JP2009059742A - Surface mount capacitors and capacitor elements - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mount type capacitor having a large capacitor capacity per volume, easily adapting to an application change after circuit design and having a small board area required for mounting, and a capacitor element used therefor.
A bottom electrode has a substantially rectangular plate shape, and is mounted on a mounting surface along a first side, an opposite side parallel to the first side, and a line segment connecting the midpoints of those sides with a straight line. A cathode terminal 7 having an exposed anode terminal 6 and exposed to the mounting surface from the central part of each of the second side perpendicular to the first side and the opposite side parallel to the second side to the center of the rectangle. The overall shape of the capacitor element 100 is a substantially rectangular plate shape, the first side, the opposite side parallel to the first side, and the line segment connecting the midpoints thereof A cathode layer extending from the center of each of the second side adjacent to the first side and the opposite side parallel to the second side toward the inside of the rectangle. It has.
[Selection] Figure 2

Description

  Surface mount type having a capacitor element using a metal with an expanded valve action metal as an anode lead and a solid electrolyte as a cathode material, and having a plurality of anode terminals connected to the anode lead and provided on a product mounting surface The present invention relates to a capacitor and its capacitor element.

  In recent years, information electronic devices such as mobile phones have been widely used in the world. These information electronic devices use digital circuit technology. Recently, digital circuit technology such as LSI is also used in computers, communication-related devices, home appliances, and in-vehicle devices. Furthermore, it is known that when the above-described LSI is operated, a high-frequency current is generated in the power supply line of the LSI. As a countermeasure, it is effective to separate the LSI, which is the source of the high-frequency current, from the power supply system at high frequency, that is, a power supply decoupling technique. When using a capacitor to remove electrical noise over a wide frequency band, multiple types of capacitors, for example, different types of capacitors such as aluminum electrolytic capacitors, tantalum capacitors, and ceramic capacitors with different self-resonant frequencies, are located near the LSI. It has been done by providing multiple.

  Conventionally, solid electrolytic capacitors using aluminum, tantalum, or the like as a valve action metal have been widely used in CPU decoupling circuits or power supply circuits because they are small and have a large capacitance and excellent frequency characteristics. In particular, the development of surface mount type solid electrolytic capacitors having low ESR (equivalent series resistance) and low ESL (equivalent series inductance) at high frequencies is in progress.

  According to Patent Document 1, a structure having a capacitor shape in which a first metal plate having two anode terminals and having a substantially flat plate shape is sandwiched between two cathode terminals having a substantially flat plate shape is used. The noise removal performance in the above high frequency region can be improved.

  According to Patent Document 2, a distributed constant circuit forming portion in which two dielectrics having a substantially flat plate shape sandwich a metal plate having a substantially flat plate shape, a cathode terminal conducting to the distributed constant circuit portion, By adopting a basic structure that includes an electrode part partially protruding from a dielectric and an anode terminal electrically connected to the electrode part, it is possible to remove broadband frequency noise with high accuracy. it can.

  The surface-mount type capacitors in Patent Document 1 and Patent Document 2 can be used for the following two types of applications depending on the method of connecting lands on the substrate. One is a three-terminal type capacitor in which each of two anode terminals of a product is connected by separate lands on the substrate and one cathode terminal is connected by a land on the substrate as shown in FIG. When used as a noise filter, it can be used as a noise filter capable of removing broadband frequency noise with high accuracy. The other is, as shown in FIG. 15B, two anode terminals of a product are connected by a common land on the substrate, and one cathode terminal is connected by a land on the substrate to form a two-terminal capacitor. In general, it is used as a bypass capacitor or decoupling. However, as shown in FIG. 15, in the case of functioning as a three-terminal capacitor and in the case of functioning as a two-terminal capacitor, the conventional structure has a cathode terminal sandwiched between two anode terminals. There is a problem that the area occupied by the land pattern, that is, the area on the substrate necessary for mounting the capacitor, is different, and it becomes difficult to change the application of the two-terminal type and the three-terminal type after circuit design.

  According to Patent Document 3, in a surface mount type capacitor having a plurality of anode terminals, the anode terminals are provided on the same product side surface substantially perpendicular to the product mounting surface, thereby providing two terminals as shown in FIG. Whether mounted as a type capacitor or a three-terminal type capacitor, the area on the substrate required for mounting is almost constant. However, as shown in FIG. 16, the shape of the capacitor element is a structure having a curved portion such as a U-shape, U-shape, or V-shape. There is a problem that the occupancy rate of the battery is low and the capacity is low compared with the volume.

JP 2002-313676 A JP 2002-164760 A JP 2006-73791 A

  In the above situation, the technical problem of the present invention is that it is easy to cope with a change in use after circuit design, has a large capacitor capacity per volume, and has a small board area required for mounting and a surface mount capacitor used therefor It is to provide a capacitor element.

  In order to solve the above-mentioned problems, a surface mount capacitor of the present invention has a capacitor element using a metal with an enlarged valve action metal as an anode lead and a solid electrolyte as a cathode, and is connected to the anode lead and mounted. A surface-mounted capacitor having an anode terminal appearing on a surface and having a cathode terminal connected to a cathode layer and appearing on a mounting surface, wherein the capacitor element is a porous body made of a valve action metal from which an anode lead is derived. A dielectric, a solid electrolyte, and a cathode layer are sequentially formed on the surface, and has an overall shape of a substantially rectangular plate. Each of the first side, the opposite side parallel to the first side, the first side, and the opposite side An H-shaped anode formed along a line connecting the middle points, and a rectangular shape from the center of each side of the second side adjacent to the first side and the opposite side parallel to the second side. With cathode layer extending inward The anode terminal and the cathode terminal are formed in a substantially rectangular plate-like lower surface electrode portion, and the shape of the anode terminal appearing on the mounting surface and the surface facing the capacitor element is substantially rectangular as in the capacitor element. And the opposite side parallel to the first side and a line segment connecting the first side and the midpoint of each of the opposite sides, and the cathode terminal is mounted on the mounting surface and the capacitor. The shape appearing on the surface facing the element is a shape extending from the center of each side of the second side adjacent to the first side and the opposite side of the second side toward the inside of the rectangle. Features.

  Further, the surface mount type capacitor of the present invention has a pair of capacitor elements in which a metal with an expanded valve action metal is used as an anode lead and a solid electrolyte as a cathode, and is connected to the anode lead and appears on the mounting surface. A surface-mounted capacitor having a terminal and having a cathode terminal connected to a cathode layer and appearing on a mounting surface, wherein the capacitor element has a dielectric on a surface of a porous body made of a valve metal from which an anode lead is derived. The solid electrolyte and the cathode layer are sequentially formed, and have an overall shape of a substantially rectangular plate, adjacent to the first side, the opposite side parallel to the first side, and the first side and the opposite side. And a U-shaped anode formed along the second side extending from the center of the second side adjacent to the first side toward the opposite side parallel to the second side. The anode terminal and the cathode terminal are substantially A shape formed on a rectangular plate-like lower surface electrode portion and the anode terminal appearing on the mounting surface and the surface facing the capacitor element is a substantially rectangular first side, an opposite side parallel to the first side, and the first side. H-shape formed along one side and a line segment connecting each midpoint on the opposite side, and the shape of the cathode terminal appearing on the mounting surface and the surface facing the capacitor element is the first It is a shape extending from the center of each side of the second side adjacent to the side and the opposite side of the second side toward the inside of the rectangle.

  The valve metal may be aluminum, tantalum, niobium, niobium oxide, titanium, or vanadium.

  The capacitor element of the present invention is a capacitor element that is used for a surface-mounted capacitor and uses a metal with an enlarged valve action metal as an anode lead and a solid electrolyte as a cathode, and the valve from which the anode lead is derived. A dielectric, a solid electrolyte, and a cathode layer are sequentially formed on the surface of a porous body made of a working metal, and has an overall shape of a substantially rectangular plate. The first side, the opposite side parallel to the first side, and the first side An H-shaped anode formed along a line connecting one side and the midpoint of each of the opposite sides, the second side adjacent to the first side and each side at the opposite side of the second side A cathode layer extending from the central portion toward the inside of the rectangle is provided.

  The capacitor element of the present invention is a capacitor element that is used for a surface-mounted capacitor and uses a metal with an enlarged valve action metal as an anode lead and a solid electrolyte as a cathode, and the valve from which the anode lead is derived. A dielectric body, a solid electrolyte, and a cathode layer are sequentially formed on the surface of a porous body made of a working metal, and has an overall shape of a substantially rectangular plate. A first side and an opposite side parallel to the first side A U-shaped anode formed along a second side adjacent to both the first side and the opposite side, and the opposite side from the center of the second side adjacent to the first side And a cathode layer extending toward the surface.

  According to the present invention, the capacity of the capacitor with respect to the volume is high, and the area occupied by the land pattern on the substrate can be made equal in the case of functioning as a three-terminal capacitor and in the case of functioning as a two-terminal capacitor. Easy to adapt to changing applications. In addition, a surface mount capacitor having a high occupation ratio of the capacitor element with respect to the entire product volume can be obtained.

  Next, an embodiment of the present invention will be described.

(Embodiment 1)
First, a diagram relating to the capacitor element of the surface mount type solid electrolytic capacitor in the first embodiment of the present invention will be described. FIG. 1 is a diagram for explaining the structure of a capacitor element included in a surface mount type solid electrolytic capacitor. FIG. 1 (a) is a plan view of the capacitor element, FIG. 1 (b), FIG. 1 (c), FIG. 1 (d) is a schematic cross-sectional view taken along lines AA, BB, and CC in the plan view shown in FIG. 1 (a). In addition, since the actual cross section has become very complicated due to the expansion of the surface of the valve action metal, it has been schematically shown in order to simply show the order of the formation layers and the formation regions.

  Next, the structure of the capacitor element according to Embodiment 1 of the present invention will be described with reference to FIG. As shown in FIG. 1A, the capacitor element has a substantially rectangular plate shape. The shape of the exposed anode lead is a shape including a first side, an opposite side parallel to the first side, and a line connecting the midpoints of these sides. This is similar to the letter H in the alphabet. As shown in the cross-sectional views of FIGS. 1B and 1C, the anode lead is also located at the center of the capacitor element.

  The central portion of the anode lead is exposed in FIG. 1B, the end portion in FIG. 1C, and the whole in FIG. 1D. A dielectric 2 is formed on the surface excluding the anode lead portion exposed in FIGS. 1 (a) to 1 (d). On the surface of the dielectric 2, a cathode layer made of a solid electrolyte 3, graphite 4 and silver 5 is formed. In order to prevent short circuit between the exposed anode lead 1 and the cathode layer, an extra dielectric 2 is formed on the anode lead side. The anode lead of the capacitor element uses a valve action metal such as aluminum, tantalum, niobium, niobium oxide, titanium, or vanadium. Among these, aluminum which is advantageous for reducing the product height is preferable. Solid electrolytes used for the cathode layer include metal oxide semiconductors such as manganese dioxide, and conductive polymers such as polyaniline, polythiophene, and polypyrrole. Among these, a conductive polymer having high conductivity is preferable, and polypyrrole having a low cost is optimal.

  Next, a method of connecting the lower surface electrode of the surface mount capacitor product and the capacitor element in the first embodiment of the present invention will be described with reference to FIG. The anode lead 1 of the capacitor element 100 and the anode terminal 6 of the lower electrode are electrically connected, and the silver 5 of the capacitor element 100 and the cathode terminal 7 of the lower electrode are electrically connected. The anode terminal 6 and the cathode terminal 7 at the three locations on the bottom electrode of the product are electrically separated by the insulating resin 8. The capacitor element 100 can be stacked in a plurality, and the capacitance and ESR can be controlled by the number of stacked layers.

  Next, a surface mount capacitor product according to the first embodiment of the present invention will be described with reference to FIG. 3A is an overhead view (perspective view) of the surface-mounted solid electrolytic capacitor in Embodiment 1, FIG. 3B is a plan view seen from the upper surface of FIG. 3A, and FIG. ) Is a bottom view as viewed from the lower surface of FIG. 3A, FIG. 3D is a side view as viewed from side A of FIG. 3A, and FIG. 3E is from side B of FIG. 3A. FIG. As shown in FIG. 3, after the capacitor element and the product lower surface electrode portion are connected, the capacitor element is covered with an exterior resin 9 for sealing. The exterior resin is preferably an acrylic resin, a phenol resin, or an epoxy resin. Of these, thermally and chemically stable epoxy resins are preferred.

  Next, the surface mount type capacitor according to the first embodiment of the present invention will be described with reference to FIGS. 4, 5, and 6 are diagrams illustrating sections D, E, and F in the overhead view of FIG. The capacitor element and the lower electrode can be connected by resistance welding, laser welding, or conductive resin. Among these, the conductive resin 10 that is advantageous for alleviating distortion due to a step corresponding to the thickness of the dielectric of the capacitor element and the cathode is preferable.

  Similarly, the cathode layer and the anode lead of the capacitor elements are connected by the conductive resin 10. Next, the area required for mounting the two-terminal and three-terminal surface mount capacitors on the substrate in the surface mount capacitor according to the first embodiment of the present invention will be described with reference to FIG. FIG. 7A is a board land plane pattern diagram when mounted as a three-terminal capacitor, and FIG. 7B is a board land plane pattern diagram when mounted as a two-terminal capacitor. In the figure, 11 and 12 are lands for connecting the anode terminal on the lower surface of the product, 13 and 14 in the figure are lands for connecting the cathode terminal on the lower surface of the product, and 15 is a substrate. As shown in FIG. 7, the land pattern occupies the same area on the board according to the three-terminal type and two-terminal type capacitor applications, so the area required for mounting is almost the same. Cheap.

(Embodiment 2)
First, a diagram relating to the capacitor element of the surface mount capacitor according to the second embodiment of the present invention will be described. FIG. 8 is a diagram for explaining the structure of a capacitor element included in the surface-mounted capacitor according to the present embodiment. 8A is a plan view of the capacitor element, and FIGS. 8B and 8C are views taken along lines GG and HH in the plan view shown in FIG. 8A, respectively. It is typical sectional drawing explaining the cross section of.

  Next, the structure of the capacitor element according to the second embodiment of the present invention will be described with reference to FIG. As shown in FIG. 8A, the capacitor element has a substantially rectangular plate shape. The exposed anode lead 1 has a shape including a first side, a side parallel to the first side, and a second side perpendicular to the first side. This is similar to the U-shape of Katakana. A dielectric 2 is formed on the surface excluding the anode lead 1 exposed in FIGS. 8A to 8C. A cathode layer made of a solid electrolyte, graphite, and silver 5 is formed on the surface of the dielectric. In order to prevent a short circuit between the exposed anode lead 1 and the cathode layer, an extra dielectric 2 is formed on the anode lead side. The material described in Embodiment 1 is used as the material used in this capacitor element.

  Next, a method of connecting the lower surface electrode of the surface mount capacitor product and the capacitor element in the second embodiment will be described with reference to FIG. The capacitor elements 200 are arranged in pairs so as to be symmetrical about the anode lead 1 on the long side of the capacitor element 200. The connection method is the same as in the first embodiment. Capacitor elements can be stacked in multiple layers, and the capacitance and ESR can be controlled by the number of stacked layers. The product structure of the surface mount capacitor in the second embodiment is different from that in the first embodiment described above in FIGS. 3 to 6 except that the number of capacitor elements in the same layer at the time of stacking is two. And the same structure. Further, in the surface mount type capacitor in the second embodiment, the area required for mounting on the substrate as a two-terminal type and a three-terminal type surface mount type capacitor is the same as the substrate land pattern of FIG. 7 described in the first embodiment. It becomes the same.

(Comparative Example 1)
First, a diagram related to the surface mount capacitor in Comparative Example 1 will be described. FIG. 10 is a diagram for explaining the structure of a capacitor element included in a surface mount capacitor. 10A is a plan view of the capacitor element, and FIGS. 10B and 10C are cut along the II and JJ lines in the plan view shown in FIG. 10A, respectively. It is typical sectional drawing explaining the cross section of. Next, a method for connecting the lower surface electrode and the capacitor element in the first comparative example will be described with reference to FIG. The connection method is the same as in the first embodiment. The capacitor element 300 can be stacked in a plurality of layers, and the capacitance and ESR can be controlled by the number of stacked layers.

  Next, the structure of the surface mount capacitor of Comparative Example 1 will be described with reference to FIG. 12A is an overhead view, FIG. 12B is an upper surface, FIG. 12C is a lower surface, FIG. 12D is a side surface A, and FIG. The exposed anode terminal is located at both ends of the capacitor element including the first side and the side parallel to the first side. The material of the capacitor element is the same as in the first and second embodiments.

  Next, the internal structure of the surface mount capacitor of Comparative Example 1 will be described with reference to FIGS. FIGS. 13 and 14 show sections K and L, respectively, in the overhead view of FIG. The cathode layer and anode lead between the capacitor elements, and the anode terminal and cathode terminal of the bottom electrode are electrically connected. The laminated capacitor elements are covered with an exterior resin as in the first and second embodiments. For the connection method and the exterior resin, the same method and the same material as those in Embodiments 1 and 2 are used.

  Next, the area required for mounting the two-terminal type and three-terminal type surface-mounted capacitors on the substrate in the surface-mounted capacitor of Comparative Example 1 will be described with reference to FIG. FIG. 15A is a board land plane pattern diagram when mounted as a three-terminal capacitor, and FIG. 15B is a board land plane pattern diagram when mounted as a two-terminal capacitor. 11 and 12 are lands that connect the anode terminal, 13 is a land that connects the cathode terminal, and 15 is a substrate. As shown in FIG. 15, in the conventional structure, in order to connect two anode terminals parallel to each other, the cathode terminal is bypassed and connected, so the area occupied by the land pattern on the substrate, that is, on the substrate necessary for mounting the capacitor. There is a problem that the areas are different, and it becomes difficult to change the usage of the two-terminal type and the three-terminal type after circuit design.

(Comparative Example 2)
First, a diagram related to the surface mount capacitor of Comparative Example 2 will be described. FIG. 16 is a diagram for explaining the structure of a capacitor element included in a surface mount capacitor. 16A is a plan view of the capacitor element, and FIGS. 16B, 16C, and 16D are lines MM and OO in the plan view shown in FIG. It is a typical sectional view explaining a section when cut with a line and a PP line, respectively. The shape of the capacitor element is a U-shape and an anode lead is provided at one end. The material of the capacitor element is the same as in the first embodiment.

  Next, a method of connecting the lower surface electrode and the capacitor element of this comparative example will be described with reference to FIG. The connection method is the same as in the first embodiment. The capacitor element 400 can be stacked in a plurality, and the capacitance and ESR can be controlled by the number of stacked layers.

  Next, the structure of the surface mount capacitor in Comparative Example 2 will be described with reference to FIG. 18A is an overhead view, FIG. 18B is an upper surface, FIG. 18C is a lower surface, FIG. 18D is a side surface A, and FIG. The two exposed anode terminals 6 are formed on the side opposite to the side surface B. Since the space inside the curved portion of the capacitor element is sealed with the exterior resin 9, the occupation ratio of the capacitor element to the product is low, and the capacity is low compared to the volume.

  Next, the internal structure of the surface mount capacitor of Comparative Example 2 will be described with reference to FIGS. 19, FIG. 20, and FIG. 21 show sections Q, R, and S, respectively, in the overhead view of FIG. In addition, the code | symbol of each part is common to other drawings. As the connection method and the exterior resin, the same method and the same material as those in Embodiment 1 are used.

  Next, the area required for mounting the two-terminal and three-terminal surface mount capacitors on the substrate in the surface mount capacitor of Comparative Example 2 will be described with reference to FIG. 22A is a board land plane pattern diagram when mounted as a three-terminal capacitor, and FIG. 22B is a board land plane pattern diagram when mounted as a two-terminal capacitor. In the figure, 11 and 12 are lands for connecting the anode terminal on the lower surface of the product, 13 is a land for connecting the cathode terminal on the lower surface of the product, and 15 is a substrate. As shown in FIG. 22, the land pattern occupies the same area on the board according to the three-terminal type and two-terminal type capacitor applications, so the area required for mounting is almost the same, corresponding to application changes after circuit design. This is preferable because it is easy.

  The surface-mounted capacitor according to the present invention can be applied to a solid electrolytic capacitor of a type that is surface-mounted on a substrate such as a printed wiring board of an electronic component or an electrical component.

The figure explaining the structure of the capacitor | condenser element included in the surface mount type capacitor of Embodiment 1 of this invention. 1A is a plan view of the capacitor element, and FIGS. 1B, 1C, and 1D are lines AA, BB, and C- of FIG. 1A, respectively. The typical sectional view when cut by C line. The figure explaining the connection form of the surface mount type capacitor of Embodiment 1 of this invention, the lower surface electrode, and the capacitor | condenser element included. The figure explaining the structure of the surface-mounted capacitor | condenser of Embodiment 1 of this invention. 3A is an overhead view, FIG. 3B is an upper surface, FIG. 3C is a lower surface, FIG. 3D is a side surface A, and FIG. FIG. 4 is a schematic cross-sectional view of the cross-section D shown in FIG. 3A in the surface mount capacitor of Embodiment 1 of the present invention. FIG. 4 is a schematic cross-sectional view of the cross-section E shown in FIG. 3A in the surface mount capacitor of Embodiment 1 of the present invention. FIG. 4 is a schematic cross-sectional view of the cross-section F shown in FIG. 3A in the surface mount capacitor of Embodiment 1 of the present invention. The figure which compared the land pattern when mounting the surface mount type capacitor of Embodiment 1 of this invention on a board | substrate according to a use. 7A is a board land plane pattern diagram of a three-terminal structure, and FIG. 7B is a board land plane pattern diagram of a two-terminal structure. The figure explaining the structure of the capacitor | condenser element included in the surface mount type capacitor of Embodiment 2 of this invention. 8A is a plan view of the capacitor element, and FIGS. 8B and 8C are schematic cross-sectional views taken along lines GG and HH in FIG. 8A, respectively. . The figure explaining the connection form of the surface mount type capacitor of Embodiment 2 of this invention, the lower surface electrode, and the capacitor | condenser element included. FIG. 6 is a diagram for explaining a structure of a capacitor element included in a surface mount capacitor of Comparative Example 1; 10A is a plan view of the capacitor element, and FIGS. 10B and 10C are schematic cross-sectional views taken along lines II and JJ in FIG. 10A, respectively. . The figure explaining the connection form of the capacitor | condenser element included in a lower surface electrode with the surface mount type capacitor of the comparative example 1. FIG. 6A and 6B illustrate a structure of a surface mount capacitor of Comparative Example 1. FIG. 12A is an overhead view, FIG. 12B is an upper surface, FIG. 12C is a lower surface, FIG. 12D is a side surface A, and FIG. The figure explaining the internal structure of the surface mount type capacitor of the comparative example 1. FIG. 13 is a schematic cross-sectional view of the cross section K shown in FIG. FIG. 13 is a schematic cross-sectional view of the cross-section L shown in FIG. The figure which compared the land pattern when mounting the surface mount type capacitor of the comparative example 1 on a board | substrate according to a use. 15A is a board land plane pattern diagram of a three-terminal structure, and FIG. 15B is a board land plane pattern diagram of a two-terminal structure. FIG. 6 is a diagram for explaining a structure of a capacitor element included in a surface-mounted capacitor of Comparative Example 2. 16 (a) is a plan view of the capacitor element, and FIGS. 16 (b), 16 (c), and 16 (d) are the MM line, OO line, and P- of FIG. 16 (a), respectively. The typical sectional view when cut by P line. The figure explaining the connection form of the capacitor | condenser element included in a lower surface electrode with the surface mount type capacitor of the comparative example 2. FIG. FIG. 6 illustrates a structure of a surface mount capacitor of Comparative Example 2. 18A is an overhead view, FIG. 18B is an upper surface, FIG. 18C is a lower surface, FIG. 18D is a side surface A, and FIG. FIG. 19 is a schematic cross-sectional view of the cross-section Q shown in FIG. FIG. 19 is a schematic cross-sectional view of the cross-section R shown in FIG. FIG. 19 is a schematic cross-sectional view of the cross section S shown in FIG. The figure which compared the land pattern when mounting the surface mount type capacitor of the comparative example 2 on a board | substrate according to a use. 22A is a board land plane pattern diagram of a three-terminal structure, and FIG. 22B is a board land plane pattern diagram of a two-terminal structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anode lead 2 Dielectric 3 Solid electrolyte 4 Graphite 5 Silver 6 Anode terminal 7 Cathode terminal 8 Insulation resin 9 Exterior resin 10 Conductive resin 11, 12, 13, 14 Land 15 Board | substrate 100,200,300,400 Capacitor element

Claims (5)

It has a capacitor element using a metal with an expanded valve action metal as an anode lead and a solid electrolyte as a cathode, and has an anode terminal connected to the anode lead and appearing on the mounting surface, and connected to the cathode layer on the mounting surface. A surface mount capacitor having a cathode terminal that appears,
The capacitor element is formed by sequentially forming a dielectric, a solid electrolyte, and a cathode layer on the surface of a porous body made of a valve metal from which an anode lead is derived, and has an overall shape of a substantially rectangular plate,
Comprising an H-shaped anode formed along the first side, the opposite side parallel to the first side, and a line segment connecting the midpoint of each of the first side and the opposite side;
A cathode layer extending from the center of each side of the second side adjacent to the first side and the opposite side parallel to the second side toward the inside of the rectangle;
The anode terminal and the cathode terminal are formed on a substantially rectangular plate-like bottom electrode part,
The shape of the anode terminal appearing on the mounting surface and the surface facing the capacitor element is the same as the capacitor element, the first side of the substantially rectangular shape, the opposite side parallel to the first side, the first side and the opposite side. H-shape formed along the line connecting the middle points of
The shape of the cathode terminal appearing on the mounting surface and the surface facing the capacitor element is from the center of each side of the second side adjacent to the first side and the opposite side of the second side toward the inside of the rectangle. Surface-mount type capacitor characterized by having a shape that extends. It has a capacitor element pair that uses a metal with an expanded valve action metal as the anode lead and a solid electrolyte as the cathode, has an anode terminal connected to the anode lead and appearing on the mounting surface, and connected to the cathode layer for mounting A surface mount capacitor having a cathode terminal appearing on the surface,
The capacitor element is formed by sequentially forming a dielectric, a solid electrolyte, and a cathode layer on the surface of a porous body made of a valve metal from which an anode lead is derived, and has an overall shape of a substantially rectangular plate,
A U-shaped anode formed along the first side, the opposite side parallel to the first side, and the second side adjacent to both the first side and the opposite side;
A cathode layer extending from the center of the second side adjacent to the first side toward the opposite side parallel to the second side;
The anode terminal and the cathode terminal are formed on a substantially rectangular plate-like bottom electrode part,
The shape of the anode terminal appearing on the mounting surface and the surface facing the capacitor element is a substantially rectangular first side, an opposite side parallel to the first side, and a midpoint of each of the first side and the opposite side. An H-shape formed along the connecting line segment,
The shape of the cathode terminal appearing on the mounting surface and the surface facing the capacitor element is from the second side adjacent to the first side and the center of each side of the second side to the inside of the rectangle. A surface-mounted capacitor characterized by an extended shape.   3. The surface mount capacitor according to claim 1, wherein the valve metal is aluminum, tantalum, niobium, niobium oxide, titanium, or vanadium. A capacitor element that is used for a surface mount type capacitor and uses a metal with an enlarged valve action metal as an anode lead and a solid electrolyte as a cathode,
A dielectric, a solid electrolyte, and a cathode layer are sequentially formed on the surface of a porous body made of a valve metal from which an anode lead is derived,
An H-shaped anode having an overall shape of a substantially rectangular plate, formed along a first side, an opposite side parallel to the first side, and a line segment connecting the midpoints of the first side and the opposite side With
A capacitor element, comprising: a cathode layer extending toward the inside of the rectangle from a central portion of each of the second side adjacent to the first side and the opposite side of the second side. A capacitor element that is used for a surface mount type capacitor and uses a metal with an enlarged valve action metal as an anode lead and a solid electrolyte as a cathode,
A dielectric, a solid electrolyte, and a cathode layer are sequentially formed on the surface of a porous body made of a valve metal from which an anode lead is derived,
It has an overall shape of a substantially rectangular plate, and is formed along the first side, the opposite side parallel to the first side, and the second side adjacent to both the first side and the opposite side. With a U-shaped anode,
A capacitor element comprising: a cathode layer extending from a central portion of a second side adjacent to the first side toward the opposite side.

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