JP2008294244A - Wiring pattern connection method, wiring sheet, and wiring sheet laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform an effective and highly reliable complete connection with a simple process.
A wiring pattern connection method according to the present invention includes a wiring pattern on a wiring sheet having a wiring pattern on a front surface and a back surface of a flexible support, and a through hole provided in the flexible support. A connection method, in which a conductive material-containing solution that is dried to form a conductive portion is applied to a region including at least the peripheral portion around the through-hole portion, and each wiring pattern is connected through the formed conductive portion. There is a special feature. Therefore, the front and back wiring patterns can be electrically connected through the through-hole portion by a simple process.
[Selection] Figure 2

Description

  The present invention relates to a wiring pattern connection method, a wiring sheet, and a wiring sheet laminate, and more particularly to a wiring pattern connection method in which wiring patterns provided on the front and back surfaces are connected to each other through a through hole.

  In recent years, various devices such as a light emitting device / medium and an optical processing device / medium using fine particles / ultrafine particles have been proposed in Patent Document 1 and the like. Further, as a means for forming these various elements or a wiring pattern connecting them, a circuit pattern is directly drawn with a metal paste using an inkjet head on a substrate as in Patent Document 2 to form a fine pattern. A wiring pattern forming method and a circuit board manufacturing method have been proposed that are easy to perform, do not require waste liquid treatment, have a simple production process, and require less equipment and production costs. Further, Patent Document 3 proposes a technique for manufacturing an electron source substrate using the ink jet principle.

As described above, various proposals using the ink jet principle have begun to be made. However, the idea of manufacturing various devices or pattern wiring sheets / substrates by such means is still new, and more specific methods are described. The fact is that there are many unknown parts and they are still groping, and there are still many issues to consider. For example, in order to realize such a highly functional pattern wiring sheet / substrate, such a pattern is formed on the front and back of a sheet / substrate made of a flexible support, or such a pattern wiring sheet is used. / Realize a highly functional pattern wiring sheet / substrate or its laminate by stacking multiple boards, electrically connecting front / back or upper / lower sheets / board-like patterns, and cooperating each other's wiring patterns It is possible to plan. At that time, as means for electrically connecting each wiring pattern, for example, Patent Document 4 discloses a technique for filling a through hole formed in a substrate with copper electroless plating. Patent Document 5 suggests that various methods such as ink jet, screen printing, dispenser, impregnation, and spin coating are used as means for filling the conductive metal paste into the hole for conduction.
JP 2000-126681 A JP 2002-134878 A JP 2001-319567 A JP 2006-86194 A JP 2002-299833 A

  However, in the method using plating as described in Patent Document 4, it is necessary to put the entire substrate in a plating bath, and steps such as cleaning and drying of the substrate are necessary, and it is inevitable that the apparatus becomes large. In addition, although there is a detailed description of pattern formation in the above-mentioned Patent Document 5, the means for filling the hole for conduction is limited only to suggest the technique, and how to do it specifically. It ’s not clear yet.

  The present invention has been made in view of these problems and circumstances, and a wiring pattern connection method, a wiring sheet, and a wiring sheet laminate capable of performing effective and reliable complete connection in a simple process. The purpose is to provide.

  In order to solve the above problems, the wiring pattern of the present invention is connected to a wiring sheet having a wiring pattern on each of the front and back surfaces of the flexible support and a through hole provided in the flexible support. According to the method, a conductive material-containing solution that is dried to form a conductive portion is applied to a region including at least the peripheral portion around the through-hole portion, and each wiring pattern is connected via the formed conductive portion. There is a special feature. Therefore, the front and back wiring patterns can be electrically connected through the through-hole portion by a simple process.

  Also, a wiring formed by laminating a plurality of wiring sheets each having a wiring pattern provided on either or both of the front surface and the back surface of the flexible support and a through hole provided in the flexible support. According to the wiring pattern connection method of the present invention in the sheet laminate, the conductive material contains a conductive material that is dried to form a conductive portion in a region including at least the peripheral edge of the through-hole portion communicating with the wiring sheet at one end. It is characterized in that a solution is applied and each wiring pattern is connected through the formed conductive portion. Therefore, a desired wiring pattern to be connected to each wiring sheet can be electrically connected through the through-hole portion by a simple process.

  Furthermore, the conducting portion is formed by applying a plurality of droplets of the conductive material-containing solution to a region including at least the peripheral portion around the through-hole portion. Therefore, the conductive part is effectively formed, and the front and back wiring patterns can be electrically connected through the through hole part with a simple process.

  The conducting portion is formed by applying a droplet of the conductive material-containing solution so as to cover the through-hole portion and the peripheral portion around the through-hole portion. Therefore, the conductive part is effectively formed, and the front and back wiring patterns can be electrically connected through the through hole part with a simple process.

  Furthermore, it is preferable to form the conduction part on the front and back of the wiring sheet.

  Further, the inner wall surface of the through-hole portion is more effective and reliable because it is more easily wetted with the conductive material-containing solution than the wiring pattern forming surface of the flexible support or the surface of the wiring pattern. Connection can be made.

  Further, the inner wall surface of the through-hole portion has a surface roughness larger than that of the wiring pattern forming surface of the flexible support or the surface of the wiring pattern, so that effective and reliable complete connection is achieved. be able to.

  In addition, by using a liquid droplet ejecting head, a conductive material-containing solution is ejected onto a region including at least the peripheral edge of the through-hole portion to form a conductive portion of a dot pattern, thereby forming a wiring pattern of a minute wiring sheet. Can also be connected.

  Furthermore, by using a droplet jet head, a conductive material-containing solution is jetted onto a region covering the through-hole portion and the peripheral edge of the through-hole portion to form a conductive portion of the dot pattern. It is also possible to connect the wiring patterns.

  Moreover, the wiring sheet as another invention is formed by a wiring pattern provided on the front and back surfaces of the flexible support, a through hole provided in the flexible support, and a method of connecting the patterns. And having a conductive portion for connecting each wiring pattern. Therefore, an inexpensive and highly reliable wiring sheet can be provided.

  Furthermore, the wiring sheet laminate as another invention includes a wiring pattern provided on either or both of the front surface and the back surface of the flexible support, and a through-hole portion provided in the flexible support. A wiring sheet laminate comprising a plurality of wiring sheets having a conductive material-containing solution applied to a region including at least an edge around each through-hole portion communicated by the wiring pattern connection method. Is formed by arranging the inner wall of each through-hole portion that communicates with each other, and is characterized by having a conduction portion that connects the wiring patterns of each wiring sheet. Therefore, the desired wiring pattern used as the connection object in a some wiring sheet can be electrically connected, and the novel wiring sheet laminated body which functions effectively can be provided.

  According to the present invention, a conductive material-containing solution that is dried to form a conductive portion is applied to a region including at least the peripheral portion around the through-hole portion, and each wiring pattern is connected through the formed conductive portion. Therefore, it is possible to provide an inexpensive and highly reliable wiring sheet that can electrically connect the wiring patterns on the front and back sides with a simple process.

  FIG. 1 is a plan view showing a configuration of a wiring sheet according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. 1. The wiring sheet 10 of the present embodiment shown in both figures includes a flexible support 11 made of resin or paper, a through hole 12 formed in the flexible support 11, a wiring pattern 13 on the front surface, and a back surface. The wiring pattern 14 is included. In the present embodiment, the front and back wiring patterns 13, 14 are shown as being orthogonal to each other. Moreover, although an actual wiring sheet is composed of more complicated wiring patterns, only one simplified wiring pattern is shown here for the sake of explanation. Here, an example of a dimension is shown for reference. As shown in FIGS. 1 and 2, for example, a flexible support 11 having a thickness of 1000 μm is used, and a through hole 12 having a diameter of 300 μm is formed. A ring-shaped wiring pattern 13 having an outer diameter φ800 μm and an inner diameter φ400 μm is formed concentrically with the through-hole 12 on both the front and back surfaces of the flexible support 11 near the upper and lower edges of the through-hole 12. And a line-like wiring pattern having a line width of 300 μm. Here, the thickness of the ring-shaped or line-shaped wiring pattern is 5 μm. In FIGS. 1 and 2, the ratios are not necessarily drawn in proportion to the actual dimensions.

  Next, a flexible support for producing the wiring sheet of the present invention will be described. The material for the wiring sheet of the present invention is selected from organic materials in consideration of lightness, flexibility, and flexibility, and also in consideration of the situation of bending during use. Further, depending on the application, it is selected in consideration of at least a rigidity that does not bend due to its own weight. Specifically, various resins including polyethylene, polyester, vinyl, and sheets and polymer films made of thermosetting resins such as epoxy are used as the support. Alternatively, it is possible to use a paper or a paper-based support that is lightweight and can be bent and has a certain rigidity. These materials may be used alone as a support, or a combination of these materials may be used in order to impart appropriate rigidity or water resistance. Specifically, a composite sheet in which the resin sheet or material is incorporated on the surface or inside of paper may be used as the support.

  The wiring sheets shown in FIGS. 1 and 2 are formed by punching through holes 14 in, for example, a 1000 μm-thick paper, and wiring patterns 12 and 13 combining ring and line patterns by screen printing on the front and back sides. Formed. The pattern forming material is a silver nano paste made of silver nanoparticles having a particle diameter of 5 nm to 50 nm, a dispersant (diethanolamine), and an organic binder (thermal phenol resin). After printing, volatile components are removed by heat treatment, and a wiring pattern is obtained in which conduction is obtained in a state where the binder and silver nanoparticles are aggregated and sintered.

  In addition, what is used here is not necessarily limited to the silver nanopaste containing silver nanoparticles, but, as will be described later, gold, silver, copper, as well as the conductive part of the through-hole part formed by the liquid jet head Alternatively, a solution containing metal fine particles containing any of palladium, nickel, or conductive polymer or superconductor fine particles may be used.

  Then, as shown in FIG. 2, the droplet 15 made of the conductive fine particle-containing solution ejected and flying by the ink jet principle flies in the direction of the arrow in FIG. 2, and passes through the through hole 14 of the flexible support 11. It is designed to land near the edge 16. FIG. 3 which is an enlarged view of the edge of the through hole shows virtual dots 17 formed by landing of the droplets 15, and FIG. 4 shows a dot pattern 18 actually formed. The dot pattern 18 is missing because the solution enters a part of the through hole 14. In FIG. 5, a plurality (eight in FIG. 5) of dot patterns 18 with such droplets 15 are formed in the vicinity of the periphery of the edge 16 of the through hole 14 so as to surround the through hole 14.

  In this way, by forming the dot pattern 18 by landing the droplet 15 near the edge 16 of the through-hole 14, the dot pattern 18 covers the ring-shaped portion of the wiring pattern 12 on the surface, and the dot pattern As shown in FIG. 6A, the solution of the 18 missing portion adheres to the inner wall of the through hole 14. Thereafter, the solution adhering to the inner wall of the through-hole 14 reaches the bottom of the through-hole 14 as shown in FIG. 6B and contacts the wiring pattern 13 on the back surface. And the wiring pattern 13 on the back surface are connected by a solution adhering through the inner wall of the through hole 14, and the volatile components are removed by heating and drying at 50 ° C to 100 ° C to connect the wiring patterns 12 and 13 on the front and back sides. Completed as a conducting part.

  Next, FIG. 7 which is an enlarged view of the edge portion of the through hole shows a case where the virtual dots 17 formed by landing of the droplets 15 are very large, and FIG. 8 shows the actual formation. A dot pattern 18 is shown. As shown in FIG. 8, the dot pattern 18 is deposited and formed in a donut shape with the center removed by the through hole 14. The solution in the portion where the center is removed in a donut shape adheres to the inner wall of the through hole 14 and plays a role of connecting to the wiring pattern on the back surface. In the case of the droplet 15 that forms the large dot pattern 18 as described above, it is possible to connect to the wiring pattern on the back surface with only one droplet, but not only one droplet but also a plurality of droplets may be applied. .

  In addition, although it is an example which forms such a dot pattern from the surface of a flexible support body, such a dot pattern is similarly formed from the ring-shaped part of the wiring pattern currently formed in the back surface, both front and back By connecting and conducting from both (upper and lower sides), a more reliable and reliable conducting portion can be formed.

  Here, the solution is a liquid containing a conductive film forming component, but a dispersion liquid in which conductive fine particles (conductive nanoparticles) of 5 nm to 50 nm are dispersed in a dispersion medium together with a dispersant and an organic binder is used. For example, as the conductive fine particles, in addition to metal fine particles containing any of gold, silver, copper, palladium, and nickel, conductive polymer and superconductor fine particles are used. About these electroconductive fine particles, in order to improve dispersibility, the organic substance etc. can also be coated and used for the surface. Examples of the coating agent that coats the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid, and the like. The particle diameter of the conductive fine particles is preferably 1 nm or more and 100 nm or less. More preferably, the lower limit is set to 5 nm in consideration of the dispersion stability of the conductive fine particles, and the upper limit is set to 50 nm in consideration of avoiding clogging of the nozzle of the liquid jet head described later. The liquid dispersion medium containing conductive fine particles preferably has a vapor pressure at room temperature of 0.001 mmHg to 200 mmHg (about 0.133 Pa to 26600 Pa). This is because if the vapor pressure is higher than 200 mmHg, the dispersion medium rapidly evaporates after discharge, making it difficult to form a good film. The vapor pressure of the dispersion medium is more preferably 0.001 mmHg or more and 50 mmHg or less (about 0.133 Pa or more and 6650 Pa or less). This is because if the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying tends to occur when droplets are ejected by the droplet ejection method, and stable ejection becomes difficult. On the other hand, in the case of a dispersion medium whose vapor pressure at room temperature is lower than 0.001 mmHg, drying is slow and the dispersion medium tends to remain in the film, and a high-quality conductive film after heat and / or light treatment in the subsequent process. Is difficult to obtain. The dispersion medium to be used is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation.

  Specific examples of such a dispersion medium include water, alcohols such as methanol, ethanol, propanol, and butanol, n-heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, and dipentene. Hydrocarbon compounds such as tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxy Ether compounds such as ethane, bis (2-methoxyethyl) ether, p-dioxane, propylene carbonate, γ Butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, it may be mentioned polar compounds such as cyclohexanone.

  Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred and more preferred dispersions in terms of fine particle dispersibility, dispersion stability, and ease of application to the droplet discharge method. Examples of the medium include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more.

  The dispersoid concentration when such conductive fine particles are dispersed in the dispersion medium is preferably 1% by mass or more and 60% by mass or less, and can be adjusted according to the desired film thickness of the conductive film. If it exceeds 60% by mass, aggregation tends to occur and ejection by the liquid jet head becomes difficult.

  The surface tension of the solution containing the conductive fine particles thus adjusted is preferably in the range of 0.02 N / m or more and 0.07 N / m or less. This is because, when the solution is ejected by the liquid ejecting head, if the surface tension is less than 0.02 N / m, the wettability of the solution composition with respect to the nozzle surface increases, so that the ejection direction is likely to be bent. This is because if it exceeds 07 N / m, the shape of the meniscus at the tip of the nozzle is not stable, and it becomes difficult to control the discharge amount and the discharge timing.

  In addition, in order to adjust the surface tension, a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based solution is added to such a solution as long as the contact angle with the support (solution-adhering portion) is not unduly lowered. Trace amounts can be added. The nonionic surface tension modifier improves the wettability of the solution to the support (solution adhering portion), improves the leveling property of the film, and helps to prevent the occurrence of crushing of the coating film and the generation of itching skin.

  Such a solution may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary. The viscosity of this solution is preferably 1 mPa · s or more and 50 mPa · s or less. When discharging with a liquid ejecting head, if the viscosity is less than 1 mPa · s, the peripheral portion of the nozzle is easily contaminated by the outflow of ink, and if the viscosity is more than 50 mPa · s, the clogging frequency in the nozzle holes is high. This is because it becomes so high that it becomes difficult to discharge liquid droplets smoothly.

  In the present embodiment, a silver fine particle dispersion in which silver fine particles having a particle diameter of 10 nm are dispersed in α-terpineol is used. However, the present invention is not necessarily limited to this, and has an appropriate size as described above. These various fine particles may be prepared and used so as to have a desired surface tension in the year.

  And as a droplet discharge device which discharges the solution containing such electroconductive fine particles, (a) of FIG. 9 which is a partially cut perspective view, and BB ′ line sectional view of FIG. 9 (a) An apparatus including the liquid ejecting head 30 shown in FIG. 9B is preferably used. Here, as shown in FIG. 9A, the liquid ejecting head 30 includes, for example, a stainless steel nozzle plate 31 and a diaphragm 32, and both are joined via a partition member (reservoir plate) 33. It is. A plurality of spaces 34 and a liquid pool 35 are formed by the partition member 33 between the nozzle plate 31 and the diaphragm 32. Each space 34 and the liquid reservoir 35 are filled with a conductive fine particle-containing solution, and each space 34 and the liquid reservoir 35 communicate with each other via a supply port 36. A plurality of nozzle holes 37 for injecting the conductive fine particle-containing solution from the space 34 are formed in the nozzle plate 31 in a row. On the other hand, a hole 38 for supplying ink to the liquid reservoir 35 is formed in the vibration plate 32. Also, a piezoelectric element (piezo element) 39 is joined to the surface of the diaphragm 32 opposite to the surface facing the space 34 as shown in FIG. The piezoelectric element 39 is located between the pair of electrodes 40 and is configured to bend so that when energized, it projects outward. The diaphragm 32 to which the piezoelectric element 39 is bonded in such a configuration is bent integrally with the piezoelectric element 39 so that the volume of the space 34 is increased. It is going to increase.

  Therefore, the conductive fine particle-containing solution corresponding to the increased volume in the space 34 flows from the liquid reservoir 35 through the supply port 36. Further, when the energization to the piezoelectric element 39 is released from such a state, both the piezoelectric element 39 and the diaphragm 32 return to their original shapes. Therefore, since the space 34 also returns to its original volume, the pressure of the conductive fine particle-containing solution in the space 34 rises, and the droplet 41 of the conductive fine particle-containing solution is discharged from the nozzle hole 37 toward the substrate.

  The droplet ejection method (inkjet method) of the liquid ejecting head 30 may be any mechanism as long as the droplets can be quantitatively ejected, and in particular, an ink jet principle capable of forming droplets of about 0.1 pl to several hundreds pl. Any mechanism other than the piezo jet type using the piezoelectric element 39 may be employed. For example, the Sweet method disclosed in US Pat. No. 3,596,275, US Pat. No. 3,298,030, etc., or the thermal disclosed in Japanese Patent Publication No. 56-9429. An ink jet method may be used.

  Next, other characteristic points of the present invention will be described. As described above, in the present invention, the conductive fine particle-containing solution is connected to the front and back wiring patterns along the inner wall of the through hole. Therefore, it is necessary to make it easy for the conductive fine particle-containing solution to enter the through hole.

  Therefore, in the present invention, in consideration of this point, the inner wall of the through hole is easily wetted with the conductive fine particle-containing solution, that is, has a lyophilic property. More specifically, the region of the inner wall of the through-hole is at least from the portion of the surface of the edge of the through-hole or the surface of the wiring pattern on the surface where the droplet first adheres to form the dot pattern. However, it is easy to get wet with the conductive fine particle-containing solution, in other words, the solution is likely to move toward the inner wall of the through hole. For example, the surface portion of the edge of the through hole is the material surface of a flexible support made of resin or paper, but this portion is considerably smooth due to the manufacturing process of sheet-like resin or paper. It is formed as a flat surface. In the case of a resin sheet, the surface property is close to a mirror surface. Also in the case of paper sheets, although there are irregularities in the cellulose fibers of the paper, filler particles such as talc, clay, calcium carbonate, titanium dioxide are filled between the fibers, and the irregularities are reduced by a calendar roller. As a result, the surface has irregularities of about 2 to 3 μm. Further, the surface of the wiring pattern formed on the sheet surface also has a relatively smooth surface property following the surface property of the original sheet surface.

  In contrast to such a smooth surface texture, the inner wall of the through hole in the wiring sheet of the present invention has a rough surface texture of 5, 6 μm or more by drilling with a mechanical drill or a laser. State (surface roughness is large). The purpose is to allow the liquid to penetrate and move through the surface by capillary action using the rough state. The rough inner wall surface is a state where at least the surface of the support or the surface of the wiring pattern is more liable to allow the liquid to permeate or move, and a part of the droplet landed near the edge of the through hole. Moves quickly toward the inner wall of the rough through-hole due to capillary action.

  In these examples, by increasing the surface roughness of the inner wall surface of the through hole, the solution containing the conductive fine particles moves quickly. It is also a good method to perform sex processing. Alternatively, an oxygen-rich functional group may be formed on the resin surface by UV ozone irradiation to improve lyophilicity due to polarity. Moreover, the wettability may be improved by plasma irradiation to aim at the same effect.

  FIG. 10 is a schematic cross-sectional view showing the configuration of a wiring sheet laminate of another invention. A wiring sheet laminate 50 shown in the figure is a laminate in which a plurality (three in this example) of wiring sheets 10 are laminated. For example, after laminating three wiring sheets 10-1, 10-2, and 10-3 as shown in FIGS. 11A, 11B, and 11C, and bonding them with an insulating adhesive The through-hole 14 that communicates is formed, and then the droplet 15 of the conductive material-containing solution is landed near the edge 16 of the through-hole 14 to form a dot pattern. For example, the wiring sheet 10-1 in FIG. 11A is a wiring sheet in which the wiring pattern 12 on the surface is formed on the flexible support 11, and the wiring sheet 10-2 in FIG. 11 is a wiring sheet in which a wiring pattern 12 on the front surface and a wiring pattern 13 on the back surface are formed on the flexible support 11, and FIG. 11C shows a wiring pattern 12 on the front surface and a wiring pattern on the back surface on the flexible support 11. 13 is a wiring sheet on which 13 is formed. By laminating these, applying a conductive material-containing solution to the surface of the common through hole 14 and its inner wall, and drying, the wiring patterns on the front and back of each wiring sheet are electrically connected, and a more complicated circuit configuration, Alternatively, it is possible to realize a laminated wiring sheet laminate that realizes a larger capacity memory configuration.

  When a droplet of the conductive material-containing solution is landed near the edge of the through hole, a dot pattern is formed with a plurality of droplets around the edge of the through hole as shown in FIGS. Alternatively, one large dot pattern may be used as shown in FIGS. The through hole may be formed after laminating a plurality of wiring sheets and adhering them with an insulating adhesive, or by aligning a wiring sheet on which a through hole has been formed in advance with the through hole position. May be laminated and bonded. However, since the adhesive may enter the through hole during bonding, the former is rather preferable. Even in the case of such a laminated wiring sheet structure, the inner wall surface of the through hole should be more easily wetted with the conductive material-containing solution than the wiring pattern forming surface of each wiring sheet or the wiring pattern surface. Alternatively, it is desirable to increase the surface roughness or apply various treatments to obtain the same effect as in the case of electrically connecting the front and back wiring patterns with a single-layer wiring sheet. The same.

  Further, in the present invention, in order to establish electrical connection between the front and back wiring patterns, a description has been given of using a liquid jet head as a means for applying a conductive material-containing solution into the through hole of the wiring sheet. However, it is not necessary to limit to this, and this means can also be suitably applied as a means for forming a wiring pattern. The wiring pattern that combines the ring-shaped and line-shaped patterns shown in FIG. 1 inputs computer graphics data to the liquid ejecting head, and moves the ejecting head relative to the entire surface of the flexible support. Such a pattern can be easily formed by jetting and drawing. As the solution to be used, the aforementioned conductive material-containing solution can be applied as it is. In this way, if not only the application of the conductive material-containing solution to the through-hole part but also the formation of such a wiring pattern by the liquid ejecting head, an apparatus such as screen printing can be omitted, so a very inexpensive through-hole is provided. It is possible to realize a pattern wiring forming apparatus capable of conducting to a portion.

  The present invention is not limited to the above-described embodiments, and it goes without saying that various modifications and substitutions are possible as long as they are described within the scope of the claims.

It is a top view which shows the structure of the wiring sheet of one embodiment of this invention. FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. 1. It is an enlarged plan view of the edge part of a through hole. It is an enlarged plan view showing a dot pattern actually formed. It is an enlarged plan view showing a plurality of dot patterns actually formed. It is a schematic sectional drawing which shows a mode that the electroconductive fine particle containing solution flows through the inner wall of a through hole, and is electrically connected to the wiring pattern of front and back. It is an enlarged plan view showing a dot pattern actually formed. It is an enlarged plan view showing a dot pattern actually formed. FIG. 2 is a diagram illustrating a structure of a liquid jet head using a piezoelectric element that is preferably used in the present invention. It is a schematic sectional drawing which shows the structure of the wiring sheet laminated body of another invention. It is a schematic sectional drawing which shows each wiring sheet of the wiring sheet laminated body of FIG.

Explanation of symbols

10, 10-1, 10-2, 10-3; wiring sheet,
11; flexible support, 12, 13; wiring pattern,
14; Through hole, 15; Droplet, 16; Edge, 17; Virtual dot,
18; dot pattern, 30; liquid jet head,
50: Wiring sheet laminate.

Claims (11)

In a wiring pattern connection method in a wiring sheet having a wiring pattern on each of the front and back surfaces of the flexible support and a through-hole portion provided in the flexible support,
Applying a conductive material-containing solution that dries to form a conductive portion to a region that includes at least the peripheral portion around the through-hole portion, and connects the wiring patterns through the formed conductive portion. A characteristic wiring pattern connection method. A wiring sheet formed by laminating a plurality of wiring sheets each having a wiring pattern provided on one or both of the front and back surfaces of the flexible support and a through hole provided in the flexible support. In the connection method of the wiring pattern in the laminate,
A conductive material-containing solution that is dried to form a conductive portion is applied to a region including at least an edge portion around the through-hole portion that communicates with the wiring sheet at one end, and the conductive material-containing solution is formed through the formed conductive portion. A wiring pattern connecting method, wherein each wiring pattern is connected.   3. The wiring according to claim 1, wherein the conductive portion is formed by applying a plurality of droplets of the conductive material-containing solution to a region including at least an edge portion around the through-hole portion. Pattern connection method.   The conductive part is formed by applying a droplet of the conductive material-containing solution so as to cover the through-hole part and an edge around the through-hole part. Wiring pattern connection method.   The wiring pattern connection method according to claim 1, wherein the conductive portion is formed on the front and back of the wiring sheet.   The inner wall surface of the through-hole portion is more easily wetted with the conductive material-containing solution than the wiring pattern forming surface of the flexible support or the surface of the wiring pattern. 6. The wiring pattern connection method according to any one of 5 above.   6. The surface roughness of the inner wall surface of the through-hole portion is larger than the surface of the flexible support on which the wiring pattern is formed or the surface of the wiring pattern. The wiring pattern connection method according to Item 1.   2. The conductive portion of the dot pattern is formed by ejecting the conductive material-containing solution to a region including at least an edge around the through-hole portion using a liquid droplet ejecting head. The wiring pattern connecting method according to any one of 3 and 5.   Using the liquid droplet ejecting head, the conductive material-containing solution is ejected to a region covering the through-hole portion and an edge around the through-hole portion to form the conductive portion of the dot pattern. The wiring pattern connection method according to claim 4 or 5. A wiring pattern provided on each of the front and back surfaces of the flexible support;
A through hole provided in the flexible support;
A wiring sheet formed by the wiring pattern connection method according to claim 1, and having a conduction portion that connects the wiring patterns. A wiring sheet formed by laminating a plurality of wiring sheets each having a wiring pattern provided on one or both of the front and back surfaces of the flexible support and a through hole provided in the flexible support. In the laminate,
10. Each of the conductive material-containing solutions provided in a region including at least an edge portion around each of the through-hole portions communicated with each other by the wiring pattern connection method according to claim 2. A wiring sheet laminate, characterized in that the wiring sheet laminate is formed by arranging an inner wall of a through-hole portion and connecting the wiring pattern of each wiring sheet.

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