JP2009075712A - IC label for forgery prevention - Google Patents

Abstract

An object of the present invention is to provide a high-accuracy authenticity by having an antenna that is destroyed and cannot be reused when the non-contact IC inlet portion built in the label is peeled off and has a high security function. It is an object of the present invention to provide an anti-counterfeit IC label having a label substrate that can be determined.
An adhesive that adheres to at least a label substrate (1), a non-contact IC inlet portion (11) comprising an antenna (6) and an IC chip (4) for receiving electromagnetic waves, and an adherend (21). In the anti-counterfeit IC label provided with the layer (7), the antenna (6) of the non-contact IC inlet portion (11) has a release layer (16) on one surface of the label substrate (1). The anti-counterfeit IC label is provided with an adhesive layer (7) provided so as to cover the releasable layer (16) and the antenna (6).
[Selection] Figure 1

Description

  The present invention relates to an anti-counterfeit IC label that is used by being attached to a product or its package, and relates to a technique for preventing forgery / alteration due to non-contact IC inlet portions and label replacement.

  In recent years, for items that are difficult to forge, such as relatively expensive products such as high-class liquor and consumables for electrical appliances, a label is attached to the product itself or a case that wraps it to determine its authenticity. Is being pasted.

  In view of this, a seal label or the like having a forgery prevention function by mounting a non-contact IC inlet portion having a high security function has been proposed (for example, see Patent Document 1). In particular, by embedding an IC chip in which unique identification information is stored, individual discrimination becomes possible.

Prior art documents are shown below.
JP 2003-150924 A

  However, since the antenna used for the non-contact IC inlet portion as described above is usually provided by etching aluminum or copper on a tough substrate such as polyimide, polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), It is difficult to destroy the antenna, and the non-contact IC inlet portion can be taken out and used easily.

  On the other hand, since the sealing label as described above can be easily forged by means of color copying or the like, only the non-contact IC inlet portion is removed from the sealing label attached to the regular article. There is a problem that the non-contact IC inlet portion can be easily reused by sticking the removed non-contact IC inlet portion to the removed and forged seal label. As a result, the accuracy of authenticity determination is reduced.

  The present invention is intended to solve such problems of the prior art, and has an antenna that cannot be reused if it is intended to peel off the non-contact IC inlet portion built in the label. Another object of the present invention is to provide an anti-counterfeit IC label having a label base material that can be used for highly accurate authentication by having a high security function.

  The present invention has been made to solve the above-mentioned problems. The invention according to claim 1 of the present invention includes at least a label substrate (1), an antenna (6) for receiving electromagnetic waves, and an IC. In the anti-counterfeit IC label provided with a non-contact IC inlet portion (11) made of a chip (4) and an adhesive layer (7) bonded to the adherend (21), the non-contact IC inlet portion (11 ) Antenna (6) is provided on one surface of the label substrate (1) via a releasable layer (16), and further covers the releasable layer (16) and the antenna (6). An anti-counterfeit IC label provided with an adhesive layer (7).

  The invention according to claim 2 of the present invention is the IC label for anti-counterfeiting according to claim 1, wherein the IC chip (4) has an anisotropic conductive paste (ACP) and a foreign material at a predetermined position of the antenna (6). An anti-counterfeiting IC label characterized by being bonded and provided by any one of an anisotropic conductive film (ACF), a non-conductive paste (NCP), and an ultrasonic wave (USB).

  The invention according to claim 3 of the present invention is the IC label for forgery prevention according to claim 1 or 2, wherein the antenna (6) is made of any one of silver, copper, nickel, conductive carbon, and metal particles. An anti-counterfeit IC label formed of a conductive paste dispersed in a resin binder.

  The invention according to claim 4 of the present invention is characterized in that in the IC label for forgery prevention according to any one of claims 1 to 3, the label base material (1) is made of a material having easy breakability. This is an anti-counterfeit IC label.

  The invention according to claim 5 of the present invention is the anti-counterfeit IC label according to any one of claims 1 to 4, wherein at least a part of the label base material (1) is provided with slits and cuts. This is an IC label for preventing forgery.

  The invention according to claim 6 of the present invention is the anti-counterfeit IC label according to any one of claims 1 to 5, wherein the label base material (1) is peeled away from the surface opposite to the antenna (6) adhesive surface. An anti-counterfeiting IC label comprising either a solvent coloring layer (2) that dissolves in a solvent or a solvent coloring layer (2) that chemically reacts with the peeling solvent.

  The invention according to claim 7 of the present invention is the anti-counterfeit IC label according to claim 6, wherein a printed layer (3 of marks, characters, patterns, etc.) is formed on the solvent coloring layer (2) of the label substrate (1). ) Is provided for preventing forgery.

  The invention according to claim 8 of the present invention is the anti-counterfeit IC label according to any one of claims 1 to 7, wherein the adhesive layer (7) has an adhesive strength of 8000 mN / 25 mm to 30000 mN / JIS according to JIS Z0237. It is an IC label for forgery prevention characterized by being 25 mm or less.

  The invention according to claim 9 of the present invention is the IC label for forgery prevention according to any one of claims 1 to 8, wherein a unique ID is stored in the IC chip (4), and the identification information is individually stored. This is a forgery-preventing IC label characterized by a unique value in the IC chip.

  The invention according to claim 10 of the present invention is the forgery prevention IC label according to claim 9, wherein the identification information is associated with management information for managing the adherend (21). IC label for prevention.

  The invention according to claim 11 of the present invention is the anti-counterfeit IC label according to any one of claims 1 to 10, wherein the IC chip (4) has a read-only memory, and the identification. An anti-counterfeit IC label characterized in that information is stored in the read-only memory.

  The invention according to claim 12 of the present invention is the IC label for forgery prevention according to any one of claims 7 to 11, wherein at least part of the label base material (1) on the printed layer (3) is visually observed. Or an anti-counterfeit IC label characterized in that a machine-detectable security function layer (8) is provided.

  The invention according to claim 13 of the present invention is the IC label for forgery prevention according to claim 12, wherein the security function layer (8) includes the security function layer (8), the incident light source, and the position of the observer's viewpoint. OVD functional materials whose color tone changes depending on the relationship, or fluorescent materials or phosphorescent materials that excite with electromagnetic waves of specific wavelengths and return electromagnetic waves of different wavelengths, or have specific patterns to provide polarization, and extract specific polarized light The anti-counterfeit IC label is formed of at least one of liquid crystal materials to be patterned.

  The invention according to claim 14 of the present invention is the anti-counterfeit IC label according to any one of claims 9 to 13, wherein the label base material (1) has at least a partial region on the printed layer (3). An anti-counterfeit IC comprising a numbering printing section (10) having optically readable optical identification information, wherein at least a part of the identification information and the optical identification information is associated with each other. It is a label.

  The invention according to claim 15 of the present invention is the IC label for forgery prevention according to claim 14, wherein the security function layer (8) and the numbering printing part (10) are printed on the label base material (1). The anti-counterfeit IC label is formed in at least a partial region of the same surface on the layer (3).

  According to the present invention, the antenna constituting the non-contact IC inlet portion built in the label is made of a printed layer of a conductive paste, and the label base material is made easily destructible, so that it becomes a fragile antenna. Therefore, if the non-contact IC inlet portion is intentionally peeled off to be replaced, the antenna is destroyed or peeled off, and illegal use by replacement or the like can be made impossible. At the same time, by providing a security functional layer for preventing duplication on the label base material, unauthorized use due to the reuse of the label can be made impossible. Further, providing the numbering printing portion on the same plane helps to prevent photographic copying.

  Embodiments of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is an explanatory view showing an embodiment of an anti-counterfeit IC label according to the present invention, and is a side sectional view together with a release sheet. FIG. 2 is an embodiment of an anti-counterfeit IC label according to the present invention. FIG. 3 is an explanatory view showing another embodiment of the anti-counterfeit IC label according to the present invention, and is a side sectional view shown together with a release sheet. FIG. 4 is according to the present invention. FIG. 5 is a plan view for explaining another embodiment of an anti-counterfeit IC label, and FIG. 5 is a diagram for attaching an anti-counterfeit IC label provided with a non-contact IC inlet inclined with respect to a label base material to an adherend. It is explanatory drawing which shows a mode.

  As shown in FIG. 1, an IC label for forgery prevention according to one embodiment of the present invention includes at least a label base (1), an antenna (6) for receiving electromagnetic waves, and an IC chip (4). An anti-counterfeit IC label provided with an IC inlet part (11) and an adhesive layer (7) that adheres to an adherend (21), the antenna (6) of the non-contact IC inlet part (11) is labeled An adhesive layer (7) is provided on one surface of the substrate (1) via a releasable layer (16), and further covers the releasable layer (16) and the antenna (6). This is a forgery-preventing IC label characterized by the above.

  The non-contact IC inlet part (11) is provided with a release layer (16) on a label substrate (1) and an antenna (6) formed by printing a conductive paste such as silver, and the antenna ( 6) and an IC chip (4) mounted at a predetermined position and connected to the antenna (6) via an electrical joint (5).

  The releasable layer (16) is a functional layer that easily peels or destroys the antenna (6) from the label substrate (1), and may be provided on the entire surface or a part of the antenna (6). Materials used include siloxane and fluorine additives, silicone resins, Teflon (registered trademark), polyethylene wax and other release agents added to or dispersed in acrylic resin, polyester resin, urethane resin, etc. It can be provided by offset printing or silk printing.

  The antenna (6) is formed by printing a conductive paste. The conductive material by this conductive paste is preferably silver, and includes an evaporative drying type silver paste containing a binder resin, a solvent, and silver powder to obtain conductivity by contacting them. However, the conductive material is not limited to silver, and a material in which metal powder such as copper or nickel, conductive carbon powder, conductive fiber, conductive whisker, or the like is dissolved or dispersed in a solvent together with a binder can also be used.

  The antenna (6) can be formed by printing using a printing method such as screen printing, flexographic printing, gravure printing, or offset printing. It is also possible to print conductive ink with a printer.

  The IC chip (4) is formed in a square shape, and its side portion has a length dimension of 0.5 mm and a height dimension of 0.1 mm. Note that the length of the side portion can be changed as appropriate instead of 0.5 mm. In this case, it is preferable that the length of the side portion is in the range of 0.05 mm to 0.5 mm. The lower limit of 0.05 mm is the minimum size that can physically form a circuit. The shape of the IC chip (4) can be changed as appropriate, for example, a rectangular shape. Also in this case, it is preferable that the length dimension of the side portion (long side portion) is in the range of 0.05 mm to 0.5 mm. A chip having such dimensions has already been realized in the Muchip (TM) of Hitachi, Ltd. with dimensions of 0.4 mm in width, 0.4 mm in depth, and 0.1 mm in height, for example. It is well known in the art that such IC chips can be mass produced and manufactured.

  The antenna (6) and the IC chip (4) are connected via an electrical joint (5). The electrical joint (5) consists of metal particles such as anisotropic conductive paste (ACP) and an adhesive binder, and electrical connection is realized by curing the adhesive binder under heat and pressure conditions. Used.

  For example, an IC chip (an anisotropic conductive paste (ACP), an anisotropic conductive film (ACF), a non-conductive paste (NCP), and an ultrasonic wave (USB) is used at a predetermined position of the antenna (6). 4) is preferably joined and provided.

  The label base material (1) in this embodiment has brittleness (fragility). That is, the label substrate (1) is formed of a brittle plastic film or paper.

  Examples of the material for the label substrate (1) include synthetic resin films such as brittle vinyl chloride and brittle polyester that are made brittle by mixing an appropriate amount of a plasticizer such as kaolin and calcium carbonate, or cellulose acetate, low density Examples thereof include films formed by solution film formation of highly crystalline plastic materials such as polyethylene, polystyrene, and polyphenylene sulfide. Other materials include UV-cured synthetic resin or UV-cured synthetic resin mixed with an appropriate amount of powder such as kaolin and calcium carbonate, and a film obtained by curing and drying the resin thin film by UV irradiation. . Further, non-woven fabrics made of synthetic fibers or paper such as art paper, coated paper, and high-quality paper can be used.

  Thereby, if it is going to forcibly peel off the forgery prevention IC label (20) affixed to the adherend (21), the label base material (1) can be broken, and an anti-counterfeit effect can be achieved. it can.

  Moreover, in order to make a label base material (1) easier to fracture | rupture, a slit and a notch | incision are provided. For example, as shown in FIG. 2, slits (12, 13, 14, 15) are formed in the label base material (1). Note that the shape of the slits (12, 13, 14, 15) can be appropriately changed as necessary, and may be linear or curved. Furthermore, by providing the antenna (6) with slits (15) at regular intervals, the antenna (6) can be further easily broken when the IC label (20) is peeled off. Thereby, the label base material (1) and the antenna (6) are cut from the slit as a starting point, and the function as an anti-counterfeit IC label having the non-contact IC inlet portion (11) can be completely destroyed.

  Further, on the surface opposite to the antenna (6) adhesion surface of the label base material (1) in the present embodiment, a solvent coloring layer (solvent detection portion) (2) dissolved in the stripping solvent or chemically reacts with the stripping solvent. Any one of the solvent coloring layers (2) is provided.

  The pressure-sensitive adhesive material of the adhesive layer (7) is soluble in an organic solvent. When attempting to peel off the anti-counterfeit IC label (20), use an organic solvent with weak solubility (such as ethyl alcohol or acetone used as a light removing liquid) or a commercially available seal remover, etc. If the dye is to be peeled off without being damaged, the dye held in a dispersed state is dissolved in the solvent coloring layer (2), and a trace is left as coloring on the label substrate (1). That is, the solvent coloring layer (2) has a solvent coloring function.

  The dye particles used in the present invention can be used insofar as they are insoluble in water and soluble in organic solvents, but dyes such as leuco dyes and fluorescent brighteners can be used.

  As for the counterfeiting side, it is assumed that the adhesive material of the adhesive layer (7) is softened by heat such as a dryer in addition to the act of peeling with a solvent, and the anti-counterfeit IC label (20) is peeled off. In this case, the above-described dye alone does not reach the melting temperature, and the effect is insufficient. Therefore, a thermal coloring material can be used for thermal stimulation by dispersing the leuco dye and a developer that binds to the leuco dye by thermal stimulation. In this case, the solvent coloring layer (2) has a thermal coloring function. In the case of thermal coloring, a leuco dye is usually a colorless or light-colored material, and it is suitable to manifest as a color tone when reacted with thermal. In addition, the solvent coloring layer (2) should just have at least one function of a solvent coloring function or a thermal coloring function.

  Further, a printing layer (3) such as a mark, a character, or a pattern can be provided on the solvent coloring layer (2) of the label substrate (1). For example, a printing method such as screen printing, flexographic printing, gravure printing, offset printing or the like is used, and as the printing ink, it is necessary to use a printing ink suitable for each printing method. It is necessary to select a printing ink material or a printing / drying method that does not obstruct colorants such as dyes contained in 2). For example, a UV printing method that does not require a solvent, or an ink that has as little solvent as possible can be considered.

  Furthermore, the adhesive force of the adhesive layer (8) in this embodiment is set to 8000 mN / 25 mm according to JIS Z0237. Here, in the anti-counterfeit label, when the label base material (1) is to be peeled off from the adherend (21), the label is applied to the adhesive layer (8) covering the non-contact IC inlet portion (11). In order to cause the substrate (1) to break, it is necessary to make the adhesive force between the adherend (21) and the adhesive layer (8) stronger than the breaking force of the label substrate (1).

  Therefore, a material having an adhesive strength of 8000 mN / 25 mm or more and 30000 mN / 25 mm or less is selected for the adhesive layer (8) according to JIS Z0237. The adhesive strength of the adhesive layer (8) is desired to be greater than the breaking strength of the label base material (1), but the label base material (1) weakened by a slit or the like in the actual peeling operation is about 8000 mN / 25 mm. If there is force, it can leave a trace of peeling.

  Next, at least a part of the printed layer (3) of the label substrate (1) can be provided with a security function layer (security function part) (8) that can be visually or machine-detected.

  The security functional layer (8) is excited by an OVD functional material whose color tone changes according to the positional relationship between the security functional layer (8), the incident light source, and the viewpoint of the observer, or an electromagnetic wave having a specific wavelength, and is different It is made of at least one of a fluorescent material and a phosphorescent material that return electromagnetic waves of a different wavelength, or a liquid crystal material that has a specific pattern and is polarized by taking out specific polarized light.

  As the security functional layer (8), it is preferable to use a material that can be determined by visual inspection or by using a simple device. Examples of such a material include (1) an OVD functional material, (2) a fluorescent material or a phosphorescent material, and (3) a liquid crystal material. That is, the security functional layer (8) is made of at least one of (1) OVD functional material, (2) fluorescent material, phosphorescent material, and (3) liquid crystal material.

  Hereinafter, (1) OVD functional material, (2) fluorescent material, or phosphorescent material, or (3) liquid crystal material will be described in order.

  First, (1) OVD functional material will be described. An OVD (Optical Variable Device) is an image that uses interference of light, and is a display that produces a color shift in which the color changes depending on the representation of a stereoscopic image and the viewing angle, and is a medium that can be determined by visual inspection. It is. Among them, examples of the OVD such as a hologram and a diffraction grating include a relief type that records light interference fringes on a plane as a fine uneven pattern, and a volume type that records interference fringes in a volume direction. Also, although the method is different from that of holograms and diffraction gratings, there are multilayer film systems in which thin films of ceramics and metal materials with different optical characteristics are laminated, or materials that cause color change (color shift) depending on the viewing angle due to liquid crystal materials etc. This is an example. These OVDs can be said to be effective means for preventing forgery because they give a unique impression such as stereoscopic images and color shifts and require advanced manufacturing techniques.

  Among these OVDs, in consideration of mass productivity and cost, a relief hologram (or a relief diffraction grating) or a multilayer thin film type is preferable, and these OVDs are generally widely used. First, a relief hologram will be described. This relief type hologram or relief type diffraction grating is mass-produced by using a relief type press plate having a fine concavo-convex pattern constituting the hologram or diffraction grating, respectively. That is, this press plate heats and pressurizes the OVD forming layer to replicate a fine uneven pattern.

The OVD forming layer is for increasing the diffraction efficiency, and is made of a material having a refractive index different from that of the polymer material constituting the relief surface. As a material to be used, high refractive index materials such as TiO ₂ , Si ₂ O ₃ , SiO, Fe ₂ O ₃ , and ZnS having different refractive indexes, Al, Sn, Cr, Ni, Cu, and Au having higher reflection effects are used. These materials are used alone or in combination. These materials are formed by a well-known thin film forming technique such as a vacuum deposition method or sputtering, and the film thickness is about 0.5 to 100 nm although it varies depending on the application. In order to prevent the hologram from affecting the communication of the non-contact IC inlet portion (11), it is desirable to specify a metal vapor deposition portion or use a transparent hologram made of a non-metal vapor deposition material.

  Furthermore, a multilayer thin film method will be described. When the multilayer thin film method is used, as described above, the OVD forming layer is formed of a multilayer thin film layer having different optical aptitudes, and is formed by laminating as a metal thin film, a ceramic thin film, or a composite thin film including them together. For example, when thin films having different refractive indexes are stacked, a high refractive index thin film and a low refractive index thin film may be combined, or a specific combination may be stacked alternately. By combining them, a desired multilayer thin film can be obtained.

This multilayer thin film layer is made of a material such as ceramics or metal, and is formed by laminating approximately two or more high refractive index materials and a low refractive index material having a refractive index of about 1.5 with a predetermined film thickness. Examples of materials used are given below. First, as ceramics, Sb ₂ O ₃ (3.0 = refractive index n: the same applies below), Fe ₂ O ₃ (2.7), TiO ₂ (2.6), CdS (2.6), CeO ₂ (2.3), ZnS (2.3), PbCl ₂ (2.3), CdO (2.2), Sb ₂ O ₃ (2.0), WO ₃ (2.0), SiO (2. 0), Si ₂ O ₃ (2.5), In ₂ O ₃ (2.0), PbO (2.6), Ta ₂ O ₃ (2.4), ZnO (2.1), ZrO ₂ ( 2.0), MgO (1.6), SiO ₂ (1.5), MgF ₂ (1.4), CeF ₃ (1.6), CaF ₂ (1.3 to 1.4), AlF ₃ (1.6), Al ₂ O ₃ (1.6), GaO (1.7), and the like.

  And as a metal simple substance or an alloy thin film, Al, Fe, Mg, Zn, Au, Ag, Cr, Ni, Cu, Si etc. are mentioned, for example. Examples of the low refractive index organic polymer include polyethylene (1.51), polypropylene (1.49), polytetrafluoroethylene (1.35), polymethyl methacrylate (1.49), polystyrene (1 .60) and the like.

  By selecting at least one kind from these high refractive index materials or 30% to 60% transparent metal thin film, selecting at least one kind from low refractive index materials, and alternately laminating them at a predetermined thickness, It shows absorption or reflection for visible light. Note that a thin film made of a metal has a value under a certain condition in the present application because an optical characteristic such as a refractive index changes depending on a state of a constituent material or a forming condition.

  Each of the above materials is appropriately selected based on optical properties such as refractive index, reflectance, and transmittance, weather resistance, interlayer adhesion, and the like, and is laminated as a thin film to form a multilayer thin film layer. A known method can be used as the formation method, and the film thickness, film formation speed, number of layers, or optical film thickness (= n · d, n: refractive index, d: film thickness) can be controlled. The vacuum evaporation method and the sputtering method are used. These OVDs were made into a very thin foil and transferred to at least a part of the printed layer (3) of the label substrate (1), or rubbed into the label substrate (1) or miniaturized. Depending on whether the OVD foil is dispersed in a resin binder and inked and printed, it becomes impossible to peel off the anti-counterfeit IC label (20) and reuse it.

  Next, (2) a fluorescent material or a phosphorescent material will be described. As a fluorescent material or a phosphorescent material, a controlled ink or a special ink that is difficult to obtain is provided on the printing layer (3) of the label substrate (1) by a printing method. Authentication can be determined by using a verifier. For example, what brings about an optical effect includes a method of printing ink, fluorescent ink, fluorescent fiber, or the like that emits light when irradiated with ultraviolet rays or infrared light, or a method of printing on paper.

  The image of the drawn character or pattern emits light when irradiated with a black lamp (ultraviolet light) or infrared light (780 nm or more). As a result, an image that was not originally detected under visible light (400 to 700 nm) can be verified visually or through a light receiving element. In particular, since a specific wavelength limited to the material is returned, verification with a simple verifier is possible. Easy and reliable. The material used for the fluorescent color developing portion has a color tone pattern that changes by irradiation with ultraviolet rays or infrared rays, and when dispersed in an ink resin, a colorless and transparent material having a refractive index that is the same as or close to that of the ink resin is preferable.

Moreover, there exists a fluorescent substance as fluorescent material or luminous material. Examples of the phosphor include an ultraviolet light emitting phosphor and an infrared light emitting phosphor, and examples thereof are given below. The ultraviolet phosphor emits light in the visible wavelength region when irradiated with ultraviolet rays. For example, Ca ₂ B ₅ O ₃ Cl: Eu ²⁺ , CaWO ₄ , ZnO: Zn ₂ SiO ₄ : Mn, Y ₂ O ₂ S: Eu, ZnS: Ag, YVO ₄ : Eu, Y ₃ 0 ₃ : Eu, Gd ₂ O ₂ S: Tb, La ₂ O ₂ S: Tb, Y ₃ Al ₅ O ₁₂ : Ce, and the like. The amount of these phosphors added is such that light emission when irradiated with black light can be visually confirmed, or fluorescence can be detected by the light receiving element of the detector.

  In addition, print these special inks on the surface of the label substrate (1), or rub them into the label substrate (1), or make the whole into a special shape such as a star shape. Therefore, it can be expected that an anti-counterfeit effect can be obtained.

In addition, infrared emitting phosphors include those that emit light in the visible wavelength region and those that emit light in the infrared wavelength region when irradiated with infrared rays. Examples of the former include YF ₃ : YB, Er, ZnS: CuCo, and the like. Also as the latter, for example _{LiNd 0.9 Yb 0.1 P 4 O 12} , LiBi 0.2 Nd 0.7 Yb 0.1 P 4 O 12, Nd0 · 9 Yb 0.1 Nd 5 (MoO 4) 4, NaNb 0.3 Yb 0.1 P4O 12, Nd 0.8 Yb _{0.2 Na 5 (W0 4) 4} , Nd 0.8 Yb 0.2 Na 5 (Mo 0.5 WO 0.5) 4, Ce 0.05 Gd 0.05 Nd 0.75 Yb 0.25 Na 5 (W 0.7 Mo 0.3 0 4) 4, Nd 0.3 Yb 0.1 Al 3 ( _{BO 3) 4, Nd0 · 9} Yb 0.1 Al 2.7 Cr 0.3 (BO 3) 4, Nd 0.4 P 5 O4, Nd 0.8 Yb 0.2 K 3 (PO 4) is _2, and the like. The latter emits infrared light having an emission spectrum peak at 980 nm to 1020 nm by irradiating light having an infrared wavelength of around 800 nm. The amount of the infrared light emitting phosphor added in the ink is such that the light emission can be visually confirmed or the light receiving element of the detector can detect the fluorescence.

  Next, (3) a liquid crystal material will be described. Examples of the liquid crystal material include cholesteric liquid crystal. A cholesteric liquid crystal is a liquid crystal aligned in a spiral shape and has a polarization separation ability to reflect right or left circularly polarized light having a specific wavelength. The reflected wavelength is determined by the pitch of the spiral period, and the left and right of the circularly polarized light are determined by the direction of the spiral. In normal observation light, the right and left polarized lights are mixed and the image cannot be confirmed, but only one of the polarized lights can be taken out by holding the polarizing filter and can be recognized as an image. In other words, the cholesteric liquid crystal is called a latent image technology, and the reflected wavelength of reflected light varies depending on the angle. Therefore, the cholesteric liquid crystal can be used as a color shift ink and can be camouflaged. The liquid crystal material is not limited to cholesteric liquid crystal, and any material that exhibits the same effect may be used.

Next, as shown in FIGS. 3 and 4, a numbering printing unit (optical identification unit) (10) in which an optically readable optical identification ID (optical identification information) is engraved on the surface of the printing layer (3). ) Is provided. The numbering printing section (10) is formed by laser engraving or the like, and forms letters by cutting off the printing ink by blowing the printing ink by laser irradiation. Therefore, the effect of preventing falsification of the optical identification ID can be improved. Examples of such optical identification IDs include simple alphanumeric characters that can be viewed visually. As examples of mechanical reading, identification IDs are superimposed by techniques such as one-dimensional barcodes, two-dimensional barcodes, and digital watermarks. There is an arbitrary image, an array of dots and symbols, etc.

  Such an optical identification ID can be associated with the identification ID recorded on the IC chip (4) as follows. That is, as an association between the optical identification ID on the database and the identification ID of the IC chip (4), an optical identification ID is generated from the identification ID of the IC chip (4) by data conversion, and the IC chip ( The identification ID of 4) is generated by data conversion. As an example of data conversion, function conversion including CRC and hash, symmetric encryption, asymmetric encryption, and the like can be used. When such an optical identification ID is used, there is an effect that the authenticity of the anti-counterfeit IC label (20) can be easily confirmed visually or by an optical reader.

  By printing such an optical identification ID on the surface of the printing layer (3) of the label substrate (1) provided with the security function layer (security function part) (8), that is, the numbering printing part (10 ) And the security function layer (8) are provided on the same surface of the label base material (1), so that there is an effect that a photographic copy of the anti-counterfeit IC label (20) can be prevented.

  Thus, a counterfeit-preventing IC label (20) using a fragile plastic film or paper as a label substrate (1), further provided with slits and cuts in one part thereof, and a printed antenna (6). ), The antenna (6) is easily destroyed when the anti-counterfeit IC label (20) affixed to the adherend (21) is peeled off, and the label is released from the peelable layer (16). The base material (1) and the antenna (6) can be peeled and destroyed, information reading from the IC chip (4) is not performed normally, and an attempt is made to destroy or peel the IC label (20) for preventing forgery. It becomes possible to leave a history. At the same time, since the antenna (6) is destroyed, it is possible to make it impossible to forge by reusing the non-contact IC inlet portion (11).

  In addition, a release sheet (9) that can be easily peeled is temporarily adhered to the surface of the adhesive layer (8). As the release sheet (9), a separator in which a release agent layer (not shown) such as a silicone resin is laminated on a paper or plastic sheet by coating or the like is used.

  As described above, according to the anti-counterfeit IC label (20) of the present embodiment, the antenna (6) is formed by printing or the like on the label base material (1) of the non-contact IC inlet portion (11) in the label. Therefore, the antenna (6) can be easily broken at the time of peeling / injustice, and the label base material (1) and the antenna (6) can be peeled off from the release layer (16), and the IC chip (4 ) Cannot be read out. Furthermore, the non-contact IC inlet part (11) including the antenna (6) can be more easily broken by providing the slit (12, 13, 14, 15) in the label base material (1).

  Further, even if an attempt is made to duplicate the IC label (20) for forgery prevention by color copying or the like, since the security function layer (8) is provided, it is possible to prevent duplicating the same one as the original. Therefore, it is possible to prevent fraud such as counterfeiting, falsification, and alteration by a color copier, and verification can be performed more reliably and quickly by applying special light. Furthermore, determination by a machine is also possible by using a light receiving element.

  Further, since the identification ID is stored in the IC chip (4), the individual anti-counterfeit IC label (20) can be determined.

  Therefore, it is possible to perform double security management of electrical confirmation of the anti-counterfeit IC label (20) and visual confirmation by the security function layer (8), and highly accurate authentication can be performed. it can. Furthermore, not only security management but also various information are stored in the IC chip (4), thereby enabling traceability such as physical distribution and strict management of valuable items and personal information.

  Moreover, since the label base material (1) itself is brittle, when the label base material (1) attached to the adherend (21) is to be peeled off, the label base material (1) is about to be peeled off. The label substrate (1) is easily broken by the force. Therefore, it can prevent peeling off the label base material (1), maintaining the form of a label base material (1) as it is.

  Further, since the adhesive strength of the adhesive layer (7) is set to 8000 mN / 25 mm or more, when trying to peel off the label substrate (1) attached to the adherend (21), The label substrate (1) can be reliably broken, and the non-contact IC inlet portion (11) can also be broken.

  Furthermore, since the label base material (1) is provided with slits (12, 13, 14, 15), the label base material (1) is surely secured when the label base material (1) is to be peeled off. Can be broken.

  Moreover, since the solvent coloring layer (2) is provided on the label substrate (1), it is attempted to peel the label from the adherend (21) without using a solvent or a commercially available seal remover. Then, the label base material (1) is colored, and the trace can be left.

  As described above, since the non-contact IC inlet portion (11) in the label is integral with the label base material (1), it is impossible to take out the IC chip (4) from the label. In addition, the label base material (1) itself is made brittle and has a security function, thereby making it impossible to collect the label base material (1). As a result, it becomes impossible to take out the non-contact IC inlet portion (11) and the label base material (1) and reuse them, and it is possible to reliably prevent forgery and alteration.

  The present invention will be described in detail with specific examples.

<Example 1>
A solvent coloring ink was applied to a label substrate made of art paper. On top of that, a pattern was printed by offset printing. Furthermore, fluorescent ink that emits light by ultraviolet rays was printed as a security functional layer. On the other hand, a release layer having a release effect is provided by dispersing Teflon (registered trademark) powder in acrylic resin on the other side, and silver paste is printed on the upper layer by screen printing (350 mesh), and the antenna is Printing was performed with the label substrate inclined. A 0.4 mm square IC chip terminal was joined to this antenna with ACP (anisotropic conductive paste) to obtain a paper-based non-contact IC inlet. The obtained IC inlet portion could be read by an IC reader / writer.

An acrylic adhesive with 12000 mN / 25 mm adhesive strength is applied to the label base layer, polyethylene is laminated on one side of the kraft paper, and a silicon-treated separator (thickness: 112 μm) is temporarily attached to it. did. Further, forgery prevention IC label A was prepared by providing slits in the periphery, corners and antenna installation portions.

<Example 2>
A double security function layer was formed by printing a pattern by offset printing on the same label base material layer as in Example 1 and further printing a special ink that develops color by irradiating infrared rays with a wavelength of 780 nm. . Further, a release layer in which polyethylene wax was dispersed in an acrylic resin to provide a release effect was provided in a pattern on a portion where the antenna was provided. Other than this, the anti-counterfeit IC label B was produced as the material and configuration of Example 1.

  Below, the comparative example of this invention is demonstrated.

<Comparative Example 1>
An aluminum thin film antenna was formed by etching on a 38 μm thick PET film, and the previous non-contact IC inlet portion was mounted on the label substrate of Example 1. Moreover, the pattern was printed on the label base material. At that time, an IC label C without a security function layer was produced by providing slits only around the label base material.

<Comparative example 2>
A slit was formed at intervals of 4 mm around the non-contact IC inlet portion of the PET film base. A pattern was printed on a fragile film substrate, and the PET film-based non-contact IC inlet portion was laminated on the other surface. An adhesive layer having an adhesive strength of less than 8000 mN / 25 mm having a low adhesive strength was provided thereon to produce an IC label D.

  The anti-counterfeit IC labels A and B and the IC labels C and D of Examples 1 and 2 and Comparative Examples 1 and 2 produced in this way are shown in FIG. 21). Thereafter, the IC labels A and B for preventing counterfeiting and the IC labels C and D were carefully removed from the box (21).

  In the anti-counterfeit IC labels A and B of Examples 1 and 2, the label base material is cut starting from four types of slits, and at the same time, the antenna printed from the release layer is easily peeled and broken. The function as an anti-counterfeit label having a completely non-contact IC inlet portion could be destroyed. In particular, the anti-counterfeit IC label B has a great effect because the antenna is destroyed by the pattern of the release layer. Furthermore, when the anti-counterfeit IC labels A and B were peeled from the box (21) using a solvent, the label base material itself was colored by the solvent, and the traces could be clearly confirmed. Further, the label base material from which only the non-contact IC inlet portion was removed was color-copied and the slit was also inserted in the same manner as the genuine product, but it could be confirmed as a counterfeit product without a security function layer. In the anti-counterfeit IC label B of Example 2, printing could be confirmed by irradiating an infrared light lamp, and discrimination between a very similar counterfeit product and duplicate product was possible.

  On the other hand, when the IC labels C and D of Comparative Examples 1 and 2 for comparison are peeled off vigorously, the label base material can be expected to break due to the difference in slits and adhesive strength. The label did not break. In particular, it was difficult to break a tough PET film-based antenna. Even if a slit was made in the non-contact IC inlet portion itself like the IC label D, it was difficult to break. Moreover, it could be easily removed from the box (21) by using a solvent or the like. Then, the peeled IC labels C and D could be reused by being attached to another box (21) again. Furthermore, similar products could be easily produced by color copying the design.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

It is explanatory drawing which shows one Example of the IC label for forgery prevention which concerns on this invention, Comprising: It is a sectional side view shown with a peeling sheet. It is a top view explaining one Example of the IC label for forgery prevention which concerns on this invention. It is explanatory drawing which shows the other Example of the IC label for forgery prevention which concerns on this invention, Comprising: It is a sectional side view shown with a peeling sheet. It is a top view explaining the other Example of the IC label for forgery prevention which concerns on this invention. It is explanatory drawing which shows a mode that the IC label for forgery prevention which provided the non-contact IC inlet part inclining with respect to the label base material was affixed on the to-be-adhered body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Label base material 2 ... Solvent coloring layer (solvent detection part)
DESCRIPTION OF SYMBOLS 3 ... Printing layer 4 ... IC chip 5 ... Joint part 6 ... Antenna 7 ... Adhesive layer (adhesive)
8 ... Security function layer (Security function part)
9 ... Release sheet 10 ... Numbering printing part (optical identification part)
DESCRIPTION OF SYMBOLS 11 ... Non-contact IC inlet part 12 ... Slit 13 ... Slit 14 ... Slit 15 ... Slit 16 ... Release property layer 20 ... IC label for forgery prevention 21 ... Substrate

Claims (15)

  An anti-counterfeit IC label provided with at least a label base material, a non-contact IC inlet portion comprising an antenna and an IC chip for receiving electromagnetic waves, and an adhesive layer for adhering to an adherend, the non-contact IC inlet portion The anti-counterfeit IC label is characterized in that an antenna is provided on one surface of a label substrate via a release layer, and an adhesive layer is further provided so as to cover the release layer and the antenna. .   The IC chip is bonded to a predetermined position of the antenna by an anisotropic conductive paste (ACP), an anisotropic conductive film (ACF), a non-conductive paste (NCP), or an ultrasonic wave (USB). The anti-counterfeit IC label according to claim 1, wherein the anti-counterfeit IC label is provided.   The anti-counterfeiting according to claim 1 or 2, wherein the antenna is formed of a conductive paste in which any one of silver, copper, nickel, conductive carbon, and metal particles is dispersed in a resin binder. IC label.   The forgery-preventing IC label according to any one of claims 1 to 3, wherein the label base material is made of a material that is easily destructible.   The anti-counterfeit IC label according to any one of claims 1 to 4, wherein a slit or a cut is provided in at least a part of the label base material.   The solvent coloring layer that dissolves in the peeling solvent or the solvent coloring layer that chemically reacts with the peeling solvent is provided on the surface opposite to the antenna adhesion surface of the label base material. The IC label for forgery prevention of any one of 1 thru | or 5.   7. The forgery-preventing IC label according to claim 6, wherein a printed layer of marks, characters, patterns, etc. is provided on the solvent coloring layer of the label substrate.   The anti-counterfeit IC label according to any one of claims 1 to 7, wherein the adhesive layer has an adhesive strength of 8000 mN / 25 mm or more and 30000 mN / 25 mm or less according to JIS Z0237.   9. The anti-counterfeit IC label according to claim 1, wherein a unique ID is stored in the IC chip, and the identification information is a value unique to each IC chip.   10. The forgery-preventing IC label according to claim 9, wherein the identification information is associated with management information for managing the adherend.   11. The forgery-preventing IC label according to claim 1, wherein the IC chip has a read-only memory, and the identification information is stored in the read-only memory. .   The forgery-preventing IC label according to any one of claims 7 to 11, wherein a security functional layer that can be visually or machine-detected is provided on at least a part of the printed layer of the label base material. . The security functional layer is excited by an OVD functional material whose color tone changes according to the positional relationship between the security functional layer, the incident light source, and the viewpoint of the observer, or an electromagnetic wave having a specific wavelength, and returns an electromagnetic wave having a different wavelength. 13. A fluorescent material, a phosphorescent material, or a liquid crystal material that has a specific pattern and has a polarization property and is patterned by taking out the specific polarization, is formed from at least one material. IC label for prevention of forgery described.   A numbering printing unit having optically readable optical identification information is provided in at least a partial area on the printed layer of the label base material, and at least a part of the identification information and the optical identification information are associated with each other. The anti-counterfeit IC label according to any one of claims 9 to 13,   15. The forgery-preventing IC label according to claim 14, wherein the security function layer and the numbering printing portion are formed in at least a partial region of the same surface on the printing layer of the label base material. .