JP2008294009A - Method of microfabrication under controlled pressure, and microfabrication apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of microfabrication by which the adhesion of a die with a processing object (resin or the like) is inhibited, and shape loss of the pattern transferred to the processing object is prevented, and to provide a microfabrication apparatus. <P>SOLUTION: A method for microfabrication in which pressure is applied to a die 100 with a given pattern and a processing object 200 to transfer a pattern onto a surface to be shaped of the processing object 200, includes a heating step of heating the die 100 and the processing object 200 at respective given temperatures, and a pressure application step of pressing the die 100 and the processing object 200 at a pressure of 1 MPa or below after the heating step. Furthermore, there is provided the microfabrication apparatus 1 for realizing the microfabrication method. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a micromachining method and a micromachining apparatus for controlling a pressing force between a mold and a workpiece and transferring a pattern of the mold onto the workpiece.

  In order to form a fine circuit pattern typified by an LSI (Large Scale Integrated Circuit) on a semiconductor substrate (hereinafter simply referred to as a substrate), a technique called photolithography is generally used. However, this method has led to an increase in the size and cost of the apparatus as the pattern to be formed is miniaturized.

  In addition, in order to obtain a fine molding, injection molding is carried out by pouring a molten resin heated at a high speed and high pressure into a mold heated to a temperature lower than the glass transition temperature of the resin and solidifying it while controlling the pressure. Are also used. However, in this method, since the supplied resin is solidified while the mold is deprived of heat, it is difficult for the resin to enter the fine pattern of the mold, and it is difficult to form a fine shape. It is also conceivable to heat the mold and wait for the resin to enter the fine pattern, and then cool and mold the mold. However, in the injection molding, since it is necessary to pour the resin into the mold at a high pressure, a large mold that can withstand the high pressure is necessary, and as a result, the heat capacity of the mold increases, and there is a problem that it takes time for heating and cooling.

  In recent years, nanoimprinting process technology for forming ultrafine patterns on a substrate has been attracting attention as a solution to the above problems. This process is briefly described as follows.

  First, a mold in which a pattern to be formed is formed on the surface is prepared, and a mold heated to a temperature higher than the glass transition temperature of the object to be processed is pressed against a resin held at a temperature lower than the glass transition temperature. Then, the resin surface is melted and fluidized, and the pattern of the mold is transferred to the resin. Next, the mold is cooled to solidify the resin, and the mold is released. Thereby, a predetermined pattern is formed in resin (for example, refer patent document 1).

  In this method, an expensive electron beam light source or optical system is not required, and a simple structure based on a heater and a press device can be used.

  Further, in this method, the resin can enter the fine pattern of the mold without the problem that the resin is deprived of heat and solidified. In addition, since a large mold that can withstand high pressure such as injection molding is not required, the temperature can be increased and decreased at high speed, and there is no problem of throughput.

  In fact, it is possible to accurately transfer the shape formed in the mold as it is, and there is a report that a thin line having a line width of about 20 nm has already been formed by this method.

  Furthermore, by using such nanoimprinting process technology, various microchips and microdevices such as optical devices such as diffraction gratings, photonic crystals, and waveguides, and fluid devices such as microchannels and reactors are used. The situation where it is possible to produce is now being realized.

  Here, conventionally, there was a tendency to mold at a high pressure because it was considered to mold at a high speed, and there was no example of trying to mold at a low pressure, particularly 1 MPa or less (for example, Non-Patent Document 1). To 4).

International Publication Number WO2004 / 093171 (page 12, FIG. 2) J.Photopolym, sci, Techonol., Vol.16, No4,2003, p.615-620 J. Photopolym, sci, Techonol., Vol.14, No3,2001, p.457-462 Science, Vol.272,5.April.1996, p.85-87 Appl.Phys.Lett., Vol.67, No.21,20November1995, p.3114-3116

  However, when the size of the pattern to be transferred is on the micro or sub-micro order, when the mold and the object to be processed are pressed with a large pressure, the mold and the resin are firmly adhered to each other and cannot be released or formed on the object to be processed. There was a problem that the pattern was out of shape. This problem becomes more prominent as the pattern width (dimension in the plane direction of the workpiece) becomes smaller, the depth of the pattern (dimension in the vertical direction of the workpiece) becomes larger, and the aspect ratio becomes larger. .

  Accordingly, an object of the present invention is to provide a micromachining method and a micromachining apparatus in which a mold and an object to be processed (resin or the like) are difficult to stick to each other, and pattern deformation is difficult to occur.

  In order to achieve the above object, a micromachining method of the present invention is a micromachining method in which a mold having a predetermined pattern and a workpiece are pressed and the pattern is transferred to a molding surface of the workpiece. The mold and the workpiece are pressed at a pressure of 1 MPa or less.

  Furthermore, a more preferable micromachining method of the present invention is a micromachining method in which a mold having a predetermined pattern and a workpiece are pressed and the pattern is transferred to a molding surface of the workpiece. A heating step of heating the workpieces to a predetermined temperature, respectively, and a pressing step of pressing the mold and the workpieces with a pressure of 1 MPa or less after the heating step.

  In this case, in the heating step, the mold is preferably heated to a temperature higher than that of the workpiece, and more preferably, the mold is heated to a temperature higher than the glass transition temperature of the workpiece, and the workpiece is processed. It is better to heat to below the glass transition temperature.

  The aspect ratio of the pattern is preferably 0.2 or more. The width of the pattern is preferably 2 μm or less. Furthermore, the depth of the pattern is preferably 200 nm or more.

  Another micromachining method of the present invention is a micromachining method in which a mold having a predetermined pattern and a workpiece are pressed and the pattern is transferred to a molding surface of the workpiece. The displacement speed of the mold relative to the workpiece is adjusted so that the pressure between the workpiece and the workpiece does not exceed 1 MPa.

  Further, the micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to a molding surface of the workpiece. A displacement means capable of adjusting a relative position of the mold with respect to an object and a displacement speed for changing the position; a position detection means capable of detecting a relative position of the mold with respect to the workpiece; the mold; Pressure detecting means for detecting a pressure between the workpiece and the displacement detecting means based on the information of the position detecting means and the pressure detecting means, and the pressure between the mold and the workpiece is Control means for adjusting the displacement speed of the mold relative to the workpiece so as not to exceed 1 MPa.

  According to the present invention, by pressing a mold and an object to be processed with a pressure of 1 MPa or less, the pattern of the mold can be prevented from being deformed and the pattern of the mold can be accurately transferred. In particular, even when the pattern width is small, when the pattern depth is large, or when the aspect ratio is large, the pattern of the pattern can be prevented and the pattern of the mold can be accurately transferred.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

  As shown in FIG. 1, the micromachining apparatus 1 of the present invention is a micromachining apparatus that presses a mold 100 having a predetermined pattern and a workpiece 200 to transfer the pattern of the mold to the workpiece 200. The mold holding unit 2 that holds the mold 100, the workpiece holding unit 12 that holds the workpiece 200, and the relative position of the mold 100 with respect to the workpiece 200 and the displacement speed that changes the position are adjusted. Possible displacement means 5, position detection means 7 for detecting the relative position of the mold 100 with respect to the workpiece 200, pressure detection means 8 for detecting the pressure between the mold 100 and the workpiece 200, and the mold Mold heating means 3 for heating 100, mold cooling means 4 for cooling the mold 100, mold temperature detection means 31 for detecting the temperature of the mold 100, workpiece heating means 13 for heating the workpiece 200, processing The object cooling means 14 for cooling the object 200, the object temperature detecting means 131 for detecting the temperature of the object 200, the position detecting means 7, the pressure detecting means 8, the mold temperature detecting means 31, and the object to be processed. Based on the detection information of the object temperature detection means 131, the control means 300 for controlling the operation of the displacement means 5, the mold heating means 3, the mold cooling means 4, the workpiece heating means 13, and the workpiece cooling means 14. Mainly composed.

  As the material of the mold 100, “metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon” and the like are used. Further, the mold 100 may be anything as long as it can press the workpiece 200 and process the workpiece 200, but a predetermined pattern made of unevenness on one end surface (pattern surface 100a). Is formed. This pattern can be formed by subjecting the pattern surface 100a to precision machining. In addition, after forming predetermined irregularities on a silicon substrate or the like as a master disk of the mold 100 by a semiconductor micromachining technique such as etching, the surface of the silicon substrate or the like is subjected to metal plating by an electroforming (electroforming) method, for example, a nickel plating method. Then, the metal plating layer can be peeled off to form a pattern consisting of irregularities. Of course, as long as the mold 100 can form a fine pattern, the material and the manufacturing method thereof are not particularly limited. The width of this pattern (dimension in the planar direction of the workpiece 200) depends on the type of the workpiece 200 used, but is various, such as 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, 10 nm or less. Formed in size. Further, the depth of the pattern (the vertical dimension of the workpiece 200) is formed in various sizes such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, 100 μm or more. The aspect ratio of this pattern includes various patterns such as 0.2 or more, 0.5 or more, 1 or more, 2 or more. Since this mold is heated and cooled during the imprint process, it is preferable to make it as thin as possible and reduce its heat capacity.

  Various objects can be used as the workpiece 200, for example, a resin such as polycarbonate and polyimide, a metal such as aluminum, a material such as glass, quartz glass, silicon, gallium arsenide, sapphire, and magnesium oxide. A molding material having a substrate shape as it is can be used. Also, the surface of the substrate body made of silicon, glass, etc., with a coating layer such as “resin”, “photoresist”, “aluminum, gold, silver or other metal for forming a wiring pattern” formed It can also be used. Furthermore, the workpiece 200 may of course have a shape other than the substrate, such as a film.

  As shown in FIG. 1, the mold holding unit 2 is formed on a mold holding surface 2 a that holds the mold 100 so that the mold 100 can be fixed in surface contact with a fastener such as a screw or a clamp fitting. The structure of the mold holding unit 2 may be any structure as long as it holds the mold 100 on the mold holding surface 2a. For example, the structure that holds the mold 100 by electrostatic suction or vacuum suction on the mold holding surface 2a. It is also possible.

  Further, the mold holding unit 2 includes a mold heating means 3 for heating the mold 100, for example, a carbon heater having a very high response. The carbon heater is controlled to supply current from a power source (not shown) by the control means 300, and can maintain the mold 100 at a predetermined constant temperature. As the heater, for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used.

  The mold holding unit 2 is provided with mold cooling means 4 for cooling the mold 100. As the mold cooling means 4, for example, a coolant such as water or oil, or a cooling gas such as air or inert gas is allowed to flow inside the mold holder 2 formed of a metal having high thermal conductivity such as aluminum or copper. Thus, a cooling channel capable of cooling the mold 100 can be used.

  Further, the mold holding unit 2 is provided with a mold temperature detecting means 31 for detecting the temperature of the mold 100, for example, a thermocouple. The mold temperature detection means 31 is electrically connected to the control means 300 and is formed so as to transmit information regarding the detected temperature of the mold 100 to the control means 300.

  As illustrated in FIG. 1, the workpiece holding unit 12 holds the workpiece 200 in a substantially horizontal state, and includes a holding stage having a workpiece holding surface 12 a on the upper surface.

  In this holding stage, a large number of vacuum holes (not shown) are formed in the workpiece holding surface 12a, and a negative pressure is applied to the vacuum holes from a negative pressure source (not shown) to hold the workpiece. The workpiece 200 can be sucked and held on the surface 12a. The structure of the workpiece holding unit 12 may be anything as long as the workpiece 200 is held on the workpiece holding surface 12a. For example, the workpiece holding unit 12 may be held by a fastener such as a clamp fitting. Of course, it is also possible to adopt a structure that is fixed to the surface 12a or is held by suction by electrostatic attraction.

  Further, a workpiece heating means 13 for heating the workpiece 200 to be held, for example, a carbon heater with very good responsiveness, is provided below the holding stage. The carbon heater is controlled by the control means 300 to supply current from a power source (not shown), and can maintain the workpiece 200 on the holding stage at a predetermined constant temperature. As the heater, for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used.

  Further, the processing object holding unit 12 may be provided with a processing object cooling means 14 for cooling the processing object 200. As the processing object cooling means 14, for example, cooling of water, oil or the like cooling liquid, air, inert gas, or the like inside the processing object holding part 12 formed of a metal having high thermal conductivity such as aluminum or copper. The cooling flow path which can cool the workpiece 200 can be used by flowing gas.

  Further, the processing object holding unit 12 is provided with a processing object temperature detecting means 131 for detecting the temperature of the processing object 200, for example, a thermocouple. Further, the processing object temperature detecting means 131 is electrically connected to the control means 300 and is formed so as to transmit information regarding the detected temperature of the processing object 200 to the control means 300.

  As shown in FIG. 1, the displacing means 5 includes, for example, a ball screw 51 arranged in the vertical direction and an electric motor 52 that rotationally drives the ball screw 51. Further, the lower end portion of the ball screw 51 and the upper surface of the mold holding portion 2 are connected via a pressing portion 53 and a bearing mechanism 54. Then, the ball screw 51 is rotationally driven by the electric motor 52, so that the pressing portion 53 is placed on the mold 100 and the workpiece 200 with respect to a plurality of, for example, four columns 56 provided between the base 50 and the upper base 55. Can be displaced in the direction of contact / separation (hereinafter referred to as the Z direction). As the electric motor 52, various types such as a direct current motor, an alternating current motor, a stepping motor, and a servo motor can be used. Here, it is preferable that the displacement means 5 can adjust the position of the mold 100 with respect to the workpiece 200 by a displacement amount equal to or less than the depth of the pattern of the mold 100. Specifically, it is preferable that the amount of displacement can be adjusted to 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, more preferably 100 nm or less, more preferably 10 nm or less, more preferably 1 nm or less. What can be done is preferred.

  Further, the displacement means 5 is preferably one that can adjust the displacement speed of the mold 100 relative to the workpiece 200. Specifically, it can be adjusted at 100 μm / second or less, preferably 10 μm / second or less, more preferably 1 μm / second or less, further preferably 100 nm / second or less, more preferably 10 nm / second or less, and still more preferably. Those that can be adjusted at 1 nm / second or less are preferable. This is because the control means 300 controls the operation of the displacement means 5 based on the information detected by the pressure detection means 8 and adjusts the pressure between the mold 100 and the workpiece 200, but the pressure detection means 8 It takes some time to feed back the detected information to the displacement means 5. Therefore, if the displacement speed is too high, the information detected by the pressure detection means 8 is delayed from being fed back to the displacement means 5, and the actual pressure between the mold 100 and the workpiece 200 cannot be accurately controlled. Because.

  Here, the case where the displacement means 5 is provided on the mold holding unit 2 side has been described, but it is of course possible to provide the displacement means 5 on the workpiece holding unit 12 side. Further, the displacement means 5 is not limited to one constituted by a ball screw and an electric motor as long as the relative displacement amount and displacement speed between the mold 100 and the workpiece 200 can be adjusted. It is also possible to use a piezoelectric element that can change the size (dimension) by adjusting the size, or a magnetostrictive element that can change the size (dimension) by adjusting the magnetic field. It is of course possible to use both a ball screw and an electric motor and a piezoelectric element or a magnetostrictive element. In this case, a ball screw and an electric motor are applied when the mold 100 and the workpiece 200 are largely displaced, and a piezoelectric element or a magnetostrictive element is used when the mold 100 and the workpiece 200 are displaced by a small amount. be able to. Further, it is of course possible to use a hydraulic type or a pneumatic type.

  By configuring the displacing means 5 in this way, the mold holding unit 2 that holds the mold 100 is moved up and down, and the pattern surface 100a of the mold 100 is precisely set against the workpiece 200 held by the workpiece holding unit 12. Can be approached, pressed, and separated.

  The position detecting means 7 is formed by, for example, a linear scale disposed on the mold holding unit 2. Using this linear scale, the distance between the workpiece 200 and the mold holder 2 can be measured, and the relative position and displacement speed of the mold 100 relative to the workpiece 200 can be calculated and detected from the measured value. . Further, the position detection means 7 is electrically connected to the control means 300 and is formed to transmit information on the detected position and displacement speed of the mold 100. The position detecting means 7 is not limited to a linear scale, and various types can be used. For example, the position of the workpiece 200 is measured using a laser length measuring device provided on the mold holding unit 2 side. Alternatively, the position of the mold 100 may be measured using a laser length measuring machine provided on the workpiece holding unit 12 side. Alternatively, an encoder provided in the electric motor may be used to measure the amount of displacement of the displacement means 5 by calculation. The resolution of the position detection means 7 is preferably one that can be detected with a value that is at least smaller than the size of the pattern of the mold 100 in the depth direction (Z direction) or less than the amount of displacement that the displacement means 5 can adjust. Specifically, it can be detected at 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, further preferably 100 nm or less, more preferably 10 nm or less, more preferably 1 nm or less. What can be done is preferred.

  By configuring the position detecting means 7 in this way, the position of the pattern surface 100a of the mold 100 with respect to the workpiece 200 is precisely adjusted according to the size of the pattern and the pressure between the mold 100 and the workpiece 200. Therefore, the pattern transfer property and mold release property can be improved.

  The pressure detection unit 8 detects a pressure between the mold 100 and the workpiece 200, and for example, a load cell that measures a load between the mold 100 and the workpiece 200 can be used. Thus, if the load is measured and divided by the area of the pattern surface 100a of the mold 100, the pressure between the mold 100 and the workpiece 200 can be detected. Moreover, the pressure detection means 8 is electrically connected to the control means 300, and is configured to transmit information regarding the detected pressure.

  Based on the detection information of the position detecting means 7, the pressure detecting means 8, the mold temperature detecting means 31, and the workpiece temperature detecting means 131, the control means 300 is based on the displacement means 5, the pressing means 6, the mold heating means 3, the mold cooling. For controlling the operation of the means 4, the workpiece heating means 13, and the workpiece cooling means 14, for example, a computer can be used.

  In particular, in the present invention, the control means 300 controls the displacement means 5 based on the information of the position detection means 7 and the pressure detection means 8 so that the pressure between the mold 100 and the workpiece 200 does not exceed 1 MPa. In addition, the relative displacement and displacement speed of the mold 100 with respect to the workpiece 200 are adjusted. Specifically, the displacement speed is adjusted so that the pressure between the mold 100 and the workpiece 200 does not exceed 1 MPa between the time when the information of the pressure detection means 8 is detected and the time when the displacement means 5 is controlled. To do. Here, the displacement speed to be adjusted depends on the material and temperature of the workpiece 200, but is preferably adjusted to 100 μm / second or less, preferably 10 μm / second or less, more preferably 1 μm / second or less. More preferably, the adjustment should be made at 100 nm / second or less, more preferably 10 nm / second or less, more preferably 1 nm / second or less. Thereby, the actual pressure between the mold 100 and the workpiece 200 can be reliably adjusted to be equal to or less than a predetermined value set in advance. In addition, based on the information of the pressure detection means 8, at least one of the mold heating means 3 and the workpiece heating means 13 is controlled, and the temperature of the molding surface of the workpiece 200 is changed to change the mold 100 and the workpiece. It is also possible to adjust the pressure between the object 200.

  Next, the fine processing method of the present invention will be described. The micromachining method of the present invention is a micromachining method in which a mold 100 having a predetermined pattern and a workpiece 200 are pressed to transfer a pattern onto a molding surface of the workpiece 200. Are pressed at a pressure of 1 MPa or less.

  First, the mold 100 and the workpiece 200 are heated to a predetermined temperature for molding. In this case, the mold 100 is preferably heated to a temperature higher than that of the workpiece 200, and more preferably, the mold 100 is heated to a temperature higher than the glass transition temperature (or softening temperature) of the workpiece 200 to be processed. The article 200 is preferably heated to a temperature below its glass transition temperature (or softening temperature). Thereby, when the mold 100 and the workpiece 200 are pressed, heat is transferred from the mold 100 to the workpiece 200, and only the vicinity of the surface of the workpiece 200 can be softened. Problems such as the object 200 being crushed can be avoided.

  After heating the mold 100 and the workpiece 200 to a predetermined temperature, the mold 100 and the workpiece 200 are pressed below a preset pressure. At this time, it is preferable that the pressure between the mold 100 and the workpiece 200 is as small as possible within a range in which the pattern of the mold 100 can be transferred to the workpiece 200. Specifically, it may be 1 MPa or less, more preferably 0.5 MPa or less, and still more preferably 0.25 MPa or less. Thereby, since it presses with a pressure comparatively smaller than before, it does not increase the adhesive force between the mold 100 and the workpiece 200, and prevents the mold 100 from collapsing and facilitating mold release. Can do. In addition, since the load applied to the mold 100 can be reduced, it is possible to prevent the mold 100 from causing fatigue failure as a result, and to extend the life of the mold 100. In this case, the displacement speed of the mold 100 relative to the workpiece 200 is preferably set to a speed that can be adjusted so that the pressure between the mold 100 and the workpiece 200 does not always exceed a preset pressure, for example, 1 MPa. More preferably, it is preferable to control and press the displacement amount of the mold 100 with respect to the workpiece 200.

  Next, the mold 100 and the workpiece 200 are cooled while keeping the mold 100 and the workpiece 200 in contact with each other, and the temperature of the workpiece 200 is set to a glass transition temperature (or softening temperature) or lower. At this time, cooling may be performed while maintaining the pressure between the mold 100 and the workpiece 200, or cooling may be performed after reducing the pressure to near zero.

  Finally, the mold 100 and the workpiece 200 are released, and the process of the fine processing method is finished.

  By pressing the mold 100 and the workpiece 200 at a pressure of 1 MPa or less in this way, the adhesion between the mold 100 and the workpiece 200 can be reduced, so imprintability (pattern transfer) Property, releasability, etc.) can be improved. In particular, as the pattern width (dimension in the planar direction of the workpiece 200) of the mold 100 becomes 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, or 10 nm or less, the pattern depth (working object) As the vertical dimension of 200) increases to 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, 100 μm or more, the pattern aspect ratio becomes 0.2 or more, 0.5 or more, 1 As described above, the imprintability can be improved as the value increases to 2 or more.

  EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

  As a test material, a transparent injection molded product having a thickness of 2 mm made of an ethylene / norbornene copolymer having a glass transition temperature of 135 ° C. was used.

  The imprint was evaluated using an imprint apparatus (VX-2000N-US) manufactured by SCIVAX and using a 30 mm × 30 mm mold under the conditions described in the examples. Table 1 summarizes the relationship between molding pressure and imprintability (pattern transfer property, mold release property, etc.). Here, the imprintability was observed with an electron microscope for the obtained fine uneven pattern, and the pattern similar to that of the mold was transferred well. ○, pattern defect (underfill, elongation, defect) was recognized. What was obtained was evaluated as x.

Example 1 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) was pressed against the surface of the resin plate at a speed of 1μm / sec. When the load sensor attached to the top of the mold reached 450N (pressure 0.5MPa), the load Held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 2 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) was pressed against the surface of the resin plate at a speed of 1000μm / sec. When the load sensor attached to the top of the mold reached 450N (pressure 0.5MPa), the load Held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 3 (imprint evaluation on injection-molded body)
Specimen 1 fixed on a plate heated to glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to mold setting temperature Tg + 35 ° C (170 ° C) (pattern: hole diameter 1μm / depth 1μm) The aspect ratio 1) was pressed against the surface of the resin flat plate at a speed of 1 μm / second, and when the load sensor attached to the upper part of the mold reached 450 N (pressure 0.5 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 4 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: pillar diameter 0.5 µm / depth) 1 μm, aspect ratio 0.5) was pressed against the surface of the resin flat plate at a speed of 1 μm / second, and when the load sensor attached to the upper part of the mold reached 450 N (pressure 0.5 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 5 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) is pressed against the surface of the resin plate at a speed of 1μm / sec. When the load sensor attached to the top of the mold reaches 675N (pressure 0.75MPa), the load Held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 6 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) is pressed against the surface of the resin plate at a speed of 1000μm / sec. When the load sensor attached to the top of the mold reaches 675N (pressure 0.75MPa), the load Held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 7 (imprint evaluation on injection-molded body)
Specimen 1 fixed on a plate heated to glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to mold setting temperature Tg + 35 ° C (170 ° C) (pattern: hole diameter 1μm / depth 1μm) The aspect ratio 1) was pressed against the surface of the resin flat plate at a speed of 1 μm / second, and when the load sensor attached to the upper part of the mold reached 675 N (pressure 0.75 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 8 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: pillar diameter 0.5 µm / depth) 1 μm, aspect ratio 0.5) was pressed against the surface of the resin flat plate at a speed of 1 μm / second, and when the load sensor attached to the upper part of the mold reached 675 N (pressure 0.75 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 9 (imprint evaluation on injection-molded body)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) was pressed against the surface of the resin plate at a speed of 1μm / sec. When the load sensor attached to the top of the mold reached 900N (pressure 1MPa), Hold for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 10 (imprint evaluation on an injection molded product)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) is pressed against the surface of the resin flat plate at a speed of 1000μm / sec. Hold for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 11 (imprint evaluation on an injection molded product)
Specimen 1 fixed on a plate heated to glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to mold setting temperature Tg + 35 ° C (170 ° C) (pattern: hole diameter 1μm / depth 1μm) The aspect ratio 1) was pressed against the surface of the resin plate at a speed of 1 μm / second, and when the load sensor attached to the upper part of the mold reached 900 N (pressure 1 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Example 12 (imprint evaluation on an injection molded product)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: pillar diameter 0.5 µm / depth) 1 μm, aspect ratio 0.5) was pressed against the surface of the resin flat plate at a speed of 1 μm / second. When the load sensor attached to the upper part of the mold reached 900 N (pressure 1 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, a good pattern was transferred. The observation results are summarized in Table 1.

Comparative Example 1 (imprint evaluation on injection molded product)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) is pressed against the surface of the resin plate at a speed of 1μm / sec. When the load sensor attached to the top of the mold reaches 9000N (pressure 10MPa), Hold for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, burrs and the like were conspicuous and had a defective pattern. The observation results are summarized in Table 1.

Comparative Example 2 (imprint evaluation on injection molded product)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: line / space (L / S ) = 1μm / 1μm, depth 1μm, aspect ratio 1) is pressed against the surface of the resin plate at a speed of 1000μm / sec. When the load sensor attached to the top of the mold reaches 9000N (pressure 10MPa), Hold for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, burrs and the like were conspicuous and had a defective pattern. The observation results are summarized in Table 1.

Comparative Example 3 (imprint evaluation on injection molded product)
Specimen 1 fixed on a plate heated to glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to mold setting temperature Tg + 35 ° C (170 ° C) (pattern: hole diameter 1μm / depth 1μm) The aspect ratio 1) was pressed against the surface of the resin flat plate at a speed of 1 μm / second. When the load sensor attached to the upper part of the mold reached 9000 N (pressure 10 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, burrs and the like were conspicuous and had a defective pattern. The observation results are summarized in Table 1.

Comparative Example 4 (imprint evaluation on injection molded product)
Specimen 1 was fixed on a plate heated to a glass transition temperature Tg-15 ° C (120 ° C) and pre-heated to a preset molding temperature Tg + 35 ° C (170 ° C) (pattern: pillar diameter 0.5 µm / depth) 1 μm, aspect ratio 0.5) was pressed against the surface of the resin flat plate at a speed of 1 μm / second, and when the load sensor attached to the upper part of the mold reached 9000 N (pressure 10 MPa), the load was held for 20 seconds. Thereafter, while maintaining the displacement of the mold, the mold was cooled to Tg-15 ° C. (120 ° C.). After completion of the cooling, the mold was released from the flat plate at a speed of 1 μm / second. When observed with an electron microscope, burrs and the like were conspicuous and had a defective pattern. The observation results are summarized in Table 1.

L / S (line / space): 1 μm / 1 μm, pattern depth, aspect ratio 1
Hall: Diameter 1μm / Depth 1μm, Aspect ratio 1
Pillar: Pillar diameter 0.5μm / depth 1μm, aspect ratio 0.5
Temperature of sample material during molding: Tg-15 ° C
Mold release temperature: Tg-15 ℃

  From this example, it was revealed that in the imprint process, pressing the mold and the object to be processed at 1 MPa or less is superior in imprintability (pattern transfer property, release property, etc.).

It is a schematic front view which shows the microfabrication apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fine processing apparatus 3 Type | mold heating means 4 Type | mold cooling means 5 Displacement means 7 Position detection means 8 Pressure detection means 13 Processing object heating means 14 Processing object cooling means 31 Type | mold temperature detection means 100 Type | mold 131 Processing object temperature detection means 200 Processing object 300 Control means

Claims (9)

In a fine processing method of pressing a mold having a predetermined pattern and a workpiece, and transferring the pattern to a molding target surface of the workpiece,
A fine processing method, wherein the mold and the object to be processed are pressed with a pressure of 1 MPa or less. In a fine processing method of pressing a mold having a predetermined pattern and a workpiece, and transferring the pattern to a molding target surface of the workpiece,
A heating step of heating the mold and the workpiece to respective predetermined temperatures;
After the heating step, a pressing step of pressing the mold and the workpiece with a pressure of 1 MPa or less,
A fine processing method characterized by comprising: The micromachining method according to claim 2, wherein the heating step heats the mold to a temperature higher than that of the workpiece. 3. The micromachining method according to claim 2, wherein the heating step heats the mold to a temperature higher than the glass transition temperature of the workpiece, and heats the workpiece to a temperature lower than the glass transition temperature. 5. The microfabrication method according to claim 1, wherein an aspect ratio of the pattern is 0.2 or more. 5. The microfabrication method according to claim 1, wherein a width of the pattern is 2 [mu] m or less. 5. The microfabrication method according to claim 1, wherein the pattern has a depth of 200 nm or more. In a fine processing method of pressing a mold having a predetermined pattern and a workpiece, and transferring the pattern to a molding target surface of the workpiece,
A fine processing method, wherein a displacement speed of the mold relative to the processing object is adjusted so that a pressure between the mold and the processing object does not exceed 1 MPa. In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to a molding surface of the workpiece,
A displacement means capable of adjusting a relative position of the mold with respect to the workpiece and a displacement speed for changing the position;
Position detecting means capable of detecting a relative position of the mold with respect to the workpiece;
Pressure detecting means for detecting pressure between the mold and the workpiece;
The displacement means is controlled based on the information of the position detection means and the pressure detection means, and the displacement of the mold with respect to the workpiece so that the pressure between the mold and the workpiece does not exceed 1 MPa. Control means for adjusting the speed;
A microfabrication apparatus comprising:

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