JP2008205672A - Piezoelectric device and electronic component module - Google Patents

Abstract

The present invention provides a piezoelectric device that enables reliable inspection and an electronic component module that is formed using the inspected piezoelectric device so that components are not wasted.
A piezoelectric device package having a terminal portion 44 having a protruding conductor portion 43 formed by accommodating a piezoelectric vibrating piece 13 inside and a conductor protruding from a terminal exposed on a bottom surface, and a surface of a substrate 25 And an electrode terminal 53 formed on the same side of the substrate as the mounting surface of the integrated circuit and connected to the integrated circuit, and connected to the integrated circuit 26 mounted on the substrate. A terminal 53 is connected to the terminal portion 44 of the package.
[Selection] Figure 1

Description

  The present invention relates to an improvement in an electronic component module formed by connecting a piezoelectric device in which a piezoelectric vibrating piece is housed and a substrate on which an integrated circuit is mounted to such a package.

Piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators in small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems Is widely used.
For example, in an electronic component module such as a piezoelectric oscillator, a piezoelectric vibrating piece and an integrated circuit connected to the piezoelectric vibrating piece are required. For example, a cavity serving as a storage space is formed above and below, and the front side of the substrate serving as a boundary between them is formed. There is known a configuration in which a piezoelectric vibrating piece is mounted and an electronic component such as an integrated circuit is mounted on the back side and sealed (see Patent Document 1, FIG. 13a).

However, with such a configuration, if there is a defect in one component of the piezoelectric vibrating piece and the integrated circuit, there is a disadvantage that the whole becomes a defective product.
Therefore, it is conceivable that a piezoelectric vibrator using a piezoelectric vibrating piece and an integrated circuit are separately formed, inspected in advance, and non-defective products are combined.
That is, as shown in FIG. 14 of Patent Document 1, the piezoelectric vibrator (the storage container 1322) and an electronic component such as an integrated circuit (the storage container 1324) are connected in the vertical direction.

WO01 / 58007

However, among such storage containers, for example, a piezoelectric vibrator, which is a piezoelectric oscillator, has an electrode serving as a mounting terminal exposed on the bottom surface thereof, and a driving voltage is applied by bringing a contact pin into contact with the mounting terminal. This is applied and the operation of the piezoelectric vibrator is inspected.
Here, FIG. 10 is an explanatory view showing a part of the piezoelectric vibrator 1 with its bottom face facing up.
In this piezoelectric vibrator 1, the electrode formed as the mounting terminal 2 has a normal form, and its thickness is extremely thin.

In addition, since the piezoelectric vibrator 1 as a whole is extremely miniaturized, there are the following inconveniences in performing the inspection as described above.
That is, when the contact pin to be brought into contact with the mounting terminal 2 of the piezoelectric vibrator 1 becomes relatively thick and large due to the miniaturization of the piezoelectric vibrator 1, the contact pin is slightly tilted and is slightly exaggerated in FIG. As shown, the mounting terminal 2 may not come into contact.
That is, there is a problem that reliable inspection becomes difficult.

  The present invention has been made to solve the above-described problems, and is formed by using a piezoelectric device that enables reliable inspection and a piezoelectric device that has been inspected, so that no electronic parts are wasted. An object is to provide a component module.

According to the first aspect of the present invention, the piezoelectric device includes a terminal portion having a protruding conductor portion formed by housing a piezoelectric vibrating piece in an insulating package and protruding a conductor from a terminal on the bottom surface of the package. Is achieved.
According to the configuration of the first invention, since the terminal portion exposed on the bottom surface of the package, that is, the mounting terminal includes the protruding conductor portion, when the inspection is performed using the thick contact pin, the contact pin is somewhat Even if it is tilted, it can be reliably brought into contact with the terminal portion and can be inspected reliably.

According to a second aspect of the present invention, there is provided a piezoelectric device comprising: a terminal portion having a protruding conductor portion formed by projecting a conductor to a terminal exposed on the bottom surface while accommodating a piezoelectric vibrating piece therein. And an electrode terminal connected to the integrated circuit and connected to the integrated circuit mounted on the surface of the substrate, and formed on the same surface of the substrate as the mounting surface of the integrated circuit. The electrode terminal is achieved by an electronic component module connected to the terminal portion of the piezoelectric device.
According to the configuration of the second invention, since the terminal portion exposed on the bottom surface of the package of the piezoelectric device, that is, the mounting terminal has the protruding conductor portion, when the inspection is performed using the thick contact pin, the contact portion is provided. Even if the pin is slightly inclined, it can be reliably brought into contact with the terminal portion and can be inspected reliably. Then, a piezoelectric oscillator can be formed without waste of components by selecting a non-defective product determined by the inspection result and connecting the substrate on which the integrated circuit is mounted. In this case, since the protruding conductor portion formed on the package side is connected to the electrode terminal of the substrate, a space can be formed between the package and the substrate by the protruding conductor portion. And can accommodate an integrated circuit mounted on the substrate.
In the present invention, an “electronic component module” refers to a device in which a piezoelectric device and an integrated circuit mounted on a substrate are connected. Therefore, depending on the contents of the integrated circuit, those that become a real-time clock, a gyro sensor, and the like are widely included. If the integrated circuit includes an oscillation circuit, it becomes a “piezoelectric oscillator”.

A third invention is characterized in that, in the configuration of the second invention, the protruding conductor portion is formed by multilayer plating.
According to the structure of 3rd invention, the protrusion amount of a protrusion conductor part can be adjusted with the degree of lamination | stacking by forming a protrusion conductor part by multilayer plating.

According to a fourth invention, in the configuration of the second invention, the protruding conductor portion is formed by a metal bump.
According to the configuration of the fourth invention, by forming the protruding conductor portion by the metal bump, the protruding conductor portion can be easily formed by using a flip chip bonding technique and equipment.

According to a fifth aspect of the present invention, in any one of the third and fourth aspects of the invention, the substrate and the piezoelectric device are joined by applying solder to the electrode terminals of the substrate.
According to the structure of 5th invention, the said package and the said board | substrate can be joined reliably using a solder reflow process.

According to a sixth aspect of the present invention, in the configuration of the third or fourth aspect of the present invention, a conductor protrusion is formed by multilayer plating or metal bumps as the electrode terminal of the substrate, and the substrate-side conductor protrusion and the package side The present invention is characterized in that it is configured to connect a laminated plating or a metal bump which is a conductor protruding portion.
According to the configuration of the sixth invention, the same method can be used to form the protruding conductor portions on the piezoelectric device side and / or the substrate side, and different methods can be introduced in accordance with the respective processes. It is convenient because it can be adjusted to the actual situation at the manufacturing site.

According to a seventh aspect of the present invention, in the configuration of the fifth aspect of the present invention, a conductor protruding portion by multilayer plating is formed as an electrode terminal of the substrate, and the substrate side conductor protruding portion and the multilayer plating which is the conductor protruding portion on the piezoelectric device side And are connected by adding solder.
According to the configuration of the seventh invention, both the protruding conductor part on the substrate side and the protruding conductor part on the piezoelectric device side are formed by multilayer plating, so that the protruding amount of the protruding conductor part depends on the degree of lamination. Can be adjusted. In addition, the piezoelectric device and the substrate can be reliably bonded using a solder reflow process.

1 and 2 show a first embodiment of an electronic component module according to the present invention. FIG. 1 is a schematic cross-sectional view thereof, and FIG. 2 is a diagram of a piezoelectric device (piezoelectric vibrator) portion as a part thereof. It is a schematic bottom view.
In the figure, an electronic component module 30 constitutes, for example, a piezoelectric oscillator, and is formed by connecting a substrate 25 on which an integrated circuit 26 is mounted to a piezoelectric vibrator 10 as a piezoelectric device. Therefore, in the following description of the embodiment, the electronic component module 10 is referred to as “piezoelectric oscillator 10”. This is the same in other embodiments.
First, the piezoelectric vibrator 10 will be described. The piezoelectric vibrator 10 is formed by housing a piezoelectric vibrating piece 13 in an insulating package 11 and sealing it with a lid 12. The package 11 is formed by, for example, laminating a plurality of substrates each formed so as to provide an accommodation space S1 using an aluminum oxide ceramic green sheet as an insulating material, and then sintering.

In other words, in this embodiment, the inner material of some of the laminated substrates is removed to form a rectangular box, and the internal space S1 accommodates the piezoelectric vibrating reed 13. It is a space. An electrode part 23 is formed on a ceramic substrate constituting the bottom of the package 11, for example, a conductive adhesive 28 is applied, and the vicinity of the base end of the piezoelectric vibrating piece 13 is placed thereon and heated. Thus, the conductive adhesive 28 is cured and bonded.
Here, in this embodiment, a box-shaped package is formed to accommodate the piezoelectric vibrating piece 13. For example, a single ceramic substrate is prepared as an insulating base, An electrode portion is formed on the substrate, the piezoelectric vibrating piece 13 is bonded, and a thin box-shaped lid or lid is covered and sealed to form a package for accommodating the piezoelectric vibrating piece 13 as a whole. You may do it.

In the vicinity of the left end portion in the figure in the internal space S1 of the package 11, for example, an electrode portion 24 formed on the tungsten metallized 21 with a nickel plating 22 and a gold plating 23 on the substrate that is exposed to the internal space S1 and constitutes the inner bottom portion. Is provided. Actually, one pair is provided at each end in the width direction of the package 11.
The electrode portion 24 is connected to a mounting terminal 44 as a terminal portion exposed to the outside on the bottom surface of the package 11 by a conductive through hole 21 a provided in the package 11. The vibration piece 13 is supplied.

  The piezoelectric vibrating piece 13 is formed of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to quartz. In the case of this embodiment, the piezoelectric vibrating piece 13 may be, for example, a quartz vibrating piece formed by cutting a crystal into a rectangle or a tuning-fork type quartz vibrating piece.

As shown in FIG. 2, mounting terminals as terminal portions are provided at the four corners of the package 11, respectively, one pair is connected to the piezoelectric vibrating piece 13, and the other pair passes through the outer surface or the inner surface of the package 11 and the lid body 12. To be a ground terminal.
In this embodiment, the mounting terminal 44 as a terminal portion has a protruding conductor portion 43 as shown in FIG.
Specifically, the protruding conductor portion 43 is formed by multilayer plating. For example, a tungsten paste 41 is provided on the outer surface of the four corners at the bottom of the package 11 by applying a conductive paste by screen printing, for example. The surface is provided by applying nickel plating 42 and further forming a thick nickel layer on the surface.
Preferably, the thickness of the protruding conductor portion 43 is larger than the thickness dimension of the integrated circuit 26.
Thereby, a space S <b> 2 is formed between the package 11 and the substrate 25, and the space S <b> 2 can be used as a housing space for the integrated circuit 26.

The substrate 25 is formed of, for example, a relatively flexible polyimide substrate, a hard glass epoxy substrate, a ceramic substrate, or the like, and an integrated circuit 26 to be combined with the piezoelectric vibrator 10 is mounted on the surface thereof by die bonding or the like. Wire bonding is performed by bonding wires 28 and 28 to electrode portions 27 and 27 formed on the surface of the substrate 25.
Here, the integrated circuit 26 includes an oscillation circuit (not shown), so that the piezoelectric oscillator as a whole is formed in this embodiment. However, the integrated circuit is not limited to this.
That is, the integrated circuit 26 that does not include an oscillation circuit is configured not as a piezoelectric oscillator, but as a real-time clock or a gyro sensor, for example, even in the same electronic component module.
Electrode terminals 53 and 53 are formed on the same surface of the substrate 25 as the surface on which the integrated circuit 26 is mounted. The electrode terminals 53 and 53 are electrically connected to mounting terminals 56 and 56 formed on the bottom surface of the substrate 25 by means (not shown) such as conductive through holes.

Here, the electrode terminal 53 of the board | substrate 25 has the nickel layer 52 formed by apply | coating nickel paste by screen printing on the copper layer 51 formed by apply | coating copper paste by screen printing on the board | substrate surface, for example. A gold layer 45 is formed thereon by plating, the gold are brought into contact with each other, and, for example, an ultrasonic wave is applied to be bonded by heating. This coupling may be a solder connection.
Note that the piezoelectric oscillator 30 can be completed by filling the connected substrate 25 portion with an insulating and airtight sealing resin so as to enter the accommodation space S2 with the mounting terminals 56 exposed. .

  The present embodiment is configured as described above. In the piezoelectric vibrator 10 as a piezoelectric device, the terminal portion 44 exposed on the bottom surface of the package 11, that is, the mounting terminal includes the protruding conductor portion 43. Therefore, when an inspection is performed using a thick contact pin, even if the contact pin is slightly inclined, the contact can be reliably brought into contact with the terminal portion 44, and the inspection can be reliably performed.

Moreover, when the substrate 25 is combined with the piezoelectric vibrator 10 as described above as the piezoelectric oscillator 30, the following effects are exhibited.
That is, as described above, since the portion of the piezoelectric vibrator 10 can be surely inspected, by selecting a non-defective product based on the inspection result and connecting the substrate 25 on which the integrated circuit 26 is mounted. The piezoelectric oscillator 30 can be formed without wasting parts. In this case, since the protruding conductor 43 formed on the package 11 side is connected to the electrode terminal 53 of the substrate 25, the protruding conductor 43 can form a space S2 between the package 11 and the substrate 25. The integrated circuit 26 mounted on the substrate 25 can be accommodated in this space.

FIG. 3 is a schematic sectional view showing a first modification of the piezoelectric oscillator of FIG. 1, and FIG. In these modified examples, the portions denoted by the same reference numerals as those of the piezoelectric oscillator in FIG. 1 have a common configuration, and therefore, a duplicate description will be omitted, and the following description will focus on differences.
3, the piezoelectric oscillator 10-1 of Modification 1 is the same as the piezoelectric oscillator of FIG. 1 except that the configuration of the protruding conductor portion 43-1 formed on the terminal portion 44-1 is different. .
In this case, the protruding conductor part 43-1 of the terminal part 44-1 is formed, for example, by applying a conductive paste such as a tungsten paste with a dispenser or the like in a dome shape or a hemispherical shape. A gold layer 45 is formed on the surface by plating or the like.
By doing in this way, the protrusion conductor part 43-1 protruded spherically can be formed, and it can make it easy to contact | abut with a board | substrate side electrode terminal (not shown).

The piezoelectric oscillator 10-2 of the modified example 2 shown in FIG. 4 is the same as the piezoelectric oscillator of FIG. 1 except that the configuration of the protruding conductor portion 43-5 formed in the terminal portion 44-2 is different. .
In this case, the protruding conductor part 43-5 of the terminal part 44-2 is plated a plurality of times, such as a plating part 43-2, a plating part 43-3, and a plating part 43-4, so that a plurality of layers are plated. A laminate is formed. By doing in this way, the protrusion amount of the protrusion conductor part 43-5 can be adjusted easily.

FIGS. 5 to 9 are schematic cross-sectional views showing other embodiments of the piezoelectric oscillator. In these embodiments, the same reference numerals as those of the piezoelectric oscillator in FIG. The description to be omitted will be omitted, and the following description will focus on the differences.
FIG. 5 shows a second embodiment of the piezoelectric oscillator.
In this embodiment, the electrode terminal 53-1 of the substrate 25 on which the integrated circuit 26 is mounted is formed by a metal bump, for example, a gold bump, and protrudes upward at a predetermined height.

As in the case of FIG. 1, the terminal 44 on the piezoelectric vibrator 10 side is obtained by forming a protruding conductor portion 43 by gold plating on the surface of a plating portion (tungsten metallized 41 and nickel plating 42).
The piezoelectric vibrator 10 is obtained by superimposing the protruding conductor portions 43 and 43 on the electrode terminal 53-1 of the gold bump, and applying ultrasonic waves thereto and heat-sealing.
According to such a configuration, since the metal bumps are stacked on the protruding conductor portion 53-1, the height dimension of the accommodation space S2 can be made larger than that in the case of FIG.
Moreover, it can join only by applying an ultrasonic wave and a soldering process is unnecessary.

FIG. 6 shows a third embodiment of the piezoelectric oscillator.
This embodiment is almost the same as the embodiment of FIG. 1 except that a solder paste is applied on the electrode terminal 53 of the substrate 25, the protruding conductor portion 43 of the piezoelectric vibrator is placed, and a reflow process is performed. , Solder 57 is used for joining.
In this case, as compared with FIG. 1, since the solder is used, the joining is ensured.

FIG. 7 shows a fourth embodiment of the piezoelectric oscillator.
The electrode terminals 53-2 and 53-2 of the substrate 25 are formed of protruding conductors formed by plating. The electrode terminal as the protruding conductor can be formed by the same method as that of the protruding conductor portion 43 of FIG.
On the other hand, the terminal portion on the piezoelectric vibrator 10 side is formed by a protruding conductor portion 43-6 made of metal bumps. As a result, the protruding conductor portions 43-6 and 43-6 of the piezoelectric vibrator 10 were superposed on the gold-plated electrode terminals 53-2 and 53-2, and ultrasonic waves were applied thereto and heat-sealed. Is.
According to such a configuration, since the metal bumps 43-6 are superimposed on the electrode terminals 53-2, the height dimension of the accommodation space S2 can be made larger than in the case of FIG.
Moreover, it can join only by applying an ultrasonic wave and a soldering process is unnecessary.

FIG. 8 shows a fifth embodiment of the piezoelectric oscillator.
In this embodiment, as in the case of FIG. 1, the protruding conductor portion 43 is formed on the surface of the plating portion (tungsten metallized 41 and nickel plating 42) by gold plating at the terminal portion of the piezoelectric vibrator 10. The electrode terminals of the substrate 25 have the same structure, and the electrode terminals 53-2 and 53-2 of the substrate 25 are formed of protruding conductors formed by plating.
The protruding conductors 43 and 43 of the piezoelectric vibrator 10 are overlapped on the electrode terminals 53-2 and 53-2 of the substrate 25 and joined by applying ultrasonic waves.
According to such a configuration, since the protruding conductor portion 43 is overlaid on the electrode terminal 53-2 by gold plating, the height dimension of the accommodation space S2 can be made larger than in the case of FIG.
Moreover, it can join only by applying an ultrasonic wave and a soldering process is unnecessary.

FIG. 9 shows a sixth embodiment of the piezoelectric oscillator.
In this embodiment, as in the case of FIG. 1, the protruding conductor portion 43 is formed on the surface of the plating portion (tungsten metallized 41 and nickel plating 42) by gold plating at the terminal portion of the piezoelectric vibrator 10. The electrode terminals of the substrate 25 have the same structure, and the electrode terminals 53-2 and 53-2 of the substrate 25 are formed of protruding conductors formed by plating.
8 is different from the case of FIG. 8 in that a solder paste is applied on the electrode terminals 53-2 and 53-2 of the substrate 25, the projecting conductor portion 43 of the piezoelectric vibrator is placed, and a reflow process is performed, whereby the solder 57 is obtained. It joins with.
According to such a configuration, since the protruding conductor portion 43 is overlaid on the electrode terminal 53-2 by gold plating, the height dimension of the accommodation space S2 can be made larger than in the case of FIG.
Moreover, since solder is used, joining is ensured.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention is applicable to all piezoelectric devices regardless of the names of piezoelectric vibrators, piezoelectric oscillators, etc., as long as they are covered with a package or a box-shaped lid and accommodate a piezoelectric vibrating piece inside. Can be applied to.
In the present invention, the “electronic component module” refers to a device in which a piezoelectric device and an integrated circuit mounted on a substrate are connected. Accordingly, the contents of the integrated circuit broadly include a real-time clock or a gyro sensor.

1 is a schematic cross-sectional view showing a first embodiment of an electronic component module of the present invention. The schematic bottom view of the piezoelectric vibrator which is a component of the electronic component module of FIG. Modification 1 of the terminal part of the piezoelectric vibrator which is a component of the electronic component module of FIG. Modification 2 of the terminal portion of the piezoelectric vibrator, which is a component of the electronic component module of FIG. The schematic sectional drawing which shows 2nd Embodiment of the electronic component module of this invention. The schematic sectional drawing which shows 3rd Embodiment of the electronic component module of this invention. The schematic sectional drawing which shows 4th Embodiment of the electronic component module of this invention. FIG. 9 is a schematic cross-sectional view showing a fifth embodiment of the electronic component module of the present invention. The schematic sectional drawing which shows 6th Embodiment of the electronic component module of this invention. The figure explaining an example of the problem of the conventional piezoelectric device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Electronic component module (piezoelectric oscillator), 11 ... Package, 13 ... Piezoelectric vibrating piece, 25 ... Substrate, 26 ... Integrated circuit, 30 ... Piezoelectric oscillator, 44 ... Terminal part (mounting terminal), 43 ... Projecting conductor part, 53 ... Electrode terminal

Claims (7)

  A piezoelectric device comprising: a terminal portion having a projecting conductor portion formed by housing a piezoelectric vibrating piece in an insulating package and projecting a conductor from a terminal on the bottom surface of the package. A piezoelectric device including a terminal part having a protruding conductor part formed by projecting a conductor to a terminal exposed on the bottom surface while accommodating a piezoelectric vibrating piece inside,
And connected to an integrated circuit mounted on the surface of the substrate, and formed on the same side of the substrate as the integrated circuit mounting surface, and electrode terminals connected to the integrated circuit,
The electronic component module, wherein the electrode terminal of the substrate is connected to the terminal portion of the piezoelectric device.   The electronic component module according to claim 2, wherein the protruding conductor portion is formed by multilayer plating.   The electronic component module according to claim 2, wherein the protruding conductor portion is formed of a metal bump.   5. The electronic component module according to claim 3, wherein solder is applied to the electrode terminals of the substrate to join the substrate and the piezoelectric device.   Conductive protrusions are formed by multilayer plating or metal bumps as electrode terminals of the substrate, and the substrate side conductor protrusions are connected to the multilayer plating or metal bumps that are conductor protrusions on the piezoelectric device side. The electronic component module according to claim 3, wherein:   A conductor protruding portion by multilayer plating is formed as an electrode terminal of the substrate, and the substrate-side conductor protruding portion is connected to the multilayer plating which is the conductor protruding portion on the piezoelectric device side by adding solder. The electronic component module according to claim 5.

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