JP2008225185A - Optoelectronic circuit board - Google Patents

Abstract

An optoelectronic circuit board capable of inspecting an optical element and an optical waveguide while the optical element is mounted on the substrate is proposed.
A first optical waveguide (13A) is provided with a converging optical waveguide (14), and a second optical waveguide (13B) is provided with a branch optical waveguide (15). The first inspection optical signal 20 is introduced into the converging optical waveguide 14 from the introduction opening 140, and the first inspection optical signal 20 propagating from the converging optical waveguide 14 through the first optical waveguide 13A is converted into the first optical module. The optoelectronic circuit board 1 can be inspected depending on whether or not 12A has received it. Further, the optical signal 2 transmitted from the first optical module 12 </ b> A propagates through the second optical waveguide 13 </ b> B, and a part of the optical signal 2 propagates through the branch optical waveguide 15. The optoelectronic circuit board 1 is inspected depending on whether or not the light receiving device 4 has received a part of the optical signal 2 from the branch optical waveguide 15 through the extraction opening 150 as the second inspection optical signal 21. Can do.
[Selection] Figure 1

Description

  The present invention relates to an optoelectronic circuit board.

  Conventionally, an optical component in which a metal reflection film that increases the amount of reflected laser light is formed around the light emitting unit, a substrate on which the optical component is mounted, and the optical component and the substrate are provided between the optical component and the laser beam. An optical waveguide through which light propagates, a first pyramid mirror provided at a position corresponding to an optical component near the end of the optical waveguide, and converting the optical path of the laser light, and an inspection light provided by branching from the optical waveguide There is known an optical waveguide substrate provided with a waveguide and a second pyramid mirror provided near the end of the optical waveguide for inspection and converting the optical path of laser light (see, for example, Patent Document 1).

  The detection of the deviation of the optical component mounted on the optical waveguide substrate is performed by detecting a laser light source that outputs laser light, a half mirror having a reflecting surface that reflects the laser light, and laser light reflected by the reflecting surface of the half mirror. This is done by using a detection device comprising a photodetector for detection.

  First, the laser light output from the laser light source of the detection device toward the second pyramid mirror is transmitted through the half mirror, and then its optical path is converted by the second pyramid mirror, and the optical waveguide for inspection and the optical waveguide are changed. Propagating and the light path is converted again by the first pyramid mirror.

The laser light whose optical path has been converted is reflected with the amount of reflected light being increased by the metal reflection film of the optical part when the optical part is mounted with a deviation from a predetermined position, and the reflected laser light returns to the optical path. After being reflected by the reflecting surface of the half mirror, it is detected by a photodetector, and the photodetector detects a deviation in mounting of the optical component based on the amount of laser light.
JP 2003-185526 A

  An object of the present invention is to propose an optoelectronic circuit board capable of inspecting an optical element and an optical waveguide while the optical element is mounted on the substrate.

  In order to achieve the above object, an aspect of the present invention provides the following optoelectronic circuit board.

(1) A light emitting side opening having an electronic circuit and allowing an optical signal to pass from the first surface side to the second surface side, and passing the optical signal from the second surface side to the first surface side. A light receiving side opening formed thereon, a light emitting element mounted on the first surface side of the substrate and provided at a position facing the light emitting side opening, and provided at a position facing the light receiving side opening A first light-receiving element that converts the optical path of the optical signal that is provided on the second surface side of the substrate and passes through the light-emitting side opening from the first surface side to the second surface side. And the optical path of the optical signal so that the optical signal converted by the first optical path conversion surface passes through the light receiving side opening from the second surface side to the first surface side. An optical waveguide having a second optical path conversion surface to be converted, and branched from the optical waveguide, for inspection Optoelectronic circuit board characterized by comprising an inspection optical waveguide for introducing or taking out a signal to the optical waveguide.

(2) The optoelectronic circuit board according to (1), wherein the inspection optical waveguide includes a third optical path conversion surface that converts an optical path of the inspection optical signal.

(3) The substrate has an inspection opening through which the inspection optical signal passes, and the inspection optical signal passes through the inspection opening on the third optical path conversion surface of the inspection optical waveguide. The optical circuit board according to (2), wherein the optical path of the optical signal for inspection is converted as described above.

(4) Further, another substrate is provided on the second surface side of the substrate via the optical waveguide and the inspection optical waveguide, and the other substrate passes through the inspection optical signal. And the third optical path conversion surface of the inspection optical waveguide converts the optical path of the inspection optical signal so that the inspection optical signal passes through the inspection opening. The optoelectronic circuit board according to (2).

(5) The angle with respect to the traveling direction of the optical signal at the branch point of the optical waveguide for inspection is an acute angle when the optical waveguide for inspection is used for taking out the optical signal for inspection. The optoelectronic circuit board according to (1).

(6) The core of the optical waveguide for inspection has a smaller sectional area than the core of the optical waveguide when the optical waveguide for inspection is used for taking out the optical signal for inspection (5) ) Optoelectronic circuit board.

(7) The optoelectronic circuit board according to (1), wherein at least one of the optical waveguide and the inspection optical waveguide has a curved portion starting from a branch point.

(8) The inspection optical waveguide includes a first inspection optical waveguide for introducing the inspection optical signal and a second inspection optical waveguide for extracting the inspection optical signal. The electronic circuit board according to (1).

  According to the optoelectronic circuit board of the first aspect, the optical element and the optical waveguide can be inspected in a state where the optical element is mounted on the substrate.

  According to the optoelectronic circuit board of the second aspect, it is possible to increase the mounting density of electronic components and the like mounted on the board as compared with the case where the third optical path conversion surface is not provided.

  According to the optoelectronic circuit board according to the third aspect, the optical element and the optical waveguide can be easily inspected.

  According to the optoelectronic circuit board of the fourth aspect, it is possible to further increase the mounting density of electronic components and the like mounted on the board.

  According to the optoelectronic circuit board of the fifth aspect, it is possible to effectively extract the optical signal for inspection.

  According to the optoelectronic circuit board of the sixth aspect, it is possible to suppress the loss of the optical signal propagating through the optical waveguide.

  According to the optoelectronic circuit board according to the seventh aspect, the inspection optical signal can be effectively introduced and taken out, and the degree of freedom of arrangement of electronic components and the like mounted on the board can be increased.

  According to the optoelectronic circuit board of the eighth aspect, the optical element and the optical waveguide can be inspected more accurately.

[First embodiment]
(Configuration of optoelectronic circuit board)
1, 2, and 3 show an optoelectronic circuit board according to a first embodiment of the present invention, FIG. 1 (a) is a perspective view, and FIG. 1 (b) is FIG. 1 (a). FIG. 1C is a cross-sectional view taken along the line A2-A2 of FIG. 1A, FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view of FIG. FIG. 3A is a cross-sectional view taken along line CC in FIG. 2A, and FIG. 3B is a cross-sectional view taken along line DD in FIG. 2A.

  The optoelectronic circuit board 1 includes an optical circuit and an electronic circuit, and includes first and second substrates 10 and 11 having electronic circuits including various electronic components, power supply circuit components, and the like, and the first substrate 10. Between the first and second optical modules 12A and 12B mounted on the first surface side of the first and second substrates 10 and 11, and between the first and second optical modules 12A and 12B. And an optical waveguide layer 130 for optically connecting the two.

  The first optical module 12A includes a light emitting element 120A and a light receiving element 121A. The second optical module 12B includes a light emitting element 120B and a light receiving element 121B. The first and second optical modules 12A and 12B are packaged, and their detailed configurations will be described later.

    The optical waveguide layer 130 is provided by branching from the first optical waveguide 13A and the first and second optical waveguides 13A and 13B that serve as an optical transmission path between the first and second optical modules 12A and 12B. It has a merging optical waveguide 14 as an inspection optical waveguide, and a branch optical waveguide 15 as an inspection optical waveguide provided by branching from the second optical waveguide 13B.

(First substrate)
The first substrate 10 is electrically composed of a substrate material formed of an insulating material such as a glass epoxy resin having a thickness of 0.5 mm, and various electronic components and power circuit components formed on the upper surface of the substrate material. And a conductive pattern connected to the.

  The first substrate 10 has light-emitting side openings 100A and 100B and a light-receiving side opening 101B formed at positions facing the light-emitting elements 120A and 120B and the light-receiving elements 121A and 121B, respectively. The opening 140 for extraction and the opening 150 for extraction are formed. Further, a light emitting side opening (not shown) is formed at a position facing the light emitting element 120B of the second optical module 12B. In addition, the light emission side opening and light reception side opening formed in each optical module may be one opening, and are not limited to this.

(Second substrate)
Similar to the first substrate 10, the second substrate 11 includes a substrate material formed of an insulating material such as a glass epoxy resin having a thickness of 1 mm, and various electronic components and power supplies formed on the lower surface of the substrate material. A circuit pattern or the like and a conductive pattern electrically connected thereto.

(Optical waveguide)
As shown in FIG. 1B, the first optical waveguide 13A is an optical waveguide having a thickness of 0.2 mm that includes a core 132 and a clad 131 that is formed around the core 132 and has a refractive index smaller than that of the core 132. The second optical waveguide 13B, the merging optical waveguide 14, and the branching optical waveguide 15 are configured in the same manner.

  The first optical waveguide 13A is provided with a branching optical waveguide 14 as an inspection optical waveguide, which is introduced as an inspection opening provided in the first substrate 10. The optical path of the first inspection optical signal 20 as the inspection optical signal is converted from the opening 140 by the optical path conversion surface 140A and introduced into the first optical waveguide 13A.

  The second optical waveguide 13B is provided with a branched optical waveguide 15 as an inspection optical waveguide, and a part of the optical signal 2 propagating through the second optical waveguide 13B is included in the branched optical waveguide 15. A part of the optical signal 2 propagates, and is a second inspection optical signal 21 as an inspection optical signal. The optical path of the inspection optical signal 21 is converted by the optical path conversion surface 150A, and the inspection opening It is comprised so that it may take out outside from the opening 150 for taking out.

  Further, it is desirable that the angle with respect to the traveling direction of the optical signal 2 at the branching point of the branch optical waveguide 15 is an acute angle, and this allows a part of the optical signal 2 to be efficiently propagated to the branch optical waveguide 15 while suppressing loss. Because.

  The cross-sectional area of the core 132 of the merging optical waveguide 14 is for the purpose of introducing the first inspection optical signal 20 into the merging optical waveguide 14 from the introduction opening 140, so that the first and second optical waveguides 13A and 13B Although configured to be equivalent to the cross-sectional area of the core 132, the present invention is not limited to this.

  However, in the second inspection optical signal 21, it is desirable that the cross-sectional area of the core 132 of the branch optical waveguide 15 is small and the cross-sectional area is wide in order to suppress the loss of the optical signal 2 propagating through the second optical waveguide 13B. Therefore, as an example, the width of the core 132 of the second optical waveguide 13B is narrower than the width of 80 μm, which is 10 μm.

  In addition, the edge of the optical waveguide layer 130 is sealed at the edge of the substrate with an encapsulant 200 such as an epoxy resin. The sealing with the encapsulant 200 may be a part, and is not limited to this.

  Note that the number of inspection optical waveguides that join or branch from one optical waveguide is not limited to one, and a plurality of inspection optical waveguides may be used, and one optical waveguide has one inspection optical waveguide that joins and branches. Will be described later.

(Optical waveguide manufacturing method)
Next, a method for manufacturing the first and second optical waveguides 13A and 13B, the merged optical waveguide 14, and the branched optical waveguide 15 will be described. The first and second optical waveguides 13A and 13B, the merging optical waveguide 14, and the branch optical waveguide 15 can be manufactured by, for example, a commonly used photolithography method or a method using RIE (reactive ion etching). In particular, it can be efficiently produced by a production process using a mold described in Japanese Patent Application Laid-Open No. 2004-29507 already proposed by the present applicant. The manufacturing process will be described below.

  First, a master on which a convex portion corresponding to the core 132 is formed is produced using, for example, a photolithography method. Next, a curable resin having a viscosity of, for example, about 500 to 7000 mPa · s and having light transmittance in the ultraviolet region and the visible region, for example, a methylsiloxane group in the molecule, A layer of curable organopolysiloxane containing an ethylsiloxane group and a phenylsiloxane group is provided by coating or the like, and then cured to form a cured layer. Next, the hardened layer is peeled off from the master and a mold having a concave portion corresponding to the convex portion is produced.

  Next, a clad film substrate made of a resin excellent in adhesion to the mold, for example, an alicyclic acrylic resin film, an alicyclic olefin resin film, a cellulose triacetate film, a fluororesin film, or the like is adhered to the mold. Let Next, the concave portion of the mold is filled with, for example, an ultraviolet curable or thermosetting monomer, an oligomer or a mixture of a monomer and an oligomer, an epoxy type, a polyimide type, an acrylic type ultraviolet curable resin, or the like. . Next, the curable resin in the recess is cured to form the core 132, and then the mold is peeled off. This leaves the core 132 on the cladding film substrate.

  Next, the clad 131 is provided so as to cover the core 132 on the side of the clad film substrate on which the core 132 is formed. Examples of the clad 131 include a film, a layer obtained by applying and curing a curable resin for clad, and a polymer film obtained by applying a solvent solution of a polymer material and drying.

  Finally, the surface where the core 132 of the optical waveguide is exposed is cut at a predetermined angle by a dicer to form the optical path conversion surfaces 133A, 133B, 134A, 140A, 150A and end surfaces. Further, by cutting with a dicer parallel to the core 132, the first, second, branching and merging optical waveguides 13A, 13B, 14 and 15 with the clad film base material and the clad layer as the clad 131 are completed.

(Optical module)
Hereinafter, although the configuration of the first optical module 12A will be described, the second optical module 12B has the same configuration and function. The first optical module 12A includes a substrate 129, the above-described light emitting element 120A and the above-described light receiving element 121A mounted on the lower surface of the substrate 129, a control unit 127A mounted on the upper surface of the substrate 129, and terminals. 124, a wire 126, and a sealing resin 128 such as an epoxy resin that seals the control unit 127A.

  As shown in FIG. 3A, the light receiving element 121A of the first optical module 12A (also the light emitting element 120A) is electrically connected to the control unit 127A provided on the substrate 129 via the wire 122 and the pad 123. It is connected.

  The control unit 127A includes a drive circuit that drives the light emitting element 120A and an amplifier circuit that amplifies the electric signal output from the light receiving element 121A. The control unit 127A is electrically connected to the terminal 110 via the wire 126, the pad 124, and the solder ball 125. They are connected and protected by a sealing resin 128.

  As the light receiving element 121A, for example, a planar optical element such as a planar photodiode can be used. In this embodiment, a GaAs PIN photodiode having excellent high-speed response is used as the light receiving element 121A. The PIN photodiode includes, for example, a P-layer, an I-layer, and an N-layer that are PIN-bonded on a GaAs substrate, a p-type electrode connected to the P-layer, and an n-type electrode formed on the N-layer. ing.

  As shown in FIG. 3B, the light emitting element 120A of the first optical module 12A can use a plurality of light emitting elements (surface optical elements) such as a surface light emitting diode and a surface laser. In this embodiment, a VCSEL (surface emitting laser) is used as the light emitting element 120A.

  In this surface emitting laser, for example, an n-type upper reflector layer, an active layer, a current confinement layer, a p-type lower reflector layer, a p-type contact layer, and a p-type electrode are formed on an n-type GaAs substrate. An n-type electrode is formed on the front side of the substrate.

(Operation of the first embodiment)
The operation of the optoelectronic circuit board according to the first embodiment of the present invention will be described below with reference to FIGS. 4 and 5 while referring to FIGS.

(Transmission and reception of optical signals)
Here, as an example, a case where image signals are transmitted from the first optical module 12A to the second optical module 12B will be described. The control unit 127A of the first optical module 12A transmits a drive signal based on the image signal to the light emitting element 120A, and the light emitting element 120A converts the optical signal 2 based on the drive signal through the light emission side opening 100A. Transmit towards surface 134A.

  At this time, a voltage of a drive signal is applied between the p-type electrode and the n-type electrode of the light emitting element 120A, and for example, laser light having a wavelength of 850 nm is output as the optical signal 2 from the light emitting region of the light emitting layer.

  The optical path conversion surface 134A converts the optical path of the optical signal 2 transmitted from the light emitting element 120A, and propagates the optical signal 2 to the second optical waveguide 13B.

  The optical signal 2 propagated through the second optical waveguide 13B has its optical path converted by the optical path conversion surface 133B.

  The optical signal 2 passes through the light receiving side opening 101B and is received by the light receiving element 121B of the second optical module 12B. The light receiving element 121B converts the received optical signal 2 into an electrical signal and outputs the electrical signal to the control unit 127B.

  The control unit 127 </ b> B processes the converted electric signal to generate an image signal, and outputs the image signal to a predetermined electronic component on the first substrate 10.

(Inspection of the first optical waveguide and each module)
As shown in FIG. 1 and FIG. 3A, the case where the first optical waveguide 13A and each module are inspected by introducing the optical signal 2 from the external light emitting device 3 into the first optical waveguide 13A is shown. This will be described with reference to the flowchart of FIG.

  The light emitting device 3 transmits the first inspection optical signal 20 toward the optical path conversion surface 140A (S1).

  The first inspection optical signal 20 output from the light emitting device 3 passes through the introduction opening 140, is changed in optical path by the optical path conversion surface 140 </ b> A, and propagates through the converging optical waveguide 14.

  The first inspection optical signal 20 propagated through the merged optical waveguide 14 merges into the first optical waveguide 13A, is further converted in optical path by the optical path conversion surface 133A, passes through the light receiving side opening 100B, and passes through the first optical waveguide 13A. When the optical waveguide 13A and the first optical module 12A function normally, they are received by the light receiving element 121A and converted into electrical signals.

  When the first optical module 12A receives the first inspection optical signal 20 and normally processes the received first inspection optical signal 20 (S2; Yes), the first optical waveguide 13A and the first optical waveguide 13A It can be seen that the first optical module 12A is functioning normally.

  Next, the optical signal 2 is transmitted from the second optical module 12B in order to check whether or not there is an abnormality in the second optical module 12B (S3).

  When the first optical module 12A receives the optical signal 2 from the second optical module 12B and processes it normally (S4; Yes), the first optical module 12A, the first optical waveguide 13A and the second optical module 12A It can be seen that the function of the optical module 12B is normal (S5).

  Here, in step 2, when the first optical module 12A does not receive the first inspection optical signal 20, or when the received signal cannot be processed normally (S2; No), the first It can be seen that the optical module 12A or the first optical waveguide 13A may have an abnormality (S6).

  In Step 4, when the first optical module 12A does not receive the optical signal 2 transmitted from the second optical module 12B or when the received signal cannot be processed normally (S4; No), it is understood that the first optical waveguide 13A from the second optical module 12B or the second optical module 12B to the merged optical waveguide 14 may be abnormal (S7).

(Inspection of the second optical waveguide and each module)
As shown in FIG. 1 and FIG. 3B, in the case of inspecting the second optical waveguide and each module by taking out the optical signal 2 propagating through the second optical waveguide 13B, according to the flowchart of FIG. explain.

  The light emitting element 120A of the first optical module 12A transmits the optical signal 2 toward the optical path conversion surface 134A (S10).

  The optical signal 2 passes through the light emitting side opening 100 </ b> A, has its optical path converted by the optical path conversion surface 134 </ b> A, propagates through the second optical waveguide 13 </ b> B, and further partially propagates to the branch optical waveguide 15.

  The second optical signal 21 for inspection, which is a part of the optical signal 2 propagated to the branch optical waveguide 15, is converted in the optical path by the optical path conversion surface 150 </ b> A provided in the branch optical waveguide 15 and passes through the extraction opening 150. After that, it is received by the light receiving device 4.

  Here, when the second inspection optical signal 21 is received by the light receiving device 4 (S11; Yes), the first optical module 12A and the second optical waveguide 13B up to the branch optical waveguide 15 function normally. You can see that

  Subsequently, when the second optical module 12B receives the optical signal 2 transmitted from the first optical module 12A (S12; Yes), the first optical module 12A, the second optical waveguide 13B, and the second optical module 12B It can be seen that the optical module 12B is functioning normally (S13).

  Here, when the second inspection optical signal 21 is not received by the light receiving device 4 in step 11 (S11; No), either the first optical module 12A or the second optical waveguide 13B is abnormal. (S14).

  In step 12, when the second optical module 12B has not received the optical signal 2 or has not processed the received signal normally (S12; No), the second optical signal 21 for inspection is Since the light is received by the light receiving device 4, it can be seen that there is an abnormality in the second optical waveguide 13B from the second optical module 12B to the branched optical waveguide 15 or the second optical module 12B (S15). .

[Second Embodiment]
In the following description, portions having the same configuration and function as those of the first embodiment are denoted by common reference numerals.

  FIG. 6 is a plan view showing an optoelectronic circuit board according to the second embodiment of the present invention. The optoelectronic circuit board 1 includes a first and second optical waveguides 14a, 14b, a first branching optical waveguide 15a, and a second branching optical waveguide 15b. It is branched from the waveguides 13A and 13B.

  The first merging optical waveguide 14a introduces an inspection optical signal from the first introduction opening 140a, and the second merging optical waveguide 14b introduces an inspection optical signal from the second introduction opening 140b. It is configured. The first and second converging optical waveguides 14a and 14b have optical path conversion surfaces (not shown) at positions corresponding to the first and second introduction openings 140a and 140b.

  The first and second branch optical waveguides 15a and 15b are configured to extract the inspection optical signal from the first extraction opening 150a and the second extraction opening 150b. The first and second branch optical waveguides 15a and 15b have optical path conversion surfaces (not shown) at positions corresponding to the first and second extraction openings 150a and 150b.

  In the present embodiment, the first inspection optical signal 20 is introduced from the first and second introduction openings 140a and 140b, and the second inspection light is introduced from the first and second extraction openings 150a and 150b. By taking out the signal 21, the first and second optical modules 12A and 12B and the first and second optical waveguides 13A and 13B can be inspected.

[Third embodiment]
FIG. 7 is a plan view showing an optoelectronic circuit board according to a third embodiment of the present invention. The optoelectronic circuit board 1 includes first and second optical waveguides 13A and 13B each having a curved portion starting from a branch point. The optical waveguide having a curved portion starting from the branch point may be the merged optical waveguide 14 and the branched optical waveguide 15, or the first and second optical waveguides 13A and 13B, the merged optical waveguide 14 and the branch. The optical waveguide 15 may have a curved portion, but is not limited to this.

  The first optical waveguide 13A is provided with a branching of the converging optical waveguide 14, and the converging optical waveguide 14 can effectively introduce the inspection optical signal 20 from the introduction opening 140. The optical path conversion surface is provided at a position corresponding to the introduction opening 140.

  On the other hand, the second optical waveguide 13B is provided by branching the branch optical waveguide 15, and the branch optical waveguide 15 is on the extension of the straight portion extending from the first optical module 12A. It is effectively propagated and taken out from the extraction opening 150 as an inspection optical signal. The branched optical waveguide 15 has an optical path conversion surface at a position corresponding to the extraction opening 150.

  In the present embodiment, the first and second optical modules are introduced by introducing the first inspection optical signal 20 from the introduction opening 140 and taking out the second inspection optical signal 21 from the extraction opening 150. 12A, 12B and the first and second optical waveguides 13A, 13B can be inspected.

[Fourth embodiment]
FIG. 8A is a cross-sectional view showing an optoelectronic circuit board according to the fourth embodiment of the present invention, and FIG. 8B shows an optoelectronic circuit board according to the fourth embodiment of the present invention. It is sectional drawing shown.

  In the present embodiment, as shown in FIG. 8A, an introduction opening 140 is provided in the second substrate 11, and as shown in FIG. 8B, an extraction opening 150 is provided in the second substrate 11. Provided.

  In the present embodiment, the first and second optical modules are introduced by introducing the first inspection optical signal 20 from the introduction opening 140 and taking out the second inspection optical signal 21 from the extraction opening 150. 12A and 12B and the first and second optical waveguides 13A and 13B can be inspected.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from or changing the technical idea of the present invention.

(A) is a perspective view which shows the optoelectronic substrate based on the 1st Embodiment of this invention, (b) is A1-A1 of Fig.1 (a) based on the 1st Embodiment of this invention. It is line sectional drawing, (c) is A2-A2 sectional view taken on the line of Fig.1 (a) based on the 1st Embodiment of this invention. (A) is a top view which shows the optoelectronic circuit board based on the 1st Embodiment of this invention, (b) BB line of FIG. 2 (a) concerning the 1st Embodiment of this invention It is sectional drawing. (A) is CC sectional view taken on the line of FIG. 2 (a) based on 1st Embodiment of this invention, (b) is FIG. 2 (1) concerning 1st Embodiment of this invention ( It is the DD sectional view taken on the line of a). It is an example of the flowchart of a test | inspection of the 1st optical waveguide which concerns on the 1st Embodiment of this invention, and each optical module. It is an example of the flowchart of a test | inspection of the 2nd optical waveguide which concerns on the 1st Embodiment of this invention, and each optical module. It is a top view which shows the optoelectronic circuit board based on the 2nd Embodiment of this invention. It is a top view which shows the optoelectronic circuit board based on the 3rd Embodiment of this invention. (A) is sectional drawing which shows the optoelectronic circuit board based on the 4th Embodiment of this invention, (b) is sectional drawing which shows the optoelectronic circuit board concerning the 4th Embodiment of this invention. is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optoelectronic circuit board, 2 ... Optical signal, 3 ... Light-emitting device, 4 ... Light-receiving device, 10 ... 1st board | substrate, 11 ... 2nd board | substrate, 12A ... First optical module, 12B ... second optical module, 13A ... first optical waveguide, 13B ... second optical waveguide, 14 ... confluence optical waveguide, 14a ... first 1 merging optical waveguide, 14b ... second merging optical waveguide, 15 ... branching optical waveguide, 15a ... first branching optical waveguide, 15b ... second branching optical waveguide, First optical signal for inspection, 21... Second optical signal for inspection, 100A... Light emitting side opening, 100B, 101B... Light receiving side opening, 110, 124. ... Light emitting element, 121A, 121B ... Light receiving element, 122, 126 ... Wire, 123 ..Pad, 125 ... solder ball, 127A ... control unit, 128 ... sealing resin, 131 ... cladding, 132 ... core, 133A, 133B, 134A, 140A, 150A ... Optical path conversion surface, 140, 140a, 140b ... opening for introduction, 150, 150a, 150b ... opening for extraction, 200 ... encapsulant

Claims (8)

A light emitting side opening that has an electronic circuit and passes an optical signal from the first surface side to the second surface side, and a light receiving side that passes the optical signal from the second surface side to the first surface side A substrate with an opening formed thereon;
A light emitting element mounted on the first surface side of the substrate and provided at a position facing the light emitting side opening; and a light receiving element provided at a position facing the light receiving side opening;
A first optical path conversion surface that is provided on the second surface side of the substrate and converts an optical path of the optical signal passing through the light emission side opening from the first surface side to the second surface side; and A second optical path for converting the optical path of the optical signal so that the optical signal converted by the first optical path conversion surface passes through the light receiving side opening from the second surface side to the first surface side. An optical waveguide having a conversion surface;
An optoelectronic circuit board, comprising: an inspection optical waveguide that is branched from the optical waveguide and introduces or extracts an inspection optical signal from the optical waveguide.   The optoelectronic circuit board according to claim 1, wherein the inspection optical waveguide includes a third optical path conversion surface that converts an optical path of the inspection optical signal. The substrate has an inspection opening through which the inspection optical signal passes,
The third optical path conversion surface of the inspection optical waveguide converts an optical path of the inspection optical signal so that the inspection optical signal passes through the inspection opening. Optoelectronic circuit board. Furthermore, another substrate is provided on the second surface side of the substrate via the optical waveguide and the inspection optical waveguide,
The other substrate has an inspection opening through which the inspection optical signal passes,
The third optical path conversion surface of the inspection optical waveguide converts an optical path of the inspection optical signal so that the inspection optical signal passes through the inspection opening. Optoelectronic circuit board.   The angle with respect to the traveling direction of the optical signal at the branch point of the inspection optical waveguide is an acute angle when the inspection optical waveguide is used for extracting the inspection optical signal. The optoelectronic circuit board described.   The core of the optical waveguide for inspection is smaller in cross-sectional area than the core of the optical waveguide when the optical waveguide for inspection is used for taking out the optical signal for inspection. Optoelectronic circuit board.   2. The optoelectronic circuit board according to claim 1, wherein at least one of the optical waveguide and the inspection optical waveguide has a curved portion starting from a branch point. 3.   2. The inspection optical waveguide includes a first inspection optical waveguide for introducing the inspection optical signal, and a second inspection optical waveguide for extracting the inspection optical signal. An electronic circuit board according to 1.

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