JP2009092572A - Probe pin and fixed card using the same - Google Patents

Abstract

The durability of an IC evaluation probe pin is improved.
A probe pin and a fixed card using the probe pin according to the present invention have a cylindrical probe support column 14 provided with a conductor fixing portion 15 on a side surface near one end, and the other end of the probe support column 14 inserted from one end. A cylindrical slide portion 16 that slides in a telescopic manner, cylindrical first and second conductor support portions 17a and 17b that are provided on the side of the slide portion 16 with the slide portion 16 interposed therebetween, and a slide A rotatable pulley 18 provided at the other end of the portion 16 and having conductivity and elasticity, one end is fixed to the conductor fixing portion 15, passes through the conductor support portion 17 a, and circulates along the groove of the pulley 18. The probe conductor 19 is installed so as to penetrate the conductor support portion 17b and moves while rotating the pulley 18 in accordance with the expansion and contraction operation of the probe support column 14 and the slide portion 16.
[Selection] Figure 1

Description

  The present invention relates to a probe pin for IC evaluation and a fixed card using the same.

  The probe pin for IC evaluation is formed of an alloy mainly composed of tungsten (W), nickel (Ni), or the like, and the probe pin itself has a role of conducting an evaluation signal. For this reason, in the fixed card using the conventional probe pin of the vertical needle type, due to the structure of the probe pin, the probe pin is melted or seized at the power source or the ground during the test, and the probe pin cannot be expanded and contracted. There was a problem that there was a possibility. Furthermore, there is a problem that the probe pin that can no longer be expanded and contracted may crush the terminal on the chip side depending on the shape of the terminal such as an area bump.

  Also, in conventional vertical probe pins, chip-side terminal bumps are crimped to the tip, making it difficult to maintain a stable contact with the chip-side terminal. There is a problem that it is necessary to clean (see, for example, “Patent Document 1”).

Furthermore, in the conventional fixed card using the probe pin, there is a problem that the probe mark on the chip side terminal varies due to the height variation of the probe pin, and the damage on the chip side terminal increases due to the multiple contact. .
JP-A-2005-44825

  The present invention provides a probe pin capable of separating a signal conduction path from a telescopic structure and a fixed card using the probe pin.

  According to one aspect of the present invention, a cylindrical probe column having a conductor fixing portion provided on a side surface in the vicinity of one end, and a cylindrical slide unit that slides in a telescopic manner with the other end of the probe column inserted from one end. And cylindrical first and second conductor support portions provided on opposite sides of the slide portion so that the central axis is parallel to the central axis of the slide portion with the slide portion interposed therebetween, and rotation A rotatable pulley provided at the other end of the slide portion so that the axis is orthogonal to the central axis of the slide portion, and a conductive pulley and at least an elasticity that can be wound along the groove of the pulley. Is fixed to the conductor fixing portion, penetrates through the first conductor support portion, and circulates along the groove of the pulley and passes through the second conductor support portion, the probe support and the Sura Probe pin is provided, characterized in that with the expansion and contraction of the de part having a probe conductors to move while rotating the pulley.

  According to another aspect of the present invention, a plurality of the above-described probe pins are installed such that the central axis of the probe support is perpendicular to the substrate, and an input / output signal from a probe tester is connected to one end of the probe conductor. Fixed cards are provided that are each connected.

  According to the present invention, since the signal conduction path is separated from the elastic structure of the probe pin, the durability of the probe pin can be improved.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a view showing a probe pin according to Embodiment 1 of the present invention. Here, the case where the probe pin 11 is brought into contact with the pad 13 on the chip 12 is mainly shown. FIG. 1A shows a state before the probe pin 11 is brought into contact with the pad 13, and FIG. 1B shows a state where the probe pin 11 is brought into contact with the pad 13.

  The probe pin 11 according to the first embodiment of the present invention includes a probe support 14 formed of an insulating material, a conductor fixing portion 15, a slide portion 16, conductor support portions 17a and 17b, a pulley (pulley) 18, and a conductive material. The probe conductor 19 formed by is provided.

  The columnar probe support 14 is fixed substantially vertically downward to the fixed card substrate, a conductor fixing portion 15 is provided on the side surface near the upper portion of the probe support 14, and a cylindrical slide portion 16 is provided below the probe support 14. Is covered so as to slide freely.

  Two cylindrical conductor support portions 17 a and 17 b are provided on the side surface of the slide portion 16 so as to face each other with the slide portion 16 interposed therebetween so that the central axis thereof is parallel to the central axis of the slide portion 16. A rotatable pulley 18 is provided at the lower end so that the rotation axis thereof is orthogonal to the central axis of the slide portion 16.

  One end of the probe conductor 19 is fixed to the fixed card substrate and the conductor fixing portion 15, passes through the conductor support portion 17 a, and is installed so as to go around the pulley 18 and pass through the conductor support portion 17 b. A signal from a probe tester (not shown) is electrically connected to the probe conductor 19 on the fixed card.

  The pulley 18 is rotated by a probe conductor 19 that moves along a groove provided on the circumferential surface in accordance with the expansion and contraction of the probe support 14 and the slide portion 16.

  The probe conductor 19 has sufficient elasticity to be wound around at least the pulley 18, and can move while sliding inside the conductor support portions 17a and 17b.

  Further, as shown in FIG. 1B, the probe conductor 19 comes into contact with the pad 13 when the tip 12 is raised, and then the tip 12 is further raised, so that the pulley 18 is rotated and the conductor support portion 17b is rotated. Move towards.

  Minute irregularities are formed on the surface of the probe conductor 19, and the probe conductor 19 removes deposits such as oxide film and dirt on the surface of the pad 13 at the contact point 20 with the pad 13 by movement. Further, these deposits are mechanically cleaned and removed at the lower edge portion of the conductor support portion with the movement of the probe conductor 19 every time the probe pin 11 is expanded or contracted.

  FIG. 2 is a perspective view showing the internal structure of the probe pin 11 according to the first embodiment of the present invention. Here, in order to show the internal structure, the slide portion 16 (shown by a one-dot chain line in FIG. 2) is shown through. As in FIG. 1, FIG. 2A shows a state before the probe pin 11 is brought into contact with the pad 13, and FIG. 1B shows a state in which the probe pin 11 is brought into contact with the pad 13.

As shown in FIG. 2, a stopper 21 and a coiled spring 22 are provided inside the slide portion 16.
The stopper 21 is provided in the lower part of the cylinder of the slide part 16 so as not to hinder the rotation of the pulley 18, and the spring 22 is interposed between the probe column 14 inserted into the cylinder of the slide part 16 from above and the stopper 21. Is provided.

  According to the first embodiment, since the signal conduction path (probe conductor 19) from the probe tester is separated from the stretchable structure (probe column 14 and slide portion 16) formed of an insulating material, the needle tip ( Even when the probe conductor 19) is burned in, the sticking of the stretchable structure can be prevented, and the durability of the probe pin 11 can be improved.

  In addition, since the sticking of the stretchable structure can be avoided, damage to the corresponding pad 13 on the chip 12 can be minimized.

  Furthermore, according to the first embodiment, the probe conductor 19 that moves with the rotation of the pulley 18 polishes the contact point 20 and removes deposits such as oxide film and dirt on the surface of the pad 13. Thus, stable conduction of the signal can be maintained.

  Furthermore, according to the first embodiment, each time the probe pin 11 is expanded or contracted, the conductor support portions 17a and 17b clean the dirt and the like adhering to the probe conductor 19, so that stable signal conduction at the contact point 20 is maintained. be able to.

  In the first embodiment described above, the probe column 14, the conductor fixing portion 15, the slide portion 16, the conductor support portions 17a and 17b, and the pulley 18 are formed of an insulating material. However, the present invention is limited to this. Instead, for example, a method in which a signal path (probe conductor 19) from the probe tester is electrically separated from these portions, such as applying an appropriate insulating film, may be employed.

  FIG. 3 is a diagram showing a fixed card using probe pins according to the second embodiment of the present invention. Here, as an example, the case where the probe pins 31a to 31c similar to those of the first embodiment are brought into contact with the pads 33a to 33c on the chip 32, respectively, is shown. 3A shows a state before the probe pins 31a to 31c are brought into contact with the pads 33a to 33c on the chip 32. FIG. 3B shows the probe pins 31a to 31c on the chip 32 by raising the chip 32. The state which made it contact the pads 33a-33c is shown.

  Since the structure, function, and operation of the probe pins 31a to 31c are the same as those in the first embodiment, detailed description thereof is omitted. Moreover, when indicating each part which comprises the probe pins 31a-31c, the same code | symbol as Example 1 is used.

  The fixed card using the probe pins according to the second embodiment of the present invention includes three probe pins 31 a to 31 c installed almost vertically on the fixed card substrate 34.

  The probe conductor 19 of the probe pin 31a is electrically connected to a first signal from a probe tester (not shown) on the fixed card substrate 34, and the probe conductor 19 of the probe pin 31b is electrically connected to the fixed card substrate 34. The probe conductor 19 of the probe pin 31c is electrically connected to the third signal from the probe tester on the fixed card substrate 34, and is electrically connected to the second signal from the probe tester.

  In a state where the probe pins 31a to 31c are not in contact with the pads 33a to 33c on the chip 32, there is a slight height variation between the probe pins 31a to 31c as shown in FIG. . This is due to variations in the manufacture of the probe pins 31a to 31c or variations in installation on the fixed card substrate 34, and a height variation of about 100 μm is inevitable.

  As an example, FIG. 3 shows a case where the probe pin 31b is lower than the probe pin 31a by a and the probe pin 31c is lower than the probe pin 31a by b. In FIG. 3, the height variation is emphasized, but in actuality, as described above, it is at most several hundred μm.

  When the tip 32 is raised and the probe pins 31a to 31c are brought into contact with the pads 33a to 33c on the tip 32, as shown in FIG. 3B, the probe conductor 19 having a length corresponding to the initial height variation. Protrudes above the conductor support 17b. That is, 2a for the probe pin 31b and 2b for the probe pin 31c.

  What is important is that the contact area of the pads 33a to 33c with the probe conductor 19 is almost the same regardless of the initial height variation, and the probe marks on the pads 33a to 33c by the probe conductor 19 are almost uniform. Is to become. This is realized by pressing the probe conductor 19 wound around the pulley 18 of each of the probe pins 31a to 31c against the pads 33a to 33c by the spring 22.

  The same applies to the height variations of the pads 33a to 33c as well as the height variations of the probe pins 31a to 31c. FIG. 4 is a diagram illustrating another example of a fixed card using probe pins according to the second embodiment of the present invention. Here, as an example, the case where the vicinity of the contact point of the pad 33b is lower than the other pads 33a and 33c is shown. Similarly to FIG. 3, FIG. 4A shows a state before contacting the pads 33a to 33c, and FIG. 4B shows a state where the pads 33a to 33c are contacted.

  As shown in FIG. 4B, even in such a case, the probe pins 31a to 31c are expanded and contracted by the spring 22 and the probe conductor 19 is pressed against the pads 33a to 33c with an appropriate pressure. Regardless of the height variation, damage to the pads 33a to 33c can be minimized.

  According to the second embodiment, not only the same effects as in the first embodiment can be obtained, but also the height variation between the plurality of probe pins installed on the fixed card substrate 34 is absorbed by the expansion / contraction operation. The probe marks by 19 are always ensured almost uniformly, and damage due to height variations on the pads 33a to 33c can be minimized.

  Further, according to the second embodiment, even when the pads 33a to 33c on the chip 32 have height variations, the height variations are absorbed by the respective expansion and contraction operations of the probe pins 31a to 31c. Damage to 33a to 33c can be minimized.

  In the second embodiment, the number of probe pins installed on the fixed card substrate 34 is three, but the present invention is not limited to this.

The figure which shows the probe pin concerning Example 1 of this invention. The perspective view which shows the internal structure of the probe pin concerning Example 1 of this invention. The figure which shows the fixed card | curd using the probe pin concerning Example 2 of this invention. The figure which shows another example of the fixed card | curd using the probe pin concerning Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11, 31a-31c Probe pin 12, 32 Tip 13, 33a-33c Pad 14 Probe support | pillar 15 Conductor fixing | fixed part 16 Slide part 17a, 17b Conductor support part 18 Pulley 19 Probe conductor 20 Contact point 21 Stopper 22 Spring 34 Fixed card board

Claims (5)

A columnar probe support provided with a conductor fixing portion on the side surface near one end;
A cylindrical slide part that is inserted into the other end of the probe support column from one end and slides in an expandable manner;
Cylindrical first and second conductor support portions provided on opposite sides of the slide portion with the slide portion interposed therebetween so that a central axis is parallel to the central axis of the slide portion;
A rotatable pulley provided at the other end of the slide portion such that the rotation axis is orthogonal to the central axis of the slide portion;
It has conductivity and elasticity that can be wound at least along the groove of the pulley, one end is fixed to the conductor fixing portion, passes through the first conductor support portion, and circulates along the groove of the pulley. And a probe pin that is installed so as to penetrate the second conductor support portion and moves while rotating the pulley in accordance with an expansion / contraction operation of the probe support and the slide portion. A stopper formed in the cylinder in the vicinity of the other end of the slide portion so as not to interfere with the rotational operation of the pulley;
The probe pin according to claim 1, further comprising a coiled spring provided between the other end of the probe support and the stopper.   The probe pin according to claim 1, wherein the probe support, the slide portion, the first and second conductor support portions, and the pulley are formed of an insulating material.   2. The probe pin according to claim 1, wherein the probe conductor has a minute unevenness on a surface thereof, and removes adhered matter at a contact point by movement accompanying expansion and contraction of the probe support and the slide portion. .   A plurality of probe pins according to claim 1 are installed so that a central axis of the probe support is perpendicular to a substrate, and an input / output signal from a probe tester is connected to one end of the probe conductor, respectively. Fixed card to be.

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