JP2008308728A - Backing plate and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive backing plate having sufficient mechanical strength. <P>SOLUTION: The backing plate for holding a sputtering target has a main body part 2 which is made by stacking and joining a plate 2C made from copper for an electrode with a reinforcing plate 2S made from stainless steel. The main body part 2 has a water channel 4 placed therein for circulating a cooling water, and has the plate 2C for the electrode arranged on a side on which the sputtering target 3 is held. The water channel 4 is placed on the reinforcing plate 2S so that its inner space comes in contact with the plate 2C for the electrode. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technology for manufacturing a backing plate that holds a sputtering target used in a sputtering method.

  In general, as a backing plate for holding a sputtering target, a copper (Cu) plate having a high thermal conductivity is often used in order to use it as an electrode and to have good electrical conductivity and to efficiently remove heat during discharge. It has been.

FIG. 3 is a cross-sectional view showing a configuration of a conventional backing plate.
As shown in FIG. 3, a conventional backing plate 101 has a target 103 attached to a main body 102 made of copper (Cu). And in order to cool the main-body part 102, the water channel 104 is dug in the inside, and the backing plate without a water leak is attached by attaching the lid | cover 105 made from copper or stainless steel (SUS) to the part of this water channel 104, and joining. It is comprised so that it may become.

However, in such a conventional technique, for example, when brazing is adopted as a joining method of the main body portion 102 and the lid 105, the entire plate is made of copper having a high thermal conductivity, and thus is annealed at a high temperature. There is a possibility that problems such as loss of mechanical strength and deformation occur.
For this reason, in recent years, EBW (electron beam welding) and FSW (friction stir welding) using local frictional heat are often used as a method for joining the lid and the main body of the backing plate.

However, even in the case of using EBW or FSW, in the conventional technique using copper having good thermal conductivity, the mechanical strength of the entire plate is lowered during welding, causing a strength problem. Moreover, EBW and FSW may be difficult for a large backing plate.
Moreover, in the prior art, copper as a constituent material is expensive, and welding by EBW and FSW is an expensive process, so that there is a problem that the backing plate becomes expensive.
JP 2002-220661 A

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a backing plate that is inexpensive and has sufficient mechanical strength.

In order to achieve the above object, the invention according to claim 1 is a backing plate for holding a sputtering target, wherein an electrode plate made of copper and a reinforcing plate made of stainless steel are joined and laminated. A cooling path for circulating a cooling medium is provided in the main body, and the electrode plate is disposed on the side holding the sputtering target.
According to a second aspect of the present invention, in the first aspect of the present invention, the cooling path is provided such that an internal space thereof is in contact with the electrode plate.
According to a third aspect of the present invention, in the second aspect of the present invention, the cooling path is provided in the reinforcing plate.
According to a fourth aspect of the present invention, in the second aspect of the present invention, the cooling path is provided in the electrode plate.
The invention according to claim 5 is the manufacturing method of the backing plate according to claims 1 to 4, wherein the cooling path is dug and formed in the main body portion from the reinforcing plate side, and then a cover made of stainless steel is provided. A step of joining the reinforcing plate by arc welding.

  In the case of the present invention, it has a main body part obtained by joining and laminating an electrode plate made of copper and a reinforcing plate made of stainless steel, and the electrode plate is arranged on the side holding the sputtering target. While it becomes a good electrode (cathode) with a uniform voltage made of copper having good electrical conductivity, a sufficient mechanical strength can be secured by a reinforcing plate made of stainless steel. In addition, since stainless and copper have very close linear expansion coefficients, problems such as deformation due to heat do not occur.

In the present invention, when the internal space of the cooling path is provided so as to be in contact with the electrode plate, the main body can be efficiently cooled by copper having a high thermal conductivity.
In this case, when the cooling path is provided in the reinforcing plate, the electrode plate can be made thin, which is advantageous in terms of strength and cost.

  On the other hand, when the cooling path is provided in the electrode plate, the area of the cooling path in contact with the electrode plate can be increased, so that there is an effect that more efficient cooling is possible.

  According to the manufacturing method of the present invention, the lid made of stainless steel is joined to the reinforcing plate made of stainless steel by arc welding, so that it can be joined in a simple process in the atmosphere, thereby backing it inexpensively in a short period of time. Plates can be made.

  According to the present invention, it is possible to provide a backing plate that is inexpensive and has sufficient mechanical strength.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a backing plate according to the present invention.
As shown in FIG. 1, the backing plate 1 of the present embodiment includes a main body 2 in which an electrode plate 2C made of copper (Cu) and a reinforcing plate 2S made of stainless steel (SUS) are joined and laminated. have.
In this case, the electrode plate 2 </ b> C is arranged on the side that holds the sputtering target 3, and holds the sputtering target 3.

  In the present invention, the thickness of the electrode plate 2C is preferably 5 to 10 mm from the viewpoint of avoiding an increase in cost while ensuring strength while not particularly limited.

On the other hand, the reinforcing plate 2S is not particularly limited, but it is preferable to use nonmagnetic austenitic stainless steel from the viewpoint of not disturbing the plasma used for sputtering.
Further, the thickness of the reinforcing plate 2S is not particularly limited, but is preferably 10 to 15 mm in consideration of strength and an appropriate thickness of the backing plate.

  In the case of the present invention, the main body 2 may be clad steel obtained by bonding the electrode plate 2C and the reinforcing plate 2S, or a plywood formed by brazing the electrode plate 2C and the reinforcing plate 2S.

And in this Embodiment, the water channel (the channel for circulating the water as a cooling medium by digging into the reinforcing plate 2S from the surface side, that is, the side opposite to the side where the electrode plate 2C is provided) Cooling path) 4 is formed.
Here, the water channel 4 is dug through the reinforcing plate 2 </ b> S so that the surface (back side surface) of the electrode plate 2 </ b> C is exposed to the space of the water channel 4.

Further, a cover 5 made of stainless steel is attached to a portion where the reinforcing plate 2S is dug so as to cover the water channel 4 of the reinforcing plate 2S.
In the case of the present invention, although not particularly limited, the lid 5 is joined to the reinforcing plate 2S by arc welding (for example, TIG welding) from the viewpoints of cleanliness and prevention of welding distortion and welding defects. Is preferred.

  According to the present embodiment having such a configuration, it has a body portion 2 in which an electrode plate 2C made of copper and a reinforcing plate 2S made of stainless steel are joined and laminated. Since it is arranged on the side where the sputtering target 3 is held, a good and uniform electrode (cathode) made of copper with good electrical conductivity can be obtained, while the reinforcing plate 2S made of stainless steel makes the main body portion A sufficient mechanical strength of 2 can be secured. In addition, since stainless and copper have very close linear expansion coefficients, problems such as deformation due to heat do not occur.

Moreover, in this Embodiment, since the cooling water which circulates in the water channel 4 is comprised so that the surface of 2 C for electrodes may be contacted, the main-body part 2 is efficiently passed through copper with large heat conductivity. Can be cooled.
Furthermore, according to this embodiment, since the lid 5 made of stainless steel is joined to the reinforcing plate 2S made of stainless steel by arc welding, the lid 5 can be joined in a simple process in the atmosphere. Thus, the backing plate 1 can be manufactured in a short period of time and at a low cost.

  FIG. 2 is a cross-sectional view showing the configuration of another embodiment of a backing plate according to the present invention. Hereinafter, the same parts as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 2, in the backing plate 1A of the present embodiment, a water channel 4 is provided in the electrode plate 2C.
In this case, the water channel 4 is provided by digging from the surface side of the reinforcing plate 2S, as in the above embodiment.

  Also in the present embodiment having such a configuration, a good electrode (cathode) having a uniform voltage made of copper having good electrical conductivity can be obtained as in the case of the above-described embodiment, while a reinforcing electrode made of stainless steel can be obtained. The plate 2S can ensure sufficient mechanical strength of the main body 2. In addition, since stainless and copper have very close linear expansion coefficients, problems such as deformation due to heat do not occur.

  Moreover, in this Embodiment, since the cooling path 4 is provided in the electrode plate 2C, and it is comprised so that cooling water may contact the inner wall face of the cooling path 4, it is efficient via copper with large heat conductivity. The main body 2 can be cooled well.

Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.
Note that the present invention is not limited to the above-described embodiment as long as it is included in the scope of the present invention, and various modifications can be made.

Schematic cross-sectional configuration diagram of an embodiment of a backing plate according to the present invention Schematic sectional view showing the configuration of another embodiment of the present invention Schematic sectional view showing the structure of a conventional backing plate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Backing plate 2 ... Main-body part 2C ... Electrode plate 2S ... Reinforcing plate 3 ... Sputtering target 4 ... Water channel (cooling channel) 5 ... Cover

Claims (5)

A backing plate for holding a sputtering target,
It has a main body part in which an electrode plate made of copper and a reinforcing plate made of stainless steel are joined and laminated,
The main body is provided with a cooling path for circulating a cooling medium,
A backing plate in which the electrode plate is disposed on the side holding the sputtering target.   The backing plate according to claim 1, wherein the cooling path is provided so that an internal space thereof is in contact with the electrode plate.   The backing plate according to claim 2, wherein the cooling path is provided in the reinforcing plate.   The backing plate according to claim 2, wherein the cooling path is provided in the electrode plate. A manufacturing method of a backing plate according to claim 1,
A method for manufacturing a backing plate, comprising the step of digging and forming the cooling path in the main body portion from the reinforcing plate side, and then joining a lid made of stainless steel to the reinforcing plate by arc welding.

Images