JP2008214704A - Amorphous metal / metal glass joint - Google Patents
Amorphous metal / metal glass joint Download PDFInfo
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本発明は、急速な冷却速度で作成されるアモルファス金属もしくは広範囲な過冷却融体範囲と明確なガラス転移点を持つ金属ガラスの接合体に関し、同種組成もしくは異種組成からなるアモルファス金属もしくは金属ガラスないしは結合部分に析出されたナノ結晶を含むコンポジットあるいは結晶金属と接合された接合体、更には結晶金属を面方向、層方向あるいは任意の部所に配列接合された構造用、機能性を有する大型部材、複雑部材に関する。 The present invention relates to an amorphous metal produced at a rapid cooling rate or a metal glass joined body having a wide range of supercooled melt and a clear glass transition point. Composites containing nanocrystals deposited in the bonding part or joined bodies joined with crystalline metals, and large members with structure and functionality in which crystalline metals are arrayed and joined in the plane direction, layer direction or any part , Relating to complex members.
アモルファス金属もしくは金属ガラスは106-8 K/sの大きな冷却速度で急冷させなくてはならないため、大型の部材を作成することが困難であり、大型部材や複雑形状物の作成ができないため、用途に大きな制約があった。 Since amorphous metal or metallic glass must be rapidly cooled at a large cooling rate of 10 6-8 K / s, it is difficult to create a large member, and large members and complex shapes cannot be created. There were major restrictions on the application.
母材と同程度の強度を有する大型の部材や複雑形状物の作成には従来の結晶金属接合で広範囲に行われている溶接や半田・蝋接合が考えられるが、アモルファス金属もしくは金属ガラスはガラス転移点が300-900℃と結晶金属の融点に較べて一般に低いため熱に弱く、またその組織は脆弱なため、従来の結晶金属に適用してきた通常の溶接や半田・蝋接合法では結晶化してしまいアモルファス金属もしくは金属ガラスの部品を作成することは困難である。 For the production of large-sized members and complex shapes with the same strength as the base metal, welding and solder / wax bonding widely used in conventional crystalline metal bonding can be considered, but amorphous metal or metallic glass is glass. Since the transition point is 300-900 ° C, which is generally lower than the melting point of crystalline metal, it is weak against heat and its structure is fragile, so it is crystallized by conventional welding and solder / wax bonding methods applied to conventional crystalline metals. Therefore, it is difficult to produce a part made of amorphous metal or metallic glass.
また有機系の接着剤で接着するという方法も考えられるが、部材間の均一接合や部材強度に問題があり、また高価となり、100度以上の高温での使用では剥離や強度低下が生じ、場合によっては火災の危険も生じるため、用途は著しく制約される。 In addition, there may be a method of bonding with an organic adhesive, but there are problems with uniform bonding between members and member strength, and it is expensive, and peeling and strength reduction occur when used at a high temperature of 100 degrees or more. Depending on the situation, there is a risk of fire, so the application is severely restricted.
本発明に関連して、非特許文献1には最安定化金属ガラスZr41Ti14Cu12Ni10Be23の電子ビーム接合が、非特許文献2には超安定化金属ガラスPd40Ni40P20の超塑性を用いた摩擦接合例が、非特許文献3には最安定化金属ガラスZr55Al10Ni5Cu30のパルス電流接合法が報じられている。 In relation to the present invention, Non-Patent Document 1 discloses electron beam bonding of the most stabilized metallic glass Zr 41 Ti 14 Cu 12 Ni 10 Be 23 , and Non-Patent Document 2 describes ultra-stabilized metallic glass Pd 4 0Ni 40 P. An example of friction welding using superplasticity of 20 is reported in Non-Patent Document 3, and a pulse current welding method of the most stabilized metallic glass Zr 55 Al 10 Ni 5 Cu 30 is reported.
これらはいずれも最安定化金属ガラスであり、ΔT(=Tx-Tg)(Tx:結晶化温度、Tg:ガラス点)が大きい。金属ガラスは組成によってΔTが小さいものもあり、またアモルファス金属のようにΔT=0のものもあり、広範囲の用途にはアモルファス金属もしくはΔTが小さい金属ガラスの接合体も必要である。更には結晶金属と接合された接合体も必要である。 These are all the most stabilized metallic glasses, and ΔT (= Tx−Tg) (Tx: crystallization temperature, Tg: glass point) is large. Some metal glasses have a small ΔT depending on the composition, and some have ΔT = 0 like an amorphous metal. For a wide range of applications, an amorphous metal or a metal glass bonded body having a small ΔT is required. Furthermore, a joined body joined with a crystalline metal is also necessary.
特許文献1には、Tg以上Tx以下の温度で回転プローブによる摩擦熱による金属ガラスの接合方法が記載されている。 Patent Document 1 describes a method of joining metallic glass by frictional heat using a rotating probe at a temperature of Tg or more and Tx or less.
本発明は、上記した従来技術の実情に鑑みてなされたものであり、同種もしくは異種のアモルファス金属もしくは金属ガラスないしは結合部分に析出されたナノ結晶を含むコンポジット、あるいは結晶金属と接合された接合体、更には結晶金属を面方向、層方向、任意の場所で接合させ、大型で複雑形状を有する構造用及び機能性部材を作ることを課題とする。 The present invention has been made in view of the above-described prior art, and is a composite containing nanocrystals deposited on the same kind or different kinds of amorphous metal or metal glass or bonded portion, or a joined body joined with a crystalline metal. Furthermore, it is an object of the present invention to produce a structural member and a functional member having a large and complicated shape by bonding a crystalline metal in a plane direction, a layer direction, and an arbitrary place.
本発明者らは、新たな発想のもとに鋭意研究を行い、レーザ、電子ビーム加熱、電気抵抗加熱、超音波加熱あるいは摩擦熱等を利用し直接母材を接合させるか、あるいは半田や蝋材等の接合材を介して、アモルファス金属もしくは金属ガラスを結晶化させる前に結合させるという条件を見つけることによって、本発明を完成することに至った。 The present inventors have conducted intensive research based on a new idea and directly joined the base material using laser, electron beam heating, electrical resistance heating, ultrasonic heating, frictional heat, etc. The present invention has been completed by finding a condition that an amorphous metal or a metallic glass is bonded before being crystallized through a bonding material such as a material.
この場合、結晶化を起こさせないで直接結合させるには接合速度を大きくして温度の拡散上昇を抑えるか、結晶化が起こりにくい熱源として電子ビーム源を用いる等の工夫が必要である。また接合体組成にも制限があることが判明した。さらに電気抵抗加熱法では電気抵抗の多寡によって電流値の制御、超音波加熱、摩擦撹拌接合法等では短い印加時間、適度の接触圧力等が必要である。 In this case, in order to directly bond without causing crystallization, it is necessary to devise such as increasing the bonding speed to suppress an increase in temperature diffusion or using an electron beam source as a heat source in which crystallization hardly occurs. It has also been found that there is a limit to the composition of the joined body. Furthermore, the electric resistance heating method requires a short application time, an appropriate contact pressure, and the like in the current value control, ultrasonic heating, friction stir welding method, etc. depending on the electric resistance.
半田・蝋接合においては耐酸化性のPd基−、Au基金属ガラス以外の金属ガラスやアモルファス金属は酸化皮膜に覆われているため、直接には接合しにくい。従ってこの酸化皮膜を接合直前に除去する必要がある。金属ガラスを蝋材として用いた蝋接では蝋材部分に脆い結晶層が析出することを抑えるために、蝋材と母材を接合温度からガラス転移点まで臨界冷却速度以上で冷却する必要がある。 In solder / wax bonding, metallic glass and amorphous metal other than oxidation-resistant Pd-based and Au-based metallic glass are covered with an oxide film, so that direct bonding is difficult. Therefore, it is necessary to remove this oxide film immediately before joining. In brazing using metallic glass as a brazing material, it is necessary to cool the brazing material and the base material at a critical cooling rate or higher from the joining temperature to the glass transition point in order to prevent the formation of a brittle crystal layer on the brazing material portion. .
さらに、摩擦攪拌接合法では100rpm以上の高速で工具を回転しその摩擦熱で被接合体を軟化し、塑性変形を利用して固相状態で接合する方法である。被接合体の材料硬度によって圧入深さ、回転速度を変える必要がある。母材の強度を保ったまま接合を行うと、接合ツールの寿命の問題があり、ガラス遷移点(Tg)以上かつ結晶化温度(Tx)以下で接合する必要がある。 Further, the friction stir welding method is a method in which a tool is rotated at a high speed of 100 rpm or more, the object to be welded is softened by the frictional heat, and is joined in a solid state using plastic deformation. It is necessary to change the press-fitting depth and the rotational speed depending on the material hardness of the joined body. When bonding is performed while maintaining the strength of the base material, there is a problem of the life of the bonding tool, and it is necessary to bond at a glass transition point (Tg) or higher and a crystallization temperature (Tx) or lower.
電気抵抗加熱法では10A以上の電流を短時間流し、急熱加熱による接合方法である。被接合体の固有電気抵抗度によって印加電流を変える必要がある。 The electric resistance heating method is a bonding method in which a current of 10 A or more is passed for a short time and rapid heating is performed. It is necessary to change the applied current depending on the specific electrical resistance of the object to be joined.
超音波法は、固定された一方の材料に対して超音波振動する他方の材料を押し当てることにより、摺動界面の接合阻害層を破壊して界面凝着を形成し、さらに初期凝着形成後は半田・蝋材を用いることなく材料の超音波誘起変形により変形部表面の接合阻害層破壊と密着面積拡大を促進する接合技術である。材料の接合界面に供給されるエネルギーが上記摩擦攪拌法と同様に熱エネルギーではないことから、エネルギーを接合界面近傍に効果的に集中することができる。その結果、単位面積の接合に必要となるエネルギーが少なくて済み、かつ、非常に短時間で接合できる。すなわち、接合部近傍の温度上昇を低く抑えることができる。また、固相状態のまま接合するため、非常に寸法精度の高い接合が可能となる。 In the ultrasonic method, by pressing the other material that vibrates ultrasonically against one fixed material, the bonding inhibition layer of the sliding interface is destroyed to form interface adhesion, and further initial adhesion formation After that, there is a joining technique that promotes the destruction of the joint-inhibiting layer on the surface of the deformed portion and the enlargement of the adhesion area by ultrasonic-induced deformation of the material without using solder / wax material. Since the energy supplied to the bonding interface of the material is not thermal energy as in the friction stir method, the energy can be effectively concentrated in the vicinity of the bonding interface. As a result, less energy is required for bonding of unit areas, and bonding can be performed in a very short time. That is, the temperature rise in the vicinity of the joint can be kept low. In addition, since bonding is performed in a solid state, bonding with extremely high dimensional accuracy is possible.
本発明は、アモルファス金属もしくは金属ガラスを結晶化させる前に結合させるという条件を見つけることによって、あるいは準安定結晶相を形成させることによってアモルファス金属もしくは金属ガラスを主体とした、あるいは結晶金属と接合された大型で複雑形状を有する構造用及び小型の機能性部材を提供する。すなわち、大型の部材を作成することが困難であるというアモルファス金属もしくは金属ガラスの弱点を本発明は解決した。更に付加価値の高いアモルファス金属もしくは金属ガラスを微細成型体に加工することも可能となった。 The present invention is based on amorphous metal or metallic glass or bonded to crystalline metal by finding the condition that amorphous metal or metallic glass is bonded before crystallization, or by forming a metastable crystalline phase. The present invention provides a structural member and a small functional member having a large and complex shape. That is, the present invention has solved the weak point of amorphous metal or metallic glass that it is difficult to produce a large member. Furthermore, it has become possible to process high value-added amorphous metal or metallic glass into a fine molded body.
各種の熱的接合方法は小型・大型・複雑部材の部位によって、複数方式で多面的に重複使用されることも必要である。例えば比較的大型のものはレーザや電子ビーム接合で、比較的小さい箇所は超音波接合で、曲率のある場所は半田接合等の組み合わせが望ましい。また複雑形状や多層材の接合には拡散接合や電気抵抗加熱法が適している場合もある。 Various thermal bonding methods are required to be used in a multifaceted manner by a plurality of methods depending on the parts of small, large, and complicated members. For example, it is desirable to use a combination of laser or electron beam bonding for a relatively large size, ultrasonic bonding for a relatively small portion, and solder bonding or the like for a portion having a curvature. In addition, diffusion bonding or electric resistance heating may be suitable for bonding complex shapes or multilayer materials.
例えば、レーザや電子ビーム、超音波接合および半田接合ではアモルファス金属もしくは金属ガラス接合体作製の完全自動化も可能となる。 For example, in laser, electron beam, ultrasonic bonding, and solder bonding, it is possible to completely automate the production of an amorphous metal or metal glass bonded body.
以下、本発明における各種組成のアモルファス金属もしくは金属ガラス接合体について、各種接合条件を用いてその実施例を説明する。 Examples of amorphous metal or metal glass bonded bodies having various compositions according to the present invention will be described below using various bonding conditions.
表1は各種材料の原料組成及び反応条件である。なお、本発明が適用される材料は、上記請求項において包含される全てのアモルファス金属もしくは金属ガラスであり、表1に記載された材料に限定されるものではない。 Table 1 shows raw material compositions and reaction conditions of various materials. The materials to which the present invention is applied are all amorphous metals or metallic glasses included in the above claims, and are not limited to the materials described in Table 1.
以下は、各種組成のアモルファス金属もしくは金属ガラスの組成及びガラス点、試料サイズを表した表である。
図1及び図2は表1中の番号1の試料2枚を用いて半導体YAGレーザ(26W,ビーム径0.3m)及び電子ビーム(加速電圧60kV、電流3-5mA, 真空度0.1Pa)で接合し、その接合部をX線と透過電子顕微鏡で構造解析した結果である。 1 and 2 are joined using a semiconductor YAG laser (26 W, beam diameter 0.3 m) and an electron beam (acceleration voltage 60 kV, current 3-5 mA, vacuum degree 0.1 Pa) using two samples No. 1 in Table 1. It is the result of structural analysis of the joint with X-rays and a transmission electron microscope.
図1のグラフはビード表裏面のX線回折結果を示しており、グラフの横軸は〜の角度を示しており、縦軸は信号強度を示している。左上の図(a)は接合速度2m/min.の場合、右上の図(b)は接合速度2.5m/min.の場合、左下の図(c)は接合速度3m/min.の場合における結果を示している。図1の右下の図(d)は、ビード表裏面の透過電子顕微鏡構造解析結果を示している。 The graph of FIG. 1 has shown the X-ray-diffraction result of the bead front and back, the horizontal axis of the graph shows the angle of ˜, and the vertical axis shows the signal intensity. The upper left figure (a) shows the results when the welding speed is 2 m / min., The upper right figure (b) shows the results when the welding speed is 2.5 m / min, and the lower left figure (c) shows the results when the welding speed is 3 m / min. Is shown. The lower right figure (d) of FIG. 1 has shown the transmission-electron-microscope structural analysis result of bead front and back.
図2のグラフは、電子ビーム接合後のX線解析結果であり、グラフの横軸は〜の角度を、縦軸は信号強度を示している。グラフの結果は、下から(a) 熱影響のない領域、 (b) 酸化物相 、(c) 熱影響領域における結果を示す。また、図2の画像は透過電子顕微鏡解析結果であり、左から(d) 溶接領域の高分解能像、(e) 非晶質相領域の回折像, (f)明視野像 (g) hR-14 Ni4Ti3 単相を示している。 The graph of FIG. 2 is an X-ray analysis result after electron beam bonding, in which the horizontal axis indicates an angle of ˜ and the vertical axis indicates signal intensity. The graph results show the results in (a) a region without heat influence, (b) an oxide phase, and (c) a heat-affected region from the bottom. The image in Fig. 2 shows the results of transmission electron microscope analysis. From the left, (d) high-resolution image of the weld region, (e) diffraction image of the amorphous phase region, (f) bright-field image (g) hR- 14 Ni 4 Ti 3 single phase.
半導体レーザの接合速度が2m/minから3m/minへ増加すると、接合部の組織は結晶相からほぼ単一の非晶質相に変化した。低速度ではナノ準安定稜面体hR14-Ni4Ti3が出現した(図1(d))。結晶化を防ぐには4m/min以上の接合速度が必要である。ナノ準結晶が生成してもアモルファス金属もしくは金属ガラス接合体の強度を低下させるものではない。 When the bonding speed of the semiconductor laser increased from 2 m / min to 3 m / min, the structure of the bonding portion changed from a crystalline phase to a substantially single amorphous phase. At low speed, nano metastable ridges hR14-Ni 4 Ti 3 appeared (Fig. 1 (d)). In order to prevent crystallization, a bonding speed of 4 m / min or more is required. Even if the nano quasicrystal is formed, the strength of the amorphous metal or metallic glass joined body is not lowered.
一方、電子ビーム接合では、図2における電子ビーム接合後のX線解析図a-c)と透過電子顕微鏡解析結果(d-g)から明らかなように、接合領域は非晶質相であった。試料番号7の金属ガラスCu60Zr30Ti10を用いた場合も同様の結果が得られた。 On the other hand, in the electron beam bonding, as is apparent from the X-ray analysis diagram ac) after electron beam bonding in FIG. 2 and the transmission electron microscope analysis result (dg), the bonding region was an amorphous phase. Similar results were obtained when the metal glass Cu 60 Zr 30 Ti 10 of sample number 7 was used.
図3は金属ガラスの電流圧接法の概略図である。試料番号3の金属ガラスZr55Cu30Ni5Al10を積層して急速に電流加熱することにより、接合部のみが優先的に加熱される。この接法は金属ガラスなど急速加熱、冷却が必要不可欠な接合に最も適した接合法の一つである。得られた接合体断面の組織を図4に示す。図4は、50ミクロンの厚さのZr55Cu30Ni5Al104層を抵抗溶接により接合した試料の断面組織である。図5は、この試料のZr基金属ガラス接合部のX線回折結果である。 FIG. 3 is a schematic view of the current pressure welding method for metallic glass. By laminating the metal glass Zr 55 Cu 30 Ni 5 Al 10 of sample number 3 and rapidly heating the current, only the joint is preferentially heated. This welding method is one of the most suitable joining methods for metal glass and other rapid heating and cooling that are essential. The structure of the obtained bonded body cross section is shown in FIG. FIG. 4 is a cross-sectional structure of a sample in which four layers of Zr 55 Cu 30 Ni 5 Al 10 having a thickness of 50 microns are joined by resistance welding. FIG. 5 is an X-ray diffraction result of the Zr-based metallic glass joint of this sample.
厚さ50ミクロンの試料番号4のZr65Ni10Cu5Al7.5Pd12.5を4枚重ねて4層にして10MPaの圧力を負荷し、399℃のガラス遷移温度以上の過冷却液体領域の450℃に急速に電流加熱し、5秒保持して接合を行い、急速冷却した。その断面組織では4層の金属ガラスは層間が検出されないほどきれいに接合が行われ、溶接接合欠陥は見られない。また組成の変化はなく、非晶質である。 Four layers of Zr 65 Ni 10 Cu 5 Al 7.5 Pd 12.5 with a sample number of 4 with a thickness of 50 microns are stacked in four layers and loaded with a pressure of 10 MPa, 450 ° C in the supercooled liquid region above the glass transition temperature of 399 ° C The current was rapidly heated and held for 5 seconds to perform bonding and rapidly cooled. In the cross-sectional structure, the four layers of metallic glass are joined so finely that no interlayer is detected, and no weld joint defect is observed. Moreover, there is no change in composition and it is amorphous.
図6は試料番号3(Zr55Cu30Ni5Al10)の試料2枚を用いて、摩擦攪拌接合(FSW)で接合した接合体の外観図である。この時、ツールの回転速度を500rpm、移動速度(接合速度)を50mm/min、荷重を550kgfとした。ツールはSKD61工具鋼であり、ショルダ径15mm、プローブ径5mmで左ネジが施してある。図7は、ツールの回転速度を500rpmと一定にし、移動速度を25mm/minと50mm/minに変化した場合のZr55Cu30Ni5Al10継手の接合部におけるX線回折結果を示す。二つのグラフのうち、上のグラフが移動速度を25mm/minの場合の解析結果であり、下のグラフが移動速度を50mm/minの場合の解析結果である。25mm/minの場合には、移動速度が遅すぎるため単位距離あたりの入熱量が多く、接合温度が結晶化温度(Tx)の768Kを超えてしまったため、結晶化を示すピークが存在するのに対し、50mm/minに速度を向上させ、単位距離あたりの入熱量を減少させると、温度がTx以下となり、ガラス状態を維持できることがわかる。さらに接合速度を増加させると、徐々に温度が減少するが、125mm/min以上では温度がガラス遷移温度(Tg)以下となり、塑性流動性が悪くなるためショルダが試料から浮いた状態となり、接合が不可能であった。 FIG. 6 is an external view of a joined body joined by friction stir welding (FSW) using two samples of sample number 3 (Zr 55 Cu 30 Ni 5 Al 10 ). At this time, the rotation speed of the tool was 500 rpm, the moving speed (joining speed) was 50 mm / min, and the load was 550 kgf. The tool is SKD61 tool steel, shoulder diameter is 15mm, probe diameter is 5mm and left-handed. FIG. 7 shows the X-ray diffraction results at the joint of the Zr 55 Cu 30 Ni 5 Al 10 joint when the rotation speed of the tool is kept constant at 500 rpm and the moving speed is changed between 25 mm / min and 50 mm / min. Of the two graphs, the upper graph is the analysis result when the moving speed is 25 mm / min, and the lower graph is the analysis result when the moving speed is 50 mm / min. In the case of 25 mm / min, since the moving speed is too slow, the amount of heat input per unit distance is large, and the junction temperature has exceeded the crystallization temperature (Tx) of 768 K, so there is a peak indicating crystallization. On the other hand, when the speed is increased to 50 mm / min and the heat input per unit distance is decreased, the temperature becomes Tx or less, and the glass state can be maintained. When the bonding speed is further increased, the temperature gradually decreases, but at 125 mm / min or more, the temperature becomes the glass transition temperature (Tg) or less, and the plastic fluidity deteriorates, so that the shoulder floats from the sample, and the bonding is performed. It was impossible.
図8は回転速度500rpm、接合速度50mm/min、荷重 550kgfで接合した場合の、Zr55Cu30Ni5Al10継手の接合方向に垂直な断面における、表面から0.5mm(三角で示す)、1.0mm(四角で示す)、1.5mm(丸で示す)の位置の硬さ分布である。このように、結晶化した場合の900Hvより大幅に小さく、概ね非晶質の状態を保っているものと考えられる。母材の500Hvより若干高いのは、微細に結晶化した粒子がわずかに分散しているためと考えられる。なお試料番号9(La55Al20Cu20)についても同様の結果が得られた。 8 (indicated by triangles) rotational speed 500 rpm, welding speed 50 mm / min, when joined with a load 550 kgf, in a cross section perpendicular to the joining direction of the Zr 55 Cu 30 Ni 5 Al 10 joint, 0.5 mm from the surface, 1.0 Hardness distribution at positions of mm (indicated by squares) and 1.5 mm (indicated by circles). Thus, it is thought that it is much smaller than 900Hv at the time of crystallization, and has maintained the amorphous state substantially. The reason why it is slightly higher than 500 Hv of the base material is considered to be because finely crystallized particles are slightly dispersed. Similar results were obtained for sample number 9 (La 55 Al 20 Cu 20 ).
アモルファス合金あるいは金属ガラスの超音波接合における接合阻害層の破壊は、上記アモルファス合金あるいは金属ガラスの特徴のひとつである低いヤング率のため、比較的容易に達成できる。しかし、アモルファス合金あるいは金属ガラスはガラス転移点よりも低いプロセス温度では塑性変形させることが困難であるため、接合面全域での凝着を達成するには、接合過程における局所温度や接合面の粗さの精緻な制御が不可欠となる。 The destruction of the bonding inhibition layer in the ultrasonic bonding of amorphous alloy or metallic glass can be achieved relatively easily because of the low Young's modulus, which is one of the characteristics of the amorphous alloy or metallic glass. However, since amorphous alloys or metallic glasses are difficult to be plastically deformed at a process temperature lower than the glass transition point, in order to achieve adhesion across the entire joint surface, the local temperature during the joint process and the rough surface of the joint surface are difficult to achieve. Sophisticated control is essential.
超音波接合装置の代表的な構成を図9に示す。超音波接合装置は、荷重を発生・制御する機構と、荷重をワーク接合部に印加する機構と、超音波振動を発生・制御する機構と、超音波振動をワーク接合部に伝達する機構と、ワークを把握あるいは固定する機構を最低限具備しており、ワークの材質や寸法により必要に応じて、加熱および冷却によりワークの温度を制御する機構と、接合位置を精度良く決定する位置決め機構を装着することができる。なお、本発明が適用される超音波接合装置は図9に示す形態に限定されるものではなく、上述の構成条件を満足する装置全てを包含する。 A typical configuration of the ultrasonic bonding apparatus is shown in FIG. The ultrasonic bonding apparatus includes a mechanism for generating / controlling a load, a mechanism for applying a load to the workpiece bonding portion, a mechanism for generating / controlling ultrasonic vibration, a mechanism for transmitting ultrasonic vibration to the workpiece bonding portion, It is equipped with at least a mechanism for grasping or fixing the workpiece, and it is equipped with a mechanism for controlling the temperature of the workpiece by heating and cooling and a positioning mechanism for accurately determining the joining position according to the material and dimensions of the workpiece. can do. Note that the ultrasonic bonding apparatus to which the present invention is applied is not limited to the embodiment shown in FIG. 9, but includes all apparatuses that satisfy the above-described configuration conditions.
図10は試料番号3のZr55Cu30Ni5Al10金属ガラス薄帯の急冷ロール接触面どうしを超音波周波数75 kHz、超音波出力7.25 W、超音波印加時間600 ms、予熱なしの条件にて接合した界面の断面光学顕微鏡組織である。図11は、室温で超音波接合された金属ガラスZr55Cu30Ni5Al10の接合界面のX線回折パターン(a)と金属ガラスZr55Cu30Ni5Al10のX線回折パターン(b)の比較である。 Figure 10 shows the conditions of Zr 55 Cu 30 Ni 5 Al 10 thin ribbon ribbon contact surface of sample number 3 with ultrasonic frequency of 75 kHz, ultrasonic power of 7.25 W, ultrasonic application time of 600 ms, and no preheating. 2 is a cross-sectional optical microscopic structure of a bonded interface. FIG. 11 shows the X-ray diffraction pattern (a) of the bonding interface of metallic glass Zr 55 Cu 30 Ni 5 Al 10 ultrasonically bonded at room temperature and the X-ray diffraction pattern (b) of metallic glass Zr 55 Cu 30 Ni 5 Al 10. ) Comparison.
予熱なしでは金属ガラスの塑性変形を十分に誘起することができないため、接合は部分的にしか生じていない。しかし、図11の微小領域X線回折パターンに示すように、この接合は母材である金属ガラスの非晶質構造を全く損なうことなく達成されている。これは、室温での超音波接合が金属ガラスの仮組み技術として好適であることを意味している。仮組みは接合における寸法精度を決定づける工程であるので、金属ガラスの特性に影響を及ぼさないで仮組みを達成する技術は重要である。 Since the plastic deformation of the metallic glass cannot be sufficiently induced without preheating, the joining occurs only partially. However, as shown in the micro-region X-ray diffraction pattern of FIG. 11, this bonding is achieved without any loss of the amorphous structure of the metallic glass as the base material. This means that ultrasonic bonding at room temperature is suitable as a temporary assembly technique for metallic glass. Since the temporary assembly is a process that determines the dimensional accuracy in joining, a technique for achieving the temporary assembly without affecting the characteristics of the metallic glass is important.
なお、試料番号2の試料Ni39.8Nb26.5Zr28.4H5.2も水素が入った金属ガラスであるが、接合でき、エレクトロニクス素子への期待がもたれる。試料番号8(Fe70Hf10B20)と試料番号10(Fe80Nb10B10)の組成が異なる2枚の試料片の接合も可能であった。 Sample No. 2 sample Ni 39.8 Nb 26.5 Zr 28.4 H 5.2 is also a metallic glass containing hydrogen, but it can be joined and expected for an electronic device. Two sample pieces having different compositions of sample number 8 (Fe 70 Hf 10 B 20 ) and sample number 10 (Fe 80 Nb 10 B 10 ) could be joined.
図12は表中の番号5の試料(Pd40Cu30Ni10P20)を蝋材としてCu試験片(φ6mm、長さ20mm)を923Kで1分保持した後平均冷却速度30K/秒で急冷して拡散接合したときの温度履歴である。接合部に厚み1mmの石英スペーサーを挿入することで金属ガラス蝋は約1mmの厚みを持って接合される。図13はCuをPd40Cu30Ni10P20で蝋接した接合体の微小部X線回折パターン(スポット径φ50μm)である。3つあるグラフのうち、上から、母材部分、金属ガラス蝋部分(中心から400μm)、金属ガラス蝋部分(中心)の結果を示している。尚、金属ガラス蝋は非晶質状態で母材と接合した。 FIG. 12 shows a sample No. 5 (Pd 40 Cu 30 Ni 10 P 20 ) in the table as a brazing material and a Cu test piece (φ6 mm, length 20 mm) is held at 923 K for 1 minute and then rapidly cooled at an average cooling rate of 30 K / sec. The temperature history when diffusion bonding is performed. By inserting a 1 mm thick quartz spacer into the joint, the metallic glass wax is joined with a thickness of about 1 mm. FIG. 13 is a micro X-ray diffraction pattern (spot diameter φ50 μm) of a joined body in which Cu is brazed with Pd 40 Cu 30 Ni 10 P 20 . Among the three graphs, the results of the base material part, the metal glass wax part (400 μm from the center), and the metal glass wax part (center) are shown from the top. The metallic glass wax was joined to the base material in an amorphous state.
図14は試料番号5(Pd40Cu30Ni10P20)のPd基金属ガラス試料2枚の間にSn-3.0Ag-0.5Cu鉛フリー半田を使用し、250℃、1分間、窒素雰囲気下で加熱した試料断面の光学顕微鏡写真の結果である。金属ガラス界面は結晶化することなく接合している。なお試料番号6(Pd42.5Cu30Ni7.5P20)の場合も同様の結果が得られた。 Figure 14 shows the use of Sn-3.0Ag-0.5Cu lead-free solder between two Pd-based metallic glass samples of sample number 5 (Pd 40 Cu 30 Ni 10 P 20 ) at 250 ° C for 1 minute in a nitrogen atmosphere. It is the result of the optical micrograph of the sample cross section heated by. The metallic glass interface is bonded without crystallizing. Similar results were obtained for sample number 6 (Pd 42.5 Cu 30 Ni 7.5 P 20 ).
接合体の結果を表2にまとめる。試料番号1(Ni53Nb20Ti10Zr8Co6Cu3)、試料番号2(Ni53Nb20Ti10Zr8Co6Cu3)、試料番号3(Zr55Cu30Ni5Al10)の接合体は接合部分が完全非晶質であり、引張強度も母材強度と同等値を示した。 The results of the joined body are summarized in Table 2. Sample number 1 (Ni 53 Nb 20 Ti 10 Zr 8 Co 6 Cu 3 ), sample number 2 (Ni 53 Nb 20 Ti 10 Zr 8 Co 6 Cu 3 ), sample number 3 (Zr 55 Cu 30 Ni 5 Al 10 ) The joined part was completely amorphous at the joined part, and the tensile strength was equivalent to the base material strength.
以下は、各種接合体の結果を示した表である。
本発明は、実施例1−6で詳述したように、小型・大型で複雑形状を有する構造用及び機能性部材を作ることが可能となった。 As described in detail in Example 1-6, the present invention makes it possible to produce structural and functional members that are small, large, and have complicated shapes.
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