JP2008203368A - Wiring connection structure of display panel, display device, and sealing processing method and sealing processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring connection structure of a display panel whose frame is made narrow. <P>SOLUTION: An FPC 23 is connected to an external connection terminal array portion 27 provided on an outer peripheral portion of a plasma display panel 17 so that its tip end edge faces on the outside of the plasma display panel 17 from the inside of the plasma display panel 17, and arranged not to protrude by the plasma display panel 17. Consequently, a front portion (an edge portion of an opening portion 22) 31a of a side frame 31 disposed in a vertical direction among frames constituting a housing 21 is set narrower in width (joint width) than a conventional technique. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a display panel wiring connection structure, a display device, a sealing processing method, and a sealing processing device.

Generally, a plasma display device including a plasma display panel (hereinafter also referred to as PDP (Plasma Display Panel)) as a main part has no flickering and a display contrast ratio compared to a CRT (Cathode Ray Tube) display or a liquid crystal display device. Has a large size, can be made thin and large, has a high response speed, and has recently been used as a display for information processing equipment.
This plasma display device is a display that displays by taking out visible light by irradiating the phosphor with ultraviolet rays generated by the discharge, and the electrode is covered with a dielectric material according to the operation method, and the state of AC discharge indirectly It is roughly divided into an AC type that is operated in a DC state and a DC type that is operated in a state of direct current discharge with an electrode exposed to a discharge space. In particular, the AC type has a relatively simple structure as described above. Since such a large screen can be easily realized, it is widely used.
A plasma display panel constituting the main part of such an AC type plasma display device is arranged so that a front substrate and a rear substrate made of a transparent material such as glass are opposed to each other, and generates plasma between both substrates. A discharge gas space is formed and is schematically configured.

  In the plasma display panel of the AC type, in the plasma display panel, on the inner surface of the front substrate which is one of the pair of substrates as described above for forming discharge cells (hereinafter also referred to as cells), A row electrode composed of a scan electrode and a sustain electrode (common electrode) is arranged in parallel along the horizontal direction, and along the vertical direction so as to be orthogonal to the row electrode on the inner surface of the rear substrate, which is the other substrate. A three-electrode surface discharge type configuration in which column electrodes composed of data electrodes (address electrodes) are arranged can suppress the influence of high energy ions generated during surface discharge performed on the front substrate, thus extending the life. Is the most widely adopted.

This three-electrode surface discharge type AC plasma display device performs a write discharge for selecting a discharge cell to be displayed (light emission) between a data electrode on the back substrate and a scan electrode on the front substrate, A sustain discharge (display discharge) is generated by the surface discharge of the selected cell between the scan electrode and the sustain electrode of the front substrate.
Further, in such a plasma display panel, red, green, and blue phosphor layers are disposed on the inner surface of the back substrate, and red are disposed at positions facing the phosphor layers on the inner surface of the front substrate, Each of the green and blue color filter layers is arranged. The phosphors of these colors emit light by ultraviolet rays generated by the discharge in the cell, thereby enabling multicolor light emission.
As shown in FIG. 1, the plasma display panel 2 constituting the main part of the plasma display device 1 is disposed so that the front substrate 3 and the rear substrate 4 face each other. A discharge gas space is formed between the two and is schematically configured.

In the plasma display panel 2, the front substrate 3 and the rear substrate 4 face each other with a gap of about 100 μm, and the extension direction (row direction) of the electrode pair and the extension direction (column direction) of the address electrode are It is arranged so that it is orthogonal to each other and a discharge gas space is formed between both substrates, and its peripheral part is hermetically sealed by frit glass made of, for example, low-melting glass as a sealing agent. Made to wear.
That is, after the frit glass is applied to the peripheral portion of the back substrate 4, the front substrate 3 and the back substrate 4 are bonded together, and the firing process is performed at a temperature of 300 ° C. to 500 ° C. at which the low melting point glass is softened. The frit glass is melted and the front substrate 3 and the back substrate 4 are joined and sealed to form a panel. Here, discharge cells are defined by the barrier ribs.

Thereafter, for example, an FPC (Flexible Printed Circuit) 6 as a flexible printed circuit is provided on the external connection terminal array portion 5 formed on the peripheral portion of the plasma display panel 2 in which the front substrate 3 and the rear substrate 4 are combined. Then, a wiring connection process for connecting the driving circuit board 8 to the plasma display panel 2 is performed by crimping through an anisotropic conductive film (ACF) 7 (see FIG. 4). .
In addition, the anisotropic conductive film 7 shows electroconductivity along a crimping | compression-bonding direction (thickness direction) by crimping | compression-bonding, for example, shows electrical insulation between crimping | compression-bonding parts along a length direction.

As shown in FIG. 1, the FPC 6 is arranged in a curved state outward. Further, a clearance (for example, about 10 mm) for preventing the generation of vibration noise is secured between the FPC 6 and the frame 11 constituting the housing.
That is, the length (the distance between the edge of the front substrate 3 and the top of the curved FPC 6) da of the overhanging portion of the plasma display panel 2 of the FPC 6 and the distance between the frame 11 and the FPC 6 as the clearance (the top of the FPC 6) And the distance (db) between the inner surface of the side surface of the frame 11 and the inner surface of the frame 11.
Therefore, the joint width (frame width) dc of the front surface portion of the frame 11 covers the peripheral portion of the plasma display panel 2 including the external connection terminal array portion 5, and ensures the length da and the separation db. Is set to a predetermined width.

In the wiring connection process, first, the FPC 6 to which the ACF 7 is attached is supplied from the side of the plasma display panel 2 (from the left side in the figure) as shown in FIGS.
Next, the FPC 6 is temporarily fixed to the external connection terminal array portion 5 of the plasma display panel 2 through the ACF 7 in an aligned state so that the electrode terminals 5a and the corresponding electrode terminals 6a are in contact with each other.
Next, as shown in FIG. 4, the FPC 6 is crimped and connected to the external connection terminal array portion 5 of the plasma display panel 2 using the upper crimping head 13 and the lower crimping head 14.

That is, the external connection terminal array portion 5 that connects the FPC 6 at the peripheral portion of the plasma display panel 2 includes the pressing surface 13a of the upper pressing head 13 and the pressing surface 14a of the lower pressing head 14 disposed to face the pressing surface 13a. The FPC 6 is temporarily fixed to the external connection terminal array portion 5 of the plasma display panel 2 via the ACF piece 7 in a state where the lower pressure bonding head 14 is pressed from below. Then, the upper pressure-bonding head 13 is heated and pressurized for a certain time with a predetermined pressing force and temperature from above (see, for example, Patent Document 1 and Patent Document 2).
Next, as shown in FIG. 2B, a sealing resin 16 is dropped from the nozzle 15 between one end of the FPC 6 connected to the external connection terminal array unit 5 and the end of the back substrate 4. Then supply and seal.
Next, the FPC 6 is bent and the other end is connected to the drive circuit board 8 by thermocompression bonding or using a connector or the like.

According to such a wiring connection method, in addition to the peripheral portion of the plasma display panel 2 and the separation db between the frame 11 and the FPC 6 as a clearance, the length da of the projecting portion of the FPC 6 is ensured at the front surface of the frame 11. As a result, the joint width of the front portion of the frame 11 becomes wide.
That is, the size of the housing becomes unnecessarily large, and the screen size becomes relatively small with respect to the entire size on the front side.
For this reason, the technique which arrange | positions FPC so that the curvature in the curved part may become as large as possible is proposed (for example, refer patent document 3 etc.).
JP-A-8-255568 Japanese Patent Laid-Open No. 11-154460 JP 2006-78622 A

The problem to be solved is that in the above prior art, even if the FPC is arranged so that the curvature at its curved portion is as large as possible, the FPC is still curved and protrudes to the side of the plasma display panel. Therefore, the joint width of the front part of the frame is still widened.
A problem to be solved by the present invention is, for example, a problem that occurs when the conventional wiring connection method as described above is used in response to the narrow frame of the plasma display panel.

  In order to solve the above problems, the invention according to claim 1 is a matrix driving type display panel in which a large number of pixels are two-dimensionally arranged, and is arranged on the back side of the display panel to drive the display panel. A display circuit wiring connection structure in which a driving circuit board on which a driving circuit is mounted is electrically connected via a flexible wiring board. The flexible wiring board has a leading edge at the display panel. One end of the display panel is connected to a panel side connection terminal array provided on the peripheral edge of the back surface of the display panel, and the other end is provided on the side of the drive circuit board. It is connected to the connection terminal array section.

  According to a seventh aspect of the present invention, there is provided a display device comprising the display panel wiring connection structure according to any one of the first to fifth aspects.

  According to a ninth aspect of the present invention, a matrix driving type display panel in which a large number of pixels are two-dimensionally arranged, and a driving circuit that is disposed on the back side of the display panel and drives the display panel are mounted. A flexible wiring board for electrically connecting a driving circuit board and a method for sealing a connection portion between the display panel and a leading edge thereof facing outward of the display panel In the aspect, the flexible wiring board is bent so that the other end side of the flexible wiring board connected to the panel side connection terminal array part provided on the peripheral edge of the back surface of the display panel is lifted Thus, a sealing agent supplying step of supplying a sealing agent is provided between the front surface of the bent portion of the flexible wiring board and the back surface of the display panel.

  According to an eleventh aspect of the present invention, a matrix drive type display panel in which a large number of pixels are two-dimensionally arranged, and a drive circuit that is arranged on the back side of the display panel and drives the display panel are mounted. A flexible wiring board for electrically connecting a driving circuit board and a sealing processing device for sealing a connection portion between the display panel and a leading edge of the flexible printed circuit board outside the display panel The flexible wiring board is arranged so that the other end side of the flexible wiring board connected to the panel-side connection terminal array part provided on the peripheral edge of the back surface of the display panel is lifted up in a manner facing the direction. In a bent state, a sealing agent supplying means for supplying a sealing agent is provided between the surface of the bent portion of the flexible wiring board and the back surface of the display panel.

Hereinafter, preferred embodiments of the present invention will be described in detail.
The wiring connection structure of the first embodiment includes a matrix drive type display panel in which a large number of pixels are two-dimensionally arranged, and a drive circuit that is disposed on the back side of the display panel and drives the display panel. The drive circuit board is electrically connected via a flexible wiring board, and the wiring connection structure of the display panel, wherein the flexible wiring board has a tip edge facing outward of the display panel, One end is connected to a panel-side connection terminal array provided at the peripheral edge of the display panel, and the other end is connected to a substrate-side connection terminal array provided on the drive circuit board.

  In this wiring connection structure, the flexible wiring board is configured such that the end edge thereof faces the outside of the display panel and one end thereof is connected to the panel-side connection terminal array provided at the peripheral edge of the display panel. At the same time, since the other end is connected to the board side connection terminal array provided on the drive circuit board, there is no overhanging portion of the flexible wiring board to the side of the display panel, and the display panel has a flexible wiring board. The space occupied by things other than the display panel can be reduced.

  The sealing processing method according to the second embodiment includes a matrix drive type display panel in which a large number of pixels are two-dimensionally arranged, and a drive circuit that is disposed on the back side of the display panel and drives the display panel. A method for sealing a connecting portion between a flexible wiring board for electrically connecting a driving circuit board and a display panel, the tip edge of which is directed outward of the display panel With the flexible wiring board bent, the flexible wiring board is bent so that the other end side of the flexible wiring board connected to the panel side connection terminal array part provided at the peripheral edge of the back surface of the display panel is lifted. A sealing agent supplying step for supplying a sealing agent is provided between the surface of the bent portion of the plate and the back surface of the display panel.

  Further, the sealing processing apparatus of this embodiment is mounted with a matrix drive type display panel in which a large number of pixels are two-dimensionally arranged, and a drive circuit that is arranged on the back side of the display panel and drives the display panel. A sealing device for sealing a connecting portion between a flexible wiring board for electrically connecting a driving circuit board and a display panel, the tip edge of which is outside the display panel In a state in which the flexible wiring board is bent so that the other end side of the flexible wiring board connected to the panel side connection terminal array part provided at the peripheral edge of the back surface of the display panel is lifted. A sealing agent supplying means for supplying a sealing agent is provided between the surface of the bent portion of the flexible wiring board and the back surface of the display panel.

  By carrying out the sealing processing method using this sealing processing apparatus, the end edge of the flexible wiring board faces the outside of the display panel, and one end is provided on the peripheral edge of the back surface of the display panel. When the flexible wiring board is bent so that the other end side of the flexible wiring board can be lifted even when it is connected to the panel side connection terminal array part, the surface of the bent part of the flexible wiring board and the back surface of the display panel Since the sealing agent is supplied between the two, the connection site between the flexible wiring board and the display panel can be reliably and smoothly sealed.

  FIG. 5 is a cross-sectional view showing the configuration of the main part of the plasma display device according to the first embodiment of the present invention, FIG. 6 is a block diagram showing the configuration of the plasma display device, and FIG. FIG. 8 is a process diagram for explaining a manufacturing method of the plasma display panel, and FIG. 9 is a wiring connection for connecting an FPC to the plasma display panel. FIG. 10 is a block diagram showing a configuration of a wiring connection device used for carrying out the wiring connection method, and FIGS. 11 to 16 are diagrams for explaining the wiring connection method. It is explanatory drawing of.

  As shown in FIGS. 5 and 6, the plasma display device (planar display device) 16 of this example includes a PDP module 18 including a plasma display panel 17 and an analog video signal received and connected to the PDP module 18. An analog interface (hereinafter referred to as an analog IF) 19 that converts the signal into a digital video signal and supplies it to the PDP module 18 is housed in a housing 21 and is schematically configured.

The plasma display panel 17 is arranged so that the front surface is exposed from the opening 22 of the housing 21, and the plasma display panel 17 is driven via an FPC (Flexible Printed Circuit) 23 as a flexible printed circuit. The circuit board is connected to, for example, a scanning driver 24, a high voltage pulse circuit 25, and a data driver 26.
In this example, the FPC 23 is connected to the external connection terminal array portion 27 provided on the peripheral edge of the plasma display panel 17 in such a manner that the leading edge thereof faces the outside of the plasma display panel 17 from the inside of the plasma display panel 17. They are connected (see FIG. 12).

That is, as shown in FIG. 5, the wiring connection structure 28 of this example has one end so that the entire plasma display panel 17 is arranged along the wiring path inside (back side) of the plasma display panel 17. This part is connected to the external connection terminal array part 27 and connected to, for example, a scan driver 24 as a circuit board via an FPC 23 arranged so as not to protrude to the outside (side) of the plasma display panel 17. It is roughly structured.
Here, the intermediate portion of the FPC 23 is linearly arranged so as to be inclined toward the plasma display panel 17 side.
Similarly, the connection between the plasma display panel 17 and the high voltage pulse circuit 25 is made through the FPC 23 arranged so as not to protrude from the outside (side) of the plasma display panel 17.

Thereby, the front part (edge part of the opening part 22) 31a of the side frame 31 arrange | positioned along the orthogonal | vertical direction among the frames (frame body) which comprises the housing | casing 21 is the width (joint width). However, it is set narrower than the prior art (the frame is narrowed).
Further, in the side surface portion 31 b of the side frame 31, the rear side portion 31 p corresponding to the intermediate portion of the FPC 23 is formed so as to be inclined along the wiring path of the FPC 23 and is disposed on the side of the plasma display panel 17. The front portion 31q has a width (depth) that is approximately the same as the thickness of the plasma display panel 17 and is thinned.
Such narrowing and thinning are achieved in the side frames 31 on both sides.

In the plasma display panel 17, the front substrate 38 and the back substrate 39 are overlapped so that the peripheral edge of the side portion of the front substrate 38 is exposed, and the external connection terminal array unit 27 is the back surface where the front substrate 38 is exposed. For example, the external connection terminal array portion (substrate-side connection terminal array portion) of the scanning driver 24 is formed on the back side (rear side).
Correspondingly, in the FPC 23, the electrode terminal at one end connected to the external connection terminal array portion 27 of the plasma display panel 17 and the electrode at the other end connected to the external connection terminal array portion of the scan driver 24, for example. The terminals are formed on the same side (front side).

As shown in FIG. 6, the PDP module 18 includes a panel unit 33, a digital signal processing / control circuit 34, and an in-module power supply circuit 35 incorporating a D / D converter.
The panel unit 33 includes a plasma display panel 17, a scan driver 24 that drives the scan electrodes, a data driver 26 that drives the data electrodes, and a high-voltage pulse circuit 25 that supplies a pulse voltage to the plasma display panel 17 and the scan driver 24. The power recovery circuit 36 recovers surplus power from the high-voltage pulse circuit 25.

The plasma display panel 17 is configured as a matrix drive type display panel in which a large number (for example, 1365 × 768) of pixels are two-dimensionally arranged.
As shown in FIG. 7, the plasma display panel 17 is arranged so that a front substrate 38 and a rear substrate 39 face each other, and a discharge gas space is formed between the front substrate 38 and the rear substrate 39. It is configured.

  The front substrate 38 includes a front glass substrate 42 made of a transparent material such as glass, and a transparent electrode made of tin oxide, ITO (Indium Tin Oxide), or the like formed on the inner surface of the front glass substrate 42 in parallel along the row direction. 43a, 44a and the transparent electrodes 43a, 44a, the scan electrodes 43 and the sustain electrodes 44 having bus electrodes 43b, 44b made of Al, Cu, Ag or the like for reducing the resistance value, respectively, and the scan electrodes 43 And a transparent dielectric layer 45 made of a low melting point glass such as PbO (lead oxide) covering the sustain electrode 44, and secondary electron emission to protect the transparent dielectric layer 45 from discharge generated during operation. And a protective film 46 made of MgO (magnesium oxide) or the like having a large coefficient and excellent sputtering resistance.

The back substrate 39 includes a back glass substrate 47 made of a transparent material such as glass, and an address electrode 48 made of Al, Cu, Ag, etc. formed in parallel to each other along the column direction on the inner surface of the back glass substrate 47. The white dielectric layer 49 covering the address electrode 48 and a discharge gas such as He (helium), Ne (neon), and Xe (xenon) are filled alone or mixed to secure the discharge gas space. Generated by discharge of a discharge gas disposed at the bottom or side of a discharge cell defined by the barrier rib 51, and a barrier rib 51 made of a low melting point glass or the like formed along the vertical direction to separate individual discharge cells And a phosphor layer 52 that is separately applied to each of red, green, and blue phosphor layers that convert ultraviolet rays to visible light.
Here, the phosphor layer 52 includes red, green, and blue phosphor layers 52r, 52g, and 52b. Of the phosphor material, as the red phosphor, (Y, Gd) BO: Eu, (Y, Gd) BO 3: Eu, as the green phosphor, Zn ₂ SiO _4: Mn, as a blue phosphor, BaMgAl ₁₀ O ₁₇ : Eu is used.

In the plasma display panel 17, the extension direction (row direction) of the electrode pair and the extension direction (column direction) of the address electrode 48 are set with the front substrate 38 and the rear substrate 39 facing each other with a gap of about 100 μm. So that the discharge gas space is formed between the two substrates, and the peripheral portion thereof is made of, for example, frit glass made of low-melting glass as a sealing agent. Manufactured in an airtight manner.
That is, after the frit glass is applied to the peripheral portion of the back substrate 39, the front substrate 38 and the back substrate 39 are bonded together, and the baking process is performed at a temperature of 300 ° C. to 500 ° C. at which the low melting point glass is softened. The frit glass is melted and the front substrate 38 and the back substrate 39 are bonded and sealed to form a panel. Here, discharge cells are defined by the barrier ribs 51.

In the plasma display panel 17, when the scan driver 24 controls the scan electrode 43 and the data driver 26 controls the address electrode 48, lighting or non-lighting of a predetermined pixel among these pixels is controlled, and a desired display is performed. Display is performed.
As shown in FIG. 6, the digital signal processing / control circuit 34 includes an input IF signal processing circuit 54, a frame memory 55, a memory control circuit 56, and a driver control circuit 57.

For example, the average luminance level of the video signal input to the input IF signal processing circuit 54 is calculated by an input signal average luminance level calculation circuit (not shown) in the input IF signal processing circuit 54 and output as, for example, 5-bit data. Is done. Further, the PLE control circuit 65 sets PLE control data according to the average luminance level and inputs it to a luminance level control circuit (not shown) in the input IF signal processing circuit 54.
The logic power supply supplies the logic power to the digital signal processing / control circuit 34 and the panel unit 33. The in-module power supply circuit 35 is supplied with DC power from the display power supply, converts the voltage of the DC power into a predetermined voltage, and then supplies the voltage to the panel unit 33.

The analog IF 19 includes a Y / C separation circuit 58 having a chroma decoder, an A / D conversion circuit 59, a synchronization signal control circuit 61 having a PLL circuit, an image format conversion circuit 62, and an inverse γ (gamma) conversion circuit. 63, a system control circuit 64, and a PLE control circuit 65.
Schematically, the analog IF 19 converts the received analog video signal into a digital video signal, and then supplies the digital video signal to the PDP module 18. For example, an analog video signal transmitted from a TV tuner is decomposed into RGB luminance signals in a Y / C separation circuit 58 and then converted into a digital video signal in an A / D conversion circuit 59.

When the pixel configuration of the PDP module 18 and the pixel configuration of the video signal are different, the image format conversion circuit 62 performs necessary image format conversion. The display luminance characteristic with respect to the input signal of the plasma display panel 17 is linearly proportional, but a normal video signal is corrected in advance (gamma-converted) in accordance with the CRT characteristic.
For this reason, after the A / D conversion circuit 59 performs A / D conversion of the video signal, the inverse γ conversion circuit 63 performs inverse γ conversion on the video signal to restore the linear characteristics. Is generated. This digital video signal is output to the PDP module 18 as an RGB video signal.

Since the analog video signal does not include the sampling clock and data clock signal for A / D conversion, the PLL circuit built in the synchronization signal control circuit 61 generates a horizontal synchronization signal supplied simultaneously with the analog video signal. As a reference, a sampling clock and a data clock signal are generated and output to the PDP module 18.
The PLE control circuit 65 of the analog IF 19 performs brightness control. Specifically, when the average luminance level is less than or equal to a predetermined value, the display luminance is increased, and when the average luminance level exceeds a predetermined value, the display luminance is decreased. The system control circuit 64 outputs various control signals to the PDP module 18.

Next, a method for manufacturing the plasma display device 16 of this example will be described with reference to FIGS.
The manufacturing method of the plasma display panel 17 will be described. First, as shown in FIG. 7, transparent electrodes 43a and 44a are formed in parallel along the horizontal direction H on the inner surface of the front glass substrate 42 (step SA11 (FIG. 8)).
Next, bus electrodes 43b and 44b for reducing the resistance value are formed on the transparent electrodes 43a and 44a (on the lower surface side in FIG. 8) along the horizontal direction (step SA12).

Thus, the scan electrode 43 and the sustain electrode 44 are formed from the transparent electrodes 43a and 44a and the bus electrodes 43b and 44b.
Next, a transparent dielectric layer 45 that covers the scan electrode 43 and the sustain electrode 44 is formed (step SA13).
Next, a protective film 46 for protecting the transparent dielectric layer 45 from discharge is formed (step SA14). Thus, the front substrate 38 is completed.

On the other hand, as shown in FIG. 7, in order to manufacture the back substrate 39, address electrodes 48 are formed in parallel along the vertical direction on the top surface of the back glass substrate 47 (step SB11 (FIG. 8)).
Next, a white dielectric layer 49 that covers the address electrode 48 is formed (step SB12).
Next, on the white dielectric layer 49, stripe-shaped barrier ribs 51 defining discharge cells are formed in order to limit the movement of charges and prevent erroneous lighting (step SB13).

Next, the phosphor layer 52 is formed between the partition walls 51 and 51 (step SB14). The phosphor layer 52 includes red, green, and blue phosphor layers 52r, 52g, and 52b.
Next, a sealing agent is applied to the peripheral portion of the back glass substrate 47, and this is baked to complete the back substrate 39 (step SB15).

Next, with the front substrate 38 and the rear substrate 39 facing each other with a gap of about 100 μm, the extension direction (row direction) of the electrode pair and the extension direction (column direction) of the address electrodes 48 are orthogonal to each other. As shown in FIG. 8, the discharge gas space is formed between the two substrates so that the discharge gas space is formed (step SC16 (FIG. 8)), and the peripheral edge thereof is hermetically sealed with, for example, a sealant made of frit glass. Wear (step SC17).
That is, after applying a sealant to the peripheral portion of the back substrate 39, the front substrate 38 and the back substrate 39 are bonded to each other and subjected to a baking process to melt the frit glass. Join to form a panel. Here, discharge cells are defined by the barrier ribs 51.

Next, the panel-like front substrate 38 and rear substrate 39 thus sealed are introduced into the heating furnace, and a discharge gas is formed between the front substrate 38 and the rear substrate 39 through the vent pipe. A vacuum is heated while exhausting the discharge gas space in connection with the space, and a discharge gas composed of a mixed rare gas containing, for example, He (helium), Ne (neon), or Xe (xenon) is discharged into the discharge gas space. After introducing and filling at a predetermined pressure, the vent pipe is chipped on by overheating, and the open end is closed (step SC18). In this way, the discharge gas is filled in the discharge gas space.
Next, a discharge is generated in the discharge cell and continued for a certain period of time, thereby stabilizing the discharge.
In this way, the discharge gas space is filled with the discharge gas, and the plasma display panel 17 is completed.

Next, a wiring connection method for connecting the FPC 23 to the plasma display panel 17 will be described.
The wiring connection method of this example includes an FPC supply process (step SD11 (FIG. 9)), an FPC temporary fixing process (step SD12), an FPC pressure bonding process (step SD13), and a sealing performed using the wiring connection device 67. Stop process (step SD14).
As shown in FIGS. 10 and 11, the wiring connection device 67 can adjust the length of the plasma display panel 17 formed by combining the front substrate 38 and the rear substrate 39 with the suction pad Ma made of an elastic body. A main pressure bonding unit having a substrate stage 68 supported in a horizontal state and a heater for heating and pressurizing the FPC 23 stacked on the external connection terminal array unit 27 of the plasma display panel 17 from below through the holding pins Mb. A head 69, a backup head 71 that is disposed opposite to the main pressure-bonding head 69 via the plasma display panel 17, and pressurizes and presses a facing area facing the pressure-sensitive area of the plasma display panel 17 by the main pressure-bonding head 69; The presser head 72 for pressing the FPC 23 in a positioned state, and the presser head 72 A support head 73 that is disposed so as to oppose the display panel 17 and sandwiches the plasma display panel 17 in which the FPC 23 is disposed together with the presser head 72, a stage moving unit 74 that moves the substrate stage 68 along a horizontal plane, and the FPC 23 that is plasma. FPC supply unit 75 for supplying from the inside of the display panel 17, and head actuators 76, 77, for moving the main pressure bonding head 69, the backup head 71, the presser head 72, and the support head 73 along the vertical direction, respectively. 78 and 79, and a controller 81 for controlling each component.
Note that the main crimping head 69, the backup head 71, the presser head 72, and the support head 73 have at least tip portions made of an elastic body such as synthetic resin or rubber.

The stage moving unit 74 is configured such that the substrate stage 68 on which the plasma display panel 17 is placed is, for example, the width direction of the main crimping head 69 and the backup head 71 (electrode terminals when the plasma display panel 17 is disposed between both heads). The plasma display panel 17 is disposed in the thickness direction of the main pressure-bonding head 69 and the backup head 71 orthogonal to the width direction (the two in both directions). And a horizontal direction moving part that moves along the length direction of the electrode terminal in the case of being performed.
The head actuators 76, 77, 78, 79 have an air cylinder and an electromagnetic valve for introducing air for raising and lowering, respectively, a main pressure bonding head 69, a backup head 71, a presser head 72, and The support head 73 is moved along the vertical direction.

  As shown in FIG. 10, the controller 81 includes a main control unit 82 having a CPU (central processing unit) and the like, and a storage unit 83 for storing processing programs executed by the main control unit 82, various data, and the like. The operation unit 84, the display unit 85, the motor drive unit 86 for controlling and driving the motors constituting the stage moving unit 74 and the FPC supply unit 75, and the electromagnetics constituting the head actuators 76, 77, 78, and 79. It is constituted by an information processing device such as a computer provided with an electromagnetic valve control unit 87 for controlling the valve and a heater control unit 88 for controlling the heater constituting the main crimping head 69.

The main control unit 82 executes various processing programs stored in the storage unit 83, controls various components using various registers and flags secured in the storage unit 83, and executes motor drive control processing and the like.
Further, the main control unit 82 is configured so that the backup head 71 is pushed into the peripheral edge of the plasma display panel 17 from above a predetermined pushing amount, and the backup head 71 holds the plasma display panel 17 in a state where the backup head 71 is pushed. The electromagnetic valve control unit 87 and the heater control unit 88 are controlled so that the main crimping head 69 is heated and pressurized with a predetermined pressing force for a certain time from below with respect to the FPC 23 temporarily fixed to the external connection terminal array unit 27. .

The storage unit 83 includes an internal storage device and an external storage device, and stores a program storage area in which various processing programs such as a motor drive control processing program executed by the control unit 82 are stored, and information in which various types of information are stored. And a storage area.
The internal storage device includes a semiconductor memory such as a ROM or a RAM. The external storage device includes an FD driver to which an FD (flexible disk) is mounted, an HD driver to which an HD (hard disk) is mounted, an MO disk driver to which an MO (magneto-optical) disk is mounted, or a CD (compact disk). A disc / ROM driver, a CD-R (Recordable), a CD-RW (ReWritable), a DVD (Digital Video Disc) -ROM, a DVD-R, a DVD-RW and the like are mounted.

The main control unit 82 controls the FPC supply unit 75 via the motor driving unit 86, and as shown in FIGS. 11 and 12, the main control unit 82 moves the FPC 23 from the central portion side to the side of the back surface of the plasma display panel 17. Then, the FPC supply process is performed (step SD11 (FIG. 9)).
Next, the main control unit 82 controls the head actuators 78 and 79 via the electromagnetic valve control unit 87, and the FPC 23 is positioned on the external connection terminal array unit 27 of the plasma display panel 17 as shown in FIG. In a state where the electrode terminal 27a and the corresponding electrode terminal 23a are in contact with each other, the plasma display panel 17 on which the FPC 23 is disposed is sandwiched between the pressing head 72 and the support head 73, and the FPC 23 is pressed while being bent. FPC temporary fixing process for temporarily fixing the FPC 23 through the ACF is performed (step SD12).

  Next, the main control unit 82 controls the head actuators 76 and 77 via the electromagnetic valve control unit 87, and controls the heater of the main crimping head 69 via the heater control unit 88, as shown in FIG. As shown, an external connection terminal array portion 27 for connecting the FPC 23 at the peripheral portion of the plasma display panel 17 includes a pressing surface 69a of the main crimping head 69 and a pressing surface 71a of the backup head 71 disposed opposite to the pressing surface 69a. The main pressure-bonding head 69 is pushed into the peripheral edge of the plasma display panel 17 from below the predetermined push amount, and the backup head 71 is pushed from above to cause the plasma display panel 17 to be pushed from above. For the FPC 23 temporarily fixed to the external connection terminal array portion 27 of the display panel 17 via the ACF, And a fixed time heating and was pressurized with a predetermined pressure and temperature in the main compression bonding head 69 from the side, implementing FPC bonding step (step SD13).

Next, as shown in FIG. 15, the main control unit 82 arranges the nozzle 89 of the dispenser between one end of the FPC 23 connected to the external connection terminal array unit 27 and the end of the back substrate 39. With the other end of the FPC 23 lifted and bent at a predetermined bending angle (for example, approximately 60 degrees), the sealing resin S is dropped and supplied from the nozzle 89, as shown in FIG. Sealing is performed and a sealing process is performed (step SD14).
Here, the stress applied to the FPC 23 is smaller when the bending angle is smaller. Further, when the bending angle is 90 degrees or more, the merit to the configuration of the prior art as shown in FIG. 1 is lost. Therefore, it is desirable that the bending angle be less than 90 degrees.
The nozzle 89 is inserted from obliquely above. Further, as the sealing resin S, for example, a silicone resin is used.

Thereafter, the FPC 23 is crimped and connected to the scanning driver 24. Thus, as shown in FIG. 5, the connection between the plasma display panel 17 and the scan driver 24 via the FPC 23 is completed.
Further, the connection between the plasma display panel 17 and the high voltage pulse circuit 25 through the FPC is performed in the same manner.
In this example, the plasma display panel 17 and the data driver 26 are connected using a conventional method.
Further, the power recovery circuit 36 is connected to the plasma display panel 17 to form the panel unit 33. On the other hand, a digital signal processing / control circuit 34 is formed separately from the panel unit 33.

The panel part 33 and the digital signal processing / control circuit 34 thus formed are assembled as one module to form the PDP module 18. Further, an analog IF 19 is formed separately from the PDP module 18.
Thus, after forming the analog IF 19 separately from the PDP module 18, the plasma display device 16 is completed by electrically connecting both.

As described above, according to the configuration of this example, the FPC 23 is connected to the external connection terminal array portion 27 provided at the peripheral portion of the plasma display panel 17 from the inner side of the plasma display panel 17 with the leading edge thereof being the plasma display panel 17. Are connected so that they do not protrude from the sides of the plasma display panel 17. Of the sizes as a plasma display panel with FPC, other than the plasma display panel 17 The space occupied by the object can be reduced, and it is not necessary to secure the space of the protruding portion to the outside of the FPC unlike the prior art, and the joint width of the front surface portion 31a of the frame can be reduced. That is, a narrow frame can be achieved.
Therefore, the screen size can be made relatively large with respect to the entire size on the front side, and the size of the housing can be prevented from becoming unnecessarily large as in the prior art.

  Further, for example, a scanning driver 24 as a circuit board for driving the plasma display panel 17 is arranged near the center of the back side of the plasma display panel 17, and an intermediate portion of the FPC 23 is linearly inclined toward the plasma display panel 17 side. Therefore, the side surface portion of the frame can also be formed so as to incline toward the back side along the intermediate portion of the FPC, and the front side portion (the edge portion of the side surface portion of the frame). ) Can be shortened, and a thin feeling can be obtained.

Further, since the FPC 23 is arranged without being bent inward and outward, the length thereof can be set relatively short.
Moreover, as FPC23, the electrode terminal of the one end part connected to the plasma display panel 17 and the electrode terminal of the other end part connected to the scanning driver 24 as a circuit board are formed in the same side relatively. Since an FPC having a simple configuration can be used, cost can be reduced.

  Further, even when the FPC 23 is connected to the external connection terminal array portion 27 of the plasma display panel 17 in a mode in which the front end edge thereof faces the outside of the plasma display panel 17, the one end portion of the FPC 23 is Between the surface of the bent portion of the FPC 23 and the back surface of the plasma display panel 17 in a state in which the FPC 23 is bent so that the other end side of the FPC 23 is lifted by pressing between the presser head 72 and the support head 73. Since 89 is inserted and the sealing resin S is supplied, the connecting portion between the FPC 23 and the plasma display panel 17 can be reliably and smoothly sealed.

  Further, by making the plasma display device 16 modular, it becomes possible to manufacture the plasma display device 16 independently of other components constituting the plasma display device 16. For example, the plasma display device 16 breaks down. In such a case, it is possible to simplify and speed up the repair by replacing every PDP module 18.

FIG. 17 is a perspective view showing the configuration of the plasma display panel of the plasma display apparatus according to the second embodiment of the present invention. FIG. 18 is a diagram for explaining the configuration of the front substrate of the plasma display panel. It is explanatory drawing of.
This example is greatly different from the first embodiment described above in that it is applied to the connection between the plasma display panel and the data driver in addition to the connection between the plasma display panel and the scan driver and the high voltage pulse circuit.
Since the other configuration is substantially the same as the configuration of the first embodiment described above, the same reference numerals as those used in FIG. 7 are used in FIG. 17 for the same components as those of the first embodiment. A description thereof will be simplified.

  In the plasma display device of this example, as shown in FIG. 17, in addition to the connection between the plasma display panel 17A, the scan driver 24, and the high voltage pulse circuit 25, the connection between the plasma display panel 17A and the data driver 26 also allows the FPC 23 Is connected to the external connection terminal array sections 93 and 94 provided on the peripheral edge of the plasma display panel 17A from the inside of the plasma display panel 17A in such a manner that the leading edge thereof faces the outside of the plasma display panel 17A. The plasma display panel 17A is arranged so as not to protrude from the side and above and below.

In the plasma display panel 17A of this example, as shown in FIG. 17, the front substrate 91 and the rear substrate 92 are overlapped so that the peripheral portion on the rear side (rear side) of the front substrate 91 is exposed over the entire circumference. Out of the peripheral portion, external connection terminal array portions 93 for connecting the scanning driver 24 are formed on both sides, and external connection terminal array portions 94 for connecting the data driver 26 are formed on the upper and lower portions.
Further, for example, the external connection terminal array portion (substrate side connection terminal array portion) of the scanning driver 24 and the data driver 26 is formed on the back side (rear side).

On the front substrate 91, as shown in FIG. 18, a pair of scan electrodes 95 and sustain electrodes 96, and address electrodes (data electrodes) 97 are formed together.
That is, the front substrate 91 includes a front glass substrate, a pair of scan electrodes 95 and sustain electrodes 96 formed along the horizontal direction (row direction) H on the inner surface of the front glass substrate, and the scan electrodes 95 and sustain electrodes 96. A dielectric layer covering the dielectric layer, an address electrode main body portion 97a formed along the vertical direction (column direction) V on the back side of the dielectric layer, and an address electrode discharge portion 97b formed along the row direction, And a dielectric layer covering the address electrode body 97a.

Here, a reset discharge (address discharge) is performed between the address electrode discharge portion 97b and the scan electrode 95 (sustain electrode 96).
In the discharge space, discharge cells 98 are formed corresponding to regions surrounded by scan electrodes 95 and sustain electrodes 96 and adjacent address electrode body portions 97a and 97a.
The back substrate 92 includes a back glass substrate, barrier ribs formed on the inner surface of the back glass substrate along the vertical direction V, and a phosphor layer.

Thus, according to the configuration of this example, the same effects as those of the first embodiment can be obtained.
Further, in addition to the connection between the plasma display panel 17A and the scanning driver 24 and the high voltage pulse circuit 25, the FPC 23 is provided at the peripheral portion of the plasma display panel 17A in the connection between the plasma display panel 17A and the data driver 26. Connected to the external connection terminal array portion 94 from the inside of the plasma display panel 17A in such a manner that the leading edge thereof faces the outside of the plasma display panel 17A, to the side of the plasma display panel 17A, above and below Since it is arranged so that it does not protrude, in addition to the front part of the side frame arranged along the vertical direction among the frames (frame body) constituting the casing, the front part of the upper and lower frames In this case, the frame can be narrowed.
Therefore, the screen size can be further increased relative to the overall size on the front side.

FIG. 19 is a block diagram showing a configuration of a liquid crystal display device according to a third example of the embodiment of the present invention.
This example is greatly different from the first embodiment described above in that the present invention is applied when a liquid crystal display device is used as a flat display device instead of a plasma display device.
Since the configuration other than this is substantially the same as the configuration of the first embodiment described above, the description thereof will be simplified.

  As shown in FIG. 19, a liquid crystal display device (flat display device) 101 of this example includes a liquid crystal display panel 102, an LCD (Liquid Crystal Display) drive circuit unit 103 for driving the liquid crystal display panel 102, and an external device. An image signal generation unit 104 that generates a corresponding image signal based on the supplied image data, and a backlight device 105 for providing illumination light to the liquid crystal display panel 102 are provided.

The liquid crystal display panel 102 is, for example, a transmissive liquid crystal display panel having a TFT structure, and is opposed to a TFT substrate on which a large number of driving TFTs and transparent pixel electrodes are formed, with a gap of several [μm]. And a counter substrate on which a colored layer (color filter) is formed, a liquid crystal layer sealed in the gap, a TFT substrate, and a pair of deflecting plates disposed outside the counter substrate. .
A number of transparent pixel electrodes are arranged in a matrix on the TFT substrate, and each scanning line for supplying scanning signals and each signal for supplying display signals are arranged around the transparent pixel electrodes so as to be orthogonal to each other. Lines are provided. The scanning signal and the display signal are each input from an external input terminal connected to an external circuit.

  The LCD drive circuit unit 103 includes, for example, a control unit 106 that has a CPU (Central Processing Unit) and performs a predetermined control function and calculation function, and a semiconductor memory such as a ROM and a RAM, and is executed by the control unit 106. A storage unit 107 for storing a processing program and various data, a data electrode driving circuit (source driver) 108 for supplying a display signal (data signal) to each signal line, and a scanning signal to each scanning line And a scan electrode driving circuit (gate driver) 109.

In the liquid crystal display device 101 of this example, an FPC is used for connection between the external input terminal portion of the liquid crystal display panel 102 and the LCD drive circuit portion 103, and this FPC is similar to the first embodiment. The liquid crystal display panel 102 is connected to an external connection terminal array provided at the peripheral edge of the liquid crystal display panel 102 from the inside of the liquid crystal display panel 102 in such a manner that the leading edge thereof faces the outside of the liquid crystal display panel 102. It is arranged so as not to protrude to the side of the.
That is, for example, the scan electrode driving circuit 109 as a circuit board is arranged near the center on the back side of the liquid crystal display panel 102, and the liquid crystal display panel 102 and the scan electrode driving circuit 109 are on the back side of the liquid crystal display panel 102. Are connected by FPCs arranged without bending inside and outside.

  Thus, according to the configuration of this example, the same effects as those of the first embodiment can be obtained.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Are also included in the present invention.
For example, in the above-described embodiment, the case of applying the plasma display device or the liquid crystal display device has been described. Generally, a flexible printed circuit is connected to a connection terminal provided on the peripheral portion of the display panel. It can be applied when connecting FPC and TPC (Tape Carrier Package).
Further, the flat display device is not limited to a plasma display device or a liquid crystal display device, and can be applied to, for example, an EL (electroluminescence) display device or an SED (surface electric field display).

In the FPC supply step, FPC bent in advance may be supplied, or may be bent after being arranged in the external connection terminal array portion.
Further, the bending angle of the FPC in the sealing step is not limited to approximately 60 °, and may be, for example, about 90 °. In this case, the sealing resin is not limited to dropping by the dispenser, and may be supplied by being ejected from the nozzle.

Further, as shown in FIG. 20, the FPC 23B may be curved inward and disposed via the back side of the plasma display panel.
Further, the plasma display panel and the scanning driver are not limited to thermocompression bonding, and may be connected using a connector.

  In the wiring connection structures of the first example and the second example of the above embodiment, the FPC that electrically connects the circuit board such as the scan driver and the high-voltage pulse circuit and the plasma display panel is the periphery of the plasma display panel. Since the front edge of the plasma display panel faces the outside of the plasma display panel from the inside of the plasma display panel, it is connected to the external connection terminal array section provided in the section. The overhanging portion is eliminated, and the space occupied by things other than the plasma display panel in the size of the plasma display panel with FPC can be reduced.

It is explanatory drawing for demonstrating a prior art, Comprising: It is sectional drawing which shows the structure of the principal part of a plasma display apparatus. It is explanatory drawing for demonstrating a prior art, Comprising: It is process drawing for demonstrating the wiring connection method for connecting FPC to the plasma display panel of the plasma display apparatus. It is explanatory drawing for demonstrating a prior art, Comprising: It is explanatory drawing for demonstrating the wiring connection method for connecting FPC to the plasma display panel. It is explanatory drawing for demonstrating a prior art, Comprising: It is explanatory drawing for demonstrating the wiring connection method for connecting FPC to the plasma display panel. It is sectional drawing which shows the structure of the principal part of the plasma display apparatus which is the 1st Example in embodiment of this invention. It is a block diagram which shows the structure of the plasma display apparatus. It is a perspective view which shows the structure of the plasma display panel of the plasma display apparatus. It is process drawing for demonstrating the manufacturing method of the plasma display panel. It is process drawing for demonstrating the wiring connection method for connecting FPC to the same plasma display panel. It is a block diagram which shows the structure of the wiring connection apparatus used in order to implement the wiring connection method. It is explanatory drawing for demonstrating the wiring connection method. It is explanatory drawing for demonstrating the wiring connection method. It is explanatory drawing for demonstrating the wiring connection method. It is explanatory drawing for demonstrating the wiring connection method. It is explanatory drawing for demonstrating the wiring connection method. It is explanatory drawing for demonstrating the wiring connection method. It is a perspective view which shows the structure of the plasma display panel of the plasma display apparatus which is the 2nd Example in embodiment of this invention. It is explanatory drawing for demonstrating the structure of the front substrate of the plasma display panel. It is a block diagram which shows the structure of the liquid crystal display device which is the 3rd Example in embodiment of this invention. It is sectional drawing which shows the structure of the principal part of the plasma display apparatus which is a modification of the 1st Example in embodiment of this invention.

Explanation of symbols

16 Plasma display device (display device)
17 Plasma display panel (display panel)
23, 23A, 23B FPC (flexible wiring board)
24,24A Scan driver (Drive circuit board)
25 High-voltage pulse circuit (drive circuit board)
27 External connection terminal array section (panel side connection terminal array section)
28 Wiring connection structure 67 Wiring connection device (sealing treatment device)
72 Presser head (wiring board presser)
89 Nozzle (sealing agent supply means)
101 Liquid crystal display device (display device)
102 Liquid crystal panel (display panel)
S resin (sealing agent)

Claims (12)

A flexible wiring includes a matrix driving type display panel in which a large number of pixels are two-dimensionally arranged, and a driving circuit board which is disposed on the back side of the display panel and on which a driving circuit for driving the display panel is mounted. It is a wiring connection structure of a display panel electrically connected through a board,
The flexible wiring board is configured such that one end of the flexible wiring board is connected to a panel-side connection terminal array portion provided on the peripheral edge of the back surface of the display panel, with the leading edge facing outward of the display panel. A wiring connection structure for a display panel, wherein the other end is connected to a substrate side connection terminal array provided on the drive circuit board.   2. The wiring connection structure for a display panel according to claim 1, wherein the substrate side connection terminal array portion is disposed so as to recede inside the display panel in a plan view with respect to the panel side connection terminal array portion. .   The flexible wiring board is wired in such a manner that the flexible wiring board gradually retreats to the inside of the display panel as it proceeds from the panel side connection terminal array portion to the substrate side connection terminal array portion. The display panel wiring connection structure according to 2.   The board-side connection terminal array portion is provided on a surface opposite to the back surface of the display panel, and the flexible wiring board is curved inwardly in the display panel in plan view. 4. The display panel wiring connection structure according to claim 1, wherein the display panel wiring connection structure is connected to the array section and the substrate side connection terminal array section.   The board-side connection terminal array portion is provided on a surface opposite to a surface opposite to the back surface of the display panel, and the flexible wiring board is bent in the vicinity of the panel-side connection terminal array portion. And it is connected with the panel side connection terminal array part and the board side connection terminal array part in the mode bent near the board side connection terminal array part. 4. A display panel wiring connection structure according to 2 or 3.   6. The display panel wiring connection structure according to claim 1, wherein the display panel comprises a plasma display panel, a liquid crystal display panel, or an electroluminescence display panel.   A display device comprising the display panel wiring connection structure according to claim 1.   The display device according to claim 7, wherein the display device is a plasma display device, a liquid crystal display device, or an electroluminescence display device. A matrix drive type display panel in which a large number of pixels are two-dimensionally arranged, and a drive circuit board disposed on the back side of the display panel and mounted with a drive circuit for driving the display panel are electrically connected. A flexible wiring board for connecting to the display panel, and a method for sealing a connection site of the display panel,
The tip edge of the flexible wiring board is connected to a panel-side connection terminal array provided on the peripheral edge of the back surface of the display panel in such a manner that the leading edge faces outward of the display panel. A sealing agent supplying step of supplying a sealing agent between the surface of the bent portion of the flexible wiring board and the back surface of the display panel in a state where the flexible wiring board is bent so as to be lifted; A sealing treatment method characterized by that.   In the sealing agent supply step, the one end portion of the flexible wiring board connected to the panel side connection terminal array portion is pressed by a pressing head, and a sealing agent is ejected or dropped from a nozzle, The sealing processing method according to claim 9, wherein the sealing agent is supplied between a front surface of the bent portion of the flexible wiring board and the back surface of the display panel. A matrix drive type display panel in which a large number of pixels are two-dimensionally arranged, and a drive circuit board disposed on the back side of the display panel and mounted with a drive circuit for driving the display panel are electrically connected. A flexible wiring board for connecting to the display panel, and a sealing treatment device for sealing a connection part of the display panel,
The tip edge of the flexible wiring board is connected to a panel-side connection terminal array provided on the peripheral edge of the back surface of the display panel in such a manner that the leading edge faces outward of the display panel. A sealing agent supplying means for supplying a sealing agent between the surface of the bent portion of the flexible wiring board and the back surface of the display panel in a state in which the flexible wiring board is bent so as to be lifted; The sealing processing apparatus characterized by becoming.   A wiring board pressing means for holding the one end of the flexible wiring board connected to the panel side connection terminal array section by a pressing head; and the sealing agent supply means, the wiring board pressing means, and the one end. In a state where the sealant is pressed by the presser head, the sealant is ejected or dropped from a nozzle, and the sealant is supplied between the front surface of the bent portion of the flexible wiring board and the back surface of the display panel. The sealing processing apparatus according to claim 11.

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