JP2008233591A - Electrophoretic display device and manufacturing method thereof - Google Patents

Abstract

An electrophoretic display device with high display quality and reliability is provided.
A circuit board having an electronic circuit formed on a surface, an ITO layer as at least a transparent conductive material layer, a conductive member, an electrophoretic display layer disposed on the ITO layer, An electrophoretic display body 50 comprising a first adhesive layer 32 stacked on the electrophoretic display layer 34, and facing the circuit board 10 via the first adhesive layer 32 and the conductive member 42, and electrophoresis Electrophoresis including a protective substrate 20 made of a translucent material that is face-to-face bonded to the surface of the display body 50 opposite to the surface on which the first adhesive layer 32 is formed via the second adhesive layer 40. In the display device, an annular gap 71 having the protective substrate 20 as an upper surface and the circuit board 10 as a bottom surface exists over the entire periphery of the second adhesive layer 40, and the second adhesive layer 40 is connected to the conductive member 42. Notch 72 is provided so that it does not overlap Electrophoretic display device characterized by being.
[Selection] Figure 1

Description

  The present invention relates to an electrophoretic display device and a method for manufacturing the same.

  As one of the reflective display devices, an electrophoretic display device utilizing a phenomenon in which when an electric field is applied to an electrophoretic dispersion liquid in which electrophoretic particles are dispersed, the particles move (electrophoresis) in the liquid by Coulomb force. It has been known. An electrophoretic display layer containing the above-described electrophoretic dispersion is sandwiched between a transparent conductive material layer and a circuit board, and a voltage is locally applied, whereby electrophoretic particles are placed on an electrode having a polarity opposite to that of the charge. To form an image. In recent years, as an electrophoretic display layer, a microcapsule type in which a plurality of microcapsules encapsulating an electrophoretic dispersion liquid are two-dimensionally arranged to form an electrophoretic display layer is widely used.

  The above-mentioned electrophoretic dispersion liquid generally has low moisture resistance, and it has been found that when moisture is absorbed, the characteristics are deteriorated and the life of the electrophoretic display device or display performance is impaired. Therefore, for example, as shown in Patent Document 1, a protective substrate is further laminated on the transparent conductive material layer, and water vapor is blocked in a gap formed by both the substrates and the outer peripheral portion of the electrophoretic display body. There has been proposed a method of filling a material having the above to suppress the intrusion of water vapor.

FIG. 6 schematically shows a cross section of an electrophoretic display device based on a conventional technique. The electrophoretic display device is configured by sandwiching an electrophoretic display body 50 between a circuit board 10 and a protective substrate 20.
The circuit board 10 is made of a material having high rigidity and heat resistance such as quartz or glass in consideration of heating or the like in the circuit forming process. On the circuit board 10, TFTs (thin film transistors) 46 as switching elements are formed in a matrix, and a common electrode 44 is formed at one end. The TFT 46 is connected to an external circuit (not shown), and is individually ON / OFF controlled by information transmitted from the outside.

  The protective substrate 20 is a substrate that protects the electrophoretic display body 50. Impact resistance, body wear resistance, translucency, etc. are required, and a glass substrate is used.

  The electrophoretic display 50 includes a first adhesive layer 32, an electrophoretic display layer 34 including microcapsules 35, a transparent conductive material layer 36, a transparent insulating material layer 38, a second adhesive layer 40, and a conductive member 42. Etc.

  The transparent insulating material layer 38 is the basis for starting the manufacture of the electrophoretic display body 50, and preferably has flexibility, so that generally PET (polyethylene terephthalate) or the like is used. The transparent conductive material layer 36 is a layer that is formed on the entire surface of the transparent insulating material layer 38 and has a common potential across the entire surface, and serves as one electrode when a voltage is applied from the TFT 46 to the electrophoretic display layer 34. . The material is preferably ITO (indium oxide / tin alloy).

  The electrophoretic display layer 34 includes a plurality of microcapsules 35 arranged two-dimensionally on the transparent conductive material layer 36. Each microcapsule 35 is filled with an electrophoretic dispersion liquid in which electrophoretic particles are dispersed. As the electrophoretic particles, black particles such as carbon black charged to a positive polarity and white particles such as titanium oxide charged to a negative polarity are dispersed in equal amounts. An image can be formed by pulling up each particle onto the display surface by an electric field generated in the microcapsule 35 by application of a driving voltage. Note that a so-called one-particle electrophoretic display layer that forms an image by combining black particles and white electrophoretic dispersion may be used.

  The electrophoretic display body 50 is bonded to the circuit board 10 via the first adhesive layer 32, and is bonded to the protective substrate 20 via the second adhesive layer 40. The conducting member 42 of the electrophoretic display body 50 is electrically connected to the common electrode 44 of the circuit board 10 so that the transparent conductive material layer 36 and the common electrode 44 have a common potential. The electrophoretic display layer 34 and the first adhesive layer 32 are formed with a slight gap from the conductive member 42 so as to correspond to the formation region of the TFT 46 on the circuit board 10. On the other hand, the second adhesive layer 40 is formed on the entire upper surface of the electrophoretic display body 50.

  The planar shape of the circuit board 10 and the protective substrate 20 is larger than the planar shape of the electrophoretic display body 50, and a gap 71 is formed around the electrophoretic display body 50. The electrophoretic display body 50 has a property of deteriorating due to infiltration of water vapor (water). Therefore, the gap 71 is filled with an epoxy resin 70 as a material having a function of blocking water vapor (in FIG. 6, the gap 71 is illustrated to be filled only in the left gap 71, but in actuality an electrophoretic display is shown. Filled all around the body 50).

JP 2005-114822 A

  Thus, the electrophoretic display device is formed by laminating a glass substrate and various other thin films. Therefore, in general, a force applied only to a specific region of the apparatus is hardly generated. However, when the thickness of the conductive portion 42 is different from the sum of the film thickness (layer thickness) of the electrophoretic display layer 34 and the film thickness of the first adhesive layer 32, the above-described force is generated at the boundary between both members. Can occur. In general, the conductive member 42 is formed thicker than the sum of the film thickness of the electrophoretic display layer 34 and the film thickness of the first adhesive layer 32 in order to ensure conduction with the common electrode 44. ing. Therefore, a force in the direction of lifting the protective substrate 20 can be generated in the formation region of the conductive member 42. And the defect resulting from it may arise.

  FIG. 7 is a cross-sectional view showing defects that may occur in the protective substrate 20. The thickness of the conductive member 42 is thicker than the total thickness of the electrophoretic display layer 34 and the first adhesive layer 32, and a force is applied to bend upward the transparent conductive material layer 36 or more. As a result, a cavity 77 is generated at the boundary surface 75 between the second adhesive layer 40 and the protective substrate 20, and a crack 82 is generated in a region 80 where a force for bending the protective substrate 20 upward is applied. Such a phenomenon can reduce the display quality and reliability of the electrophoretic display device.

  The present invention has been made to solve such a problem, and an electrophoretic display device capable of reliably conducting electrical conduction between the transparent conductive material layer 36 and the circuit board 10 without causing defects such as the above-described voids and the like. An object is to provide a manufacturing method.

  In order to solve the above problems, an electrophoretic display device according to the present invention includes a circuit board having an electronic circuit formed on a surface thereof, a second adhesive layer, a transparent conductive material layer, and the transparent conductive material layer. A conductive member that electrically connects a part of the electronic circuit and the electroconductive display layer, an electrophoretic display layer disposed on the transparent conductive material layer at a predetermined interval from the conductive member, and the electrophoretic display layer An electrophoretic display body having a first adhesive layer laminated thereon, the electrophoretic display body being face-to-face bonded to the circuit board via the first adhesive layer and the conductive member, and the electrophoretic display body, An electrophoretic display device comprising: a protective substrate made of a translucent material that is face-to-face bonded to the surface opposite to the surface on which the first adhesive layer is formed via the second adhesive layer, The planar shape of the circuit board and the planar shape of the protective substrate are the same as the electrophoretic display. An annular gap having the protective substrate as a top surface and the circuit board as a bottom surface is present around the electrophoretic display, and the second adhesive layer includes the second adhesive layer. Is provided with a notch so that the projection onto the circuit board does not overlap the conductive member.

  According to this structure, the protective substrate can be prevented from being lifted by the conductive member even when the conductive member is thicker than the total of the electrophoretic display layer and the first adhesive layer. Therefore, it is possible to suppress the occurrence of peeling between the second adhesive layer and the protective substrate in the vicinity of the conductive member, and it is possible to suppress the deterioration in display quality of the electrophoretic display device.

  Preferably, at least an outer edge portion of the annular gap is filled with a material having a function of blocking water vapor.

  According to such a structure, it is possible to suppress the intrusion of moisture or the like from the outside into the electrophoretic display layer, and thus it is possible to suppress a deterioration in display quality of the electrophoretic display device over time.

  Preferably, the notch is filled with a material having a function of blocking water vapor.

  Since the material having the function of blocking water vapor is filled after the protective substrate is face-to-face bonded, no force is generated in a direction to expand the space between the second adhesive layer and the protective substrate. Therefore, according to such a structure, the electrophoretic display body can be stably placed between both the substrates (the circuit board and the protective substrate) without causing separation between the second adhesive layer and the protective substrate. Can be maintained, and deterioration of display quality can be suppressed.

  In order to solve the above problems, an electrophoretic display device according to the present invention includes a circuit board having an electronic circuit formed on a surface thereof, a second adhesive layer, a transparent conductive material layer, and the transparent conductive material. A conductive member for electrically connecting the material layer and a part of the electronic circuit; an electrophoretic display layer disposed on the transparent conductive material layer at a predetermined interval; and the electrophoresis An electrophoretic display body having a first adhesive layer laminated on the display layer, the electrophoretic display body being face-to-face bonded to the circuit board via the first adhesive layer and the conducting member, and the electrophoretic display body An electrophoretic display device comprising: a protective substrate made of a translucent material that is face-to-face bonded to the surface opposite to the surface on which the first adhesive layer is formed via the second adhesive layer. The planar shape of the circuit board and the planar shape of the protective substrate are There is an annular gap larger than the planar shape of the display body, with the protective substrate as the top surface and the circuit board as the bottom surface around the electrophoretic display body, and faces the second adhesive layer of the protective substrate. The surface is provided with a groove portion having a predetermined depth so that a region where the projection of the protective substrate onto the circuit board overlaps with the conductive member does not contact the second adhesive layer.

  According to this structure, there is no portion where the protective substrate and the second adhesive layer are face-to-face bonded in the region where the conductive member is projected. Therefore, even when the thickness of the conductive member is larger than the total of the electrophoretic display layer and the first adhesive layer, the occurrence of bubbles or peeling in the above-described region is prevented, and the display quality of the electrophoretic display device Can be suppressed.

  Preferably, at least an outer edge portion of the annular gap is filled with a material having a function of blocking water vapor.

  According to such a structure, it is possible to suppress the intrusion of moisture or the like from the outside into the electrophoretic display layer, and thus it is possible to suppress a deterioration in display quality of the electrophoretic display device over time.

  Preferably, the groove portion is also filled with a material having a function of blocking the water vapor.

  According to such a structure, it is possible to further suppress the penetration of water vapor from the outside into the electrophoretic display layer. Accordingly, it is possible to further suppress the temporal deterioration of the display quality of the electrophoretic display device.

  Preferably, a transparent insulating material layer is disposed between the transparent conductive material layer and the second adhesive layer.

  The transparent insulating material layer can protect the surface of the transparent conductive material layer on which the conductive member is not formed. Therefore, with this structure, the shaping of the second adhesive layer can be performed stably.

  Preferably, the electrophoretic display layer includes a plurality of substantially identically shaped microcapsules that hold a dispersion liquid in which electrophoretic particles are dispersed in an insulating liquid, two-dimensionally on a transparent substrate. It is formed in an array.

  The film thickness (layer thickness) of the electrophoretic display layer can be made uniform by arranging microcapsules having substantially the same shape in two dimensions. Accordingly, it is possible to suppress the occurrence of bubbles or peeling between the second adhesive layer and the protective substrate in a region other than the vicinity of the conductive member, and further suppress the deterioration of display quality of the electrophoretic display device. it can.

  In order to solve the above-described problems, an electrophoretic display device manufacturing method according to the present invention includes an electrophoretic member disposed on a transparent conductive material layer at least at a predetermined interval from a conductive member. A laminate comprising a display layer and a first adhesive layer laminated on the electrophoretic display layer is placed in a circuit board having an area larger than that of the laminate and having an electronic circuit on the surface. A first step of bonding through a first adhesive layer; a second step of arranging a second adhesive layer on the laminate to form an electrophoretic display; and a larger area than the electrophoretic display. A third step of bonding a protective substrate made of a transparent material having the electrophoretic display body onto the electrophoretic display body via the second adhesive layer so that the electrophoretic display body is contained in the protective substrate; The circuit board and the protection surrounding the electrophoretic display And a fourth step of filling a ring-shaped gap between the plates with a material having a function of blocking water vapor, wherein the second step includes the second bonding. And a step of adjusting the shape of the second adhesive layer so that a region where the projection of the layer and the conductive member overlap does not occur.

  According to this manufacturing method, it is possible to prevent a force that the second adhesive layer lifts the protective substrate on the conductive member. Therefore, it is possible to suppress the generation of bubbles or the like between the second adhesive layer and the protective substrate, and it is possible to provide an electrophoretic display device with little deterioration in display quality.

  Preferably, the fourth step is a step of filling a material having a function of blocking water vapor to a region overlapping with the conductive member.

  According to this manufacturing method, since the infiltration of water vapor into the electrophoretic display body can be further suppressed, it is possible to provide an electrophoretic display device with much less deterioration in display quality.

  In order to solve the above-described problems, an electrophoretic display device manufacturing method according to the present invention includes an electrophoretic member disposed on a transparent conductive material layer at least at a predetermined interval from a conductive member. A laminate comprising a display layer and a first adhesive layer laminated on the electrophoretic display layer is placed in a circuit board having an area larger than that of the laminate and having an electronic circuit on the surface. A first step of bonding through a first adhesive layer; a second step of arranging a second adhesive layer on the laminate to form an electrophoretic display; and a larger area than the electrophoretic display. A third step of bonding a protective substrate made of a transparent material having the electrophoretic display body onto the electrophoretic display body via the second adhesive layer so that the electrophoretic display body is contained in the protective substrate; The circuit board and the protection surrounding the electrophoretic display A fourth step of filling a ring-shaped gap between the plates with a material having a function of blocking water vapor, and a method of manufacturing an electrophoretic display device, wherein the method is applied when bonded together in the third step. The method includes a step of forming a groove portion in advance in a region where the protective substrate overlaps with the conductive member.

  In the electrophoretic display device according to this manufacturing method, the protective substrate is not in contact with the second adhesive layer on the conductive member. Therefore, it is possible to suppress the generation of bubbles or the like between the second adhesive layer and the protective substrate, and it is possible to provide an electrophoretic display device with little deterioration in display quality.

  Preferably, the fourth step is a step of filling the gap between the protective substrate and the electrophoretic display body, which overlaps with the conductive member, with a material having a function of blocking water vapor.

  According to this manufacturing method, since the infiltration of water vapor into the electrophoretic display body can be further suppressed, it is possible to provide an electrophoretic display device with much less deterioration in display quality.

Embodiments of an electrophoretic display device according to the present invention will be described below with reference to the drawings. Note that the embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is not limited to these forms unless otherwise specified in the following description. Further, in the drawings used in the following description, the scales are shown differently from the actual ones in order to make each layer and each member large enough to be recognized on the drawings.
(First embodiment)

  FIG. 1 is a schematic cross-sectional view of an electrophoretic display device according to a first embodiment of the present invention. The electrophoretic display device is formed by sandwiching an electrophoretic display body 50 between a circuit board 10 and a protective substrate 20. The circuit board 10 has a control circuit (not shown) at the outer edge, and individually controls the TFTs 46 arranged in a matrix. A common electrode 44 is provided on one side.

  The electrophoretic display 50 includes a first adhesive layer 32, an electrophoretic display layer 34, an ITO layer (hereinafter referred to as “ITO layer”) 36 as a transparent conductive material layer, and a transparent layer. A total of five layers including a PET layer (hereinafter referred to as “PET layer”) 38 as an insulating material layer and a second adhesive layer 40, and a conductive member 42 disposed at the end of the ITO layer 36 It is made up of. The electrophoretic display layer 34 is formed by two-dimensionally arranging microcapsules 35 filled with an electrophoretic dispersion liquid in which electrophoretic particles are dispersed.

  The electrophoretic display device according to the present embodiment is characterized in that a region of the second adhesive layer 40 where the layer potentially overlaps the conductive member 42 is removed and a notch 72 is formed. . When the second adhesive layer 40 is formed in the upper layer of the transparent insulating material layer 38, the notched portion 72 is formed by cutting off the region of the second adhesive layer 40 that overlaps the conducting member 42 with a slight margin. When a double-sided tape is used for the second adhesive layer 40, the above-described steps can be easily performed.

Even if the layer below the second adhesive layer 40 is deformed by the cutout portion 72, the protective substrate 20 can suppress the influence. That is, the thickness of the conductive member 42 is thicker than the combined thickness of the electrophoretic display layer 34 and the first adhesive layer 32, and the ITO layer 36 and the PET layer 38 are bent upward in a region overlapping the conductive member 42. In addition, the protective substrate 20 can be kept substantially parallel to the circuit board 10. Therefore, the electrophoretic display device according to the present embodiment can suppress the generation of the force for bending the protective substrate 20, and can suppress the generation of the above-described cavity 77 (see FIG. 7) or crack 82 (see FIG. 7). Therefore, display quality, reliability, and the like can be improved without impairing conduction between the transparent conductive material layer 36 and the circuit board 10.
(Second Embodiment)

  FIG. 2 is a schematic cross-sectional view of an electrophoretic display device according to a second embodiment of the present invention. As in the first embodiment, the electrophoretic display device according to the present embodiment is formed by holding the electrophoretic display body 50 between the circuit board 10 and the protective substrate 20. The components and functions of the electrophoretic display body 50 are the same as those of the electrophoretic display body of the first embodiment. The TFT and common electrode on the circuit board 10 are not shown.

  The electrophoretic display device according to the present embodiment is the same as the electrophoretic display device according to the first embodiment in that a notch 72 is formed in a region overlapping the conductive member 42 of the second adhesive layer 40. is doing. And it differs from the electrophoretic display device according to the first embodiment in that the epoxy resin 70 is also filled in the notch 72.

By filling the epoxy resin 70 into the cutout portion 72, infiltration of water vapor from the interface between the epoxy resin 70 and the protective substrate 20 in the vicinity of the cutout portion 72 is further suppressed. In addition, since the second adhesive layer 40 or the epoxy resin 70 is filled in the entire lower layer of the protective substrate 20 and there is no cavity region, the impact resistance of the entire electrophoretic display device is improved. Since the epoxy resin 70 is filled after the protective substrate 20 is bonded to the second adhesive layer 40, a force that bends the protective substrate 20 upward does not occur. Therefore, the electrophoretic display device according to the present embodiment is further improved in reliability while maintaining the display quality and the like at the same level.
(Third embodiment)

  FIG. 3 is a schematic cross-sectional view of an electrophoretic display device according to a third embodiment of the present invention. As in the first embodiment, the electrophoretic display device according to the present embodiment is formed by holding the electrophoretic display body 50 between the circuit board 10 and the protective substrate 20. The function of each element constituting the electrophoretic display body 50 is the same as in the first embodiment. Further, the TFT and the common electrode on the circuit board 10 are not shown in the same manner as in the second embodiment.

  The electrophoretic display device according to the present embodiment is characterized in that a groove 73 is formed in the protective substrate 20. A region potentially overlapping with the conductive member 42 in the protective substrate 20 and a region continuing from the region to the outer peripheral portion are dug down to a predetermined depth to form a groove 73. Unlike the electrophoretic display device according to the first or second embodiment, the second adhesive layer 40 has the same planar shape as the lower PET layer 38 and the like.

Due to the groove 73, the protective substrate 20 can suppress the influence even when the lower layer is deformed in the region overlapping the conductive member 42. That is, even if a partial region of the electrophoretic display body 50 is raised and deformed by the conductive member 42, the deformation is accommodated in the groove 73, so that the protective substrate 20 is not affected and substantially parallel to the circuit substrate 10. Can maintain a good condition. Therefore, the electrophoretic display device according to the present embodiment can suppress the generation of force for bending the protective substrate 20, and can suppress the generation of the above-described cavity 77 (see FIG. 7) or crack 82 (see FIG. 7). Therefore, display quality, reliability, and the like can be improved without impairing conduction between the transparent conductive material layer 36 and the circuit board 10.
(Fourth embodiment)

  FIG. 4 is a schematic cross-sectional view of an electrophoretic display device according to a fourth embodiment of the present invention. As in the first embodiment, the electrophoretic display device according to the present embodiment is formed by holding the electrophoretic display body 50 between the circuit board 10 and the protective substrate 20. Functions and the like of each element constituting the electrophoretic display body 50 are the same as those in the first embodiment. Further, the TFT and the common electrode on the circuit board 10 are not shown in the same manner as in the second embodiment.

  The electrophoretic display device according to the present embodiment is common to the electrophoretic display device according to the third embodiment in that a groove 73 is formed in a region of the protective substrate 20 that overlaps the conductive member 42. The epoxy resin 70 is different from the electrophoretic display device according to the third embodiment in that the epoxy resin 70 is also filled in the groove 73, that is, between the protective substrate 20 and the second adhesive layer 40.

By filling the epoxy resin 70 in the groove 73 as well, the entire periphery of the electrophoretic display body 50 can be covered with a glass material or the epoxy resin 70. Therefore, it is possible to improve the water vapor resistance and impact resistance of the electrophoretic display device as a whole, and it is possible to further improve the reliability while maintaining the display quality and the like at the same level.
(Fifth embodiment)

  FIG. 5 is a process cross-sectional view illustrating a method for manufacturing an electrophoretic display device according to a fifth embodiment of the present invention. Hereafter, the process of this embodiment is described based on figures.

  First, as a first step, a laminate of the first adhesive layer 32, the electrophoretic display layer 34, the ITO layer 36, and the PET layer 38 is laminated on the circuit board 10 as shown in FIG. On the circuit board 10, TFTs 46 are formed in a matrix, and a common electrode 44 is formed on one side. The electrophoretic display layer 34 faces the TFT 46 and is sandwiched between the ITO layer 36 and the TFT 46.

  A conductive member 42 is disposed on the ITO layer 36 at a predetermined interval from the electrophoretic display layer 34. When the laminate is bonded, the conductive member 42 faces the common electrode 44 on the circuit board 10. Align so that. Since the conducting member 42 is formed thicker in order to ensure conduction with the common electrode 44, the region where the conducting member 42 and the common electrode 44 face each other is raised more than the other regions.

  Next, as a second step, as shown in FIG. 5 (b), the shape of the second adhesive layer 40 is adjusted and then pasted onto the PET layer 38. As the second adhesive layer 40, a double-sided tape is preferably used. First, when the double-sided tape is overlaid on the PET layer 38, a region overlapping with the conductive member 42 is cut out to form a cutout portion 72. Then, one surface is stuck on the PET layer 38. Thus, the electrophoretic display body 50 is formed. Since the surface of the PET layer 38 is flat except for the region overlapping the conductive member 42, the surface of the second adhesive layer 40 is also flat.

  Next, as a third step, the protective substrate 20 is bonded onto the second adhesive layer 40 as shown in FIG. And it pressurizes and makes it adhere | attach completely. Since the planar shape of the circuit board 10 and the protective substrate 20 is larger than the planar shape of the electrophoretic display body 50, an annular gap 71 is formed around the electrophoretic display body 50. Further, as described above, the surface of the second adhesive layer 40 is flat, and a cutout portion 72 is formed in a region overlapping the conductive member 42. Therefore, even if the region of the PET layer 38 that overlaps with the conductive member 42 is raised, no force in the bending direction is applied to the protective substrate 20 due to the pressurization.

  Finally, as a fourth step, the epoxy resin 70 is filled from the syringe 90 into the gap 71 and the notch 72 as shown in FIG. By this step, the periphery of the electrophoretic display body 50 is covered with a material having a function of blocking water vapor, and the water vapor resistance is improved. A few steps are added after the fourth step to obtain an electrophoretic display device.

  As described above, according to the method for manufacturing an electrophoretic display device according to the present embodiment, since the process includes the step of adjusting the shape of the second adhesive layer 40 so as not to overlap the conductive member 42, the conductive member 42 is formed thicker. However, the protective substrate 20 can be bonded to a flat surface. As a result, it is possible to suppress the force in the bending direction from being applied to the protective substrate 20. In addition, since the epoxy resin 70 is filled after the protective substrate 20 is pasted, the resin does not generate a force in the direction of bending the protective substrate 20. Therefore, it is possible to suppress the occurrence of defects in the inside of the protective substrate 20, or the interface between the protective substrate 20 and the second adhesive layer 40, and to obtain an electrophoretic display device with improved display quality and reliability.

1 is a schematic cross-sectional view of an electrophoretic display device according to a first embodiment of the present invention. The schematic cross section of the electrophoretic display device concerning the 2nd Embodiment of this invention. FIG. 6 is a schematic cross-sectional view of an electrophoretic display device according to a third embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of an electrophoretic display device according to a fourth embodiment of the present invention. Process sectional drawing which shows the manufacturing method of the electrophoretic display device concerning the 5th Embodiment of this invention. The figure which shows typically the cross section of the electrophoretic display apparatus based on the conventional method. Sectional drawing which shows the defect which may generate | occur | produce in a protective substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Circuit board, 20 ... Protective board, 32 ... 1st adhesion layer, 34 ... Electrophoretic display layer, 35 ... Microcapsule, 36 ... ITO layer as a transparent conductive material layer, 38 ... As a transparent insulating material layer PET layer, 40 ... second adhesive layer, 42 ... conductive member, 44 ... common electrode, 46 ... TFT, 50 ... electrophoretic display, 70 ... epoxy resin, 71 ... void, 72 ... notch, 73 ... Groove, 75 ... boundary surface, 77 ... cavity, 80 ... region to which a force for bending the protective substrate upward is applied, 82 ... crack, 90 ... syringe.

Claims (12)

A circuit board having an electronic circuit formed on the surface;
A second adhesive layer, a transparent conductive material layer, a conductive member that electrically connects the transparent conductive material layer and a part of the electronic circuit, and the conductive member on the transparent conductive material layer; An electrophoretic display layer disposed at a predetermined interval; and a first adhesive layer laminated on the electrophoretic display layer, the first adhesive layer and the conductive member interposed therebetween. An electrophoretic display that is face-to-face bonded to a circuit board;
A protective substrate made of a translucent material that is face-to-face bonded to the surface of the electrophoretic display body opposite to the surface on which the first adhesive layer is formed via the second adhesive layer;
An electrophoretic display device comprising:
The planar shape of the circuit board and the planar shape of the protective substrate are larger than the planar shape of the electrophoretic display body, and an annular gap around the electrophoretic display body with the protective substrate as the top surface and the circuit board as the bottom surface Exists,
The electrophoretic display device, wherein the second adhesive layer is provided with a cutout portion so that projection of the second adhesive layer onto the circuit board does not overlap the conductive member.   2. The electrophoretic display device according to claim 1, wherein at least an outer edge portion of the annular gap is filled with a material having a function of blocking water vapor.   The electrophoretic display device according to claim 2, wherein the cutout portion is filled with a material having a function of blocking water vapor. A circuit board having an electronic circuit formed on the surface;
A second adhesive layer, a transparent conductive material layer,
A conductive member for electrically connecting the transparent conductive material layer and a part of the electronic circuit;
An electrophoretic display layer disposed on the transparent conductive material layer at a predetermined interval from the conductive member, and a first adhesive layer laminated on the electrophoretic display layer,
An electrophoretic display that is face-to-face bonded to the circuit board via the first adhesive layer and the conductive member;
A protective substrate made of a translucent material that is face-to-face bonded to the surface of the electrophoretic display body opposite to the surface on which the first adhesive layer is formed via the second adhesive layer;
An electrophoretic display device comprising:
The planar shape of the circuit board and the planar shape of the protective substrate are larger than the planar shape of the electrophoretic display body, and an annular gap around the electrophoretic display body with the protective substrate as the top surface and the circuit board as the bottom surface Exists,
The surface of the protective substrate facing the second adhesive layer has a predetermined depth so that a region where the projection of the protective substrate onto the circuit board overlaps with the conductive member does not contact the second adhesive layer. An electrophoretic display device comprising a groove portion.   The electrophoretic display device according to claim 4, wherein at least an outer edge portion of the annular gap is filled with a material having a function of blocking water vapor.   The electrophoretic display device according to claim 5, wherein the groove portion is filled with a material having a function of blocking water vapor.   The electrophoretic display device according to claim 1, wherein a transparent insulating material layer is disposed between the transparent conductive material layer and the second adhesive layer.   The electrophoretic display layer is formed by two-dimensionally arranging a plurality of substantially identical microcapsules holding a dispersion liquid in which electrophoretic particles are dispersed in an insulating liquid on a transparent substrate. The electrophoretic display device according to claim 1, wherein the electrophoretic display device is provided. On the transparent conductive material layer, at least a conducting member, an electrophoretic display layer disposed at a predetermined interval from the conducting member, and a first adhesive layer laminated on the electrophoretic display layer are disposed. A first step of laminating the laminated body in a circuit board having an area larger than that of the laminated body and having an electronic circuit on the surface via the first adhesive layer;
A second step of disposing a second adhesive layer on the laminate to form an electrophoretic display;
A protective substrate made of a transparent material having a larger area than the electrophoretic display body is disposed on the electrophoretic display body via the second adhesive layer so that the electrophoretic display body is accommodated in the protective substrate. A third step of bonding together;
A fourth step of filling an annular gap between the circuit board and the protective substrate surrounding the electrophoretic display body with a material having a function of blocking water vapor;
A method for manufacturing an electrophoretic display device comprising:
The electrophoretic display characterized in that the second step includes a step of adjusting a shape of the second adhesive layer so that a region where the projection of the second adhesive layer and the conductive member overlap does not occur. Device manufacturing method.   The method of manufacturing an electrophoretic display device according to claim 9, wherein the fourth step is a step of filling a material having a function of blocking water vapor to a region overlapping with the conductive member. On the transparent conductive material layer, at least a conducting member, an electrophoretic display layer disposed at a predetermined interval from the conducting member, and a first adhesive layer laminated on the electrophoretic display layer are disposed. A first step of laminating the laminated body in a circuit board having an area larger than that of the laminated body and having an electronic circuit on the surface via the first adhesive layer;
A second step of disposing a second adhesive layer on the laminate to form an electrophoretic display;
A protective substrate made of a transparent material having a larger area than the electrophoretic display body is disposed on the electrophoretic display body via the second adhesive layer so that the electrophoretic display body is accommodated in the protective substrate. A third step of bonding together;
A fourth step of filling an annular gap between the circuit board and the protective substrate surrounding the electrophoretic display body with a material having a function of blocking water vapor;
A method for manufacturing an electrophoretic display device comprising:
A method of manufacturing an electrophoretic display device, comprising: forming a groove portion in a region where the protective substrate overlaps with the conductive member when pasted in the third step.   The fourth step is a step of filling the gap between the protective substrate and the electrophoretic display body, which overlaps with the conductive member, with a material having a function of blocking the water vapor. Item 12. A method for producing an electrophoretic display device according to Item 11.

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