JP2008275652A - Electro-optic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent display inferiority due to deterioration of a liquid crystal molecule by suppressing an increase in power consumption accompanying parasite capacity. <P>SOLUTION: In an electro-optical device, an opposite substrate 2 includes: an insulating member 21 formed in a frame region FA; and a conductive film formed in a region including at least a display region DA. The conductive film includes a common electrode 22a, and an impassibility part 22b insulated from the common electrode 22a on an upper face end 211 of the insulating member 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device such as a liquid crystal display device.

  Patent Document 1 describes that a sealing member is disposed outside the drive circuit, and the sealing member surrounds not only the display unit but also the drive circuit. As a result, space can be saved without degrading the reliability of the drive circuit.

  However, in this structure, liquid crystal molecules are also interposed between the drive circuit and the counter electrode, and a DC voltage is always applied between the drive circuit and the counter electrode. Power consumption increases due to the parasitic capacitance generated between them. Further, when a DC voltage is always applied between the drive circuit and the counter electrode, the liquid crystal molecules are polarized and deteriorated. The deterioration of the liquid crystal molecules causes display unevenness in the display area. Further, with the passage of time, the electric field wraps around due to the polarized liquid crystal molecules, and the deterioration is promoted.

In order to solve this problem, Patent Document 2 discloses that a counter electrode overlapping with a drive circuit is partially removed. However, in order to partially remove the counter electrode, it is necessary to perform patterning using a dedicated mask, which causes a new problem that the number of masks and the number of manufacturing processes increase.
JP-A-6-186578 Japanese Patent Laid-Open No. 11-52328

  One object of the present invention is to suppress an increase in power consumption associated with parasitic capacitance. Another object of the present invention is to improve display defects due to deterioration of liquid crystal molecules. Still another object of the present invention is to achieve the above object without increasing the number of masks and the number of manufacturing steps.

  The electro-optical device of the present invention includes a first substrate, a second substrate facing the first substrate, an optical material sandwiched between the first substrate and the second substrate, and the first substrate. A region where the second substrate and the second substrate overlap includes a display region and a frame region around the display region. The second substrate includes an insulating member formed in the frame region and a conductive film formed in a region including at least the display region. The conductive film includes a conduction part and a non-conduction part that is insulated from the conduction part at an upper surface end of the insulating member.

  An optical material is a material that can adjust the amount of light according to an applied voltage or a supplied current, and a material that modulates the light transmittance (or light reflectance) of light from the light source or outside light (ambient light) or self-light-emitting Material is included. Specific optical materials are, for example, liquid crystal materials, inorganic or organic electroluminescent (EL) materials, electrophoretic particles, electrochromic materials, and the like.

  The electro-optical device of the present invention is a general device including an electro-optical element that emits light by an electric action or an electro-optical element that changes the polarization state of light incident from the outside. In other words, both those that emit light themselves and those that control the passage of light from the outside are included. Examples of the electro-optical element include a liquid crystal element, an inorganic or organic EL element, an electrophoretic element, a field emission element (FED), and a surface conduction electron emission element (SED).

  Liquid crystal elements, which are examples of electro-optic elements, are used not only for liquid crystal display elements for image display, but also for image shift elements that sequentially shift pixels optically and parallax barrier elements that can display 3D images. can do. The image shift element has at least one combination of a liquid crystal panel that modulates the polarization state of light and a birefringence element that shifts the optical path according to the polarization state of light emitted from the liquid crystal panel. The parallax barrier panel can display a stereoscopic image by combining with a video display element having a left-eye pixel and a right-eye pixel.

  Electro-optical devices for image display include mobile phones, video cameras, personal computer displays, head mounted displays, rear or front projectors, fax machines with display functions, digital camera finders, portable TVs, car navigation systems Display, PDA (Personal Digital Assistance), medical display, amusement devices such as games and pachinko machines, electronic notebooks, electronic bulletin boards, advertising announcement displays, and the like.

  In the electro-optical device according to the aspect of the invention, the conductive portion and the non-conductive portion of the conductive film are insulated at the upper end portion of the insulating member formed in the frame region of the second substrate. Accordingly, no voltage is applied between the drive circuit formed in the frame region of the first substrate and the non-passing portion of the second substrate in the region facing the first circuit, thereby suppressing an increase in power consumption due to parasitic capacitance. In addition, display defects due to deterioration of optical materials such as liquid crystal molecules can be improved. Furthermore, since the conductive portion and the non-conductive portion can be insulated by forming a conductive film on the insulating member, a conductive portion having a desired shape can be formed without patterning the conductive film. Therefore, the number of masks and the number of manufacturing processes are not increased.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a liquid crystal display device will be described as an example. In addition, the liquid crystal display device includes any type of display device of a transmission type, a reflection type, and a transmission / reflection type.

(Embodiment 1)
FIG. 1 is a plan view schematically showing a liquid crystal display device of the present embodiment, FIG. 2 is a plan view schematically showing a TFT (thin film transistor) substrate 1, and FIG. 3 is a plan view schematically showing a counter substrate 2. 4 is a cross-sectional view taken along line AA in FIG. The liquid crystal display device according to the present embodiment includes a TFT substrate 1, a counter substrate 2 disposed to face the TFT substrate 1, a sealing material 3 provided around the counter substrate 2, a TFT substrate 1, and a counter substrate 2. And a liquid crystal layer 4 including a liquid crystal material surrounded by a sealing material 3.

  The TFT substrate 1 includes a substrate 10 made of glass, resin, silicon or the like, a plurality of scanning lines 12 extending in the row direction, and a plurality extending in the column direction (direction intersecting the row direction) intersecting the scanning lines 12. A signal line 13, a TFT (not shown) provided near the intersection of the scanning line 12 and the signal line 13, a pixel electrode 11 connected to the signal line 13 through the TFT and arranged in a matrix, An alignment film (not shown) covering the pixel electrode 11 is provided.

  Further, the TFT substrate 1 has an external connection terminal for connecting a scanning line driving circuit 5a connected to the scanning line 12, a signal line driving circuit 5b connected to the signal line 13, and a flexible printed circuit board (not shown). 6. The scanning line drive circuit 5 a and the signal line drive circuit 5 b are connected to the external connection terminal 6, and the drive circuits 5 a and 5 b are driven and controlled by the control signal input to the external connection terminal 6. The scanning line driving circuit 5a sequentially selects the scanning lines 12 for each horizontal scanning period (for example, for each row), and outputs a scanning pulse to the selected scanning lines 12. The TFT connected to the scanning line 12 is turned on by the scanning pulse. The signal line driving circuit 5b outputs the image data to the signal line 13, and writes the image data to the pixel electrode 11 through the TFT that is turned on. That is, both drive circuits 5a and 5b control the drive of the pixel electrode 11.

  The scanning line driving circuit 5a and the signal line driving circuit 5b shown in this embodiment are analog or digital full monolithic drivers formed on the substrate 10. The scanning line driving circuit 5a and the signal line driving circuit 5b are formed on the inner side of the seal material 3, and the liquid crystal layer 4 functions as a buffer material that protects the driving circuits 5a and 5b from stress and impact.

  The counter substrate 2 is composed of a substrate 20 made of glass, resin, silicon, etc., a color filter layer (not shown), and a conductive film containing ITO (indium tin oxide), IZO (indium zinc oxide), or the like. A common electrode 22a and an alignment film (not shown) covering the common electrode 22a are provided. The common electrode 22a is disposed so as to face the plurality of pixel electrodes 11 formed on the TFT substrate 1 in common. The common electrode 22a is connected to the external connection terminal 6 on the TFT substrate 1 via a transition electrode (not shown), and the potential of the common electrode 22a is controlled by a control signal input to the external connection terminal 6.

  The area where the TFT substrate 1 and the counter substrate 2 overlap includes the display area DA and the frame area FA around the display area DA, and the area where the TFT substrate 1 protrudes from the counter substrate 2 includes the mounting area MA. By controlling the refractive index of the liquid crystal layer 4 in accordance with the potential difference between the pixel electrode 11 and the common electrode 22a, the transmittance for each pixel is modulated and image display is performed. Therefore, a region where the plurality of pixel electrodes 11 formed on the TFT substrate 1 overlap with the common electrode 22a formed on the counter substrate 2 forms the display region DA.

  The counter substrate 2 has a loop-shaped insulating member 21. The insulating member 21 continuously circulates and surrounds the display area DA in plan view. The conductive film covers the upper surface of the insulating member 21 and is insulated at at least one end portion of both end portions 211 and 212 of the insulating member 21 in a direction intersecting with the extending direction of the insulating member 21. FIG. 4 shows a state in which the conductive film covering the upper surface of the insulating member 21 is insulated at the outer end portion 211 of the insulating member 21.

  Since a potential is applied to the conductive film existing in the display area DA, the conductive film portion inside the outer end portion 211 becomes the common electrode 22a as a conduction portion. On the other hand, the conductive film portion outside the outer end portion 211 is electrically disconnected from the common electrode 22a and becomes a non-permeable portion 22b to which no potential is applied.

  In the present embodiment, since no potential is applied to the non-connection portion 22b including the region facing the drive circuits 5a and 5b, even if a DC voltage is applied to the drive circuits 5a and 5b, the drive circuits 5a and 5b and the non-connection portion 22b. It is possible to prevent a DC voltage from being applied between the two. Therefore, the occurrence of display unevenness due to deterioration of liquid crystal molecules can be suppressed. In addition, since the parasitic capacitance between the drive circuits 5a and 5b and the non-passing portion 22b can be reduced, an increase in power consumption accompanying the parasitic capacitance can be suppressed. In other words, power consumption can be reduced.

  In the present embodiment, the conductive film is insulated at the outer end portion 211 of the insulating member 21, but the conductive film may be insulated at the inner end portion 212 of the insulating member 21. In this case, the conductive film portion inside the inner end portion 212 of the insulating member 21 becomes the common electrode 22a.

  Next, a process for manufacturing the liquid crystal display device of this embodiment will be described. However, since the TFT substrate 1 can be formed by a known method such as a photolithography method or a CVD (chemical vapor deposition) method, the description of the manufacturing method of the TFT substrate 1 is omitted. The TFTs and the drive circuits 5a and 5b in the display area DA can be formed from an amorphous silicon thin film, a polycrystalline silicon thin film, or a single crystal silicon thin film formed on the substrate 10.

  The counter substrate 2 can be manufactured by the following steps. A color filter layer (film thickness of about 0.8 μm to 2 μm) is formed in the display area DA of the substrate 20 using a color filter material, and an insulating member 21 is formed in the frame area FA of the substrate 20. A conductive film (thickness of about 100 nm to 150 nm) containing ITO, IZO, or the like is formed on the color filter layer and the insulating member 21 by sputtering or CVD. The film thickness of the conductive film is generally about 100 nm to 150 nm, but if display defects such as crosstalk do not occur, the film thickness can be reduced to about 50 nm, which is desired Insulation can be realized stably. Whether to set the film thickness of the conductive film as usual or thinner than normal may be set appropriately in view of the relationship with the display quality. For example, when the conductive film is made of ITO, the concentration of oxygen dope during film formation is slightly higher than usual, the film formation temperature is set low, or the degree of vacuum during film formation is slightly reduced. This makes it easier to obtain insulation. When setting each film formation condition depending on the type of conductive film, an optimum film formation condition may be set based on a condition that does not adversely affect display quality and a condition that an insulating portion can be formed efficiently.

  In general, in the step of forming a conductive film, a so-called mask deposition method is performed in which a desired pattern is obtained by forming a film while covering unnecessary portions of the film with a mask. According to the mask deposition method, a patterning process by a photolithography method is not necessary, and the cost is low. However, there is a drawback that it is difficult to control the edge of the film due to the wrapping of the material into the mask portion, and precise processing cannot be performed. Therefore, in the mask deposition method, it is difficult to form a conductive film only on a portion where the conductive film is necessary, for example, only in the display area DA of the substrate 20 and the common transition portion.

  In the present embodiment, a conductive film is formed at least in a region including the display region DA by a mask deposition method. Due to the level difference between the upper surface of the insulating member 21 and the surface of the substrate 20, the conductive film is discontinuously formed on at least one of the two end portions 211 and 212 of the insulating member 21 as if the conductive film is separated. As a result, the conductive film is insulated at the end portion of the insulating member 21, and the common electrode 22a and the non-passing portion 22b are formed. That is, the formation of the insulating member 21 makes it possible to form the common electrode 22a having a precise shape without adding a step of patterning the conductive film using a dedicated mask. In addition, a pattern (insulating member 21) for partially insulating the conductive film can be formed without adding a new process. In other words, the insulating member 21 can be formed by the step of forming the color filter layer. Therefore, there is no increase in the number of masks or the number of manufacturing processes.

  Next, a polyimide alignment film is printed on each of the TFT substrate 1 and the counter substrate 2 and baked, and then rubbed in one direction with a rotating cloth. After the sealing material 3 is printed on the counter substrate 2, both the substrates 1 and 2 are bonded and fired. A liquid crystal material is injected from the opening of the sealing material 3, and the liquid crystal layer 4 is formed by closing the opening. A flexible printed circuit board is connected to the external connection terminal 6 on the TFT substrate 1 through an ACF (anisotropic conductive film). The liquid crystal display device of this embodiment is manufactured through the above steps.

  In the display area DA, the color filter layer and the conductive film are formed under conditions that improve the coverage characteristics so that the conductive film is not cut (insulated) between the adjacent color filter layers of other colors. That is, the side surface of the color filter layer is gently inclined to prevent insulation of the conductive film formed thereon.

  On the other hand, in the insulating member 21 in the frame area FA, in order to positively cut (insulate) the conductive film on the insulating member 21, the side surface of the insulating member 21 is sharpened, and the conductive film is applied to the upper end portion. Insulated. As a method of making the side surface of the insulating member 21 steep, when forming the insulating member 21 with a photosensitive resin, the exposure time at the time of pattern formation is made shorter than usual, and at the same time, the intensity of light to be exposed is increased, or a developing solution It is conceivable to increase the development speed by increasing the alkali concentration of the toner or increasing the temperature during development. A steep taper can also be realized by reducing the concentration of the rinsing solution before application of the photosensitive resin or by weakening the adhesiveness of the resin to the base by skipping the rinsing process.

  FIG. 5 is a cross-sectional view schematically showing another example of the insulating member 21. FIG. 5 shows a two-layer structure of the first color filter material layer 21a and the second color filter material layer 21b laminated thereon, but an insulating member is formed from three or more color filter material layers. It may be formed.

  The insulating member 21 shown in FIG. 5 has an inner end (display area side) end portion 212a of the first color filter material layer 21a and an inner end portion 212b of the second color filter material layer 21b, and the second color The conductive film is insulated at the inner end 212b of the filter material layer 21b. The conductive film portion inside the inner end portion 212b of the second color filter material layer 21b becomes the common electrode 22a. On the other hand, the conductive film portion outside the inner end portion 212b is electrically disconnected from the common electrode 22a and becomes a non-permeable portion 22b to which no potential is applied.

  In addition, in the insulating member 21 of the present embodiment, the outer end (seal material side) end 211a of the first color filter material layer 21a protrudes outward from the outer end 211b of the second color filter material layer 21b. Thereby, a conductive film is formed on the side surface of the outer end portion 211a of the first color filter material layer 21a and the side surface of the outer end portion 211b of the second color filter material layer 21b, so that the second color filter material layer A conductive film is continuously formed from the upper surface of 21 b to the surface of the substrate 20. Therefore, the non-permeable portion 22b is hardly insulated at the outer end portion 211b of the second color filter material layer 21b.

  Note that both side end portions 211a and 212a of the first color filter material layer 21a may coincide with both side end portions 211b and 212b of the second color filter material layer 21b. As a result, the number of places where the conductive film is insulated increases, so that even if the conductive film is not insulated at one end of the second color filter material layer 21b, the insulation of the conductive film can be secured at the other end. .

  FIG. 6 is a cross-sectional view schematically showing still another example of the insulating member 21. In the insulating member 21 shown in FIG. 6, the inner end portion 212b of the second color filter material layer 21b protrudes from the inner end portion 212a of the first color filter material layer 21a. In other words, the side surface of the inner end portion 212a of the first color filter material layer 21a is located outside the side surface of the inner end portion 212b of the second color filter material layer 21b. This makes it difficult for the conductive film to be formed on the side surface of the inner end portion 212a of the first color filter material layer 21a, so that the conductive film tends to be discontinuous at the inner end portion 212b of the second color filter material layer 21b. . In other words, the conductive film can be more reliably insulated at the inner end 212b of the second color filter material layer 21b.

  Note that both side end portions 211b and 212b of the second color filter material layer 21b may protrude from both side end portions 211a and 212a of the first color filter material layer 21a. Moreover, the insulating member may be formed from three or more color filter material layers. In this case, the second color filter material layer 21b may not be laminated on the first color filter material layer 21a. For example, the second color filter material layer 21b may be interposed between the second color filter material layer 21b and the first color filter material layer 21a. Three color filter material layers may be interposed. The positional relationship of the third color filter material layer with respect to the second color filter material layer 21b is described with reference to FIGS. 5 and 6, and the positional relationship of the first color filter material layer 21a with respect to the second color filter material layer 21b. Is the same.

  Next, a method for producing the insulating member 21 using the color filter material will be described. The insulating member 21 can be produced by a color filter manufacturing method such as a pigment dispersion method (colored light-sensitive material method), a printing method, or a dry film resist method. With reference to the drawings, a process of creating the insulating member 21 by these color filter manufacturing methods will be described.

  FIG. 7 is a cross-sectional view schematically showing a production process of the insulating member 21 by a pigment dispersion method (colored photosensitive material method). A colored light-sensitive material in which finely divided pigment is uniformly dispersed in a transparent photosensitive resin is applied onto the substrate 20, and the first color filter material layer 21a is formed through exposure and development (FIG. 7A). reference). Similarly, a color sensitive material 200 that covers the first color filter material layer 21a is applied (see FIG. 7B), and exposure is performed through the mask 201 (see FIG. 7C). The unexposed part of the colored light-sensitive material 200 is removed by development to form a second color filter material layer 21b on the first color filter material layer 21a (see FIG. 7D).

  By forming the second color filter material layer 21b on the first color filter material layer 21a, the slope of the side surface of the insulating member 21 can be made steep. That is, the side surface of the second color filter material layer 21b can be an inclined surface steeper than the side surface of the first color filter material layer 21a. A higher viscosity of the photosensitive resin is preferable because the side surface of the insulating member 21 can be steeper.

  FIG. 8 is a cross-sectional view schematically showing a production process of the insulating member 21 by a printing method. As shown in FIG. 8A, the first color filter material layer 21a is transferred onto the substrate 20. Next, as shown in FIG. 8B, the second color filter material layer 21b is transferred onto the first color filter material layer 21a. At this time, transfer is performed so that one end of the second color filter material layer 21b protrudes from one end of the first color filter material layer 21a. Thereafter, as shown in FIG. 8C, firing is performed to form a top end portion of the insulating member 21 on a steep slope (reverse taper).

  FIG. 9 is a cross-sectional view schematically showing a production process of the insulating member 21 by the dry film resist method. After the first color filter material layer 21a is formed on the substrate 20 (see FIG. 9A), the dry film 202 is laminated in a direction substantially orthogonal to the first color filter material layer 21a (FIG. 9B). )reference). At this time, gaps 203 are formed on both end faces of the first color filter material layer 21a. Using the mask 201, exposure is performed on an area including the gap 203 (see FIG. 9C). The unexposed portion of the dry film 202 is removed by development, and the second color filter material layer 21b is formed on the first color filter material layer 21a, thereby forming an insulating member having a reverse taper on the side surface (FIG. 9 ( d)). Note that a dry film 202 may be laminated in parallel with the first color filter material layer 21a to form the shape shown in FIG.

  The material constituting each of the color filter material layers 21a and 21b is typically selected from three color filter materials of red, green, and blue, but in some cases, a black matrix material or a transparent (white) color filter material is used. obtain. Further, when two or more kinds of materials of the same color are used, the insulating member 21 can be formed by selecting from various color filter materials. For example, when color filter materials for the transmissive part and the reflective part are used for each of red, green, and blue, the insulating member 21 can be formed by selecting from six types of materials.

  Next, a method for manufacturing the counter substrate shown in FIGS. 5 and 6 will be described. A first color filter layer is formed in the display area DA on the substrate 20 by using a first color filter material by a printing method, a pigment dispersion method, or the like, and a loop-shaped first color filter surrounding the display area DA The material layer (first frame) 21a is formed in the frame area FA.

  Similarly, using the second color filter material, a second color filter layer is formed in the display area DA on the substrate 20, and a loop-shaped second color filter material layer (second frame) 21b is formed. . The second color filter material layer 21b is formed so as to at least partially overlap the first color filter material layer 21a. Thereby, the loop-shaped insulating member 21 having a structure in which the second color filter material layer 21b is laminated on the first color filter material layer 21a is formed.

  Further, a third color filter layer is formed in the display area DA on the substrate 20 using the third color filter material. In this embodiment, the insulating member 21 is formed of the first and second color filter materials used. However, the order of use of the color filter materials for forming the insulating member 21 is not limited to this. For example, the insulating member may be formed of the color filter material used first and third, or the color filter material used second and third.

  A conductive film containing ITO, IZO, or the like is formed on the color filter layer and the insulating member 21 by sputtering or CVD. At this time, the conductive film is insulated at the inner end portion 212b of the second color filter material layer 21b by the step between the upper surface of the second color filter material layer 21b and the surface of the substrate 20.

  According to this manufacturing method, since the insulating member 21 is formed in the process of forming the color filter layer in the display area DA, it is not necessary to add a new process for forming the insulating member 21.

  Although the case where the color filter material layers 21a and 21b constituting the insulating member 21 extend in a line has been described in the present embodiment, the insulating member in the present invention is not limited to this form. FIG. 10 is a cross-sectional view schematically showing another form of the insulating member 21. As shown in FIG. 10, red, green and blue color filter layers 23R, 23G, and 23B are formed in the display area DA of the substrate 20, and a red first color filter material layer 21a is formed in the frame area FA of the substrate 20. ing. The blue color filter layer 23B closest to the frame area FA extends beyond the outer end 211a of the first color filter material layer 21a. As shown in FIG. 10, a part of the insulating member 21 may be integrated with the color filter layer in the display area DA. Further, the end of the insulating member 21 may be only on one side.

  In the present embodiment, the case where the insulating member 21 is formed using the color filter material has been described. However, the material forming the insulating member 21 is not limited to the color filter material. For example, in a liquid crystal display device having a photo spacer, the insulating member may be formed using a photo spacer material. In this case, the photo spacer is not disposed on the upper side of the conductive film as usual, but is disposed on the lower side. An insulating member is formed by a manufacturing method including exposure and development similar to the color filter material. Even in the photo spacers arranged in the display area DA, the conductive film is insulated, so that no vertical leak occurs.

(Embodiment 2)
In the first embodiment, in order to reduce the parasitic capacitance between the drive circuits 5 a and 5 b of the TFT substrate 1 and the common electrode 22 a of the counter substrate 2, the loop-shaped insulating member 21 that surrounds the display area DA is formed on the substrate 20. It is formed in the frame area FA. That is, the conductive film outside the insulating member 21 in the frame area FA is the non-permeating portion 22b.

  In the present embodiment, a case will be described in which only a portion of the conductive film facing the drive circuits 5a and 5b is made a non-conductive portion. FIG. 11 is a plan view schematically showing the counter substrate 2 of the present embodiment, and FIG. 12 is a sectional view taken along the line af in FIG. In addition, the part which each point of b, c, d, e in the af line of FIG. 11 shows is shown in FIG. The TFT substrate is the same as that shown in FIG.

  The counter substrate of the present embodiment has red, green and blue color filter layers 23R, 23G, and 23B formed in the display area DA on the substrate 20 and insulation for making the conductive film in the driver formation area DFA a non-permeable portion 22b. Member 21. The insulating member 21 is formed in the frame area FA and is composed of three layers of red, green and blue color filter material layers 21a, 21b and 21c. The inner end 212b of the second color filter material layer 21b protrudes inward (display area DA side) from the inner end 212a of the first color filter material layer 21a, and the inner end 212c of the third color filter material layer 21c The second color filter material layer 21b protrudes inward from the inner end 212b. As shown in FIG. 12, the insulating member 21 has a structure in which three color filter material layers 21a, 21b, and 21c are stacked in a stepped manner, so that the insulating member is composed of two color filter material layers. As a result, the conductive film formed on the insulating member 21 can be more reliably insulated. That is, as the number of color filter material layers constituting the insulating member 21 is increased, more patterns for insulating the conductive film can be stacked and arranged, so that the conductive film is more reliably insulated. A structure is possible.

  In the first embodiment, since the conductive film portions (non-passing portions 22b) facing the scanning line driving circuit 5a and the signal line driving circuit 5b are continuous, the scanning line driving circuit 5a and the signal line are connected via the non-passing portions 22b. A coupling capacitance is generated between the driving circuit 5b and the driving circuit 5b. In the present embodiment, since the conductive film portions (non-passing portions 22b) facing the scanning line driving circuit 5a and the signal line driving circuit 5b are electrically separated, the scanning line driving circuit 5a and the signal line driving circuit 5b are separated. The coupling capacity generated between the two can be reduced.

  In order to reduce the coupling capacitance generated between the patterns and wirings forming the drive circuits 5a and 5b, the conductive film portions facing the patterns and wirings are electrically separated by an insulating member. Also good.

(Embodiment 3)
In the first and second embodiments, the driver built-in type liquid crystal display device in which the scanning line driving circuit 5a and the signal line driving circuit 5b are formed on the inner side of the sealant 3 is shown, but the present invention is not limited to this mode. In the present embodiment, a liquid crystal display device in which a signal line driver circuit chip and a scanning line driver circuit chip are mounted on the outside of a seal material by COG (Chip On Glass) or COF (Chip On Film) will be described.

  13 is a plan view schematically showing the liquid crystal display device of this embodiment, FIG. 14 is a plan view schematically showing the TFT substrate 1, FIG. 15 is a plan view schematically showing the counter substrate 2, and FIG. FIG. 14 is a sectional view taken along line BB in FIG. The liquid crystal display device according to the present embodiment includes a TFT substrate 1, a counter substrate 2 disposed to face the TFT substrate 1, a sealing material 3 provided around the counter substrate 2, a TFT substrate 1, and a counter substrate 2. And a liquid crystal layer 4 including a liquid crystal material surrounded by a sealing material 3.

  In the display area DA on the substrate 10, a plurality of scanning lines 12 and a plurality of signal lines 13 are formed, and a plurality of pixel electrodes 11 are arranged in a matrix. A scanning line driving circuit chip 15 a connected to the scanning line 12 and a signal line driving circuit chip 15 b connected to the signal line 13 are mounted on the mounting area MA of the substrate 10. A spare wiring 7 is formed in the frame area FA of the substrate 10. The spare wiring 7 is used to input a signal to a wiring in which a defect occurs when a defect such as a disconnection occurs in the scanning line 12 or the signal line 13. Therefore, in general, when a defect such as a disconnection is corrected by the spare wiring 7, a load applied to the spare wiring 7 is increased due to the parasitic capacitance between the spare wiring 7 and the common electrode, and is supplied via the spare wiring 7. As a result, there is a possibility that a display defect that appears as a line defect may occur.

  The counter substrate 2 of the present embodiment has a plurality of insulating members 21 formed in the frame area FA on the substrate 20. The insulating member 21 is formed in a region facing the auxiliary wiring 7 and is composed of two color filter material layers 21a and 21b. The end portion of the second color filter material layer 21b protrudes from the end portion of the first color filter material layer 21a, and the conductive film is insulated at the upper end portions 212 and 211 of the insulating member 21. As a result, the conductive film portion on the insulating member 21 becomes a non-conductive portion 22b insulated from the common electrode 22a on the color filter layer 23 in the display area DA. Therefore, since the parasitic capacitance generated between the spare wiring 7 and the non-connection portion 22b is reduced, the delay of the signal supplied via the spare wiring 7 is reduced, and the occurrence of display failure is suppressed.

(Embodiment 4)
In the first to third embodiments, an insulating member is formed on the counter substrate 2 for the purpose of reducing the parasitic capacitance generated between the drive circuits 5 a and 5 b and the spare wiring 7 on the TFT substrate 1 and the conductive film on the counter substrate 2. Although the case of forming 21 has been described, the insulating member 21 according to the present invention can be used for other purposes. In the present embodiment, the case where the insulating member 21 is formed on the counter substrate 2 will be described for the purpose of preventing the conductive film at the end portion of the counter substrate 2 from being short-circuited through a peripheral member or the like.

  FIG. 17 is a plan view schematically showing the liquid crystal display device of this embodiment. The liquid crystal display device of the present embodiment includes a TFT substrate 1 and a counter substrate 2 disposed to face the TFT substrate 1. The counter substrate 2 has a common electrode 22a formed in a region including at least the display region DA. The common electrode 22a in the vicinity of the two corners of the counter substrate 2 has a common transition portion 24 for transferring an electric signal from the TFT substrate 1 to the common electrode 22a.

  When a conductive film is formed on the counter substrate 2 by a mask deposition method or the like, generally, the conductive film is generally formed up to the corner of the counter substrate 2 in order to ensure that the conductive film is formed up to the common transition portion 24. Form a film. In that case, the conductive film is exposed on the end face (side face) of the counter substrate 2 after the glass is cut. The exposed conductive film may be short-circuited with other wirings or members via peripheral members.

  The counter substrate 2 of the present embodiment includes a substantially L-shaped insulating member 21 formed outside the common transition portion 24 in plan view. When the conductive film is formed up to the corner of the counter substrate 2, the conductive film around the common transition portion 24 is separated into the conductive portion and the non-conductive portion at the upper end portion of the insulating member 21. In other words, the conductive film on the outer side than the insulating member 21 in the plan view is insulated from the common transition portion 24 and becomes the non-passing portion 22b. Therefore, even when the exposed conductive film is present on the end face of the counter substrate 2, the exposed conductive film is electrically disconnected from the common electrode 22a, so that leakage can be prevented.

  As mentioned above, although this invention was demonstrated based on embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. Those skilled in the art will appreciate that the above-described embodiment is an example, and that various modifications can be made to the combinations of the respective components and processes, and that such modifications are also within the scope of the present invention. is there. For example, the active matrix type liquid crystal display device using TFTs has been described as an example in the above embodiment, but the present invention is also applied to an active matrix type display device using a two-terminal element such as MIM (Metal Insulator Metal) as a switch element. Can be applied. In the above-described embodiment, the liquid crystal display device in which the pixel electrodes facing the common electrode are arranged in a matrix has been described as an example. The present invention also includes a lux barrier element.

1 is a plan view schematically showing a liquid crystal display device of Embodiment 1. FIG. 1 is a plan view schematically showing a TFT substrate 1 of Embodiment 1. FIG. 2 is a plan view schematically showing a counter substrate 2 of Embodiment 1. FIG. It is the sectional view on the AA line in FIG. It is sectional drawing which shows the other example of the insulating member 21 typically. FIG. 6 is a cross-sectional view schematically showing still another example of the insulating member 21. It is sectional drawing which shows typically the creation process of the insulating member 21 by the pigment dispersion method (coloring sensitive material method). It is sectional drawing which shows typically the creation process of the insulating member 21 by the printing method. It is sectional drawing which shows typically the creation process of the insulating member 21 by the dry film resist method. It is sectional drawing which shows the other form of the insulating member 21 typically. 6 is a plan view schematically showing a counter substrate 2 of Embodiment 2. FIG. It is the af sectional view taken on the line in FIG. 7 is a plan view schematically showing a liquid crystal display device of Embodiment 3. FIG. 7 is a plan view schematically showing a TFT substrate 1 of Embodiment 3. FIG. 6 is a plan view schematically showing a counter substrate 2 of Embodiment 3. FIG. FIG. 16 is a sectional view taken along line BB in FIGS. 14 and 15. 6 is a plan view schematically showing a liquid crystal display device of Embodiment 4. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 TFT substrate 2 Opposite substrate 3 Sealing material 4 Liquid crystal layer 5a Scan line drive circuit 5b Signal line drive circuit 6 External connection terminal 7 Preliminary wiring 10 Substrate 11 Pixel electrode 12 Scan line 13 Signal line 15a Scan line drive circuit chip 15b Signal line drive Circuit chip 20 Substrate 21 Insulating member 21a First color filter material layer 21b Second color filter material layer 21c Third color filter material layer 22a Common electrode 22b Non-passage portion 23 Color filter layer 24 Common transition portion 200 Colored sensitive material 201 Mask 202 Dry Film 203 Gap 211 Outer end 212 of insulating member 21 Inner end 211a of insulating member 21 Outer end 212a of first color filter material layer 21a Inner end 211b of first color filter material layer 21a Second color filter material layer 21b outer end 212b first Inner end 212c of the second color filter material layer 21b Inner end of the third color filter material layer 21c

Claims (7)

A first substrate; a second substrate facing the first substrate; and an optical material sandwiched between the first substrate and the second substrate, wherein the first substrate and the second substrate overlap each other. The region is an electro-optical device including a display region and a frame region around the display region,
The second substrate includes an insulating member formed in the frame region and a conductive film formed in a region including at least the display region,
The electroconductive device includes a conductive portion and a non-conductive portion insulated from the conductive portion at an upper end portion of the insulating member.   The first substrate has a plurality of pixel electrodes in the display area and a drive circuit for controlling driving of the pixel electrodes in the frame area, and the insulating member faces the drive circuit. The electro-optical device according to claim 1, wherein a region is formed to be the non-connection portion.   2. The electro-optical device according to claim 1, wherein the first substrate has a spare wiring in the frame region, and the insulating member is formed so that a region facing the spare wiring is the non-connection portion. .   The conduction part has a transition part for transferring an electrical signal from the first substrate to the conduction part, the insulating member is formed outside the transition part, and the non-conduction part is the transition part. The electro-optical device according to claim 1, wherein the electro-optical device is insulated from the electro-optical device.   The electro-optical device according to claim 1, wherein the insulating member includes two or more color filter material layers.   The insulating member includes at least a first color filter material layer and a second color filter material layer provided on the first color filter material layer, and the second color filter material layer is the first color filter material layer. The electro-optical device according to claim 1, further comprising an end portion protruding from an end portion of the color filter material layer. A substrate; a plurality of color filter layers formed on the substrate; a conductive portion covering the plurality of color filter layers; and a non-conductive portion insulated from the conductive portion, wherein the color filter layer is a first color A method of manufacturing a display device substrate including at least a filter layer and a second color filter layer,
The first color filter material is used to form the first color filter layer, and the first color filter layer is formed in the display area of the substrate, and the first insulating film is formed in the frame area around the display area. Forming a step;
Forming a second color filter layer in the display region using a second color filter material constituting the second color filter layer, and forming a second insulating film at least partially overlapping the first insulating film; Forming above the first insulating film;
And a step of insulating the conductive portion and the non-conductive portion at an end portion of the second insulating film by forming a conductive film on the plurality of color filter layers and the second insulating film.

Images