JP2008238196A - PRESS DIE CENTERING DEVICE AND PRESS DIE CENTERING METHOD USING THE SAME - Google Patents

Abstract

Provided is a press mold centering device capable of maintaining the centering accuracy even when the mold is mounted, and a press mold centering method using the same.
A measuring unit includes a misalignment measuring unit that is mounted on an upper mold substrate and measures a misalignment, and a misalignment measurement unit that is mounted on a lower mold substrate and measures misalignment. Positions of the first and second measurement tools 22 and 23 disposed in the measurement target section 20 corresponding to the first and second measurement tools 12 and 13 by the ten first and second measurement tools 12 and 13. The displacement is measured, the displacement of the lower mold substrate D2 is calculated and the position is corrected, and the lower mold substrate D2 and the upper mold substrate P2 are centered.
[Selection] Figure 1

Description

  The present invention relates to a press mold centering apparatus and a press mold centering method using the same. More specifically, the present invention relates to a press mold centering apparatus capable of accurately and easily aligning upper and lower molds and a press mold centering method using the same.

  Conventionally, in press processing, so-called centering is performed in which the center lines of the upper and lower molds coincide with each other in order to obtain the desired accuracy of the press-formed product. This centering is generally performed using a centering jig. FIG. 7 shows an example of a centering jig used for centering a punch press.

  As shown in FIG. 7, the centering jig 100 includes an upper jig 102 mounted in the jig hole of the upper frame 101 and a lower jig 104 mounted in the jig hole of the lower frame 103. . A centering punch 105 is fitted to the center of the upper jig 102 with a predetermined tolerance, while a centering die 106 is fitted to the lower jig 104 with a predetermined tolerance.

  The centering jig 100 performs centering by adjusting the lower frame 103 to an appropriate position so that the axis C2 of the centering die 106 coincides with the axis C1 of the centering punch 105, thereby positioning the lower frame 103. After that, the upper jig 102 and the lower jig 104 are replaced with punch guides and die holders used for actual pressing.

  However, since the upper jig 102 and the lower jig 104 can be applied to a plurality of types of molds, the tolerance of each mold itself and the tolerance between the mold and the upper jig 102 and the lower jig 104 can be reduced. Depending on the combination, there is a problem that tolerances are accumulated and the centering accuracy cannot be maintained during mounting.

In addition, the centering of the punch press die not based on the centering jig 100 is proposed in Patent Document 1.
Japanese Patent Laid-Open No. 10-85861

  The present invention has been made in view of the problems of the prior art, and is a press mold centering device that maintains the centering accuracy even when the mold is mounted, and a press mold centering method using the same. The purpose is to provide.

  The first form of the press die centering apparatus according to the present invention includes a misalignment measuring unit that is mounted on the upper mold substrate and measures misalignment, and a misalignment cover that is mounted on the lower mold substrate and measures misalignment. A measurement unit, the measurement unit includes a measurement-side substrate, and first and second measurement tools disposed at predetermined intervals on a measurement reference line of the measurement-side substrate, A measurement-side substrate, and first and second measurement tools disposed on the measurement reference line of the measurement-side substrate in correspondence with the first and second measurement tools, A measurement reference axis, a holding member rotatably attached to the measurement reference axis, and a dial gauge in which the angle of the probe is adjustable and held by the holding member. It is characterized by including a reference axis.

  The second form of the press die centering apparatus of the present invention includes a misalignment measuring unit that is mounted on the lower mold substrate and measures misalignment, and a misalignment cover that is mounted on the upper mold substrate and measures misalignment. A measurement unit, the measurement unit includes a measurement-side substrate, and first and second measurement tools disposed at predetermined intervals on a measurement reference line of the measurement-side substrate, A measurement-side substrate, and first and second measurement tools disposed on the measurement reference line of the measurement-side substrate in correspondence with the first and second measurement tools, A measurement reference axis, a holding member rotatably attached to the measurement reference axis, and a dial gauge in which the angle of the probe is adjustable and held by the holding member. It is characterized by including a reference axis.

  A third form of the press die centering apparatus of the present invention includes a misalignment measuring unit that is mounted on the upper mold substrate and measures misalignment, and a misalignment cover that is mounted on the lower mold substrate and measures misalignment. A measurement unit; an arithmetic processing device that calculates a misalignment based on a measurement value from the misalignment measurement unit; and an output unit that outputs a calculation result of the arithmetic processing device. And a first measuring tool and a second measuring tool disposed at a predetermined interval on a measurement reference line of the measurement side substrate, and the measured portion includes a measurement side substrate and a measurement target substrate. First and second measurement tools arranged on a measurement reference line corresponding to the first and second measurement tools, the measurement tool being rotatable about the measurement reference axis and the measurement reference axis A holding member to be mounted; and a non-contact displacement sensor held by the holding member; To characterized in that it comprises a reference axis to be measured.

  The fourth form of the press die centering apparatus of the present invention includes a misalignment measuring unit that is mounted on the lower mold substrate and measures misalignment, and a misalignment cover that is mounted on the upper mold substrate and measures misalignment. A measurement unit; an arithmetic processing device that calculates a misalignment based on a measurement value from the misalignment measurement unit; and an output unit that outputs a calculation result of the arithmetic processing device. And a first measuring tool and a second measuring tool disposed at a predetermined interval on a measurement reference line of the measurement side substrate, and the measured portion includes a measurement side substrate and a measurement target substrate. First and second measurement tools arranged on a measurement reference line corresponding to the first and second measurement tools, the measurement tool being rotatable about the measurement reference axis and the measurement reference axis A holding member to be mounted; and a non-contact displacement sensor held by the holding member; To characterized in that it comprises a reference axis to be measured.

  In the press die centering apparatus according to the present invention, the measurement reference axis has a flange near one end, the flange is brought into contact with the measurement side substrate and fitted to the measurement side substrate, and the measurement reference axis It is preferable that each has a ridge in the vicinity of one end, and is fitted to the measurement-side substrate by bringing the ridge into contact with the measurement-side substrate.

  In the press die centering apparatus of the present invention, it is preferable that the length of the reference axis to be measured exceeds the pass line.

  A first form of the press mold centering method of the present invention is a press mold centering method using the press mold centering apparatus of the first embodiment, wherein the center misalignment measuring portion is arranged on the upper mold substrate. Mounting procedure, a procedure for mounting the misalignment measurement target part on the lower mold substrate, a procedure for bringing the probe of the dial gauge into contact with the measurement reference axis, and the dial gauge while rotating the holding member in a certain direction. To measure the deviation of the measured reference axis from the measurement reference axis, to calculate the position correction amount of the lower mold substrate from the measurement result, and based on the calculated position correction amount of the lower mold substrate The position is corrected, and the upper mold substrate and the lower mold substrate are centered.

  A second form of the press mold centering method of the present invention is a press mold centering method using the press mold centering apparatus of the second form, wherein the misalignment measuring unit is disposed on the lower mold substrate. Mounting procedure, a procedure for mounting the misalignment measured part on the upper mold substrate, a procedure for bringing the probe of the dial gauge into contact with the measured reference axis, and the dial gauge while rotating the holding member in a fixed direction. The procedure for measuring the deviation of the measured reference axis from the measurement reference axis, the procedure for calculating the position correction amount of the upper mold substrate from the measurement result, and the upper mold substrate based on the calculated position correction amount The position is corrected and the upper mold and the lower mold are centered.

  A third form of the press mold centering method of the present invention is a press mold centering method using the press mold centering apparatus of the third embodiment, wherein the center misalignment measuring unit is disposed on the upper mold substrate. Measure the deviation of the measured reference axis from the measurement reference axis using a non-contact displacement sensor while rotating the holding member in a fixed direction. A procedure for calculating the position correction amount of the lower mold substrate from the measurement result, and correcting the position of the lower mold substrate based on the calculated position correction amount, and the core between the upper mold substrate and the lower mold substrate It is characterized by making out.

  A fourth form of the press mold centering method of the present invention is a press mold centering method using the press mold centering apparatus of the fourth embodiment, wherein the center misalignment measuring unit is disposed on the lower mold substrate. Measure the deviation of the measured reference axis from the measurement reference axis using a non-contact displacement sensor while rotating the holding member in a fixed direction. A procedure for calculating a position correction amount of the lower mold substrate from the measurement result, a position of the upper mold substrate is corrected based on the calculated position correction amount, and a core between the upper mold substrate and the lower mold substrate is corrected. It is characterized by making out.

  In the first and second embodiments of the press die centering method of the present invention, it is preferable to perform measurement by positioning the probe on the pass line.

  In the third and fourth embodiments of the press die centering method of the present invention, it is preferable to perform measurement by positioning the non-contact displacement sensor on the pass line.

  According to the present invention, it is possible to obtain an excellent effect that the centering of the upper mold substrate and the lower mold substrate can be accurately and easily performed. In addition, since the upper mold substrate and the lower mold substrate are centered, it is not necessary to center each time the upper mold and the lower mold are exchanged. An effect is also obtained.

  Hereinafter, although the present invention is explained based on an embodiment, referring to an accompanying drawing, the present invention is not limited only to this embodiment.

Embodiment 1
1 and 2 show a press die centering apparatus according to Embodiment 1 of the present invention. FIG. 1 shows a schematic front view, and FIG. 2 shows an enlarged side view thereof.

  As shown in FIGS. 1 and 2, the press mold centering device A (hereinafter simply referred to as centering device) A is mounted on the upper mold substrate P2 on the upper mold holder P1 and measures misalignment. A measuring unit (hereinafter simply referred to as a measuring unit) 10 and a misalignment measured unit (hereinafter simply referred to as a measured unit) 20 that is mounted on the lower mold substrate D2 on the lower mold holder D1 and measures misalignment. It is supposed to be prepared.

  The measuring unit 10 includes a first measuring tool 12 (30) and a first measuring tool 12 (30) and a first measuring tool 12 (30) having the same structure disposed at a predetermined interval on a measurement reference line (for example, a center line) of the measuring side substrate 11. 2 measuring tool 13 (30).

  The measuring tool 30 is freely rotatable near the end of the measurement side substrate 11, that is, the measurement reference shaft 31 in which the flange 32 is formed in the vicinity of the upper end, and the other end of the measurement reference shaft 31, that is, near the lower end. The mounted holding member 33 and the dial gauge 34 that is held on the outer peripheral portion of the holding member 33 with the probe 34a facing inward and downward and the tilt angle being adjustable through appropriate means are provided.

  Here, the protruding length of the upper end portion of the measurement reference shaft 31 from the upper surface of the flange 32 is shorter than the thickness of the measurement side substrate 11. Therefore, when the measurement reference axis 31 is suspended from the measurement side substrate 11, the upper end of the measurement reference axis 31 does not protrude from the measurement side substrate 11. The length of the measurement reference shaft 31 is adjusted so that the tip of the probe 34a of the dial gauge 34 can be positioned on the pass line L, and its lower end does not interfere with the tip of the shaft to be measured, which will be described later, that is, the upper end. ing.

  Further, the holding of the dial gauge 34 by the holding member 33 is performed, for example, by fitting a held member 34b provided at the rear portion of the dial gauge 34 so as to be adjustable in angle into a holding hole 33a provided in the outer peripheral portion of the holding member 33. It is made by letting.

  Reference numeral 35 in the drawing denotes a bearing for making the holding member 33 rotatable around the measurement reference axis 31.

  Thus, the measurement reference shaft 31 has an upper end protruding from the flange 32 fitted in a mounting hole 11a provided in the measurement side substrate 11, and the flange 32 is bolted to the measurement side substrate 11 to be measured side. The measurement tool 30 is arranged on the reference line of the measurement side substrate 11 by being suspended from the substrate 11.

  The measurement target 20 is a first measurement tool having the same structure that is disposed on the measurement target substrate 21 and the measurement reference line (for example, the center line) of the measurement target substrate 21 with the predetermined interval. 22 (40) and the second measuring tool 23 (40).

  Specifically, the measuring tool 40 is a measuring shaft 41 in which a flange 42 is formed near the lower end.

  Here, the protruding length of the end of the shaft 41 to be measured attached to the measurement-side substrate 21, that is, the lower end of the measurement shaft 41 from the bottom surface of the flange 42 is shorter than the thickness of the measurement-side substrate 21. Therefore, when the measured shaft 41 is suspended from the measured side substrate 21, the lower end of the measured shaft 41 does not protrude from the measured side substrate 21. Further, the length of the measured shaft 41 is adjusted so that the upper end thereof exceeds the pass line L.

  Thus, the measured shaft 41 has a lower end protruding from the flange 42 fitted into the mounting hole 21a provided in the measured-side substrate 21, and the flange 42 is bolted to the measured-side substrate 21. The measurement tool 40 is arranged on the reference axis of the measurement target board 21 by being suspended from the measurement target board 21.

  Next, centering by the centering apparatus A having such a configuration will be described.

  Procedure 1: The measuring unit 10 is mounted on the upper mold substrate P2 with the first measured device 12 and the second measured device 13 facing downward, while the measured unit 20 is mounted on the first measured device 22 and the second measured device. The measuring tool 23 is mounted on the lower mold substrate D2 in a state corresponding to the first measuring tool 12 and the second measuring tool 13, respectively.

  Procedure 2: With the probe 34a of the dial gauge 34 of each of the first measurement tool 12 and the second measurement tool 13 positioned on the pass line L, the first measurement tool 22 and the second measurement tool 23 are contacted. Make contact.

  Procedure 3: With the probe 34a of the dial gauge 34 of each of the first measuring tool 12 and the second measuring tool 13 in contact with the first measured tool 22 and the second measured tool 23, the holding member 33, 33 is rotated in a certain direction, for example, clockwise, and the misalignment of each of the first device to be measured 22 and the second device to be measured 23 is measured at several points. For example, measurement is performed at intervals of 90 degrees or 120 degrees.

  Procedure 4: From the measurement result, for example, the positional deviation of the first measured axis 41 from the first measurement reference axis 31 and the deviation of the measured reference line from the measurement reference line are calculated. These calculations are easily performed by a known arithmetic processing method.

  Procedure 5: The position correction amount of the lower mold substrate D2 is calculated based on the positional deviation of the first measured axis 41 from the first measurement reference axis 31 and the deviation of the measured reference line from the measurement reference line. This calculation is also easily performed by a known arithmetic processing method.

  Procedure 6: The position of the lower mold substrate D2 is corrected based on the position correction amount. That is, the upper mold substrate P2 and the lower mold substrate D2 are centered.

  Thus, in the first embodiment, since the upper mold P2 on which the upper mold, that is, the punch is mounted, and the lower mold D2, on which the lower mold, that is, the die is mounted, are aligned. Even if the mold and the lower mold are exchanged, it is not necessary to center each time, and the lead time can be remarkably shortened.

Embodiment 2
A press die centering device according to Embodiment 2 of the present invention is shown in FIGS. FIG. 3 shows a schematic view, FIG. 4 shows an enlarged side view of the measuring unit, and FIG. 5 shows a block diagram. 3 to 5, the same reference numerals as those in FIGS. 1 and 2 denote the same or similar components.

  A press mold centering device (hereinafter simply referred to as a centering device) A1, as shown in FIGS. 3 to 5, is mounted on an upper mold substrate P2 on an upper mold holder P1 and measures misalignment. A measurement unit (hereinafter simply referred to as a measurement unit) 10A, a misalignment measurement unit (hereinafter simply referred to as a measurement target unit) 20 that is mounted on the lower mold substrate D2 on the lower mold holder D1 and measures the misalignment; The calculation processing device 50 that calculates the misalignment by calculating the measurement value from the measurement unit 10A and the output device 60 that outputs the calculation value from the calculation processing device 50 are provided.

  The measurement unit 10A includes the first measurement tool 16 (70) and the first measurement tool 11 (70) and the first structure 16 and the same structure arranged with a predetermined interval on the measurement reference line (for example, the center line) of the measurement side substrate 11. 2 measuring instrument 17 (70).

  The measuring tool 70 is rotatable around the measurement reference shaft 71 in which a flange 72 is formed in the vicinity of the end portion, that is, the upper end portion of the measurement side substrate 11, and in the vicinity of the other end portion, that is, the lower end portion of the measurement reference shaft 71. The mounted holding member 73 and a non-contact type displacement sensor 74 that is held on the outer periphery of the holding member 73 through an appropriate means so that the inclination angle can be adjusted are provided.

  Here, the protruding length of the upper end portion of the measurement reference shaft 71 from the upper surface of the flange 72 is made shorter than the thickness of the measurement side substrate 11. Therefore, when the measurement reference axis 71 is suspended from the measurement side substrate 11, the upper end of the measurement reference axis 71 does not protrude from the measurement side substrate 11. The length of the measurement reference shaft 71 is adjusted so that the non-contact type displacement sensor 74 can be positioned on the pass line L, and its lower end does not interfere with the tip of the shaft to be measured which will be described later, that is, the upper end. .

  The non-contact type displacement sensor 74 is held by the holding member 73 by, for example, holding a member 74 b provided at the rear part of the non-contact type displacement sensor 74 so that the angle can be adjusted, and a holding hole provided in the outer peripheral portion of the holding member 73. This is done by fitting to 73a.

  The non-contact displacement sensor 74 has a function of outputting a detection value as a laser signal.

  Here, reference numeral 76 in the drawing denotes a bearing for making the holding member 73 rotatable around the measurement reference axis 71.

  Thus, the measurement reference shaft 71 has an upper end projecting from the flange 72 fitted in a mounting hole 11a provided in the measurement-side substrate 11, and the flange 72 is bolted to the measurement-side substrate 11 so as to be measured. The measurement tool 70 is disposed on the reference line of the measurement side substrate 11 by being suspended from the substrate 11.

  As shown in FIG. 6, the arithmetic processing unit 50 amplifies and collects the data digital converter 51 that converts the laser signal from the non-contact type displacement sensor 74 into a digital signal, and the signal from the data digital converter 51. A data collector 52 and an arithmetic processor 53 that performs arithmetic processing on the data collected by the data collector 52 are provided, and the misalignment amount and its direction are calculated. Specifically, the arithmetic processing unit 50 having such a function is configured mainly with a personal computer.

  The output device 60 is, for example, a liquid crystal display device or a printer, and displays the image of the misalignment amount and the direction calculated by the arithmetic processing device 50 and prints it out.

  Thus, the centering by the centering device A1 of the second embodiment is performed in the same manner as the centering device A of the first embodiment, but the misalignment amount and the misalignment direction are calculated simultaneously with the measurement by the measuring unit 10A. Therefore, centering is performed more quickly than in the first embodiment.

  As mentioned above, although this invention has been demonstrated based on embodiment, this invention is not limited only to this embodiment, A various change is possible. For example, in the embodiment, the measurement unit is mounted on the upper mold substrate and the measurement target is mounted on the lower mold substrate. Conversely, the measurement unit is mounted on the lower mold substrate, and the measurement target is the upper mold. It may be mounted on a substrate.

  The present invention can be applied to centering a press die.

It is a front schematic diagram of the centering device concerning Embodiment 1 of the present invention. It is an enlarged side view of the same apparatus. It is the schematic of the centering apparatus which concerns on Embodiment 2 of this invention. It is an enlarged side view of the centering device. It is a block diagram of the same centering apparatus. It is a block diagram of the arithmetic processing unit of the centering device. It is sectional drawing of an example of the conventional centering jig.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Misalignment measurement part 11 Measurement side board | substrate 12,16 1st measurement tool 13,17 2nd measurement tool 20 Misalignment measurement part 21 Measurement side board | substrate 22 1st measurement tool 23 2nd measurement tool 30,70 Measurement Tool 31, 71 Measuring reference axis 33, 73 Holding member 34 Dial gauge 40 Measuring tool 41 Measuring axis 50 Arithmetic processor 51 Data digital converter 52 Data collector 53 Arithmetic processor 60 Output device 74 Non-contact displacement sensor A Centering device L Pass line

Claims (12)

A misalignment measuring unit that is mounted on the upper mold substrate and measures misalignment, and a misalignment measurement unit that is mounted on the lower mold substrate and measures misalignment,
The measurement unit includes a measurement-side substrate, and first and second measurement tools disposed at predetermined intervals on a measurement reference line of the measurement-side substrate,
The measurement target section includes a measurement target substrate, and first and second measurement tools arranged on the measurement reference line of the measurement target substrate in correspondence with the first and second measurement tools. ,
The measurement tool includes a measurement reference axis, a holding member that is rotatably mounted on the measurement reference axis, and a dial gauge that is held by the holding member so that the angle of the probe is adjustable.
The press tool centering apparatus, wherein the measuring tool includes a measuring reference axis. A center misalignment measurement unit that is mounted on the lower mold substrate and measures misalignment, and a center misalignment measurement unit that is mounted on the upper mold substrate and measures misalignment;
The measurement unit includes a measurement-side substrate, and first and second measurement tools disposed at predetermined intervals on a measurement reference line of the measurement-side substrate,
The measurement target section includes a measurement target substrate, and first and second measurement tools arranged on the measurement reference line of the measurement target substrate in correspondence with the first and second measurement tools. ,
The measurement tool includes a measurement reference axis, a holding member that is rotatably mounted on the measurement reference axis, and a dial gauge that is held by the holding member so that the angle of the probe is adjustable.
The press tool centering apparatus, wherein the measuring tool includes a measuring reference axis. Based on the measured values from the misalignment measurement unit that is mounted on the upper mold substrate and measures misalignment, the misalignment measurement unit that is mounted on the lower mold substrate and measures misalignment, and the misalignment measurement unit An arithmetic processing unit that calculates misalignment, and an output unit that outputs a calculation result of the arithmetic processing unit,
The measurement unit includes a measurement-side substrate, and first and second measurement tools disposed at predetermined intervals on a measurement reference line of the measurement-side substrate,
The measurement target section includes a measurement target substrate, and first and second measurement tools arranged on the measurement reference line of the measurement target substrate in correspondence with the first and second measurement tools. ,
The measuring tool includes a measurement reference axis, a holding member rotatably attached to the measurement reference axis, and a non-contact displacement sensor held by the holding member,
The press tool centering apparatus, wherein the measuring tool includes a measuring reference axis. Based on the measured values from the misalignment measurement unit that is mounted on the lower mold substrate and measures misalignment, the misalignment measurement unit that is mounted on the upper mold substrate and measures misalignment, and the misalignment measurement unit An arithmetic processing unit that calculates misalignment, and an output unit that outputs a calculation result of the arithmetic processing unit,
The measurement unit includes a measurement-side substrate, and first and second measurement tools disposed at predetermined intervals on a measurement reference line of the measurement-side substrate,
The measurement target section includes a measurement target substrate, and first and second measurement tools arranged on the measurement reference line of the measurement target substrate in correspondence with the first and second measurement tools. ,
The measuring tool includes a measurement reference axis, a holding member rotatably attached to the measurement reference axis, and a non-contact displacement sensor held by the holding member,
The press tool centering apparatus, wherein the measuring tool includes a measuring reference axis. The measurement reference axis has a flange near one end, and the flange is brought into contact with the measurement side board and fitted to the measurement side board.
The measured reference shaft has a flange near one end, and is fitted to the measurement-side substrate by bringing the flange into contact with the measurement-side substrate. 4. A press die centering apparatus according to 4.   6. The press die centering device according to claim 1, wherein the length of the reference axis to be measured exceeds the pass line. A press die centering method using the press die centering device according to claim 1, 5 or 6,
A procedure for mounting the misalignment measuring unit on the upper mold substrate,
A procedure for mounting the misalignment measured part on the lower mold substrate,
A procedure for bringing the dial gauge probe into contact with the reference axis to be measured;
A procedure for measuring the deviation of the measured reference axis from the measurement reference axis with the dial gauge while rotating the holding member in a certain direction;
A procedure for calculating the position correction amount of the lower mold substrate from the measurement result;
A press die centering method, wherein the position of the lower mold substrate is corrected based on the calculated position correction amount, and the upper mold substrate and the lower mold substrate are aligned. A press die centering method using the press die centering device according to claim 2, 5 or 6,
A procedure for mounting the misalignment measuring unit on the lower mold substrate,
A procedure for mounting the misalignment measured part on the upper mold substrate,
A procedure for bringing the dial gauge probe into contact with the reference axis to be measured;
A procedure for measuring the deviation of the measured reference axis from the measurement reference axis with the dial gauge while rotating the holding member in a certain direction;
A procedure for calculating the position correction amount of the upper mold substrate from the measurement result;
A press die centering method, wherein the position of the upper die substrate is corrected based on the calculated position correction amount to center the upper die and the lower die. A press die centering method using the press die centering device according to claim 3, 5 or 6,
A procedure for mounting the misalignment measuring unit on the upper mold substrate,
A procedure for mounting the misalignment measured part on the lower mold substrate,
A procedure for measuring the deviation of the measured reference axis from the measurement reference axis with a non-contact displacement sensor while rotating the holding member in a certain direction;
A procedure for calculating the position correction amount of the lower mold substrate from the measurement result;
A press die centering method, wherein the position of the lower mold substrate is corrected based on the calculated position correction amount, and the upper mold substrate and the lower mold substrate are aligned. A press die centering method using the press die centering device according to claim 4, 5 or 6,
A procedure for mounting the misalignment measuring unit on the lower mold substrate,
A procedure for mounting the misalignment measured part on the upper mold substrate,
A procedure for measuring the deviation of the measured reference axis from the measurement reference axis with a non-contact displacement sensor while rotating the holding member in a certain direction;
A procedure for calculating the position correction amount of the lower mold substrate from the measurement result;
A press die centering method, wherein the position of the upper mold substrate is corrected based on the calculated position correction amount, and the upper mold substrate and the lower mold substrate are aligned.   9. The press die centering method according to claim 7, wherein the probe is positioned on a pass line and measurement is performed. The centering method of a press die according to claim 9 or 10, wherein measurement is performed by positioning a non-contact type displacement sensor on a pass line.

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