JP2009059867A - Substrate mounting table and substrate processing apparatus - Google Patents

Abstract

To provide a substrate mounting table in which damage to a mounting table main body due to an elevating pin hardly occurs.
The substrate mounting table is vertically inserted into the mounting table main body and the mounting table main body so as to be movable up and down so as to protrude and sink with respect to the surface of the mounting table main body. The raising / lowering pin 30 is moved up and down, and the raising / lowering pin 30 has an upper member 30b and a lower member 30a, and a bent portion 35 formed by providing an auxiliary member 39 around the boundary portion 38. When the elevating pin 30 is in the support position, the folding part 35 exists at the surface position of the mounting table main body 4a or a position above it, and the folding part 35 is subjected to a lateral force on the elevating pin 30. In this case, the lift pins 30 are formed so as to be broken with a force smaller than the force of deformation.
[Selection] Figure 4

Description

  The present invention provides a substrate processing apparatus for performing a process such as dry etching on a glass substrate or a semiconductor wafer for manufacturing a flat panel display (FPD) such as a liquid crystal display (LCD). The present invention relates to a substrate mounting table to be placed and a substrate processing apparatus to which the substrate mounting table is applied.

  For example, in FPD and semiconductor manufacturing processes, various processes such as dry etching, sputtering, and CVD (Chemical Vapor Deposition) are performed on glass substrates and semiconductor wafers that are substrates to be processed.

  Such processing is performed, for example, in a state in which the substrate is placed on the substrate mounting table provided in the chamber, and a plurality of lifting pins provided in the substrate mounting table are used for loading and unloading the substrate with respect to the substrate mounting table. This is done by raising and lowering. That is, when loading a substrate, the lifting pins are projected from the surface of the mounting table body, the substrate placed on the transfer arm is transferred onto the pins, and the lifting pins are lowered. Further, when unloading the substrate, the lifting pins are raised from the state where the substrate is placed on the mounting table body to raise the substrate from the surface of the mounting table body, and the substrate is transferred to the transfer arm in that state. . Such a technique is a conventional technique and is disclosed, for example, in Patent Document 1.

  By the way, a glass substrate for FPD typified by LCD is directed to increase in size, a huge substrate having a side exceeding 2 m is required, and a substrate mounting table is extremely increased in size. In addition, in order to support a large substrate, a large number of lifting pins are required. For this reason, the substrate mounting table itself is extremely expensive. In particular, in the case of an etching apparatus that performs plasma etching on a glass substrate for FPD, a pair of parallel plate electrodes (upper and lower electrodes) are arranged in the chamber, and the substrate mounting table functions as the lower electrode, so that the cooling mechanism Since a power feeding mechanism and the like are attached, it is more expensive.

  In such a substrate mounting table, since a large number of lifting pins are moved up and down in the mounting table body, troubles such as the transfer arm contacting the lifting pins occur while the lifting pins protrude from the mounting table body. There is a risk of damaging the substrate mounting table itself.

In particular, when the substrate size increases, the lifting pins need to be strong, and when the substrate mounting table functions as the lower electrode, the lifting pins are made conductive to achieve a uniform process in the substrate surface. When a metal lifting pin such as stainless steel (SUS) is used as the lifting pin, the lifting pin itself bends due to the lateral force such as the contact of the transfer arm. In the series of transfer operations, the lifting pins are moved up and down while being bent, which increases the possibility of damaging the expensive substrate mounting table. When the mounting table main body is damaged as described above, it is necessary to replace the expensive substrate mounting table, which causes an increase in apparatus cost.
JP 11-340208 A

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate mounting table in which damage to the mounting table main body due to the lifting pins is less likely to occur, and a substrate processing apparatus including such a substrate mounting table. And

  In order to solve the above problems, according to a first aspect of the present invention, there is provided a substrate mounting table for mounting a substrate on a substrate processing apparatus, wherein the substrate mounting table is vertically inserted into the mounting table main body and the mounting table main body. It is provided so as to be able to move up and down so as to protrude and retract with respect to the surface of the mounting table main body, and includes a lifting pin that supports and lifts the substrate at its tip, and the lifting pin has an upper member and a lower member, There is a retracted position that has a bent portion formed by providing auxiliary members around these boundaries, and is submerged in the mounting table main body, and a support position that protrudes from the mounting table main body and supports the substrate. When the elevating pin is in the support position, the fold portion is present on the surface position of the mounting table main body or a position above the pedestal body, and the fold portion is lateral to the elevating pin. When force is applied, the lifting pins That it is formed as broken by a force smaller than the deformation force providing a substrate mounting table and said.

  In the first aspect, it is preferable that the upper member and the lower member are bonded at the boundary portion. Moreover, it is preferable that the said auxiliary member has comprised the ring shape which covers the circumference | surroundings of the said boundary part. Furthermore, it is preferable that the auxiliary member is bonded to the upper member and the lower member. Furthermore, it is preferable that the auxiliary member has a constricted portion in which a constricted portion is formed at a position corresponding to a boundary portion between the upper member and the lower member.

  The upper member, the lower member, and the auxiliary member are preferably made of metal, and particularly preferably made of stainless steel. Moreover, the said upper member can take the structure which has a metal core and the resin member which covers the circumference | surroundings and upper part.

  According to a second aspect of the present invention, there is provided a substrate mounting table on which a substrate is mounted in a substrate processing apparatus, which is vertically inserted into the mounting table main body and the mounting table main body, with respect to the surface of the mounting table main body. And a lifting pin that supports the substrate at its tip and lifts and lowers, and the lifting pin is retracted from the mounting table main body, and from the mounting table main body. A support position that protrudes and supports the substrate, and when in the support position, has a constricted portion in which a constriction is formed at a surface position of the mounting table main body or a position higher than the surface position. The portion is formed so as to be bent with a force smaller than a force by which the lifting pins are deformed when a lateral force is applied to the lifting pins.

  In the second aspect, the elevating pin is preferably made of metal, and particularly preferably made of stainless steel. Moreover, the said raising / lowering pin can take the structure which has the metal core material and the resin member which covers the circumference | surroundings and upper part above the said narrow part. Moreover, the said raising / lowering pin can be comprised with a different member on the upper and lower sides of the said narrow part.

  In the first and second aspects, the processing apparatus performs plasma processing, and the mounting table body can function as a lower electrode.

  In a third aspect of the present invention, a processing container that accommodates a substrate, a substrate mounting table that is provided in the processing container and on which the substrate is placed, and a process that performs a predetermined process on the substrate in the processing chamber. A substrate processing apparatus, wherein the substrate mounting table has the configuration of the first or second aspect.

  In the third aspect, the processing mechanism generates a gas for supplying a processing gas into the processing container, an exhaust mechanism for exhausting the processing container, and plasma of the processing gas in the processing container. And a plasma generation mechanism. The plasma generation mechanism includes the substrate mounting table that functions as a lower electrode, an upper electrode provided to face the substrate mounting table, and a high-frequency power source that applies high-frequency power to the substrate mounting table. be able to.

  According to the present invention, the elevating pin has an upper member and a lower member, and has a bent portion formed by providing an auxiliary member around the boundary portion, and is submerged in the mounting table main body. It is possible to take a retreat position and a support position that protrudes from the mounting table main body and supports the substrate, and when in the supporting position, the folding portion is at a surface position of the mounting table main body or a position above it. The folding portion is formed to be bent with a force smaller than a force by which the lifting pin is deformed when a lateral force is applied to the lifting pin, so that the lifting pin supports the substrate. When lifting and lowering, sufficient strength can be maintained by the auxiliary member. When a lateral force is applied, the lifting pin is folded before the lifting pin is deformed. To cause damage to the mounting table , Lift pins can be prevented from causing damage to the mounting table body is moved up and down in the state deformed. In particular, by forming the constricted portion at a position corresponding to the boundary portion between the upper member and the lower member of the auxiliary member, the auxiliary ring is surely broken from the constricted portion, and a lateral force greater than a predetermined size is applied. In this case, the elevating pin can be surely broken at the bent portion.

  Furthermore, according to the present invention, when the lifting pin is in the support position, the lifting pin has a constricted portion in which the constricted portion is formed at the surface position of the mounting table main body or at a position above it. When a lateral force is applied to the substrate, it is formed so that it can be bent with a force smaller than the force by which the lift pin deforms. Therefore, when the lift pin moves up and down while supporting the substrate, a sufficient strength is maintained. When a lateral force is applied, the lifting pin is bent before the deformation, so that the lifting pin is deformed to cause direct damage to the mounting table body, It is possible to prevent the mounting base body from being damaged by being moved up and down while the pin is deformed.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing a plasma etching apparatus as an example of a processing apparatus provided with a susceptor as a substrate mounting table according to an embodiment of the present invention. The plasma etching apparatus 1 is a cross-sectional view of an apparatus for performing a predetermined process on an FPD glass substrate G, and is configured as a capacitively coupled parallel plate plasma etching apparatus. Here, as FPD, a liquid crystal display (LCD), an electroluminescence (Electro Luminescence; EL) display, a plasma display panel (PDP), etc. are illustrated.

  This plasma etching apparatus 1 has a chamber 2 formed into a rectangular tube shape made of aluminum, for example, whose surface is anodized (anodized).

  A susceptor 4 as a substrate mounting table for mounting a glass substrate G as a substrate to be processed is provided at the bottom of the chamber 2. The susceptor 4 includes a susceptor body 4a and lifting pins 30 for loading and unloading the glass substrate G onto the susceptor body 4a.

  The susceptor body 4a is connected to a power supply line 23 for supplying high-frequency power, and a matching unit 24 and a high-frequency power source 25 are connected to the power supply line 23. For example, high frequency power of 13.56 MHz is supplied from the high frequency power supply 25 to the susceptor 4.

  Above the susceptor 4, a shower head 11 that functions as an upper electrode is provided in parallel with the susceptor 4. The shower head 11 is supported on the upper portion of the chamber 2, has an internal space 12 inside, and has a plurality of discharge holes 13 for discharging a processing gas on the surface facing the susceptor 4. The shower head 11 is grounded and forms a pair of parallel plate electrodes together with the susceptor 4.

A gas inlet 14 is provided on the upper surface of the shower head 11, and a processing gas supply pipe 15 is connected to the gas inlet 14. A valve 16 and a mass flow controller 17 are connected to the processing gas supply pipe 15. A processing gas supply source 18 is connected to the via. A processing gas for etching is supplied from the processing gas supply source 18. As the processing gas, a gas usually used in this field, such as a halogen-based gas, an O ₂ gas, or an Ar gas, can be used.

  An exhaust pipe 19 is formed at the bottom of the chamber 2, and an exhaust device 20 is connected to the exhaust pipe 19. The exhaust device 20 includes a vacuum pump such as a turbo molecular pump, and is configured so that the inside of the chamber 2 can be evacuated to a predetermined reduced pressure atmosphere. Further, a substrate loading / unloading port 21 and a gate valve 22 for opening and closing the substrate loading / unloading port 21 are provided on the side wall of the chamber 2, and a load lock chamber adjacent to the substrate G with the gate valve 22 opened. (Not shown).

Next, the susceptor 4 which is a substrate mounting table according to an embodiment of the present invention will be described in detail with reference to the enlarged view shown in FIG.
As described above, the susceptor 4 includes the susceptor body 4a and the lifting pins 30. The susceptor body 4a includes a metal base 5 and an insulating member 6 provided on the periphery of the base 5. Have.

  A spacer member 7 made of an insulator is provided on the bottom wall 2a of the chamber 2 so as to correspond to the peripheral edge of the susceptor body 4a, and the susceptor body 4a is placed thereon. The space between the spacer member 7 and the bottom wall 2a and the space between the spacer member 7 and the susceptor body 4a are hermetically sealed, and an air atmosphere space 31 is formed between the susceptor body 4a and the bottom wall 2a. . The space 31 is insulated from the atmosphere. A plurality of insulating members 32 made of an insulator such as ceramics supporting the susceptor body 4a are embedded in the bottom wall 2a, and bolts 33 inserted into through holes provided vertically at the centers of these insulating members 32. Thus, the bottom wall 2a and the susceptor body 4a are fixed.

  On the upper surface of the susceptor body 4a, that is, on the surface of the base material 5, a plurality of convex portions 5a made of a dielectric material are formed in a protruding shape, and these convex portions 5a are surrounded by the insulating member 6 It has become. The upper surface of the insulating member 6a and the upper surface of the convex portion 5a are the same height, and when the glass substrate G is placed on the susceptor body 4a, the upper surface of the insulating member 6 and the upper surface of the convex portion 5a are in contact with each other. It is said.

  The elevating pin 30 is inserted into a hole 2b provided in the bottom wall of the susceptor 2 and a hole 5b provided in the base material 5 of the susceptor body 4a. As shown in FIG. A total of 13 lines are provided, 10 at the corresponding positions and 3 at the center. The elevating pins 30 are moved up and down by a drive mechanism (not shown). When the glass substrate G is not being transported during processing or the like, the elevating pins 30 are located at a retracted position immersed in the susceptor body 4a and At the time of loading and unloading, as shown in FIG. 2, the glass substrate G is positioned at a support position where it protrudes upward from the surface of the susceptor body 4a. A conductive stopper 60 is screwed to the lower end of the elevating pin 30. A conductive bellows 62 is provided between the stopper 60 and the susceptor body 4a to block the vacuum atmosphere and the air atmosphere. Therefore, when the elevating pin 30 is conductive, the elevating pin 30 is electrically connected to the susceptor body 4a via the bellows 62 and the stopper 60 and is held at the same potential. An insulating member 61 is provided under the stopper 60.

  The raising / lowering pin 30 has the lower member 30a and the upper member 30b, and these boundary parts become the folding part 35 which is bent when the force of a horizontal direction is added. The bent portion 35 is provided so as to be at the surface position of the susceptor body 4a or slightly above it when the elevating pin 30 is in the support position (the state shown in FIG. 2). When the lifting pin 30 is in the support position, when a lateral force having a predetermined magnitude smaller than the force by which the lifting pin 30 is deformed is applied to the protruding portion of the lifting pin 30, It is configured to break.

  Specifically, as shown in FIG. 4, in the bent portion 35, a convex portion 36 provided at the center of the upper end portion of the lower member 30 a and a convex portion 37 provided at the center of the lower end portion of the upper member 30 b. A boundary 38 is formed between the two, and both are bonded by an adhesive at the boundary 38. A ring-shaped auxiliary member 39 is provided around the convex portion 36 and the convex portion 37 including the boundary portion 38. The auxiliary member 39 and the convex portions 36 and 37 are bonded with an adhesive. Further, a constricted portion 40 is formed at a portion corresponding to the adhesive portion 38 on the outer periphery of the auxiliary member 39.

  By adjusting the length of the auxiliary member 39 (that is, the length of the convex portions 36 and 37), the thickness of the auxiliary member 39, the depth of the constricted portion 40, and the like, the minimum value of the force when folding from the folded portion 35 is reduced. When the glass substrate G is moved up and down, the bent portion 35 can be operated as usual without being deformed. However, a predetermined value is obtained when the transport arm collides with the lifting pin 30 from the side. When the above force is applied, the auxiliary member 39 is easily broken at the constricted portion 40 before the elevating pin 30 is deformed, and the elevating pin 30 is broken at the bonding portion 38 of the bent portion 35.

  A maintenance part 41 is provided at a position directly below the folding part 35 to apply a tool such as a spanner during maintenance such as attachment / removal of the lifting pins 30. Conventionally, this type of maintenance is performed at a support position for supporting the glass substrate G. Therefore, when the glass substrate G is at the support position, the maintenance unit 41 has a susceptor body 4a as shown in FIG. Need to be above the surface of the. When such a state is applied to the present embodiment, the bent portion 35 that is folded when a lateral force is applied is positioned substantially above the surface of the susceptor body 4a. However, ideally, the folding position of the lifting pins is closer to the surface of the susceptor body 4a. Therefore, as shown in FIG. 5 (b), in the support position, the preferred position is ensured by setting the height of the bent portion 35 to be slightly higher than the surface height of the susceptor body 4a. In the above, a maintenance position which is further raised from the support position as a further stop position of the lifting pin 30 is newly provided, and the lifting pin 30 is positioned at this maintenance position as shown in FIG. The maintenance part 41 is positioned above the surface of the susceptor body 4a to enable maintenance of the lift pins 30. Of course, as in the prior art, the lifting pins may be attached and detached at the support position only in two positions, the retracted position and the support position.

  The elevating pin 30 is preferably securely attached to an attachment portion (not shown) below the chamber 2 and preferably has a strength necessary for the elevating operation of the glass substrate G. From such a viewpoint, the lower member 30a and the upper member Both 30b and auxiliary member 39 are preferably made of a metal such as stainless steel (SUS). Further, from the viewpoint of performing a uniform etching process on the substrate surface, the lower member 30a and the upper member 30b of the elevating pin 30 have conductivity, and the lower member 30a from the tip of the upper member 30b through the bent portion 35. It is preferable to be electrically connected to the lower end of the susceptor body 4a so as to have the same potential as that of the susceptor body 4a. From such a viewpoint, it is preferable that the elevating pin 30 is made of a metal such as stainless steel (SUS). From the viewpoint of ensuring conduction, it is preferable to use a conductive adhesive as the adhesive. By making the lifting pins 30 conductive in this way, as described above, the lifting pins 30 are electrically connected to the susceptor body 4a via the conductive bellows 62 and the stopper 60, and have the same potential as the susceptor body 4a. Become.

  However, when the upper member 30b is made of metal, there is a risk of causing troubles such as rubbing with the susceptor body 4a in the hole 5b or scratching the glass substrate G, and abnormal discharge occurs when plasma is generated. There is a fear. From the viewpoint of preventing such rubbing, scratches on the glass substrate G, and abnormal discharge, the upper member 30b is preferably a resin member. On the other hand, although the upper member 30b is made of a conductive resin, abnormal discharge cannot be prevented, but trouble prevention due to rubbing / scratching with the susceptor body 4a and etching uniformity can be achieved at the same time. However, if the upper member 30b is simply made of resin, the strength may be insufficient.

  In order to prevent the above-mentioned rubbing, scratches on the glass substrate G, and abnormal discharge while ensuring strength, the upper member 30b is made of a resin material around the core material 42 made of stainless steel (SUS) as shown in FIG. The structure covered with 43 is preferable.

Next, the processing operation in the plasma etching apparatus 1 configured as described above will be described.
First, a glass substrate G as a substrate to be processed is carried into a chamber 2 through a substrate loading / unloading port 21 by a transfer arm (not shown) from a load lock chamber (not shown), and on the susceptor body 4a, that is, the susceptor body 4a. It is placed on the protrusion 5a made of a dielectric material and the insulating member 6 formed on the surface. In this case, the elevating pins 30 protrude upward and are positioned at the support position, and transfer the glass substrate G on the transfer arm onto the elevating pins 30. Thereafter, the lift pins 30 are lowered to place the glass substrate G on the susceptor body 4a.

  Thereafter, the gate valve 22 is closed, and the inside of the chamber 2 is evacuated to a predetermined vacuum level by the exhaust device 20. Then, the valve 16 is opened, and the processing gas from the processing gas supply source 18 is adjusted by the mass flow controller 17, and the internal space 12 of the shower head 11 passes through the processing gas supply pipe 15 and the gas inlet 14. Then, the liquid is uniformly discharged to the substrate G through the discharge holes 13, and the inside of the chamber 2 is controlled to a predetermined pressure while adjusting the exhaust amount.

  In this state, high frequency power is applied from the high frequency power supply 25 to the susceptor body 4a via the matching unit 24, and a high frequency electric field is generated between the susceptor 4 as the lower electrode and the shower head 11 as the upper electrode, thereby processing gas. And the glass substrate G is etched by this plasma.

  After performing the etching process in this manner, the application of the high frequency power from the high frequency power supply 25 is stopped, the introduction of the processing gas is stopped, the pressure in the chamber 2 is adjusted to a predetermined pressure, and the glass is lifted by the lift pins 30. The substrate G is raised to the support position. In this state, the gate valve 22 is opened, a transfer arm (not shown) is inserted into the chamber 2, and the glass substrate G on the lift pins 30 is transferred to the transfer arm. Then, the glass substrate G is unloaded from the chamber 2 to the load lock chamber (not shown) through the substrate loading / unloading port 21.

  In the above processing, when the glass substrate G is carried in and out, the elevating pin 30 is positioned at the support position protruding from the surface of the susceptor body 4a. In such a case, the transfer arm or the like is used as the elevating pin. Collisional accidents can occur and lateral forces can be exerted. In the case where the force at that time is of a magnitude that deforms the lifting pin, conventionally, the lifting pin 30 is deformed by the force at that time and directly damages the susceptor body 4a, or the lifting pin 30 There was a situation in which the susceptor body 4a was damaged by continuing to use it while being deformed.

  On the other hand, in the case of this embodiment, when a lateral force such as a collision of the transfer arm is applied to the lifting pin 30, if the force exceeds a predetermined value, the lifting pin 30 is assisted before the deformation. The constricted portion 40 of the member 39 is broken, and the elevating pin 30 is broken at the boundary portion 38 of the bent portion 35. For this reason, it is possible to prevent the susceptor body 4a from being damaged.

  On the other hand, the lifting pins 30 need to have a certain degree of strength so as not to bend or bend when the glass substrate G is supported. From such a viewpoint, the lower member 30a and the upper member 30b are bonded with an adhesive at the boundary portion 38 so that the elevating pin 30 does not break from the boundary portion 38 when the glass substrate G is supported, The auxiliary member 39 functions as a reinforcing material. That is, the auxiliary member 39 functions as a reinforcing member during normal use, and functions as a breakage guiding member so as to break from the constricted portion 40 when a lateral force is applied.

  As described above, in the present embodiment, from the viewpoint of reinforcing the elevating pin 30, the lower member 30a and the upper member 30b are bonded to each other at the boundary portion 38 with an adhesive, but the auxiliary member 39 may have a sufficient reinforcing function. For example, it is not always necessary to bond with an adhesive. Further, the adhesion with the adhesive is not necessarily required between the auxiliary member 39 and the lower member 30a and the upper member 30b.

  Further, the shape of the constricted portion of the auxiliary member 39 is not limited to the shape as shown in FIG. 4, and various shapes can be adopted in consideration of the function as the reinforcing material and the function as the breakage guiding member. It is possible to employ a constricted portion 40 ′ having a shape as shown in (a) and a constricted portion 40 ″ having a shape as shown in (b).

  Further, the constricted portion 40 of the auxiliary member 39 is not essential. In other words, if the auxiliary member 39 is configured to be surely broken when the transport arm collides with the lifting pin 30 and is broken from the adhesive portion 38, the constricted portion 40 does not have to be provided as shown in FIG. Good.

  Furthermore, not only the ring-shaped auxiliary member 39 that completely covers the periphery of the boundary portion 38 as described above, but also having the function as the reinforcing agent and the function as the breakage induction member, for example, the crossing of FIG. As shown in the plan view, an auxiliary member 39 ′ covering a part of the periphery of the boundary portion 38 may be used.

  Further, the elevating pin 30 may not be provided with such an auxiliary member 39. For example, as shown in FIG. 10, a lower member 30 a and an upper member 30 b may be provided integrally, and a constricted portion 50 may be formed between them to form a bent portion 35. In this case, the constricted portion 50 secures sufficient strength so as not to be deformed when the glass substrate G is raised and lowered, and when the raising and lowering pin 30 receives a lateral force when it is in the support position. Before the elevating pin 30 is deformed, it needs to be formed so as to be broken and broken there. Therefore, it is necessary to adjust the amount and shape of the constricted portion in consideration of the strength of the material constituting the elevating pin 30. From this point of view, the shape of the constricted portion is not limited to the constricted portion 50 in FIG. 10, and various shapes can be adopted. For example, the constricted portion 50 ′ having the shape as shown in FIG. It is possible to employ a constricted portion 50 ″ having a shape as shown in b).

  It is important to prevent the elevating pins 30 from rubbing with the susceptor body 4a, scratches on the glass substrate G, and abnormal discharge while securing the strength when supporting the glass substrate G to prevent it from being broken. In this case, as shown in FIG. 12, the bent pin 35 is not provided, and the upper part of the elevating pin 30 can be configured to cover the resin material 62 around the stainless steel core material 61.

In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible.
For example, in this embodiment, an example in which the substrate mounting table of the present invention is applied to a susceptor as a lower electrode in an RIE type capacitively coupled parallel plate plasma etching apparatus that applies high-frequency power to the lower electrode has been described. The present invention can be applied not only to other plasma processing apparatuses such as ashing and CVD film formation, but also to a type that supplies high-frequency power to the upper electrode. Also good. Further, the present invention is not limited to plasma processing, and can be applied to other processing apparatuses.

  Further, the substrate to be processed is not limited to the FPD glass substrate G but may be another substrate such as a semiconductor wafer.

Sectional drawing which shows the plasma etching apparatus which is an example of the processing apparatus provided with the susceptor as a substrate mounting base concerning one Embodiment of this invention. Sectional drawing which expands and shows the susceptor in the processing apparatus of FIG. The top view for demonstrating arrangement | positioning of the raising / lowering pin in a susceptor main body. The figure which shows an example of the structure of the raising / lowering pin used for the susceptor as a substrate mounting base concerning one Embodiment of this invention. Schematic for demonstrating the maintenance method of the raising / lowering pin in the susceptor of this embodiment. The figure which shows the example made into the structure which covered the upper member of the raising / lowering pin of FIG. 4 with the core material made from stainless steel with the resin material. Sectional drawing which shows the other example of the constriction part formed in the auxiliary member of the raising / lowering pin in the susceptor of this embodiment. The figure which shows the modification of an raising / lowering pin. The horizontal sectional view which shows the other example of the auxiliary member provided in the raising / lowering pin. The figure which shows the other modification of an raising / lowering pin. The side view which shows the other example of the constriction part formed in the raising / lowering pin of FIG. The figure which shows the other example of the structure of a raising / lowering pin.

Explanation of symbols

1: Processing equipment (plasma etching equipment)
2; Chamber (processing container)
3; Insulating plate 4; Susceptor (substrate mounting table)
4a: Susceptor body (mounting table body)
5; base material 5a; convex portion 6; insulating member 7; spacer member 11; shower head (gas supply means)
20; exhaust device 25; high frequency power supply (plasma generating means)
30; Elevating pin 30a; Lower member 30b; Upper member 35; Folded part 36, 37; Convex part 38; Boundary part 39; Auxiliary member 40, 40 ', 40 "; Constricted part 41; Maintenance part 42; Core material 43; Material 50, 50 ', 50 "; Constriction G: Glass substrate

Claims (17)

A substrate mounting table for mounting a substrate in a substrate processing apparatus,
A mounting table body;
It is vertically inserted with respect to the mounting table main body, is provided so as to be able to move up and down so as to project and sink with respect to the surface of the mounting table main body, and includes a lifting pin that supports and lifts the substrate at its tip.
The elevating pin has an upper member and a lower member, has a bent portion formed by providing an auxiliary member around these boundary portions, and is retracted into the mounting table main body, It is possible to take a support position that protrudes from the mounting table main body and supports the substrate,
When the elevating pin is in the support position, the fold is present at the surface position of the mounting table main body or a position above it, and the fold is applied when a lateral force is applied to the elevating pin. The substrate mounting table is formed so as to be bent with a force smaller than a force by which the elevating pins are deformed.   The substrate mounting table according to claim 1, wherein the upper member and the lower member are bonded at the boundary portion.   The substrate mounting table according to claim 1, wherein the auxiliary member has a ring shape that covers the periphery of the boundary portion.   The substrate mounting table according to any one of claims 1 to 3, wherein the auxiliary member is bonded to the upper member and the lower member.   The said auxiliary | assistant member has a constriction part in which the constriction was formed in the position corresponding to the boundary part of the said upper member and the said lower member, The any one of Claims 1-4 characterized by the above-mentioned. Substrate mounting table.   The substrate mounting table according to any one of claims 1 to 5, wherein the upper member, the lower member, and the auxiliary member are made of metal.   The substrate mounting table according to claim 6, wherein the upper member, the lower member, and the auxiliary member are made of stainless steel.   6. The substrate mounting table according to claim 1, wherein the upper member includes a metal core and a resin member that covers the periphery and an upper portion thereof. A substrate mounting table for mounting a substrate in a substrate processing apparatus,
A mounting table body;
It is vertically inserted with respect to the mounting table main body, is provided so as to be able to move up and down so as to project and sink with respect to the surface of the mounting table main body, and includes a lifting pin that supports and lifts the substrate at its tip.
The elevating pin can take a retracted position submerged in the mounting table main body and a support position that protrudes from the mounting table main body and supports the substrate. A constricted portion in which a constriction is formed at a surface position or a position above it, and the constricted portion is smaller than a force that deforms the lifting pin when a lateral force is applied to the lifting pin. A substrate mounting table which is formed so as to be bent by force.   The substrate mounting table according to claim 9, wherein the lifting pins are made of metal.   The substrate mounting table according to claim 10, wherein the lifting pins are made of stainless steel.   10. The substrate mounting table according to claim 9, wherein an upper part of the elevating pin has a metal core material and a resin member covering the periphery and upper part of the metal core material.   The substrate mounting table according to claim 9, wherein the elevating pins are composed of different members above and below the constricted portion.   The substrate mounting table according to any one of claims 1 to 13, wherein the processing apparatus performs plasma processing, and the mounting table body functions as a lower electrode. A processing container for containing a substrate;
A substrate mounting table provided in the processing container and on which a substrate is mounted;
A processing mechanism for performing a predetermined process on the substrate in the processing chamber;
15. The substrate processing apparatus, wherein the substrate mounting table has the configuration according to any one of claims 1 to 14.   The processing mechanism includes a gas supply mechanism that supplies a processing gas into the processing container, an exhaust mechanism that exhausts the processing container, and a plasma generation mechanism that generates plasma of the processing gas in the processing container. The substrate processing apparatus according to claim 15.   The plasma generation mechanism includes the substrate mounting table that functions as a lower electrode, an upper electrode provided to face the substrate mounting table, and a high-frequency power source that applies high-frequency power to the substrate mounting table. The substrate processing apparatus according to claim 16.

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