JP2009092581A - Wiring board for electronic component inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board used for an electronic component inspection device and excelling in electric characteristics, arrangement accuracy of connecting conductors and production facility. <P>SOLUTION: The wiring board 1 for the electronic component inspection device includes a plurality of insulating layers s1-s9 laminated along a thickness direction; a signal wiring layers S arranged between the plurality of insulating layers s3, s4; a plurality of power supply wiring layers P1, P2 electrically conductive to each other; and the connecting conductors v linearly arranged along the thickness direction between a pair of power supply wiring layers P1, P2 in vertical layers closest to the signal wiring layers S to connect the plurality of power supply wiring layers P1, P2 to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is used in an electronic component inspection apparatus such as a probe card, and particularly relates to a wiring board for an electronic component inspection apparatus having excellent electrical characteristics, internal conductor placement accuracy, and ease of manufacture.

In order to suppress power supply noise and cost, a signal layer is arranged between a power supply layer and a grant layer between a plurality of insulating layers, and a wiring region that becomes a ground potential and a wiring that becomes a power supply potential in the region of the signal layer A printed wiring board having at least one of the regions has been proposed (for example, see Patent Document 1).
Japanese Unexamined Patent Publication No. 2007-115772 (pages 1 to 20, FIGS. 1 to 3)

By the way, when it arrange | positions in order of a power supply layer, a signal layer, and a grant layer along the thickness direction like the printed wiring board of the said patent document 1, for example, the power supply via conductor connected with a power supply layer is likely to interfere. In order to avoid the signal layer, a method of moving the position of the power supply via conductor in the plane direction is adopted. At this time, when the power supply layer is one layer and is disposed only in either the upper layer or the lower layer of the signal layer, the following measures have to be taken.
For example, (1) interference with the signal layer can be avoided by providing a plurality of connection wirings between the power supply via conductors located in the upper and lower layers and shifting the positions of some of the power supply via conductors.
(2) The position of the power supply via conductor to be connected to the power supply pad formed on one surface of the printed wiring board is shifted from the center side of the pad to the peripheral side.
However, when the position of the power supply via conductor is shifted along the plane direction of the wiring board as in the measure (1), electrical characteristics such as inductance in the circuit of the power supply via conductor and the power supply layer conducted to the power supply via conductor are reduced. May decrease.

Further, when the position where the power supply via conductor is connected is shifted from the center side of the power supply pad to the peripheral side as in the measure (2), the via conductor is likely to be detached from the pad in the pad forming process. Therefore, there is a possibility that conduction between the two becomes unstable.
In particular, it is used in an electronic component inspection apparatus such as a probe card for inspecting electrical characteristics of individual electronic components by electrically connecting a probe attached to a pad on the surface side to an electrode for each of the plurality of electronic components. In the wiring board, there is a high possibility that the reliability of the inspection accuracy is impaired due to the deterioration of the electrical characteristics as described above.
In addition, if the conductive path of the via conductor is shifted by the wiring or if the via conductor is connected to the peripheral side of the pad, it is necessary to form a remarkably complicated internal wiring when designing and manufacturing the target wiring board. Since it cannot be obtained, there is a problem that a long time, a complicated process, and a large number of man-hours are required, resulting in an increase in cost.

  The present invention solves each of the problems described in the background art and provides a wiring board for an electronic component inspection device that is used in an electronic component inspection device and has excellent electrical characteristics, connection conductor placement accuracy, and ease of manufacture. Do that.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention provides a plurality of power supply wiring layers that are electrically connected to each other, arranges a signal wiring layer so as to face each other, and a pair of upper and lower power supply wiring layers closest to the signal wiring layer. The connection is established by connecting conductors arranged linearly along the thickness direction.
That is, a wiring board for an electronic component inspection apparatus according to the present invention (Claim 1) includes a plurality of insulating layers laminated along a thickness direction, a signal wiring layer disposed between the plurality of insulating layers, A plurality of power supply wiring layers arranged through a plurality of insulating layers and opposite to the signal wiring layer and electrically connected to each other, and a pair of power supply wiring layers of upper and lower layers closest to the signal wiring layer And a connection conductor that is arranged linearly along the thickness direction and connects the plurality of power supply wiring layers to each other.

According to this, in the thickness direction of the plurality of insulating layers, a plurality of power supply wiring layers are arranged on the upper and lower layers of the signal wiring layer, and among these, a pair of upper and lower power supply wiring layers closest to the signal wiring layer Connection conductors that connect the gaps linearly along the thickness direction are arranged. For this reason, the plurality of power supply wiring layers, connection conductors connecting them, pads formed on the surface of the uppermost insulating layer conducted through the connection conductors, and formed on the back surface of the lowermost insulating layer Therefore, the power supply circuit extending over the external terminals can be shortened as much as possible. Further, among the plurality of power supply wiring layers, the connection position of the connection conductor that connects between the lowermost power supply wiring layer and the external terminal formed on the back surface of the lowermost insulating layer is determined according to the required external terminal. The position can be easily set. In addition, since the connection conductor is linearly arranged between the pair of upper and lower power supply wiring layers, in the circuit design of the present wiring board, the degree of freedom when arranging a plurality of connection conductors is increased, In addition to the accuracy and speed of such a design, the manufacturing process can be facilitated.
Accordingly, it is possible to provide a wiring board for an electronic component inspection apparatus which is excellent in the arrangement accuracy of connection conductors and the ease of manufacture without deteriorating electrical characteristics such as inductance of the power supply circuit and the signal circuit adjacent thereto. Can do.

The connection conductor includes a through-hole conductor having a substantially cylindrical shape and a via conductor having a generally cylindrical shape along a through-hole penetrating the insulating layer.
The signal wiring layer is arranged between the insulating layers in an arbitrary pattern.
Further, in the signal wiring layer, through holes having a larger inner diameter than the outer diameter of each connection conductor are formed in advance in order to allow a plurality of linear connection conductors to penetrate while securing insulation at an arbitrary position. Yes.

The present invention also includes an electronic component inspection device wiring board (Claim 2) in which the plurality of power supply wiring layers are formed in a planar shape between the plurality of insulating layers.
According to this, the plurality of power supply wiring layers occupy most of the area between the insulating layers in a plan view between the plurality of insulating layers and have a substantially rectangular shape, which is generally called a solid shape. Is formed. Therefore, it is easy to arrange the connection conductors connecting the pair of upper and lower power supply wiring layers that are closest to the signal wiring layer in a straight line along the thickness direction.

Furthermore, in the present invention, an external terminal is formed on the back surface of the lowermost insulating layer among the plurality of insulating layers, and a connection conductor that is electrically connected to the lowermost power supply wiring layer is connected to the central portion. In addition, a wiring board for an electronic component inspection apparatus (claim 3) is also included.
According to this, the connection conductor that is electrically connected to the lowermost power supply wiring layer is connected to the substantially central portion of the external terminal formed on the back surface of the lowermost insulating layer. For this reason, since the electrical connection between the wiring board and the external circuit board can be reliably obtained, it is possible to accurately and surely supply power supply current and output inspection information.
Examples of the external terminal include a land grid array (LGA) pad, a pin grid array (PGA) pad, and a ball grid array (BGA) pad.

Further, in the present invention, a plurality of power supply wiring layers that are not electrically connected to the plurality of power supply wiring layers are arranged to face the plurality of power supply wiring layers via an insulating layer different from the insulating layer. Also included is an electronic component inspection device wiring board (claim 4).
According to this, the plurality of power supply wiring layers that are not electrically connected to the plurality of power supply wiring layers and form another power supply circuit pass through the insulating layer different from the insulating layer, and the plurality of power supply wiring layers. It is arranged to face the wiring layer. For this reason, a plurality of power supply wiring layers, which are a plurality of sets that do not conduct each other, that form a plurality of power supply circuits are arranged, for example, currents of different voltages depending on the electrical characteristics of the electronic component to be inspected, etc. It is possible to perform an electrically complicated and precise action such as feeding power in parallel.
In addition to the form in which the signal wiring layer and the ground wiring layer are arranged for each set, the plurality of power supply wiring layers as a plurality of sets may share the ground wiring layer for each set, for example.

Furthermore, in the present invention, the signal wiring layer is disposed between the plurality of ground wiring layers disposed between the plurality of insulating layers on the upper layer side and the lower layer side thereof, and the plurality of ground wirings. The layer also includes an electronic component inspection device wiring board (Claim 5) disposed between the power wiring layer and the signal wiring layer.
According to this, the signal wiring layer is disposed between a plurality of ground wiring layers disposed on the upper layer side and the lower layer side, and any ground wiring layer is disposed between the power supply wiring layer and the signal wiring layer. Has been. Therefore, the impedance value of the signal wiring layer can be easily controlled by adjusting the wiring width of the signal wiring layer and the thickness of the insulating layer positioned between the adjacent ground wiring layers. Furthermore, since the signal wiring layer can be reliably protected from, for example, current leaked from the power supply circuit or magnetic field by the upper and lower ground wiring layers, signal processing and transmission can be accurately performed.
Similarly to the power supply wiring layer, the ground wiring layer is also arranged in a planar shape between the plurality of insulating layers and penetrates the connection conductor while ensuring insulation at an arbitrary position. A through hole having an inner diameter larger than the outer diameter is formed in advance.

Further, according to the present invention, a plurality of pads individually connected to the power supply wiring layer, the signal wiring layer, and the ground wiring layer are formed on the surface of the uppermost insulating layer among the plurality of insulating layers. Also included is an electronic component inspection device wiring board on which the probe is attached on the pad.
According to this, since the probe is attached to each pad on the surface side, for example, it is possible to ensure electrical connection with electrodes for each of a large number of electronic components formed on the Si wafer, and accurate and reliable inspection is possible. It becomes possible.
In addition, the present invention includes an electronic component inspection device wiring board (claim 7) in which the plurality of insulating layers are made of at least one of ceramic and resin.
According to this, it is possible to reliably insulate the power supply wiring layer, the signal wiring layer, and the ground wiring layer, and to inspect the electronic component reliably.

The ceramic includes a high-temperature fired ceramic such as alumina, and a low-temperature fired ceramic containing about 50 wt% of a glass component. In the case of a high-temperature fired ceramic, W or Mo is used as a conductor such as each wiring layer or connection conductor. In the case of a low-temperature fired ceramic, Ag, Cu, or the like is used.
The ceramic may be made of any of machinable ceramic, AlN, or mullite, and the machinable ceramic is a mixture of SiO ₂ and Al ₂ O ₃ , or a mixture of AlN and BN. The thermal expansion coefficient of the Si wafer having a thermal expansion coefficient of approximately 3.0 × 10 ⁻⁶ / ° C. is approximately similar.
In addition to the epoxy resin, heat-resistant polyimide that can withstand heat during probing for attaching the probe to the surface-side pad is used as the resin.
In addition, the core substrate may be made of the ceramic, and a plurality of resin layers, power supply wiring layers, and the like may be laminated on both surfaces thereof.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a cross-sectional view showing an outline of a wiring board for an electronic component inspection apparatus (hereinafter simply referred to as an inspection apparatus wiring board) 1 according to an embodiment of the present invention.
As shown in FIG. 1, the inspection apparatus wiring board 1 is composed of a plurality of ceramic layers (insulating layers) s <b> 1 to s <b> 9 stacked in the thickness direction which is the vertical direction in FIG. A substrate body 2 is provided. Between the ceramic layers s3 and s4 of the substrate body 2, a signal wiring layer S having a predetermined pattern is disposed.
A pair (a plurality) of ground wiring layers G1 and G2 are opposed to the signal wiring layer S between the upper ceramic layers s2 and s3 and between the lower ceramic layers s4 and s5. And disposed via ceramic layers s3 and s4.
Further, a pair (a plurality) of power supply wirings are opposed to the signal wiring layer S and the ground wiring layers G1 and G2 in a plan view, between the upper ceramic layers s1 and s2 and between the lower ceramic layers s5 and s6. The layers P1 and P2 are arranged via the ceramic layers s2 and s5.

The ceramic layers s1 to s9 are made of a high-temperature fired ceramic such as alumina, or a low-temperature fired ceramic containing about 40 to 60 wt% of a glass component.
The power supply wiring layers P1 and P2 and the ground wiring layers G1 and G2 are between the ceramic layers s1 to s3 and between the ceramic layers s4 to s6 and between the ceramic layers s1 to s3 and s4 to s6 in the plan view. Is formed in a planar shape (so-called solid shape) such as a rectangle (square or rectangle).
As shown in FIG. 1, a plurality of via conductors (connection conductors) v for connecting them in a straight line are arranged along the thickness direction between the pair of upper and lower power supply wiring layers P1 and P2. The via conductor v penetrates the signal wiring layer S, the ground wiring layers G1 and G2, and the ceramic layers s2 to s5 located between the power supply wiring layers P1 and P2. At this time, the via conductor v penetrates between the patterns of the signal wiring layer S and the inside of the through holes h provided in the ground wiring layers G1 and G2, thereby preventing a short circuit therebetween.

As shown in FIG. 1, the ceramic layers s6 to s9 include any one of the signal wiring layer S, the lower power wiring layer P2, and the lower ground wiring layer G2, and the back surface 4 of the lowermost ceramic layer s9. A plurality of via conductors (connection conductors) V that are connected to the plurality of external terminals (for example, LGA pads) 6 in a straight line are disposed. The lower end of the via conductor V is connected to the substantially central portion of the external terminal 6.
Further, a plurality of pads 5 are formed on the surface 3 of the uppermost ceramic layer s. The pads 5 are formed of the upper power wiring layer P1, the upper ground wiring layer G1, and the signal wiring layer S. Any one of them is electrically connected via via conductors v1, 7, and 8.
Further, as shown in FIG. 1, the pair of upper and lower ground wiring layers G <b> 1 and G <b> 2 are also electrically connected via the via conductor 7. The via conductor 7 penetrates the inside of the through hole h provided in the power supply wiring layers P1 and P2 and between the patterns of the signal wiring layer S, thereby preventing a short circuit therebetween. In addition, the via conductor 8 connected to the signal wiring layer S penetrates through the through holes h provided in the power supply wiring layers P1 and P2 and the ground wiring layers G1 and G2, thereby preventing a short circuit therewith. It is out.

As shown in FIG. 1, probes 9 are individually attached to a plurality of pads 5 formed on the surface 3 of the substrate body 2. By electrically connecting the tip side of the probe 9 to, for example, an electrode for each of a plurality of electronic components formed on a Si wafer (not shown), it is possible to accurately detect the electrical characteristics of each electronic component. .
When the ceramic layers s1 to s9 are high-temperature fired ceramics such as alumina, the power wiring layers P1 and P2, the signal wiring layer S, and the conductors such as the via conductors v and V are formed of W or Mo. When the layers s1 to s9 are low-temperature fired ceramics such as glass-ceramics, the conductor is made of Ag or Cu.
Further, in the substrate body 2 of the wiring board 1 for the inspection apparatus, the upper portions of the ceramic layers s1 to s5 where the power wiring layers P1 and P2, the signal wiring layer S, and the ground wiring layers G1 and G2 are arranged are so-called wirings. The lower part of the ceramic layers s6 to s9 through which only the via conductor V passes is an area for adjusting the thickness of the substrate body 2.

According to the wiring board 1 for an inspection apparatus as described above, a pair (plurality) of power wiring layers P1 and P2 are arranged on the upper and lower layers of the signal wiring layer S in the thickness direction of the insulating layers s1 to s9. Via conductors (connection conductors) v that connect the wiring layers P1 and P2 linearly along the thickness direction are arranged. For this reason, the power supply wiring layers P1, P2, the via conductor v connecting between them, the pad 5 formed on the surface 3 of the uppermost insulating layer s1 conducting through the via conductors V, v1, and the lowermost layer The power supply circuit over the external terminals 6 formed on the back surface 4 of the insulating layer s9 can be made as short as possible. Further, the connection position of the via conductor (connection conductor) V connecting the lower power supply wiring layer P2 and the external terminal 6 formed on the back surface 4 of the lowermost insulating layer s9 is set to the external terminal 6 It can be easily set at the center.
In addition, since the via conductors v are linearly arranged between the pair of upper and lower power supply wiring layers P1 and P2, in the circuit design of the wiring board 1, freedom for arranging a plurality of via conductors v is provided. The degree of accuracy is increased, and the manufacturing process can be facilitated based on the accuracy and speed of the design.

Further, the signal wiring layer S is disposed between a pair of upper and lower ground wiring layers G1, G2, and the ground wiring layers G1, G2 are disposed between the signal wiring layer S and the power wiring layers P1, P2. Therefore, by adjusting the wiring width of the signal wiring layer S and the thicknesses of the adjacent insulating layers s3 and s4, the impedance value of the signal wiring layer S can be easily controlled. In addition, the signal wiring layer S can be reliably protected from, for example, a current leaked from the power supply circuit or a magnetic field by the upper and lower ground wiring layers G1 and G2, so that signal processing and transmission can be performed accurately. For this reason, it is possible to accurately and reliably detect the electrical characteristics of the electronic component having the electrode to which the probe 9 is electrically connected, and to output it to the external circuit board (not shown) or the like via the external terminal 6.
Therefore, the wiring board 1 for an inspection apparatus excellent in the placement accuracy of the via conductors v, v1, and V and in the ease of manufacturing without deteriorating the electrical characteristics such as the inductance of the power supply circuit and the signal circuit adjacent thereto. It can be.

The inspection apparatus wiring board 1 was manufactured as follows.
A ceramic slurry is prepared in advance by mixing and mixing required amounts of alumina powder, required organic binder, and solvent, and a plurality of green sheets (not shown) exhibiting a sheet shape by the doctor blade method. Molded into.
Next, through holes were punched by punching at predetermined positions in the plurality of green sheets. At this time, since the via conductors v to be arranged between the power wiring layers P1 and P2 to be formed later are linear along the thickness direction of the plurality of green sheets, the position of the through hole can be easily and easily set in the design stage. It can be set accurately.
Next, each through hole of each green sheet was filled with a conductive paste containing W powder or Mo powder to form unfired via conductors v, v1, V, 7, and 8.

Further, a conductive paste is screen-printed on the surface of the green sheet to be the ceramic layers s1 to s6 and the back surface of the green sheet to be the lowermost ceramic layer s9. Signal wiring layer S, planar power supply wiring layers P1, P2, ground wiring layers G1, G2, pads 5, and external terminals 6 were individually formed.
And after laminating | stacking and crimping | bonding the above several green sheets along the thickness direction, it baked in the predetermined | prescribed temperature range.

As a result, as shown in FIG. 1, a plurality of ceramic layers s1 to s9 are integrally laminated to form a substrate body 2 having front and back surfaces 3 and 4, and any one of the ceramic layers s1 to s9. The signal wiring layer S, the power supply wiring layers P1 and P2, the ground wiring layers G1 and G2, the pad 5 on the front surface 3 side, the external terminal 6 on the back surface 4 side, and these are connected to each other. A wiring board 1 for an inspection apparatus having via conductors (connection conductors) v, v1, V, 7, and 8 could be obtained.
According to the method for manufacturing the inspection apparatus wiring board 1 as described above, the via conductors v to be arranged between the power supply wiring layers P1 and P2 are formed in a straight line on the green sheets to be the ceramic layers s2 to s5 later. Since the circuit design is facilitated and the degree of freedom is increased, an accurate and quick circuit design can be performed, and accordingly, the entire manufacturing process can be performed in a short time. Therefore, it is possible to contribute to improving the efficiency of circuit design and manufacturing process.

FIG. 2 is a cross-sectional view showing a main part of an inspection apparatus wiring board 1a, which is an applied form of the inspection apparatus wiring board 1. As shown in FIG.
As shown in FIG. 2, the inspection apparatus wiring board 1 a includes a plurality of ceramic layers (insulating layers) s <b> 1 to s <b> 13 stacked in the thickness direction and has a front surface 3 and a back surface 4. 2a. Between the ceramic layers s4 and s5 of the substrate body 2a, a signal wiring layer S similar to the above is disposed.
A pair (a plurality) of ground wiring layers G1 and G2 are opposed to the signal wiring layer S between the upper ceramic layers s3 and s4 and between the lower ceramic layers s5 and s6. In addition, they are arranged via ceramic layers s4 and s5.
Further, two pairs of upper and lower layers (a plurality) between the upper layer ceramic layers s1 to s3 and the lower layer ceramic layers s6 to s8 while facing the signal wiring layer S and the ground wiring layers G1 and G2 in plan view. Power supply wiring layers P1 to P4 are arranged via ceramic layers s3 to s6 and the like. The signal wiring layer S, the ground wiring layers G1 and G2, and the power supply wiring layers P1 to P4 are made of the same material as described above.

As shown in FIG. 2, the wiring board 1a for the inspection apparatus includes a pair of power wiring layers P1, P3 on the upper layer side and a pair of power wiring layers P2, P4 on the lower layer side. This is different from the wiring board 1.
As shown in FIG. 2, a plurality of via conductors (connection conductors) v for connecting them in a straight line along the thickness direction of the upper and lower power supply wiring layers P1 and P2 closest to the signal wiring layer S are the same as described above. Is arranged. The upper power supply wiring layers P1 and P3 and the lower power supply wiring layers P2 and P4 are electrically connected via via conductors v1 and v2.
The lower ceramic layers s8 to s13 are formed on any one of the signal wiring layer S, the lowermost power wiring layer P4, and the lower ground wiring layer G2 and the back surface 4 of the lowermost ceramic layer s13. A plurality of via conductors (connection conductors) V that are connected to the plurality of external terminals 6 in a straight line are arranged. The lower end of the via conductor V is connected to the substantially central portion of the external terminal 6 formed on the back surface 4 of the lowermost ceramic layer s13.

  As shown in FIG. 2, a plurality of pads 5 are formed in the same manner as described above on the surface 3 of the uppermost ceramic layer 1s. The pads 5 are the uppermost power wiring layer P3 and the upper ground wiring layer G1. , And any one of the signal wiring layers S through via conductors v3, 7, and 8. Note that the lower ends of the via conductors 7 and 8 and the via conductor V are connected via a connection pad (not shown). Further, the pair of upper and lower ground wiring layers G1 and G2 are also electrically connected to each other via the via conductors 7.

In addition, probes 9 are individually attached to the plurality of pads 5 formed on the surface 3 of the substrate body 2a, and the tip side of the probes 9 is electrically connected to the electrodes for the same electronic components as described above. By doing so, it becomes possible to accurately detect the electrical characteristics of each electronic component.
The inspection apparatus wiring board 1a as described above is manufactured by the same method as the wiring board 1, and can exhibit the same effects as those of the wiring board 1 described above. In addition, since the power supply wiring layers P1 to P4 of the upper and lower layers are provided, it is possible to more reliably supply the current required for the inspection of each of the plurality of electronic components to be inspected and the power supply to the signal wiring layer S. .

FIG. 3 is a cross-sectional view showing a main part of a wiring board 1b for an inspection apparatus having a different form.
As shown in FIG. 3, the inspection apparatus wiring board 1 b includes a plurality of ceramic layers (insulating layers) s <b> 1 to s <b> 15 stacked in the thickness direction, and has a front surface 3 and a back surface 4. 2b. Between the ceramic layers s4 and s5 and the ceramic layers s6 and s7 of the substrate body 2b, a pair of upper and lower signal wiring layers Sa and Sb are disposed in the same manner as described above. Such signal wiring layers Sa and Sb are not electrically connected to each other and constitute parts of different signal circuits.
In addition, between the ceramic layers s3 and s4 on the upper layer side of the signal wiring layer Sa and between the ceramic layers s5 and s6 on the lower layer side, a pair (a plurality) of ground wiring layers G1 and G2 are opposed to the signal wiring layer Sa. However, they are arranged via the ceramic layers s4 and s5.

On the other hand, between the ceramic layers s5 and s6 on the upper layer side of the signal wiring layer Sb and between the ceramic layers s7 and s8 on the lower layer side, a pair (a plurality) of ground wiring layers G2 and G3 are opposed to the signal wiring layer Sb. However, they are arranged via the ceramic layers s6 and s7. The ground wiring layer G2 also serves as a ground wiring layer to be disposed on the lower layer side of the signal wiring layer Sa and the upper layer side of the signal wiring layer Sb.
Furthermore, in plan view, two pairs of upper and lower layers are provided between the upper ceramic layers s1 to s3 and the lower ceramic layers s8 to s10 so as to face the signal wiring layers Sa and Sb and the ground wiring layers G1 to G3. A plurality of power supply wiring layers Pa1, Pb1, Pa2, and Pb2 are arranged via ceramic layers s3 to s8 and s2 to s9 that are different from each other.

Among these, the power supply wiring layer Pa1 and the power supply wiring layer Pa2 that are closest to the top and bottom of the signal wiring layer Sa include via conductors (connection conductors) v in which the ceramic layers s3 to s8 are linearly arranged along the thickness direction. And are part of the same power supply circuit.
On the other hand, the power supply wiring layer Pb1 and the power supply wiring layer Pb2 that are closest to the top and bottom of the signal wiring layer Sb are arranged in a straight line as shown by broken lines in FIG. Are connected to each other via another via conductor (connection conductor) v. The power supply wiring layers Pb1 and Pb2 constitute part of a power supply circuit different from the power supply circuit including the power supply wiring layers Pa1 and Pa2.
The signal wiring layers Sa and Sb, the ground wiring layers G1 to G3, and the power supply wiring layers Pa1, Pb1, Pa2, and Pb2 are made of the same metal material as described above.

In addition, via conductors v2, 7, and 8 connected to the signal wiring layers Sa and Sb, the lower power wiring layers Pa2 and Pb2, or the lowermost ground wiring layer G3 are linearly formed on the ceramic layers s8 to s10. It penetrates.
Further, as shown in FIG. 3, the lower ceramic layers s11 to s15 are connected to the signal wiring layers Sa and Sb, the lower power supply wiring layers Pa2 and Pb2, and the lower vias v2, 7, and 8, respectively. A plurality of via conductors (connection conductors) V that connect in a straight line between any one of the lowermost ground wiring layers G3 and the plurality of external terminals 6 formed on the back surface 4 of the lowermost ceramic layer s15 are arranged. Has been. These via conductors V are connected to substantially the center of each of the plurality of external terminals 6. The via conductors v2, 7, and 8 and the via conductor V are connected via connection pads (not shown).

In FIG. 3, a plurality of pads 5 are formed in the same manner as described above on the surface 3 of the uppermost ceramic layer s1, and the pads 5 include the signal wiring layers Sa and Sb, the upper power supply wiring layers Pa1 and Pb1, and It is electrically connected to any one of the uppermost ground wiring layers G1 via via conductors v1, 7, 8 and via conductors indicated by broken lines in FIG.
In addition, probes 9 are individually attached to the plurality of pads 5 formed on the surface 3 of the substrate body 2b, and the tip side of the probes 9 is electrically connected to the electrodes for the same electronic components as described above. By doing so, it becomes possible to accurately detect the electrical characteristics of each electronic component to be inspected.

The wiring board 1b for an inspection apparatus as described above is also manufactured by the same method as that for the wiring board 1.
Further, the inspection apparatus wiring board 1b has the same effects as the wiring board 1. Furthermore, since two sets of the power supply wiring layers Pa1 and Pa2 and the power supply wiring layers Pa1 and Pb2, which form a plurality of power supply circuits, are arranged to face each other through different insulating layers, for example, inspection According to the electrical characteristics of each electronic component to be performed, it is possible to perform an electrically complicated and precise inspection such as transmitting currents of different voltages in parallel.

The present invention is not limited to the embodiments described above.
For example, the connection conductor used in the present invention is not limited to the form of the via conductors v and V, but may be a form of a through-hole conductor having a substantially cylindrical shape as a whole and sealed with resin or the like inside.
The insulating layer used in the present invention includes the ceramic layer s1 made of high-temperature fired ceramic such as alumina or AlN, or the like, or a kind of low-temperature fired ceramic such as glass-ceramic, various epoxy resins, or polyimide. It is good also as what consists of heat resistant resins, such as.
Furthermore, the plurality of power supply wiring layers may be formed in three or more sets that are electrically connected to each other and that are not electrically connected to each other, and may be formed inside the substrate body via different insulating layers.
In addition, in the inspection apparatus wiring boards 1, 1a, 1b, the lower ceramic layer through which only the via conductor V passes is omitted, and the lowermost power wiring layer is formed on the back surface of the ceramic layer formed on the surface. An external terminal may be formed.

Sectional drawing which shows the wiring board for inspection apparatuses of one form by this invention. Sectional drawing which shows the principal part of the application form of the wiring board for test | inspection apparatuses of FIG. Sectional drawing which shows the principal part of the wiring board for test | inspection apparatuses of a different form.

Explanation of symbols

1, 1a, 1b ………………………………… Wiring board for inspection equipment 3 …………………………………………………… Surface 4 …………… …………………………………… Back 5 ………………………………………………… Pad 6 ………………………………… ……………… External terminal 9 ………………………………………………… Probe v, V ……………………………………………… Via Conductor (connection conductor)
s1 to s15 …………………………………… Ceramic layer (insulating layer)
S, Sa, Sb .............................................. signal wiring layers P1 to P4, Pa1, Pa2, Pb1, Pb2 ... power supply wiring layers G1 to G3. ………… Grounding wiring layer

Claims (7)

A plurality of insulating layers stacked along the thickness direction;
A signal wiring layer disposed between the plurality of insulating layers;
A plurality of power supply wiring layers disposed through the plurality of insulating layers and facing the signal wiring layer, and electrically connected to each other;
A connection conductor that is arranged linearly along the thickness direction between the pair of upper and lower power supply wiring layers closest to the signal wiring layer, and that connects the plurality of power supply wiring layers;
A wiring board for an electronic component inspection apparatus. The plurality of power supply wiring layers are formed in a planar shape between the plurality of insulating layers.
The wiring board for an electronic component inspection apparatus according to claim 1. Of the plurality of insulating layers, on the back surface of the lowermost insulating layer, an external terminal connected to the central portion of the connecting conductor that is electrically connected to the lowermost power wiring layer is formed.
The wiring board for an electronic component inspection apparatus according to claim 1 or 2. A plurality of power supply wiring layers that are not electrically connected to the plurality of power supply wiring layers are arranged to face the plurality of power supply wiring layers via an insulating layer different from the insulating layer.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 3. The signal wiring layer is sandwiched between a plurality of ground wiring layers disposed between the plurality of insulating layers on the upper layer side and the lower layer side,
The plurality of ground wiring layers are disposed between the power supply wiring layer and the signal wiring layer.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 4, wherein: Among the plurality of insulating layers, a plurality of pads individually connected to the power wiring layer, the signal wiring layer, and the ground wiring layer are formed on the surface of the uppermost insulating layer, and a probe is attached on the pads. Be
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 5. The plurality of insulating layers are made of at least one of ceramic and resin.
The wiring board for an electronic component inspection apparatus according to any one of claims 1 to 6.

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