JP2008258469A - Electronics - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment for effectively dissipating heat from a heating element without enlarging a cooling fan and a heat sink. <P>SOLUTION: The electronic equipment includes: a circuit board 4; a heating element 1 mounted on the circuit board 4; a heat sink 2 for dissipating heat from the heating element 1; and a cooling fan 3 for generating cooling air for prompting heat dissipation of the heat sink 2. The circuit board 4 includes thereon a partition plate 6 for partitioning the heat sink 2 and other region so as to guide cooling air to the heat sink 2. Therefore, by guiding the cooling air to a heat generation region by the partition plate 6 heat dissipation of the heating element 1 can be effectively attained without enlarging the cooling fan 3 and the heat sink 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device such as an induction heating device that effectively dissipates heat from a heating element such as a switching element.

Conventionally, in this type of electronic device, for example, an induction heating device, a heating element such as a switching element is configured as a part of an inverter circuit component on a circuit board and radiates heat using a heat sink and a cooling fan ( For example, see Patent Document 1).
JP 2003-272817 A

  However, in the conventional configuration, in order to increase the heat generation amount of the heat generating element due to high output, it is necessary to increase the air volume of the cooling fan and increase the size of the heat sink. As a result, the noise increases due to an increase in cost due to an increase in the size of the cooling fan and an increase in the air volume. Further, if the heat sink is increased in size, there are problems that the projected area on the circuit board is increased and that the control circuit including the circuit board itself is increased in size. In addition, it is difficult to concentrate the cooling air on one point, and there is a problem that the cooling air does not increase due to the wind divergence.

  The present invention solves the above-described conventional problems, and an object thereof is to provide an electronic apparatus such as an induction heating device that effectively dissipates a heat generating element without increasing the size of a cooling fan or a heat sink. And

  In order to solve the above-described conventional problems, an electronic device according to the present invention includes a circuit board, a heat generating element attached to the circuit board, a heat sink for dissipating heat generated by the heat generating element, and cooling air that promotes heat dissipation of the heat sink. A cooling fan to be generated, and a partition plate for partitioning the heat sink and the other region is provided on the circuit board so as to guide the cooling air to the heat sink.

  In this way, the cooling air is guided to the heat generation region by the partition plate, so that the heat generation element can be radiated effectively without increasing the size of the cooling fan or the heat sink.

  The electronic device of the present invention can effectively dissipate heat from the heating element without increasing the size of the cooling fan or heat sink.

  A first invention includes a circuit board, a heat generating element attached to the circuit board, a heat sink for dissipating heat generated by the heat generating element, and a cooling fan for generating cooling air that promotes heat dissipation of the heat sink. The electronic device is provided with a partition plate that partitions the heat sink from other regions so that the cooling air is guided to the heat sink. As a result, the cooling air is guided to the heat generation region by the partition plate, so that the heat generation element can be effectively radiated without increasing the size of the cooling fan or the heat sink.

  In the second invention, in particular, in the first invention, a control circuit is formed on the partition plate to form a hybrid IC, whereby the entire circuit board can be reduced in size and the number of parts can be reduced.

  According to a third invention, in particular, in the first or second invention, a terminal is provided on the partition plate, and this terminal is inserted into a through hole for component insertion on the circuit board and soldered. At the same time, it can be mounted on a circuit board and can be easily assembled.

  According to a fourth aspect of the invention, in particular, in any one of the first to third aspects of the invention, the flow of cooling air is disturbed by providing a rectifying plate for adjusting the flow of the cooling air between the partition plate and the heat sink. It is possible to reduce the cooling effect at the same time.

  According to a fifth aspect of the invention, in particular, in any one of the first to fourth aspects of the invention, the partition plate is mounted on the circuit board so as to be in the same direction as the cooling air by the cooling fan. The direction of the cooling air can be efficiently flowed in a certain direction, and the heat generation of the heating element can be suppressed.

  Embodiments of the present invention will be described below with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
1 and 2 exemplify a circuit board configuration of an induction heating apparatus as an electronic apparatus according to Embodiment 1 of the present invention.

  As shown in FIG. 1, the electronic device according to the present embodiment includes a circuit board 4 fixed to a resin board case 5 and a switching element attached to the circuit board 4 and used for an inverter for induction heating. The heat generating element 1, the heat sink 2 configured on the circuit board 4 with a large surface area (fin shape) to dissipate the heat generated by the heat generating element 1, and cooling that generates cooling air that promotes heat dissipation of the heat sink 2 Fan 3 is provided. The heating element 1 is attached in thermal contact with the heat sink 2 as shown in FIG. 2, and the heat generated by the heating element 1 is radiated through the heat sink 2.

  On the circuit board 4, a partition plate 6 made of an insulating material is provided to partition the heat sink 2 and other regions so as to guide the cooling air from the cooling fan 3 to the heat sink 2. The partition plate 6 is mounted on the circuit board 4 so as to be in the same direction as the direction of the cooling air by the cooling fan 3.

  Here, when heating is performed with an electronic device, the heating element 1 is switched on / off at a high frequency (for example, 25 kHz), and a current of several tens of amperes flows. As a result, a loss of several tens of watts occurs in the heating element 1. In general, the heating element 1 which is a switching element is a semiconductor and is destroyed when the junction temperature exceeds 150 ° C. Therefore, the heating element 1 is thermally attached to the heat sink 2 and the cooling air generated by the cooling fan 3 is applied to the heat sink 2. It is cooling by that. Further, in order to efficiently apply the cooling air to the heat sink 2, a partition plate 6 is provided to partition the heat sink 2 and the other regions, and the passage of the cooling air is limited so that more cooling air efficiently hits the heat sink 2. It is configured as follows. Moreover, the partition plate 6 plays the role which protects from the influence of the water vapor | steam, oil smoke, etc. which a cooling wind brings with respect to components formed in areas other than the heat sink 2, and can maintain the stable quality.

  As described above, in the present embodiment, the cooling air is guided to the heat generating region by the partition plate 6, so that the heat generating element 1 can be effectively radiated without increasing the size of the cooling fan 3 or the heat sink 2. it can.

(Embodiment 2)
FIG. 3 illustrates a circuit board configuration of an induction heating device as an electronic device according to the second embodiment of the present invention. The same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in the figure, the electronic device in the present embodiment is a hybrid IC 7 in which a control circuit 8 for controlling the inverter unit is formed on a partition plate 6.

  With this configuration, the entire circuit board 4 can be reduced in size and the number of components can be reduced. In addition to effectively radiating heat from the heat generating element 1, it also has the effect of reducing the mounting cost.

(Embodiment 3)
FIG. 4 illustrates a circuit board configuration of an induction heating device as an electronic apparatus according to Embodiment 3 of the present invention. The same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in the figure, the electronic device according to the present embodiment is provided with a terminal 9 on a partition plate 6, and this terminal 9 is inserted and soldered into a through hole for component insertion on a circuit board 4.

  With this configuration, the partition plate 6 can be mounted on the circuit board 4 together with other components such as the heating element 1 and can be easily assembled in addition to effectively radiating heat from the heating element 1. .

(Embodiment 4)
FIG. 5 illustrates a circuit board configuration of an induction heating device as an electronic apparatus according to the fourth embodiment of the present invention. The same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in the figure, the electronic apparatus in the present embodiment is provided with a rectifying plate 10 for adjusting the flow of cooling air between the partition plate 6 and the heat sink 2. Specifically, a plurality of rectifying plates 10 having a predetermined width are attached to a partition plate 6 perpendicular to the circuit board 4 at a predetermined interval in the horizontal direction.

  With this configuration, it is possible to reduce the disturbance of the cooling air by the cooling fan 3, supply the rectified cooling air to the heat sink 2, and effectively dissipate the heat generating element 1.

  In each of the first to fourth embodiments, the induction heating device has been described as an example of the electronic device. However, the present invention is not limited to the induction heating device, and any device can be used as long as the electronic device includes a heating element, a heat sink, and a cooling fan. It can be applied without any problem.

  As described above, the electronic device according to the present invention can effectively dissipate the heat generating element without increasing the size of the cooling fan or the heat sink, and thus can be applied to all electronic devices including induction heating devices. .

The top view which shows the circuit board structure of the electronic device in Embodiment 1 of this invention. Sectional view showing the circuit board configuration of the electronic device Sectional drawing which shows the circuit board structure of the electronic device in Embodiment 2 of this invention Sectional drawing which shows the circuit board structure of the electronic device in Embodiment 3 of this invention Sectional drawing which shows the circuit board structure of the electronic device in Embodiment 4 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heating element 2 Heat sink 3 Cooling fan 4 Circuit board 5 Board case 6 Partition board 7 Hybrid IC
8 Control circuit 9 Terminal 10 Rectifier plate

Claims (5)

A circuit board, a heat generating element attached to the circuit board, a heat sink for dissipating heat generated by the heat generating element, and a cooling fan for generating a cooling air that promotes heat dissipation of the heat sink. An electronic device provided with a partition plate that partitions the heat sink from other regions so as to guide the heat sink. The electronic device according to claim 1, wherein a control circuit is formed on the partition plate to form a hybrid IC. The electronic device according to claim 1, wherein a terminal is provided on the partition plate, and the terminal is inserted into a through hole for component insertion on the circuit board and soldered. The electronic device of any one of Claims 1-3 which provided the baffle plate for adjusting the flow of a cooling wind between a partition plate and a heat sink. The electronic device according to any one of claims 1 to 4, wherein the partition plate is mounted on the circuit board so as to be in the same direction as the direction of the cooling air by the cooling fan.

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