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JP2008260173A - Mold suitable for washing, mold washing method and mold manufacturing method - Google Patents

Mold suitable for washing, mold washing method and mold manufacturing method Download PDF

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JP2008260173A
JP2008260173A JP2007103329A JP2007103329A JP2008260173A JP 2008260173 A JP2008260173 A JP 2008260173A JP 2007103329 A JP2007103329 A JP 2007103329A JP 2007103329 A JP2007103329 A JP 2007103329A JP 2008260173 A JP2008260173 A JP 2008260173A
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mold
pattern
cleaning
cleaning film
film
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Takahisa Kusuura
崇央 楠浦
Hitoshi Tanpo
仁志 丹保
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Scivax Corp
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Scivax Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold capable of being simply washed at a low cost regardless of the kind of an adhered pollutant, a mold washing method and a mold manufacturing method. <P>SOLUTION: The mold 100 having a mold main body 1 having a predetermined pattern and the washing film 2 deposited to the surface of the pattern is treated with a solvent or gas not damaging the pattern of the mold main body 1 to remove the pollutant adhered to the surface of the mold along with the washing film 2. Further, the washing film 2 is deposited to the mold main body 1 after washing by a predetermined method to regenerate the mold 100. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

成型技術に用いる型およびその洗浄方法に関するものである。   The present invention relates to a mold used for molding technology and a cleaning method thereof.

所定のパターンを有する型を基板等の加工対象物に押圧して、加工対象物にパターンを転写する成型技術がある(例えば、特許文献1)。この成型技術において、型のパターンが転写される加工対象物としては種々のものがあり、例えばシリコンやガラス等からなる基板本体の表面に、「配線パターンを形成するためのアルミニウム、金、銀などの金属薄膜」や、「樹脂、フォトレジスト等の被覆層」等の薄膜が形成されたものがある。また、「ポリカーボネート、ポリイミド等の樹脂」、「アルミニウム等の金属」、「ガラス、石英ガラス、シリコン、ガリウム砒素、サファイア、酸化マグネシウム等の無機材料」などの成形素材が、そのまま基板形状をなしているものもある。更に、加工対象物は、基板以外の形状、例えばフィルム状に形成されるものもある。   There is a molding technique in which a mold having a predetermined pattern is pressed against a workpiece such as a substrate and the pattern is transferred to the workpiece (for example, Patent Document 1). In this molding technique, there are various processing objects to which the pattern of the mold is transferred. For example, “aluminum, gold, silver or the like for forming a wiring pattern” is formed on the surface of the substrate body made of silicon or glass. Thin films such as “metal thin film” and “covering layer of resin, photoresist, etc.”. In addition, molding materials such as “resins such as polycarbonate and polyimide”, “metals such as aluminum”, “inorganic materials such as glass, quartz glass, silicon, gallium arsenide, sapphire, and magnesium oxide” form the substrate shape as it is. Some are. Furthermore, the processing object may be formed in a shape other than the substrate, for example, a film shape.

このような加工対象物にパターンの転写を繰り返すと、型に付着物等の汚れが生じ、所望のパターンを形成することができなくなる。特に、ナノインプリント技術に用いられる型のパターンは、ミクロン、サブミクロンオーダーであるため、微小な付着物であっても、転写性に大きく影響を及ぼす。   When the pattern transfer is repeated on such an object to be processed, dirt such as a deposit is generated on the mold, and a desired pattern cannot be formed. In particular, since the pattern of the type used in the nanoimprint technology is on the order of microns and sub-microns, even a minute deposit greatly affects the transferability.

そこで、従来は、超音波洗浄のような振動や衝撃などの物理的なエネルギーを型に加えることにより洗浄する方法や、有機溶剤、アルカリ溶剤、専用洗浄剤、酸を含む溶剤などを用いて付着物等の汚れを溶かすことにより化学的に洗浄する方法があった(例えば、特許文献2)。   Therefore, conventionally, a method of cleaning by applying physical energy such as vibration and impact to the mold, such as ultrasonic cleaning, an organic solvent, an alkaline solvent, a special cleaning agent, a solvent containing an acid, etc. are used. There has been a method of chemically washing by dissolving dirt such as kimono (for example, Patent Document 2).

国際公開番号WO2004/062886International Publication Number WO2004 / 062886 特開平6−40729号公報JP-A-6-40729

しかしながら、付着物は小さくなるほど型表面に強く付着するため、振動や衝撃などの物理的エネルギーでは除去が困難である。また、型のパターンが小さくなると、大きな衝撃によりパターンを破損するという問題もある。   However, the smaller the deposits, the stronger the adhesion to the mold surface. Therefore, it is difficult to remove them with physical energy such as vibration and impact. Further, when the pattern of the mold becomes small, there is a problem that the pattern is damaged by a large impact.

また、化学的に除去する方法では、付着物の種類により様々な溶剤が必要になる他、付着物の種類によっては化学反応が起き難く、洗浄するのが困難であった。また、型の種類によっては、付着物除去の際に型も溶解されてしまうため使用できないという問題もある。例えば、Ni製の型の場合には、酸を用いることができず、Si製の型の場合には、フッ化水素や水酸化カリウムを用いることができない。また、微細な付着物の成分を特定するには多大な時間や労力が必要であるという問題もあった。更に、微細な汚れの成分を特定するには、高価な分析機器が必要であり、費用が掛かるという問題もあった。   In addition, the chemical removal method requires various solvents depending on the type of deposit, and it is difficult to perform a chemical reaction depending on the type of deposit and is difficult to clean. Further, depending on the type of mold, there is also a problem that the mold cannot be used because the mold is dissolved when removing the deposits. For example, in the case of a Ni type, acid cannot be used, and in the case of a Si type, hydrogen fluoride or potassium hydroxide cannot be used. There is also a problem that it takes a lot of time and labor to identify the components of fine deposits. Furthermore, in order to specify the component of the fine dirt, an expensive analytical instrument is required, and there is a problem that it is expensive.

そこで本発明は、付着した汚れの種類によらず、簡易かつ低コストで洗浄することができる型およびその洗浄方法、当該型の製造方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a mold that can be cleaned easily and at a low cost, a cleaning method thereof, and a manufacturing method of the mold, regardless of the kind of attached dirt.

上記目的を達成するために、本発明の型は、所定のパターンを有する型本体と、前記パターンの表面に形成されると共に、所定の方法によって除去可能な洗浄用膜と、を具備することを特徴とする。   In order to achieve the above object, a mold of the present invention comprises a mold body having a predetermined pattern, and a cleaning film formed on the surface of the pattern and removable by a predetermined method. Features.

また、本発明の更に好ましい型は、所定のパターンを有する型本体と、前記パターンの表面に形成されると共に、前記パターンを損傷することなく除去可能な洗浄用膜と、を具備することを特徴とする。   Furthermore, a more preferable mold of the present invention comprises a mold body having a predetermined pattern, and a cleaning film that is formed on the surface of the pattern and can be removed without damaging the pattern. And

これらの場合、前記洗浄用膜は、前記パターンを損傷することのない溶剤又はガスにより除去可能な材料で形成される方が好ましい。例えば、前記型本体を金属によって形成し、前記洗浄用膜をフッ素系樹脂によって形成するか、または、前記型本体をシリコン、石英ガラス、SiOのいずれかによって形成し、前記洗浄用膜をフッ素系樹脂によって形成するようにすれば良い。 In these cases, the cleaning film is preferably formed of a material that can be removed by a solvent or gas that does not damage the pattern. For example, the mold body is formed of metal and the cleaning film is formed of a fluorine resin, or the mold body is formed of silicon, quartz glass, or SiO 2 and the cleaning film is formed of fluorine. It may be formed by a system resin.

また、本発明の洗浄方法は、所定のパターンを有する型本体と、前記パターンの表面に形成される洗浄用膜と、を有する型から、前記洗浄用膜を除去することを特徴とする。この場合、前記洗浄膜の除去は、型を溶剤又はガスで処理することにより行えば良い。また、前記溶剤又はガスは、前記型本体のパターンを損傷することがないものである方が好ましい。例えば、所定のパターンを有する金属製の型本体と、前記パターンの表面に形成されるフッ素系樹脂からなる洗浄用膜と、を有する型の場合、当該型を有機溶媒を含む薬液、アルカリを含む薬液、界面活性剤を含む薬液、フッ素を含む薬液、アルカリ蒸気を含むガス、界面活性剤蒸気を含むガス、フッ素を含む物質のガス、酸素を含む物質のガスの少なくともいずれかで処理することにより、前記洗浄用膜を除去すれば良い。また、所定のパターンを有するシリコン、石英ガラス、SiOのいずれかからなる型本体と、前記パターンの表面に形成されるフッ素系樹脂からなる洗浄用膜と、を有する型の場合、型を有機溶媒を含む薬液、界面活性剤を含む薬液、フッ素を含む薬液、界面活性剤蒸気を含むガス、フッ素を含む物質のガス、酸素を含む物質のガスの少なくともいずれかで処理することにより、前記洗浄用膜を除去すれば良い。 The cleaning method of the present invention is characterized in that the cleaning film is removed from a mold having a mold body having a predetermined pattern and a cleaning film formed on the surface of the pattern. In this case, the cleaning film may be removed by treating the mold with a solvent or a gas. The solvent or gas is preferably one that does not damage the pattern of the mold body. For example, in the case of a mold having a metal mold body having a predetermined pattern and a cleaning film made of a fluororesin formed on the surface of the pattern, the mold includes a chemical solution containing an organic solvent and an alkali. By treating with at least one of a chemical solution, a chemical solution containing a surfactant, a chemical solution containing fluorine, a gas containing alkali vapor, a gas containing a surfactant vapor, a gas containing fluorine, or a gas containing a substance containing oxygen The cleaning film may be removed. In the case of a mold having a mold body made of any one of silicon, quartz glass, and SiO 2 having a predetermined pattern, and a cleaning film made of a fluororesin formed on the surface of the pattern, the mold is organic The cleaning is performed by treatment with at least one of a chemical solution containing a solvent, a chemical solution containing a surfactant, a chemical solution containing fluorine, a gas containing a surfactant vapor, a gas containing a fluorine substance, or a gas containing a substance containing oxygen. The film for use may be removed.

また、本発明の型の製造方法は、所定のパターンを有する型本体に、所定の方法によって除去可能な材料を溶かした溶液を前記型本体のパターン上に滴下してスピンコートすることにより洗浄用膜を形成することを特徴とする   Further, the mold manufacturing method of the present invention is for cleaning by dropping a solution in which a material that can be removed by a predetermined method is dropped onto the pattern of the mold body and spin-coating it onto the mold body having a predetermined pattern. It is characterized by forming a film

また、本発明の型の別の製造方法は、所定のパターンを有する型本体に、所定の方法によって除去可能な材料を溶かした溶液に前記型本体を浸漬することにより洗浄用膜を形成することを特徴とする。   Another method of manufacturing the mold of the present invention is to form a cleaning film by immersing the mold body in a solution in which a material removable by the predetermined method is dissolved in a mold body having a predetermined pattern. It is characterized by.

また、本発明の型の更に別の製造方法は、所定のパターンを有する型本体に、所定の方法によって除去可能な材料を化学気相成長法(CVD)又は物理気相成長法(PVD)を用いて堆積させることにより洗浄用膜を形成することを特徴とする。   Still another method of manufacturing the mold of the present invention is to apply a chemical vapor deposition method (CVD) or a physical vapor deposition method (PVD) to a mold body having a predetermined pattern by removing a material that can be removed by the predetermined method. A cleaning film is formed by using and depositing.

本発明の型は、所定のパターンを有する型本体と、パターンの表面に形成されると共に、所定の方法によって除去可能な洗浄用膜と、を具備するので、付着した汚れを洗浄用膜ごと除去することができる。   The mold of the present invention includes a mold body having a predetermined pattern, and a cleaning film that is formed on the surface of the pattern and can be removed by a predetermined method. can do.

また、本発明の洗浄方法は、所定のパターンを有する型本体と、パターンの表面に形成される洗浄用膜と、を有する型から、洗浄用膜を除去するので、パターン表面に付着した汚れの種類によらず、所定の洗浄方法で簡易かつ低コストで洗浄することができる。   Further, the cleaning method of the present invention removes the cleaning film from the mold having the mold body having a predetermined pattern and the cleaning film formed on the surface of the pattern. Regardless of the type, cleaning can be performed easily and at low cost by a predetermined cleaning method.

また、本発明の型の製造方法は、簡易な方法で洗浄用膜を形成することができるので、洗浄に適した型を容易に作製することができる。   Moreover, since the washing | cleaning film | membrane can be formed with a simple method by the manufacturing method of the type | mold of this invention, the type | mold suitable for washing | cleaning can be produced easily.

本発明の型100は、図1に示すように、所定のパターンを有する型本体1と、パターンの表面に形成されると共に、所定の方法によって除去可能な洗浄用膜2と、で構成される。   As shown in FIG. 1, the mold 100 of the present invention includes a mold body 1 having a predetermined pattern and a cleaning film 2 formed on the surface of the pattern and removable by a predetermined method. .

型本体1の材料は、例えば「ニッケル等の金属」、「セラミックス」、「ガラス状カーボン等の炭素素材」、「シリコン」などから形成されており、その一端面(成型面1a)に凹凸からなる所定のパターンが形成されている。このパターンは、その成型面1aに精密機械加工を施すことで形成することができる。また、型100の原盤となるシリコン基板等にエッチング等の半導体微細加工技術によって所定のパターンを形成した後、このシリコン基板等の表面に電気鋳造(エレクトロフォーミング)法(例えばニッケルメッキ法)によって金属メッキを施し、この金属メッキ層を剥離してパターンを形成することもできる。もちろん型本体1は、微細パターンを転写できるものであれば材料やその製造方法が特に限定されるものではない。なお、ここでいうパターンには、凹凸からなる幾何学的な形状のみならず、例えば所定の表面粗さを有する鏡面状態の転写のように所定の表面状態を転写するためのものや、所定の曲面を有するレンズ等の光学素子を転写するためのものも含む。   The material of the mold body 1 is formed of, for example, “metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon”, and the like, and has one end surface (molded surface 1a) with unevenness. A predetermined pattern is formed. This pattern can be formed by subjecting the molding surface 1a to precision machining. In addition, after a predetermined pattern is formed on a silicon substrate or the like used as the master of the mold 100 by a semiconductor micromachining technique such as etching, a metal is formed on the surface of the silicon substrate or the like by an electroforming method (for example, nickel plating method). It is also possible to form a pattern by plating and peeling the metal plating layer. Of course, as long as the mold body 1 can transfer a fine pattern, the material and the manufacturing method thereof are not particularly limited. The pattern referred to here includes not only a geometrical shape composed of irregularities but also a pattern for transferring a predetermined surface state, such as a mirror surface transfer having a predetermined surface roughness, Also included are those for transferring an optical element such as a lens having a curved surface.

このパターンの幅(成型面1aの平面方向の寸法)は、用いられる加工対象物200の種類にもよるが、100μm以下、10μm以下、2μm以下、1μm以下、100nm以下、10nm以下等種々の大きさに形成される。更に、このパターンの深さ(成型面1aと直交する方向の寸法)は、10nm以上、100nm以上、200nm以上、500nm以上、1μm以上、10μm以上、100μm以上等種々の大きさに形成される。また、このパターンのアスペクト比としては、0.2以上、0.5以上、1以上、2以上等種々のものがある。   The width of this pattern (the dimension in the plane direction of the molding surface 1a) varies depending on the type of the workpiece 200 used, but various sizes such as 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, 10 nm or less. Formed. Furthermore, the depth of this pattern (dimension in the direction perpendicular to the molding surface 1a) is formed in various sizes such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, 100 μm or more. The aspect ratio of this pattern includes various patterns such as 0.2 or more, 0.5 or more, 1 or more, 2 or more.

また、型本体1は、型100と加工対象物200とを押圧した際に、型100又は加工対象物200のうねりや凹凸に合わせて変形できる厚さ、例えば1μmないし2mmに形成される。また、この型100は、インプリントプロセス中に加熱・冷却されるため、できる限り薄型化し、その熱容量を小さくする方が好ましい。   The mold body 1 is formed to have a thickness that can be deformed in accordance with the undulations or irregularities of the mold 100 or the workpiece 200 when the mold 100 and the workpiece 200 are pressed, for example, 1 μm to 2 mm. Further, since the mold 100 is heated and cooled during the imprint process, it is preferable to make the mold 100 as thin as possible and reduce its heat capacity.

洗浄用膜2は、型本体1の表面、特にパターンの表面を覆う薄い膜で、所定の方法を用いることによって簡易に除去することができるものである。これにより、型100の表面に付着物等の汚れが生じても、この洗浄用膜2を除去することによって、付着物を洗浄用膜2と共に除去することができる。   The cleaning film 2 is a thin film that covers the surface of the mold body 1, particularly the surface of the pattern, and can be easily removed by using a predetermined method. As a result, even if dirt such as deposits occurs on the surface of the mold 100, the deposits can be removed together with the cleaning film 2 by removing the cleaning film 2.

ここで、洗浄用膜2は、簡易に除去することができるものであればどのようなものでも良く、例えば、溶剤やガスなどの化学的な方法で除去できるものを用いることができる。また、洗浄用膜2は、型本体1を損傷することのない溶剤やガスで除去できるものである方が好ましい。例えば、Ni等の金属は酸に弱いため、型本体1が金属製である場合には、酸以外の溶剤やガスによって除去できる洗浄用膜2を形成する。例えば、アルカリ系溶剤やフッ素系溶剤、界面活性剤等の酸以外の溶剤やガスによって除去できるフッ素系樹脂を用いることができる。また、シリコン(Si)や石英ガラス、SiOなどはアルカリに弱いため、型本体1がシリコン(Si)製や石英ガラス製、SiO製である場合には、アルカリ以外の溶剤やガスによって除去できる洗浄用膜2を形成する。例えば、フッ素系溶剤、界面活性剤等のアルカリ以外の溶剤やガスによって除去できるフッ素系樹脂を用いることができる。 Here, the cleaning film 2 may be any film as long as it can be easily removed. For example, a film that can be removed by a chemical method such as a solvent or a gas can be used. The cleaning film 2 is preferably one that can be removed with a solvent or gas that does not damage the mold body 1. For example, since metals such as Ni are vulnerable to acid, when the mold body 1 is made of metal, a cleaning film 2 that can be removed by a solvent or gas other than acid is formed. For example, a fluorine-based resin that can be removed by a solvent other than an acid such as an alkaline solvent, a fluorine-based solvent, or a surfactant, or a gas can be used. Further, since silicon (Si), quartz glass, SiO 2 and the like are vulnerable to alkali, when the mold body 1 is made of silicon (Si), quartz glass, or SiO 2 , it is removed by a solvent or gas other than alkali. A possible cleaning film 2 is formed. For example, a fluorine-based resin that can be removed by a solvent other than an alkali such as a fluorine-based solvent or a surfactant or a gas can be used.

なお、洗浄用膜2の膜厚が厚すぎると型本体1のパターンが埋まってしまうため、洗浄用膜2の厚さは付着物を除去できる範囲でできる限り薄く形成する方が好ましい。   If the thickness of the cleaning film 2 is too thick, the pattern of the mold body 1 is buried. Therefore, it is preferable that the thickness of the cleaning film 2 is as thin as possible within the range in which deposits can be removed.

また、洗浄用膜2は、型本体1に簡単に形成できる方が好ましい。例えば、上述した洗浄用膜2の材料を溶かした溶液を型本体1のパターン上に滴下してスピンコートする方法や、当該材料を溶かした溶液中に型本体1を浸漬する方法、当該材料を化学気相成長法(CVD)や物理気相成長法(PVD)等を用いて堆積させる方法を用いることができる。これにより、型100を洗浄し洗浄用膜2を除去した後であっても、再度型本体1に洗浄用膜2を形成して、型100を再生することができる。   Further, it is preferable that the cleaning film 2 can be easily formed on the mold body 1. For example, a method in which a solution in which the material for the cleaning film 2 described above is dissolved is dropped on the pattern of the mold body 1 and spin-coated, a method in which the mold body 1 is immersed in a solution in which the material is dissolved, A deposition method using chemical vapor deposition (CVD), physical vapor deposition (PVD), or the like can be used. Thus, even after the mold 100 is cleaned and the cleaning film 2 is removed, the cleaning film 2 can be formed again on the mold main body 1 and the mold 100 can be regenerated.

次に、本発明の型の洗浄方法について説明する。   Next, the mold cleaning method of the present invention will be described.

本発明の型の洗浄方法は、所定のパターンを有する型本体と、パターンの表面に形成される洗浄用膜とを有する型から、洗浄用膜を除去するものである。   The mold cleaning method of the present invention removes a cleaning film from a mold having a mold body having a predetermined pattern and a cleaning film formed on the surface of the pattern.

このように洗浄用膜を除去すれば、型に付着している付着物の種類によらず、所定の洗浄方法で型を洗浄することができる。換言すると、汚れの種類によって種々の洗浄を行う必要がなく、簡易かつ低コストで洗浄を行うことができる。   By removing the cleaning film in this way, the mold can be cleaned by a predetermined cleaning method regardless of the kind of deposits attached to the mold. In other words, it is not necessary to perform various types of cleaning depending on the type of dirt, and cleaning can be performed easily and at low cost.

ここで洗浄用膜の除去は、型本体1を損傷することなく除去できるものであればどのようなものでも良く、例えば、洗浄用膜を溶剤やガスなどの化学的な方法で反応させて除去すれば良い。具体的には、ニッケル等の金属製の型本体1にフッ素系の洗浄用膜が形成されている型を洗浄する場合、少なくとも有機溶媒を含む薬液、アルカリを含む薬液、界面活性剤を含む薬液、フッ素を含む薬液等に浸漬して処理するか、あるいはアルカリ蒸気を含むガス、界面活性剤蒸気を含むガス、フッ素を含む物質のガス、酸素を含む物質のガスのいずれかと反応させて処理すれば良い。また、シリコンの型本体1にフッ素系の洗浄用膜が形成されている型を洗浄する場合、少なくとも有機溶媒を含む薬液、界面活性剤を含む薬液、フッ素を含む薬液等に浸漬して処理するか、あるいは界面活性剤蒸気を含むガス、フッ素を含む物質のガス、酸素を含む物質のガスのいずれかと反応させて処理すれば良い。また、これらの処理を適宜組み合わせて洗浄することも勿論可能である。   Here, the cleaning film may be removed by any means as long as it can be removed without damaging the mold body 1. For example, the cleaning film is removed by a chemical method such as a solvent or gas. Just do it. Specifically, when cleaning a mold in which a fluorine-based cleaning film is formed on a metal mold body 1 such as nickel, a chemical solution containing at least an organic solvent, a chemical solution containing an alkali, and a chemical solution containing a surfactant Or by immersion in a chemical solution containing fluorine or by reacting with a gas containing alkali vapor, a gas containing surfactant vapor, a gas containing fluorine, or a gas containing oxygen. It ’s fine. Further, when a mold having a fluorine-based cleaning film formed on the silicon mold body 1 is cleaned, the mold is immersed in a chemical solution containing at least an organic solvent, a chemical solution containing a surfactant, a chemical solution containing fluorine, or the like. Alternatively, it may be processed by reacting with any of a gas containing a surfactant vapor, a gas containing a fluorine substance, or a gas containing a substance containing oxygen. Of course, it is also possible to perform cleaning by appropriately combining these treatments.

以下に本発明を実施例により説明するが、本発明はこれら実施例に限定されるものではない。   EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

実施例1
まず、ニッケル(Ni)製の型本体1をフッ素系樹脂溶液(ダイキン化成品販売製、商品名:デュラサーフ(HD-2101Z)に浸漬した後、乾燥して洗浄用膜を形成し、これを型として使用した。
Example 1
First, the mold body 1 made of nickel (Ni) is immersed in a fluorine-based resin solution (manufactured by Daikin Chemicals Sales, product name: Durasurf (HD-2101Z), and then dried to form a cleaning film. Used as a mold.

次に、この型を用いて環状オレフィン系樹脂フィルム(オプテス製、商品名:ゼオノアフィルムZF-14-100:厚み100ミクロン)に複数回パターンを転写すると、図2に示すように、型の表面に付着物等の汚れが生じた。   Next, when this pattern is used to transfer a pattern onto a cyclic olefin resin film (manufactured by Optes, trade name: ZEONOR film ZF-14-100: thickness 100 microns) multiple times, as shown in FIG. Dirt such as deposits was generated on the surface.

この型を十分な量の水酸化カリウム(KOH)に浸漬して洗浄を行った。その表面を光学顕微鏡によって観察した。その結果を図3に示す。   This mold was washed by dipping in a sufficient amount of potassium hydroxide (KOH). The surface was observed with an optical microscope. The result is shown in FIG.

比較例1
まず、洗浄用膜のないニッケル(Ni)製の型を用いて環状オレフィン系樹脂フィルム(オプテス製、商品名:ゼオノアフィルムZF-14-100:厚み100ミクロン)に複数回パターンを転写すると、図4に示すように、型の表面に付着物等の汚れが生じた。
Comparative Example 1
First, when a pattern is transferred to a cyclic olefin resin film (manufactured by Optes, trade name: ZEONOR film ZF-14-100: thickness 100 microns) using a nickel (Ni) mold without a cleaning film, As shown in FIG. 4, dirt such as deposits was generated on the surface of the mold.

この型を十分な量のトルエンに浸漬し、超音波洗浄を行った。その表面を光学顕微鏡によって観察した。その結果を図5に示す。   This mold was immersed in a sufficient amount of toluene and subjected to ultrasonic cleaning. The surface was observed with an optical microscope. The result is shown in FIG.

比較例2
まず、洗浄用膜のないニッケル(Ni)製の型を用いて環状オレフィン系樹脂フィルム(オプテス製、商品名:ゼオノアフィルムZF-14-100:厚み100ミクロン)に数回パターンを転写すると、図6に示すように、型の表面に付着物等の汚れが生じた。
Comparative Example 2
First, when a pattern is transferred several times to a cyclic olefin resin film (manufactured by Optes, trade name: ZEONOR film ZF-14-100: thickness 100 microns) using a nickel (Ni) mold without a cleaning film, As shown in FIG. 6, dirt such as deposits was generated on the surface of the mold.

この型を十分な量の水酸化カリウム(KOH)に浸漬して洗浄を行った。その表面を光学顕微鏡によって観察した。その結果を図7に示す。   This mold was washed by dipping in a sufficient amount of potassium hydroxide (KOH). The surface was observed with an optical microscope. The result is shown in FIG.

比較例1は、従来行われていた洗浄方法であるが、図4と図5から型に付着した汚れが落ちていない。これに対し、本発明に係る実施例1は、図2と図3から型に付着した汚れがきれいに落ちているのがわかる。また、比較例3は、実施例1と同じ洗浄方法で洗浄用膜のない型を洗浄したものであるが、図6と図7から型に付着した汚れが落ちていないのがわかる。   Comparative Example 1 is a conventional cleaning method, but the dirt attached to the mold is not removed from FIGS. 4 and 5. On the other hand, in Example 1 according to the present invention, it can be seen from FIGS. 2 and 3 that the dirt attached to the mold is cleanly removed. In Comparative Example 3, the mold without the cleaning film was cleaned by the same cleaning method as in Example 1, but it can be seen from FIGS. 6 and 7 that the dirt attached to the mold was not removed.

以上より、本発明の型およびその洗浄方法は、型の洗浄に適している。   From the above, the mold of the present invention and the cleaning method thereof are suitable for mold cleaning.

本発明の型を示す断面図である。It is sectional drawing which shows the type | mold of this invention. 本発明の型の洗浄前の状態を示す写真である。It is a photograph which shows the state before washing | cleaning of the type | mold of this invention. 本発明の型を本発明の洗浄方法で洗浄した後の状態を示す写真である。It is a photograph which shows the state after wash | cleaning the type | mold of this invention with the washing | cleaning method of this invention. 従来の型の洗浄前の状態を示す写真である。It is a photograph which shows the state before washing | cleaning of the conventional type | mold. 従来の型を従来の洗浄方法で洗浄した後の状態を示す写真である。It is a photograph which shows the state after wash | cleaning the conventional type | mold by the conventional cleaning method. 従来の型の洗浄前の状態を示す写真である。It is a photograph which shows the state before washing | cleaning of the conventional type | mold. 従来の型を洗浄した後の状態を示す写真である。It is a photograph which shows the state after wash | cleaning the conventional type | mold.

符号の説明Explanation of symbols

1 型本体
1a 成型面
2 洗浄用膜
100 型
1 Mold body 1a Molding surface 2 Cleaning film 100 mold

Claims (13)

所定のパターンを有する型本体と、
前記パターンの表面に形成されると共に、所定の方法によって除去可能な洗浄用膜と、
を具備することを特徴とする型。
A mold body having a predetermined pattern;
A cleaning film formed on the surface of the pattern and removable by a predetermined method;
A mold characterized by comprising:
所定のパターンを有する型本体と、
前記パターンの表面に形成されると共に、前記パターンを損傷することなく除去可能な洗浄用膜と、
を具備することを特徴とする型。
A mold body having a predetermined pattern;
A cleaning film formed on the surface of the pattern and removable without damaging the pattern;
A mold characterized by comprising:
前記洗浄用膜は、前記パターンを損傷することのない溶剤又はガスにより除去可能な材料で形成されることを特徴とする請求項1又は2記載の型。   3. The mold according to claim 1, wherein the cleaning film is made of a material that can be removed by a solvent or a gas that does not damage the pattern. 前記型本体は金属からなり、前記洗浄用膜はフッ素系樹脂からなることを特徴とする請求項1又は2記載の型。   The mold according to claim 1, wherein the mold body is made of metal, and the cleaning film is made of a fluororesin. 前記型本体はシリコン、石英ガラス、SiOのいずれかからなり、前記洗浄用膜はフッ素系樹脂からなることを特徴とする請求項1又は2記載の型。 3. The mold according to claim 1, wherein the mold body is made of any one of silicon, quartz glass, and SiO 2 , and the cleaning film is made of a fluorine-based resin. 所定のパターンを有する型本体と、前記パターンの表面に形成される洗浄用膜と、を有する型から、前記洗浄用膜を除去することを特徴とする型の洗浄方法。   A method for cleaning a mold, comprising: removing a cleaning film from a mold having a mold body having a predetermined pattern and a cleaning film formed on a surface of the pattern. 所定のパターンを有する型本体と、前記パターンの表面に形成される洗浄用膜と、を有する型を溶剤又はガスで処理することにより、前記洗浄用膜を除去することを特徴とする型の洗浄方法。   A mold cleaning comprising removing a cleaning film by treating a mold having a mold body having a predetermined pattern and a cleaning film formed on the surface of the pattern with a solvent or a gas. Method. 前記溶剤又はガスは、前記型本体のパターンを損傷することがないものであることを特徴とする請求項7記載の型の洗浄方法。   8. The mold cleaning method according to claim 7, wherein the solvent or gas does not damage the pattern of the mold body. 所定のパターンを有する金属製の型本体と、前記パターンの表面に形成されるフッ素系樹脂からなる洗浄用膜と、を有する型を、有機溶媒を含む薬液、アルカリを含む薬液、界面活性剤を含む薬液、フッ素を含む薬液、アルカリ蒸気を含むガス、界面活性剤蒸気を含むガス、フッ素を含む物質のガス、酸素を含む物質のガスの少なくともいずれかで処理することにより、前記洗浄用膜を除去することを特徴とする型の洗浄方法。   A mold having a metal mold body having a predetermined pattern and a cleaning film made of a fluororesin formed on the surface of the pattern, a chemical solution containing an organic solvent, a chemical solution containing an alkali, and a surfactant. The cleaning film is treated with at least one of a chemical solution containing fluorine, a chemical solution containing fluorine, a gas containing alkali vapor, a gas containing a surfactant vapor, a gas containing a fluorine substance, or a gas containing a substance containing oxygen. A method for cleaning a mold, characterized in that it is removed. 所定のパターンを有するシリコン、石英ガラス、SiOのいずれかからなる型本体と、前記パターンの表面に形成されるフッ素系樹脂からなる洗浄用膜と、を有する型を、有機溶媒を含む薬液、界面活性剤を含む薬液、フッ素を含む薬液、界面活性剤蒸気を含むガス、フッ素を含む物質のガス、酸素を含む物質のガスの少なくともいずれかで処理することにより、前記洗浄用膜を除去することを特徴とする型の洗浄方法。 A chemical solution containing an organic solvent, a mold having a mold main body made of any one of silicon, quartz glass, and SiO 2 having a predetermined pattern, and a cleaning film made of a fluororesin formed on the surface of the pattern; The cleaning film is removed by treatment with at least one of a chemical solution containing a surfactant, a chemical solution containing fluorine, a gas containing a surfactant vapor, a substance gas containing fluorine, or a substance gas containing oxygen. A mold cleaning method characterized by the above. 所定のパターンを有する型本体に、所定の方法によって除去可能な材料を溶かした溶液を前記型本体のパターン上に滴下してスピンコートすることにより洗浄用膜を形成することを特徴とする型の製造方法。   A mold film having a predetermined pattern is formed by dropping a solution in which a material removable by a predetermined method is dissolved onto the pattern of the mold body and spin-coating to form a cleaning film. Production method. 所定のパターンを有する型本体に、所定の方法によって除去可能な材料を溶かした溶液に前記型本体を浸漬することにより洗浄用膜を形成することを特徴とする型の製造方法。   A method for producing a mold, wherein a film for cleaning is formed by immersing the mold body in a solution in which a material removable by a predetermined method is dissolved in a mold body having a predetermined pattern. 所定のパターンを有する型本体に、所定の方法によって除去可能な材料を化学気相成長法(CVD)又は物理気相成長法(PVD)を用いて堆積させることにより洗浄用膜を形成することを特徴とする型の製造方法。   Forming a cleaning film on a mold body having a predetermined pattern by depositing a material that can be removed by a predetermined method using chemical vapor deposition (CVD) or physical vapor deposition (PVD). A method for producing a featured mold.
JP2007103329A 2007-04-10 2007-04-10 Mold suitable for washing, mold washing method and mold manufacturing method Pending JP2008260173A (en)

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