JP2008234984A - Coating film forming apparatus and coating film forming method - Google Patents

Abstract

A coating film forming apparatus capable of forming a coating film having a flat surface and a uniform thickness.
A printer that discharges coating liquid for forming a coating film onto a substrate and a table that holds the substrate are configured to be able to form a coating film on the substrate, and are held on the table. A heating unit 44 for heating the substrate 12 being heated to a predetermined temperature higher than the temperature of the coating liquid, and the printer 42 discharges the coating liquid to the substrate 12 heated to the predetermined temperature by the heating unit 44 To do.
[Selection] Figure 1

Description

  The present invention is a coating film configured to include an inkjet discharge unit that discharges a coating liquid for forming a coating film on a processing target body and a holding unit that holds the processing target body so that a coating film can be formed on the processing target body. The present invention relates to a coating apparatus and a coating film forming method for forming a coating film by discharging a coating liquid for forming a coating film from an inkjet discharge section onto a processing object held by a holding section.

As a method for producing an organic EL element by forming a coating film on a treatment object by this kind of coating film forming method, a method for producing an organic EL element disclosed in Japanese Patent Application Laid-Open No. 2001-291583 is known. In this manufacturing method, first, an ink composition (coating liquid) containing a hole injection / transport material is ejected from an inkjet head and applied to a glass substrate provided with a partition wall (bank) having ink repellency. Then, the hole injection / transport layer is formed by performing solvent removal or heat treatment (hereinafter also referred to as “drying treatment”). Next, an ink composition containing a light emitting material is applied on the hole injection / transport layer, and then a drying process is performed to form a light emitting layer. Subsequently, a cathode is formed by a vapor deposition method or the like using a metal such as Ca, Mg, Ag, Al, or Li. Next, a sealing layer is formed using an epoxy resin, an acrylic resin, liquid glass, or the like. Thus, the element is completed. In this case, in this manufacturing method, in order to form each layer uniformly, the ink composition is applied to the same pixel at least twice.
Japanese Patent Laid-Open No. 2001-291585 (page 3, FIG. 1-9)

  However, the above manufacturing method has the following problems. That is, in this manufacturing method, the hole injection / transport layer and the light emitting layer are formed by discharging and applying the ink composition from the inkjet head to the glass substrate. In this case, in order to form a layer having a flat surface and a uniform thickness, it is necessary to smoothly spread the ink composition ejected from the inkjet head on the glass substrate. However, some ink compositions containing a hole injection / transport material and a light emitting material have a relatively high viscosity, and when each layer is formed using this type of ink composition, smooth spreading is possible. It is difficult and the uniformity of the layer thickness and the flatness of the surface of the layer may be reduced. In addition, since the viscosity of the ink composition changes with temperature change, the viscosity of the ink composition, that is, the ease of spreading of the ink composition changes depending on the temperature of the ink composition and the glass substrate. There may be variations in the uniformity of thickness and the flatness of the surface of the layer.

  Further, in the above manufacturing method, each layer is formed by drying the ink composition by applying a drying treatment after applying the ink composition. In this case, in order to perform a drying process, it is necessary to convey a board | substrate from a coating device to a drying apparatus, and there exists a possibility that foreign materials, such as dust, may adhere to the surface of an ink composition during the conveyance. In this case, when a foreign substance adheres to the surface of the ink composition before drying, the ink composition is solidified using the foreign substance as a core, and the flatness of the surface and the uniformity of the layer thickness are greatly reduced. There is also a risk that the function is reduced.

  This invention is made | formed in view of this problem, and it aims at providing the coating-film formation apparatus and coating-film formation method which can form the coating film with the flat surface and uniform thickness.

  In order to achieve the above object, a coating film forming apparatus according to claim 1 includes an inkjet discharge unit that discharges a coating liquid for forming a coating film on a processing object, and a holding unit that holds the processing object. A coating film forming apparatus configured to be able to form the coating film on the processing object, and heating the processing object held by the holding unit to a predetermined temperature higher than a temperature of the coating liquid. A heating unit is provided.

  Further, the coating film forming apparatus according to claim 2 is the coating film forming apparatus according to claim 1, wherein the holding unit is configured by a mounting table for mounting and holding the processing object on a mounting surface. The heating unit heats the mounting surface of the holding unit so that the predetermined temperature is not less than a temperature obtained by adding 45 ° C. to the temperature of the coating liquid and not more than a temperature obtained by adding 60 ° C. .

  The coating film forming apparatus according to claim 3 is the coating film forming apparatus according to claim 1 or 2, wherein the inkjet discharge unit is a conductive polymer material for forming an organic EL layer as the coating film. The coating liquid containing is discharged.

  According to a fourth aspect of the present invention, there is provided a coating film forming method, wherein a coating liquid for forming a coating film is discharged from an inkjet discharge unit onto a processing object held by a holding unit, and the coating film is applied to the processing object. A method of forming a coating film, wherein the object to be treated is heated to a predetermined temperature higher than the temperature of the coating liquid, and the object to be treated is heated to the predetermined temperature. The coating liquid is discharged onto the body to form the coating film.

  Moreover, the coating-film formation method of Claim 5 is a coating-film formation method of Claim 4, Using the mounting base which mounts and hold | maintains the said process target body on a mounting surface as said holding | maintenance part, The placement surface of the holding portion is heated so that the predetermined temperature is not less than a temperature obtained by adding 45 ° C. to the temperature of the coating liquid and not more than a temperature obtained by adding 60 ° C.

  A coating film forming method according to claim 6 is the coating film forming method according to claim 4 or 5, wherein the coating liquid containing a conductive polymer material for forming an organic EL layer as the coating film is used. It discharges from the said inkjet discharge part.

  According to the coating film forming apparatus according to claim 1 and the coating film forming method according to claim 4, the object to be treated held in the holding part is heated to a predetermined temperature higher than the temperature of the coating liquid, By discharging the coating liquid from the inkjet discharge unit to the object to be processed to form a coating film, the viscosity of the coating liquid discharged to the object to be processed can be reduced by heating. Accordingly, the coating liquid can be smoothly spread on the object to be processed, and as a result, a coating film having a flat surface and a uniform thickness can be formed. In addition, since the discharged coating liquid can be dried in a short time by heating the object to be treated, a situation in which foreign matter falls on the coating liquid before drying and the coating liquid cures around the foreign matter. Can be reliably prevented.

  Moreover, according to the coating-film formation apparatus of Claim 2, and the coating-film formation method of Claim 5, predetermined temperature is more than the temperature which added 45 degreeC to the temperature of the coating liquid, and below the temperature which added 60 degreeC Power consumption for heating while further improving the flatness of the surface of the coating film by forming the coating film by discharging the coating liquid while the mounting surface of the mounting table is heated so that it is within the range of An increase in manufacturing cost due to an excessive amount can be suppressed. Further, by controlling the temperature of the object to be processed to be equal to or lower than the temperature of 60 ° C. added to the temperature of the coating liquid and heating, the temperature of the object to be processed rises too much and bubbles are generated in the applied coating liquid, resulting in flatness. Can be reliably prevented.

  Further, according to the coating film forming apparatus according to claim 3 and the coating film forming method according to claim 6, the inkjet discharge unit discharges the coating liquid containing the conductive polymer material for forming the organic EL layer. Thus, since an organic EL layer having a flat surface and a uniform thickness can be formed, a high-quality organic EL element can be manufactured.

  Hereinafter, the best mode of a coating film forming apparatus and a coating film forming method according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the organic EL element manufacturing apparatus (hereinafter also referred to as “manufacturing apparatus”) 1 shown in FIG. 1 will be described with reference to the drawings. The manufacturing apparatus 1 is an apparatus including the coating film forming apparatus according to the present invention, and is configured to be able to manufacture the organic EL element 11 shown in FIG.

  Here, as shown in FIG. 2, the organic EL element 11 includes, for example, a substrate 12, a partition wall 13, an anode 14, an organic EL layer 15, and a cathode 16. The board | substrate 12 is an example of the process target object in this invention, Comprising: Glass and the polymeric material which has transparency are formed in flat form. The partition wall 13 is formed of a non-conductive material and is erected on the substrate 12. In this case, the anode 14 and the organic EL layer 15 are formed in each region on the substrate 12 partitioned by the partition wall 13. The anode 14 is a transparent electrode using ITO (indium tin oxide) or the like, and is formed on the surface of the substrate 12 in a thin film shape. The organic EL layer 15 is a coating film (coating film for organic EL) in the present invention, and includes, as an example, a hole transport layer 15 a and a light emitting layer 15 b, and is laminated on the anode 14. The cathode 16 is formed in a thin film shape so as to cover the partition wall 13 and the organic EL layer 15.

  On the other hand, as shown in FIG. 1, the manufacturing apparatus 1 includes a transfer device 2, a substrate cleaning device 3, a coating film forming device 4, and a cathode forming device 5. The transport device 2 is configured by, for example, a belt conveyor, and transports the substrate 12 to transport positions P1, P2, and P3 that are access positions of the substrate cleaning device 3, the coating film forming device 4, and the cathode forming device 5. The substrate cleaning device 3 cleans the substrate 12 transported to the transport position P1 by the transport device 2.

  The coating film forming apparatus 4 is an example of the coating film forming apparatus according to the present invention, and is configured to be able to form the organic EL layer 15 in each region on the substrate 12 (on the anode 14) partitioned by the partition wall 13. ing. Specifically, the coating film forming apparatus 4 includes a moving mechanism 41, a printer 42, a table 43, a heating unit 44, and a control unit 45. The moving mechanism 41 includes an arm 41b having a chuck 41a disposed at the tip, and moves the substrate 12 between the transport position P2 and the table 43 under the control of the control unit 45.

  The printer 42 corresponds to the ink jet ejection unit in the present invention, and includes tanks 51a and 51b, a head unit 52, and a drive mechanism (not shown) that drives the head unit 52. The tanks 51a and 51b individually store two types of coating liquids (inks) 61a and 61b (hereinafter also referred to as “coating liquid 61” when not distinguished) for forming the hole transport layer 15a and the light emitting layer 15b. . In this case, the coating liquid 61 includes, for example, a conductive polymer material and a solvent (for example, an aromatic solvent). The head unit 52 is configured by a multi-head in which two inkjet heads 52a and 52b dedicated to each coating liquid are integrated. In this case, the printer 42 applies the coating liquids 61a and 61b respectively stored in the tanks 51a and 51b to the substrate 12 transported to the table 43 by the moving mechanism 41 under the control of the control unit 45.

  The table 43 constitutes a mounting table as an example of the holding portion in the present invention, and includes a holding plate 43a made of, for example, metal and a leg portion 43b as shown in FIG. The substrate 12 is placed and held on the placement surface 43s. The heating unit 44 includes a heater and a temperature sensor, and is attached to the back surface of the holding plate 43a in the table 43 as shown in FIG. In this case, the heating unit 44 heats the table 43 (holding plate 43a) according to the control of the control unit 45 and maintains the placement surface 43c (that is, the substrate 12) at a predetermined temperature.

  The cathode forming device 5 is composed of, for example, a vacuum vapor deposition device, and forms the cathode 16 on the surface of the substrate 12 (on the organic EL layer 15 and the partition wall 13) transported to the transport position P3 by the transport device 2.

  Next, the operation of the manufacturing apparatus 1 when manufacturing the organic EL element 11 using the manufacturing apparatus 1 will be described focusing on the operation of the coating film forming apparatus 4.

  In this manufacturing apparatus 1, the transport apparatus 2 transports the substrate 12 supplied at a supply position outside the figure in the direction of arrow A shown in FIG. In this case, as shown in FIG. 3, a partition wall 13 is erected in advance on the substrate 12, and an anode 14 is formed in each region on the substrate 12 partitioned by the partition wall 13. To do. Next, the substrate cleaning apparatus 3 cleans the substrate 12 transported to the transport position P1. Subsequently, the transport device 2 transports the substrate 12 cleaned by the substrate cleaning device 3 from the transport position P1 to the transport position P2.

  On the other hand, in the coating film forming apparatus 4, the control unit 45 executes a coating film forming process (a process according to the coating film forming method according to the present invention). In this coating film forming process, the control unit 45 controls the heating unit 44 so that the temperature of the substrate 12 becomes a predetermined temperature (for example, 77 ° C.) higher than the temperature of the coating liquid 61 (that is, room temperature). 43 (holding plate 43a) is heated. Next, the control unit 45 controls the moving mechanism 41 to place the cleaned substrate 12 (see FIG. 1) transported to the transport position P <b> 2 on the holding plate 43 a in the table 43. Subsequently, the control unit 45 controls the printer 42 to transfer the coating liquid 61a for forming the hole transport layer 15a stored in the tank 51a from the inkjet head 52a of the head unit 52, as shown in FIG. While discharging to the area on the substrate 12 partitioned by the partition wall 13, the head portion 52 is moved in the direction of arrow B shown in the figure above the table 43, and further on the substrate 12 partitioned by the partition wall 13. The coating liquid 61b is discharged to the next area.

  At this time, the granular coating liquid 61a discharged from the inkjet head 52a collides with the surface of the substrate 12 (anode 14), and the coating liquid 61a spreads in each region on the substrate 12 partitioned by the partition wall 13. Is done. Thereby, the coating liquid 61a is applied to the surface of the substrate 12 (on the anode 14). Here, in the coating film forming apparatus 4, the substrate 12 is indirectly heated by the heating unit 44 via the table 43. For this reason, the coating liquid 61a discharged to the substrate 12 is heated and its viscosity is lowered. Therefore, as a result of the coating liquid 61a being smoothly spread on the substrate 12, the coating liquid 61a is applied with a flat surface and a uniform thickness. Further, since the substrate 12 is heated, the applied coating liquid 61a is dried in a short time, and a hole transport layer 15a is formed on the anode 14 as shown in FIG. In this case, since the coating liquid 61a is dried in a short time, it is possible to prevent a situation in which foreign matter falls on the coating liquid 61a before drying and the coating liquid 61a is cured around the foreign matter.

  Next, the control unit 45 controls the printer 42 to apply the coating liquid 61b for forming the light emitting layer 15b stored in the tank 51b from the inkjet head 52b of the head unit 52 to the partition wall 13 as shown in FIG. The head portion 52 is moved in the direction of the arrow B shown in the figure above the table 43 while being discharged onto the region on the substrate 12 partitioned by the above-mentioned, and the next region on the substrate 12 partitioned by the partition wall 13 The coating liquid 61b is discharged. At this time, the granular coating liquid 61b discharged from the inkjet head 52b collides with the surface of the substrate 12 (hole transport layer 15a), and the coating liquid 61b is applied to each region on the substrate 12 partitioned by the partition wall 13. Is extended. As a result, the coating liquid 61b is applied to the surface of the substrate 12 (on the hole transport layer 15a). In this case, as described above, since the substrate 12 is heated, the viscosity of the coating liquid 61b is lowered and smoothly spreads on the substrate 12. As a result, the coating liquid 61b has a flat surface and a uniform thickness. Is applied. Further, since the substrate 12 is heated, the applied coating liquid 61b is dried in a short time, and the light emitting layer 15b is formed on the hole transport layer 15a as shown in FIG. . Even in this case, since the coating liquid 61b is dried in a short time, it is possible to prevent the foreign matter from falling into the coating liquid 61b before drying and the coating liquid 61b to be cured around the foreign substance. Thus, the formation of the organic EL layer 15 is completed.

  Next, the control unit 45 controls the moving mechanism 41 to move the substrate 12 placed on the holding plate 43a of the table 43 to the transport position P2. Subsequently, the transport device 2 transports the substrate 12 on which the organic EL layer 15 has been formed from the transport position P2 to the transport position P3 in the direction of the arrow A shown in FIG. Next, the cathode forming device 5 forms the cathode 16 on the organic EL layer 15. Thereby, manufacture of the organic EL element 11 by the manufacturing apparatus 1 is completed.

  The inventor conducted the following experiment in order to verify the effect of the present invention. In this experiment, first, samples 101 to 108 in which the organic EL layer 15 was formed on the substrate 12 by the coating film forming process using the coating film forming apparatus 4 were produced. As the coating liquid 61 for forming the organic EL layer 15, a mixture of a phosphorescent material and tetralin was used. In this case, it adjusted so that the weight ratio of the phosphorescent material with respect to the total weight after mixing might be 2.0 weight%. Further, as the substrate 12, a glass plate material having a thickness of 0.7 mm was used. In this case, as shown in FIG. 7, the coating liquid 61 was applied to a 5 mm × 2 mm hexagonal region 200 in plan view partitioned on the substrate 12 by the partition wall 13 erected on the substrate 12. Moreover, the temperature of the coating liquid 61 at the time of preparation of each sample 101-108 was maintained at 25 degreeC which is the same as room temperature. Further, when the sample 101 is manufactured, the temperature of the substrate 12 (specifically, the surface temperature of the region 200 in the substrate 12) is maintained at 25 ° C. which is the same as the room temperature without heating the substrate 12, and During the fabrication of 108, the substrate 12 was heated and maintained at 48 ° C, 58 ° C, 70 ° C, 77 ° C, 85 ° C, 94 ° C and 102 ° C, respectively.

  Further, in this experiment, when the samples 101 to 108 were produced, when a predetermined amount (50 nl) of the coating liquid 61 was discharged to the region 200, a ring generated by the spreading of the coating liquid 61 was observed with a digital microscope. The diameter of the ring was measured. As a result, the diameters of the rings in the samples 101 to 108 were 40 μm, 33 μm, 52 μm, 134 μm, 163 μm, 185 μm, 190 μm and 185 μm, respectively, as shown in FIG. From this experimental result, the diameter of the ring tends to increase as the temperature of the substrate 12 increases when the coating liquid 61 is discharged from the printer 42 onto the substrate 12, that is, the substrate 12 (mounting surface 43a). It is apparent that the viscosity of the discharged coating liquid 61 decreases as the temperature increases, and the coating liquid 61 spreads smoothly on the substrate 12.

In this experiment, the surface roughness of the organic EL layer 15 in each region 200 of the prepared samples 101 to 108 was measured using a surface shape / roughness measuring machine (Surfcoder ET300) manufactured by Kosaka Laboratory. It was measured. In this case, the measurement conditions were as follows.
Measuring force: 100μN
Measurement speed: 0.01 mm / s
Vertical magnification: 1,000,000
Horizontal magnification: 5,000
Cut-off value: 0.08mm

  As a result, the arithmetic average height Sa as a parameter indicating the surface roughness of each organic EL layer 15 in the samples 101 to 108 is 73.3 nm, 41.5 nm, 15.4 nm, 2 0.7 nm, 4.1 nm, 3.5 nm, 2.7 nm, and 3.1 nm. Further, the maximum peak heights Sp as other parameters indicating the surface roughness of each organic EL layer 15 in the samples 101 to 108 are 1,079 nm, 689 nm, 258 nm, 52 nm, 32 nm, and 30 nm, respectively, as shown in FIG. 29 nm and 39 nm.

  From the above experimental results, when the substrate 12 is not heated when the coating liquid 61 is discharged from the printer 42 onto the substrate 12 (when the temperature of the coating liquid 61 (room temperature) is 25 ° C.). When the substrate 12 is heated to a temperature higher than the temperature of the coating liquid 61 while the surface flatness of the organic EL layer 15 is low (in this experiment, at 48 ° C. or higher), the organic EL layer 15 It is clear that the flatness of the surface of the layer 15 increases. Further, when the temperature of the substrate 12 is 70 ° C. or higher, that is, when the temperature of the substrate 12 is equal to or higher than the temperature of the coating liquid 61 plus 45 ° C., the flatness of the surface of the organic EL layer 15 is clearly higher. It is. On the other hand, when the temperature of the substrate 12 exceeds 85 ° C., that is, when the temperature of the substrate 12 exceeds the temperature obtained by adding 60 ° C. to the temperature of the coating liquid 61 (94 ° C. and 102 ° C.), It is clear that the effect of improving the flatness of the surface of the organic EL layer 15 due to the rise is small. In this case, if the temperature of the substrate 12 is set higher than necessary, the power consumption for heating becomes excessive, leading to an increase in manufacturing cost. If the temperature of the substrate 12 is too high, bubbles may be generated in the applied coating liquid 61 and the flatness may be lowered. Therefore, the temperature of the substrate 12 to be maintained when the coating liquid 61 is applied is preferably higher than the temperature of the coating liquid 61, and is equal to or higher than the temperature obtained by adding 45 ° C. to the temperature of the coating liquid 61. It is clear that it is more preferable that the temperature is within the range of not more than the temperature added.

  Thus, according to the coating film forming apparatus 4 and the coating film forming method, the substrate 12 held on the table 43 is heated to a temperature higher than the temperature of the coating liquid 61, and the substrate 12 in that state is heated. By forming the organic EL layer 15 by discharging the coating liquid 61 from the printer 42, the viscosity of the coating liquid 61 discharged onto the substrate 12 can be reduced by heating. Accordingly, the coating liquid 61 can be smoothly spread on the substrate 12, and as a result, the organic EL layer 15 having a flat surface and a uniform thickness can be formed. Further, since the discharged coating liquid 61 can be dried in a short time by heating the substrate 12, foreign matter falls on the coating liquid 61 before drying, and the coating liquid 61 is cured around the foreign matter. Can be reliably prevented.

  Moreover, according to this coating-film formation apparatus 4 and the coating-film formation method, the temperature of the board | substrate 12 becomes in the range below the temperature which added more than the temperature which added 45 degreeC to the temperature of the coating liquid 61, and added 60 degreeC. In this way, the coating liquid 61 is discharged while the mounting surface 43a of the table 43 is heated to form the organic EL layer 15, thereby further increasing the flatness of the surface of the organic EL layer 15 and heating power. An increase in manufacturing cost due to excessive consumption can be suppressed. Further, by heating the substrate 12 at a temperature equal to or lower than the temperature of the coating liquid 61 plus 60 ° C., the temperature of the substrate 12 rises too much and bubbles are generated in the coated coating liquid 61, resulting in flatness. Can be reliably prevented.

  Further, according to the coating film forming apparatus 4 and the coating film forming method, the printer 42 discharges the coating liquid 61 containing the conductive polymer material for forming the organic EL layer 15, so that the surface is flat and Since the organic EL layer 15 having a uniform thickness can be formed, the high-quality organic EL element 11 can be manufactured.

  In addition, this invention is not limited to said structure. For example, although it described above about the example which incorporated the coating-film formation apparatus 4 in the manufacturing apparatus 1 which manufactures the organic EL element 11, it is not limited to this, Various manufacture which forms a coating film in a process target body and manufactures a product The coating film forming apparatus 4 can be incorporated in the apparatus. In this case, the coating film that can be formed using the coating film forming apparatus 4 is not limited to the organic EL layer 15 described above, and includes a coating film using an inorganic material.

  In addition, the configuration example in which the coating liquid 61 applied with the substrate 12 placed on the table 43 is dried to form the organic EL layer 15 has been described above. However, a separate drying device is provided, for example, the fluidity is lowered. In a state where the coating liquid 61 is dried (temporarily dried), the substrate 12 is transported from the table 43 to the drying apparatus, and the coating liquid 61 is completely dried in the drying apparatus to form the organic EL layer 15. It can also be adopted. Even in this configuration, it is possible to reliably prevent foreign matter from adhering to the coating liquid 61 by reducing the fluidity within a short time.

  Moreover, although the example provided with the table 43 as the holding unit configured to hold the mounted substrate 12 is described above, the holding unit in the present invention is not limited to this, and for example, holds the edge of the substrate 12 It is also possible to employ a holding portion that holds the same. In this configuration, the heating unit heats a portion of the holding unit that holds the substrate 12. Further, the configuration example in which the substrate 12 is indirectly heated through the mounting surface 43a of the table 43 has been described above. For example, hot air (warm air) is blown onto the substrate 12, or a heater is disposed in the vicinity of the substrate 12. It is also possible to employ a configuration in which the substrate 12 is directly heated. In this configuration, the substrate 12 is heated to a predetermined temperature within a range that is equal to or higher than the temperature of the coating liquid 61 plus 45 ° C. and equal to or lower than the temperature of 60 ° C. added.

1 is a configuration diagram showing a configuration of a manufacturing apparatus 1. FIG. 2 is a cross-sectional view showing a configuration of an organic EL element 11. FIG. It is explanatory drawing for demonstrating the state which is discharging the coating liquid 61a for positive hole transport layer 15a formation. It is explanatory drawing for demonstrating the state in which the positive hole transport layer 15a was formed. It is explanatory drawing for demonstrating the state which is discharging the coating liquid 61b for light emitting layer 15b formation. It is explanatory drawing for demonstrating the state in which the light emitting layer 15b was formed. 3 is a plan view showing a region 200 partitioned on a substrate 12. FIG. It is a measurement result figure which shows the measurement result of the samples 101-108.

Explanation of symbols

4 Coating film forming device 12 Substrate 15a Hole transport layer 15b Light emitting layer 42 Printer 43 Table portion 44 Heating 61a, 61b Coating liquid

Claims (6)

A coating comprising an inkjet discharge unit that discharges a coating liquid for forming a coating film on a processing object, and a holding unit that holds the processing object, so that the coating film can be formed on the processing object. A film forming apparatus comprising:
The coating film forming apparatus provided with the heating part which heats the said process target object hold | maintained at the said holding | maintenance part to the predetermined temperature higher than the temperature of the said coating liquid. The holding unit is configured by a mounting table for mounting and holding the processing object on a mounting surface,
The heating unit heats the mounting surface of the holding unit so that the predetermined temperature is not less than a temperature obtained by adding 45 ° C. to the temperature of the coating liquid and not more than a temperature obtained by adding 60 ° C. The coating film forming apparatus according to claim 1.   The coating film forming apparatus according to claim 1, wherein the inkjet discharge unit discharges the coating liquid containing a conductive polymer material for forming an organic EL layer as the coating film. A coating film forming method for forming a coating film on a processing object by discharging a coating liquid for forming a coating film from an inkjet discharge unit to the processing object held in a holding part,
The processing object held in the holding unit is heated to a predetermined temperature higher than the temperature of the coating liquid, and the coating liquid is discharged to the processing object in a state of being heated to the predetermined temperature. A coating film forming method for forming the coating film. Using the mounting table for mounting and holding the processing object on the mounting surface as the holding unit,
5. The mounting surface according to claim 4, wherein the mounting surface is heated so that the predetermined temperature is not less than a temperature obtained by adding 45 ° C. to a temperature of the coating liquid and not more than a temperature obtained by adding 60 ° C. 5. Coating film forming method.   The coating film forming method according to claim 4 or 5, wherein the coating liquid containing a conductive polymer material for forming an organic EL layer as the coating film is discharged from the inkjet discharge section.

Images