JP2009040466A - Tray and electronic component storage method - Google Patents

Abstract

An embossed carrier tape for packing and shipping a semiconductor device is fixed to and attached to a partition portion (tray recess) in a storage tray so that the electronic component is a concave storage portion for general use or common use.
In a storage tray 1 in which a plurality of tray recesses 4 used for storing electronic components such as a semiconductor device 6 are formed, it is molded separately from the tray recesses 4 and designed according to the external dimensions of the semiconductor device 6 to be stored. The embossed carrier tape 3 is fixed and mounted. The embossing carrier tape 3 in which the concave storage portion 10 for each semiconductor device 6 is arranged is fixed to and attached to the storing tray 1, and the embossing carrier tape 3 corresponding to the shape of the semiconductor device 6 is replaced to change the storing tray 1. Can be shared or generalized.
[Selection] Figure 3

Description

  The present invention relates to an electronic device having terminals protruding from one side of a main body, such as a semiconductor area array type package with terminals typified by BGA (Ball Grid Array), LGA (Land Grid Array), and CSP (Chip Size Package). Relates to a tray for storing parts

  In general, a wafer level chip size package (hereinafter referred to as a semiconductor device) is used as one form of an electronic component (hereinafter referred to as a semiconductor device) having a terminal projecting from one side surface thereof, such as a semiconductor area array type package with terminals such as BGA, LGA and CSP. , A semiconductor device called WLCSP) exists. WLCSP is characterized in that the semiconductor device is formed to be approximately the same size as the semiconductor chip. Therefore, WLCSP has an unspecified number of sizes, and is used in manufacturing processes such as packaging of semiconductor devices and electrical screening before shipment, and as a container for temporary storage of semiconductor devices and transport in the process and facilities. In a used tray (hereinafter referred to as a storage tray), a storage pocket for storing a semiconductor device such as WLCSP is also set in accordance with the aforementioned size. For this reason, many molds used for molding the storage tray are produced for each size of the WLCSP to be stored. In this manner, the semiconductor device stored in the storage tray is stored in the final embossed carrier tape, and is packed and shipped.

  Next, FIGS. 7 and 8 show the structure of a conventional storage tray. FIG. 7 is a perspective view of a conventional storage tray, and FIG. 8 is a perspective view showing a state in which a semiconductor device is stored in the storage tray. As shown in FIG. 7, the storage tray 1 is formed such that a plurality of concave storage portions 10 are arranged in a matrix in the storage tray, and is mainly formed by injection molding.

  However, in the conventional storage tray 1 described above, the size of the concave storage portion 10 is set in accordance with the size of the semiconductor device 6 to be stored in the same manner as the embossed carrier tape for packing and shipping. It was difficult to have. Therefore, conventionally, a molding die for each semiconductor device 6 having different external dimensions is required, and the types of molding dies have increased. This is a major factor for storage tray molding manufacturers, which causes loss of reattachment of molding dies to molding equipment and complicates management of molding dies. In addition, in the semiconductor device manufacturer, replacement of the semiconductor device with an electrical screening device and complicated inventory management of the storage tray 1 are incurred.

  FIG. 9 shows the structure of the embossed carrier tape 3 used for packing and shipping the semiconductor device. 9 is a plan view of the embossed carrier tape, and FIG. 10 is a cross-sectional view taken along the line A-A ′ of FIG. 9 showing a state in which the semiconductor device is housed in the concave housing portion of the embossed carrier tape. As shown in FIG. 10, the embossed carrier tape 3 is formed by pressure molding, vacuum molding, press molding, or the like so that a plurality of concave storage portions 10 are aligned at regular intervals along the tape longitudinal direction. As shown in FIGS. 9 and 10, the concave storage portion 10 is a recess formed of a bottom portion and four receiving surfaces formed in an inverted pyramid shape toward the bottom portion.

  Further, as shown in FIG. 9, the embossed carrier tape 3 is provided with a feed hole 5 for feeding out the embossed carrier tape 3 on one side in the tape width direction.

  This embossed carrier tape 3 is adjusted to the external dimensions (width and thickness) of the semiconductor device 6 to be stored so that the adsorption rate of the semiconductor device 6 when the semiconductor device 6 is taken out from the concave storage portion 10 by a mounting machine is not lowered. The width and depth of the concave storage portion 10 are optimally designed.

For this reason, the mold for molding the embossed carrier tape 3 is produced in accordance with the external dimensions (width and thickness) of the semiconductor device in the same manner as the storage tray 1. (For example, refer to Patent Document 1).
JP 2004-284592 A

  However, the storage tray and the embossed carrier tape having such a configuration are manufactured according to the external dimensions of the semiconductor device stored in the concave storage portion, and the types of molding dies increase, There is a problem that a transfer loss occurs, the management of the molding die becomes complicated, and the transfer of the semiconductor device to the electrical screening device and the inventory management of the storage tray are complicated.

  The present invention is directed to solving the above-described problems of the prior art, in which an embossed carrier tape for packaging and shipping semiconductor devices is fixed and mounted on a partition portion (tray recess) in a storage tray. It is an object of the present invention to provide a tray and an electronic component storage method that are made to be generalized or shared by using a component concave storage portion.

  In order to achieve the above object, the tray according to the first aspect of the present invention is a tray in which a plurality of recesses for storing electronic components are formed, and is molded separately from the recesses and fixed to the recesses. A component carrier having a plurality of electronic component concave storage portions to be mounted is provided.

  Further, the tray according to any one of claims 2 to 6 is the same as the tray according to claim 1, wherein the conical protrusions to be fitted to the feed holes of the component carrier used for fixing and mounting to the recesses are flat on the tray in which the recesses are formed. Provided with a rectangular columnar part for fixing and mounting the concave portion and the component carrier, and a cylindrical projection of the rectangular columnar component, and a hole in the flat portion of the tray in which the concave portion is formed and a feeding hole of the component carrier The electronic component concave storage portion disposed on the component carrier fixed and mounted in the concave portion is molded according to the size of the electronic component to be stored, and fixed in the concave portion. The component carrier to be mounted is shared for electronic component storage by changing the size according to the size of the electronic component stored in the electronic component concave storage part, and the electronic component concave storage fixed and mounted in the recess There placed component carrier is characterized in that it is embossed carrier tape.

  According to a seventh aspect of the present invention, there is provided an electronic component storing method that uses the tray according to any one of the first to sixth aspects to an electronic component concave storing portion of a component carrier that is fixed and attached to the concave portion of the tray. It is characterized by containing electronic parts.

  According to the above-described configuration and method, the tray for storing the electronic components can be generalized or shared, and storage can be performed while suppressing external influences on the electronic components during transportation.

  According to the present invention, the structure for fixing the embossed carrier tape for packing and shipping to the storage tray allows the storage tray to be generalized or shared, and the number of molds for the storage tray is reduced. Thus, the number of molds held by this molding manufacturer can be reduced, the loss of mold transfer to the molding equipment, the control of molding mold management can be suppressed, and the electrical screening equipment for semiconductor devices can be reduced. There is an effect that it is possible to suppress complication of inventory management of storage trays used for replacement.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view showing a storage tray in Embodiment 1 of the present invention. Here, components having the same functions corresponding to the components described in FIGS. 7 to 10 showing the conventional example are denoted by the same reference numerals, and the same applies to the following drawings.

  2 is a perspective view showing a state in which an embossed carrier tape of a component carrier cut to a desired length is fixed and mounted in a tray recess that is a recess of the storage tray. FIG. 3 is a perspective view of the storage tray. It is a perspective view which shows the state which accommodated the semiconductor device in the concave storage part of the embossed carrier tape fixed to the tray recessed part.

  As shown in FIG. 1, a tray recess 4 for fixing and mounting the embossed carrier tape 3 is formed in the storage tray 1 at regular intervals, and a conical shape for fixing the embossed carrier tape 3 is formed on the flat portion. The protrusions 2 are formed at regular intervals along the longitudinal direction of the tray recess 4.

  As shown in FIG. 2, in the first embodiment, the feed hole 5 of the embossed carrier tape 3 is fitted into the conical protrusion 2 of the storage tray 1, and the embossed carrier tape 3 is fixed and mounted. Further, as shown in FIG. 3, the semiconductor device 6 is stored in the concave storage portion 10 after the embossed carrier tape 3 is fixed.

  Therefore, according to the first embodiment, the shipping embossed carrier tape 3 designed and manufactured in accordance with the external dimensions of the semiconductor device 6 is mounted on the storage tray 1 as the concave storage portion 10, so that the storage tray 1 Can be used as Further, by changing the embossed carrier tape 3, it can also be used as a storage tray 1 for semiconductor devices 6 having different external dimensions.

  Here, the conical protrusion 2 of the storage tray 1 is designed to have a predetermined size so as not to easily fall out from the feed hole 5 of the embossed carrier tape 3 used as the concave storage portion 10. Further, the shape is not limited to a conical shape, and may be a polygonal pyramid shape, for example.

  It should be noted that the material of the storage tray 1 is made of a conductive resin obtained by kneading carbon into a resin such as polystyrene, polypropylene, or polyphenylene ether (PPE), or a resin such as acrylonitrile-butadiene-styrene (ABS) or polycarbonate (PC). A material having electrostatic dispersibility with antistatic performance is used. Since the above-mentioned resin is a thermoplastic resin, an injection molding method is mainly used. Moreover, since the embossing carrier tape 3 is also molded using a thermoplastic resin, after heating to around 100 ° C., the steel plate is pressed and die-cut to form a thickness of about 0.1 mm to 2 mm. As the material of the embossed carrier tape 3, a conductive resin obtained by kneading carbon into a resin such as polystyrene (PS) or a resin such as polyethylene terephthalate (PET) coated with a carbon-based conductive material is used.

  In addition, according to the first embodiment, the concave storage portion 10 for inserting the semiconductor device 6 can be used in the past by using the embossed carrier tape 3 that is molded by partially heating the base tape and press-contacting it to the iron plate. The positional accuracy of the concave storage portion 10 is improved as compared with a method in which the thermoplastic resin is integrally formed by injection molding.

  Furthermore, according to the first embodiment, when the storage tray 1 is used as a transport case not only in the process but also between the factories, there is a gap between the storage tray 1 main body and the embossed carrier tape 3. As a result, the buffering property is improved, and mechanical damage to the semiconductor device 6 can be reduced.

  As described above, according to the first embodiment, the embossed carrier tape 3 designed and manufactured in accordance with the external dimensions of the semiconductor device 6 to be stored is used as the concave storage portion 10 for each semiconductor device 6 to be stored. The storage tray 1 can be shared and generalized by being fixed to and mounted on.

(Embodiment 2)
FIG. 4 is a perspective view showing a storage tray in Embodiment 2 of the present invention. FIG. 5 is a perspective view showing a state in which an embossed carrier tape cut to a desired length is fixed and attached to the concave portion of the storage tray. FIG. 6 is fixed and attached to the concave portion of the storage tray. It is a perspective view which shows the state which accommodated the semiconductor device in the concave storage part of the embossed carrier tape.

  As shown in FIG. 4, a tray recess 4 for fixing and mounting the embossed carrier tape 3 is formed in the storage tray 1 at regular intervals, and a hole 7 for fixing the embossed carrier tape 3 is formed in the flat portion. Are formed at regular intervals along the longitudinal direction of the tray recess 4.

  Further, as shown in FIG. 5, in the second embodiment, the feed holes 5 of the embossed carrier tape 3 are aligned with the holes 7 of the flat portion of the storage tray 1 and the cylindrical protrusions 9 are formed at regular intervals from above. The embossed carrier tape 3 is fixed and mounted by fitting the columnar parts 8. In addition, as shown in FIG. 6, the semiconductor device 6 is stored in the concave storage portion 10 after the embossed carrier tape 3 is fixed.

  Therefore, according to the second embodiment, the shipping embossed carrier tape 3 designed and manufactured in accordance with the external dimensions of the semiconductor device 6 is mounted on the storage tray 1 as the concave storage portion 10, whereby the storage tray 1. The embossed carrier tape 3 can be used as a storage tray 1 for a semiconductor device 6 having different external dimensions.

  Here, the columnar projection 9 of the prismatic component 8 is easily formed from the feed hole 5 of the embossed carrier tape 3 used as the concave storage portion 10 and the fixing hole 7 formed in the flat portion of the storage tray 1. It is designed to have a predetermined size so that it will not fall out. Further, the cylindrical protrusion 9 is not limited to a cylindrical shape, and may be a polygonal pyramid shape, for example.

  The material for the storage tray 1 and the prismatic component 8 is made of conductive resin such as polystyrene, polypropylene, polyphenylene ether (PPE), or the like described in the first embodiment, or acrylonitrile-butadiene. -A resin having electrostatic diffusivity, which is made of a resin such as styrene (ABS) or polycarbonate (PC) and has antistatic properties, is used. Similarly, since the resin is a thermoplastic resin, an injection molding method is mainly used.

  The material of the embossed carrier tape 3 is a conductive resin obtained by kneading carbon in a resin such as polystyrene (PS) described in the first embodiment, or a carbon conductive material in a resin such as polyethylene terephthalate (PET). A coated one is used. Further, since the embossed carrier tape 3 is similarly molded using a thermoplastic resin, it is heated to around 100 ° C., pressed against a steel plate and punched, and molded to a thickness of about 0.1 mm to 2 mm.

  Similarly to the first embodiment, the concave storage portion 10 for inserting the semiconductor device 6 uses the embossed carrier tape 3 formed by partially heating the base tape and press-contacting it to the iron plate, so that the conventional method can be used. The positional accuracy of the concave storage portion 10 is improved as compared with a method in which the thermoplastic resin is integrated and molded by an injection molding method.

  Furthermore, when the storage tray 1 is used as a case for transporting not only in the process but also between the factories, the buffering performance is improved by forming a gap between the storage tray 1 main body and the embossed carrier tape 3. In addition, mechanical damage to the semiconductor device 6 can be reduced.

  As described above, according to the second embodiment, the embossed carrier tape 3 designed and manufactured according to the external dimensions of the semiconductor device 6 to be stored is provided in the storage tray 1 as the concave storage portion 10 for each semiconductor device 6 that stores the embossed carrier tape 3. The storage tray 1 can be shared or generalized by fixing and mounting.

  The tray and the electronic component storage method according to the present invention can be used for general purpose or common use of the storage tray by the structure in which the embossed carrier tape for packing and shipping is fixed to the storage tray. BGA, LGA, CSP It is useful as a tray for storing electronic components with terminals protruding from one side of the main body, such as a semiconductor area array type package with terminals such as.

The perspective view which shows the tray for storage in Embodiment 1 of this invention The perspective view which shows the state which fixed the embossed carrier tape to the recessed part of the storage tray of Embodiment 1, and was mounted | worn. The perspective view which shows the state which accommodated the semiconductor device in the concave storage part of the embossed carrier tape fixed to the tray recessed part of the storage tray of Embodiment 1, and mounted | worn. The perspective view which shows the tray for storage in Embodiment 2 of this invention The perspective view which shows the state which fixed the embossed carrier tape to the recessed part of the storage tray of Embodiment 2, and was mounted | worn. The perspective view which shows the state which fixed and mounted | worn the embossed carrier tape to the tray recessed part of the storage tray of Embodiment 2, and accommodated the semiconductor device in the recessed storage part. The perspective view which shows the structure of the conventional storage tray The perspective view which shows the accommodation state of the semiconductor device in the conventional storage tray Top view of conventional embossed carrier tape A-A 'cross-sectional view of FIG. 9 using a conventional embossed carrier tape

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Storage tray 2 Conical protrusion 3 Embossed carrier tape 4 Tray recessed part 5 Feed hole 6 Semiconductor device 7 Hole 8 Square columnar component 9 Columnar protrusion 10 Recessed storage part

Claims (7)

  A tray having a plurality of recesses for storing electronic components, the tray comprising a component carrier that is molded separately from the recesses and in which a plurality of electronic component recess storage portions that are fixed and attached to the recesses are arranged. Tray featuring.   2. The tray according to claim 1, wherein a conical protrusion to be fitted into a feed hole of a component carrier used for fixing and mounting to the concave portion is provided on a flat portion of the tray in which the concave portion is formed.   A prismatic component for fixing and mounting the concave portion and the component carrier is provided, and the hole of the flat portion of the tray in which the concave portion is formed and the feed hole of the component carrier are fitted by the cylindrical projection of the prismatic component. The tray according to claim 1, wherein the tray is fixed.   The tray according to claim 1, wherein the electronic component concave storage portion disposed on the component carrier fixed and mounted in the concave portion is molded according to the size of the electronic component to be stored.   2. The tray according to claim 1, wherein the component carrier fixed and mounted in the concave portion is shared for electronic component storage by changing in accordance with the size of the electronic component stored in the electronic component concave storage portion.   The tray according to any one of claims 1 to 5, wherein the component carrier on which the electronic component concave storage portion fixed and mounted in the concave portion is disposed is an embossed carrier tape.   An electronic component storage, wherein the electronic component is stored in an electronic component concave storage portion of a component carrier fixed and mounted in the concave portion of the tray by using the tray according to any one of claims 1 to 6. Method.

Images