JP2008288229A - Light emitting diode and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To break a bonding wire due to thermal shock or temperature cycle.
A die pattern 3 and side electrode patterns 6a and 6b communicating with a pair of upper and lower electrode patterns 4a and 4b are formed on a circuit board 2, and an LED chip 7 is fixed on the die pattern 3. Wire bonding mounting is performed with two bonding wires 8 and 9, and sealing is performed with a translucent sealing resin 10. The mounting height of the two bonding wires 8 and 9 is set such that the first bonding wire 8 is set to a low loop and the second bonding wire 9 is set to a normal loop. The 1st bond positions of the bonding wires 8 and 9 are overlapped, and the 2nd bond positions on the upper surface electrode patterns 4a and 4b are different. The two bonding wires have different lengths in plan view, the same direction, and different 2nd bond positions. The stress received from the resin is dispersed and the wire is difficult to break.
[Selection] Figure 1

Description

  The present invention relates to a light emitting diode used in consumer equipment such as a personal computer, a printer, a PDA, a facsimile, and a mobile phone, and more specifically, a double bonding wire mounting that bonds two bonding wires so as to come out from one electrode. The present invention relates to a light emitting diode and a method for manufacturing the same.

  Conventionally, it is a surface-mounted light-emitting diode provided for electronic devices that pursue lightness, smallness, and small size. As a general structure, a pair of electrode patterns formed on the surface of a glass epoxy resin substrate is formed on the substrate. The LED chip is fixed by a conductive adhesive, and the electrode pattern of the LED chip is usually connected to the electrode pattern on the substrate by a single bonding wire, and the bonding wire and the LED chip are sealed with a sealing resin. There is something. (For example, see Patent Document 1)

JP 2002-280614 (2nd page, FIG. 4)

  The light emitting diode disclosed in Patent Document 1 will be described. As shown in FIGS. 11 and 12, the light emitting diode 21 includes a die pattern 23 on the upper surface of an insulating circuit board 22 made of glass epoxy resin, and a pair of upper surface electrodes 24a and 24b and a lower surface electrode 25a on the upper and lower surfaces. 25b are patterned. The LED chip 26 is fixed to the upper surface of the die pattern 23 formed on the circuit board 22 and is wire-bonded and mounted with a bonding wire 27. The LED chip 26 and the bonding wire 27 are covered with a translucent sealing resin 28 so as to cover the LED chip 26 and the bonding wire 27.

  A general bonding wire mounting method for the above-described light emitting diode will be described. As shown in FIG. 13, when the ball 27a is formed at the tip of the bonding wire 27 in (a), the capillary 29 is lowered, and when the ball 27a comes into contact with the LED element electrode 26a in (b), heat is generated. 1st bonding process in which the load / ultrasonic wave is transmitted to the ball 27a and the bonding wire 27 is bonded, the capillary 29 rises to a certain height in (c), and moves to a position where a 2nd bond is hit in (d). The normal loop shape of the bonding wire 27 is determined by the trajectory of the capillary 29, the capillary 29 descends, the bonding wire 27 is pressed onto the upper surface electrode 24a (24b), and the bonding wire 27 is joined by applying heat, load, and ultrasonic waves. 2nd bonding step, and then the capillary 29 is raised and the tip of the capillary 29 After securing the bonding wire 27 of a certain length, the cutting process of cutting the bonding wire 27 at the 2nd bond joint by pulling, and then the tip of the bonding wire 27 of a certain length at the tip of the capillary 29 A high voltage is applied to the spark wire to spark, and the heat melts gold to form a ball 27a by the surface tension at the tip of the bonding wire 27 and return to the state (a). This completes one cycle. Bonding can be continued.

  The problem to be solved is that a general bonding wire mounting method of a light emitting diode disclosed in Patent Document 1 described above is a gold wire bonded by a reliability test such as a thermal shock or a temperature cycle of a product. Breaks and malfunctions (no light). There were problems such as.

  The present invention eliminates the above-mentioned drawbacks. The purpose of the present invention is to provide a double bonding mounting structure that uses two bonding wires, so that the gold wire can be used in reliability tests such as thermal shock and temperature cycle of products. It is an object of the present invention to provide a light emitting diode excellent in reliability that does not break and a method for manufacturing the same.

  In order to achieve the above object, a light emitting diode according to the present invention includes a die pattern on which an LED chip is mounted on an upper surface of an insulating circuit board, a pair of upper and lower electrode patterns, and a side electrode pattern that communicates the upper and lower electrode patterns. In the light-emitting diode in which the LED chip is fixed on the die pattern, wire-bonded and mounted, and the LED chip and the bonding wire are sealed with a translucent sealing resin, the bonding wire is 1 It is characterized in that two wires are mounted from one electrode.

  The mounting height of the two bonding wires is such that the first bonding wire is disposed in a low loop, the second bonding wire is disposed in a normal loop, and the first and second bonding wires on the LED element electrode. The first bond positions are overlapped, and the 2nd bond positions of the first and second bonding wires on the upper surface electrode pattern are arranged differently.

  Further, the first and second bonding wires are characterized in that they are arranged so that their lengths are different from each other in the plan view and the directions are the same.

Further, the first and second bonding wires are characterized in that they are arranged so as to have the same length and are shifted in a plan view.

  In addition, the bonding wire mounting method for the light emitting diode includes forming a die pattern for mounting the LED chip on the upper surface of the insulating circuit board, a pair of upper and lower electrode patterns, and a side electrode pattern for communicating the upper and lower electrode patterns. In the method of manufacturing a light emitting diode, the LED chip is fixed on the die pattern, wire-bonded, and the LED chip and the bonding wire are sealed with a translucent sealing resin. Two balls are set to come out from the electrode, and when the ball is formed at the tip of the first bonding wire, when the capillary is lowered and the ball comes into contact with the LED element electrode, heat, load, and ultrasonic wave are generated. 1st bonding process for bonding a bonding wire, The rally rises to a certain height, moves to the position where the 2nd bond is hit, determines the low loop shape of the bonding wire by the trajectory of the capillary, the capillary descends, presses the bonding wire onto the upper surface electrode pattern, heat, load, 2nd bonding process to join the bonding wire by applying ultrasonic wave, and then the capillary is raised, and after securing a certain length of wire at the tip of the capillary, it is pulled to cut the wire at the 2nd bond bonding part Next, a high voltage is applied to the tip of the capillary at the tip of the capillary to blow a spark, the gold is melted by the heat, and a ball is formed at the tip of the bonding wire by surface tension. The second bond so as to overlap the first bond of the first bonding wire The first bonding step of bonding the bonding wire, the capillary is raised to a certain height, and the two bonding wires are moved to a position where two bonding bonds having the same direction and different lengths are hit so that they overlap in a plane. 2nd bond process to determine the normal loop shape of the wire with the trajectory of the wire, press it on the upper surface electrode pattern, and apply the heat, load and ultrasonic wave to join the bonding wire, and then the capillary will rise, and the tip of the capillary will be fixed It is characterized by comprising a cutting step of cutting the bonding wire at the 2nd bond bonding portion by securing the length of the bonding wire and then pulling it.

  Further, a die pattern for mounting the LED chip on the upper surface of the insulating circuit board, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed, and the LED chip is mounted on the die pattern. In the method of manufacturing a light-emitting diode, which is fixed and wire-bonded, and the LED chip and the bonding wire are sealed with a light-transmitting sealing resin, the bonding wire is set so as to come out from one electrode. When the capillary is lowered with the ball formed at the tip of the first bonding wire and the ball comes into contact with the LED element electrode, heat, load, and ultrasonic waves are transmitted to the ball to join the bonding wire. Bonding process and the capillary rises to a certain height and hits 2nd bond 2nd bonding process that moves to the position, determines the low loop shape of the bonding wire by the capillary trajectory, descends the capillary, presses the bonding wire onto the upper surface electrode pattern, and applies the heat, load, and ultrasonic wave to bond the bonding wire After that, the capillary rises, secures a bonding wire of a certain length at the tip of the capillary, and then pulls it to cut the bonding wire at the 2nd bond joint, and then the constant at the tip of the capillary A high voltage is applied to the tip of the bonding wire of length and sparks are blown off, the gold is melted by the heat, a ball is formed at the tip of the bonding wire by surface tension, and on the first bond of the first bonding wire Second bonding wire to overlap The first bonding step of joining the two, and the capillary rises to a certain height, and the two bonding wires move to a position where a 2nd bond having the same length as viewed in plan and shifted in direction is hit, The 2nd bonding process that determines the normal loop shape of the bonding wire by the trajectory, presses it onto the upper electrode pattern, and joins the bonding wire by applying heat, load, and ultrasonic waves, and then the capillary rises and reaches the tip of the capillary. It is characterized by comprising a cutting step of cutting the bonding wire at the 2nd bond bonding portion by securing the length of the bonding wire and then pulling it.

  In the light emitting diode of the present invention, by using two bonding wires, the 1st bond portion on the LED element electrode overlaps, the thickness of the bonding portion increases, the bonding strength increases, and the bonding wire is less likely to break. . Further, since the thickness of the 1st bond portion is increased, the stress that the bonding wire receives from the sealing resin depends on the first bonding wire and the second bonding wire. Accordingly, the stress is dispersed and the bonding wire is hardly broken. Even if one of the bonding wires is disconnected, the other bonding wire can be electrically connected, and as a result, the LED is not turned off. Moreover, even if the calorific value of the element increases, heat can be released from the two wires. It is possible to provide an excellent light-emitting diode and bonding wire mounting method in which a gold wire is not broken even by a reliability test such as a thermal shock or a temperature cycle of a product.

  The light emitting diode of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a surface-mounted light emitting diode according to Example 1 of the present invention, and FIG. 2 is a partial plan view of a wire bonding mounting portion of FIG. In FIG. 1, the structure of the light emitting diode 1 will be described. The die pattern 3 is formed on the upper surface of the circuit board 2 made of glass epoxy resin, the upper and lower surfaces are a pair of upper surface electrode patterns 4a and 4b, the lower surface electrode patterns 5a and 5b, and the upper and lower electrode patterns 4a, 4b, and 5a. Side electrode patterns 6a and 6b communicating with 5b are formed. The LED chip 7 is fixed on the die pattern 3 and wire bonding is performed by a mounting method described later so that the two bonding wires 8 and 9 come out from one LED element electrode 7a. 8 and 9 are sealed with a translucent sealing resin 10.

  The mounting height of the two bonding wires is such that the first bonding wire 8 is set to a low loop, the second bonding wire 9 is set to a normal loop, and the first and second bonding wires on the LED element electrode 7a are set. The first bond positions of 8 and 9 are overlapped, and the 2nd bond positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b are different in length depending on the horizontal distance in a plan view. Are the same. That is, the first bonding wire 8 is short and the second bonding wire 9 is long.

  A method for mounting the above-described light emitting diode bonding wire will be described. FIG. 3 shows a bonding wire mounting process, wherein (a) to (d) are the same as in the prior art, and the capillary 11 is lowered with the ball 8a formed at the tip of the bonding wire 8, and (b) When the ball 8a comes into contact with the LED element electrode 7a, heat, load, and ultrasonic waves are transmitted to the ball 8a to join the first bonding wire 8, and the capillary 11 is fixed in (c). Ascend to the height, move to the position where the 2nd bond is hit in (d), determine the low loop shape of the first bonding wire 8 by the trajectory of the capillary 11, the capillary 11 descends, and the first bonding wire 8 moves upward 2nd bonding process of pressing the electrode patterns 4a and 4b and applying the heat, load and ultrasonic wave to bond the first bonding wire 8 After that, the capillary 11 is raised, and after securing the first bonding wire 8 having a certain length at the tip of the capillary 11, the first bonding wire 8 is cut at the 2nd bond bonding portion by pulling. Next, a ball 9 a is formed at the tip of the capillary 11 at the tip of the second bonding wire 9 having a certain length by surface tension.

  Next, when the capillary 11 is lowered and the ball 9a comes into contact with the first bond of the first bonding wire 8 so as to overlap with the first bonding wire 8 in (e), heat, load, and ultrasonic waves are transmitted to the ball 9a, and (f ) In the first bonding step for bonding the second bonding wire 9, and in (g) the capillary 11 is raised to a certain height and the two bonding wires 8, 9 are planarly overlapped in the same direction. Move to the position where the 2nd bond with different length at the horizontal distance is hit, determine the normal loop shape of the wire by the trajectory of the capillary 11, and press it on the upper surface electrode patterns 4a, 4b in (h), heat, load, ultrasonic 2nd bonding step of joining the second bonding wire 9 by adding the pressure, and then the capillary 11 is raised and a certain length is added to the tip of the capillary 11 After securing the second bonding wire 9, one cycle is completed through a cutting step of cutting the second bonding wire 9 at the 2nd bond junction by pulling. Bonding can be continued.

  The operation and effect of the light emitting diode mounted with double bonding in the above-described configuration will be described. The condition of the first bond of the first bonding wire is that the base portion is laid down from the beginning in order to make the loop low. Since the first bonding condition of the second bonding wire is usually a loop, the base portion does not need to be bent much. Since the base portion of the first bond of the bent first bonding wire is sandwiched between two balls, the bonding strength is increased. In addition, since the first bonding portions of the two bonding wires 8 and 9 are overlapped, the stress received from the sealing resin is dispersed, and thus the wire is hardly broken. Further, when the 2nd bond positions of the two wires are the same, the wire is easily disconnected. Therefore, the wire is hardly broken by changing the length of the two wires and shifting the positions.

  Further, in the case of an LED chip, since two wires come out from one electrode, a large current can be passed, so that the brightness can be increased. Even if a large current is applied and the amount of heat generation increases, heat can be released from the two wires.

  Further, even if one of the wires is cut, the other wire can be electrically connected, and as a result, the LED is not turned off.

  4 is a cross-sectional view of a light emitting diode according to Example 2 of the present invention, and FIG. 5 is a partial plan view of the wire bonding mounting portion of FIG. 4 and 5, the difference from the first embodiment is that the 2nd bond positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b cannot be secured in terms of design. Sometimes, the first and second bonding wires 8 and 9 have the same horizontal distance and the same length when seen in a plan view, and as shown in FIG. The 2nd bond positions of the first and second bonding wires can be made different. Since the operation and effect of the second embodiment are the same as those of the first embodiment, the description thereof will be omitted.

  A method for mounting the above-described light emitting diode bonding wire will be described. FIG. 6 shows a bonding wire mounting process. In (a) to (h), the difference from Example 1 is that the 2nd bond positions of the first and second bonding wires 8 and 9 are slightly shifted in the rotational direction. 2nd bond positions are made different. Since the operation and effect of the second embodiment are the same as those of the first embodiment, the description thereof will be omitted.

  7 is a cross-sectional view of a light emitting diode according to Example 3 of the present invention, and FIG. 8 is a partial plan view of the wire bonding mounting portion of FIG. 7 and 8, the differences from the first embodiment will be described. In the light emitting diode 1, a through hole 2a is formed at a substantially central portion of an insulating circuit board 2 made of glass epoxy resin, and an LED chip 7 is fixed on a die pattern 3 formed on the bottom surface of the through hole 2a. Is.

  When the surface of the LED element electrode 7a is lower than the circuit board 2, the stress of the first bonding of the two bonding wires 8 and 9 is concentrated at the base portion of the first bonding, and it is easy to break. However, since the base portion of the 1st bond is increased by the amount of the overlapping ball portions, the influence of stress is weakened, and disconnection is difficult. By mounting the LED chip 7 in the through hole 2a of the circuit board 2, a thin light-emitting diode can be realized.

  The mounting height of the two wires is the same as in the first embodiment, the first bonding wire 8 is set to the low loop, the second bonding wire 9 is set to the normal loop, and the first height on the LED element electrode 7a is set. The first bonding positions of the first and second bonding wires 8 and 9 are overlapped, and the second bonding positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b are horizontal distances when viewed in plan. The length is different and the direction is the same. That is, the first bonding wire 8 is short and the second bonding wire 9 is long. Since the above-described bonding wire mounting method of the light emitting diode and its operation and effect are the same as those in the first and second embodiments, the description thereof will be omitted.

  9 is a cross-sectional view of a light emitting diode according to Example 4 of the present invention, and FIG. 10 is a partial plan view of the wire bonding mounting portion of FIG. 9 and FIG. 10, differences from the second embodiment will be described. Similar to the third embodiment, a through hole 2a is formed at a substantially central portion of an insulating circuit board 2 made of glass epoxy resin, and the LED chip 7 is fixed on the die pattern 3 formed at the bottom of the through hole. To do.

  The difference from the third embodiment described above is the position and direction of the 2nd bond of the two bonding wires 8 and 9. That is, the 1st bond positions of the first and second bonding wires 8 and 9 on the LED element electrode 7a are overlapped, and the 2nd bond positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b. Is the same in length at the horizontal distance as seen in a plan view, and as shown in FIG. 10, the 2nd bond position of the first and second bonding wires is moved by slightly shifting the 2nd bond position in the rotational direction. Can be different. Since the above-described bonding wire mounting method of the light emitting diode and its operation and effect are the same as those of the first, second, and third embodiments, the description thereof is omitted.

  As described above, the light emitting diode of the present invention is mounted by wire bonding so that the two bonding wires come out from one LED element electrode, so that the first bond portion overlaps, the bonding strength increases, and the bonding wire is disconnected. At the same time, the stress that the bonding wire receives from the sealing resin is dispersed in the two wires and the disconnection of the bonding wire is difficult to occur. Moreover, it becomes difficult to disconnect by hitting the 2nd bond position at a shifted position. Furthermore, since two wires come out from one electrode, a large current can flow, so that the brightness can be increased. Even if a large current is applied and the amount of heat generation increases, heat can be released from the two wires. Even if one of the bonding wires is disconnected, the other bonding wire can be electrically connected, and as a result, the LED is not turned off. It is possible to provide a light emitting diode excellent in reliability in which a gold wire is not broken even by a reliability test such as a thermal shock or a temperature cycle of the product, and a manufacturing method thereof.

  In the mounting method of the present invention, the wire bonding mounting is performed so that the two bonding wires come out from one LED element electrode. However, in the case of a light emitting element such as an LED, the first bond portion of the two wires is hit next to each other. However, although a large current and heat dissipation can be achieved, the electrode size on the element is required twice, so that the light is blocked and it is difficult to increase the luminance.

  Although the light emitting diode and the manufacturing method thereof have been described above, it is needless to say that the mounting method can be implemented in other semiconductors.

It is sectional drawing of the light emitting diode which concerns on Example 1 of this invention. It is a fragmentary top view of the wire bonding mounting part of FIG. It is bonding wire mounting process explanatory drawing which concerns on Example 1 of this invention. It is sectional drawing of the light emitting diode which concerns on Example 2 of this invention. It is a fragmentary top view of the wire bonding mounting part of FIG. It is bonding wire mounting process explanatory drawing which concerns on Example 2 of this invention. It is sectional drawing of the light emitting diode concerning Example 3 of this invention. It is a fragmentary top view of the wire bonding mounting part of FIG. It is sectional drawing of the light emitting diode concerning Example 4 of this invention. It is a fragmentary top view of the wire bonding mounting part of FIG. It is sectional drawing of the conventional light emitting diode. It is a fragmentary top view of the wire bonding mounting part of FIG. It is explanatory drawing of the conventional bonding wire mounting process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Circuit board 2a Through-hole 3 Die pattern 4a, 4b Upper surface electrode pattern 5a, 5b Lower surface electrode pattern 6a, 6b Side surface electrode pattern 7 LED chip 7a LED element electrode 8 1st bonding wire 8a, 9a Ball 9 2nd Bonding wire 10 Translucent sealing resin 11 Capillary

Claims (6)

  A die pattern for mounting an LED chip, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed on an upper surface of an insulating circuit board, and the LED chip is fixed on the die pattern. In addition, in the light-emitting diode formed by wire bonding and sealing the LED chip and the bonding wire with a light-transmitting sealing resin, the bonding wire is mounted so that two of the bonding wires come out from one electrode. A light emitting diode.   The mounting height of the two bonding wires is such that the first bonding wire is disposed in a low loop, the second bonding wire is disposed in a normal loop, and the first and second bonding wires 1st on the LED element electrode are arranged. 2. The light emitting diode according to claim 1, wherein the bonding positions are overlapped and the first and second bonding wires on the upper surface electrode pattern are arranged at different positions.   3. The light emitting diode according to claim 2, wherein the first and second bonding wires are arranged so that their lengths are different from each other in a plan view and the directions are the same.   3. The light emitting diode according to claim 2, wherein the first and second bonding wires are arranged such that the lengths thereof are the same and the directions are shifted when viewed in a plan view.   A die pattern for mounting an LED chip, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed on an upper surface of an insulating circuit board, and the LED chip is fixed on the die pattern. In addition, in the method of manufacturing a light emitting diode formed by wire bonding mounting and sealing the LED chip and the bonding wire with a translucent sealing resin, the bonding wires are arranged so as to come out of two from one electrode, When the ball is formed at the tip of the first bonding wire, the capillary is lowered, and when the ball contacts the LED element electrode, heat, load, and ultrasonic waves are transmitted to the ball to bond the bonding wire. Process and position where the capillary rises to a certain height and hits the 2nd bond 2nd bonding process in which the low loop shape of the bonding wire is determined by the trajectory of the capillary, the capillary descends, the bonding wire is pressed onto the upper surface electrode pattern, and the bonding wire is joined by applying heat, load, and ultrasonic waves. After that, the capillary rises, and after securing a wire of a certain length at the tip of the capillary, a cutting step of cutting the wire at the 2nd bond joint by pulling, and then, at the tip of the capillary, a certain length A high voltage is applied to the tip of the wire to cause a spark to flow, the gold is melted by the heat, a ball is formed at the tip of the bonding wire by surface tension, and the first bonding wire is overlapped on the first bond. A first bonding step for bonding two bonding wires; Lie rises to a certain height, the two bonding wires move to a position where they hit the 2nd bond with the same direction and different length so that they overlap in a plane, and the normal loop shape of the wire is determined by the trajectory of the capillary, A 2nd bonding process in which the bonding wire is joined by pressing on the upper surface electrode pattern and applying heat, load, and ultrasonic wave, and then the capillary is raised, and after securing a certain length of bonding wire at the tip of the capillary, it is pulled And a cutting step of cutting the bonding wire at the 2nd bond bonding portion, and a method for manufacturing a light emitting diode. A die pattern for mounting an LED chip, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed on an upper surface of an insulating circuit board, and the LED chip is fixed on the die pattern. In addition, in the method of manufacturing a light emitting diode formed by wire bonding mounting and sealing the LED chip and the bonding wire with a translucent sealing resin, the bonding wires are arranged so as to come out of two from one electrode, When the ball is formed at the tip of the first bonding wire, the capillary is lowered, and when the ball contacts the LED element electrode, heat, load, and ultrasonic waves are transmitted to the ball to bond the bonding wire. Process and position where the capillary rises to a certain height and hits the 2nd bond 2nd bonding process in which the low-loop shape of the bonding wire is determined by the trajectory of the capillary, the capillary descends, the bonding wire is pressed onto the upper surface electrode pattern, and the bonding wire is joined by applying heat, load, and ultrasonic waves. After that, the capillary rises, a bonding wire having a certain length is secured at the tip of the capillary, and then the cutting process is performed by cutting the bonding wire at the 2nd bond joint by pulling. A high voltage is applied to the tip of the length of the bonding wire, a spark is blown, the gold is melted by the heat, a ball is formed at the tip of the bonding wire by surface tension, and the first bonding wire overlaps with the first bond. Connect the second bonding wire as The first bonding step, the capillary rises to a certain height, and the two bonding wires move to a position where a 2nd bond having the same length in the plane and shifted in direction is hit, and the trajectory of the capillary 2nd bonding process that determines the normal loop shape of the bonding wire, presses it onto the upper electrode pattern, and joins the bonding wire by applying heat, load, and ultrasonic waves, and then the capillary rises and a certain length is attached to the tip of the capillary A method of manufacturing a light-emitting diode, comprising: cutting a bonding wire at a 2nd bond bonding portion by pulling the bonding wire after securing the bonding wire.

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