JP2009048834A - ORGANIC ELECTROLUMINESCENT DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE - Google Patents

Abstract

An organic electroluminescence device capable of preventing deterioration of a light emitting element and improving the extraction efficiency of emitted light to ensure high definition and a wide viewing angle, a manufacturing method thereof, and an electronic apparatus.
An element substrate having a plurality of light-emitting elements having a light-emitting layer sandwiched between an anode and a cathode and a sealing layer covering the plurality of light-emitting elements, The element substrate 20A and the sealing substrate 31 include the element substrate 20A and a sealing substrate 31 that is disposed so as to face each other and includes a plurality of colored layers 37 and a black matrix layer 32 that partitions the plurality of colored layers 37. And a peripheral sealing layer 33 provided in the peripheral portion of the sealing substrate 31, and a translucent adhesive layer 34 provided in a pixel region inside the peripheral sealing layer 33 and having a lower elastic modulus than the peripheral sealing layer 33. Are pasted together.
[Selection] Figure 3

Description

  The present invention relates to an organic electroluminescence device, a manufacturing method thereof, and an electronic apparatus.

  In recent years, with the diversification of information equipment and the like, there is an increasing need for flat display devices that consume less power and are lighter. As one of such flat display devices, an organic electroluminescence device (hereinafter referred to as “organic EL device”) having an organic light emitting layer is known.

Many materials used for the light emitting layer, the hole injection layer, and the electron injection layer of an organic EL device are likely to react with moisture and oxygen in the air and easily deteriorate. When these layers deteriorate, a non-light emitting region called a “dark spot” is formed in the organic EL device, and the lifetime of the light emitting element is shortened. Therefore, for example, a structure in which the light emitting layer or the like can be sealed (for example, Patent Document 1), or a structure in which the light emitting element is sealed with a thin film having excellent moisture resistance has been proposed (for example, patents). Reference 2).
JP 2006-294534 A Japanese Patent Laid-Open No. 2001-230086

  By the way, the organic EL device is bonded to an element substrate including a light emitting element and a sealing layer (the thin film) for sealing the light emitting element, and a sealing substrate disposed to face the element substrate, for example, covering the sealing layer. When the layers are bonded together, the alignment position between the element substrate and the sealing substrate may be adjusted in a state where the substrates are bonded to each other before the material liquid constituting the adhesive layer is completely solidified. At this time, when the substrates are shifted in the plane direction, the sealing layer sealing the light emitting element is damaged by the force applied to the boundary surface between the adhesive layer and the sealing layer sealing the light emitting element. There is a risk of it. Further, at this time, the bank function of the peripheral sealant may be impaired, and the material liquid may protrude.

  In addition, due to the elasticity of the adhesive layer, there is a possibility that the force for returning the substrate from the position after the adjustment works and the alignment accuracy is lowered. As a result, there is a problem that the fineness of display is lowered and the viewing angle is narrowed.

  The present invention has been made in view of the above-described problems of the prior art, and can improve the extraction efficiency of emitted light while preventing the influence of moisture and the like, and can ensure high definition and a wide viewing angle. It is an object of the present invention to provide a luminescence device, a manufacturing method thereof, and an electronic device.

  In order to solve the above problems, an organic electroluminescence device of the present invention has a plurality of light-emitting elements that sandwich an organic light-emitting layer between a pair of electrodes, and a sealing layer that covers the plurality of light-emitting elements. An element substrate, and a sealing substrate that is disposed opposite to the element substrate and includes a plurality of colored layers and a light shielding layer that partitions the plurality of colored layers, and the element substrate and the sealing substrate are: A peripheral sealing layer provided in a peripheral portion of the element substrate and the sealing substrate; a translucent adhesive layer provided in a pixel region inside the peripheral sealing layer and having a lower elastic modulus than the peripheral sealing layer; It is characterized by being pasted through.

  According to the organic electroluminescence device of the present invention, since the elastic modulus of the translucent adhesive layer is lower than that of the peripheral sealing layer, for example, the mutual alignment positions are adjusted after the element substrate and the sealing substrate are bonded together. At the time, when an external impact is applied, the stress at the interface between the adhesive layer and the sealing layer can be relaxed. As a result, the sealing layer can be prevented from being damaged, and the light emitting element can be prevented from being deteriorated due to intrusion of moisture, oxygen, or the like. Moreover, since the force that the substrates try to return from the adjusted position is alleviated, for example, the alignment position between the element substrate and the sealing substrate can be adjusted favorably. Thereby, the opposing position of a light emitting element and a colored layer can be adjusted with high precision, and it becomes possible to improve the extraction efficiency of emitted light. Therefore, a device capable of ensuring high definition and a wide viewing angle can be obtained.

Moreover, it is preferable that the translucent adhesive layer is comprised from the material which has an elastomer resin as a main component.
According to such a configuration, it is possible to prevent the sealing layer from being damaged when adjusting the alignment position because it is made of an elastomer resin having a low elastic modulus, that is, a rubber-like elastic body having a high elongation rate. In addition, since the translucent adhesive layer is in a solid state, the adhesive layer can be prevented from protruding during pressure bonding.

Moreover, it is preferable that the elastomer resin which comprises a translucent adhesive layer is an acrylic resin or a silicone resin.
According to such a configuration, the translucent adhesive layer has high translucency and heat resistance, and does not cause discoloration by ultraviolet irradiation performed when forming the peripheral seal layer, so that high-luminance light emission is possible and desired The following emission color can be obtained.

Moreover, it is preferable that the elastic modulus adjusting agent is added to the translucent adhesive layer.
According to such a configuration, the elastic modulus of the translucent adhesive layer can be adjusted by adding the elastic modulus adjusting agent. Generally, the elastic modulus can be increased by increasing the addition amount of the elastic modulus adjusting material.

The elastic modulus of the translucent adhesive layer is preferably in the range of 0.01 to 1 GPa, and the elastic modulus of the peripheral seal layer is preferably 1 GPa or more.
According to such a configuration, if the elastic modulus of the translucent adhesive layer is less than 0.01 GPa, heat resistance may be insufficient and peeling may occur. On the other hand, if the pressure is higher than 1 GPa, the sealing layer may be damaged when adjusting the alignment position between the substrates.
In addition, since the elastic modulus of the peripheral seal layer is 1 GPa or more, the bank function is sufficiently exhibited, and the translucent adhesive layer can be prevented from protruding.

Moreover, it is preferable that the film thickness of a translucent contact bonding layer exists in the range of 2-5 micrometers.
According to such a structure, the unevenness | corrugation on the surface of a light shielding layer and a colored layer can be relieve | moderated and planarized. Thereby, it is prevented that air bubbles are mixed in the translucent adhesive layer, and the substrates can be favorably bonded to each other. If the film thickness of the translucent adhesive layer is less than 2 μm, the above irregularities cannot be absorbed and bubbles tend to remain. In addition, when the thickness of the translucent adhesive layer is greater than 5 μm, the distance between the colored layer and the light emitting element is increased, and there is a possibility that light leakage may occur in adjacent pixels.

Moreover, it is preferable that the translucent contact bonding layer is formed using the adhesive agent which does not contain a gap material.
According to such a structure, since the gap material which consists of an inorganic material and an organic material is not contained in the adhesive like the past, the filling in an adhesive is carried out at the time of pressure bonding (at the time of bonding of substrates). It is possible to prevent the sealing layer from being damaged by the object.

The sealing layer preferably includes an electrode protective layer that covers the electrode of the light emitting element, an organic buffer layer that covers the electrode protective layer, and a gas barrier layer that covers the organic buffer layer.
According to such a configuration, between the element substrate and the sealing substrate, the electrode protective layer that covers the electrode of the light emitting element, the organic buffer layer that covers the electrode protective layer, and the gas barrier layer that covers the organic buffer layer Since a sealing layer in which at least three layers are stacked is formed, defects on the gas barrier layer can be prevented by planarizing the element substrate on which the light emitting element is formed, and moisture in the light emitting element can be prevented. Infiltration can be prevented.
In addition, since the light shielding layer is made of a material having a lower elastic modulus than the organic buffer layer and the gas barrier layer, it is possible to absorb the load at the time of bonding between the substrates and prevent the gas barrier layer from being damaged. can do.

  In order to solve the above problems, a method for manufacturing an organic electroluminescence device of the present invention includes an element substrate having a plurality of light emitting elements and a sealing layer covering the plurality of light emitting elements, a plurality of colored layers, and a light shielding layer. A sealing substrate is attached via an element substrate and a peripheral sealing layer provided in a peripheral portion of the sealing substrate, and a translucent adhesive layer provided in the pixel region and having a lower elastic modulus than the peripheral sealing layer. And a step of adjusting the alignment position of the sealing substrate and the element substrate.

  According to the method for manufacturing an organic electroluminescence device of the present invention, when the mutual alignment position is adjusted after bonding the element substrate and the sealing substrate, or when some external force is applied, the adhesive layer and the sealing layer are sealed. The stress at the interface with the stop layer can be relaxed. Thereby, it can prevent that a sealing layer is damaged. Moreover, it is prevented that the force which the substrates try to return from the adjusted position works, and for example, the alignment position between the substrates can be accurately performed. Thereby, the extraction efficiency of emitted light can be improved, and a device capable of ensuring high definition and a wide viewing angle can be obtained.

In addition, it is preferable to form a peripheral sealing layer in the peripheral portion between the element substrate and the sealing substrate after forming the translucent adhesive layer in the pixel region.
Further, by forming the light-transmitting adhesive layer in the pixel region first, it is possible to prevent impurities from being mixed into the material for forming the peripheral seal layer. Therefore, the adhesion performance of the peripheral seal layer is ensured.

An electronic apparatus according to the present invention includes the organic electroluminescence device described above.
ADVANTAGE OF THE INVENTION According to this invention, the electronic device provided with the display part excellent in reliability and also excellent in display quality can be provided.

The present invention will be described in detail below.
This embodiment shows a part of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in each figure shown below, in order to make each layer and each member the size which can be recognized on drawing, the scale is varied for each layer and each member.

(First embodiment of organic EL device)
First, a first embodiment of an organic electroluminescence device of the present invention (hereinafter referred to as “organic EL device”) will be described.
FIG. 1 is a schematic diagram showing a wiring structure of the organic EL device of the present embodiment. In FIG. 1, reference numeral 1 denotes the organic EL device.

  This organic EL device 1 is of an active matrix type using thin film transistors (hereinafter referred to as TFTs) as switching elements, and intersects a plurality of scanning lines 101 at right angles to each scanning line 101. The pixel region X is formed in the vicinity of each intersection of the scanning line 101 and the signal line 102 with a wiring configuration including a plurality of signal lines 102 extending in the direction and a plurality of power supply lines 103 extending in parallel to the signal lines 102. It is a thing.

  Of course, according to the technical idea of the present invention, an active matrix using TFT or the like is not indispensable. Even if the present invention is implemented using an element substrate for a simple matrix and the simple matrix is driven, the same effect can be obtained at low cost. can get.

  A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. Further, a scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  Further, in each pixel region X, a switching TFT (switching element) 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel shared from the signal line 102 via the switching TFT 112 are provided. A holding capacitor 113 for holding a signal, a driving TFT (switching element) 123 to which a pixel signal held by the holding capacitor 113 is supplied to a gate electrode, and the power supply line 103 through the driving TFT 123 are electrically connected An anode 10 (electrode) through which a drive current flows from the power line 103 when connected, and a light emitting layer 12 (organic light emitting layer) sandwiched between the anode 10 and the cathode 11 (electrode) are provided.

  According to the organic EL device 1, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and according to the state of the holding capacitor 113. The on / off state of the driving TFT 123 is determined. Then, current flows from the power supply line 103 to the anode 10 through the channel of the driving TFT 123, and further current flows to the cathode 11 through the light emitting layer 12. The light emitting layer 12 emits light according to the amount of current flowing through it.

  Next, specific modes of the organic EL device 1 of the present embodiment will be described with reference to FIGS. Here, FIG. 2 is a plan view schematically showing the configuration of the organic EL device 1. FIG. 3 is a cross-sectional view schematically showing the organic EL device 1. FIG. 4 is a diagram showing the main part (A part) of FIG. 3, and is an enlarged cross-sectional view for explaining the configuration of the peripheral part of the organic EL device 1.

First, the configuration of the organic EL device 1 will be described with reference to FIG.
FIG. 2 is a diagram showing a TFT element substrate (hereinafter referred to as “element substrate”) 20 </ b> A that causes the light emitting layer 12 to emit light by the above-described various wirings, TFTs, and various circuits formed on the substrate body 20.
The element substrate 20A of the organic EL device includes an actual display region 4 (inside the two-dot chain line in FIG. 2) in the center portion and a dummy region 5 (between the one-dot chain line and the two-dot chain line) arranged around the actual display region 4. Area).

  One of red (R), green (G), and blue (B) light is extracted from the pixel region X shown in FIG. 1, and the display region RGB shown in FIG. 2 is formed. In the actual display area 4, the display areas RGB are arranged in a matrix. In addition, each of the display areas RGB is arranged in the same color in the vertical direction of the paper, and constitutes a so-called stripe arrangement. The display area RGB is combined into one display unit pixel, and the display unit pixel mixes RGB light emission to perform full color display.

  Scanning line drive circuits 80 are disposed on both sides of the actual display area 4 in FIG. 2 and on the lower layer side of the dummy area 5. Further, an inspection circuit 90 is disposed above the actual display area 4 in FIG. 2 and below the dummy area 5. This inspection circuit 90 is a circuit for inspecting the operating state of the organic EL device 1, and includes, for example, inspection information output means (not shown) for outputting the inspection result to the outside, and the organic EL during production or at the time of shipment. The apparatus 1 is configured to be able to inspect the quality and defects.

(Cross-section structure)
Next, a cross-sectional structure of the organic EL device 1 will be described with reference to FIG.
The organic EL device 1 in the present embodiment is a so-called “top emission structure” organic EL device. Since the top emission structure extracts light not from the element substrate side but from the sealing substrate side, there is an effect that a wide light emitting area can be secured without being affected by the size of various circuits arranged on the element substrate. Therefore, luminance can be secured while suppressing voltage and current, and the lifetime of the light-emitting element can be maintained long.
The organic EL device 1 includes a plurality of light emitting elements 21 having a light emitting layer 12 (organic light emitting layer) sandwiched between an anode 10 and a cathode 11 (a pair of electrodes), and an element substrate 20A having a pixel partition wall 13 separating the light emitting elements 21. And a sealing substrate 31 disposed opposite to the element substrate 20A.

(Element board)
As shown in FIG. 3, the organic EL device 1 has an inorganic insulating layer 14 made of silicon nitride or the like coated on an element substrate 20A on which the above-described various wirings (for example, TFT (not shown) or the like) are formed. Yes. Further, a contact hole (not shown) is formed in the inorganic insulating layer 14, and the above-described anode 10 is connected to the driving TFT 123. On the inorganic insulating layer 14, a planarizing layer 16 is formed in which a metal reflector 15 made of an aluminum alloy or the like is housed.
On the planarizing layer 16, a light emitting element 21 in which an anode 10 and a cathode 11 are formed with a light emitting layer 12 interposed therebetween is configured. An insulating pixel partition wall 13 is arranged so as to partition the light emitting element 21.

In this embodiment, a metal oxide conductive layer such as ITO (Indium Thin Oxide) having a high hole injection layer having a work function of 5 eV or more is used for the anode 10.
In the present embodiment, because of the top emission structure, the anode 10 does not necessarily need to use a light-transmitting material, and a metal electrode made of aluminum or the like may be used. When this configuration is adopted, the above-described metal reflector 15 need not be provided.

  As a material for forming the cathode 11, since this embodiment has a top emission structure, it needs to be a light-transmitting material. Therefore, a light-transmitting conductive material is used. As the translucent conductive material, ITO is suitable, but other than this, for example, indium oxide / zinc oxide-based amorphous conductive film (Indium Zinc Oxide: IZO) is used. Can be used. In the present embodiment, ITO is used.

For the cathode 11, a material having a large electron injection effect (a work function of 4 eV or less) is preferably used. For example, calcium, magnesium, sodium, lithium metal, or a metal compound thereof. Examples of the metal compound include metal fluorides such as calcium fluoride, metal oxides such as lithium oxide, and organometallic complexes such as acetylacetonato calcium. In addition, these materials alone have high electrical resistance and do not function as an electrode. Therefore, patterning a metal layer such as aluminum, gold, silver, or copper so as to avoid the light emitting portion, or translucency such as ITO or tin oxide. You may use in combination with the laminated body with the metal oxide conductive layer which has this.
In the present embodiment, a laminate of lithium fluoride, magnesium-silver alloy, and ITO is used by adjusting the film thickness to obtain translucency.

The light emitting layer 12 employs a white light emitting layer that emits white light. The white light emitting layer is formed on the entire surface of the element substrate 20A using a vacuum deposition process. As the white light-emitting material, a styrylamine-based light-emitting material, an anthracene-based dopant (blue), a styrylamine-based light-emitting material, a rubrene-based dopant (yellow), or the like is used.
A triarylamine (ATP) multimer hole injection layer, a TPD (triphenyldiamine) hole transport layer, and an aluminum quinolinol (Alq ₃ ) layer (electron transport layer) are formed on the lower layer or upper layer of the light emitting layer 12. It is preferable to form a film.

An electrode protective layer 17 (sealing layer) is formed on the element substrate 20A to cover the light emitting element 21 and the pixel partition wall 13.
The electrode protective layer 17 is preferably composed of a silicon compound such as silicon oxynitride in consideration of translucency, adhesion, water resistance, and gas barrier properties. The film thickness of the electrode protective layer 17 is preferably 100 nm or more, and the upper limit of the film thickness is preferably set to 200 nm or less in order to prevent generation of cracks due to stress generated by covering the pixel partition walls 13.
In the present embodiment, the electrode protective layer 17 is formed as a single layer, but may be stacked as a plurality of layers. For example, the electrode protective layer 17 may be composed of a low elastic modulus lower layer and a high water resistance upper layer.

An organic buffer layer 18 (sealing layer) is formed on the electrode protective layer 17 to cover the electrode protective layer 17. The organic buffer layer 18 is disposed so as to fill the uneven portion of the electrode protection layer 17 formed in a concavo-convex shape due to the influence of the shape of the pixel partition wall 13, and the upper surface thereof is formed substantially flat.
The organic buffer layer 18 has a function of relieving stress generated by warping or volume expansion of the element substrate 20A and preventing the electrode protective layer 17 from peeling from the pixel partition wall 13 having an unstable shape. Further, since the upper surface of the organic buffer layer 18 is substantially flattened, a gas barrier layer 19 (sealing layer), which will be described later, made of a hard film formed on the organic buffer layer 18 is also flattened. Therefore, there is no portion where stress is concentrated, thereby preventing generation of cracks in the gas barrier layer 19.

  Since the organic buffer layer 18 is formed by a screen printing method under a reduced pressure atmosphere as a raw material main component before curing, all of the organic buffer layer 18 having excellent fluidity and having no solvent or volatile component is a raw material of a polymer skeleton. It is necessary to be an organic compound material, and an epoxy monomer / oligomer having an epoxy group and a molecular weight of 3000 or less is preferably used (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000). For example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, polyethylene glycol diglycidyl ether, alkyl glycidyl ether, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, There are ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, and these are used alone or in combination.

Further, as the curing agent that reacts with the epoxy monomer / oligomer, one that forms a cured film having excellent electrical insulation and adhesion, high hardness, toughness, and excellent heat resistance, excellent translucency, and curing. An addition polymerization type with little variation in the size is preferred. For example, 3-methyl-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-endomethylene-1,2,3,6-tetrahydrophthalic anhydride, 1,2,4,5-benzene Acid anhydride curing agents such as tetracarboxylic dianhydride and 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride are preferred. Furthermore, low-temperature curing is facilitated by adding trace amounts of amine compounds such as alcohols and aminophenols that have a high molecular weight and are difficult to volatilize such as 1,6-hexanediol as reaction accelerators that promote the reaction (ring opening) of acid anhydrides. Become. These curings are performed by heating in the range of 60 to 100 ° C., and the cured film becomes a polymer having an ester bond.
In addition, a cation-releasing type polymerization initiator often used for shortening the curing time may be used. However, a slow reaction may be used so that curing shrinkage does not rapidly advance, and the viscosity is reduced by heating after coating. What forms a hardened | cured material finally using thermosetting so that planarization may be advanced is preferable.

  Furthermore, additives such as a silane coupling agent that improves the adhesion to the electrode protective layer 17 and the gas barrier layer 19, a water capturing agent such as an isocyanate compound, and fine particles that prevent shrinkage during curing may be mixed. In addition, since the printing is performed under a reduced pressure atmosphere, the water content is adjusted to 10 ppm or less in order to make it difficult for bubbles to occur when applied.

  The viscosity of each raw material is preferably 1000 mPa · s (room temperature: 25 ° C.) or more. This is because it does not penetrate into the light emitting layer 12 immediately after the application and does not generate a non-light emitting region called a dark spot. Moreover, as a viscosity of the buffer layer forming material which mixed these raw materials, 500-20000 mPa * s, especially 2000-10000 mPa * s (room temperature) are preferable.

Moreover, as an optimal film thickness of the organic buffer layer 18, 2-5 micrometers is preferable. When the organic buffer layer 18 is thicker, foreign matter is mixed in to prevent defects in the gas barrier layer 19. However, if the combined thickness of the organic buffer layer 18 exceeds 5 μm, the coloring layer 37 and the light emitting layer 12 described later As the distance increases and more light escapes to the side, the light extraction efficiency decreases.
Moreover, as a characteristic after hardening, it is preferable that the elastic modulus of the organic buffer layer 18 is 1 to 10 GPa. If it is 10 GPa or more, the stress at the time of planarizing the pixel partition wall 13 cannot be absorbed, and if it is 1 GPa or less, wear resistance, heat resistance and the like are insufficient.

On the organic buffer layer 18, a gas barrier layer 19 is formed in a wide range so as to cover the organic buffer layer 18 and cover the terminal portion of the electrode protective layer 17.
The gas barrier layer 19 is for preventing oxygen and moisture from entering, and thereby, deterioration of the light emitting element 21 due to oxygen and moisture can be suppressed. The gas barrier layer 19 is preferably formed of a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like in consideration of translucency, gas barrier properties, and water resistance.

The elastic modulus of the gas barrier layer 19 is preferably 100 GPa or more, specifically about 200 to 250 GPa. The film thickness of the gas barrier layer 19 is preferably about 200 to 600 nm.
This is because if it is less than 200 nm, the coverage with respect to foreign matter is insufficient and a through-hole is partially formed, and the gas barrier property may be impaired. If it exceeds 600 nm, a crack due to stress occurs. Because there is a fear.

Further, the gas barrier layer 19 may have a laminated structure, or may have a configuration in which the composition is not uniform, and particularly, the oxygen concentration changes continuously or discontinuously.
In addition, as for the film thickness at the time of setting it as a laminated structure, 200-400 nm is preferable as a 1st gas barrier layer, and if it is less than 200 nm, the surface and side surface coating | cover of the organic buffer layer 18 will run short. As a 2nd gas barrier layer which improves the coating | covering property, such as a foreign material, 200-800 nm is preferable.
When the total thickness exceeds 1000 nm, the occurrence frequency of cracks is increased, and this is not preferable from the economical viewpoint.

  Further, in the present embodiment, since the organic EL device 1 has a top emission structure, the gas barrier layer 19 needs to have light transmittance. Therefore, by appropriately adjusting the material and the film thickness, the present embodiment Then, the light transmittance in the visible light region is set to 80% or more, for example.

(Sealing substrate)
Further, a sealing substrate 31 is disposed opposite to the element substrate 20A on which the gas barrier layer 19 is formed.
Since the sealing substrate 31 has a display surface for extracting emitted light, the sealing substrate 31 is made of a light transmissive material such as glass or transparent plastic (polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, or the like).

  On the lower surface of the sealing substrate 31, a red colored layer 37 </ b> R, a green colored layer 37 </ b> G, and a blue colored layer 37 </ b> B are arranged in a matrix as the colored layer 37 constituting the color filter. The film thickness of the colored layer 37 is adjusted to about 0.1 to 1.5 μm for each color. The width is preferably set to about 10 to 15 μm.

  Each of the colored layers 37 is disposed so as to face the white light emitting layer 12 formed on the anode 10. Thereby, the emitted light of the light emitting layer 12 is transmitted through each of the colored layers 37 and emitted to the observer side as each color light of red light, green light and blue light.

  A black matrix layer 32 (light shielding layer) is formed around the colored layer 37. The black matrix layer 32 is formed with a film thickness similar to or greater than that of the colored layer 37. Furthermore, the width of the peripheral sealing layer 33 is covered with the black matrix layer 32 so that light from a frame portion (non-light emitting portion) D (see FIG. 4) in the peripheral portion of the organic EL device 1 described later does not leak. There may be.

As described above, in the organic EL device 1, the light emitted from the light emitting layer 12 is used and color display is performed by the colored layers 37 of a plurality of colors.
In addition to the colored layer 37, the sealing substrate 31 may be provided with a functional layer such as an ultraviolet blocking / absorbing layer, an antireflection film, or a heat dissipation layer.

A peripheral seal layer 33 is provided in the peripheral portion between the element substrate 20 </ b> A and the sealing substrate 31.
The peripheral sealing layer 33 has a bank function that improves the positional accuracy of the bonding of the element substrate 20A and the sealing substrate 31 and prevents the translucent adhesive layer 34 to be described later from sticking out. It is comprised with the epoxy material etc. which improve. Preferably, an epoxy monomer / oligomer having an epoxy group and a molecular weight of 3000 or less is used (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000). For example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, polyethylene glycol diglycidyl ether, alkyl glycidyl ether, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, There are ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, and these are used alone or in combination.

  In addition, as a curing agent that reacts with epoxy monomer / oligomer, photoreactive type that causes cationic polymerization reaction such as diazonium salt, diphenyliodonium salt, trifelsulfonium salt, sulfonate ester, iron arene complex, silanol / aluminum complex, etc. Initiators are preferred. The viscosity at the time of coating is preferably 20,000 to 200,000 mPa · s (room temperature), more preferably 40,000 to 100,000 mPa · s. When a material whose viscosity gradually increases after irradiation with ultraviolet rays is used, it is possible to prevent the peripheral seal layer 33 from being broken even with a narrow seal width of 1 mm or less, and to prevent the filler from sticking out after bonding. Further, in order to make it difficult for bubbles to be generated when the pressure is reduced during bonding, it is preferable that the water content is a material adjusted to 1000 ppm or less.

The film thickness of the peripheral seal layer 33 is preferably 15 μm or less, and the elastic modulus of the peripheral seal layer 33 is preferably 1 GPa or more.
It should be noted that gap materials (fillers) such as clay minerals, silica balls, and resin balls that are often contained in general adhesives are damaged when the above-described gas barrier layer 19 is bonded and bonded. An adhesive made of an ultraviolet curable resin that does not contain is used.

Further, a translucent adhesive layer 34 made of a thermosetting resin is formed inside the element substrate 20 </ b> A and the sealing substrate 31 surrounded by the peripheral seal layer 33.
The translucent adhesive layer 34 is filled without gaps in the organic EL device 1 surrounded by the peripheral sealing layer 33 described above, and fixes the sealing substrate 31 disposed opposite to the element substrate 20A. It has a buffering function against external mechanical shocks and protects the light emitting layer 12 and the gas barrier layer 19.

  Further, the translucent adhesive layer 34 also has a gap control function for keeping the distance between the colored layer 37 and the light emitting element 21 constant. However, in order to prevent light leakage to adjacent pixels, the distance between the colored layer 37 and the light emitting element 21 (gap between the substrates) is shorter than the width of the black matrix layer 32 adjacent to the colored layer 37. By setting the distance between the colored layer 37 and the light emitting element 21 in this way, the light emitted in the adjacent pixel direction can be blocked by the black matrix layer 32 adjacent to the colored layer 37.

The translucent adhesive layer 34 is an organic compound material that is excellent in flatness and pattern coating suitability as a raw material main component before curing, and has an elastic modulus after curing smaller than that of the peripheral seal layer 33. Must be a resin. For example, an acrylic resin partially containing a carboxyl group such as 2-ethylhexyl acrylate-acrylic acid polymer, poly-iso-octyl acrylate-acrylic acid polymer, or a silicone resin such as dimethylsiloxane polymer is preferable.
The reason why the above resin is preferable is that it is a material that has high translucency and heat resistance and does not cause coloring such as yellowing due to ultraviolet irradiation performed when the peripheral seal layer 33 is formed.

Moreover, in order to ensure moderate adhesiveness at the time of bonding, additives, such as an elastic modulus regulator, may be added. Typical elastic modulus modifiers include terpene resins, esterified rosin resins, aromatic petroleum resins, coumarone-indene aromatic resins, dicyclopentadiene, styrene, isoprene, cyclopentene, and trimethylsilane modified silicone resins. The elastic modulus can be adjusted by adding these, and generally the elastic modulus increases as the amount added is increased.
Moreover, since the said material is a lipophilic material, the water resistance of the translucent adhesive layer 34 can also be improved by adding.

  The optimum elastic modulus of the translucent adhesive layer 34 is preferably in the range of 0.01 to 1 GPa. If the elastic modulus of the translucent adhesive layer 34 is less than 0.01 GPa, there is a risk of peeling due to insufficient heat resistance. When the elastic modulus is higher than 1 GPa, after the substrates 20A and 31 are bonded together, the alignment position between the colored layer and the light emitting element 21 is finely adjusted by relatively shifting the substrates 20A and 31 in the parallel direction. The gas barrier layer 19 may be damaged.

  As a film thickness of the translucent adhesive layer 34, in order to absorb the unevenness | corrugation on the surface of the black matrix layer 32 and the colored layer 37, it needs to be a film thickness thicker than them, and the inside of the range of 2-5 micrometers is preferable. . For example, when the film thickness is less than 2 μm, the unevenness cannot be absorbed and bubbles easily remain in the uneven portion. Further, if the film thickness is thicker than 5 μm, light leaks to the adjacent colored layer 37 (pixel), which is not preferable. Further, as described above, it is necessary to form the film with a thickness smaller than the width of the black matrix layer 32.

  Further, as in the case of the peripheral seal layer 33 described above, an adhesive that does not contain a gap material (filler) such as clay mineral, silica ball, or resin ball that is contained in a large amount of general adhesive is used. Prevents damage.

  Moreover, the viscosity at the time of application | coating has preferable 500 mPa * s (room temperature) or less, and its about 30-300 mPa * s is more preferable. The reason is that the material filling property into the space after the bonding is taken into consideration, and a material in which the curing starts after the viscosity once decreases immediately after heating is preferable. Further, in order to make it difficult for bubbles to be generated when the pressure is reduced at the time of bonding, it is preferable that the water content is a material adjusted to 100 ppm or less.

(Cross sectional structure of the periphery)
Next, a cross-sectional structure of the peripheral portion of the organic EL device 1 will be described with reference to FIG.
As shown in FIG. 4, the periphery of the organic EL device 1 includes an electrode protective layer 17, an organic buffer layer 18, a gas barrier layer 19, and a peripheral seal layer 33 between the element substrate 20A and the sealing substrate 31 described above. It becomes the structure laminated | stacked one by one.

  The thickness of the organic buffer layer 18 decreases from the central portion to the peripheral end portion 35. Thereby, damages such as cracks and peeling due to stress concentration of the gas barrier layer 19 covering the organic buffer layer 18 can be prevented.

  Here, the gas barrier layer 19 is formed wider than the organic buffer layer 18 so as to completely cover the organic buffer layer 18, and the peripheral seal layer 33 is disposed on the gas barrier layer 19. Further, the rising portion 36 of the peripheral end portion 35 of the organic buffer layer 18 is formed within the width d of the peripheral seal layer 33. Thus, since the gas barrier layer 19 covering the peripheral edge portion 35 of the organic buffer layer 18 is protected by the peripheral seal layer 33, damage such as cracks and peeling due to stress concentration of the gas barrier layer 19 can be prevented. Along with this, moisture can be prevented from passing through the gas barrier layer 19 and reaching the light emitting element 21, and generation of dark spots can be prevented.

  In addition, although the gas barrier layer 19 in this embodiment is formed wider than the outer periphery of the peripheral seal layer 33, it does not necessarily need to be formed wider than the peripheral seal layer 33. That is, the peripheral edge 38 of the gas barrier layer 19 only needs to be formed wider than the peripheral edge 35 of the organic buffer layer 18, and the width d of the peripheral seal layer 33 is the same as the peripheral edge 35 of the organic buffer layer 18. It may be formed inside. Further, the width of the electrode protection layer 17 is wider than that of the organic buffer layer 18 and is usually formed using the same mask material as that of the gas barrier layer 19.

  The peripheral portion of the organic EL device 1 is a frame portion (non-light emitting portion) D. The frame portion D is a non-light-emitting portion of the organic EL device 1, and is, for example, the width from the pixel partition wall 13 provided at the endmost portion on the element substrate 20A to the end portion of the element substrate 20A. The frame portion D is formed with 2 mm, for example, and the width d of the peripheral seal layer is formed with 1 mm, for example.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device 1 according to the present embodiment will be described with reference to FIGS.
Here, FIG. 5 is a process diagram on the element substrate 20A side of the organic EL device 1, and FIG. 6 is a process diagram on the sealing substrate 31 side.

First, as shown in FIG. 5A, the electrode protective layer 17 is formed on the element substrate 20A on which the cathode 11 is laminated.
Specifically, for example, a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like is formed by a high-density plasma film forming method such as an ECR sputtering method or an ion plating method.

Next, as shown in FIG. 5B, the organic buffer layer 18 is formed on the electrode protective layer 17.
Specifically, the organic buffer layer 18 that has been screen-printed in a reduced-pressure atmosphere is cured by heating in the range of 60 to 100 ° C. As a problem at this point, the viscosity temporarily decreases until the reaction is started immediately after heating. At this time, the material for forming the organic buffer layer 18 passes through the electrode protective layer 17 and the cathode 11 and penetrates into the light emitting layer 12 such as Alp ₃ to generate dark spots.
Therefore, it is preferable to leave the film at a low temperature until the curing proceeds to some extent, and to raise the temperature to a certain degree when the viscosity is increased to a certain degree to complete curing.

Next, as shown in FIG. 5C, the gas barrier layer 19 is formed on the organic buffer layer 18.
Specifically, it is formed by a high density plasma film forming method such as an ECR sputtering method or an ion plating method. In addition, reliability is improved by improving the adhesion by oxygen plasma treatment before the formation.

On the other hand, as shown in FIG. 6A, a colored layer 37 and a black matrix layer 32 are formed on the sealing substrate 31. As the colored layer 37, a red colored layer 37R, a green colored layer 37G, and a blue colored layer 37B are formed in a matrix, and a black matrix layer 32 is formed around each colored layer 37R, 37G, 37B.
Specifically, the colored layers 37R, 37G, and 37B are formed so as to face the white light emitting layer 12 formed on the anode 10. The thickness of the colored layer 37 is preferably as thin as possible in consideration of light transmittance, and the red colored layer 37R, the green colored layer 37G, and the blue colored layer 37B are respectively formed with the above-described thicknesses of about 0.1 to 1.5 μm. .
The black matrix layer 32 is formed with a film thickness similar to or greater than that of the colored layer 37.
Specifically, a pattern is formed by a printing method such as a photolithography method or an ink jet method, and the film thickness is appropriately adjusted while adjusting the coating amount in accordance with the material to be used.

Next, as shown in FIG. 6B, a translucent adhesive layer 34 is formed so as to cover the surfaces of the colored layer 37 and the black matrix layer 32.
Specifically, since the forming material itself is sticky, the viscosity is lowered by diluting with an organic solvent or the like. Then, a pattern is applied on the surface of the colored layer 37 and the black matrix layer 32 using a flexographic printing method, a gravure printing method, a screen printing method, a slit coating method, or the like. Thereafter, the light-transmitting adhesive layer 34 is formed by evaporating the solvent component in a heat oven or the like.
The translucent adhesive layer 34 also has a role of protecting the gas barrier layer 19. When the liquid material is left as it is in a liquid material, the liquid material convects in the apparatus to leave the gas barrier layer 19. Since there is a risk of damage, the translucent adhesive layer 34 must be solidified.

  In addition, although it applied directly on the coloring layer 37 and the black matrix layer 32, it may be pasted on the coloring layer 37 and the black matrix layer 32 after the light-transmitting adhesive layer 34 is once formed on another substrate. Good. However, since the gas barrier layer 19 may be dissolved by the organic solvent, it is not preferable to form it on the element substrate 20A side.

Next, as shown in FIG. 6C, a peripheral sealing layer 33 is formed on the periphery of the sealing substrate 31 on which the colored layer 37, the black matrix layer 32, and the translucent adhesive layer 34 are formed.
Specifically, the above-described ultraviolet curable resin (material liquid) is applied around the sealing substrate 31 by a needle dispensing method.
Note that this printing method may be a screen printing method.

Next, as shown in FIG. 6D, the sealing substrate 31 coated with the peripheral sealing layer 33 is irradiated with ultraviolet rays.
Specifically, for the purpose of starting the reaction of the peripheral sealing layer 33, for example, the sealing substrate 31 is irradiated with ultraviolet light having a light amount of 500 mJ / cm ² . At this time, the curing reaction is started only by the peripheral sealing layer 33 which is an ultraviolet curable resin, and the viscosity gradually increases.

  Next, the element substrate 20A side where the gas barrier layer 19 is formed as shown in FIG. 5C and the sealing substrate 31 where the peripheral seal layer 33 has started to cure are pasted as shown in FIG. 6D. Match.

At this time, both the element substrate 20A and the sealing substrate 31 are brought close to each other while finely adjusting the alignment position between the bonded element substrate 20A and the sealing substrate 31.
Specifically, the element substrate 20A and the sealing substrate 31 are moved relative to each other in the plane direction (parallel direction), and the facing position between the light emitting element 21 and the coloring layer 37 is adjusted. For example, the positional deviation between the light emitting element 21 and the colored layer 37 is adjusted to be 2 μm or less. In this way, final alignment (correction) is performed.
Then, the peripheral sealing layer 33 is disposed and bonded so as to completely cover the rising portion 36 of the peripheral end portion 35 of the organic buffer layer 18 formed on the element substrate 20A.
Specifically, this bonding step is performed in a vacuum atmosphere with a degree of vacuum of, for example, 1 Pa, held at a pressure of 600 N for 200 seconds, and the reaction of the peripheral seal layer 33 is advanced and pressure bonded.

  Next, after the pressure-bonded organic EL device 1 is returned to the air atmosphere, complete curing is performed by heat curing at 60 to 100 ° C.

Even if a vacuum space exists between the element substrate 20A and the sealing substrate 31, the peripheral seal layer 33 enters the space by thermosetting in the atmosphere.
From the above, the desired organic EL device 1 in the present embodiment described above can be obtained.

  Therefore, according to the above-described apparatus and manufacturing method, since the elastic modulus of the translucent adhesive layer 34 is lower than the elastic modulus of the peripheral sealing layer 33, both of the element substrate 20A and the sealing substrate 31 are bonded together. When finely adjusting the alignment position, the gas barrier layer 19 can be prevented from being damaged by the stress at the interface between the translucent adhesive layer 34 and the gas barrier layer 19. That is, since the translucent adhesive layer 34 is made of a rubber-like elastic body having a high elongation rate, the stress applied to the boundary portion between the translucent adhesive layer 34 and the gas barrier layer 19 can be relaxed. In addition, since the action of the substrates 20A and 31 returning from the adjusted positions is alleviated, the light emitting elements 21 and the colored layers 37 can be accurately aligned without damaging the gas barrier layer 19. it can.

  In this manner, by preventing damage to the gas barrier layer 19 and preventing moisture from entering, deterioration of the light emitting element 21 can be prevented, and a device with high heat resistance and high reliability can be obtained. In addition, by positioning the light emitting element 21 and the colored layer 37 with high accuracy, the efficiency of extracting emitted light can be improved, and a device capable of ensuring high definition and a wide viewing angle can be obtained.

  Further, by forming the translucent adhesive layer 34 before the peripheral seal layer 33, it is possible to prevent impurities from being mixed into the peripheral seal layer 33. Thereby, the favorable adhesiveness of the periphery sealing layer 33 is securable. That is, if the forming material of the peripheral sealing layer 33 is applied on the sealing substrate 31 first, the curing reaction is caused when the forming material of the light-transmitting adhesive layer 34 diluted with the solvent is applied and dried. There is a possibility that the forming material of the translucent adhesive layer 34 may be mixed in the former forming material of the peripheral sealing layer 33. For this reason, it is necessary to prevent the performance of the peripheral seal layer 33 from deteriorating due to foreign matters.

  In addition, by providing a peripheral sealing layer 33 having a higher elastic modulus (1 GPa or more) than that of the translucent adhesive layer 34 around the translucent adhesive layer 34, heat resistance and durability can be ensured, and finally At the time of heating, it is possible to prevent a positional deviation between the element substrate 20A and the sealing substrate 31 in a state where the alignment position is adjusted.

  Moreover, by forming the translucent adhesive layer 34 from a material having a smaller elastic modulus than the conventional one, the filling property is improved and the film thickness can be easily adjusted. Therefore, the adhesive layer can be made thinner than before, and the distance between the light emitting element 21 and the colored layer 37 can be reduced.

  As a result, in order to enlarge the viewing angle, even when the pixel pitch is made higher and the area of the colored layer 37 (pixel area) is enlarged, light emission to adjacent pixels does not occur. Thereby, since a light emission area can be earned, high luminance light emission can be obtained with low power consumption. Further, the entire apparatus can be reduced in thickness.

  Before the element substrate 20A and the sealing substrate 31 are bonded, the peripheral sealing layer 33 is irradiated with ultraviolet rays to start a curing reaction, and after the viscosity of the peripheral sealing layer 33 is increased, the element substrate 20A and the sealing substrate 31 are attached. to paste together. Therefore, the drawing operation can be performed at high speed because the viscosity is low at the time of application. Further, since the viscosity increases at the time of bonding, it is possible to improve the bonding position accuracy and prevent the light-transmitting adhesive layer 34 from protruding.

Further, after the element substrate 20A and the sealing substrate 31 are bonded together, the peripheral sealing layer 33 is completely cured, so that the adhesiveness, heat resistance, and moisture resistance as an adhesive layer are maintained while maintaining the positional accuracy between the substrates 20A and 31. Can be improved.
As described above, the gas barrier layer 19 is protected to prevent the light emitting element 21 from being deteriorated, and the highly reliable organic EL device 1 can be obtained.

The manufacturing method described above is a method in which a material that gradually undergoes a curing reaction after being irradiated with ultraviolet rays is used as a material for forming the peripheral sealing layer 33. On the other hand, when a material that rapidly cures during ultraviolet irradiation is used, after the element substrate 20A and the sealing substrate 31 are bonded together, ultraviolet irradiation that temporarily cures the peripheral seal layer 33 is performed. In the step of bonding the sealing substrate 31 and the element substrate 20A, as described above, the degree of vacuum is, for example, in a vacuum atmosphere of 1 Pa, and the pressure is maintained at 600 N for 60 seconds for pressure bonding. Further, since the position must be fixed during pressure bonding, as a step of temporarily curing the peripheral seal layer 33, for example, ultraviolet light having a light amount of 500 mJ / cm ² is irradiated onto the sealing substrate 31 during pressure bonding as described above. In this case, the final alignment position between the element substrate 20A and the sealing substrate 31 is adjusted before the peripheral seal layer 33 is completely cured. Thereafter, the peripheral sealing layer 33 is completely cured by thermosetting in the air atmosphere to the organic EL device 1 bonded by pressure bonding, and the organic EL device 1 is completed.

(Second Embodiment of Organic EL Device)
Next, the organic EL device 2 in the second embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. Here, FIG. 7 is a cross-sectional view schematically showing the organic EL device 2.

  As shown in FIG. 7, the organic EL device 2 according to the second embodiment of the present invention has a peripheral sealing layer so that light from the frame portion (non-light emitting portion) D of the peripheral portion of the organic EL device 1 does not leak. Within the width 33 (peripheral portion of the sealing substrate 31) is covered with the black matrix layer 32.

  As described above, the configuration in which the width of the peripheral seal layer 33 is covered with the black matrix layer 32 prevents light leakage from the frame portion (non-light emitting portion) D in the peripheral portion of the organic EL device 2. It becomes possible. Furthermore, by forming the black matrix layer 32 with a thickness greater than that of the colored layer 37, it is possible to more effectively prevent light leakage to adjacent pixels. The film thickness of the black matrix layer 32 is preferably about 1 to 2 μm. When the black matrix layer 32 is formed thicker than the colored layer 37, the colored layer 37 is formed first, and the black matrix layer 32 is formed later.

  The translucent adhesive layer 34 is patterned so as to expose the formation region (contact portion) of the peripheral seal layer 33 on the black matrix layer 32. The film thickness of the translucent adhesive layer 34 is formed so as to be able to flatten the unevenness on the surfaces of the colored layer 37 and the black matrix layer 32 in order to avoid mixing of bubbles. However, the film thickness is set so that the gap between the light emitting element 21 and the colored layer 37 is shorter than the width of the black matrix layer 32 adjacent to the colored layer 37 in order to reliably prevent light leakage to adjacent pixels. To do. By setting the distance between the colored layer 37 and the light emitting element 21 in this way, the light emitted in the adjacent pixel direction can be blocked by the black matrix layer 32 adjacent to the colored layer 37.

  According to the present embodiment, the black matrix layer 32 is also formed in the frame portion D, and the film thickness thereof is larger than the thickness of the colored layer 37. It is possible to effectively prevent light leakage to the light. Further, the light-transmitting adhesive layer 34 having a lower elastic modulus than the peripheral seal layer 33 can prevent the gas barrier layer 19 from being damaged when the alignment between the element substrate 20A and the sealing substrate 31 is adjusted.

  In this manner, by preventing damage to the gas barrier layer 19 and preventing moisture from entering, deterioration of the light emitting element 21 can be prevented, and a device with high heat resistance and high reliability can be obtained. In addition, by positioning the light emitting element 21 and the colored layer 37 with high accuracy, the efficiency of extracting emitted light can be improved, and a device capable of ensuring high definition and a wide viewing angle can be obtained.

  Note that the end portion of the black matrix layer 32 may be formed on the peripheral end portion of the colored layer 37. Thereby, it is possible to further prevent light leakage to the adjacent pixels due to the positional deviation between the light emitting element 21 and the colored layer 37.

(Electronics)
Next, an example of an electronic apparatus including the organic EL device according to the above embodiment will be described.
FIG. 8A is a perspective view showing an example of a mobile phone. In FIG. 8A, reference numeral 50 denotes a mobile phone body, and reference numeral 51 denotes a display unit including an organic EL device.
FIG. 8B is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 8B, reference numeral 60 denotes an information processing apparatus, reference numeral 61 denotes an input unit such as a keyboard, reference numeral 63 denotes an information processing body, and reference numeral 62 denotes a display unit including an organic EL device.
FIG. 8C is a perspective view showing an example of a wristwatch type electronic device. In FIG.8 (c), the code | symbol 70 shows the timepiece body and the code | symbol 71 shows the EL display part provided with the organic EL apparatus.
Since the electronic devices shown in FIGS. 8A to 8C are provided with the organic EL device described in the previous embodiment, the electronic devices have good display characteristics.

  In addition, as an electronic device, it is not restricted to the said electronic device, It can apply to a various electronic device. For example, a desktop computer, a liquid crystal projector, a multimedia personal computer (PC) and an engineering workstation (EWS), a pager, a word processor, a television, a viewfinder type or a monitor direct view type video tape recorder, an electronic notebook, an electronic The present invention can be applied to electronic devices such as a desktop computer, a car navigation device, a POS terminal, and a device having a touch panel.

  The preferred embodiments according to the present invention have been described above with reference to the accompanying drawings. However, it goes without saying that the present invention is not limited to such examples, and the above embodiments may be combined. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

  For example, on the surfaces of the colored layer 37 and the black matrix layer 32, a surface modification layer that improves wettability with the material for forming the light-transmitting adhesive layer 34 may be provided. As a result, the forming material easily goes around the uneven portions on the surfaces of the colored layer 37 and the black matrix layer 32, and the forming material can be filled without bubbles being mixed into the uneven portions. Thus, since the forming material of the translucent adhesive layer 34 quickly wets and spreads on the concavo-convex portion, the drying process can be quickly started after application. This configuration is particularly effective when the step at the boundary between the colored layer 37 and the black matrix layer 32 is large.

It is a schematic diagram which shows the wiring structure of the organic electroluminescent apparatus of this embodiment of this invention. It is a top view which shows typically the structure of the organic electroluminescent apparatus in 1st Embodiment of this invention. It is sectional drawing which shows typically the structure of the organic electroluminescent apparatus in 1st Embodiment of this invention. It is an expanded sectional view of the A section shown in Drawing 3 in a 1st embodiment of the present invention. It is process drawing by the side of the element substrate of the organic EL device in a 1st embodiment of the present invention. It is process drawing by the side of the sealing substrate of the organic electroluminescent apparatus in 1st Embodiment of this invention. It is sectional drawing which shows typically the structure of the organic electroluminescent apparatus in 2nd Embodiment of this invention. It is a figure which shows the electronic device in embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Organic EL device 2 ... Organic EL device 10 ... Anode (electrode) 11 ... Cathode (electrode)
DESCRIPTION OF SYMBOLS 12 ... Light emitting layer (organic light emitting layer) 13 ... Pixel partition wall 17 ... Electrode protective layer 18 ... Organic buffer layer 19 ... Gas barrier layer 20A ... Element substrate 21 ... Light emitting element 31 ... Sealing substrate 32 ... Black matrix layer (light shielding layer) 33 ... peripheral sealing layer 34 ... translucent adhesive layer 35 ... peripheral edge of organic buffer layer 38 ... peripheral edge of gas barrier layer

Claims (12)

An element substrate having a plurality of light emitting elements sandwiching an organic light emitting layer between a pair of electrodes, and a sealing layer covering the plurality of light emitting elements;
A sealing substrate that is disposed opposite to the element substrate and includes a plurality of colored layers and a light shielding layer that partitions the plurality of colored layers;
The element substrate and the sealing substrate are provided in a peripheral seal layer provided in a peripheral portion of the element substrate and the sealing substrate, and provided in a pixel region inside the peripheral seal layer and have lower elasticity than the peripheral seal layer. An organic electroluminescent device, wherein the organic electroluminescent device is bonded via a light-transmitting adhesive layer having a rate.   The organic electroluminescent device according to claim 1, wherein the translucent adhesive layer is made of a material mainly composed of an elastomer resin.   The organic electroluminescent device according to claim 2, wherein the elastomer resin constituting the translucent adhesive layer is an acrylic resin or a silicone resin.   The organic electroluminescence device according to claim 1, wherein an elastic modulus adjusting agent is added to the translucent adhesive layer. The elastic modulus of the translucent adhesive layer is in the range of 0.01 to 1 GPa,
The organic electroluminescence device according to any one of claims 1 to 4, wherein the elastic modulus of the peripheral sealing layer is 1 GPa or more.   6. The organic electroluminescent device according to claim 1, wherein the translucent adhesive layer has a thickness in a range of 2 to 5 μm.   The organic electroluminescent device according to claim 1, wherein the translucent adhesive layer is formed using an adhesive that does not include a gap material. An electrode protective layer that covers the electrode of the light emitting element; and
An organic buffer layer covering the electrode protective layer;
The organic electroluminescence device according to claim 1, further comprising: a gas barrier layer that covers the organic buffer layer.   An element substrate having a plurality of light emitting elements and a sealing layer covering the plurality of light emitting elements, and a sealing substrate having a plurality of colored layers and a light shielding layer are provided in a peripheral portion of the element substrate and the sealing substrate. An organic electroluminescent device comprising: a peripheral sealing layer formed on the pixel region; and a light-transmitting adhesive layer provided in a pixel region and having a lower elastic modulus than the peripheral sealing layer. Production method.   The method for manufacturing an organic electroluminescence device according to claim 9, further comprising a step of adjusting an alignment position between the sealing substrate and the element substrate.   11. The organic electronic device manufacturing method according to claim 9, wherein after forming a light-transmitting adhesive layer in a pixel region, the peripheral sealing layer is formed in a peripheral portion between the element substrate and the sealing substrate. Method.   An electronic apparatus comprising the organic electroluminescence device according to any one of claims 1 to 8.

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