JP2008265244A - Micro-mold, its manufacturing method, and plating matrix for manufacturing micro-mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro-mold, which is fine and multi-staged in its uneven portions and excellent in durability by a manufacturing method, which is not complicated, at low cost. <P>SOLUTION: When manufacturing a molding micro-mold, which is fine and multi-staged in its uneven portions, by electroplating, a plating matrix is used, which is manufactured through a method wherein an image is formed of a photosensitive resin on a conductive substrate and a metal film is formed by the electroplating, and then the following steps a, b are repeated once or more for further laminating a metal film on the metal film through the electroplating: a. the step for forming an image on the metal film with the photosensitive resin through a photo-lithographic method; and b. the step for laminating the metal film through the electroplating. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a mold for fine molding created by an electrolytic plating method, for example, a micro mold for molding a microfluidic chip having multi-stage uneven portions used when performing chemical analysis or chemical reaction, and the production thereof. The present invention relates to a method, a molded product molded using the fine mold, and a method for producing a plating mother mold used for producing the fine mold.

2. Description of the Related Art Conventionally, a fine mold having a fine shape and having multiple concavo-convex portions is manufactured by a photolithography method and an electrolytic plating method. FIG. 2 shows a manufacturing process of a fine mold by a conventional photolithography method and an electrolytic plating method. First, as shown in FIG. 2A, a photosensitive resin 22 is applied to the conductive substrate 21. Next, as shown in FIG. 2B, a thin conductive metal layer 23 such as copper is formed on the entire surface of the photosensitive resin 22 by sputtering or electroless plating. Next, a photosensitive resin 24 is applied to the entire surface of the metal layer 23, and then a desired pattern is exposed and developed to form an image with the photosensitive resin 24. At this time, a region where no image is formed is defined as a pattern opening 24a (FIG. 2C). Next, as shown in FIG. 2D, the metal layer 23 in the pattern opening 24a region is removed by dipping in an etching solution, and the underlying photosensitive resin 22 is exposed in the removed region. Next, as shown in FIG. 2E, the photosensitive resin 24 is peeled off, and the patterned metal layer 23 is exposed. Next, the photosensitive resin 22 in the region where the metal layer 23 is not formed is exposed by irradiating ultraviolet rays. Thereby, the exposure part 22a is formed in the photosensitive resin 22 of the 1st layer (FIG.2 (f)). Next, as shown in FIG. 2G, the second layer of the photosensitive resin 25 is applied to the entire surface including the first metal layer 23 and the exposed portion 22a of the first layer of the photosensitive resin 22. To do. Next, as shown in FIG. 2H, the patterned metal layer 26 is exposed again through the steps (b) to (e) described above, and the region where the metal layer 26 is not formed is photosensitive. The resin layer 25 is exposed. In order to enable collective development across the two photosensitive resin layers (22, 25) in a later step, the region where the second metal layer 26 is not formed is at least the first layer. It is set so as to include a region where the metal layer 23 is not formed. Next, as shown in FIG. 2I, the photosensitive resin 25 in the region where the metal layer 26 is not formed is exposed by irradiating ultraviolet rays. Thereby, the exposure part 25a is formed in the photosensitive resin 25 of the second layer. Next, development is performed to remove the exposed portions 22a and 25a of the first layer and the second layer of photosensitive resin, and as shown in FIG. 2 (j), the photosensitive resin and the metal layer are laminated. A plating matrix for electrolytic plating is obtained. In FIG. 2J, photodecomposition (positive type) photosensitive resins 22 and 25 are used. Next, electrolytic plating is performed on the electrolytic plating mother mold to form a metal film to be the multistage fine mold 27 (FIG. 2 (k)). Finally, as shown in FIG. 2 (l), the metal mold is peeled off from the electrolytic plating mother mold, whereby the fine mold 27 having the concavo-convex portions formed in multiple stages can be manufactured.
JP 2005-161667 A

However, in the method of manufacturing the fine mold 27 having such a multi-stepped uneven portion, the number of steps of patterning the metal layer for each layer is increased when forming the plating matrix, and the apparatus for forming the metal layer Therefore, the process is complicated and the productivity is inferior. Furthermore, the durability of the plating matrix is inferior due to the laminated structure of photosensitive resin and metal.

  The present invention has been made in view of the above situation, and provides a fine mold that is fine, has multiple concavo-convex portions, and has excellent durability at a low cost by a simple manufacturing method. There is.

The inventors of the present invention have studied a method for producing a plating mother mold by electrolytic plating in forming a fine mold for molding having fine and uneven portions, and forming a metal layer on the photosensitive resin layer. By not including the process to do, the manufacturing method which can manufacture a fine metal mold | die cheaply with the manufacturing method which is not complicated was established.
That is, the present invention
A method for producing a plating matrix used when forming a fine mold by an electrolytic plating method, wherein the plating matrix forms an image with a photosensitive resin on a conductive substrate using a photolithography method, A method for producing a plating matrix in which a metal film is formed by electrolytic plating on a conductive substrate on which an image is formed, and then a metal film lamination step including the following steps a and b is repeated once or twice or more.
a. A process of forming an image with a photosensitive resin using a photolithographic method on the metal film in order to further laminate a metal film on the metal film by electrolytic plating;
b. A process of forming a metal film by electrolytic plating.
Furthermore, the present invention provides the method for producing a plating matrix according to the above-described photolithographic method, wherein the photosensitive resin layer is directly irradiated with a convergent beam of ultraviolet light, and the ultraviolet light source is a semiconductor laser. A manufacturing method of a plating mold described above, a fine mold obtained by performing electroplating using a plating mold manufactured by the method described above, a manufacturing method of the fine mold, and A molded product formed by using a fine mold.

ADVANTAGE OF THE INVENTION According to this invention, the multistage fine metal mold | die for shaping | molding can be efficiently manufactured in a simpler process and in a short time. In addition, by using the mold of the present invention, a molded product such as a microfluidic chip having a flow path with uneven portions can be manufactured with high accuracy.

Embodiments of the present invention will be described below with reference to the drawings.

The present invention comprises a plating mold forming process and a fine mold forming process for manufacturing a fine mold. 1A to 1J show an example of a plating mother mold forming process, and FIGS. 1K to 1L show an example of a fine mold forming process.

In the present invention, first, an image is formed on a conductive substrate with a photosensitive resin using a photolithographic method. As shown in FIG. 1A, a photosensitive resin layer 2 is formed on a conductive substrate 1. The conductive substrate 1 varies depending on the size of the fine mold to be produced and the number of fine molds. For example, the conductive substrate 1 is rectangular and has a size of 20 to 650 mm × 20 to 550 mm and a thickness of about 1.0 mm. . The material is not particularly limited as long as it can be electroplated (conductive), such as stainless steel, nickel, copper, and iron. Moreover, as the photosensitive resin 2, for example, a dry film resin, a liquid resin, or the like can be used, but is not limited thereto. Further, the film thickness of the photosensitive resin 2 needs to be 15 μm to 350 μm in consideration of the required dimensions of a molded product produced by the present mold, but is not limited to this.

As shown by an arrow in FIG. 1B, the photosensitive resin layer 2 is directly irradiated with a convergent beam 3 of ultraviolet rays, and exposure is performed while scanning in a predetermined fine pattern. At this time, only the light irradiated portion of the photosensitive resin layer 2 is exposed and cured (when the photosensitive resin is a negative type).

As an ultraviolet light source, an excimer laser, a high frequency of YAG, a semiconductor laser, or the like can be used. In the present invention, a semiconductor laser is preferable from the viewpoints of downsizing, ease of handling, and economy. A specific example of the ultraviolet semiconductor laser is a GaN-based laser having an oscillation wavelength of 400 to 410 nm.
For example, a plurality of ultraviolet semiconductor lasers are arranged in an array, each laser beam is converged so as to be in focus with the photosensitive resin, and a pattern is drawn while scanning.
Alternatively, drawing may be performed while scanning laser light with a polygon mirror, or laser light may be divided into a plurality of beams and drawn with a mirror.

Next, by removing the uncured portion of the photosensitive resin 2 by development, an image is formed by the cured photosensitive resin 2a on the surface of the conductive substrate 1, as shown in FIG. In removing the uncured part of the photosensitive resin by development, an alkaline aqueous solution such as sodium carbonate can be used.

Next, when the conductive substrate on which this image is formed is immersed in a metal plating bath and subjected to electrolytic plating by energization, the first layer is formed on the surface of the conductive substrate 1 as shown in FIG. The metal film 4 is formed. At this time, the back surface of the conductive substrate may be made nonconductive by laminating a resin thin film. Examples of the type of the metal film 4 in the first layer include nickel and nickel alloys of nickel and iron, cobalt, tungsten and the like. The electroplating conditions for forming the nickel film are energized for 1 to 10 hours at a current density of 0.5 to 5.0 A / dm ² when, for example, an electroplating solution mainly composed of nickel sulfamate is used. To deposit nickel. The thickness of the metal film 4 is limited to the depth of the concave portion of about 10 to 300 μm in the mother die of the fine die in consideration of the required size of the molded product produced with the present die. It is not something. However, the thickness of the metal film does not exceed the thickness of the photosensitive resin 2.

  Next, the remaining cured photosensitive resin portion 2a is peeled off using a photosensitive resin stripping material, so that the first-layer metal film 4 is applied to the conductive substrate as shown in FIG. 1 (e). A putter is formed. In removing the cured photosensitive resin portion 2a by peeling, for example, an amine solvent, an alkaline aqueous solution, or the like can be used, but the invention is not limited thereto.

  In the present invention, a second metal film is further laminated on the first metal film layer 4 by electrolytic plating. Specifically, as shown in FIG. 1F, a photosensitive resin 5 is laminated on the entire surface of the conductive substrate on which the first metal film 4 is formed. Next, as indicated by an arrow in FIG. 1G, exposure is performed while the photosensitive resin layer 5 is directly irradiated with the convergent beam 3 of ultraviolet rays and scanned into a predetermined fine pattern. Examples of the photosensitive resin 5 used in this case include those described in the photosensitive resin 2. As the ultraviolet light source, the above-described GaN-based semiconductor laser is preferable.

  Next, an uncured portion of the photosensitive resin 5 is removed by development to form an image with the cured photosensitive resin 5a on the surface of the first-layer metal film 4 as shown in FIG. 1 (h). To do. At this time, in the image of the photosensitive resin 5a, the outer peripheral region of the image of the first-layer metal film 4 is covered with the photosensitive resin 5a. Further, if necessary, a portion where the photosensitive resin layer 5 is removed by development can also be provided in a region where the first-layer metal film 4 is not formed. For removing the uncured portion of the photosensitive resin by development, an alkaline aqueous solution such as sodium carbonate can be used.

Next, in order to laminate the second-layer metal film, the conductive substrate on which the image is formed is immersed in a metal plating bath and subjected to electroplating by energization, as shown in FIG. A second-layer metal film 6 is formed on the surface of the first-layer metal film 4. At this time, in order to enhance the adhesion between the first-layer metal film 4 and the second-layer metal film 6, an acid is removed for the purpose of removing oxides and activating the surface of the first-layer metal film 4. Processing may be performed. As the kind of acid used for the acid treatment, dilute nitric acid, dilute hydrochloric acid, dilute sulfuric acid and the like can be used, but are not limited thereto. Examples of the type of the second layer metal film include nickel and nickel alloys of nickel and iron, cobalt, tungsten, and the like. The electroplating conditions for forming the nickel film are energized for 1 to 10 hours at a current density of 0.5 to 5.0 A / dm ² when, for example, an electroplating solution mainly composed of nickel sulfamate is used. To deposit nickel. The thickness of the second-layer metal film 6 needs a depth of a recess of about 10 to 300 μm on the surface of the fine mold in consideration of the required dimensions of the molded product produced by the present mold. It is not limited to. However, the thickness of the metal film does not exceed the thickness of the photosensitive resin 5a.

Next, the remaining cured photosensitive resin portion 5a is peeled off using a photosensitive resin stripping agent, and as shown in FIG. 1 (j), the first-layer metal film 4 and the first layer on the conductive substrate. A plating mold 7 for producing a fine mold patterned with the second metal film 6 can be manufactured. As the chemical solution for removing the cured photosensitive resin portion 5a, for example, an amine-based solvent, an alkaline aqueous solution, or the like can be used, but is not limited thereto.

Next, when the above-described plating mold 7 for producing a fine mold is immersed in a metal plating bath and electroplating is performed by energization, the fine mold is formed on the surface of the plating mold 7 as shown in FIG. A metal film to be the mold 8 is formed. Examples of the metal film to be used as the fine mold 8 include nickel and nickel alloys of nickel and iron, cobalt, tungsten and the like. For example, in the case of using an electroplating solution mainly composed of nickel sulfamate, the electroplating conditions for forming the nickel film are energized for 20 to 80 hours at a current density of ² to 5 A / dm ² , Nickel is deposited until the thickness reaches a predetermined thickness.

  Finally, when the metal film that becomes the fine mold 8 is peeled from the plating mother mold 7, the fine mold 8 of the present invention shown in FIG. 1 (l) is obtained. The obtained fine mold 8 has a shape obtained by inverting the shape of the plating matrix 7. The fine mold 8 in FIG. 1 is an example of a mold having two concavo-convex portions. However, in the present invention, when the concavo-convex portion of the mold has three tiers or more, (f) in FIG. (J) can be further repeated to produce a plating matrix in which the concavo-convex part is composed of three or more metal films by sequentially laminating the third and subsequent metal films on the second metal film, By using the plating mother mold, the fine mold of the present invention having three or more uneven portions can be produced.

  The fine mold of the present invention is mounted on, for example, an injection molding machine, and a plastic such as polycarbonate resin, polyester resin, acrylic resin, polyamide resin, polyethylene, polypropylene, and fluorine resin is filled into the fine mold of the injection molding machine. Thus, the molded product of the present invention can be produced. Furthermore, when the upper surface of this molded product is sealed with a film or a resin plate and holes for inflow and outflow are formed in the sealing material at both end portions of the flow path, a microfluidic chip is obtained. Applications and specific examples of the chip are used for diagnosis, reaction, separation, measurement and the like in the medical field, the industrial field, the biotechnology field, and the like. For example, molded products used in the medical field can shorten measurement time, reduce the number of samples, and perform parallel processing due to their fine structure, so hospital clinical laboratories, bed sites, operating rooms, clinics, Used for home diagnosis.

  According to the present invention, an inexpensive fine mold can be provided by producing a plating mother mold by electrolytic plating in the production of a fine mold for molding that is fine and has multi-level uneven portions. Furthermore, compared with the conventional manufacturing method, a process can be simplified and a short delivery time is attained.

The figure which shows one embodiment of the manufacturing process of the fine metal mold | die of this invention. The figure which shows the manufacturing process of the fine metal mold | die of a prior art example.

Explanation of symbols

1. 1. conductive substrate 2. First layer photosensitive resin 3. Convergent beam of ultraviolet rays 4. First layer metal film 5. Second layer photosensitive resin 6. Second layer metal film 7. Plating mold for fine mold manufacturing Fine mold 2a. Cured first layer photosensitive resin portion 5a. Cured second layer photosensitive resin portion 21. Conductive substrate 22. Photosensitive resin 23. Metal layer 24. Photosensitive resin 25. Photosensitive resin 26. Metal layer 27. Fine mold 22a. Pattern opening 24a of first layer photosensitive resin. Photosensitive resin pattern openings 25a. For pattern etching the first metal layer. Pattern opening of second layer photosensitive resin

Claims (5)

A method for producing a plating matrix used when forming a fine mold by an electrolytic plating method, wherein the plating matrix forms an image with a photosensitive resin on a conductive substrate using a photolithography method, A method for producing a plating matrix in which a metal film is formed by electrolytic plating on a conductive substrate on which an image is formed, and then a metal film lamination step including the following steps a and b is repeated once or twice or more.
a. A process of forming an image with a photosensitive resin using a photolithographic method on the metal film in order to further laminate a metal film on the metal film by electrolytic plating;
b. A process of forming a metal film by electrolytic plating. 2. The method for producing a plating matrix according to claim 1, wherein, in the photolithographic method, the exposure is performed by directly irradiating the photosensitive resin layer with a convergent beam of ultraviolet rays. The method for producing a plating mother die according to claim 2, wherein the ultraviolet light source is a semiconductor laser. The fine metal mold | die formed by performing electrolytic plating using the plating mother mold manufactured by the method as described in any one of Claims 1-3, and the manufacturing method of a fine metal mold | die. A molded product obtained by molding using the fine mold according to claim 4.

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