JP2008285179A - Taping device and method for controlling the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a taping device for inspecting the appearance of a semiconductor product inserted into a carrier tape pocket, efficiently replacing a defective product with a good product when the defective product is found, and exhibiting a high rate of operation, and a method for controlling the device. <P>SOLUTION: The taping device is equipped with a carrier tape driving mechanism 1 for carrying the carrier tape T and intermittently transferring this carrier tape T, and a holding mechanism 2 installed on a main table for carrying the semiconductor product onto the taping device. The taping device is also equipped with an appearance inspecting part 3 for taking the image of the appearance of the semiconductor product W stored in the pocket and detecting the product stored in the pocket and positioned in an unacceptable orientation or having an unacceptable appearance, and a discharging mechanism 4 for discharging the semiconductor product W having an unacceptable appearance from the pocket by sucking it. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a taping device for inserting an electronic component such as a small semiconductor product into a pocket of a carrier tape and sealing it with a seal, and a control method therefor.

  In the manufacturing process of electronic components, an apparatus for transporting products while inspecting them is indispensable. For example, in a manufacturing process of a discrete semiconductor such as a diode or a small semiconductor product such as a small pin IC, a test handler is used as an apparatus for transporting the product while inspecting it. The most common test handler includes a test device that tests the electrical characteristics of a product, a marking device that marks the surface of the product, a taping device that packs the product in a carrier tape, etc. The process of each process is performed while conveying an electronic component to each apparatus by the conveyance unit.

  In the taping device that constitutes a part of the taping device as described above, whether the semiconductor product accommodated in the carrier tape is accommodated in the correct direction, or is there no shape defect or foreign matter mixed in the accommodated semiconductor product? A semiconductor product determined to be defective in this appearance inspection is removed from the carrier tape. The carrier tape contains a large number of semiconductor products, but if any defective product is mixed, the entire carrier tape must be discarded. This is a very important process.

Defective products in the carrier tape are discriminated by visual inspection by an operator or by a camera provided near the carrier tape, and when a defective product is found, the manufacturing apparatus is temporarily stopped and the operator manually The excision was performed automatically by exchanging or mechanical punching (Patent Document 1).
JP 2003-165506 A

  However, when a defective product is found, the replacement of the manufacturing equipment with a non-defective product stops the entire test handler with each process as described above, leading to a decrease in productivity. It was. In addition, due to the recent miniaturization of semiconductor products, it is very difficult for an operator to replace a semiconductor product manually, and there is a problem that the product is damaged.

  Further, in the method of mechanical punching as in Patent Document 1, the processing can be continued without stopping the manufacturing apparatus, but due to the punching of the carrier tape, a part where the product is not stored is generated in some places of the tape. It was.

  The present invention has been proposed in order to solve the above-described problems of the prior art. The purpose of the present invention is to inspect the appearance of a semiconductor product inserted into a carrier tape pocket and find a defective product. In such a case, it is an object of the present invention to provide a taping device that can be efficiently replaced with a non-defective product and a control method thereof.

  In order to achieve the above object, a first aspect of the present invention provides a carrier tape driving unit that holds a carrier tape and accommodates an electronic component in a pocket provided on the carrier tape to intermittently transfer the carrier tape; In a taping device for holding and transferring an electronic component to an electronic component receiving position of a carrier tape and controlling the holding unit for inserting the electronic component into a pocket at the receiving position and sequentially storing and packing the electronic components in the pocket An appearance inspection unit that captures and detects a defect of the electronic component accommodated in the pocket, and an electronic component that is determined to be defective by the appearance inspection unit to a discharge position that is one pocket downstream from the accommodation position. A defective product discharge section that discharges from the pocket, and the carrier tape drive section discharges the electronic component from the pocket. After, and returning the empty pocket in said discharge position to the stowed position.

  The invention of claim 4 captures the invention of claim 1 from the viewpoint of a method. The carrier tape is held, the electronic component is accommodated in a pocket provided in the carrier tape, and the carrier tape is intermittently transferred. The electronic component is sequentially accommodated in the pocket by controlling the carrier tape driving unit and the holding unit that holds and transfers the electronic component to the electronic component accommodation position of the carrier tape and inserts the electronic component into the pocket at the accommodation position. In the control method of the taping device to be packed, the appearance inspection step of performing the appearance inspection of the electronic component by the appearance inspection section that images and detects the defect of the electronic component accommodated in the pocket, and the defect in the appearance inspection step. The determined electronic component is sucked from the pocket by the defective product discharge section at a discharge position one pocket downstream from the storage position. A defective product discharging step, and a step of returning an empty pocket at the discharge position to the accommodation position after the defective product discharge unit discharges the electronic component from the pocket by the carrier tape driving unit. It is characterized by.

  In the inventions of claims 1 and 4 as described above, when an appearance defect or the like is found in the electronic component in the carrier tape, this is automatically detected by the appearance inspection unit, and the defective product is adsorbed by the discharge unit. Since it can hold | maintain and discharge | emit, it is not necessary to stop a manufacturing apparatus and replace | exchange for a good product like the past, and it is excellent in productivity. In addition, it is not necessary for an operator to manually exchange electronic components for minute electronic components, and high-quality products can be provided.

  In addition, after the defective electronic component is discharged from the discharge position by the discharge unit, the carrier tape is returned for one discharged pocket, so the defective product and the non-defective product can be automatically replaced. Unlike the case where defective products are discharged by punching out non-defective products, there is no possibility that the pocket of the carrier tape is empty due to the discharge of defective products.

  According to the second aspect of the present invention, there is provided a carrier tape driving unit that holds a carrier tape and accommodates an electronic component in a pocket provided on the carrier tape and intermittently transfers the carrier tape, and an electronic component accommodation position of the carrier tape. In the taping device for holding and transferring the electronic component and controlling the holding unit for inserting the electronic component into the pocket at the receiving position and sequentially storing and packing the electronic component in the pocket, the electronic received in the pocket A visual inspection unit that captures and detects a defect of a component; and a defective product discharge unit that discharges an electronic component determined to be defective by the visual inspection unit from the pocket at a discharge position. The discharge position is common, the holding part and the defective product discharge part are provided in common, and the carrier tape drive part is an electronic part in the appearance inspection part. If the defective is detected, and transporting the carrier tape, and returning the pockets in the appearance inspection position to the housing discharge position.

  The invention of claim 5 captures the invention of claim 2 from the viewpoint of a method. The carrier tape is held, the electronic component is accommodated in a pocket provided in the carrier tape, and the carrier tape is intermittently transferred. The electronic component is sequentially accommodated in the pocket by controlling the carrier tape driving unit and the holding unit that holds and transfers the electronic component to the electronic component accommodation position of the carrier tape and inserts the electronic component into the pocket at the accommodation position. In the control method of the taping device to be packed, the appearance inspection step of performing the appearance inspection of the electronic component by the appearance inspection section that images and detects the defect of the electronic component accommodated in the pocket, and the defect in the appearance inspection step. A defective product discharging step of sucking and discharging the determined electronic component from the pocket at a discharge position by a defective product discharging section; And the discharge position are common, the holding unit and the defective product discharge unit are provided in common, and when the carrier tape drive unit detects a defect of the electronic component in the appearance inspection unit, Transferring the carrier tape and returning the pocket at the appearance inspection position to the accommodation discharge position.

  In the inventions of claims 2 and 5 as described above, in addition to the effects of the inventions of claims 1 and 4, the discharge part and the holding part can be made common, thereby simplifying the device configuration. Is possible.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the position taken by the appearance inspection unit on the carrier tape is covered with a glass cover, and the glass cover is slidable on the carrier tape. The defective product discharge section includes a lever that slides the glass cover, and the electronic component is discharged from the pocket while being opened by the lever.

  In the invention of claim 3 as described above, since the discharge position is covered with the glass cover, it is possible to prevent reflection of light that hinders imaging of the appearance inspection unit.

  According to the present invention, the appearance inspection of the semiconductor product inserted into the carrier tape pocket is performed, and when a defective product is found, it can be efficiently replaced with a non-defective product, and the taping device with high operating rate and its control A method can be provided.

  Next, the best mode for carrying out the present invention will be described with reference to FIGS.

(1) Embodiment of the present invention [Configuration of embodiment]
As shown in FIG. 1, the taping apparatus according to the present embodiment is equipped with a carrier tape T and a carrier tape drive mechanism 1 for intermittently transferring the carrier tape T and a main table (not shown) and a semiconductor. And a holding mechanism 2 for transporting the product onto the taping device.

  The taping device also picks up the appearance inspection unit 3 that picks up an appearance of the semiconductor product W accommodated in the pocket and detects a defect or an appearance defect in the direction of accommodation in the carrier tape, and the semiconductor product W having an appearance defect. And a discharge mechanism 4 for discharging from the pocket.

  The carrier tape drive mechanism 1 includes a sprocket 11 that carries a protrusion in an embossed hole (not shown) of the carrier tape T and conveys it, a motor 12 that drives the sprocket 11 to rotate, and a conveyance path 13 that conveys the carrier tape T horizontally. With. Downstream of the transport path 13, a seal S that is attached to the surface of the carrier tape T and a sealing iron 16 that guides the seal S onto the carrier tape T are provided.

  Further, as shown in the plan view of FIG. 2, the carrier tape drive mechanism 1 is parallel to the discharge mechanism 4 on the same axis when the appearance inspection unit 3 finds a defective product from the inside of the pocket. A moving mechanism is provided.

  On the carrier tape T of the carrier tape drive mechanism 1, a tape cover 14 and a glass cover 15 are provided. The glass cover 15 is provided so as to be slidable relative to the tape cover 14 with respect to the tape cover 14, and is urged toward the distal end direction. The glass cover 15 is provided so as to cover a position Q that is one pocket downstream from the accommodation position P in which the holding mechanism 2 inserts the semiconductor product W, and the tape cover 14 covers further downstream from the position Q. It is like that.

  The holding mechanism 2 includes an adsorption nozzle 21 that is driven in the vertical direction, that is, the Z-axis direction to adsorb the semiconductor product W, and adsorbs or releases the semiconductor product W by vacuum adsorption, and rotates the main table M. Accordingly, the semiconductor product W is carried to the semiconductor product accommodation position P of the carrier tape T, and the semiconductor product W is inserted into the pocket at the position P. As shown in the plan view of FIG. 2, the main table M has various processing steps such as an electrical measurement inspection process, a direction determination process, and a stamping process on the semiconductor product W at the circumferentially equidistant positions. Is to be applied.

  The appearance inspection unit 3 images the appearance of the semiconductor product W accommodated in the pocket by an imaging means such as a camera at the inspection discharge position Q downstream of the carrier tape by one pocket of the carrier tape, and is accommodated in the pocket. It is a means for determining whether the direction of the semiconductor product W is correct or whether an appearance defect of the semiconductor product W has occurred.

  The discharge mechanism 4 includes a suction nozzle 41 for discharge that is driven in the vertical direction, that is, the Z-axis direction, thereby holding the semiconductor product W accommodated in the pocket by vacuum suction and discharging it from the pocket. . As shown in FIG. 2A, the discharge mechanism 4 is disposed at a position separated from the normal position of the carrier tape drive mechanism 1 on which the carrier tape T is mounted. Specifically, the carrier tape drive mechanism is provided on a position Y line parallel to the transport direction X-line of the carrier tape T, and when a defective product is found in the appearance inspection unit 3 as shown in FIG. 1 is moved onto a position Y line parallel to the transport direction X-line of the tape T by a mechanism that translates this, and in response to this, a discharge mechanism 4 provided at a separated position on the Y-line carries a carrier on the Y-line. It moves to the inspection discharge position Q of the tape drive mechanism 1.

  Here, as shown in FIG. 3, the discharge mechanism 4 includes a lever 42 for pushing the glass cover 15 to the tape cover 14 side. The lever 42 is attached independently of the discharge suction nozzle 41, and covers the inspection discharge position when the discharge mechanism 4 moves on the Y axis toward the carrier tape drive mechanism 1 as described above. The glass cover 15 is pushed open.

[Effects of Embodiment]
The operation of the present embodiment having the above configuration will be described with reference to the drawings.

  The electronic component that has been subjected to each process such as the electrical property inspection process and the marking process is conveyed to the taping device while being conveyed by the holding mechanism 2 provided on the main table M.

  FIG. 4 illustrates the operation of the taping device. As shown in FIG. 4A, the suction nozzle 21 of the holding mechanism 2 provided on the main table M descends at the storage position P while holding the semiconductor product W4, as shown in FIG. Then, it is accommodated in the pocket of the carrier tape T and ascends as shown in FIG.

  During this time, the appearance inspection unit 3 performs an appearance inspection of the semiconductor product W that passes through the inspection discharge position Q, and detects the presence or absence of an appearance defect such as a direction difference. At this time, since the inspection discharge position Q is covered with the glass cover 15, it is possible to prevent reflection of light that hinders the imaging of the appearance inspection unit 3.

  When an appearance defect of the semiconductor product W is detected in the appearance inspection unit 3, the carrier tape drive mechanism 1 stops feeding the carrier tape, and the entire carrier tape drive mechanism 1 is discharged as shown in FIG. The mechanism 4 is translated to a position on the same axis as the mechanism 4.

  Next, as shown in FIG. 2B or FIG. 4D, the discharge mechanism 4 moves on the Y axis in the direction of the carrier tape drive mechanism 1 and stops on the inspection discharge position Q. At this time, the lever 42 provided in the discharge mechanism 4 pushes and opens the glass cover 15 on the carrier tape T toward the tape cover 14 as the discharge mechanism 4 moves on the Y axis.

  In this state, as shown in FIG. 4 (e), the suction nozzle 41 for discharge is lowered, and as shown in FIG. 4 (f), the semiconductor product W4 is suctioned and held up, and the semiconductor product W4 is lifted from the pocket. Discharge. At the same time, the appearance inspection unit 3 checks whether or not the semiconductor product W4 is discharged from the pocket.

  The discharge mechanism 4 moves on the Y axis toward the original position, releases the suction of the semiconductor product W4 held at the original position, and discharges the product to a discharge box or the like installed at the original position. When the discharge mechanism 4 moves to the original position, the glass cover 15 of the discharge mechanism 4 is urged to return to the position covering the inspection discharge position Q as shown in FIG.

  At the same time, the carrier tape drive mechanism 1 translates from the Y axis to the X axis as shown in FIG. Then, as shown in FIG. 4 (h), the motor 12 rotates the sprocket 11 to return the carrier tape T by one pocket in the direction opposite to the transport direction.

  As described above, the taping device of the present embodiment normally repeats the operations shown in FIGS. 4A to 4C, but in the pocket that is conveyed to the inspection discharge position Q in the appearance inspection unit 3. When the appearance inspection of the semiconductor product W accommodated in the container is detected and the appearance defect is detected, the processes shown in FIGS. 4D to 4H are performed, and the defective product is discharged from the pocket of the carrier tape T. It is supposed to be.

  In the taping device of the present embodiment as described above, when an appearance defect or the like is found in a semiconductor product in the carrier tape, the appearance inspection unit automatically detects the appearance defect of the semiconductor product, and detects the defective product. Since it is possible to make it a non-defective product by sucking and holding it by the discharge mechanism 4 and returning the carrier tape by one pocket, it is necessary to stop the manufacturing apparatus and replace it with a non-defective product as before. There is no productivity. In addition, it is not necessary for an operator to manually replace a semiconductor product with a minute semiconductor product, and a high-quality product can be provided.

  In addition, when the defective semiconductor product is discharged from the inspection discharge position Q by the discharge mechanism 4 and then the carrier tape is returned by one discharged pocket, the defective product is discharged by punching out the defective portion as in the past. Unlike the case, the pocket of the carrier tape T does not become empty due to the discharge of defective products.

(2) Other Embodiments The present invention includes not only the aspects exemplified in the above-described embodiments but also the following aspects. For example, the glass cover provided on the carrier tape is not an essential component, and the effects of the present invention can be achieved without providing the glass cover.

  In the present invention, the discharge mechanism 4 and the holding mechanism 2 can be made common. That is, it is possible to discharge the semiconductor product W determined to be defective in appearance by the suction nozzle 21 provided on the main table M. In this case, it is not necessary to provide the discharge suction nozzle 41 and the lever 42 provided as the configuration of the discharge mechanism 4 in the above embodiment. In addition, a mechanism for moving the carrier tape drive mechanism 1 when a defective product is discharged becomes unnecessary.

  In this case, as shown in FIG. 5, the storage position and the discharge position of the semiconductor product W are common immediately below the suction nozzle 21 provided on the main table M, and the appearance inspection position is one pocket from the storage / discharge position. It is provided downstream.

  When the processing of this aspect is shown in the flowchart, the following two types are possible as shown in FIGS. 6 (a) and 6 (b). First, in FIG. 6A, in the state where the housing of the semiconductor product W4 from the suction nozzle 21 is completed at the housing position P, the appearance inspection unit 3 performs an appearance inspection of the semiconductor product W3 (S601), and the appearance is defective. It is detected whether or not there is (S602). If there is no appearance defect (NO), the carrier tape drive mechanism 1 advances the carrier tape and permits the next pocket to accommodate a new semiconductor product W5 from the suction nozzle 21 (S603), and returns to S601.

  On the other hand, when an appearance defect is detected (YES in S602), the carrier tape drive mechanism 1 returns the carrier tape by one pocket (S604), and the semiconductor product W3 having the appearance defect is positioned at the accommodation position P. At this time, the suction nozzle 21 is lowered and the defective semiconductor product W3 is discharged (S605). More specifically, when the main table M rotates, the suction is released at the next position on the main table M, and the defective product discharge unit is discharged.

  Next, the carrier tape drive mechanism 1 advances the carrier tape, sends the pocket in which the semiconductor product W3 is stored to the inspection discharge position Q (S606), and confirms that no semiconductor product remains in the pocket. (S607). Then, the carrier tape drive mechanism 1 returns the carrier tape by one pocket (S608), the suction nozzle 21 descends at the storage position P to store the semiconductor product W (S609), and the process returns to S601.

  On the other hand, the process shown in FIG. 6B is intended to speed up the process shown in FIG. 6A, and the main table M is rotated without waiting for the appearance inspection on the carrier tape. . That is, in the state where the housing of the semiconductor product W4 from the suction nozzle 21 is completed at the housing position P, the appearance inspection unit 3 performs an appearance inspection of the semiconductor product W3 (S611) and detects whether there is a defect in appearance. (S612). If there is no appearance defect (NO), the carrier tape drive mechanism 1 advances the carrier tape and permits the next pocket to accommodate a new semiconductor product W5 from the suction nozzle 21 (S613), and returns to S611.

  On the other hand, when an appearance defect is detected (YES in S612), the main table M is reversely rotated and returned by one suction nozzle (S614). Next, the carrier tape drive mechanism 1 returns the carrier tape T by one pocket (S615). The semiconductor product W3 having an appearance defect is located at the housing position P. At this time, the suction nozzle 21 is lowered to pick up the defective semiconductor product W3 (S616).

  Next, the carrier tape drive mechanism 1 advances the carrier tape, sends the pocket in which the semiconductor product W3 is stored to the inspection discharge position Q (S617), and confirms that no semiconductor product remains in the pocket. (S618). During this time, the main table M is rotated by one suction nozzle (S619), and the defective semiconductor product W4 held by the suction nozzle 21 is discharged to the defective product discharge section (S620). Then, the carrier tape drive mechanism 1 returns the carrier tape by one pocket (S618), the suction nozzle 21 descends at the storage position P to store the semiconductor product W (S619), and the process returns to S611.

  Thus, according to the present invention, the discharge mechanism 4 and the holding mechanism 2 can be made common, thereby simplifying the apparatus configuration.

  Moreover, in the said embodiment, as shown in FIG. 2, the discharge mechanism 4 is provided on the position Y line parallel to the conveyance direction X line of the carrier tape T, and as shown in FIG. When a defective product is found in the inspection unit 3, the carrier tape drive mechanism 1 is moved to a position Y parallel to the transport direction X of the tape T by a mechanism for moving the carrier tape drive mechanism 1. The discharge mechanism 4 provided at the separated position is moved on the Y axis to the inspection discharge position Q of the carrier tape drive mechanism 1. However, the present invention is not limited to this mode, and for example, FIG. As shown in a) and (b), the discharge mechanism 4 may be moved to the inspection discharge position Q of the carrier tape drive mechanism 1.

  Thus, if the discharge mechanism 4 is configured so as to be positioned on the inspection discharge position Q of the carrier tape drive mechanism 1 when a defective product is found in the appearance inspection unit 3, the specific aspect thereof is not limited. The carrier tape drive mechanism 1 and the discharge mechanism 4 may be moved as in the embodiment of the present invention, or may be realized by moving only one of them. is there.

  However, it can be said that the mode shown in the above embodiment is the best because, in the carrier tape drive mechanism, one drive shaft is added in the front-rear direction, that is, in the direction perpendicular to the tape feed direction. By using this mechanism, the front and back positions of the tape pocket can be corrected. In this case, the movement in the front-rear direction is servo-driven and the positioning accuracy is high, so that the position of the semiconductor product can be recognized by the camera, and the pocket position can be corrected and stored reliably.

The side view which shows the whole taping apparatus structure in embodiment of this invention. The top view which shows the whole structure of the taping apparatus in embodiment of this invention. The side view which shows the structure of the discharge mechanism in embodiment of this invention. The schematic diagram which shows the effect | action of the taping apparatus in embodiment of this invention. The side view which shows the structure of the taping apparatus in other embodiment of this invention. The flowchart which shows the effect | action of the taping apparatus in other embodiment of this invention. The top view which shows the whole structure of the taping apparatus in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Carrier tape drive mechanism 2 ... Holding mechanism 3 ... Appearance inspection part 4 ... Discharge mechanism 11 ... Sprocket 12 ... Motor 13 ... Conveyance path 14 ... Tape cover 15 ... Glass cover 16 ... Sealing iron 21 ... Adsorption nozzle 41 ... For discharge Suction nozzle 42 ... Lever M ... Main table P ... Housing position P ... Semiconductor product housing position Q ... Inspection discharge position S ... Seal T ... Carrier tape W ... Semiconductor product

Claims (5)

A carrier tape driving unit that holds the carrier tape and stores the electronic component in a pocket provided in the carrier tape and intermittently transfers the carrier tape, and holds and transfers the electronic component to the electronic component receiving position of the carrier tape. In the taping device for controlling and holding the electronic part to be inserted into the pocket at the storage position and sequentially storing and packing the electronic parts in the pocket,
An appearance inspection unit that detects and detects defects in the electronic components housed in the pockets;
An electronic component determined to be defective by the appearance inspection unit, including a defective product discharge unit that discharges from the pocket at a discharge position on the downstream side by one pocket from the storage position;
The taping device according to claim 1, wherein the carrier tape drive unit returns an empty pocket at the discharge position to the storage position after the defective product discharge unit discharges the electronic component from the pocket. A carrier tape driving unit that holds the carrier tape and stores the electronic component in a pocket provided in the carrier tape and intermittently transfers the carrier tape, and holds and transfers the electronic component to the electronic component receiving position of the carrier tape. In the taping device for controlling and holding the electronic part to be inserted into the pocket at the storage position and sequentially storing and packing the electronic parts in the pocket,
An appearance inspection unit that detects and detects defects in the electronic components housed in the pockets;
An electronic component determined to be defective by the appearance inspection unit, and a defective product discharge unit that discharges the electronic component from the pocket at a discharge position;
The accommodation position and the discharge position are common.
The holding part and the defective product discharge part are provided in common,
The carrier tape driving unit is configured to transfer the carrier tape and return the pocket at the appearance inspection position to the accommodation / discharge position when a defect of an electronic component is detected by the appearance inspection unit. apparatus. The position to be imaged by the appearance inspection unit on the carrier tape is covered with a glass cover, and this glass cover is provided so as to be slidable on the carrier tape,
The taping apparatus according to claim 1, wherein the defective product discharge section includes a lever that slides the glass cover, and discharges the electronic component from the pocket in an open state by the lever. A carrier tape driving unit that holds the carrier tape and stores the electronic component in a pocket provided in the carrier tape and intermittently transfers the carrier tape, and holds and transfers the electronic component to the electronic component receiving position of the carrier tape. Then, in the control method of the taping device for controlling the holding unit for inserting the electronic component into the pocket at the storage position and sequentially storing and packing the electronic component in the pocket,
An appearance inspection step of inspecting the appearance of the electronic component by an appearance inspection unit that images and detects defects in the electronic component accommodated in the pocket;
A defective product discharging step of sucking and discharging the electronic component determined to be defective in the appearance inspection step from the pocket at a discharge position on the downstream side by one pocket from the housing position by the defective product discharge unit;
And a step of returning the empty pocket at the discharge position to the storage position after the defective product discharge section discharges the electronic component from the pocket by the carrier tape driving section. Method. A carrier tape driving unit that holds the carrier tape and stores the electronic component in a pocket provided in the carrier tape and intermittently transfers the carrier tape, and holds and transfers the electronic component to the electronic component receiving position of the carrier tape. Then, in the control method of the taping device for controlling the holding unit for inserting the electronic component into the pocket at the storage position and sequentially storing and packing the electronic component in the pocket,
An appearance inspection step of inspecting the appearance of the electronic component by an appearance inspection unit that images and detects defects in the electronic component accommodated in the pocket;
A defective product discharging step of sucking and discharging the electronic component determined to be defective in the appearance inspection step from the pocket at a discharge position by a defective product discharging unit;
The accommodation position and the discharge position are common.
The holding part and the defective product discharge part are provided in common,
Including transferring the carrier tape to return the pocket at the appearance inspection position to the accommodation discharge position when the carrier tape driving unit detects a defect of the electronic component in the appearance inspection section. A control method for a taping device.

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