JP2009070650A - Functional conductive coating, its manufacturing method, and printed wiring board - Google Patents
Functional conductive coating, its manufacturing method, and printed wiring board Download PDFInfo
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- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
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- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
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- 235000021122 unsaturated fatty acids Nutrition 0.000 claims abstract description 14
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- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
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- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 6
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- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 239000011889 copper foil Substances 0.000 abstract description 9
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- 238000007650 screen-printing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
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- 230000001070 adhesive effect Effects 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 229920005668 polycarbonate resin Polymers 0.000 description 1
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- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
本発明は、ハンダ付け機能と銅箔との密着性および導電性を有する機能性導電塗料とその製造方法並びに印刷配線基板に関する。 The present invention relates to a functional conductive paint having a soldering function, adhesion between a copper foil and conductivity, a method for producing the same, and a printed wiring board.
金属粉末を含有した導電性塗料は、電子部品と配線との接着や印刷配線板を用いたジャンパー線、印刷抵抗の端子引き出し線等を形成するためなど、多方面に用いられるため、現在盛んに研究されている。 Conductive paint containing metal powder is widely used because it is used in many fields, such as bonding of electronic components and wiring, jumper wires using printed wiring boards, and terminal lead wires for printed resistors. It has been studied.
従来、樹脂バインダ型の低温硬化導電塗料として、銀、銅、ニッケル等の金属粉末を樹脂に配合したものが電子回路の印刷配線や導電性接着剤として用いられている。しかし、これらの導電塗料は樹脂分が重量比で２０％程度配合されているため、容積比から見ると圧倒的に樹脂分が多く、市販されている導電塗料はいずれもハンダ付けは不可能である。 Conventionally, resin binder-type low-temperature curing conductive paints in which metal powders such as silver, copper, and nickel are mixed with resin are used as printed wirings and conductive adhesives for electronic circuits. However, these conductive paints contain about 20% resin by weight, so the volume ratio is overwhelmingly high, and any of the commercially available conductive paints cannot be soldered. is there.
また、特許文献１，２に開示されているようなハンダ付け可能な導電塗料も提案されているが、十分な性能を有したものではない。さらに、特許文献３に開示されているように、金属粉末の防錆や適正な印刷性を実現するために、導電塗料には不飽和脂肪酸を添加したものもある。しかし、バインダにフェノール樹脂を使用し、不飽和脂肪酸を添加した場合、銅箔との密着性が悪くなるものであった。 Moreover, although the electrically conductive paint which can be soldered as disclosed in Patent Documents 1 and 2 has been proposed, it does not have sufficient performance. Furthermore, as disclosed in Patent Document 3, in order to realize rust prevention and proper printability of metal powder, there is a conductive paint to which an unsaturated fatty acid is added. However, when a phenol resin is used for the binder and an unsaturated fatty acid is added, the adhesion with the copper foil is deteriorated.
一方、最近の電子回路のほとんどは表面実装化されてきているため、表面実装電子部品とハンダ付けが可能で、スルーホールを介して銅箔で形成された配線との密着性も良好な導電塗料の開発が強く望まれている。
本発明は、上記背景技術に鑑みてなされたものであり、樹脂基板あるいは銅箔との密着性が高く、導電性が良好かつハンダ付けが可能な低温硬化型の機能性導電塗料とその製造方法並びに印刷配線基板を提供することを目的とする。 The present invention has been made in view of the above-described background art, and has a low adhesion property and a low-curing functional conductive paint that has high adhesion to a resin substrate or copper foil, good conductivity, and solderability. An object of the present invention is to provide a printed wiring board.
本発明者等らは、上記課題を解決するために鋭意検討した結果、金属粉末、バインダ、および有機溶媒を混合して塗料を製造する過程において、金属粉末としてＡｇコートＮｉ粉末を単独、あるいはＡｇコートＮｉ粉末とＡｇ粉末との混合物を用い、バインダとしてキレート変性エポキシ樹脂とフェノール樹脂との混合物、および／またはキレート変性エポキシ樹脂とフェノール樹脂との反応生成物を用いて導電塗料を形成した。この導電塗料を絶縁基板に印刷して、１５０〜１７０℃前後の低温で焼き付け硬化させた導電塗料のパターンは、優れた導電性を示すとともに、ハンダの濡れ性が良く、ハンダとの接合性と銅箔との密着性にも優れていることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention, in the process of manufacturing a paint by mixing a metal powder, a binder, and an organic solvent, Ag coated Ni powder alone or Ag Using a mixture of coated Ni powder and Ag powder, a conductive paint was formed using a mixture of a chelate-modified epoxy resin and a phenol resin and / or a reaction product of a chelate-modified epoxy resin and a phenol resin as a binder. The pattern of the conductive paint obtained by printing this conductive paint on an insulating substrate and baked and cured at a low temperature of about 150 to 170 ° C. exhibits excellent conductivity, good solder wettability, and good bonding properties with solder. It has been found that the adhesiveness with the copper foil is also excellent, and the present invention has been completed.
本発明は、ＡｇコートＮｉ粉末およびＡｇ粉末の少なくとも一方から成る金属粉末と、キレート変性エポキシ樹脂を含む熱硬化性樹脂を含有し、不飽和脂肪酸を添加して成る機能性導電塗料である。前記熱硬化性樹脂は、キレート変性エポキシ樹脂とフェノール樹脂との混合物、および／またはキレート変性エポキシ樹脂とフェノール樹脂との反応生成物である。前記不飽和脂肪酸は、オレイン酸および／またはリノール酸である。 The present invention is a functional conductive paint comprising a metal powder comprising at least one of an Ag-coated Ni powder and an Ag powder, a thermosetting resin containing a chelate-modified epoxy resin, and an unsaturated fatty acid added thereto. The thermosetting resin is a mixture of a chelate-modified epoxy resin and a phenol resin, and / or a reaction product of a chelate-modified epoxy resin and a phenol resin. The unsaturated fatty acid is oleic acid and / or linoleic acid.
さらに、前記金属粉末の含有量は、全体の７０〜９９ｗｔ．％であり、前記熱硬化性樹脂中のキレート変性エポキシ樹脂は、その他の成分に対して１０〜２０ｗｔ．％である。 Furthermore, the content of the metal powder is 70 to 99 wt. %, And the chelate-modified epoxy resin in the thermosetting resin is 10 to 20 wt. %.
またこの発明は、ＡｇコートＮｉ粉末およびＡｇ粉末の少なくとも一方から成る金属粉末と、キレート変性エポキシ樹脂を含む熱硬化性樹脂を混合し、不飽和脂肪酸と硬化剤を添加して、これらを溶媒に溶かし、キレート変性エポキシ樹脂とフェノール樹脂との反応生成物を形成する機能性導電塗料の製造方法である。 The present invention also includes mixing a metal powder composed of at least one of Ag-coated Ni powder and Ag powder and a thermosetting resin containing a chelate-modified epoxy resin, adding an unsaturated fatty acid and a curing agent, and using these as a solvent. This is a method for producing a functional conductive paint that dissolves to form a reaction product of a chelate-modified epoxy resin and a phenol resin.
またこの発明は、ＡｇコートＮｉ粉末およびＡｇ粉末の少なくとも一方から成る金属粉末を全体の７０〜９９ｗｔ．％含有し、キレート変性エポキシ樹脂を含む熱硬化性樹脂を有し、前記熱硬化性樹脂中のキレート変性エポキシ樹脂は、その他の成分に対して１０〜２０ｗｔ．％であり、不飽和脂肪酸を添加して成る機能性導電性塗料を、絶縁基板上に塗布して導電路を形成した印刷配線基板である。 Further, according to the present invention, a metal powder composed of at least one of an Ag-coated Ni powder and an Ag powder is added to 70 to 99 wt. % Containing a thermosetting resin containing a chelate-modified epoxy resin, and the chelate-modified epoxy resin in the thermosetting resin is 10 to 20 wt. % Is a printed wiring board in which a functional conductive paint formed by adding an unsaturated fatty acid is applied on an insulating substrate to form a conductive path.
本発明の機能性導電塗料によれば、樹脂基板などを用いた印刷配線を含む電子回路製造において、チップ部品等電子部品や回路構成部品と印刷配線などとのハンダ接合や、スルーホールなどを介しての銅箔との接着が可能なため、簡便に電子回路を製造することができる。 According to the functional conductive paint of the present invention, in the manufacture of electronic circuits including printed wiring using a resin substrate or the like, the electronic components such as chip parts, circuit components and solder wiring between printed wiring and the like, through holes, etc. Since it can be bonded to all copper foils, an electronic circuit can be easily manufactured.
さらに本発明の機能性導電塗料を用いることにより、１５０〜１７０℃程度の低温で、安定かつ簡便に印刷配線などで電子回路を製造することが可能であり、回路基板の製造プロセスを大幅に簡略化することができる。したがって、従来の銅箔のエッチング工程による表面実装用の導体回路の一部を、本願発明による印刷配線とすることにより、回路製作を簡素化し、コストと歩留まりの大幅な改善が可能となる。さらに、廃液を少なくし、安価で環境負荷の小さいものとすることができ、当該技術分野に大きく貢献するものである。 Furthermore, by using the functional conductive paint of the present invention, it is possible to manufacture electronic circuits stably and simply with printed wiring at a low temperature of about 150 to 170 ° C., greatly simplifying the circuit board manufacturing process. Can be Therefore, a part of the conductor circuit for surface mounting by the conventional copper foil etching process is a printed wiring according to the present invention, thereby simplifying circuit manufacture and significantly improving cost and yield. Further, the amount of waste liquid can be reduced, the cost can be reduced, and the environmental load can be reduced. This greatly contributes to the technical field.
また、導電性塗料中の金属粉末表面上には、空気中の水分または酸素などにより薄い自然酸化膜が形成されるため、安定な電気的導通が得られないことがあるが、本発明の機能性導電塗料においては、不飽和脂肪酸が該酸化膜をも除去するので、抵抗値が極めて小さい電子回路を形成することができる。 In addition, since a thin natural oxide film is formed on the surface of the metal powder in the conductive paint by moisture or oxygen in the air, stable electrical conduction may not be obtained. In the conductive conductive paint, since the unsaturated fatty acid also removes the oxide film, an electronic circuit having a very small resistance value can be formed.
以下、本発明の実施の形態について詳細に説明する。本発明の機能性導電塗料に用いられる金属粉末は、ＡｇコートＮｉ粉末、Ｃｕ粉末、Ａｇ粉末、Ｎｉ粉末、Ａｌ粉末などが挙げられるが、これらのうち、ハンダ付け性の観点から、ＡｇコートＮｉ粉末もしくはＡｇコートＮｉ粉末とＡｇ粉末との混合粉末が好ましい。また金属粉末の含有量は、機能性導電塗料全体中に好ましくは、７０〜９９ｗｔ.％で、さらに好ましくは、７０〜９５ｗｔ.％である。 Hereinafter, embodiments of the present invention will be described in detail. Examples of the metal powder used in the functional conductive paint of the present invention include Ag-coated Ni powder, Cu powder, Ag powder, Ni powder, and Al powder. Among these, Ag-coated Ni is used from the viewpoint of solderability. A powder or a mixed powder of Ag-coated Ni powder and Ag powder is preferred. The content of the metal powder is preferably 70 to 99 wt.%, More preferably 70 to 95 wt.% In the entire functional conductive paint.
本発明の機能性導電塗料に用いられるバインダに含まれる熱硬化性樹脂は、エポキシ樹脂、メラミン樹脂、フェノール樹脂、ポリイミド樹脂、ポリカーボネート樹脂などが挙げられるが、これらのうち、塗膜特性の観点から、キレート変性エポキシ樹脂、フェノール樹脂が好ましい。また熱硬化性樹脂の含有量は、機能性導電塗料全体中に好ましくは、１〜３０ｗｔ.％で、さらに好ましくは、５〜１５ｗｔ.％である。 Examples of the thermosetting resin contained in the binder used in the functional conductive paint of the present invention include an epoxy resin, a melamine resin, a phenol resin, a polyimide resin, and a polycarbonate resin. Among these, from the viewpoint of coating film characteristics. Chelate-modified epoxy resins and phenol resins are preferred. The content of the thermosetting resin is preferably 1 to 30 wt.%, More preferably 5 to 15 wt.% In the entire functional conductive paint.
バインダには、イミダゾール、ジシアンジアミド、芳香族ポリアミンなどの硬化剤を加えるが、これらのうち、イミダゾールが好ましい。また硬化剤の含有量は、機能性導電塗料全体中に好ましくは、１〜３０ｗｔ.％で、さらに好ましくは、２〜２０ｗｔ.％である。 Curing agents such as imidazole, dicyandiamide, and aromatic polyamine are added to the binder. Of these, imidazole is preferred. Further, the content of the curing agent is preferably 1 to 30 wt.%, More preferably 2 to 20 wt.% In the entire functional conductive paint.
本発明の機能性導電塗料に用いられる有機溶媒は、熱硬化性樹脂を該塗料中に均一に分散させるものであれば特に限定されないが、例えば、ブチルカルビトール、メチルカルビトール、ソルベッソ１５０などの有機溶媒を添加させて、スクリーン印刷できる粘度（２００〜５００ポイズ程度）に調整してもよい。これらの有機溶媒のうち、ブチルカルビトールが好ましく、含有量は機能性導電塗料全体中に好ましくは、０．１〜２０ｗｔ.％で、さらに好ましくは、０.５〜１５ｗｔ.％である。 The organic solvent used in the functional conductive paint of the present invention is not particularly limited as long as the thermosetting resin is uniformly dispersed in the paint, and examples thereof include butyl carbitol, methyl carbitol, and Solvesso 150. An organic solvent may be added to adjust the viscosity so that screen printing can be performed (about 200 to 500 poise). Of these organic solvents, butyl carbitol is preferable, and the content thereof is preferably 0.1 to 20 wt.%, More preferably 0.5 to 15 wt.% In the entire functional conductive paint.
さらに、本発明の機能性導電塗料には、金属粉末表面上の酸化膜破壊を助長する目的で、オレイン酸、リノール酸、リノレン酸などの不飽和脂肪酸を溶解させてもよい。これらの不飽和脂肪酸のうち、オレイン酸およびリノール酸が好ましく、含有量は、機能性導電塗料全体中に好ましくは、０．１〜５．０ｗｔ.％で、さらに好ましくは、０．５〜３．０ｗｔ.％である。 Furthermore, in the functional conductive paint of the present invention, unsaturated fatty acids such as oleic acid, linoleic acid and linolenic acid may be dissolved for the purpose of promoting the destruction of the oxide film on the surface of the metal powder. Of these unsaturated fatty acids, oleic acid and linoleic acid are preferable, and the content is preferably 0.1 to 5.0 wt.% In the entire functional conductive paint, and more preferably 0.5 to 3 0.0 wt.%.
上記組成の本発明の機能性導電塗料は、ハイブリッドミキサー等の自公転式ミキサーで配合した材料が均一に分散するまでよく混合した後、印刷、スプレー、筆塗り等の種々の方法で所望の形状に絶縁基板上に塗布することができる。そして、１５０〜１７０℃の温度で、５〜３０分間焼成することにより、簡便に電子回路を形成することができる。 The functional conductive paint of the present invention having the above composition is mixed in a desired shape by various methods such as printing, spraying, brush coating, etc., after mixing well until the material blended in a revolving mixer such as a hybrid mixer is uniformly dispersed. It can be applied on an insulating substrate. And an electronic circuit can be simply formed by baking for 5 to 30 minutes at the temperature of 150-170 degreeC.
次に、本発明の機能性導電塗料を用いた印刷配線基板の製造方法を示す。まず、印刷配線用樹脂基板上に本発明の塗料をスクリーン印刷法などで、所望のパターンで付着し乾燥させる。この後、１５０〜１７０℃の温度で焼成する。これにより、良好な電気的導通がとられた印刷配線電極が製造される。本発明の機能性導電塗料は、電子部品と印刷配線とのハンダ密着性に優れているので、簡便に表面実装電子回路を製造することができる。 Next, the manufacturing method of the printed wiring board using the functional conductive paint of this invention is shown. First, the paint of the present invention is deposited on a resin substrate for printed wiring by a screen printing method or the like and dried. Thereafter, baking is performed at a temperature of 150 to 170 ° C. Thereby, the printed wiring electrode from which favorable electrical continuity was taken is manufactured. Since the functional conductive paint of the present invention is excellent in solder adhesion between an electronic component and a printed wiring, a surface-mount electronic circuit can be easily produced.
以下、本発明を実施例により更に説明するが、本発明は以下の実施例に制約されるものではない。まず以下の材料を用意して混合する。
ＡｇコートＮｉ粉末（Ａｇコート量１５ｗｔ％）にＡｇ粉末を１０ｗｔ％配合した金属粉末 ８８重量部
オレイン酸 ２重量部
イミダゾール添加キレート変性エポキシ樹脂（固形分として） ０〜２重量部
（キレート変性エポキシ樹脂に対するイミダゾール添加量＝２０ｐｈｒ）
フェノール樹脂（固形分として） ８〜１０重量部
ブチルカルビトール ２．５重量部
EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not restrict | limited to a following example. First, the following ingredients are prepared and mixed.
Metal powder containing 10 wt% of Ag powder in Ag coated Ni powder (Ag coat amount 15 wt%) 88 parts by weight Oleic acid 2 parts by weight Imidazole-added chelate-modified epoxy resin (as solid content) 0-2 parts by weight (chelate-modified epoxy resin Addition amount of imidazole to 20 phr)
Phenolic resin (as solids) 8-10 parts by weight Butyl carbitol 2.5 parts by weight
これらの材料を配合した導電塗料を、図１に示すジグザグパターンでガラスエポキシ樹脂基板上にスクリーン印刷し、１６０℃で３０分間焼成して導電路を形成した。
図１の導電路は、スクリーン印刷用ジグザクパターンであり、線幅は２ｍｍで倍率は１８４倍となっている。したがって、体積抵抗率ρは次式から求める。
ρ＝（Ｒｘ／１８４）×ｄ（Ω・cm）
ただし、Ｒｘ：シグザクパターンの両端間の抵抗値（Ω）
ｄ：試料パターンの膜厚（ｃｍ）
A conductive coating containing these materials was screen-printed on a glass epoxy resin substrate with a zigzag pattern shown in FIG. 1 and baked at 160 ° C. for 30 minutes to form a conductive path.
1 is a zigzag pattern for screen printing, the line width is 2 mm, and the magnification is 184 times. Therefore, the volume resistivity ρ is obtained from the following equation.
ρ = (Rx / 184) × d (Ω · cm)
However, Rx: Resistance value between both ends of the zigzag pattern (Ω)
d: Sample pattern film thickness (cm)
実施例に使用した材料の概要
ＡｇコートＮｉ粉末 横沢金属工業株式会社製 ＹＮＡシリーズ（特注品）
Ａｇ粉末 堺化学工業株式会社製 ＡＧ−３５００Ｍ
キレート変性エポキシ樹脂 株式会社アデカ製 ＥＰ−４９−２３
エポキシ樹脂硬化剤 株式会社アデカ製 ＥＨ−４３４４Ｓ（フェノール樹脂の硬化促進剤としても使用可能）
フェノール樹脂 リグナイト株式会社製 ＡＨ−８８０
オレイン酸 和光純薬工業株式会社製 １級試薬
ブチルカルビトール 和光純薬工業株式会社製 特級試薬
ハイブリッドミキサー キーエンス社製
Outline of materials used in Examples Ag coated Ni powder YNA series manufactured by Yokozawa Metal Industry Co., Ltd. (custom product)
Ag powder AG-3500M manufactured by Sakai Chemical Industry Co., Ltd.
Chelate-modified epoxy resin manufactured by Adeka Corporation EP-49-23
Epoxy resin curing agent EH-4344S manufactured by ADEKA CORPORATION (can also be used as a curing accelerator for phenolic resin)
AH-880 made of phenolic resin Lignite Co., Ltd.
Oleic acid Wako Pure Chemical Industries, Ltd. First grade reagent butyl carbitol Wako Pure Chemical Industries, Ltd. Special grade reagent hybrid mixer KEYENCE Corporation
以上の条件で、フェノール樹脂に対するキレート変性エポキシ（ＥＰ）樹脂量を変えた場合の性能を評価した。評価結果を表１に示す。
表１により、フェノール樹脂に対するキレート変性エポキシ樹脂量が、１０〜２０ｗｔ．％で好ましい結果が得られた。これにより、本発明の機能性導電塗料は、はんだ付け性及び銅箔との密着性が良いものであり、電子回路の製造または電子回路形成に用いることができることが確かめられた。 According to Table 1, the amount of the chelate-modified epoxy resin relative to the phenol resin is 10 to 20 wt. % Gave favorable results. As a result, it was confirmed that the functional conductive paint of the present invention has good solderability and adhesion with copper foil, and can be used for the production of electronic circuits or the formation of electronic circuits.
Claims (6)
A metal powder composed of at least one of Ag-coated Ni powder and Ag powder was added in an amount of 70 to 99 wt. % Containing a thermosetting resin containing a chelate-modified epoxy resin, and the chelate-modified epoxy resin in the thermosetting resin is 10 to 20 wt. %, And a conductive wiring formed by adding a functional conductive paint to which an unsaturated fatty acid is added on an insulating substrate to form a conductive path.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160197A (en) * | 2013-04-12 | 2013-06-19 | 常州华狮化工有限公司 | Superstrong anti-torque low temperature setting functional primer and preparation method thereof |
| JP2013196954A (en) * | 2012-03-21 | 2013-09-30 | Kyoto Elex Kk | Thermosetting conductive paste composition |
| JP2013196953A (en) * | 2012-03-21 | 2013-09-30 | Kyoto Elex Kk | Thermosetting conductive paste composition |
| JP2022109477A (en) * | 2021-01-15 | 2022-07-28 | 株式会社オリジン | primer paint composition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005264095A (en) * | 2004-03-22 | 2005-09-29 | Kyoto Elex Kk | Conductive resin composition and conductive paste |
| JP2005302904A (en) * | 2004-04-08 | 2005-10-27 | Tatsuta System Electronics Kk | Paste for filling hole and method for filling through-hole or bottomed hole of substrate by using paste |
| JP2006028213A (en) * | 2004-07-12 | 2006-02-02 | Toyama Prefecture | Functional electroconductive coating, electronic circuit using the same and its formation method |
-
2007
- 2007-09-12 JP JP2007236520A patent/JP2009070650A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005264095A (en) * | 2004-03-22 | 2005-09-29 | Kyoto Elex Kk | Conductive resin composition and conductive paste |
| JP2005302904A (en) * | 2004-04-08 | 2005-10-27 | Tatsuta System Electronics Kk | Paste for filling hole and method for filling through-hole or bottomed hole of substrate by using paste |
| JP2006028213A (en) * | 2004-07-12 | 2006-02-02 | Toyama Prefecture | Functional electroconductive coating, electronic circuit using the same and its formation method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013196954A (en) * | 2012-03-21 | 2013-09-30 | Kyoto Elex Kk | Thermosetting conductive paste composition |
| JP2013196953A (en) * | 2012-03-21 | 2013-09-30 | Kyoto Elex Kk | Thermosetting conductive paste composition |
| CN103160197A (en) * | 2013-04-12 | 2013-06-19 | 常州华狮化工有限公司 | Superstrong anti-torque low temperature setting functional primer and preparation method thereof |
| JP2022109477A (en) * | 2021-01-15 | 2022-07-28 | 株式会社オリジン | primer paint composition |
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