grains). The ideal slip system determined by the Schmid factor is not necessarily active. By the way, as a result of research conducted by the inventors, it has been found that a relatively large crystal grain is more likely to be deformed in an ideal slip system determined from a Schmid factor. Therefore, in this case, it is desirable to extract data of large crystal grains and evaluate the data.

  Although FIG. 16 shows an example of <101>, for <001> and <111>, the result is that the parameter P changes more sensitively to creep damage in the same way for larger crystal grains. Similarly, in the correlation with the creep strain, the parameter P of the larger crystal grain changed more sensitively to the creep strain. Therefore, even when the deformation amount is evaluated from the creep strain amount, the evaluation accuracy can be improved by extracting and evaluating only the data of crystal grains having a specific size.

  Further, as described above, even when the remaining life evaluation of the metal material and the deformation amount evaluation of the metal material are performed from the GAM value, the evaluation accuracy can be improved as follows.

  FIG. 17 shows the results of data evaluation on the correlation data between the GAM value and the creep life consumption rate shown in FIG. 8 by extracting relatively large crystal grains and small crystal grains within the measurement field of view. In FIG. 17, when the solid line is a small crystal grain, the dotted line is a large crystal grain. As shown in FIG. 16, in this example, the smaller crystal grains generally showed larger GAM values than the larger crystal grains. As described above, the GAM value has a relatively small absolute value and is easily affected by measurement errors. Therefore, if only the crystal grains of a specific size that increases the GAM value are extracted and the data is evaluated, the influence of the error is relatively reduced as the absolute value of the GAM increases, and the evaluation accuracy can be improved. it can. The GAM value is an index indicating the degree of a small misorientation within a grain, and the misorientation within a grain is considered to be caused by an increase in lattice defects such as dislocations. By the way, the vicinity of the grain boundary is not only a source of dislocations but also a region where dislocations are likely to accumulate. Therefore, it is considered that the GAM value is increased because the ratio of the area near the grain boundary to the crystal grain area is higher in the smaller crystal grains. That is, in this case, it is desirable to extract data of small crystal grains and evaluate the data.

  FIG. 17 shows the evaluation of the remaining creep life, but in the evaluation of the creep strain, the smaller the grain size, the larger the GAM value becomes and the influence of the error can be reduced. Even when evaluating the amount of deformation of a material, only data for crystal grains of a specific size (in this case, only data for small crystal grains having a size smaller than a predetermined size) should be extracted and evaluated. Thus, the evaluation accuracy of the deformation amount evaluation of the metal material can be improved.

Next, still another embodiment will be described. In this embodiment, the deformation direction is estimated using line analysis of the intragranular orientation difference. As schematically shown in FIG. 18, at the measurement points arranged in a straight line (indicated by black circles in the figure), the average of the orientation differences between all two adjacent points in each crystal grain is M. Define as _line . The inventors define each θ formed by the M _line and the deformation direction in the creep interruption test material of Hastelloy X (Hastelloy is a registered trademark) as shown in FIG. 19, and the relationship between M _line and θ in the creep damaged material. As a result, the relationship as shown in FIG. 20 was found.

An example of a method for estimating the main creep deformation direction is shown below using the relationship shown in FIG. A test piece is cut out from an evaluation target part of an evaluation target device part made of Hastelloy X (Hastelloy is a registered trademark), and M _line is evaluated by EBSP. At this time, care must be taken not to lose sight of the relationship between the direction in the SEM of the EBSP sample and the direction in the device part to be evaluated before the sample is cut out. In this sample, M _line is evaluated in a plurality of directions, and if the direction in which M _line is the highest is found, that is, it is the main creep deformation direction in the observation plane. In this way, since the deformation direction can be estimated, when the deformation direction of the investigation material is unknown in the above-described remaining life evaluation method and deformation amount evaluation of the metal material, the investigation is performed by adding the above steps. It is possible to know the deformation direction of the material.

  Next, another embodiment will be described. FIG. 8 shows the results of data evaluation by extracting crystal grains having crystal orientations near <101>, <001>, and <111> with respect to the stress axis for the correlation data between GAM and creep life consumption rate shown in FIG. Is shown in FIG. In the example shown in FIG. 21, the GAM value obtained by extracting and evaluating the crystal grains in the vicinity of <101> and <111> is smaller than that in the vicinity of <001>. It shows a good correlation with the lifetime consumption rate. That is, in this case, by evaluating the data by extracting crystal grains in the vicinity of <101> and <111>, it is possible to evaluate the remaining creep life in a wider range of lifetime consumption rate.

  Note that FIG. 21 shows the creep remaining life evaluation. Similarly, in the evaluation of the creep strain, the GAM value and creep strain of the crystal grains in the vicinity of <101> and <111> are similar to those in the vicinity of <001>. Since the correlation is made in a wider range, as described above, when evaluating the deformation amount of the metal material from the GAM value, only the data of the crystal grains having a specific crystal orientation is extracted and the data is evaluated. This makes it possible to evaluate the deformation amount of the metal material in a wider range.

  By the way, in the evaluation of the crystal orientation distribution in each of the embodiments described above, the case where the evaluation is performed using the EBSP method has been described. Although this EBSP method requires only a small amount, it is necessary to collect a sample from equipment parts. On the other hand, if the evaluation of the crystal orientation distribution is performed by the X-ray diffraction method, the crystal orientation distribution can be measured nondestructively, and each of the above-described embodiments can be performed nondestructively.

  In each of the remaining life evaluation method and the deformation amount evaluation method described above, the face-centered cubic structure polycrystalline metal material (Hastelloy X) has been described. However, these evaluations also apply to the body-centered cubic structure and the hexagonal close-packed structure. The method can be applied. Further, for example, a single crystal material, a unidirectionally solidified alloy material, and a material in a multiaxial stress field such as internal pressure creep can be similarly applied as long as the crystal orientation distribution changes.

The reverse pole figure seen from the stress axis direction in a new material, a creep interruption material, and a creep rupture material. The graph which shows the relationship between crystal orientation distribution parameter P _{<1 0 1>, x} and creep lifetime consumption rate. The functional block diagram which shows the main structures of the remaining life evaluation apparatus of the metal material which concerns on one Embodiment of this invention. The flowchart for demonstrating an example of the remaining life evaluation method which concerns on one Embodiment of this invention. The graph which shows the relationship between crystal orientation distribution parameter P _{<1 0 1>, 15} and creep life consumption rate. The graph which shows the relationship between crystal orientation distribution parameter P _{<1 1 1>, 15} and creep life consumption rate. The graph which shows the relationship between crystal orientation distribution parameter P _{<0 0 1>, 15} and creep life consumption rate. The graph which shows the relationship between a GAM value and a creep life consumption rate. The functional block diagram which shows the main structures of the deformation evaluation apparatus of the metal material which concerns on one Embodiment of this invention. The flowchart for demonstrating an example of the deformation amount evaluation method which concerns on one Embodiment of this invention. The graph which shows the relationship between crystal orientation distribution parameter P _{<1 0 1>, 15} and the amount of creep strain. The graph which shows the relationship between crystal orientation distribution parameter P _{<1 1 1>, 15} and the amount of creep strain. The graph which shows the relationship between crystal orientation distribution parameter P _{<0 0 1>, 15} and the amount of creep strain. The graph which shows the relationship between a GAM value and the amount of creep strain. The pole figure in a new material and a creep rupture material. The graph which shows the influence of the crystal grain size in the correlation with the creep life consumption rate of crystal orientation distribution parameter P _{<1 0 1>, 15} . The graph which shows the influence of the crystal grain diameter in the correlation with the creep life consumption rate of a GAM value. The schematic diagram for _{demonstrating} the evaluation method of the line analysis parameter _Mline of the crystal orientation difference in a grain. The schematic diagram for demonstrating the definition of angle (theta) made by the evaluation direction of M _line , and a creep test stress axis. The graph which shows the correlation of M _line and (theta) in a creep damage material. The graph which shows the influence of the crystal orientation in the correlation with the creep life consumption rate of a GAM value.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Remaining life evaluation apparatus, 21 ... Crystal orientation distribution measurement means, 22 ... GAM value measurement means, 23 ... Crystal orientation distribution quantification means, 24 ... Master curve derivation means, 25 ... Remaining life determination means , 26... Deformation amount determination means, 100... Deformation amount evaluation device.

Claims (30)

The crystal orientation distribution measuring means measures the crystal orientation distribution with respect to the progress of material life of the test material, and the crystal orientation distribution quantifying means quantifies the measured crystal orientation distribution, and the quantified crystal orientation distribution and material life A storage step in which the master curve deriving means derives a first master curve representing the relationship with the degree of progress of the data and stores it in the database;
Measurement in which the crystal orientation distribution measuring means measures the crystal orientation distribution of the investigation material that is made of the same material as the test material and performs the remaining life evaluation, and the crystal orientation distribution quantifying means quantifies the measured crystal orientation distribution Steps,
The data of the first master curve stored in the storing step is read from the database by the remaining life determining means, and the crystal orientation distribution of the investigation material quantified in the measuring step is applied to the read first master curve. A determination step for determining the remaining life of the investigation material;
The remaining life evaluation method of the metal material characterized by comprising.   The method for evaluating the remaining life of a metal material according to claim 1, wherein the crystal orientation distribution measuring means comprises an EBSP (Electron Back-Scatter Diffraction Pattern) method.   The crystal orientation distribution quantifying means quantifies the crystal orientation distribution from the ratio of the number of measurement points where the angle between the stress axis and the predetermined crystal orientation is within a predetermined range with respect to the number of all measurement points. The method for evaluating the remaining life of a metal material according to claim 1 or 2.   4. The remaining life evaluation method for a metal material according to claim 1, wherein a GAM value measured by a GAM (Grain Average Misorientation) value measuring means is used instead of the crystal orientation distribution. . After the storing step, the GAM value measuring means measures the GAM value with respect to the progress of the material life of the test material, and the second master curve representing the relationship between the GAM value and the progress of the material life is the master curve. Further comprising the step of the derivation means deriving and storing in the database;
After the measuring step, the GAM value measuring means further includes a step of measuring the GAM value of the investigation material,
In the determination step, the data of the second master curve is read from the database by the life determination means, and the measured GAM value of the survey material is applied to the read second master curve, so that the surplus of the survey material is obtained. The remaining life evaluation method for a metal material according to any one of claims 1 to 3, further comprising determining a life. The crystal orientation distribution measurement means measures the crystal orientation distribution with respect to the deformation amount of the test material, and the crystal orientation distribution quantification means quantifies the measured crystal orientation distribution, and the quantified crystal orientation distribution and the deformation amount of the test material A storage step in which the master curve deriving means derives a first master curve representing the relationship with the data and stores it in the database;
A measurement step in which the crystal orientation distribution measuring means measures the crystal orientation distribution of the investigation material for which the deformation amount evaluation is made of the same material as the test material, and the crystal orientation distribution quantifying means quantifies the measured crystal orientation distribution. When,
The first master curve data stored in the storing step is read from the database by the deformation amount determining means, and the crystal orientation distribution of the investigation material quantified in the measuring step is applied to the read first master curve. A determination step of determining a deformation amount of the investigation material;
A method for evaluating a deformation amount of a metal material, comprising:   The method for evaluating a deformation amount of a metal material according to claim 6, wherein the crystal orientation distribution measuring means includes an EBSP (Electron Back-Scatter Diffraction Pattern) method.   The crystal orientation distribution quantifying means quantifies the crystal orientation distribution from the ratio of the number of measurement points where the angle between the stress axis and the predetermined crystal orientation is within a predetermined range with respect to the number of all measurement points. The method for evaluating a deformation amount of a metal material according to claim 6 or 7.   9. The deformation amount evaluation method for a metal material according to claim 6, wherein a GAM value measured by a GAM (Grain Average Misorientation) value measuring means is used instead of the crystal orientation distribution. . After the storing step, the GAM value measuring means measures the GAM value with respect to the deformation amount of the test material, and the master curve deriving means derives a second master curve representing the relationship between the GAM value and the test material. Further comprising storing in a database;
After the measuring step, the GAM value measuring means further includes a step of measuring the GAM value of the investigation material,
In the determination step, the deformation amount determination means reads the data of the second master curve from the database, applies the measured GAM value of the survey material to the read second master curve, and The method for evaluating a deformation amount of a metal material according to claim 6, further comprising determining a deformation amount.   The crystal orientation distribution measuring means measures the crystal orientation distribution with respect to the progress of the material life of the test material, and further creates a pole figure regarding the measured crystal orientation, and the main deformation direction based on the created pole figure 3. The method for evaluating a remaining life of a metal material according to claim 2, further comprising a deformation direction determining means for determining   The crystal orientation distribution measuring means measures the crystal orientation distribution with respect to the progress of the material life of the test material, and further creates a pole figure regarding the measured crystal orientation, and the main deformation direction based on the created pole figure 8. The method for evaluating a deformation amount of a metal material according to claim 7, further comprising a deformation direction determining means for determining When measuring the crystal orientation distribution by the crystal orientation distribution measuring means, and quantifying the measured crystal orientation distribution by the crystal orientation distribution quantifying means,
The remainder of the metal material according to any one of claims 1, 2, 3, and 5, wherein only data of crystal orientation distribution of crystal grains having a specific size in a measurement visual field is extracted. Life evaluation method.   14. The method for evaluating a remaining life of a metal material according to claim 13, wherein the crystal grains having the specific size are crystal grains having a size within a measurement field of view of a predetermined size or more.   6. The remaining life of a metal material according to claim 4, wherein in the measurement of the GAM value by the GAM value measuring means, only the data of crystal grains having a specific size in the measurement visual field is extracted. Evaluation methods.   The method for evaluating the remaining life of a metal material according to claim 15, wherein the crystal grains having the specific size are crystal grains having a size within a measurement field of view of a predetermined size or less.   6. The method for evaluating the remaining life of a metal material according to claim 4 or 5, wherein in the measurement of the GAM value by the GAM value measuring means, only data of crystal grains having a specific orientation is extracted.   18. The method for evaluating the remaining life of a metal material according to claim 17, wherein the crystal grains having the specific orientation are crystal grains having an orientation in the vicinity of <101> with respect to a main deformation direction.   18. The method for evaluating the remaining life of a metal material according to claim 17, wherein the crystal grains having the specific orientation are crystal grains having an orientation in the vicinity of <111> with respect to a main deformation direction. When measuring the crystal orientation distribution by the crystal orientation distribution measuring means, and quantifying the measured crystal orientation distribution by the crystal orientation distribution quantifying means,
The deformation of the metal material according to any one of claims 6 to 8, 10 and 12, wherein only data of crystal orientation distribution of crystal grains having a specific size in a measurement visual field is extracted. Quantity evaluation method.   21. The method for evaluating a deformation amount of a metal material according to claim 20, wherein the crystal grain having the specific size is a crystal grain having a size within a measurement field of view of a predetermined size or more.   The deformation amount of the metal material according to claim 9 or 10, wherein in the measurement of the GAM value by the GAM value measuring means, only the data of the crystal grains having a specific size in the measurement visual field is extracted. Evaluation methods.   23. The method for evaluating a deformation amount of a metal material according to claim 22, wherein the crystal grains having a specific size are crystal grains having a size within a measurement field of view of a predetermined size or less.   11. The deformation evaluation method for a metal material according to claim 9, wherein in the measurement of the GAM value by the GAM value measuring means, only data of crystal grains having a specific orientation is extracted.   25. The method for evaluating a deformation amount of a metal material according to claim 24, wherein the crystal grains having the specific orientation are crystal grains having an orientation in the vicinity of <101> with respect to a main deformation direction.   The method for evaluating a deformation amount of a metal material according to claim 24, wherein the crystal grains having the specific orientation are crystal grains having an orientation in the vicinity of <111> with respect to a main deformation direction. M _line which is a value obtained by averaging the orientation difference between two adjacent measurement points among a plurality of measurement points arranged in a straight line in each crystal grain of the test material made of a deformed metal material, and the test material Obtaining in advance correlation data representing the correlation between the deformation direction and the angle between the direction of the plurality of measurement points arranged in a straight line; and
Measuring the M _line of the investigation material made of the same material as the test material a plurality of times while changing the direction of the plurality of measurement points arranged in a straight _line ;
The method further comprises a step of applying a measurement result of the M _line of the investigation material to the correlation data and evaluating a deformation direction of the investigation material. The remaining life evaluation method of the metal material as described in the item. 28. The remaining life evaluation method for a metal material according to claim 27, wherein an EBSP method is used to measure the M _line . M _line which is a value obtained by averaging the orientation difference between two adjacent measurement points among a plurality of measurement points arranged in a straight line in each crystal grain of a test material made of a deformed metal material, Obtaining in advance correlation data representing the correlation between the deformation direction and the angle between the direction of the plurality of measurement points arranged in a straight line; and
Measuring the M _line of the investigation material made of the same material as the test material a plurality of times while changing the direction of the plurality of measurement points arranged in a straight _line ;
27. The method further comprises a step of applying a measurement result of the M _line of the investigation material to the correlation data and evaluating a deformation direction of the investigation material. The deformation | transformation amount evaluation method of the metal material as described in a term. 30. The method for evaluating a deformation amount of a metal material according to claim 29, wherein an EBSP method is used for measuring the M _line .

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