JP2009092489A - Optical element temperature characteristic inspection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical element temperature characteristic inspection apparatus using a plurality of Peltier elements and having a high temperature accuracy and capable of inspecting a plurality of optical elements at a high speed.
SOLUTION: Individual cooling jackets corresponding to a plurality of Peltier elements are prepared, and a pair of cooling jackets and Peltier elements is formed from the bottom on a common metal plate having an area larger than a plurality of Peltier element areas. The upper plate is fixed on the base by a support so that it is fixed to the back side of the plate, and the space under the cooling jacket is a column, and the cooling medium is allowed to flow through individual cooling medium paths to the individual cooling jackets. A stage board with a plurality of optical elements, optical element wafers, and optical element chips arranged on top of each other, and the temperature of the upper plate is maintained at a desired uniform temperature by controlling the cooling medium temperature flow rate and Peltier element current. Then, the characteristics of a plurality of optical elements are measured at a uniform temperature.
[Selection] FIG.

Description

  This invention measures the light receiving sensitivity, light emission characteristics, light emission wavelength distribution, and other characteristics of optical elements such as photodiodes (PD), laser diodes (LD), and light emitting diodes (LEDs) while keeping the temperature of the element and its surroundings constant. The present invention relates to an inspection apparatus capable of performing the above.

  Patent Document 1 is a print in which a plurality of light receiving elements are embedded upward, a heater is provided on the back of a soaking block cooled through a coolant, and a plurality of semiconductor lasers are inserted into a plurality of insertion holes on the soaking block. An apparatus has been proposed in which a substrate is placed, a semiconductor laser and a light receiving element are opposed to each other, and the semiconductor laser is energized while being held at a predetermined temperature. The soaking block is a wide and thick rectangular metal plate, and the coolant passes through it and is cooled by the coolant. The soaking block only cools, and in order to raise the temperature, the soaking block is heated by the heater on the back.

  When changing the inspection temperature, adjust the heater power. The temperature of the soaking block is determined by the balance between heating and cooling. A semiconductor laser is energized to emit light downward, and the light emission intensity is measured by a light receiving element facing upward. This has the advantage that the inspection efficiency is good because the light emitting element and the light receiving element are combined in a one-to-one relationship. The light emission characteristics of many laser diodes can be measured in a short time by changing the temperature.

  However, since the method of determining the temperature in the soaking block depends on the balance between the heat generated by the heater and the heat released from the refrigerant, there is a drawback that the temperature accuracy is poor. When changing the inspection temperature, it takes time to reach the desired temperature because the heater power is controlled, and it is necessary to wait until the temperature becomes uniform in the soaking block. In addition, refrigerant passages and heaters are provided discretely, and heat suction and outflow are unevenly present. Therefore, there is a problem that the temperature is difficult to be constant and uniform in the soaking block.

  That is, the soaking block is always in a non-equilibrium state. There is always a strong heat flow in the soaking block and there is a large temperature distribution. Since the light receiving element as the inspection element is in the soaking block, it is susceptible to temperature changes, and the light receiving sensitivity also changes, so that there is a disadvantage that temperature correction is necessary.

  Patent Document 2 uses a Peltier element. A soaking jig (stage) is placed on the Peltier element, and an optical element is placed on it. The entire Peltier element and soaking jig are surrounded by a chamber with a transmission window in the upper center. Set the gas temperature. The semiconductor laser is energized to emit upward light, and a measuring instrument provided outside the window is aligned to examine the emission intensity and distribution of the semiconductor laser.

  The internal and external spaces are divided by the chamber, and the temperature of the internal gas is controlled by an air conditioner provided separately. Only the semiconductor laser of the device under test is in the chamber. Since a measuring instrument and an alignment mechanism can be provided outside the chamber, the inspection mechanism and the alignment mechanism are not affected by temperature changes.

  There is also an advantage that temperature control is precise because the temperature of the soaking jig is determined by the Peltier element. Since the ambient temperature is controlled by air conditioning, the temperature around the device under test is stabilized. There is no large heat flow because no heater is used. Soaking jigs and semiconductor lasers are close to equilibrium. There are advantages as described above.

  However, there is no one-to-one correspondence between the optical element and the inspection element. Accordingly, it is necessary to measure the optical element characteristics one by one with the inspection mechanisms facing each other and axially aligned. Since an optical element is provided in the chamber, it takes time to replace it. The chamber is opened, the inspected optical element is taken out, the next optical element is attached to the stage, the chamber is closed, and air is allowed to flow from the air conditioner to the chamber to wait for equilibrium.

  As such, the optical elements are put into the chamber one by one and attached to the stage and inspected, the chamber is opened, the element is replaced, the chamber is closed, and air at a desired temperature is allowed to flow inside to be inspected. The same is repeated for each optical element. This takes a lot of time. Therefore, the inspection efficiency of the optical element is poor.

JP-A 63-247676

JP 09-288143 A

  There is a demand for a temperature characteristic inspection apparatus that has high temperature accuracy and can be inspected at a high speed. In Patent Document 1, a plurality of light receiving elements are embedded in a soaking block heated by a heater and cooled by a refrigerant, a printed circuit board with a plurality of semiconductor lasers is opposed to the soaking block, and the semiconductor laser is emitted to receive the light. The emission intensity is detected. This makes it possible to inspect the characteristics of a large number of semiconductor lasers at once.

  However, the soaking block is not in thermal equilibrium but has a temperature distribution. Also, the temperature at each point of the soaking block is not stable. The temperature of each element may be different. Since the temperature error is large, accurate temperature characteristics cannot be inspected.

  In Patent Document 2, one light element is placed on a Peltier element / heat equalizing jig surrounded by a chamber in which temperature-controlled air is blown, and the light emitted from the transmission window is inspected by an inspection device. Therefore, the temperature of the element can be defined with high accuracy. However, it is inefficient because the inspection is performed in a shielded chamber one by one.

  In any case, the accuracy of the measured temperature is good and the temperature characteristics are inspected quickly.

  If a large number of semiconductor lasers are arranged vertically and horizontally on a strictly temperature-adjustable metal plate, and the emission power is inspected by emitting the semiconductor lasers, the above-mentioned temperature accuracy can be inspected well and quickly. Should be.

  In order to strictly control the temperature, it is necessary to use a Peltier element. In Patent Document 2, a soaking jig is placed on a Peltier element, and one semiconductor laser is placed thereon. Since a single semiconductor laser is small, the temperature distribution with a soaking jig is not a problem. A thermocouple may be provided near the target semiconductor laser and the temperature of the semiconductor laser may be monitored.

  FIG. 1 is a view showing a cooling structure of the inspection apparatus of Patent Document 2. In FIG. Although not described in detail in Patent Document 2, it is presumed to be as shown in FIG. A Peltier element 4 is provided on a cooling jacket 3 provided with a hole in a metal plate, and a jig and a semiconductor laser are provided on the Peltier element 4. The cooling jacket 3 is perforated with refrigerant passages such as a supply passage 6 and a discharge passage 7. The cooling jacket 3 is fixed on a base (not shown). The only load applied to the Peltier element is the metal upper plate 5 on which the optical element is placed. The temperature of the element can be more precisely limited by a soaking jig or a Peltier element.

  The Peltier element utilizes the fact that when current is passed through the junction of different materials, it generates and heats depending on the direction of the current. Since a single bond does not absorb and generate heat enough, a plurality of materials are laminated. The outermost layer becomes the electrode. When current is passed in a certain direction, heat flows in a certain direction. When current is passed in the opposite direction, heat flows in the opposite direction. It is an element that can move heat like that.

  A Peltier element is placed on the cooling mechanism, an upper plate for placing the element is placed thereon, and the element to be inspected is placed thereon. When a current is passed through the Peltier element, heat is taken from the upper plate and the element to be inspected and moved to the cooling mechanism. The cooling mechanism eliminates the heat that has moved. Conversely, a heating mechanism may be provided. A current is passed through the Peltier element in the opposite direction. Heat from the heating mechanism can be transferred to the upper plate and the element to be inspected. The cooling mechanism and the heating mechanism may be the same.

  Increasing the current increases the amount of heat transfer. Reducing current reduces the amount of heat transferred. The amount of heat transfer can be adjusted by the electric current. The temperature of the device mounting top plate is always measured with a thermocouple. The amount of current is controlled while monitoring this. Therefore, the upper plate and the element to be inspected can be set to an arbitrary temperature by the Peltier element. Of course, if there is a heat source, a cooling source, and an upper plate, there is heat conduction, so the upper plate can be brought to an arbitrary temperature. Patent Document 1 has such a structure. However, relying on heat conduction cannot achieve the desired temperature quickly and accurately, and there is no uniformity. Patent Document 2 has a structure in which one element is mounted on a Peltier element, and the temperature of the element to be inspected is precisely controlled. However, since only one element can be handled, Patent Document 2 is time consuming and inefficient.

  We want to increase the number of semiconductor lasers that can be measured at once using Peltier elements. It means that you can place many devices on the top plate instead of one. In other words, an upper plate is placed on the Peltier element, and an inspection stage having a large number of devices mounted thereon is placed thereon. There is no prior example of such an inspection device.

  Therefore, the prior art of mounting a plurality of devices on the stage above the Peltier element cannot be shown. Though there is no prior art, thought experiments can be carried out.

  If a device mounting upper plate is provided on a Peltier element and a device is mounted on the device to inspect the device, the upper plate should be wider. This is because a larger number of devices can be handled at one time. If a larger number of devices can be inspected at once, the efficiency becomes higher.

  However, since the area of a commercially available Peltier element is limited, it is impossible to use an element mounting upper plate having a larger area than a commercially available Peltier element. The number of elements that can be inspected at one time by the area of the Peltier element is limited. A solution is to use a plurality of Peltier elements. If an inspection board with a larger area is used, two or more Peltier elements may be combined.

  For example, if four square Peltier elements are arranged vertically and horizontally, a metal plate having a double side length should be able to be used as the upper plate. By doing so, inspection of four times as many elements can be performed at once, and the inspection cost can be reduced. A plurality of Peltier elements such as 3 × 2 or 3 × 3 may be arranged and the upper plate may be placed thereon, and a number of elements may be arranged vertically and horizontally on the upper plate to inspect the characteristics.

  In this case, the structure shown in FIG. For example, a 2 × 2 Peltier element 4,..., 4 is placed on the heavy cooling jacket 3, and one wide upper plate 5 is placed thereon. FIG. 2 is not a prior example. There is no prior art of holding multiple stages with multiple Peltier elements in parallel. FIG. 2 shows an example of a thought experiment.

  Commercially available Peltier elements 4 vary in thickness. Peltier elements with the same dimensions and standards are not actually the same thickness. In FIG. 2, the right Peltier element 4g is thicker than the left Peltier element 4h. When the upper plate 5 is placed on the 2 × 2 Peltier element, a gap 29 is generated between the thinner Peltier element 4 h and the upper plate 5. Even if the gap 29 is small, the heat conduction between the Peltier element 4 and the upper plate 5 is greatly hindered, so that a strongly biased temperature distribution is formed on the upper plate 5. In this case, the temperature is different for each element, and the optical characteristics are measured at different temperatures. Don't do that.

  By using multiple Peltier elements and making the thermal conductivity of the Peltier element and the upper plate uniform and improving the temperature uniformity of the upper plate, the characteristics of the multiple optical elements can be inspected with good temperature accuracy and at a high speed. It is an object of the present invention to provide a temperature characteristic inspection apparatus.

  The optical element temperature characteristic inspection apparatus of the present invention prepares individual cooling jackets corresponding only to a plurality of Peltier elements, and sets a combination of a cooling jacket and a Peltier element from the bottom, and has a common area having a plurality of Peltier element areas or more. The top plate is fixed to the back of a single metal top plate, and the top plate is fixed on the base by a support so that there is a space under the cooling jacket. A stage board on which a plurality of optical elements, optical element wafers, and optical element chips are arranged is placed on a common upper plate, and the temperature of the upper plate is controlled by controlling the cooling medium temperature flow rate and the Peltier element current. By maintaining the temperature at a desired uniform temperature, the characteristics of a plurality of optical elements can be measured at the uniform temperature.

  The upper plate is made of copper alloy or copper, and the surface is subjected to surface treatment such as gold plating or nickel plating. Excellent heat conduction because it is copper or copper alloy. Since it rusts only it, it is plated.

  The present invention uses a number of cooling jackets equal to the number M of Peltier elements instead of one cooling jacket. There are M sets of cooling jackets and Peltier elements. A set of M cooling jackets and Peltier elements is uniformly fixed to one upper plate 5 from below. Do not fix the cooling jacket on something like a substrate. The cooling jacket / Peltier element may be integrated as a unit in advance, and then suspended and fixed to the back surface of the upper plate 5.

  In order to float the cooling jacket, the upper plate 5 is held by a support on the base. In this way, a free space is provided immediately below the bottom surface of the Peltier element. The support is made of resin such as Duracon. Since it is resin, it has heat insulation. No heat is transferred between the base and the upper plate 5. The temperature uniformity of the upper plate 5 is increased.

  Since the cooling jacket is divided, there is no gap between the Peltier element and the upper plate 5 even if the thickness of the Peltier element varies. There is no non-uniform heat conduction. If there is variation in the thickness of the Peltier element, the height of the bottom surface of the cooling jacket will vary, but the cooling jacket is not fixed to the substrate or the like and is a space below it.

  The currents Ij of the M Peltier elements (1, 2,..., M) can be individually controlled. Even if the performance of the Peltier element varies, the magnitude of the heat flow flowing through the Peltier element in the vertical direction can be freely adjusted by controlling the Peltier element current Ij.

The refrigerant flow amount Fj (j = 1,..., M) to the cooling jacket can be controlled as an overall ΣFj. Thereby, the cooling rate can be changed. In addition, Fj can be controlled individually. Then, the cooling capacity can be controlled for each cooling jacket.
In the invention of claim 1, a plurality of sets of Peltier elements and cooling jackets are vertically coupled and fixed to the back surface of one metal upper plate having an area larger than the area of the plurality of Peltier elements. The bottom of the cooling jacket is a space, the cooling jacket is provided with a refrigerant passage, an appropriate temperature refrigerant is circulated through the cooling jacket, an electric current is passed through the Peltier element in the forward and reverse directions, and the temperature and distribution of the refrigerant The temperature of the upper plate is regulated by the amount and the current of the Peltier element, and the optical element is determined by placing a stage on which a plurality of optical elements are placed on the upper plate, a wafer on which optical elements are formed, or a stage on which chips are mounted. Since the characteristics are inspected at the temperature, the characteristics of a plurality of optical elements can be inspected at a high speed with high temperature accuracy.
In the invention of claim 2, since the upper plate is made of copper or a copper alloy and is subjected to surface treatment of gold plating or nickel plating, it is excellent in heat conduction.
The invention according to claim 3 is heat-insulating because the support for holding the upper plate with respect to the base is resin.
In the invention of claim 4, since the Peltier element and the cooling jacket are integrated and suspended on the back surface of the upper plate, there is no gap between the Peltier element and the upper plate.
According to the fifth aspect of the present invention, the upper plate, the Peltier element, and the cooling jacket are provided with vertical screw through holes, the Peltier element is passed from above the upper plate, the screw is passed through the back surface of the cooling jacket, and the nut is screwed into the screw. Since the Peltier element and the cooling jacket are fixed to the plate, the contact pressure between the Peltier element and the upper plate can be adjusted depending on the amount of screwing.
According to the sixth aspect of the present invention, the upper plate and the Peltier element are provided with a threaded hole in the longitudinal direction, the cooling jacket is provided with a female screw hole, and the screw is passed through the female screw hole of the cooling jacket from above the upper plate. Since the Peltier element and the cooling jacket are fixed to the upper plate, the contact pressure between the Peltier element and the upper plate can be adjusted depending on the amount of screwing.
According to the seventh aspect of the present invention, the upper plate, the Peltier element, and the cooling jacket are provided with vertical screw through holes, an aluminum plate having a female screw hole is applied to the bottom surface of the cooling jacket, and the Peltier element and the cooling jacket are placed on the upper plate. Since the screw is passed through the back of the screw and screwed into the female screw hole of the aluminum plate and the Peltier element, cooling jacket, and aluminum plate are fixed to the upper plate, the contact pressure between the Peltier element and the upper plate is adjusted by the amount of screwing. Moreover, since the aluminum plate has good heat conduction, the uniformity of the temperature distribution of the cooling jacket can be improved.
According to the invention of claim 8, a screw through hole is made in the upper plate, the upper surface of the cooling jacket is bonded to the lower surface of the Peltier element, and an aluminum plate having a female screw hole is joined on the Peltier element, thereby integrating the Peltier element and the cooling jacket. Since the upper plate 5 is screwed from above the upper plate 5 and screwed into the female screw hole of the aluminum plate, it is suspended and fixed to the back surface of the upper plate, so that the contact pressure between the Peltier element and the upper plate is adjusted according to the amount of screwing. Moreover, since the aluminum plate has good heat conduction, the uniformity of the temperature distribution of the cooling jacket can be improved.
According to the ninth aspect of the present invention, the upper plate, the Peltier element, and the cooling jacket are provided with a threaded hole in the vertical direction. The screw passes through the Peltier element from the upper plate to the back surface of the cooling jacket, and the rubber spacer is passed through the screw. The Peltier element and the cooling jacket are fixed to the upper plate so as to relieve the pressure applied to the Peltier element, so that the Peltier element can be protected.
The invention of claim 10 provides a heat insulating sheet, an upper plate, a Peltier element, a cooling jacket, a heat insulating sheet, an aluminum plate with a vertical screw threaded hole, and a Peltier element, a cooling jacket, and a heat insulating sheet from above the upper plate. The screw is passed through the back of the aluminum plate, the nut is screwed into the screw, the Peltier element, cooling jacket, heat insulating sheet, and aluminum plate are fixed to the upper plate, so that the pressure applied to the Peltier element is relieved. Can be protected. Moreover, the cooling jacket is hardly heated by the ambient atmosphere because of the heat insulating sheet.
The invention according to claim 11 is provided with an over-tightening prevention collar around the screw, and the collar has a cylindrical shape whose overall length is shorter than the total thickness of the parts to be fastened to the upper plate. Even when the bolts are tightened, the elastic material is only deformed at a predetermined rate, so that the load on the Peltier element can be stabilized.
In the invention of claim 12, a CAN inspection stage having a plurality of positioning pins and a plurality of board mounting screw holes provided on the upper surface and having a wiring structure therein is placed on the upper plate, and has a plurality of optical elements having the internal wiring structure. The mounted inspection board is positioned and placed on the CAN inspection stage, wiring is connected, the inspection board is fixed to the CAN inspection stage with screws, and the optical element temperature is set to a predetermined temperature to inspect the characteristics of the optical element. Thus, the characteristics of a plurality of optical elements can be inspected at a high speed.
In the invention of claim 13, a wafer inspection stage having a plurality of vacuum holes formed on the upper surface is placed on an upper plate, and a wafer on which a plurality of optical elements are formed is placed on the wafer inspection stage. Thus, the characteristics of the optical elements formed on the wafer are inspected by setting the temperature of the wafer to a predetermined temperature, so that it is possible to inspect efficiently even if the wafer is large.
According to the fourteenth aspect of the present invention, a chip inspection stage having a plurality of vacuum holes formed on the upper surface is placed on an upper plate, a plurality of optical element chips are placed on the chip inspection stage, and vacuum suction is performed. Since the characteristics of the optical element chip are inspected at a predetermined temperature, a large number of device chips can be efficiently inspected collectively.
According to the fifteenth aspect of the present invention, side walls are formed by extending the four edges of the upper plate 5 upward to form an enclosure structure above the upper plate, and air having a low dew point is supplied to the enclosure structure at a temperature suitable for inspection. As a result, a temperature control space filled with air with a low dew point at the same temperature as the optical element to be inspected is formed above the upper plate, preventing condensation of moisture on the device, probe, etc., and reducing the temperature gradient in a parallel state It becomes close to and can prevent condensation.
According to the sixteenth aspect of the present invention, a side pipe wall having a temperature adjusting air passage and a temperature adjusting air outlet and a temperature adjusting air inlet is formed at the four edges of the upper plate 5, and a surrounding structure is provided above the upper plate. By supplying air with low dew point at a temperature suitable for inspection to the enclosure structure via the temperature control air inlet, temperature control air passage, and temperature control air outlet, it is almost the same temperature as the optical device under test above the upper plate Since the temperature control space filled with the air having a low dew point is formed, it becomes closer to a thermal equilibrium state, and condensation can be prevented more effectively. It also prevents moisture condensation on the device and probe.
According to the seventeenth aspect of the present invention, a drainage channel and a fluid supply channel branched in the base are provided, and a drainage outlet and a fluid inlet that integrate the drainage channel and the fluid supply channel are opened at the end of the base. Connect the external hose to the drainage outlet and the supply inlet of the base, connect the drainage passage of the cooling jacket and the drainage path of the base via the upper and lower joints by the vertical drainage pipe, and supply the cooling jacket The supply passage of the base and the supply channel of the base are connected by a vertical supply pipe via a joint, the refrigerant is supplied from one external hose, separated by the base, and supplied to each cooling jacket. Since the drainage is gathered at the base and discharged to one external hose, the drainage path and the liquid supply path are separated.
The invention of claim 18 absorbs the difference in the height in the vertical direction of the cooling jacket by changing the coupling length of the liquid supply pipe and drainage pipe at the upper and lower joints. Only one drain is required, and the refrigerant flow path is arranged.

  Since the optical element is placed on the upper plate 5 on which a plurality of Peltier elements are fixed for inspection, the characteristics of a large number of optical elements can be measured in a short time. Since the plurality of divided cooling jackets and the same number of Peltier elements are attached to one upper plate from below, no gap is generated between the Peltier elements and the upper plate even if the Peltier elements vary in thickness. The contact state between the Peltier element and the upper plate 5 can be made the same. Since the heat flow flowing through the Peltier element can be made uniform, the temperature distribution of the upper plate can be made uniform. The characteristics of a large number of optical elements can be collectively checked at the same temperature.

[Example 1 (FIGS. 3, 4, 12)]
The present invention can use any plurality of Peltier elements (M). Here, an embodiment will be described in which two 2 × 2 = 4 Peltier elements (M = 4) are arranged in parallel. FIG. 3 is a schematic longitudinal sectional view of the optical element inspection apparatus according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional plan view. FIG. 12 is a bottom perspective view of only the cooling jacket, Peltier element, and upper plate portion.

  As shown in FIG. 12, four sets of cooling jacket / Peltier elements are fixed under one upper plate 5. The first set of the first cooling jacket 31 and the first Peltier element 41, the second set of the second cooling jacket 32 and the second Peltier element 42, the third set of the third cooling jacket 33 and the third Peltier element 43, the fourth A fourth set of the cooling jacket 34 and the fourth Peltier element 44 is attached vertically and horizontally under one upper plate 5. Peltier elements are large area Peltier elements that are available. Since it is difficult to obtain a larger area, multiple pieces are used.

  The cooling jacket is not a common one. It is important that the cooling jackets 31 to 34 are divided according to the Peltier elements 41 to 44. Since the thicknesses of the Peltier elements 41 to 44 are not equal, the heights of the bottom surfaces of the cooling jackets 31 to 34 are not uniform.

  As shown in the longitudinal sectional view of FIG. 3, each Peltier element is attached to the upper plate 5 integrally with the cooling jacket in the vertical direction. In FIG. 3, the third Peltier element 43 and the third cooling jacket 33 are fixed to the left side of the back surface of the upper plate 5. The fourth Peltier element 44 and the fourth cooling jacket 34 are fixed to the right side of the back surface of the upper plate 5. Behind that, the first and second cooling jackets 31 and 32 and the first and second Peltier elements 41 and 42 are similarly fixed to the back surface of the upper plate 5. A pair of Peltier elements and cooling jackets divided into the upper plate 5 by a plurality of bolts are independently attached. The upper plate 5 is made of, for example, a nickel-plated copper alloy.

Posts 19 are erected at the corners of the upper surface of the base 8. The support column 19 is made of a material having low heat conduction so that heat does not escape through this. The support column 19 can be made of plastic such as Duracon. The upper plate 5 is supported at the upper end of the column 19. The base 8 serves as a base of the apparatus and a refrigerant passage. This will be explained later. On the base 8, the upper plate 5 is suspended by the support 19. Therefore, the space under the Peltier element / cooling jacket is a space. Since it is a space, there is no problem even if there is a difference in height between the bottom surfaces of the cooling jackets 31, 32, 33, 34. No gap is generated between the Peltier elements 41, 42, 43, 44 and the upper plate 5. The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

  As shown in FIG. 4, the cooling jackets 31, 32, 33, 34 are provided with independent refrigerant passages 2, 2,. Since the cooling jackets 31 are separated, the refrigerant passage is also separated and independent. Here, the refrigerant passage 2 is simply U-shaped. However, it may be a more complicated meandering passage. It is important that there is an independent refrigerant passage 2, 2 ... for each cooling jacket 31, .... Near the beginning and end of the refrigerant passage 2 are a supply passage 6 and a discharge passage 7. The refrigerant is pure water, alcohol, liquid with a low freezing point, or the like. The ends of the supply passage 6 and the discharge passage 7 are connected to an external hose for each cooling jacket, and can be supplied and discharged separately.

  Here, the structure is simpler. End portions of the supply passage 6 and the discharge passage 7 are connected to a liquid supply pipe 22 and a liquid discharge pipe 23 extending in the vertical direction. The lower ends of the liquid supply pipe 22 and the drain pipe 23 are connected to the refrigerant distribution path 85 (FIG. 23) of the base 8. Although the height of the cooling jacket is not common, since the coupling length of the liquid supply pipe 22 and the drain pipe 23 can be changed, there is no problem even if there is a difference in height.

[Example 2 (fixed with screws and nuts: Fig. 5)]
A means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 5 shows a sectional view of the fixing structure. There are a plurality of (M) cooling jackets 3 and Peltier elements 4, but only one is shown because the same fixing means is used. Actually, there are a plurality of sets of cooling jacket / Peltier elements on the left and right or front and back.

  A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. Screw holes 94 and 95 are formed in the Peltier element 4 and the cooling jacket 3 so as to penetrate in the vertical direction. A recess 96 is provided at the lower end of the screw through hole 95 of the cooling jacket 3. The screw 9 is passed from the recess 92 of the upper plate 5 to the screw through holes 93, 94, 95. The screw head 90 fits into the recess 92 of the upper plate 5. The male screw portion 97 at the tip of the screw 9 appears in the recess 96. The nut 98 is screwed into the male screw portion 97 and the screw 9 is tightened.

As a result, the Peltier element 4 and the cooling jacket 3 are fixed to the upper plate 5. The contact pressure between the Peltier element 4 and the upper plate 5 can be adjusted by the amount of screwing. A round head screw is used here, but a countersunk screw can also be used. Since the Peltier element 4 has a relatively short life, it is necessary to replace it as appropriate. The cooling jacket 3 and the Peltier element 4 can be removed from the upper plate 5 simply by removing the screw 9. The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Example 3 (fixed with screws: FIG. 6)]
Other means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 6 shows a sectional view of the fixing structure. There are a plurality of (M) cooling jackets 3 and Peltier elements 4, but only one is shown because the same fixing means is used.
The

A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. The Peltier element 4 is provided with a screw through hole 94 so as to penetrate in the vertical direction. The cooling jacket 3 has a female screw hole 99 that extends from the top to the middle. The screw 9 is passed from the recess 92 of the upper plate 5 to the screw through holes 93 and 94 and the female screw hole 99. The screw head 90 fits into the recess 92 of the upper plate 5. The male screw portion 97 at the tip of the screw 9 is screwed into the female screw hole 99 of the cooling jacket 3. By tightening the screw 9, the Peltier element 4 and the cooling jacket 3 are fixed to the upper plate 5. The contact pressure between the Peltier element 4 and the upper plate 5 can be adjusted by the amount of screwing. A round head screw is used here, but a countersunk screw can also be used. The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Example 4 (fixed with screws and aluminum plate: Fig. 7)]
Other means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 7 shows a sectional view of the fixing structure. There are a plurality of (M) cooling jackets 3 and Peltier elements 4, but only one is shown because the same fixing means is used.

A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. Screw holes 94 and 95 are formed in the Peltier element 4 and the cooling jacket 3 so as to penetrate in the vertical direction. An aluminum plate 76 having the same dimensions as the cooling jacket 3 is prepared. A screw hole 77 is formed in the aluminum plate 76. The Peltier element 4, the cooling jacket 3, and the aluminum plate 76 are stacked one above the other. The screw 9 is passed from the recess 92 of the upper plate 5 to the screw through hole 93, the screw through hole 94 of the Peltier element, and the screw through hole 95 of the cooling jacket. The male screw portion 97 at the tip of the screw 9 is screwed into the screw hole 77 of the aluminum plate 76. The screw head 90 fits into the recess 92 of the upper plate 5. Tighten the screw 9. As a result, the Peltier element 4, the cooling jacket 3, and the aluminum plate 76 are fixed to the upper plate 5. The contact pressure between the Peltier element 4 and the upper plate 5 can be adjusted by the amount of screwing. A round head screw is used here, but a countersunk screw can also be used. Since the aluminum plate 76 has good heat conduction, it improves the uniformity of the temperature distribution of the cooling jacket 3. The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Example 5 (fixed with screw and aluminum plate: FIG. 8)]
Other means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 8 shows a sectional view of the fixing structure. There are a plurality of (M) cooling jackets 3 and Peltier elements 4, but only one is shown because the same fixing means is used.

  A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. The Peltier element 4 and the cooling jacket 3 do not have a vertical hole. The bottom surface of the Peltier element 4 and the top surface of the cooling jacket 3 are fixed with an adhesive. An aluminum plate 78 having substantially the same extent as the Peltier element 4 is prepared. A female screw hole 79 is formed in the aluminum plate 78 in the vertical direction. The lower surface of the aluminum plate 78 and the upper surface of the Peltier element 4 are fixed with an adhesive. Or it unites with an adhesive sheet. The short countersunk screw 91 is passed from the recess 92 of the upper plate 5 to the screw through hole 93 and the female screw hole 79 of the aluminum plate 78. The screw head 90 fits into the recess 92 of the upper plate 5. The male screw portion 97 of the countersunk screw 91 is screwed into the female screw hole 79 of the aluminum plate 78. Tighten the countersunk screw 91.

Thereby, the aluminum plate 78 is fixed to the upper plate 5. Since the Peltier element 4 and the cooling jacket 3 are bonded to the aluminum plate 78, the aluminum plate 78, the Peltier element 4 and the cooling jacket 3 are fixed to the upper plate 5. Since aluminum is excellent in heat conduction, it improves the uniformity of the temperature distribution of the upper plate 5.
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Example 6 (A rubber spacer is inserted to absorb stress: FIG. 9)]
Other means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 9 shows a sectional view of the fixing structure.

  A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. Screw holes 94 and 95 are formed in the Peltier element 4 and the cooling jacket 3 so as to penetrate in the vertical direction. A recess 96 is provided at the lower end of the screw through hole 95 of the cooling jacket 3. The screw 9 is passed from the recess 93 of the upper plate 5 to the screw through hole 93, the screw through hole 94 of the Peltier element, and the screw through hole 95 of the cooling jacket. The screw head 90 fits into the recess 92 of the upper plate 5. The male screw portion 97 at the tip of the screw 9 appears in the recess 96. A ring-shaped rubber spacer 80 is inserted into the male screw portion 97. The nut 98 is screwed into the male screw portion 97 and the screw 9 is tightened.

As a result, the Peltier element 4 and the cooling jacket 3 are fixed to the upper plate 5. Since the rubber spacer 80 is inserted between the end surfaces of the nut 98 and the recess 96, the rubber acts to relieve stress. The stress applied to the Peltier element 4 can be reduced. Although a countersunk screw is used here, a round head screw can also be used. The Peltier element 4 may be deteriorated by an excessive tightening force. By inserting a rubber spacer, the pressure is relieved and the Peltier element 4 is protected. The surface pressure applied to the Peltier element is preferably suppressed to 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Example 7 (a rubber sheet is sandwiched to absorb stress: FIG. 10)]
Other means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 10 shows a sectional view of the fixing structure.
A heat insulating sheet 82 made of rubber or the like having a lateral dimension substantially equal to that of the cooling jacket 3 is prepared. The heat insulating sheet 82 is formed with a screw through hole 84 at a portion through which the screw 9 is to pass. A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. Screw holes 94 and 95 are formed in the Peltier element 4 and the cooling jacket 3 so as to penetrate in the vertical direction. The heat insulating sheet 82, the cooling jacket 3, and the Peltier element 4 are stacked and placed along the back surface of the upper plate 5.

  It passes through the recess 92 of the upper plate 5, the screw through hole 93, the screw through hole 94 of the Peltier element, the screw through hole 95 of the cooling jacket, and the screw through hole 84 of the heat insulating sheet 82. The screw head 90 fits into the recess 92 of the upper plate 5. The male screw portion 97 at the tip of the screw 9 appears outside the screw through hole 84 of the heat insulating sheet 82. The nut 98 is screwed into the male screw portion 97 and the screw 9 is tightened. The Peltier element 4, the cooling jacket 3, and the heat insulating sheet 82 are fixed to the upper plate 5.

Since the rubber heat insulating sheet 82 is inserted between the nut 98 and the end face of the cooling jacket 3, the heat insulating sheet 82 relieves stress. The stress applied to the Peltier element 4 can be reduced. Although a countersunk screw is used here, a round head screw can also be used. The Peltier element 4 may be deteriorated by an excessive tightening force. The Peltier element 4 is protected by inserting a heat insulating sheet 82 made of rubber. The pressure applied to the Peltier element is preferably 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less. In the case of cooling, there is an advantage that the cooling jacket 3 is hardly heated by the ambient atmosphere due to the heat insulating sheet 82.

[Example 8 (overtightening prevention collar: FIG. 11)]
Other means for fixing the cooling jacket 3 and the Peltier element 4 to the upper plate 5 will be described. FIG. 11 shows a sectional view of the fixing structure.

A cylindrical overtightening collar 83 that is shorter than the total thickness of the Peltier element 4, the cooling jacket 3, the heat insulating sheet 82, and the aluminum plate 89 is prepared. The overtightening prevention collar has a cylindrical shape whose overall length is shorter than the total thickness of the parts fastened to the upper plate. A recess 92 is formed on the upper surface of the upper plate 5. A screw through hole 93 is formed so as to penetrate the upper plate 5 in the vertical direction. The Peltier element 4, the cooling jacket 3, the heat insulating sheet 82, and the aluminum plate 89 are provided with screw through holes 94, 95, 84, 100 so as to penetrate in the vertical direction. The cooling jacket 3, the Peltier element 4, the heat insulating sheet 82, and the aluminum plate 89 are stacked and are placed along the back surface of the upper plate 5. The overtightening prevention collar 83 and the screw 9 are integrated, and the concave portion 93 of the upper plate 5, the screw through hole 93, the screw through hole 94 of the Peltier element, the screw through hole 95 of the cooling jacket, the screw through hole 84 of the heat insulating sheet, the aluminum plate Through the screw through hole 100. The screw head 90 fits into the recess 92 of the upper plate 5. The male screw portion 97 at the tip of the screw 9 appears outside the screw through hole 100 of the aluminum plate 89. The nut 98 is screwed into the male screw portion 97 and the screw 9 is tightened. The Peltier element 4, the cooling jacket 3, the heat insulating sheet 82, and the aluminum plate 89 are fixed to the upper plate 5. When it comes into contact with the lower end of the overtightening prevention collar 83, the nut 98 does not advance further. No great stress is applied to the Peltier element 4. The Peltier element 4 can be protected. The pressure is 3 kg / cm ² or less. The tightening prevention collar 83 can also be applied to the rubber spacer of FIG.

[Embodiment 9 (A stage for board mounting is placed on the upper plate 5: FIGS. 13, 14, and 15)]
A metal stage is placed on the upper plate 5. There are two types according to the mode of the test object. A chip is fixed to a CAN package, lead pins and electrodes are wire bonded, and a large number of optical elements obtained as products are inserted into a socket for testing, and a CAN test, and a wafer chip that is tested as a wafer or in a chip state. With inspection. Here, the stage 52 for CAN inspection will be described. FIG. 13 shows a perspective view of the CAN inspection stage 52. The CAN inspection stage 52 is a metal plate that is substantially the same as the upper plate 5. Several positioning pins 53, 53,... Are planted upward on the upper surface. This is a pin for accurately determining the mounting position of the inspection board. A plurality of board mounting screw holes 54 are formed on the upper surface of the CAN inspection stage 52. Further, the CAN inspection stage 52 has an internal wiring mechanism (not shown) necessary for applying current and voltage to the optical element. This has a fine matrix structure. The wiring mechanism is not described in detail because it is not the object of the present invention.

  The back surface of the CAN inspection stage 52 is fixed on the upper plate 5. As shown in FIG. 13, the cooling jacket 3, the Peltier element 4, the upper plate 5, and the CAN inspection stage 52 are stacked in order from the bottom.

  The inspection board 55 is provided with a matrix structure of internal wiring (not shown) and a large number of inspection sockets 56 for inserting lead pins of the completed optical element 57 to be inspected. The lead pin of the socket 56 is connected to the internal wiring structure. The board wiring is connected to the CAN inspection stage wiring.

  FIG. 14 is a longitudinal sectional view showing a state in which the inspection board 55 is mounted on the CAN inspection stage 52 and coupled. FIG. 15 is a plan view showing a state in which the inspection board 55 is mounted on the CAN inspection stage 52 and coupled. The upper plate 5 is fixed on the base 8 by the support 19. A plurality of sets of Peltier elements 4 and a cooling jacket 3 are suspended from the lower surface of the upper plate 5. Below the cooling jacket 3 is a space. A CAN inspection stage 52 is mounted on the upper plate 5. An inspection board 55 is overlaid on the CAN inspection stage 52.

The inspection board 55 has a through hole 66 and a positioning hole 72 corresponding to the CAN inspection stage 52. Positioning is performed by inserting the positioning pins 53 of the inspection stage 52 into the positioning holes 72 of the inspection board 55. A set screw 65 is inserted from above the through hole 66 of the inspection board 55 and screwed into the board mounting screw hole 54 to be screwed.
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

A large number of wires come out from the leads of the inspection socket 56 and are connected to a test electric circuit outside the board. As a result, in the case of a semiconductor laser, a drive current is passed to emit light. In the case of a light receiving element, a reverse bias voltage is applied and the photocurrent generated by applying test light is measured.
The sizes of the CAN inspection stage 52 and the inspection board 55 are limited by the size and number of the Peltier elements 4. The number of inspection sockets 56 is, for example, about 100 to 300. This is used to test the finished optical device.

[Example 10 (wafer-inspection stage placed on top plate 5: FIGS. 16, 17, and 18)]
A metal stage is placed on the upper plate 5. FIG. 16 shows a wafer-inspection stage 58 for testing the wafer as it is.

  The wafer-inspection stage 58 is a metal plate that is substantially the same as the upper plate 5. Several vacuum holes 59, 59... Open upward on the upper surface.

  A horizontal vacuum path 60 following the vacuum suction holes 59, 59,... Is drilled inside the wafer-inspection stage 58. As shown in the cross-sectional view of FIG. 17, this is a continuous air flow path within the wafer-inspection stage 58. There is a vacuum path outlet 61 at the end face of the stage 58. As shown in FIG. 18, the vacuum path 60 from the vacuum path outlet 61 is connected to an external vacuuming pipe 62. When a wafer or chip is placed on the vacuum pulling hole 59 and the vacuum path 60 is evacuated, the back surface of the wafer or chip is sucked and fixed at that position.

  FIG. 18 shows a state in which a wafer 63 that has not yet been separated after fabrication of the device is placed on the wafer-inspection stage 58 and vacuum suction is performed. Air is sucked through the evacuation pipe 62 so that the vacuum path 60 is set to a negative pressure and the wafer 63 is sucked. An inspection mechanism such as a probe (not shown), a light-emitting element, a light-receiving element, etc. for applying a voltage / current in contact with an electrode portion of a device inside the wafer is provided up and down. The probe descends and the electrode of the device portion to be tested is held down to ensure electrical conduction, and a light emission test and a light reception test are performed. Test each device and move the probe and inspection mechanism sequentially. Alternatively, a plurality of devices may be collectively tested. The temperature is set by changing the temperature and flow rate of the refrigerant in the cooling jacket 3, the current flowing in the forward and reverse directions of the Peltier element, and the like.

The temperature of the stage 58 is constantly measured with a thermocouple or the like. Since the plurality of Peltier elements 4 are used in parallel, the area of the upper plate 5 and the stage 58 can be increased. Even if the wafer on which the device is manufactured is large, it can be efficiently inspected. Since the Peltier element 4 and the cooling jacket 3 are structured to be suspended from the upper plate 5, the contact state between the Peltier element 4 and the upper plate 5 can be made the same even if the thickness of the plurality of Peltier elements varies. .
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Embodiment 11 (Chip inspection stage 58 'is placed on the upper plate 5: FIG. 19)]
In order to inspect the optical element in a chip state, a metal chip inspection stage 58 ′ is placed on the upper plate 5. The chip stage 58 ′ has a structure very similar to the wafer-inspection stage 58. A vacuum pulling hole 59 as shown in FIGS. Since the chip is targeted, more vacuum drawing holes 59 that are denser and finer than the wafer inspection stage 58 are provided on the upper surface.

  A horizontal vacuum path 60 following the evacuation holes 59, 59,... Is drilled inside the chip inspection stage 58 ′. As shown in the sectional view of FIG. 17, the air flow passage is continuous inside the stage 58 ′. There is a vacuum path outlet 61 at the end face of the stage 58 '.

  The vacuum path 60 is connected to an external vacuuming pipe 62 from the vacuum path outlet 61. When the chips 64, 64,... Are placed on the vacuum pulling hole 59 and the vacuum path 60 is evacuated, the back surface of the chip 64 is sucked and fixed at that position.

  FIG. 19 shows a state in which the chips 64, 64,... After the optical element device is fabricated on the wafer and the chips are separated are placed on the chip inspection stage 58 'and vacuum suctioned. The vacuum path 60 is connected to an external vacuuming pipe 62 from the vacuum path outlet 61. When the vacuum path 60 is evacuated, the back surface of the chip 64 is sucked and fixed at that position.

A probe (not shown) for applying voltage / current by contacting the electrode portion of the device chip and an inspection mechanism such as a light emitting element and a light receiving element are provided so as to be movable up and down. The probe descends and the electrode of the chip to be tested is held down to ensure continuity, and the light emission test and the light reception test are performed. Each device chip is tested sequentially, and the probe and inspection mechanism are moved sequentially. Alternatively, a plurality of devices may be collectively tested. The temperature is set by changing the temperature and flow rate of the refrigerant in the cooling jacket 3, the current flowing in the forward and reverse directions of the Peltier element, and the like. The temperature of the stage 58 'is constantly measured with a thermocouple or the like. Since the plurality of Peltier elements 4 are used in parallel, the area of the upper plate 5 and the stage 58 'can be increased. A large number of device chips can be efficiently inspected collectively. Since the Peltier element 4 and the cooling jacket 3 are suspended from the upper plate 5, the contact state between the Peltier element 4 and the upper plate 5 can be made the same even if the thickness of the plurality of Peltier elements varies. .
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Example 12 (the enclosure structure is formed on the upper plate 5: FIG. 20)]
The upper plate 5 has so far been a flat metal plate. In the twelfth embodiment, the metal wall is extended upward from the four edges of the upper plate 5 to form side walls in the four directions. FIG. 20 shows a cross-sectional view thereof. The structure in which the Peltier element 4 and the cooling jacket 3 are suspended under the upper plate 5 is the same as the conventional structure. Here, a metal raised portion is formed at the end of the upper plate 5 to form the side wall 50. Inspection stages 52, 58, 58 ′ and the like are placed on the upper plate 5 surrounded by the side wall 50. These stages are surrounded by ambient gas having a low temperature and a low dew point, which is surrounded and supplied by the side walls. The height of the side wall is about 10 mm to 50 mm depending on the purpose. An enclosure structure is formed by the side wall extending upward. Air containing no moisture near the inspection temperature is supplied here.

Thereby, a temperature control space 70 filled with air having a low dew point at substantially the same temperature as the device to be inspected is formed immediately above the stage. Especially in the case of inspection at low temperature, when the device is cooled by the action of the cooling jacket 3 and the Peltier element 4, if the surrounding air is air with a high dew point containing a large amount of water, the water condenses on the device and the inspection is performed. May interfere. Therefore, the surroundings of the upper plate 5 are extended upward to form a surrounding structure, and air with a low dew point is filled here to form a temperature control space 70 to prevent moisture condensation on the device, the probe and the like. The temperature gradient is reduced and it becomes close to an equilibrium state, and condensation can be prevented.
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Embodiment 13 (formation of enclosure structure having temperature control air passage on upper plate 5: FIGS. 21 and 22)]
In Example 13, the temperature adjusting air was circulated by making the inside of the side wall forming the enclosure structure hollow. FIG. 21 shows a longitudinal sectional view, and FIG. 22 shows a transverse plan view. The structure in which the Peltier element 4 and the cooling jacket 3 are suspended under the upper plate 5 is the same as the conventional structure. Here, the inter-side walls 51 including metal cavities are formed around the upper plate 5. A CAN inspection stage 52, a wafer, and chip inspection stages 58 and 58 'are placed on the upper plate 5 surrounded by the side tube wall 51. These stages 52 and 58 are surrounded by the side tube wall 51 on all sides. The height of the side wall is about 30 mm to 70 mm depending on the purpose. An enclosure structure is formed by the side wall extending upward. The temperature adjusting air 74 having a temperature close to the inspection temperature and having a low dew point is introduced from the temperature adjusting air inlet 68 into the side tube wall 51.

The temperature adjustment air 74 circulates in the temperature adjustment air passage 67 to bring the side tube wall 51 to a temperature suitable for inspection. Furthermore, it flows out from the temperature control air outlet 69 to the part surrounded by the side tube wall 51. Here, there are stages 52, 58 holding a large number of optical elements 73,. Here, the inspection board 55 to which a large number of completed optical elements 73, 73... Are fixed is shown. A temperature control space 70 filled with air having a low dew point at substantially the same temperature as the inspection temperature is formed immediately above the stage. The optical element 73, the stage 52, the inspection board 55, and the upper plate 5 have substantially the same temperature and the atmosphere has substantially the same temperature. This is particularly useful when testing at low temperatures. A surrounding structure is formed by extending the periphery of the upper plate 5 upward, filling the temperature-controlled air 74 with a low dew point therein, and forming the temperature-controlled space 70 in which the side tube wall 51 is also at substantially the same temperature. It becomes closer to a thermal equilibrium state and can more effectively prevent condensation. Prevent moisture condensation on devices, probes, etc.
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

[Embodiment 14 (Forming a refrigerant passage in the base: FIG. 23)]
Since there are a plurality of cooling jackets 3, 3 ..., there are a plurality of refrigerant supply pipes and discharge pipes. A rubber hose can be connected to the end of the supply passage 6 and the discharge passage 7 of each cooling jacket. For example, if there are four sets of cooling jackets and Peltier elements, it is possible to supply and discharge the refrigerant with eight rubber hoses. Even so, it is possible to devise a technique for more efficiently circulating the refrigerant by using the base 8 here. This is shown in FIG.
The pressure applied to the Peltier element was 3 kg / cm ² (0.4 MPa including atmospheric pressure) or less.

  A drainage pipe 23 is connected to the end of the discharge passage 7 of the cooling jacket 3, 3. A drainage passage 85 is drilled horizontally in the base 8. The drainage pipe 23 is connected to the drainage path 85 via the lower joint 26. The drainage passage 85 is branched internally by the number equal to the number of Peltier element / cooling jacket pairs. It is integrated and connected to the drainage outlet 86 at once. It is discharged from here to an external hose. A liquid supply path 87 is formed in the base 8 horizontally. The liquid supply path 87 is branched internally by an amount equal to the number of Peltier element / cooling jacket pairs. These are integrated and collectively connected to the liquid supply inlet 88. The liquid is supplied from an external hose here. Since the height is different, the drainage path 85 and the liquid supply path 87 are separated.

  The liquid supply path 87 is connected to the vertical liquid supply pipe 22 (FIG. 4) via a joint (not shown). The liquid supply pipe 22 is connected to the supply passage 6 of the cooling jacket through a joint (not shown). As for the liquid supply, it passes from the external hose through the liquid supply inlet 88 and enters the liquid supply path 87 inside the base 8 and branches from the upward liquid supply pipe 22 to the supply path 6 of the cooling jacket. Heat is exchanged with the cooling jacket through the refrigerant passage 2. The discharge side passes from the discharge passage 7 through the drainage pipe 23 to the external hose through the drainage passage 85 of the base 8 through the drainage outlet 86.

  The upper joint 25 and the lower joint 26 include a combination of an L-shaped pipe and a vertical straight pipe. An O-ring is also inserted to prevent leakage. Even if the vertical height of the cooling jacket is different, it can be freely adjusted by changing the coupling length of the vertical straight pipe and L-shaped pipe.

  In this way, only one external hose is required for liquid supply and one for drainage. By using the base 8, the refrigerant flow path is arranged. The base 8 can be made of resin. If it is resin, a flow path can be shape | molded easily. However, it may be a metal base.

Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

The schematic longitudinal cross-sectional view of the temperature characteristic test | inspection apparatus which concerns on the prior art example which provided the cooling jacket which has a refrigerant path on a certain stand, and set | placed the Peltier element on it and put the heat equalizing plate on it.

In order to increase the number of elements that can be inspected at one time, a wide soaking plate is used, a cooling jacket with a refrigerant path is installed on some table, a plurality of Peltier elements are placed on it, and a soaking plate is placed on it. The longitudinal cross-sectional view which shows that a clearance gap may arise between a soaking | uniform-heating board and a Peltier element in the case of the structure to assume.

A wide upper plate is used to increase the number of elements that can be inspected at one time. The wide upper plate is suspended on a base by a support column, and a set of multiple Peltier elements and cooling jackets are fixed to the back of a metal upper plate. FIG. 2 is a longitudinal sectional view showing a basic configuration of the present invention in which a back surface of the Peltier element is not provided with a gap between the Peltier element and the upper plate as a space.

A wide upper plate is used to increase the number of elements that can be inspected at one time. The wide upper plate is suspended on a base by a support column, and a set of multiple Peltier elements and cooling jackets are fixed to the back of a metal upper plate. FIG. 3 is a cross-sectional plan view showing the basic configuration of the present invention in which the back surface of the Peltier element is not formed as a space between the Peltier element and the upper plate.

The upper plate, Peltier element, and cooling jacket are provided with threaded holes in the vertical direction, and the screw is passed through the threaded hole from above, and the nut is screwed on the back of the cooling jacket, and the set of the cooling jacket and Peltier element is raised by the screw. The longitudinal cross-sectional view which shows Example 2 of this invention made to adhere to a board. There are several Peltier elements and cooling jackets, but only one is shown.

The upper plate and the Peltier element are provided with screw through holes in the vertical direction, the cooling jacket is provided with female screw holes, the screws are passed through the screw through holes from above the upper plate, and screwed into the female screw holes of the cooling jacket. The longitudinal cross-sectional view which shows Example 3 of this invention which was made to adhere the group of a cooling jacket and a Peltier element to the upper board by FIG. There are several Peltier elements and cooling jackets, but only one is shown.

The upper plate, Peltier element, and cooling jacket are threaded in the vertical direction and overlapped with the aluminum plate with the female screw hole, and the screw is passed through the screw through hole from the upper plate to the female screw hole of the aluminum plate. FIG. 9 is a longitudinal sectional view showing a fourth embodiment of the present invention in which a cooling jacket, a Peltier element, and an aluminum plate are fixed to an upper plate by screwing. There are several Peltier elements, cooling jackets, and aluminum plates, but only one is shown.

Aluminum plate with female screw holes, Peltier element, and cooling jacket are overlaid, and a screw through hole is drilled vertically in the upper plate, and a screw is passed through the screw through hole from above the upper plate, to the female screw hole of the aluminum plate. FIG. 10 is a longitudinal sectional view showing a fifth embodiment of the present invention in which an aluminum plate, a Peltier element, and a cooling jacket are fixed to an upper plate by screwing. There are several Peltier elements, cooling jackets, and aluminum plates, but only one is shown.

Screw holes are provided in the upper plate, Peltier element, and cooling jacket in the vertical direction. Screws are passed through the screw holes from above, and a nut is threaded through a rubber spacer with screw holes on the back of the cooling jacket. The longitudinal cross-sectional view which shows Example 6 of this invention which made the group of a cooling jacket, a Peltier element, and a spacer adhere to an upper board. There are several Peltier element / cooling jacket pairs, but only one is shown.

Screw holes are provided in the upper plate, Peltier element, and cooling jacket, and a heat insulating sheet having screw holes is prepared. The Peltier element, cooling jacket, and heat insulating sheet are stacked vertically, and the screws are passed through the screw holes in the upper plate. FIG. 10 is a longitudinal sectional view showing Example 7 of the present invention in which a nut is screwed outside a heat insulating sheet and a cooling jacket, a Peltier element, and a heat insulating sheet are fixed to an upper plate by screws. There are several sets of Peltier elements, cooling jackets, and insulation sheets, but only one is shown.

Prepare a heat insulating sheet with through holes, vertically provide screw through holes in the upper plate, Peltier element, cooling jacket, and heat insulating sheet, and screw and overtightening collar from the top to the upper plate, Peltier element, cooling jacket, heat insulation Pass through the through hole of the sheet and aluminum plate, screw the nut on the back side of the heat insulation sheet, and fix the combination of the aluminum plate, heat insulation sheet, cooling jacket and Peltier element to the upper plate with screws, and excessive pressure is applied to the Peltier element The longitudinal cross-sectional view which shows Example 8 of this invention made not to hang. There are several Peltier elements, cooling jackets, insulation sheets, and aluminum plates, but only one is shown.

Cooling showing a common structure of the present invention in which four sets of Peltier elements / cooling jackets are fixed to the back surface of one wide upper plate and the heights of the back surfaces of the cooling jackets are different due to variations in Peltier element thickness. The perspective view of a jacket bottom direction.

The perspective view of the upper surface of the CAN inspection stage which has a plurality of positioning pins and a screw hole for board attachment on the upper surface for mounting | inspecting the optical characteristic by mounting | wearing the inspection board which arranged many optical elements mounted in CAN.

Multiple sets of Peltier elements and cooling jackets are suspended on the lower surface of the upper plate fixed by the support on the base, and the CAN inspection stage and the inspection board are overlaid on the upper plate. Is a longitudinal sectional view of Embodiment 9 of the present invention in which is inserted and held in the inspection socket.

The top view of Example 9 of this invention with which the test | inspection board in which many optical elements are inserted and hold | maintained at the test | inspection socket lined up vertically and horizontally is positioned by the positioning pin and the positioning hole, and is fixed on the CAN test | inspection stage.

FIG. 6 is a top perspective view of a wafer-inspection stage in which a plurality of vacuum holes and vacuum paths are formed for fixing and testing a wafer on which a large number of optical element devices are formed without cutting into a chip.

Wafer formed with a plurality of vacuum holes and a vacuum path for testing a wafer on which a plurality of optical element devices are formed without cutting the wafer into a chip. Figure.

A plurality of pairs of Peltier elements and cooling jackets are attached to the back surface of the upper plate held by the support that stands on the base, the wafer-inspection stage is fixed to the top surface, and air is sucked from the vacuum holes. The longitudinal cross-sectional view of Example 10 of this invention which was made to fix the wafer in which the element was formed to the wafer inspection stage.

A plurality of pairs of Peltier elements and cooling jackets are attached to the back surface of the upper plate held by the support that stands on the base, a chip inspection stage is fixed on the top surface, and a plurality of air is sucked from the vacuum holes. The longitudinal cross-sectional view of Example 11 of this invention which was made to fix an optical element chip | tip to a chip | tip inspection stage.

Attach multiple sets of Peltier elements and cooling jackets to the back surface of the upper plate held by the support that stands on the base, and bulge the four sides of the upper plate to form side walls that are close to the test temperature. The longitudinal cross-sectional view of Example 12 of this invention which supplied the air which has temperature and a low dew point, and formed the temperature control space in which the air of test temperature stays above an upper board.

Attach multiple sets of Peltier elements and cooling jackets to the back surface of the upper plate held by the support that stands on the base, and provide side tube walls with cavities around the upper plate to test temperature into the side tube wall A vertical cross section of Example 13 of the present invention, in which air having a low temperature and dew point is supplied and blown above the upper plate to form a temperature control space in which air close to the test temperature stays above the upper plate. Figure.

Side pipe walls with cavities are provided on the four sides of the upper plate, and air with a temperature close to the test temperature is supplied into the side tube wall and a low dew point is blown above the upper plate, and the air is close to the test temperature above the upper plate. The top view of Example 13 of this invention which was made to form the temperature control space which stagnates.

A drainage channel branched into the base and a branched supply channel are drilled. The drainage channels are integrated and connected to the drainage outlet, and the supply channels are integrated and connected to the supply fluid inlet. Is connected to the discharge passage of the cooling jacket through the drainage pipe, and the branched supply pipe is connected to the supply passage of the cooling jacket through the supply pipe and the supply and drainage flow paths are branched by the base. Then, it is connected to individual cooling jackets, and is a longitudinal sectional view of Embodiment 14 of the present invention which is integrated and connected to an external hose.

Explanation of symbols

2 refrigerant passage
3 cooling jacket
4 Peltier element
5 upper plate
6 supply passage
7 passage for discharge
8 units
9 screws
19 props
22 supply pipe
23 drainage pipe
25 upper joint
26 under fitting
29 gaps
31, 32, 33, 34 Cooling jacket
41, 42, 43, 44 Peltier element
50 side walls
51 side pipe wall
52CAN inspection stage
53 locating pin
54 board mounting screw holes
55 inspection board
56 inspection socket
57 Optical element to be inspected
58 wafer inspection stage
58 'chip inspection stage
59 vacuum hole
60 vacuum paths
61 vacuum exit
62 vacuum piping
63 device wafer
64 device chips
65 set screw
66 through holes
67 temperature controlled air passage
68 temperature controlled air inlet
69 temperature controlled air outlet
70 temperature control space
72 positioning holes
74 temperature controlled air
76 aluminum plate
77 screw holes
78 aluminum plate
79 female screw holes
80 rubber spacer
82 heat insulation sheet
83 Overtightening prevention collar
84 screw through hole
85 drainage channel
86 drainage outlet
87 supply lines
88 liquid supply inlet 89 aluminum plate 90 screw head
91 countersunk screw
92 recesses
93 screw through hole
94 screw through hole
95 screw through hole
96 recesses
97 male screw
98 nut
99 female screw holes
100 aluminum plate screw holes

Claims (18)

Multiple sets of Peltier elements and cooling jackets are connected up and down and fixed to the back of one metal upper plate that has an area larger than the area of multiple Peltier elements. The upper plate is supported by a support on the base and cooled. The jacket has a space at the bottom, a cooling passage is provided in the cooling jacket, an appropriate temperature of refrigerant is circulated through the cooling jacket, current is passed through the Peltier element in the reverse direction, and the temperature is increased by the refrigerant temperature, flow rate and Peltier element current. The temperature of the plate is regulated, and a stage in which a plurality of optical elements are placed on the upper plate or a wafer in which the optical elements are formed, and a stage in which chips are mounted are placed on the optical element at a predetermined temperature to inspect the characteristics. An optical element temperature characteristic inspection apparatus characterized in that it is configured as described above. 2. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the upper plate is made of copper or a copper alloy and is subjected to gold plating or nickel plating surface treatment. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the support for holding the upper plate with respect to the base is resin. 4. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the Peltier element and the cooling jacket are integrated and suspended on the back surface of the upper plate. The upper plate, Peltier element, and cooling jacket are drilled with vertical screw holes, passed through the Peltier element from above the upper plate, the screw is passed through the back of the cooling jacket, and the nut is screwed into the screw. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the optical element temperature characteristic inspection apparatus is fixed. The upper plate, Peltier element with a threaded hole in the vertical direction, the cooling jacket with a female threaded hole, the screw threaded through the female threaded hole of the cooling jacket from above the upper plate and screwed into the upper plate, Peltier element, 4. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the cooling jacket is fixed. The upper plate, Peltier element, and cooling jacket are drilled with vertical screw holes, and an aluminum plate with a female screw hole is applied to the bottom of the cooling jacket, and the screw is passed through the top plate to the back of the Peltier element and cooling jacket. 4. The optical element temperature characteristic inspection according to claim 1, wherein a Peltier element, a cooling jacket, and an aluminum plate are fixed to an upper plate by being screwed into a female screw hole of the plate. apparatus. A screw through hole is drilled in the upper plate, the upper surface of the cooling jacket is bonded to the lower surface of the Peltier element, an aluminum plate having a female screw hole is joined on the Peltier element, and the Peltier element and the cooling jacket are integrated. 5. The optical element temperature characteristic inspection device according to claim 4, wherein the optical element temperature characteristic inspection apparatus is suspended and fixed to the back surface of the upper plate by passing a screw from above and screwing into a female screw hole of the aluminum plate. Drill a vertical screw hole in the upper plate, Peltier element, and cooling jacket, pass the Peltier element from the upper plate, pass the screw to the back of the cooling jacket, pass the rubber spacer through the screw, and screw the nut into the screw. 4. The optical element temperature characteristic inspection apparatus according to claim 1, wherein a Peltier element and a cooling jacket are fixed to the upper plate so as to relieve the pressure applied to the Peltier element. Prepare a heat insulation sheet, drill vertical screw holes in the top plate, Peltier element, cooling jacket, heat insulation sheet, and aluminum plate, and pass from the top plate to the back of the aluminum plate through the Peltier element, cooling jacket, and heat insulation sheet. 4. A screw is passed through the nut, the nut is screwed into the screw, and a Peltier element, a cooling jacket, a heat insulating sheet, and an aluminum plate are fixed to the upper plate to relieve pressure applied to the Peltier element. The optical element temperature characteristic inspection apparatus according to any one of the above. 11. The optical element temperature characteristic inspection apparatus according to claim 9, wherein an overtightening preventing collar is provided around the screw, and the collar is a cylinder whose overall length is shorter than a total thickness of components fastened to the upper plate. An optical element temperature characteristic inspection device characterized by having a shape. A CAN inspection stage with a plurality of positioning pins and a plurality of board mounting screw holes on the upper surface and having a wiring structure inside is placed on the upper plate, and a CAN inspection is performed on an inspection board having an internal wiring structure and a plurality of optical elements attached thereto. It is positioned on the stage, connected to the wiring, the inspection board is fixed to the CAN inspection stage with screws, and the characteristics of the optical element are inspected with the temperature of the optical element as a predetermined temperature. The optical element temperature characteristic inspection apparatus according to claim 1. A wafer having a plurality of vacuum holes formed on the upper surface thereof is placed on an upper plate, a wafer on which a plurality of optical elements are formed is placed on the wafer inspection stage, and vacuum suction is performed. 2. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the characteristic of the optical element formed on the wafer is inspected at a predetermined temperature. A chip inspection stage having a plurality of vacuum holes on the upper surface is placed on the upper plate, a plurality of optical element chips are placed on the chip inspection stage, and vacuum suction is performed to set the chip temperature to a predetermined temperature. 2. The optical element temperature characteristic inspection apparatus according to claim 1, wherein the characteristic of the optical element chip is inspected. A side wall is formed by extending the four edges of the upper plate 5 upward to form an enclosure structure above the upper plate, and air having a low dew point is supplied to the enclosure structure at a temperature suitable for inspection. 2. The optical element temperature characteristic inspection apparatus according to claim 1, wherein a temperature control space filled with air having a low dew point at substantially the same temperature as the optical element to be inspected is formed. A temperature suitable for inspection by forming a side pipe wall having a temperature adjusting air passage and a temperature adjusting air outlet and a temperature adjusting air inlet at the four edges of the upper plate 5 and forming a surrounding structure above the upper plate. By supplying air with a low dew point to the enclosure structure via the temperature control air inlet, temperature control air passage, and temperature control air outlet, the upper plate is filled with air with a low dew point at almost the same temperature as the optical device under test. The optical element temperature characteristic inspection apparatus according to claim 1, wherein a temperature control space is formed. A drainage path and a supply path that branch into the base are provided, and a drainage outlet and a supply inlet that integrate the drainage path and the supply path are opened at the end of the base. An external hose is connected to the liquid supply inlet, the discharge path of the cooling jacket and the drainage path of the base are connected by a vertical drainage pipe via the upper and lower joints, and the supply path of the cooling jacket and the supply of the base are connected. The liquid passages are connected by a vertical liquid supply pipe via a joint, the refrigerant is supplied from one external hose, separated by the base and supplied to each cooling jacket, and the drainage from the cooling jacket gathers at the base The optical element temperature characteristic inspection apparatus according to claim 1, wherein the optical element temperature characteristic inspection apparatus is discharged to one external hose. 18. The optical element temperature characteristic inspection apparatus according to claim 17, wherein a difference in height in the vertical direction of the cooling jacket is absorbed by changing a coupling length of the liquid supply pipe and the drain pipe at the upper and lower joints. .

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