JP2008281570A - Circuit device provided with three-dimensional molded circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit device equipped with three-dimensional shaping circuit board that reduces the utilization frequency of adhesives, such as those used conventionally, improves assembly property between three-dimensional shaping circuit board and external lead-out terminals, achieves lower cost and higher-quality, and further reduces number of parts, as well as, makes the flexibility of the shapes of base increased. <P>SOLUTION: To a three-dimensional shaping circuit board 1 in which circuit section is formed on a molded component that has a stereoscopic shape, a plurality of external lead-out terminals 3 are fixed through integrally molding. A three-dimensional shaping circuit block 10, in which a pyroelectrical material element 9 and electronic components for processing signals and a signal processing circuit are mounted on a three-dimensional shaping circuit board 1, is packaged in a housing 6 so as to constitute an infrared detector 11. The housing 6 includes a cap 7 provided with a window portion 12 that allows infrared radiation to transmit from the outside and an infrared transmission filter 13 attached to the cap portion 12 on the pyroelectrical material element 9, and a base 8 for retaining the three-dimensional shaping circuit board 1, wherein the base 8 is integrally molded to the three-dimensional shaping circuit board 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a circuit device including a three-dimensional molded circuit board, and more particularly to a structure of an infrared detector, for example.

  The three-dimensional molded circuit board (MID: Molded Interconnect Device) can respond to the recent downsizing, multifunction, and cost reduction of electronic devices, and has the same characteristics when used in infrared detectors. You can have it.

  A conventional infrared detector is a three-dimensional molded circuit in which a pyroelectric element for detecting infrared rays, an electronic component for processing a signal output from the pyroelectric element, and a signal processing circuit are mounted on a three-dimensional molded circuit board. The block is packaged in a housing. The three-dimensional molded circuit board is connected to the external lead terminal by soldering, conductive adhesive, laser welding or the like, and the three-dimensional molded circuit board and the external lead terminal are held by the housing.

  For example, there are Patent Documents 1 and 2. In this conventional example, the three-dimensional molded circuit board uses an insulating adhesive in a portion that requires holding and insulation with respect to the housing with the external lead-out terminal, and a portion that requires electrical connection. In this case, a conductive adhesive is used. For this reason, there are problems that the adhesive curing time is long and the connection reliability of the adhesive is lowered due to variations in the application of the adhesive.

  As another conventional example, for example, as shown in FIG. 17, a three-dimensional molded circuit board 1 on which a mounting component is mounted is fixed to a stem in which a metal base 8 ′ and an external lead-out terminal 3 are integrated with an insulating adhesive 50. The conductive adhesive 51 is used for the connection between the external lead-out terminal 3 that requires electrical connection and the three-dimensional molded circuit board 1.

For this reason, the assembly lead time is long, and the electrical connection portion is fixed by the adhesive, so that the reliability of the electrical connection is low. In addition, in the conventional method of joining with an adhesive, there is a problem that an adhesive curing step is separately provided, and it is necessary to wait until the adhesive is cured. Increasing the number of steps is not only troublesome and costly, but also causes problems such as poor adhesion due to variations in the application of the adhesive, and the quality of the infrared detector is reduced. In addition, if solder is used for the parts that require electrical connection and holding, the melting temperature is high, and therefore there is a problem that the quality of the circuit components is adversely affected by the damage of the circuit components or the thermal deformation of the molded product. In addition, when laser welding is used, there is a problem that a highly accurate facility is required. Reference numeral 7 in the figure denotes a cap for packaging the three-dimensional molded circuit board 1 and is fixed to the metal base 8 ′ by resistance welding or the like in the final assembly process.
Japanese Patent Application No. 11-9620 Japanese Patent Application No. 8-100769

  The present invention was invented in view of the problems of the above-described conventional example, and the object thereof is to reduce the frequency of use of an adhesive as in the prior art, and to provide a three-dimensional molded circuit board and an external lead terminal. The present invention relates to a circuit device including a three-dimensional molded circuit board that can improve the assembly performance, can be manufactured at a low cost and can be improved in quality, and can further reduce the number of components.

  In order to solve the above-mentioned problem, according to the first aspect of the present invention, a plurality of external lead-out terminals 3 are fixed by integral molding to a three-dimensional molded circuit board 1 in which a circuit portion 2 is formed on a molded product having a three-dimensional shape. Therefore, it is possible to reduce the frequency of use of conductive adhesives and insulating adhesives as in the prior art, and it is not necessary to join the three-dimensional molded circuit board 1 and the external lead-out terminal 3 in the subsequent process. Assembling property can be improved.

  Further, since the three-dimensional molded circuit board 1 is packaged in the housing 6 and the external lead-out terminal 3 protrudes outside the housing 6, the step of integrally attaching the external lead-out terminal 3 to the conventional housing is omitted. it can.

  In addition, a pyroelectric element 9 that detects infrared rays, an electronic component that processes a signal output from the pyroelectric element 9, and a signal processing circuit are mounted on the three-dimensional molded circuit board 1 with the external lead-out terminal 3. An infrared detector 11 is configured by packaging the three-dimensional molded circuit block 10 formed in the housing 6. The housing 6 includes a window portion 12 for transmitting infrared rays to the pyroelectric element 9 from the outside, and the window portion 12. Since the cap 7 having the infrared transmission filter 13 attached to the base and the base 8 for holding the three-dimensional molded circuit board 1 are assembled, the assembly of the three-dimensional molded circuit board 1 and the external lead-out terminal 3 is good. In addition, it is possible to produce the infrared detector 11 with low cost and high quality and high reliability.

  Further, since the base 8 is integrally formed with the three-dimensional molded circuit board 1, the number of parts can be reduced and the degree of freedom of the shape of the base 8 can be increased.

  The invention described in claim 2 is preferably characterized in that, in claim 1, the thin metal plate 21 is integrally formed on the base 8 portion of the three-dimensional molded circuit board 1 by insert molding. 21 can be easily attached to the base 8 portion, and the electromagnetic shielding property of the cap 7 can be further improved.

  The invention described in claim 3 is preferably characterized in that, in claim 1, the base 8 is subjected to conductive plating. In this case, even if the base 8 material is a resin, the electromagnetic shielding property is improved. Can be made.

  The invention described in claim 4 is preferably characterized in that, in claim 2 or claim 3, the cap 7 is joined to the base 8 portion of the three-dimensional molded circuit board 1 by heat welding. Compared with the bonding process between the three-dimensional molded circuit board and the base and the welding process between the cap and the base, the assemblability and the sealing performance can be further improved.

  The invention described in claim 5 is preferably characterized in that, in claim 4, the base 8 portion of the three-dimensional molded circuit board 1 is made of a resin having a lower melting temperature characteristic than that of the molded resin for the circuit board. In this case, the shape and quality of the three-dimensional molded circuit block 10 in the subsequent welding process can be stabilized.

  According to a sixth aspect of the present invention, in the fifth aspect of the present invention, it is preferable that a fitting groove 22 for fitting with the cap 7 is provided in the base 8 portion of the three-dimensional molded circuit board 1. The step of welding the cap and the base can be omitted, and the three-dimensional molded circuit board 1 and the cap 7 can be easily and reliably sealed by the fitting structure.

  According to the seventh aspect of the present invention, a plurality of external lead-out terminals 3 are fixed by integral molding to a three-dimensional molded circuit board 1 in which a circuit portion 2 is formed on a molded product having a three-dimensional shape. The molded circuit board 1 is packaged in the housing 6, and the external lead-out terminals 3 protrude outside the housing 6. The pyroelectric element for detecting infrared rays is detected on the three-dimensional molded circuit board 1 with the external lead-out terminals 3. 9 and an infrared detector 11 is formed by packaging a three-dimensional molded circuit block 10 on which an electronic component for processing a signal output from the pyroelectric element 9 and a signal processing circuit are mounted in a housing 6. The housing 6 includes a cap 7 having a window 12 for transmitting infrared rays to the pyroelectric element 9 from the outside, and an infrared transmission filter 13 attached to the window 12, and a three-dimensional structure. A base 8 for holding the circuit board 1, the base 8 is made of a metal material, and the base 8 is integrally formed with the three-dimensional molded circuit board 1 by insert molding. Since the external lead-out terminal 3 can be attached simultaneously with the molding of 1, the conventional bonding process between the three-dimensional molded circuit board and the base can be omitted.

  As described above, according to the first aspect of the present invention, since a plurality of external lead-out terminals are fixed by integral molding to a three-dimensional molded circuit board in which a circuit portion is formed on a molded product having a three-dimensional shape. As a result, it is possible to reduce the frequency of use of the conductive adhesive, the insulating adhesive, and the like, and the process of joining the three-dimensional molded circuit board and the external lead-out terminal in the subsequent process becomes unnecessary, and the manufacturing process can be shortened. The assemblability of the three-dimensional molded circuit board with external lead-out terminals can be improved, and the cost can be reduced, the quality can be improved, and the reliability can be improved.

  In addition, since the three-dimensional molded circuit board is packaged in the housing and the external lead-out terminal protrudes outside the housing, there is no need to attach the external lead-out terminal integrally to the housing as in the prior art. It gets even better.

  Further, a three-dimensional molding in which a pyroelectric element that detects infrared rays, an electronic component that processes a signal output from the pyroelectric element, and a signal processing circuit are mounted on the three-dimensional molding circuit board with an external lead-out terminal. An infrared detector is configured by packaging a circuit block in a housing, and the housing includes a window portion through which infrared rays are transmitted from outside to the pyroelectric element and an infrared transmission filter attached to the window portion. And a base for holding the three-dimensional molded circuit board, the assembly of the three-dimensional molded circuit board and the external lead-out terminal is good, and can be produced at low cost, and the infrared detection is highly reliable. A vessel is obtained.

  Further, since the base is integrally formed with the three-dimensional molded circuit board, the number of parts can be reduced, the degree of freedom of the shape of the base can be increased, and a change in the base shape can be easily handled.

  According to the second aspect of the invention, in addition to the effect of the first aspect, the sheet metal material is integrally formed by insert molding on the base portion of the three-dimensional molded circuit board. The electromagnetic shielding property can be improved reliably.

  According to the third aspect of the invention, in addition to the effect of the first aspect, since the base is subjected to conductive plating, the electromagnetic shielding property can be improved even if the base material is a resin.

  In the invention described in claim 4, in addition to the effect described in claim 2 or claim 3, since the cap is joined to the base portion of the three-dimensional molded circuit board by heat welding, the conventional three-dimensional molded circuit board and the base Compared with the bonding process and the process of welding the cap and the base, the assemblability is greatly improved, and the sealing performance of the circuit device provided with the three-dimensional molded circuit board is further improved by welding the base portion and the cap. Can be improved.

  In addition to the effect of the fourth aspect, the base portion of the three-dimensional molded circuit board is made of a resin having a lower melting temperature than the molded resin for the circuit board. It is possible to ensure the stability of the shape and quality of the three-dimensional molded circuit block by the process.

  According to the sixth aspect of the invention, in addition to the effect of the fifth aspect, since the fitting groove for fitting with the cap is provided in the base portion of the three-dimensional molded circuit board, the conventional process of welding the cap and the base is performed. The three-dimensional molded circuit board and the cap can be easily and surely sealed by the fitting structure, and the sealing performance can be improved at low cost.

  According to the seventh aspect of the present invention, since the base is made of a metal material and the base is integrally formed with the three-dimensional molded circuit board by insert molding, the external lead-out terminal can be attached simultaneously with the molding of the three-dimensional molded circuit board. Thus, the conventional bonding process between the three-dimensional molded circuit board and the base can be omitted, and the assemblability can be further improved.

  Hereinafter, the present invention will be described based on embodiments shown in the accompanying drawings.

  In the present embodiment, an infrared detector 11 that detects infrared rays radiated from a human body and an object will be described as an example.

  1 to 6 show the basic configuration of the present invention. In the example shown in FIG. 1, a three-dimensional molded circuit board 1 having a three-dimensional shape (MID: hereinafter referred to as “three-dimensional circuit board 1”) includes a pyroelectric element 9 that detects infrared rays, and a pyroelectric element. An electronic component for processing a signal output from 9 and a signal processing circuit (not shown) are mounted, and three external lead terminals 3 are integrally provided on the three-dimensional circuit board 1 to form a three-dimensional molding circuit. A block 10 is configured, and an infrared detector 11 is configured by packaging a portion other than the external lead-out terminal 3 of the three-dimensional molded circuit block 10 in a housing 6.

  The housing 6 includes a cap 7 that houses the molded circuit board 1 and a base 8 that holds the molded circuit board 1. The cap 7 is provided with a window portion 12 through which infrared rays are transmitted to the pyroelectric element 9 from the outside. The window portion 12 is provided with an infrared transmission filter 13.

  As will be described later, three external lead terminals 3 are integrally formed on the three-dimensional circuit board 1 by insert molding, and these external lead terminals 3 penetrate the base 8 and protrude outside. Note that two of the three external lead-out terminals 3 are output external lead-out terminals that do not require electrical connection with the circuit portion 2 of the three-dimensional circuit board 1, and the remaining one external lead-out terminal 3. Is an external lead-out terminal for grounding that requires electrical connection with the circuit part 2 of the three-dimensional circuit board 1, and the ground external lead-out terminal is grounded to the GND side.

  In the molding of the three-dimensional circuit board 1, a thermoplastic resin excellent in thin-walled high fluidity, low-pressure moldability and high heat resistance, for example, a material such as a liquid crystal polymer or polyphthalamide is preliminarily dried at 100 ° C. to 150 ° C. It is created by injection molding under conditions of a mold temperature of 130 ° C to 160 ° C and a resin temperature of 300 ° C to 350 ° C for 8 hours or more.

  At this time, as shown in FIG. 2 (a), a cylindrical metal material is formed as an external lead-out terminal 3 by three insert moldings per one three-dimensional circuit board 1, and the molded product connection side of the external lead-out terminal 3 is the three-dimensional circuit board. 1 is formed so as to penetrate through the terminal mounting molding portion 23. 2A, for example, the thickness d1 of the three-dimensional circuit board 1 is 2 mm, the horizontal width d2 is 6.4 mm, the vertical width d3 is 7.3 mm, and the height d4 of the terminal mounting molding 23 is 3.5 mm. The length d5 of the lead-out terminal 3 is 5 mm to 10 mm, but it is not limited to this value. 2B shows the case where the board-side exposed portion 4 of the external lead-out terminal 3 is flush with the surface of the terminal mounting molded portion 23, and FIG. (C) shows the case where it is depressed more than the surface of the molding part 23 for terminal attachment.

  3A and 3B show an example in which the external lead-out terminal 3 which is an insert part is set in the molding die 25. FIG. In this example, the circuit board molding resin injected from the molding nozzle is filled into the cavity 27 through the gate 26, whereby the base 8 made of a metal material is insert-molded on the three-dimensional circuit board 1. . In this case, the gate shape may be a structure such as a pinpoint gate or a tunnel gate in order to eliminate post-processing. Further, if a cut surface is necessary for the three-dimensional circuit board 1, a cutting allowance for facilitating the cutting work by the cut surface may be provided in the molded product in advance. In this case, the cutting process is performed in the process after the insert molding. Further, since the molded product is small, in order to simplify the handling of the molded product in the subsequent process, a single molded product may be formed by a large number of mold substrates as shown in FIG. In this case as well, if the cut surface 28 is necessary in the same manner as described above, a cutting allowance 29 may be provided in the molded product as shown in FIG.

  Therefore, by joining and fixing the plurality of external lead-out terminals 3 to the terminal mounting molding portion 23 of the three-dimensional circuit board 1 by insert molding, it is not necessary to join the external lead-out terminals 3 and the three-dimensional circuit board 1 in a later process. Thus, the manufacturing process can be shortened. In particular, since the frequency of use of conventional conductive adhesives and insulating adhesives can be reduced, the adhesive curing step can be omitted, the assembling property can be further improved, and production is possible at low cost. In addition, a high-quality and high-reliability infrared detector 11 can be obtained.

  FIG. 5 shows an example of the manufacturing process of the three-dimensional circuit board 1. First, a copper thin film serving as a plating underlayer is formed on the surface of a three-dimensional molded product. This copper thin film may be formed by DC sputtering or RF sputtering. Thereafter, a circuit portion is formed on the three-dimensional molded product by laser patterning and electroplated. In addition to electroplating, plating may be a method using a film transfer method, a photoresist, or the like, for example. Here, as shown in FIG. 6, the surface of the external lead-out terminal 3 is also plated. The hatched portion in FIG. 6 indicates a plating connection portion, and this hatched portion becomes a conductive circuit pattern 5 extending from the circuit portion 2 of the three-dimensional circuit board 1 to the board-side exposed portion 4 of the external lead-out terminal 3. The lead-out terminal 3 can be conducted. Thereby, the electrical connection between the external lead-out terminal 3 and the three-dimensional circuit board 1 becomes possible, and the assemblability is further improved as compared with the electrical connection using the conventional conductive adhesive. In the case where the surface of the external lead-out terminal 3 is plated, if the diameter of the external lead-out terminal 3 becomes larger than the predetermined diameter tolerance range due to plating, the diameter of the external lead-out terminal 3 is reduced in advance. For example, if the plating thickness is 10 μm, the diameter of the external lead-out terminal 3 may be reduced by about 0.02 mm.

  Other basic configurations of the present invention are shown in FIGS. In this example, a base 8 made of a metal material is provided with the same number (three in this example) of terminal insertion holes 14 as the number of external lead terminals 3 fixed to the three-dimensional circuit board 1. It protrudes from the insertion hole 14 to the outside. One of the three external lead-out terminals 3 is a ground external lead-out terminal for grounding the circuit portion of the three-dimensional circuit board 1 to GND.

  In consideration of the dimension between the external lead-out terminals 3, the same number (three in this example) of terminal lead-out holes 14 as the external lead-out terminals 3 are provided. As shown, a tapered guide surface 31 is provided on the insertion side in advance, and when the external lead-out terminal 3 is pushed into the terminal insertion hole 14, the external lead-out terminal 3 is inserted into the terminal insertion hole 14 along the lead surface 31. Is done. This facilitates positioning of the base 8 and the external lead-out terminal 3 during assembly, and allows the three-dimensional circuit board 1 to be easily fixed at a predetermined position on the base 8.

  Here, as shown in FIG. 10, the three terminal insertion holes 14 are divided into two output terminal insertion holes 14a and one ground terminal insertion hole 14b. The output terminal insertion hole 14a is inserted with an output external lead terminal 3a that does not require electrical connection with the circuit portion of the three-dimensional circuit board 1, and the ground terminal insertion hole 14b has a ground external lead terminal. 3b is inserted. An insulating sealing molding resin 15 concentric with the output external lead-out terminal 3a is disposed on the outer peripheral portion of the output external lead-out terminal 3a, and on the other hand, on the outer peripheral portion of the ground terminal insertion hole 14b. The conductive sealing resin 16 is disposed concentrically with the ground lead-out terminal 3b. The molding resins 15 and 16 for sealing may be integrally formed on the outer peripheral surface of the external lead-out terminal 3, or may be attached to the outer peripheral surfaces of the external lead-out terminals 3a and 3b by press-fitting or fitting, respectively. . Thereafter, the output and ground external lead-out terminals 3a and 3b are inserted into the terminal insertion holes 14a and 14b, respectively, and the inserted portions are joined by ultrasonic welding or the like, whereby the output terminal insertion hole 14a and the output are inserted. The gap 17 with the external lead-out terminal 3a is filled by heat welding of the insulating sealing molding resin 15, whereby the base 8 and the output external lead-out terminal 3a are insulated, and the circuit portion of the three-dimensional circuit board 1 A short circuit with the base 8 can be prevented. On the other hand, the gap 18 between the grounding terminal insertion hole 14b and the grounding external lead-out terminal 3b is filled by heat welding of the conductive sealing molding resin 16, whereby the base 8 and the grounding external lead-out terminal 3b are connected. Short circuit. As a result, the circuit part of the three-dimensional circuit board 1 and the base 8 are grounded via the grounding external lead-out terminals 3b, respectively, so that the internal circuit products are adversely affected by external radio waves (such as the malfunction of the pyroelectric element 9). ) In addition, since all the gaps 17 and 18 between the external lead-out terminals 3 and the terminal insertion holes 14 are sealed with the molding resins 15 and 16 for sealing, the sealing performance of circuit products inside the packaging can be improved. As a result, high quality and high reliability of the infrared detector 11 can be secured.

  The conductive sealing molding resin 15 and the insulating sealing molding resin 16 are each preferably a resin having a lower melting temperature characteristic than the molding material of the molded circuit board 1. As a result, when the sealing molding resins 15 and 16 are heat-welded in the post-welding process, the thermal effect on the three-dimensional circuit board 1 can be reduced, and the three-dimensional molded circuit block 10 on which electronic components and the like are mounted can be reduced. The stability of shape and quality can be improved.

  Further, a low-melting resin such as polyethylene, polypropylene, or ABS can be used as the sealing molding resins 15 and 16, and simultaneous molding can be performed by two-color molding with a circuit board molding resin. Using the molding die 25 of FIG. 9, the circuit board molding resin is filled into the substrate forming cavity 27 through the gate 26 from one molding nozzle, and the sealing molding resin 15 from the other molding nozzle, 16 are filled into cavities 27 ′ that form gaps 17 and 18 between the external lead-out terminal 3 and the terminal insertion hole 14 through a plurality of gates 26 ′. In molding, by controlling the injection speed of the molding nozzle, the molded circuit board 1 portion and the sealing molding resin 15 and 16 portions can be molded as different resins. In addition, not only the above two-color molding but a mold exchange system may be used. In the example of FIG. 10, it is desirable to make the colors of the molding resins 15 and 16 for sealing, the color of the base 8 material, and the color of the molding resin for circuit boards different, thereby improving the appearance inspection after welding. It will be easy to do.

  11 and 12 show an embodiment of the present invention. As shown in FIGS. 11 and 12, a part of the three-dimensional circuit board 1 is used as a base 8, and the assembly process of the three-dimensional circuit board 1 and the base 8 is omitted. Other configurations are the same as the basic configuration of FIG. 1, and only different points will be described. In this example, the portion that becomes the base 8 is molded integrally when the molded circuit board 1 is molded, and the base 8 portion of the molded circuit board 1 is made of resin at the time of the final assembly process for assembling the cap 7. It can be easily joined by welding. Thus, it is possible to improve the stability of the shape and quality of the three-dimensional molded circuit block in the subsequent welding process. Further, there is an advantage that the assembly process of the three-dimensional circuit board 1 and the base 8 can be omitted, and the degree of freedom of the shape of the base 8 portion is increased.

  Further, in the case where the base 8 portion of the three-dimensional circuit board 1 is integrally molded as described above, it is desirable to use a resin having a lower melting temperature characteristic than the molding resin for the circuit board as the material for the base molding resin. In this case, it is possible to simultaneously mold the base molding resin and the circuit board molding resin by two-color molding using the molding die shown in FIG. Thus, by making the melting point of the molding resin for the base lower than that of the molding resin for the circuit board, it is possible to suppress the thermal influence on the side of the three-dimensional circuit board 1 in the process of heating and welding the cap 7 to the base 8 portion. As a result, the stability of the shape and quality of the three-dimensional molded circuit block can be ensured.

  Further, in order to improve the electromagnetic shielding property of the circuit product, it is desirable to insert-mold a thin metal material 21 in the base 8 portion. As shown in FIGS. 12 and 13 (b), the thin metal plate 21 has an output terminal into which a grounding external lead-out terminal 3a that does not require electrical connection with the base 8 is inserted with a predetermined gap. An insertion hole 40 and a grounding terminal insertion hole 41 into which the grounding lead-out terminal 3b that requires electrical connection with the base 8 is inserted without a gap are provided. The gap between the output terminal insertion holes 40 is filled with insulating molding resin. On the other hand, there is no gap between the grounding terminal insertion hole 41 and the grounding external lead-out terminal 3b, and the grounding external leadout is performed. The terminal 3b and the base 8 are short-circuited.

  Here, FIG. 13A shows an example in which the external lead-out terminal 3 that is an insert part and the thin metal material 21 are set in the molding die 25. In this example, the circuit board molding resin injected from the molding nozzle is filled into the cavity 27 through the gate 26, whereby the sheet metal material 21 and the external lead-out terminal 3 are placed on the molded circuit board 1 which is a molded product. Insert and integrally molded. In addition, in the case where insert molding cannot be performed or in order to improve electromagnetic shielding properties, copper plating is also applied to the surface of the base 8 portion of the three-dimensional circuit board 1 in the same manner as the basic configuration of FIG. At this time, the copper plating of the base 8 portion is prevented from adhering to the portion in contact with the cap 7. Further, the copper plating of the base 8 portion can be performed simultaneously with the formation of the conductive circuit pattern 5 for electrical connection between the three-dimensional circuit board 1 and the external lead-out terminal 3, thereby reducing the number of times of plating. The manufacturing process can be further simplified.

  As still another embodiment of the present invention, as shown in FIG. 14, it is desirable to provide a fitting groove 22 for fitting with the cap 7 in the base 8 portion of the three-dimensional circuit board 1. In this case, the cap 7 is easily welded to the base 8 portion of the three-dimensional circuit board 1 in the final cap 7 assembling process by heat-welding the fitting portion after the cap 7 is fitted in the fitting groove 22. And it can join reliably and in addition to the improvement of an assembly property, the sealing performance of a circuit product can be improved further.

  As still another embodiment of the present invention, as shown in FIG. 15, a base 8 made of a metal material may be inserted and integrally molded when the molded circuit board 1 is molded. Other configurations are the same as the basic configuration of FIG. 1, and only different points will be described. In this example, the assembly process of the three-dimensional circuit board 1, the base 8 and the external lead-out terminal 3 can be largely omitted by insert-molding the base 8 and the external lead-out terminal 3 with respect to the three-dimensional circuit board 1. Further, by using the base 8 as a metal material, it is possible to improve the assemblability without deteriorating the electromagnetic shielding property of the circuit product. The base 8 is provided with two output terminal insertion holes 14a and one grounding terminal insertion hole 14b. The grounding external lead-out terminal 3b, which requires electrical connection with the base 8, is inserted into the grounding terminal. The hole 14b is press-fitted in a conductive state. Further, the connection external lead-out terminal 3a that needs to be insulated from the base 8 is disposed with a sufficient gap from the connection terminal insertion hole 14a, and the gap is filled with an insulating molding resin. . FIG. 16A shows an example in which the base 8 that is an insert part and the external lead-out terminal 3 are set in the molding die 25. In this example, the circuit board molding resin injected from the molding nozzle is filled into the cavity 27 through the gate 26, whereby the base circuit 8 made of a metal material and the external lead are formed with respect to the three-dimensional circuit board 1 which is a molded product. The terminal 3 can be inserted and integrally molded. In addition, in this example, since the copper plating like the said embodiment is unnecessary for the base 8, there also exists an advantage that a manufacturing process can be simplified further by reducing the frequency | count of plating.

It is sectional drawing which shows the basic composition of this invention. (A) is a perspective view in which the same three-dimensional molded circuit board and external lead-out terminal are integrally formed, and (b), (c), and (d) are cross-sectional views taken along line AA of (a), and the external lead-out terminal. The example of the positional relationship of the board | substrate side exposed part and the molding part surface for terminal attachment of a three-dimensional molded circuit board is shown. The molding die same as the above is shown, (a) is a sectional view taken along line BB in (b), and (b) is a sectional view taken along line CC in (a). (A) and (b) are a perspective view of a molded product obtained in large numbers, and an explanatory view of a cutting allowance. It is explanatory drawing of the manufacturing process of a three-dimensional molded circuit board same as the above. It is explanatory drawing of a conductive circuit pattern same as the above. It is an exploded perspective view showing other basic composition. (A)-(c) is explanatory drawing of the state which inserts an external lead-out terminal same as the above into a terminal insertion hole. It is sectional drawing of a shaping die same as the above. It is explanatory drawing of the arrangement | positioning state of a base same as the above, an external derivation | leading-out terminal, and the molding resin for sealing. It is a perspective view explaining embodiment of this invention. It is sectional drawing same as the above. (A) is sectional drawing of a shaping die same as the above, (b) is a perspective view of a sheet metal material and an external lead-out terminal inserted in the die of (a). (A) (b) is sectional drawing explaining the case where a cap is fitted and welded to the fitting groove of a base same as the above. (A) is a perspective view at the time of integrally molding a base on the same three-dimensional molded circuit board, (b) is a sectional view thereof. (A) is sectional drawing of a shaping die same as the above, (b) is a perspective view of a sheet metal material and an external lead-out terminal inserted in the die of (a). (A) is an exploded perspective view of a conventional infrared detector, (b) is a perspective view of a state in which a three-dimensional molded circuit board is bonded to a metal base with an insulating adhesive and a conductive adhesive, and (c) is a final view. It is a perspective view of a cap assembly state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 3D shaping circuit board 2 Circuit part 3 External lead-out terminal 4 Board | substrate side exposed part 5 Conductive circuit pattern 6 Housing 7 Cap 8 Base 9 Pyroelectric element 10 3D shaping circuit block 11 Infrared detector 12 Window part 13 Infrared transmission filter 21 Sheet metal material 22 Fitting groove

Claims (7)

A plurality of external lead-out terminals are fixed by integral molding to a three-dimensional molded circuit board having a circuit portion formed on a molded product having a three-dimensional shape, and a plurality of three-dimensional molded circuit boards are packaged in a housing. The external lead terminal protrudes outside the housing, and the pyroelectric element for detecting infrared rays on the three-dimensional molded circuit board with the external lead terminal, the electronic component for processing the signal output from the pyroelectric element, and the signal An infrared detector is configured by packaging a three-dimensional molded circuit block on which a processing circuit is mounted in a housing, and the housing includes a window portion for transmitting infrared rays to the pyroelectric element from the outside, and the window portion And a base for holding the three-dimensional molded circuit board, wherein the base is a three-dimensional molded circuit board. Circuit device including a three-dimensional molded circuit board, characterized in that it is integrally molded. 2. A circuit device comprising a three-dimensional molded circuit board according to claim 1, wherein a thin metal plate is integrally formed by insert molding on a base portion of the three-dimensional molded circuit board. 2. The circuit device having a three-dimensional molded circuit board according to claim 1, wherein the base is subjected to conductive plating. 4. A circuit device comprising a three-dimensional molded circuit board according to claim 2, wherein a cap is joined to the base portion of the three-dimensional molded circuit board by heat welding. 5. The circuit device having a three-dimensional molded circuit board according to claim 4, wherein the base portion of the three-dimensional molded circuit board is made of a resin having a temperature characteristic lower than that of the molding resin for circuit boards. 6. The circuit device having a three-dimensional molded circuit board according to claim 5, wherein a fitting groove for fitting with the cap is provided in a base portion of the three-dimensional molded circuit board. A plurality of external lead-out terminals are fixed by integral molding to a three-dimensional molded circuit board having a circuit portion formed on a molded product having a three-dimensional shape, and a plurality of three-dimensional molded circuit boards are packaged in a housing. The external lead terminal protrudes outside the housing, and the pyroelectric element for detecting infrared rays on the three-dimensional molded circuit board with the external lead terminal, the electronic component for processing the signal output from the pyroelectric element, and the signal An infrared detector is configured by packaging a three-dimensional molded circuit block on which a processing circuit is mounted in a housing, and the housing includes a window portion for transmitting infrared rays to the pyroelectric element from the outside, and the window portion A cap having an infrared transmission filter attached to the base and a base for holding the three-dimensional molded circuit board. The base is made of a metal material. Circuit device including a three-dimensional molded circuit board, characterized in that integrally molded by insert molding over scan a three-dimensional molded circuit board.

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