JP2008249978A - Discharge amount adjustment method, liquid material discharge method, color filter manufacturing method, liquid crystal display device manufacturing method, and electro-optical device manufacturing method - Google Patents

Abstract

Disclosed are a discharge amount adjusting method capable of accurately adjusting a discharge amount, a liquid discharge method, a color filter manufacturing method, a liquid crystal display device manufacturing method, and an electro-optical device manufacturing method.
The present invention relates to a discharge amount adjustment method for adjusting a discharge amount when a droplet is discharged from a nozzle. In the measurement discharge step for discharging droplets from the nozzle, the first cooling step and the second cooling step for cooling the nozzle temperature, which is the temperature near the nozzle, and the measurement discharge step, the discharge amount discharged is measured. After adjusting the discharge amount through the measurement step and the adjustment step after the measurement discharge step, the measurement step and the adjustment step for adjusting the measured discharge amount to be close to the target discharge amount in the measurement step When the measurement discharge step is performed again, the first cooling step and the second cooling step are performed between the measurement discharge step and the measurement discharge step performed again.
[Selection] Figure 4

Description

  The present invention relates to a discharge amount adjusting method, a liquid discharge method, a color filter manufacturing method, a liquid crystal display device manufacturing method, and an electro-optical device manufacturing method, and in particular, the discharge amount of liquid droplets discharged from nozzles. The present invention relates to a method for adjusting with high accuracy.

  2. Description of the Related Art Conventionally, as a method for ejecting droplets onto a workpiece, a method for ejecting droplets using an ink jet droplet ejecting apparatus is known. The droplet discharge device moves along a table on which a workpiece such as a substrate is placed and the workpiece is moved in one direction, and a guide rail arranged in a direction perpendicular to the moving direction of the table at a position above the table. And a carriage. An ink jet head (hereinafter referred to as a droplet discharge head) is disposed on the carriage, and droplets are discharged onto the workpiece and applied.

  In a process of manufacturing a color filter of a liquid crystal display device, red blue green ink is ejected onto a substrate to form a red blue green film. At this time, when the discharge amount does not discharge the same amount for each nozzle, color unevenness occurs.

  In order to solve this problem, Patent Document 1 discloses a method for adjusting the discharge amount by accurately measuring the discharge amount per dot. According to this, after measuring the weight of the discharge amount, the discharge amount is adjusted by adjusting the voltage applied to the drive element that drives the droplet discharge head or the frequency of the drive waveform.

Japanese Patent Laid-Open No. 11-248927

  Various materials are used for the functional liquid to be applied by discharging liquid droplets onto the workpiece. Many functional fluids change in viscosity with temperature, and fluid resistance changes as the viscosity changes. As the fluid resistance changes, the flow velocity of the functional liquid flowing through the flow path in the droplet discharge head changes. As the flow rate of the functional liquid changes, the discharge amount per dot fluctuates, and it is difficult to accurately measure the discharge amount.

  When the cavity of the droplet discharge head is pressurized using a piezoelectric element, part of the energy applied to the operation of the piezoelectric element is converted into heat, which causes the temperature of the droplet discharge head to rise. Further, when the piezoelectric element is not driven, the piezoelectric element does not generate heat, and the droplet discharge head dissipates heat, which causes the temperature of the droplet discharge head to fluctuate.

  When measuring the discharge amount, the discharge amount is affected by the temperature. Therefore, the head temperature at the time of measurement needs to be measured under substantially the same temperature condition every time it is measured.

  The present invention has been made by paying attention to such conventional problems, and its purpose is to adjust the discharge amount with high accuracy, a discharge method for a liquid material, a method for manufacturing a color filter, a liquid crystal display, and the like. An object of the present invention is to provide a device manufacturing method and an electro-optical device manufacturing method.

  In order to solve the above problems, a discharge amount adjusting method of the present invention is a discharge amount adjusting method for adjusting a discharge amount when discharging a droplet from a nozzle, and includes a measurement discharge step for discharging a droplet from a nozzle. And a cooling step for lowering the nozzle temperature, which is a temperature near the nozzle, a measurement step for measuring the discharge amount discharged in the measurement discharge step, and the discharge amount measured in the measurement step as a target discharge amount. And adjusting the discharge amount in the adjustment process, and then performing the measurement discharge process again, the cooling process is performed between the measurement discharge process and the measurement discharge process performed again. It is characterized by.

  According to this discharge amount adjustment method, after discharging for measurement, the nozzle temperature is lowered before discharging for measurement again.

  When discharging droplets from the nozzle, the liquid is pressurized. By pressurizing the liquid, the pressure of the liquid is increased. At this time, the liquid is in contact with the gas at the nozzle. Since the pressure of the liquid becomes higher than the pressure of the gas, a part of the liquid becomes droplets and is discharged into the gas.

  When pressurizing a liquid, a part of the energy to pressurize is converted into heat. Then, the temperature near the nozzle rises.

  Many liquids have low viscosity because the kinetic energy of the molecules constituting the liquid increases as the temperature changes. When the viscosity of the liquid material changes, the fluid resistance when passing through a flow path such as a nozzle changes. And the discharge amount of the liquid discharged from the nozzle changes.

  In this adjustment method, after discharging for measurement, the discharge amount is measured and adjusted. At this time, the nozzle temperature rises. When adjusting again, the nozzle temperature is lowered and then discharged for measurement. Then, the discharge amount is measured and adjusted. That is, when discharging for measurement, the discharge amount under substantially the same temperature condition is measured by lowering the nozzle temperature. Therefore, the discharge amount can be measured in a state where the nozzle temperature difference when discharging is small. As a result, the discharge amount can be adjusted with high accuracy.

  In the discharge amount adjustment method of the present invention, the cooling step is performed in parallel with at least one of the measurement step and the adjustment step.

  According to this discharge amount adjustment method, the cooling process is performed during the measurement process or the adjustment process. In the measurement process, the discharged droplets are measured. In the adjustment step, adjustment is performed on the discharging means based on the measured result. And since a cooling process is performed with respect to a nozzle, a cooling process can be performed during performing a measurement process or an adjustment process.

  And after performing a cooling process, compared with the method of performing a measurement process and an adjustment process, discharge amount can be adjusted in a short time. As a result, the discharge amount can be adjusted with high productivity.

  The discharge amount adjusting method of the present invention includes a plurality of nozzles, and when performing the cooling process in at least one of the plurality of nozzles, the measurement discharge process is performed in at least one of the other nozzles. Features.

  According to this discharge amount adjusting method, a plurality of nozzles are provided. Then, by performing measurement discharge in a certain nozzle, when the nozzle temperature is high, measurement discharge is performed from nozzles whose temperature has been lowered while the nozzle temperature is being lowered. Since there are a plurality of nozzles, there may be a nozzle whose nozzle temperature is high due to ejection and a nozzle whose nozzle temperature is low due to cooling.

  At this time, while the nozzle whose nozzle temperature is high due to the discharge is cooled and the nozzle temperature is lowered, the measurement discharge can be performed from the nozzle whose nozzle temperature is cooled and low. At this time, measurement discharge can be performed while the nozzle temperature of the nozzle to be discharged is low.

  Then, in one nozzle, the measurement discharge, the measurement step, and the adjustment step are performed, and after the nozzle temperature is lowered, the measurement discharge, the measurement step, and the adjustment step are repeated again. In a short time, the discharge amount of the plurality of nozzles can be adjusted. As a result, the discharge amount can be adjusted with high productivity.

  In the discharge amount adjustment method of the present invention, nozzles that need to be adjusted again in the same order after adjusting the discharge amounts in a plurality of nozzles in order, adjusting all the discharge amounts that are to be adjusted In this case, the discharge amount is adjusted.

  According to this discharge amount adjustment method, after the first measurement discharge is performed from all nozzles to be adjusted, the second measurement is performed in the same order as when the first measurement discharge is performed. Dispensing is performed. The nozzle that discharges first can be cooled while discharging from the other nozzles. In this method, while discharging from all the other nozzles in order, the nozzles that have been discharged and the nozzle temperature has increased can be cooled.

  The cooling time can be set to a substantially uniform time because the discharge order is the same for the first time and the second time. On the other hand, when the order of the nozzles ejected at the first time and the order of ejection at the second time are different, there is a difference in the time between the first and second ejections for each nozzle. When the time between the first discharge and the second discharge is short, it is necessary to delay the time for performing the second discharge in order to cool down, so the time required for the discharge and measurement becomes longer.

  Therefore, the method in which the discharge order is the same for the first time and the second time can perform discharge, measurement, and adjustment in a shorter time compared to the case where the discharge order is different between the first time and the second time. As a result, the discharge amount can be adjusted with high productivity.

  The discharge amount adjusting method of the present invention has a warm-up drive process in which the nozzle temperature is warmed up until the nozzle temperature reaches a preset warm-up set temperature, and the warm-up drive process is performed before the measurement discharge process. It is characterized by being.

  According to this discharge amount adjustment method, the nozzle temperature is raised to the warm-up set temperature when the nozzle temperature falls below the warm-up set temperature by performing the warm-up drive process before the measurement discharge process. . Therefore, in the measurement discharge process, even when the nozzle temperature is too low, the discharge is performed in a state where the set temperature is substantially warm-up. As a result, since it is possible to measure the discharge amount at substantially the same nozzle temperature, it is possible to accurately measure the discharge amount.

  The discharge amount adjusting method of the present invention is characterized in that in the cooling step, the nozzle is left to cool.

  According to this discharge amount adjusting method, it is not necessary to prepare a means for cooling, and therefore a resource-saving cooling method can be achieved.

  The discharge amount adjustment method of the present invention has a cooling time setting step for setting a cooling setting time, which is a time for the nozzle temperature to drop to a predetermined temperature when the nozzle is left unattended. It is characterized by cooling between.

  According to this discharge amount adjusting method, the cooling set time is set, and in the cooling step, the cooling is performed for the cooling set time or more. The cooling setting time is a time required for the nozzle temperature to drop to a predetermined temperature when the nozzle is left, and is a time set in the cooling time setting step. In the cooling step, the nozzle temperature can be reliably lowered to a predetermined temperature by leaving it for a cooling set time or longer.

  In this method, the nozzle temperature is lowered to a predetermined temperature by managing the time. Therefore, since it is not necessary to prepare a means for managing the temperature, it is possible to provide a resource-saving method for managing the decrease in the nozzle temperature.

  In the discharge amount adjusting method of the present invention, the cooling setting time is set to a time when the discharge amount error due to the influence of the nozzle temperature is equal to or less than the allowable error.

  According to this discharge amount adjusting method, the cooling set time is set. There is a correlation between the nozzle temperature and the discharge amount, and when the dispersion of the nozzle temperature is large, the dispersion of the discharge amount becomes large. When adjusting the discharge amount, an allowable error with respect to the target value of the discharge amount is set. In order to keep the discharge amount within an allowable error, the temperature range of the nozzle temperature at the time of discharge is limited. In order to set the nozzle temperature within this temperature range, a cooling set time required for the nozzle temperature to be lowered is set. That is, in order for the discharge amount error to be less than or equal to the allowable error, it is necessary to set a cooling setting time in which the nozzle temperature is in a predetermined temperature range. In the present invention, the cooling setting in which the nozzle temperature is in a predetermined temperature range is required. The time is set. As a result, the discharge amount error is less than the allowable error, and the discharge amount can be adjusted with high accuracy.

  The discharge amount adjusting method of the present invention includes a cooling temperature setting step for setting a cooling set temperature that is a temperature to be cooled in the cooling step, and the cooling step includes a temperature measuring step for measuring the nozzle temperature, a nozzle temperature and cooling. Comparing with the cooling set temperature that is the temperature to be finished, it has a cooling judgment step for judging whether to continue cooling or to finish, and a leaving step for cooling the nozzle temperature, measuring the nozzle temperature, The nozzle temperature is cooled until the measured nozzle temperature reaches a cooling set temperature.

  According to this discharge amount adjusting method, the nozzle temperature is measured in the measurement process. Then, the nozzle is left until the nozzle temperature reaches the cooling set temperature. Therefore, in the cooling process, the nozzle temperature can be reliably lowered to the cooling set temperature. As a result, the nozzle temperature can be managed with high accuracy.

  In order to solve the above-mentioned problems, a liquid material discharge method of the present invention is a liquid material discharge method for discharging a liquid material to a workpiece from a nozzle as droplets, and a discharge amount adjusting step for adjusting a discharge amount; And an application step of discharging droplets onto the workpiece, and the discharge amount measurement step is adjusted using the discharge amount adjustment method described above.

  According to this liquid material discharge method, the discharge amount is accurately adjusted and then discharged onto the workpiece. Therefore, when discharging to the workpiece, it is possible to discharge with a precisely adjusted discharge amount.

  In order to solve the above-mentioned problems, a color filter manufacturing method of the present invention is a color filter manufacturing method including a step of applying and forming color ink on a substrate, and the liquid material discharge method described above In this case, the color ink is ejected and applied to the substrate.

  According to this color filter manufacturing method, since the color ink discharge amount is discharged and applied with high accuracy, the color filter can be applied with high accuracy.

  In order to solve the above problems, a method for manufacturing a liquid crystal display device according to the present invention includes forming an alignment film on a first substrate and a second substrate, and sandwiching the liquid crystal between the first substrate and the second substrate. A method for manufacturing a liquid crystal display device having a forming step, wherein a material for an alignment film is discharged to at least one of a first substrate and a second substrate using the liquid material discharge method described above. An alignment film is formed by coating.

  According to the method for manufacturing a liquid crystal display device, since the discharge amount in the alignment film material is discharged and applied with high accuracy, the liquid crystal display device manufacturing method in which the application amount in the alignment film material is applied with high accuracy is provided. be able to.

  In order to solve the above problems, a method for manufacturing a liquid crystal display device of the present invention includes a step of forming a liquid crystal between a first substrate and a second substrate after applying the liquid crystal to the first substrate. A method of manufacturing a liquid crystal display device, characterized in that liquid crystal is discharged and applied to a first substrate using the liquid material discharge method described above.

  According to this method for manufacturing a liquid crystal display device, since the liquid crystal discharge amount is discharged and applied with high accuracy, a liquid crystal display device manufacturing method in which the liquid crystal application amount can be applied with high accuracy can be obtained.

  In order to solve the above-described problems, an electro-optical device manufacturing method of the present invention is a method for manufacturing an electro-optical device having a step of forming a light-emitting element by applying a light-emitting element forming material to a substrate and then solidifying. Then, the light emitting element forming material is discharged and applied onto the substrate using the liquid discharge method described above.

  According to this method of manufacturing an electro-optical device, since the discharge amount of the light-emitting element forming material is accurately discharged and applied, the method of manufacturing the electro-optical device in which the light-emitting element forming material is applied with high accuracy is provided. be able to.

  In order to solve the above problems, an electro-optical device manufacturing method of the present invention is a method for manufacturing an electro-optical device having a step of forming an electrode by applying a liquid electrode material to a substrate and then solidifying it. According to another aspect of the present invention, the liquid electrode material is discharged and applied to the substrate using the liquid discharge method described above.

  According to this method of manufacturing an electro-optical device, since the discharge amount of the liquid electrode material is accurately discharged and applied, the electro-optical device in which the electrode material is formed by applying the electrode material application amount with high accuracy It can be set as the manufacturing method of this.

  In order to solve the above problems, an electro-optical device manufacturing method of the present invention is a method for manufacturing an electro-optical device having a step of forming a wiring by applying a liquid wiring material to a substrate and then solidifying it. Then, using the above-described liquid material discharge method, a liquid wiring material is discharged and applied to the substrate.

  According to this method for manufacturing an electro-optical device, since the discharge amount of the wiring material of the liquid material is discharged and applied with high accuracy, the application amount of the wiring material is applied with high accuracy and the wiring is formed. It can be set as the manufacturing method of this.

  In order to solve the above-described problems, an electro-optical device manufacturing method according to the present invention includes a step of forming a semiconductor by applying a liquid semiconductor material to a substrate, solidifying the substrate, and then heating the substrate. And a liquid semiconductor material is discharged and applied onto a substrate using the liquid discharge method described above.

  According to this method of manufacturing an electro-optical device, since the discharge amount of the liquid semiconductor material is accurately discharged and applied, the electro-optical device in which the semiconductor material is applied with high accuracy and the semiconductor is formed It can be set as the manufacturing method of this.

Embodiments of the present invention will be described below with reference to the drawings.
In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.

(First embodiment)
In the present embodiment, an example of a characteristic ejection method of the present invention in which a droplet ejection device and a droplet are ejected and drawn using the droplet ejection device will be described with reference to FIGS.

(Droplet discharge device)
First, a droplet discharge device 1 that discharges and applies droplets to a workpiece will be described with reference to FIGS. There are various types of droplet discharge devices, but a device using an ink jet method is preferable. The ink jet method is suitable for microfabrication because it can discharge minute droplets.

  FIG. 1 is a schematic perspective view showing the configuration of the droplet discharge device. A functional liquid is discharged and applied by the droplet discharge device 1. As shown in FIG. 1, the droplet discharge device 1 includes a base 2 formed in a rectangular parallelepiped shape. In the present embodiment, the longitudinal direction of the base 2 is the Y direction, and the direction orthogonal to the Y direction is the X direction.

  On the upper surface 2a of the base 2, a pair of guide rails 3a and 3b extending in the Y direction is provided so as to protrude over the entire width in the Y direction. On the upper side of the base 2, a stage 4 constituting a scanning means provided with a linear motion mechanism (not shown) corresponding to the pair of guide rails 3a and 3b is attached. The linear movement mechanism of the stage 4 is, for example, a screw type linear movement mechanism including a screw shaft (drive shaft) extending in the Y direction along the guide rails 3a and 3b and a ball nut screwed to the screw shaft. The drive shaft is connected to a Y-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in units of steps. When a drive signal corresponding to a predetermined number of steps is input to the Y-axis motor, the Y-axis motor rotates normally or reversely, and the stage 4 corresponds to the predetermined number of steps along the Y-axis direction. It moves forward or backward (scans in the Y direction) at a speed.

  Further, a main scanning position detection device 5 is disposed on the upper surface 2a of the base 2 in parallel with the guide rails 3a and 3b so that the position of the stage 4 can be measured.

  A placement surface 6 is formed on the upper surface of the stage 4, and a suction-type substrate chuck mechanism (not shown) is provided on the placement surface 6. When a substrate 7 as a work is placed on the placement surface 6, the substrate 7 is positioned and fixed at a predetermined position on the placement surface 6 by a substrate chuck mechanism.

  A pair of support bases 8a and 8b are erected on both side surfaces of the base 2 in the X direction, and a guide member 9 extending in the X direction is installed on the pair of support bases 8a and 8b.

  On the upper side of the guide member 9, a storage tank 10 that stores the functional liquid to be discharged is provided. On the other hand, a guide rail 11 extending in the X direction is provided below the guide member 9 so as to protrude over the entire width in the X direction.

  The carriage 12 arranged so as to be movable along the guide rail 11 is formed in a substantially rectangular parallelepiped shape. The linear movement mechanism of the carriage 12 is, for example, a screw type linear movement mechanism including a screw shaft (drive shaft) extending in the X direction along the guide rail 11 and a ball nut screwed to the screw shaft, The drive shaft is connected to an X-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in steps. When a drive signal corresponding to a predetermined number of steps is input to the X-axis motor, the X-axis motor rotates forward or backward, and the carriage 12 moves forward or backward along the X direction by the amount corresponding to the same number of steps. Move (scan in X direction). A sub-scanning position detector 13 is arranged between the guide member 9 and the carriage 12 so that the position of the carriage 12 can be measured. A droplet discharge head 14 is provided on the lower surface of the carriage 12 (the surface on the stage 4 side).

  A cleaning unit 15 is disposed on one side of the stage 4 (on the right side in the drawing) above the base 2. The cleaning unit 15 includes a maintenance stage 16 and a flushing unit 17, a capping unit 18, a wiping unit 19, a weight measuring device 20, and the like that are disposed on the maintenance stage 16 as a preliminary discharge region.

  The maintenance stage 16 is located on the guide rails 3 a and 3 b and includes a linear motion mechanism similar to that of the stage 4. The maintenance stage 16 can be moved to a desired location and stopped by detecting the position using the main scanning position detector 5 and moving with the linear motion mechanism.

  The flushing unit 17 is a device that receives liquid droplets ejected from the liquid droplet ejection head 14 when the flow path in the liquid droplet ejection head 14 is washed. When the functional liquid in the liquid droplet ejection head 14 is volatilized, the viscosity of the functional liquid becomes high, so that it becomes difficult to eject. In this case, in order to remove the functional liquid having a high viscosity from the droplet discharge head 14, the droplet discharge head 14 discharges the droplets for cleaning. The flushing unit 17 performs the function of receiving the droplets.

  The capping unit 18 is a device that covers the droplet discharge head 14. The liquid droplets ejected from the liquid droplet ejection head 14 may be volatile. When the solvent of the functional liquid present in the liquid droplet ejection head 14 volatilizes from the nozzle, the viscosity of the functional liquid changes and the nozzle is clogged. Sometimes. The capping unit 18 is configured to prevent the nozzle from being clogged by covering the droplet discharge head 14.

  Further, when solid matter is mixed into the droplet discharge head 14 and the droplet cannot be discharged, the functional liquid and solid matter inside the droplet discharge head 14 are sucked and removed. And nozzle clogging is eliminated.

  The wiping unit 19 is a device that wipes the nozzle plate on which the nozzles of the droplet discharge head 14 are arranged. The nozzle plate is a member disposed on the surface of the droplet discharge head 14 that faces the substrate 7. When droplets adhere to the nozzle plate, the droplets adhering to the nozzle plate may come into contact with the substrate 7, and the droplets may adhere to an unexpected location on the substrate 7. The wiping unit 19 prevents droplets from adhering to an unscheduled location on the substrate 7 by wiping the nozzle plate.

  Further, when a droplet is attached around the nozzle, the droplet attached to the nozzle plate comes into contact with the discharged droplet, and the trajectory of the discharged droplet is bent. Therefore, the place to apply may be different from the place to apply. The wiping unit 19 prevents droplets from adhering to an unscheduled location on the substrate 7 by wiping the nozzle plate.

  The weight measuring device 20 is provided with an electronic balance, and a tray is disposed on the electronic balance. A droplet is ejected from the droplet ejection head 14 to a tray, and an electronic balance measures the weight of the droplet. The tray is provided with a sponge-like absorber so that the ejected liquid droplets bounce and do not come out of the tray. The electronic balance measures the weight of the tray before and after the droplet discharge head 14 discharges droplets. The weight measuring device 20 can measure the weight of the liquid droplets to be discharged by calculating the difference in weight between the trays before and after the discharge.

  The maintenance stage 16 is moved along the guide rails 3a and 3b, and the carriage 12 is moved along the guide rail 11, so that the flushing unit 17 and the capping unit 18 are disposed at a position facing the droplet discharge head 14. Any one of the wiping unit 19 and the weight measuring device 20 is arranged.

  When the stage 4 and the maintenance stage 16 move in the Y direction along the guide rails 3a and 3b, the droplet discharge head 14 moves to a position facing the cleaning unit 15 or the substrate 7 and drops the droplet. Is to be discharged.

  The droplet discharge device 1 includes support columns 21 at four corners, and an air control device 22 at an upper portion (upper side in the drawing). The air control device 22 includes a blower, a filter, a cooling / heating device, a humidity adjusting device, and the like. The blower takes in the air in the factory and passes it through a filter, thereby removing dust and dirt in the air and supplying purified air.

  The air conditioner is a device that controls the temperature of the supplied air so that the atmospheric temperature of the droplet discharge device 1 is maintained within a predetermined temperature range. The humidity adjusting device is a device that controls the humidity of air supplied by dehumidifying or humidifying air so that the atmospheric humidity of the droplet discharge device 1 is maintained within a predetermined humidity range.

  A sheet 23 is arranged between the four support columns 21 so as to block the air flow. The air supplied from the air control device 22 flows from the air control device 22 toward the floor 24 (in the direction from the top to the bottom in the figure), and dust and dirt in the space surrounded by the sheet 23 are directed toward the floor 24. Fluid. Thereby, it is difficult for dust and dirt to adhere to the substrate 7.

  Further, the sheet 23 restricts the air flow, so that the temperature and humidity in the space surrounded by the sheet 23 are hardly affected from the outside of the sheet 23. The air control device 22 can easily control the temperature and humidity in the space surrounded by the seat 23.

  FIG. 2A is a schematic plan view showing the carriage. As shown in FIG. 2A, twelve droplet ejection heads 14, the first droplet ejection head 14 a to the twelfth droplet ejection head 14 m, are arranged on the carriage 12, and the surface of the droplet ejection head 14. The nozzle plate 30 is disposed in the nozzle plate 30. A plurality of nozzles 31 are arranged on the nozzle plate 30. The number of nozzles 31 may be set according to the pattern to be ejected and the size of the substrate 7. In this embodiment, for example, two nozzles 31 are arranged in one nozzle plate 30, Fifteen nozzles 31 are arranged in each row.

  FIG. 2B is a schematic side view showing the carriage, and is a view of the carriage shown in FIG. As shown in FIG. 2B, the carriage 12 includes a base plate 32. On the upper side of the base plate 32, a moving mechanism 33 as a scanning means is disposed, and a mechanism for moving the carriage 12 along the guide rail 11 is accommodated.

  A drive circuit board 35 is disposed below the base plate 32 via a support portion 34. A head drive circuit 36 is disposed below the drive circuit board 35. Further, a head mounting plate 38 is disposed on the base plate 32 via a support portion 37, and the droplet discharge head 14 is disposed on the lower surface of the head mounting plate 38. The head drive circuit 36 and the droplet discharge head 14 are connected by a cable (not shown), and a drive signal output from the head drive circuit 36 is input to the droplet discharge head 14.

  A supply device 39 is disposed below the base plate 32, and a tube (not shown) is provided between the storage tank 10 and the supply device 39 and between the supply device 39 and the droplet discharge head 14 shown in FIG. Connected by. The functional liquid supplied from the storage tank 10 is supplied to the droplet discharge head 14 by the supply device 39.

  FIG. 2C is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. As shown in FIG. 2C, the droplet discharge head 14 includes a nozzle plate 30, and a nozzle 31 is formed on the nozzle plate 30. A cavity 40 communicating with the nozzle 31 is formed on the upper side of the nozzle plate 30 and at a position facing the nozzle 31. A functional liquid 41 as a liquid material stored in the storage tank 10 is supplied to the cavity 40 of the droplet discharge head 14.

  Above the cavity 40, a vibration plate 42 that vibrates in the vertical direction (Z direction) and expands and contracts the volume in the cavity 40 and a piezoelectric element 43 that expands and contracts in the vertical direction and vibrates the vibration plate 42 are disposed. Has been. The piezoelectric element 43 expands and contracts in the vertical direction to pressurize and vibrate the diaphragm 42, and the diaphragm 42 pressurizes the cavity 40 by enlarging and reducing the volume in the cavity 40. Thereby, the pressure in the cavity 40 fluctuates, and the functional liquid 41 supplied into the cavity 40 is discharged through the nozzle 31.

  When the droplet discharge head 14 receives a nozzle drive signal for controlling and driving the piezoelectric element 43, the piezoelectric element 43 expands and the diaphragm 42 reduces the volume in the cavity 40. As a result, the functional liquid 41 corresponding to the reduced volume is discharged as droplets 44 from the nozzle 31 of the droplet discharge head 14. When the droplets 44 are ejected from the nozzles 31, a part of the energy applied to the droplet ejection head 14 is converted into heat in order to eject the droplets 44. And the periphery of the nozzle 31 which discharges the droplet 44 is heated, and temperature rises.

  FIG. 3 is an electric control block diagram of the droplet discharge device. In FIG. 3, the droplet discharge device 1 includes a CPU (arithmetic processing unit) 48 that performs various arithmetic processes as a processor, and a memory 49 that stores various types of information.

  The main scanning drive device 50, the sub-scanning drive device 51, the main scanning position detection device 5, the sub-scanning position detection device 13, and the head drive circuit 36 that drives the droplet discharge head 14 are connected via an input / output interface 52 and a data bus 53. Connected to the CPU 48. Further, the input device 54, the display device 55, the weight measuring device 20, the flushing unit 17, the capping unit 18, and the wiping unit 19 are also connected to the CPU 48 via the input / output interface 52 and the data bus 53. Similarly, in the cleaning unit 15, a maintenance stage driving device 56 that drives the maintenance stage 16 and a maintenance stage position detection device 57 that detects the position of the maintenance stage 16 are also connected to the CPU 48 via the input / output interface 52 and the data bus 53. ing.

  The main scanning drive device 50 is a device that controls the movement of the stage 4, and the sub-scanning drive device 51 is a device that controls the movement of the carriage 12. The main scanning position detection device 5 recognizes the position of the stage 4 and the main scanning driving device 50 controls the movement of the stage 4 so that the stage 4 can be moved and stopped to a desired position. Yes. Similarly, the sub-scanning position detection device 13 recognizes the position of the carriage 12 and the sub-scanning driving device 51 controls the movement of the carriage 12 so that the carriage 12 can be moved and stopped to a desired position. It has become.

  The input device 54 is a device that inputs various processing conditions for ejecting the droplets 44. For example, the input device 54 is a device that receives and inputs coordinates for ejecting the droplets 44 on the substrate 7 from an external device (not shown). The display device 55 is a device that displays processing conditions and work status, and an operator performs an operation using the input device 54 based on information displayed on the display device 55.

  The weight measuring device 20 includes an electronic balance and a saucer, and is a device that measures the weight of the droplet 44 ejected by the droplet ejection head 14 and the saucer that receives the droplet 44. The weight of the tray before and after the droplet 44 is discharged is measured, and the measured value is transmitted to the CPU 48.

  The maintenance stage driving device 56 selects one device from the flushing unit 17, the capping unit 18, the wiping unit 19, and the weight measuring device 20, and is positioned at a location facing the droplet discharge head 14. It is a device that moves. Then, after the maintenance stage position detection device 57 detects the position of the maintenance stage 16, the maintenance stage driving device 56 moves the maintenance stage 16, so that the desired device or unit can reliably operate the droplet discharge head 14. It is possible to move to a place opposite to.

  The memory 49 is a concept including a semiconductor memory such as a RAM and a ROM, and an external storage device such as a hard disk and a CD-ROM. Functionally, a storage area is set for storing program software 58 in which a procedure for controlling operations in the droplet discharge device 1 is described. Further, a storage area for storing discharge position data 59 which is coordinate data of the discharge position in the substrate 7 is also set.

  In addition, warm-up drive data 60 such as drive count data is set in the warm-up drive of the droplet discharge head 14. Further, when measuring the weight of the droplet 44 discharged from the nozzle 31, a storage area for storing measurement drive data 61 for driving the piezoelectric element 43 is set. Further, a storage area for head cooling data 62 relating to the cooling state of the droplet discharge head 14 is set. Further, a storage area for the discharge amount adjustment data 63 including the measurement data of the discharge amount measured by the weight measuring device 20 and data for determining whether or not the adjustment of the discharge amount is finished is set.

  Further, a storage area for storing a main scanning movement amount for moving the substrate 7 in the main scanning direction (Y direction) and a sub scanning movement amount for moving the carriage 12 in the sub scanning direction (X direction); A storage area that functions as a work area, a temporary file, and the like, and various other storage areas are set.

  The CPU 48 performs control for ejecting the functional liquid 41 as droplets 44 at predetermined positions on the surface of the substrate 7 in accordance with the program software 58 stored in the memory 49. As a specific function realization part, it has the weight measurement calculating part 64 which performs the calculation for implement | achieving weight measurement. Further, when the droplet discharge head 14 is warm-up driven, the cleaning calculation unit 65 that calculates the timing for cleaning the droplet discharge head 14, the selection of the droplet discharge head 14 that is warm-up driven, and the warm-up drive time A warm-up control calculation unit 66 is provided.

  In addition, a discharge calculation unit 67 that performs calculation for discharging the droplets 44 by the droplet discharge head 14 is provided. If the discharge calculation unit 67 is divided in detail, a discharge start position calculation unit 68 for setting the droplet discharge head 14 to an initial position for droplet discharge is provided. Furthermore, the ejection calculation unit 67 includes a main scanning control calculation unit 69 that calculates control for scanning and moving the substrate 7 in the main scanning direction (Y direction) at a predetermined speed. In addition, the discharge calculation unit 67 includes a sub-scanning control calculation unit 70 that calculates control for moving the droplet discharge head 14 in the sub-scanning direction (X direction) by a predetermined sub-scanning amount. Further, the discharge calculation unit 67 includes a nozzle discharge control calculation unit 71 that performs calculation for controlling which nozzle 31 is operated to discharge the functional liquid among the plurality of nozzles 31 in the droplet discharge head 14. It has various function calculation units.

(Discharge method)
Next, an ejection method for drawing on the substrate 7 using the above-described droplet ejection apparatus 1 will be described with reference to FIGS. FIG. 4 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate. 5 to 9 are diagrams for explaining a discharge method using a droplet discharge device.

  Step S1 corresponds to a cooling time setting step and is a step of setting a time for cooling the droplet discharge head. Next, the process proceeds to step S2. Step S2 corresponds to a cooling determination step, and is a step of determining whether or not to cool the droplet discharge head. When it is determined to cool (Yes), the process proceeds to step S3. Step S3 corresponds to a leaving step, and is a step in which the droplet discharge head is left and cooled by dissipating heat. Next, the process proceeds to step S2. When it is determined in step S2 that the cooling is not performed (No), the process proceeds to step S4. The first cooling step of Step S11 is configured by Steps S2 and S3. Step S11 is a step of cooling the droplet discharge head by radiating heat from the droplet discharge head. Step S4 corresponds to a measurement discharge step, and is a step of discharging a predetermined number of times from the nozzle to the tray of the weight measuring device. Next, the process proceeds to step S5. Step S5 corresponds to a measurement process, and measures the weight of the pan of the weight measuring device. And it is the process of calculating the discharge amount per discharge. Next, the process proceeds to step S6.

  Step S6 corresponds to a discharge amount determination step, and is a step of determining whether or not the measured discharge amount is within a specified range. When the discharge amount is not within the specified range (No), the process proceeds to step S7. In step S6, when the discharge amount is within a specified range (Yes), the process proceeds to step S8. Step S7 corresponds to an adjustment step, and is a step of adjusting the discharge amount discharged from the nozzle. Next, the process proceeds to step S8. The step S12 to step S7 constitute the second cooling step of step S12. Step S12 is a process in which the droplet discharge head is cooled by radiating heat. Steps S11 and S12 are both cooling steps.

  Step S8 corresponds to a step of determining whether or not the discharge amounts of all the discharge heads are within a specified range. In this step, it is determined whether or not the discharge amounts of all of the first droplet discharge head to the twelfth droplet discharge head are within the specified range when measured in step S5. When there is an ejection head whose measured ejection amount is not within the specified range (No), the process proceeds to step S1. When all the ejection heads have the ejection amount measured in step S5 within the specified range (Yes), the process proceeds to step S9.

  Step S9 corresponds to a coating process, and is a process of drawing by discharging droplets on the substrate. This completes the manufacturing process of discharging and applying droplets to the substrate.

Next, using FIG. 5 to FIG. 9, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately measured and applied to the workpiece in correspondence with the steps shown in FIG. 4 will be described in detail. .
FIGS. 5-6 is a figure corresponding to step S1, FIG. 5 (a) is a figure for demonstrating the method to measure the temperature of a nozzle plate. As shown in FIG. 5A, an infrared radiation thermometer 74 is used to measure the nozzle temperature, which is the temperature near the nozzle 31. An infrared camera 75 having an area sensor is disposed beside the weight measuring device 20, and the infrared camera 75 can image the arranged nozzles 31. A temperature analysis device 76 is electrically connected to the infrared camera 75, and an infrared radiation thermometer 74 is configured by the infrared camera 75 and the temperature analysis device 76. The infrared camera 75 receives infrared rays emitted from the nozzle plate 30, converts them into electrical signals, and outputs them to the temperature analyzer 76. The temperature analyzer 76 converts light energy received by the infrared camera 75 into temperature. Therefore, the temperature around each nozzle 31 on the nozzle plate 30 can be measured as the nozzle temperature.

  Subsequently, the droplet 44 is discharged from the nozzle 31 toward the weight measuring device 20. The weight measuring device 20 includes an electronic balance 77, a tray 78 is disposed on the electronic balance 77, and a sponge-like receptor 79 is stored in the tray 78. When the droplet 44 discharged from the nozzle 31 lands on the receptor 79, the droplet 44 is absorbed by the receptor 79 so that a part of the droplet 44 does not jump out of the tray 78. . Further, when the droplet 44 contains a volatile liquid, the droplet 44 soaks into the receptor 79, so that the droplet 44 is less likely to come into contact with the outside air and is less likely to volatilize. The number of discharges discharged in one step is preferably set in view of the responsiveness of the infrared radiation thermometer 74. In the present embodiment, for example, 100 is used. Therefore, when step S4 is repeated 12 times, the nozzle 31 discharges 1200 times.

  FIG. 5B is a graph showing the relationship between the nozzle temperature and the discharge amount when discharging continuously. In FIG. 5B, the horizontal axis shows the change of the nozzle temperature 80, and the right side is higher than the left side. The vertical axis indicates the change in the discharge amount 81, and the upper side is larger than the lower side. A change in the discharge amount 81 when the nozzle temperature 80 changes when discharging the first functional liquid is shown in the first discharge amount temperature correlation line 82a. Similarly, the case where the second functional liquid is discharged is indicated by a second discharge amount temperature correlation line 82b, and the case where the third functional liquid is discharged is indicated by a third discharge amount temperature correlation line 82c.

  For example, when the color filter is manufactured, the first functional liquid to the third functional liquid correspond to red ink, blue ink, and green ink. In addition, when forming wiring, functional liquids with different concentrations of metal powder dispersed in a solvent are applicable. In addition, when manufacturing a liquid crystal display device, a case where a plurality of different functional liquids are discharged is applicable. The functional liquid 41 includes a liquid containing a liquid crystal, a liquid containing a material for an alignment film, a liquid containing a material for forming a wiring, and the like.

  In both the first functional liquid to the third functional liquid, the discharge amount 81 is larger when the nozzle temperature 80 is higher than when the nozzle temperature 80 is low. The functional liquid is in a state where the solute is dissolved or dispersed in the solvent. And when the temperature of a solvent and a solute becomes high, since the amplitude which the molecule | numerator which comprises a solvent and a solute vibrates becomes large, the fluidity | liquidity of a solute becomes high. Therefore, when the nozzle temperature 80 increases, the viscosity of the functional liquid decreases. When the functional liquid 41 passes through the flow path of the droplet discharge head 14 or the nozzle 31, the fluid resistance of the functional liquid is lowered, so that the functional liquid is easily discharged. As a result, the discharge amount 81 increases.

  At this time, in the first function liquid to the third function liquid, the relationship between the viscosity and the temperature of the function liquid 41 is different, and thus the discharge amount 81 is different for each of the first function liquid to the third function liquid.

  FIG. 5C is a time chart showing a change in the discharge amount in the droplet discharge head. The horizontal axis indicates the passage of time 83, and the vertical axis indicates the change in the discharge amount 81. A discharge amount transition line 84 indicates a change in the discharge amount 81 with respect to the transition of the time 83.

  As shown in FIG. 5C, in the discharge section 84a, the discharge amount 81 increases as time 83 passes. At this time, by driving the piezoelectric element 43, the piezoelectric element 43 and the vibration plate 42 vibrate, a part of energy is converted into heat, and the nozzle temperature 80 rises. Then, the viscosity of the functional liquid 41 decreases and the discharge amount 81 increases.

  In the non-ejection section 84b, the ejection amount 81 decreases as the time 83 elapses. At this time, the driving of the piezoelectric element 43 is stopped, and the heat of the droplet discharge head 14 is dissipated into the atmosphere, so that the nozzle temperature 80 decreases. Then, the viscosity of the functional liquid 41 increases and the discharge amount 81 decreases.

  When the discharge amount 81 at the start of discharge is the discharge amount 84c during cooling and the nozzle temperature 80 at this time is the cooling set temperature, the discharge amount 81 in the non-discharge section 84b is the discharge amount 84c during cooling as time passes. Close to. An error that is allowed when the discharge amount 81 is measured and adjusted is defined as an allowable error 85. By stopping the discharge, the discharge amount 81 decreases, and when the discharge amount 81 is the sum of the cooling discharge amount 84c and the allowable error 85, the time 83 that has elapsed since the discharge was stopped is cooled to the minimum. Time 86 is assumed. Then, after the discharge, the cooling set time is set to a time longer than the minimum cooling time 86 when the time for cooling the droplet discharge head 14 by leaving it to be measured for discharge is set as the cooling set time. As the minimum cooling time 86, it is preferable to adopt a value that is measured a plurality of times and estimated using a statistical method. In step S1, the cooling set time is set.

  FIG. 6 is an adjustment order table showing the adjustment order in the droplet discharge head for adjusting the discharge amount. As shown in FIG. 6, in the first round, the discharge amount is measured in this order from the first droplet discharge head 14a to the twelfth droplet discharge head 14m. Adjustment is made when the discharge rate is not within the specified range. Measurement and adjustment are performed in the same order in the second and third rounds.

  For example, after the first droplet discharge head 14a discharges in step S4 in the first round and then in step S4 in the second round, the second droplet discharge head 14b to the twelfth droplet are discharged. The ejection head 14m performs step S4. Further, after the first droplet discharge head 14a discharges the first round and then discharges the second round, the first droplet discharge head 14a to the twelfth droplet discharge head 14m perform the second step S12. The time for performing the cooling step is included. If this time is longer than the set cooling time, it is determined in step S2 that cooling is not necessary, so the leaving step in step S3 is not performed.

  In step S2, the elapsed time since the droplet discharge head 14 discharged last time is confirmed. Then, when the elapsed time from the ejection of the droplet ejection head 14 is shorter than the cooling set time, the droplet ejection head 14 is left unattended in step S3. For example, when the time after the droplet discharge head 14 discharges to the flushing unit 17 and the flushing is shorter than the cooling set time, the process proceeds to step S3.

  In step S3, the droplet discharge head 14 is left in the atmosphere. At this time, the droplet discharge head 14 is cooled by removing heat from the flow of air passing in contact with the droplet discharge head 14. When the elapsed time after the droplet discharge head 14 discharges becomes longer than the cooling set time, the process passes through step S2 and proceeds to step S4.

  FIG. 7A is a time chart showing a driving waveform of the droplet discharge head. FIG. 7A is an example when droplets 44 are continuously ejected from the droplet ejection head 14, and the head drive circuit 36 displays three ejection drive waveforms 87 for driving the piezoelectric elements 43. . The horizontal axis of the figure shows the passage of time 83, and the vertical axis shows the change of the drive voltage 88. The ejection drive waveform 87 has a substantially trapezoidal waveform, and the ejection voltage 89 and the ejection pulse width 90, which are the peak values of the drive voltage during ejection, are set to a predetermined voltage and time. The ejection waveform period 91 that is the period of the ejection drive waveform 87 is also formed at a predetermined time interval. The discharge voltage 89, the discharge pulse width 90, and the discharge waveform period 91 need to be set according to the dynamic characteristics of the piezoelectric element 43 and the diaphragm 42. Therefore, it is desirable to carry out a preliminary test for actual ejection to derive optimum ejection conditions.

  FIG. 7B and FIG. 7C are diagrams corresponding to step S4. As shown in FIG. 7B, the weight measuring device 20 is positioned at a position facing the first droplet discharge head 14a by moving the maintenance stage 16 and the carriage 12. Then, as shown in FIG. 7C, the piezoelectric element 43 is driven by applying a voltage of the ejection drive waveform 87 to the piezoelectric element 43 shown in FIG. 2C of the first droplet ejection head 14a. Then, a droplet 44 is discharged from the nozzle 31 to the weight measuring device 20. Then, the time when the ejection is finished is stored in the memory 49 as one of the head cooling data 62. In step S2, it is determined whether or not to cool using the time when the discharge is finished.

  In step S <b> 5, the weight measuring device 20 measures the weight of the discharged droplet 44. In step S4, the weight measuring device 20 includes a pre-discharge weight that is the weight of the tray 78 before the droplet 44 is discharged, and a post-discharge weight that is the weight of the tray 78 after the droplet 44 is discharged. Measure. Then, by calculating a difference obtained by subtracting the pre-discharge weight from the post-discharge weight, the weight of the discharged droplet 44 is measured. Next, by dividing the measured weight of the droplet 44 by the number of ejections, the ejection amount of the droplet 44 ejected by one ejection is calculated.

  Next, in step S6, it is determined whether the discharge amount is within a specified range. When the ejection amount is within the specified range, the measured number of the droplet ejection head 14 and data indicating that the adjustment has been completed are stored in the memory 49 as one of the ejection amount adjustment data 63. Then, the process proceeds to step S8.

  When the discharge amount is not within the specified range in step S6, the discharge amount is adjusted in step S7. In this step, adjustment is performed using a correlation table. This correlation table is a table showing the relationship between the discharge amount and the discharge voltage 89. And this correlation table is a table set by investigating in a step different from the step described above. Then, the discharge voltage 89 is changed using the measured value of the discharge amount measured in step S5 and the correlation table so that the discharge amount becomes the target discharge amount. Specifically, when the discharge amount is smaller than the target discharge amount, the discharge voltage 89 is increased. On the other hand, when the discharge amount is larger than the target discharge amount, the discharge voltage 89 is decreased. And after adjusting the discharge voltage 89, it transfers to step S8.

  Between step S5 and step S7, the droplet discharge head 14 is not driven. Accordingly, during this time, the droplet discharge head 14 is radiated and cooled. This interval is the second cooling step in step S12, and step S12 is a step that proceeds in parallel with step S5 to step S7.

  In step S8, the droplet discharge heads 14 determined in step S6 that the discharge amount is not within the specified range are searched. Specifically, since the number of the droplet discharge heads 14 whose discharge amount is within a specified range is stored in the memory 49, the memory among the first droplet discharge head 14a to the twelfth droplet discharge head 14m The droplet discharge heads 14 not stored in 49 are searched. When the discharge amounts of all the droplet discharge heads 14 are within the specified range, the process proceeds to step S9.

  Then, when there is a droplet discharge head 14 whose discharge amount is not within the specified range, the droplet discharge head 14 to be adjusted next is selected using the adjustment order table shown in FIG. The selected droplet discharge head 14 is adjusted from step S2.

  FIG. 8 is a diagram corresponding to step S9. As shown in FIG. 8, the carriage 12 and the stage 4 are moved, and the droplet discharge head 14 and the substrate 7 are moved so that the droplet discharge head 14 and the substrate 7 face each other. Next, based on a predetermined drawing pattern, droplets 44 are ejected and applied to the substrate 7. The planned drawing pattern is applied and step S9 is ended, and the manufacturing process for discharging and applying droplets to the substrate is ended.

As described above, this embodiment has the following effects.
(1) According to this embodiment, after discharging for measurement in step S4, the discharge amount 81 is measured and adjusted. At this time, the nozzle temperature 80 rises. When adjusting again, in step S11 and step S12, after the nozzle temperature 80 is lowered, it is discharged for measurement. Then, the discharge amount 81 is measured and adjusted. That is, when discharging for measurement, the discharge amount 81 under substantially the same temperature condition is measured by lowering the nozzle temperature 80. Accordingly, the discharge amount 81 can be measured in a state where the nozzle temperature difference during discharge is small. As a result, it is possible to accurately adjust the discharge amount using the measured data.

  (2) According to this embodiment, while performing the measurement process of step S5 or the adjustment process of step S7, the droplet discharge head 14 is cooled in the second cooling process of step S12 in parallel. . Therefore, after performing a cooling process, compared with the method of performing a measurement process and an adjustment process, discharge amount can be adjusted in a short time. As a result, the droplet discharge head 14 can be cooled and the discharge amount 81 can be adjusted with good productivity.

  (3) According to this embodiment, a plurality of droplet discharge heads 14 are provided. Then, when the nozzle temperature 80 is high due to the measurement discharge in a certain droplet discharge head 14, while the nozzle temperature 80 is being lowered, the droplets that have dropped to the other nozzle temperature 80. Measurement discharge is performed from the discharge head 14. Accordingly, it is possible to adjust the discharge amount in the plurality of droplet discharge heads 14 in a short time compared to the method of adjusting each droplet discharge head 14 one by one. As a result, the discharge amount can be adjusted with high productivity.

  (4) According to this embodiment, after the first measurement discharge is performed from all of the droplet discharge heads 14 to be adjusted, the same measurement discharge is performed in the same order. A second measurement discharge is performed. The droplet discharge head 14 to be discharged first can be cooled while discharging from another nozzle. In this method, while discharging from all the other nozzles in order, the nozzles that have been discharged and the nozzle temperature has increased can be cooled. Therefore, the method in which the discharge order is the same for the first time and the second time can perform discharge, measurement, and adjustment in a shorter time compared to the case where the discharge order is different between the first time and the second time. As a result, the discharge amount can be adjusted with high productivity.

  (5) According to this embodiment, when the droplet discharge head 14 is cooled, the droplet discharge head 14 is left in the atmosphere to radiate heat. Therefore, since it is not necessary to prepare a means for cooling, a resource-saving cooling method can be achieved.

  (6) According to this embodiment, after setting the cooling set time in Step S1, the cooling process in Step S11 and Step S12 is performed for cooling for the cooling set time or more. In the cooling process, the nozzle temperature 80 can be reliably lowered to a predetermined temperature by leaving it for the cooling set time. In this method, the nozzle temperature is lowered to a predetermined temperature by managing the time. Therefore, since it is not necessary to prepare a means for managing the temperature, a resource saving method can be achieved.

  (7) According to the present embodiment, in step S1, the cooling setting time during which the nozzle temperature is within the predetermined temperature range is set in order to make the discharge amount error equal to or less than the allowable error. As a result, the discharge amount error is less than the allowable error, and the discharge amount can be adjusted with high accuracy.

(Second Embodiment)
In the present embodiment, an embodiment of a characteristic ejection method of the present invention in which droplets are ejected using a droplet ejection device and applied to a workpiece will be described with reference to FIGS.
This embodiment is different from the first embodiment in that it has a warm-up drive process.

  FIG. 9 is a flowchart showing a manufacturing process in which droplets are ejected and applied onto a substrate. Steps S1 to S3 are the same as steps S1 to S3 in the first embodiment, and a description thereof will be omitted. If it is determined in step S2 that the cooling is not performed (No), the process proceeds to step S21. Step S21 corresponds to a warm-up driving process, and is a process of driving the piezoelectric element to such an extent that no droplets are discharged from the nozzle. At this time, warm-up driving is performed in the droplet discharge head that discharges in step S4. Next, the process proceeds to step S4. Steps S4 to S12 are the same as steps S4 to S12 of the first embodiment, and a description thereof will be omitted. Through the above steps, the manufacturing process of discharging and applying to the substrate is completed.

  Next, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately measured and applied to the workpiece will be described in detail with reference to FIG. 10 in association with the steps shown in FIG.

  10A to 10B are diagrams corresponding to step S1, and FIG. 10A is a time chart showing a driving waveform of the droplet discharge head. FIG. 10A shows three non-ejection drive waveforms 94 that are an example of warm-up driving by driving the droplet ejection head 14 without ejecting the droplets 44. The horizontal axis of the figure shows the passage of time 83, and the vertical axis shows the change of the drive voltage 88. The non-ejection driving waveform 94 has a substantially trapezoidal waveform, and the non-ejection voltage 95 that is the peak value of the driving voltage at the time of non-ejection greatly vibrates the piezoelectric element 43 within a range where the droplets 44 are not ejected. Better. In the present embodiment, for example, the non-ejection voltage 95 employs a voltage that is about one third of the ejection voltage 89. The non-ejection pulse width 96 which is a pulse width at the time of non-ejection employs the same value as the ejection pulse width 90. A non-ejection waveform period 97 that is a waveform period of the non-ejection drive waveform 94 is set to an interval at which the piezoelectric element 43 vibrates. In the present embodiment, for example, the non-ejection waveform period 97 employs the same time interval as the ejection waveform period 91.

  FIG. 10B is a time chart showing changes in the discharge amount in the droplet discharge head. The horizontal axis indicates the passage of time 83, and the vertical axis indicates the change in the discharge amount 81. A discharge amount transition line 98 indicates a change in the discharge amount 81 with respect to the transition of the time 83.

  As shown in FIG. 10B, warm-up driving is performed in the warm-up drive section 98a, and the discharge amount 81 increases as time 83 passes. Then, the increase in the discharge amount 81 is reduced and the discharge amount 81 becomes constant. The discharge amount 81 at this time is the warm-up discharge amount 98b, and the nozzle temperature 80 is the warm-up set temperature.

  In the discharge section 98c, since the nozzle 31 is discharged and the nozzle temperature 80 rises, the discharge amount 81 increases with the passage of time 83. In the non-ejection section 98d, the droplet ejection head 14 dissipates heat and the nozzle temperature 80 decreases, so that the ejection amount 81 decreases with the passage of time 83.

  The discharge amount 81 in the non-discharge section 98d becomes close to the warm-up discharge amount 98b as time passes. An error allowed when the discharge amount 81 is measured and adjusted is set as an allowable error 99. By stopping the discharge, the discharge amount 81 decreases, and when the discharge amount 81 becomes the sum of the warm-up discharge amount 98b and the allowable error 99, the time 83 that has elapsed since the discharge was stopped is minimized. The cooling time is 100. Then, when the time for cooling the droplet discharge head 14 by leaving it to be discharged for measurement after discharge is set as the cooling set time, the cooling set time is set longer than the minimum cooling time 100. In step S2, when it is determined whether cooling is necessary or not, this cooling set time is used. As the minimum cooling time 100, it is preferable to adopt a value that is measured a plurality of times and estimated using a statistical method. In step S1, the cooling set time is set.

  Steps S2 and S3 are the same as steps S2 and S3 of the first embodiment, and a description thereof is omitted.

  FIG. 10C is a diagram corresponding to step S21. As shown in FIG. 10C, the piezoelectric element 43 is driven by applying a voltage of the non-ejection drive waveform 94 to the piezoelectric element 43 shown in FIG. 2C of the first droplet ejection head 14a. The first droplet discharge head 14 a is heated by heat generated when the piezoelectric element 43 is driven and heat generated by the head drive circuit 36.

  Steps S4 to S9, Step S11, and Step S12 are the same as Steps S4 to S9, Step S11, and Step S12 of the first embodiment, and a description thereof is omitted. Then, the planned drawing pattern is applied and step S9 is ended, and the manufacturing process for discharging and applying droplets to the substrate is ended.

As described above, according to the present embodiment, in addition to the effects (2) to (7) in the first embodiment, the following effects are obtained.
(1) According to this embodiment, when the nozzle temperature 80 falls below the warm-up set temperature by performing the warm-up driving process in step S21 before the measurement discharge process in step S4, the nozzle temperature 80 is The temperature has risen to the warm-up set temperature. Therefore, in the measurement discharge process, discharge is performed in a state where the nozzle temperature 80 is substantially the warm-up set temperature. As a result, since the discharge amount at substantially the same nozzle temperature 80 can be measured, the discharge amount can be accurately measured.

  (2) According to the present embodiment, the warm-up set temperature is higher than the cooling set temperature in the first embodiment. Therefore, the minimum cooling time 100 is shorter than the minimum cooling time 86 in the first embodiment. Therefore, since the time for the leaving step in step S3 is shortened, it can be adjusted with high productivity.

(Third embodiment)
In this embodiment, FIGS. 11 to 14 show a droplet discharge device and an embodiment of a characteristic discharge method of the present invention in which droplets are discharged using this droplet discharge device and applied to a workpiece. It explains using.
This embodiment differs from the second embodiment in that a temperature sensor is built in the droplet discharge head.

  FIG. 11 is a schematic cross-sectional view of a main part of the droplet discharge head. That is, in this embodiment, as shown in FIG. 11, the droplet discharge head 106 is configured. The droplet discharge head 106 includes a nozzle plate 30, and the nozzle 31 is formed on the nozzle plate 30. A cavity 40 communicating with the nozzle 31 is formed at a position above the nozzle plate 30 and facing the nozzle 31. A temperature sensor 107 is formed so as to be in contact with the functional liquid 41 in the nozzle plate 30 and the cavity 40. The temperature sensor 107 may be a temperature sensor that has a high response speed and can be measured with high accuracy. For example, in the present embodiment, a thermistor is used.

  Since the temperature sensor 107 is in contact with the functional liquid 41 in the nozzle plate 30 and the cavity 40, the temperature of the functional liquid 41 in the nozzle plate 30 and the cavity 40 can be detected. Since the nozzle plate 30 and the functional liquid 41 are located in the vicinity of the nozzle 31, the temperature detected by the temperature sensor 107 can be a nozzle temperature that is the temperature in the vicinity of the nozzle 31. In addition, one temperature sensor 107 is disposed in one droplet discharge head 106.

  FIG. 12 is an electric control block diagram of the droplet discharge device. The droplet discharge device 108 includes twelve droplet discharge heads 106, and one temperature sensor 107 is disposed for each droplet discharge head 106. Accordingly, twelve temperature sensors 107 are arranged.

  The temperature sensor 107 is connected to the nozzle temperature detection device 109. The nozzle temperature detection device 109 is connected to the CPU 48 via the input / output interface 52 and the data bus 53. The temperature sensor 107, the nozzle temperature detection device 109, and the like constitute a temperature measurement unit.

  The temperature sensor 107 outputs a voltage signal corresponding to the temperature near the nozzle 31 to the nozzle temperature detection device 109. The nozzle temperature detection device 109 receives a voltage signal, converts it into a digital signal corresponding to the nozzle temperature, and outputs it to the CPU 48. A temperature sensor 107 is disposed in the vicinity of each nozzle 31, and the CPU 48 can recognize the nozzle temperature of each nozzle 31.

  FIG. 13 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate, and FIG. 14 is a diagram for explaining an ejection method using a droplet ejection device.

  In FIG. 13, step S31 corresponds to a cooling temperature setting step, and is a step of setting a temperature threshold value for determining the end of cooling when the droplet discharge head is cooled. Next, the process proceeds to step S32. Step S32 corresponds to a temperature measurement step and is a step of measuring the temperature of the droplet discharge head. Next, the process proceeds to step S33.

  Step S33 corresponds to a cooling determination step and is a step of determining whether or not to cool the droplet discharge head. When it is determined to cool (Yes), the process proceeds to step S3. When it is determined in step S33 that the cooling is not performed (No), the process proceeds to step S21. The step S32, step S33, and step S3 constitute the third cooling step of step S41. Step S41 is a step of cooling the droplet discharge head by radiating heat from the droplet discharge head.

  Step S21 is the same as that of the second embodiment, and Steps S4 to S9 and Step S12 are the same as those of the first embodiment, and the description thereof is omitted. Through the above steps, the manufacturing process of discharging and applying to the substrate is completed.

  Next, with reference to FIG. 14, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately measured and applied to the workpiece in correspondence with the steps shown in FIG. 13 will be described in detail.

  14A and 14B are diagrams corresponding to step S31, and FIG. 14A is a time chart showing a change in nozzle temperature in the droplet discharge head. The horizontal axis shows the passage of time 83, and the vertical axis shows the change in the nozzle temperature 80. The nozzle temperature transition line 110 shows the change in the nozzle temperature 80 with respect to the transition of the time 83.

  As shown in FIG. 14A, the warm-up drive is performed in the warm-up drive section 110a, and the nozzle temperature 80 rises as time 83 passes. Then, the rise in the nozzle temperature 80 is reduced, and the nozzle temperature 80 becomes constant. The nozzle temperature 80 at this time is defined as a warm-up nozzle temperature 110b. In the discharge section 110c, the nozzle temperature 80 is discharged from the nozzle 31, and in the non-discharge section 110d, the nozzle temperature 80 decreases with the passage of time 83.

  FIG. 14B is a graph showing the relationship between the nozzle temperature and the discharge amount when discharging continuously. In FIG. 14B, the horizontal axis indicates the change in the nozzle temperature 80, and the right side is higher than the left side. The vertical axis indicates the change in the discharge amount 81, and the upper side is larger than the lower side. When the functional liquid 41 is discharged, the discharge amount 81 that changes with the change in the nozzle temperature 80 is indicated by a discharge amount temperature correlation line 111.

  The discharge amount 81 at the warm-up nozzle temperature 110b is defined as the warm-up discharge amount 111a. The discharge amount 81 obtained by adding the warm-up discharge amount 111a and the discharge amount 81 with the allowable error 112 is set as the allowable discharge amount 111b. In the discharge amount temperature correlation line 111, the nozzle temperature 80 corresponding to the allowable discharge amount 111b is set as the allowable nozzle temperature 111c. In step S31, the cooling set temperature is set to a temperature lower than the allowable nozzle temperature 111c.

  In step S <b> 32, the nozzle temperature detection device 109 outputs the nozzle temperature 80 detected by the temperature sensor 107 to the CPU 48. At this time, the temperature sensor 107 detects the nozzle temperature 80 of the droplet discharge head 106 that adjusts the discharge amount next. Then, the CPU 48 compares the detected nozzle temperature 80 with the cooling set temperature. When the nozzle temperature 80 is higher than the cooling set temperature, the process proceeds to step S3, and when it is lower, the process proceeds to step S21. Therefore, when step S41 is completed and the process proceeds to step S21, the nozzle temperature 80 is lower than the allowable nozzle temperature 111c. In step S21, after the warm-up driving, the nozzle temperature 80 can be set to a temperature close to the warm-up nozzle temperature 110b.

  Steps S4 to S9 and Step S12 are the same as those in the first embodiment, and a description thereof will be omitted. Then, the planned drawing pattern is applied and step S9 is ended, and the manufacturing process for discharging and applying droplets to the substrate is ended.

As described above, according to the present embodiment, in addition to the effects (2) to (7) in the first embodiment and the effects (1) and (2) in the second embodiment, the following effects are obtained. Have.
(1) According to this embodiment, the nozzle temperature 80 is measured in the measurement process of step S32. And it is left until the nozzle temperature 80 reaches the cooling set temperature. Therefore, in the third cooling step of step S41, the nozzle temperature 80 can be reliably lowered to the cooling set temperature. As a result, the nozzle temperature can be managed with high accuracy.

(Fourth embodiment)
Next, an embodiment of manufacturing a liquid crystal display device by applying the ejection method of the present invention will be described with reference to FIG.

  First, a liquid crystal display device which is one of electro-optical devices including a color filter will be described. FIG. 15 is a schematic exploded perspective view showing the structure of the liquid crystal display device.

  As shown in FIG. 15, the liquid crystal display device 120 as an electro-optical device includes a transmissive liquid crystal display panel 121 and an illumination device 122 that illuminates the liquid crystal display panel 121. The liquid crystal display panel 121 is arranged with the liquid crystal 123 sandwiched between an element substrate 124 as a first substrate and a counter substrate 125 as a second substrate. A lower polarizing plate 126 is disposed on the lower surface of the element substrate 124, and an upper polarizing plate 127 is disposed on the upper surface of the counter substrate 125.

  The element substrate 124 includes a substrate 128 made of a light transmissive material, and an insulating film 129 is formed on the substrate 128. On the insulating film 129, pixel electrodes 130 as electrodes are formed in a matrix. Each pixel electrode 130 is formed with a TFT (Thin Film Transistor) element 131 as a semiconductor having a switching function. The pixel electrode 130 is connected to the drain terminal of the TFT element 131.

  Surrounding each pixel electrode 130 and the TFT element 131, a scanning line 132 as a wiring and a data line 133 as a wiring are formed in a grid pattern. The scanning line 132 is connected to the gate terminal of the TFT element 131, and the data line 133 is connected to the source terminal of the TFT element 131.

  An alignment film 135 is formed on the liquid crystal 123 side of the element layer 134 including the pixel electrode 130, the TFT element 131, the scanning line 132, the data line 133, and the like.

  The counter substrate 125 includes a substrate 137 made of a light transmissive material. A lower layer bank 138 made of a light-shielding material is formed in a lattice shape below the substrate 137, and an upper layer bank 139 made of an organic compound or the like is formed below the lower layer bank 138. The lower layer bank 138 and the upper layer bank 139 constitute a partition 140.

  Red (R), green (G), and blue (B) color filters 141R, 141G, and 141B are formed as colored layers 141 in the recesses partitioned in a matrix by the partition 140. An overcoat layer 142 is formed as a planarizing layer that covers the partition wall 140 and the color filters 141R, 141G, and 141B. A counter electrode 143 as an electrode made of a transparent conductive film such as ITO (Indium Tin Oxide) is formed so as to cover the overcoat layer 142. Further, an alignment film 144 is formed on the liquid crystal 123 side of the counter electrode 143. The alignment film 144 and the alignment film 135 are formed with groove-shaped unevenness, and the liquid crystal 123 is formed along the unevenness.

  The liquid crystal 123 has a property that the tilt angle of the liquid crystal 123 changes when a voltage is applied to the pixel electrode 130 and the counter electrode 143 sandwiching the liquid crystal 123, and the voltage applied to the liquid crystal 123 by the switching operation of the TFT element 131. Is controlled to control the tilt angle of the liquid crystal 123 to perform the operation of transmitting or blocking light for each pixel. In addition, since light does not naturally enter the pixel where the light is blocked by the liquid crystal 123, the color is black. Thus, by operating the liquid crystal 123 as a shutter by switching operation of the TFT, the transmission of light is controlled for each pixel, and the image can be displayed by blinking the pixel.

  The pixel electrode 130 is electrically connected to the drain terminal of the TFT element 131. By turning on the TFT for a certain period, the pixel signal supplied from the data line 133 is given to each pixel electrode 130 at a predetermined timing. Supplied in. The voltage level of the pixel signal having a predetermined level supplied to the pixel electrode 130 in this way is held between the counter electrode 143 and the pixel electrode 130 of the counter substrate 125, and the liquid crystal 123 is changed according to the voltage level of the pixel signal. The amount of transmitted light changes.

  The lighting device 122 includes a light source, and includes a light guide plate, a diffusion plate, a reflection plate, and the like that can emit light from the light source toward the liquid crystal display panel 121. As the light source, a white LED, EL, cold cathode tube, or the like can be used. In this embodiment, a cold cathode tube is employed.

  The lower polarizing plate 126 and the upper polarizing plate 127 may be combined with an optical functional film such as a retardation film used for the purpose of improving the viewing angle dependency. The liquid crystal display panel 121 is not limited to a TFT element as an active element, but may include a TFD (Thin Film Diode) element, or may be a passive liquid crystal display device in which electrodes constituting pixels intersect with each other. .

  In the process of forming the color filters 141R, 141G, and 141B on the counter substrate 125, the ejection method in the first to third embodiments is used. Specifically, the lower layer bank 138 and the upper layer bank 139 are formed on the substrate 137, and the partition 140 is formed. The method for forming the partition wall 140 is well known and will not be described. And the color ink of each color is manufactured by melt | dissolving the material of color filter 141R, 141G, 141B in a solvent, or disperse | distributing it to a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, this color ink is discharged and applied to the concave portion surrounded by the partition 140.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the color ink is discharged and applied. Thereafter, the applied color ink is heated and dried to solidify, thereby forming the color filters 141R, 141G, and 141B.

  Further, in the step of forming the counter electrode 143 on the lower surface of the overcoat layer 142 in the counter substrate 125, the ejection method in the first to third embodiments is used. Specifically, the material liquid of the electrode film is manufactured by dissolving the material of the counter electrode 143 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the lower surface of the overcoat layer 142.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Then, the counter electrode 143 is formed by heating and drying and solidifying the applied electrode film material liquid.

  Further, in the step of forming the alignment film 144 on the lower surface of the counter electrode 143 in the counter substrate 125, the ejection method in the first to third embodiments is used. Specifically, the material for the alignment film 144 is dissolved in a solvent or dispersed in a dispersion medium to produce a material liquid for the alignment film. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this alignment film is discharged and applied to the lower surface of the counter electrode 143.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the alignment film material liquid is discharged and applied. Thereafter, the alignment film 144 is formed by solidifying the applied alignment film material by heating and drying.

  Further, in the step of forming the scanning lines 132 and the data lines 133 in the element layer 134 of the element substrate 124, the ejection method in the first to third embodiments is used. Specifically, a bank is formed of an insulating film so that a place where a wiring is to be formed becomes a recess. Then, the wiring material liquid is manufactured by dissolving the wiring material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this wiring is discharged and applied to the recesses formed between the banks.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the wiring material liquid is discharged and applied. Then, the scanning line 132 and the data line 133 are formed by heating and drying and solidifying the applied wiring material liquid.

  Further, in the step of forming the TFT element 131 in the element layer 134 in the element substrate 124, the ejection method in the first to third embodiments is used. Specifically, a bank is formed of an insulating film so that the place where the TFT element 131 is formed becomes a recess. Then, a TFT element material solution is manufactured by dissolving a TFT element material such as silicon in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the TFT element is discharged and applied to the recesses formed between the banks.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment process and the measurement process are repeated to adjust the discharge amount, and then the material liquid of the TFT element is discharged and applied. Thereafter, the material liquid of the TFT element is heated and dried to solidify and crystallize. Thereafter, after ion doping, an insulating film and a terminal are formed to form a TFT element 131.

  Further, in the step of forming the pixel electrode 130 on the upper surface of the element layer 134 in the element substrate 124, the ejection method in the first to third embodiments is used. Specifically, a material liquid of the electrode film is manufactured by dissolving the material of the pixel electrode 130 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the upper surface of the element layer 134.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Then, the pixel electrode 130 is formed by solidifying the electrode film material liquid by heating and drying.

  Further, in the step of forming the alignment film 135 on the upper surface of the element layer 134 in the element substrate 124, the ejection method in the first to third embodiments is used. Specifically, the material of the alignment film 135 is dissolved in a solvent or dispersed in a dispersion medium to produce an alignment film material solution. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this alignment film is discharged and applied to the upper surface of the element layer 134.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the alignment film material liquid is discharged and applied. Then, the alignment film 135 is formed by solidifying the applied alignment film material by heating and drying.

  Further, in order to sandwich the liquid crystal 123 between the element substrate 124 and the counter substrate 125, the ejection method in the first to third embodiments is used in the step of applying the liquid crystal 123 to the element substrate 124. Specifically, the liquid crystal material liquid is discharged and applied to the upper surface of the alignment film 135 using the droplet discharge device 1 or the droplet discharge device 108.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the liquid crystal material liquid is discharged and applied.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the color filters 141R, 141G, and 141B, the discharge amount of the color ink is accurately adjusted by using the discharge method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the color filters 141R, 141G, and 141B in which the color ink application amount is accurately applied.

  (2) According to this embodiment, in the process of manufacturing the alignment films 135 and 144, the discharge method in the material of the alignment film can be accurately controlled by using the discharge method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the alignment films 135 and 144 in which the application amount of the alignment film material is applied with high accuracy.

  (3) According to the present embodiment, in the step of applying the liquid crystal, the discharge method of the first to third embodiments is used to accurately discharge and apply the liquid crystal discharge amount. . Accordingly, it is possible to manufacture the liquid crystal display device 120 in which the amount of liquid crystal applied is accurately applied.

  (4) According to the present embodiment, in the process of manufacturing the pixel electrode 130 and the counter electrode 143, the discharge amount of the electrode material can be accurately controlled by using the discharge method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the pixel electrode 130 and the counter electrode 143 to which the application amount of the electrode material is applied with high accuracy.

  (5) According to the present embodiment, in the process of manufacturing the scanning line 132 and the data line 133, the ejection amount of the wiring material can be accurately controlled by using the ejection method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the scanning lines 132 and the data lines 133 in which the amount of wiring material applied is accurately applied.

  (6) According to the present embodiment, in the process of manufacturing the TFT element 131, by using the ejection method according to the first to third embodiments, the ejection amount of the semiconductor material can be ejected with high accuracy and applied. is doing. Therefore, it is possible to manufacture the TFT element 131 in which the semiconductor material is applied with high accuracy.

(Fifth embodiment)
Next, an embodiment of manufacturing an organic EL device by applying the ejection method of the present invention will be described with reference to FIG.

  First, an organic EL device that is one of electro-optical devices will be described. FIG. 16 is a schematic exploded perspective view showing the structure of the organic EL device.

  As shown in FIG. 16, the organic EL device 147 as an electro-optical device includes a substrate 148. An insulating film 149 is formed on the upper surface of the substrate 148. On the insulating film 149, contact electrodes 150 are formed in a matrix, and TFT elements 151 serving as a semiconductor having a switching function are formed at positions adjacent to the contact electrodes 150. A contact electrode 150 is connected to the drain terminal of the TFT element 151.

  Scanning lines 152 as wirings and data lines 153 as wirings are formed in a grid pattern so as to surround each contact electrode 150 and TFT element 151. The scanning line 152 is connected to the gate terminal of the TFT element 151, and the data line 153 is connected to the source terminal of the TFT element 151.

  An element layer 154 including a contact electrode 150, a TFT element 151, a scanning line 152, a data line 153, and the like is formed. An insulating film 155 is formed on the upper surface of the element layer 154, and banks 156 are formed in a lattice shape on the upper surface of the insulating film 155.

  A pixel electrode 157 as an electrode is formed at each bottom of the concave region formed by the bank 156, and the pixel electrode 157 is electrically connected to the contact electrode 150. A hole transport layer 158 as a light emitting element is formed on the upper surface of the pixel electrode 157, and light emitting layers 159 R, 159 G, and 159 B as light emitting elements are formed on the upper surface of the hole transport layer 158. The hole transport layer 158 and the light emitting layers 159R, 159G, and 159B form a functional layer 160 as a light emitting element.

  The light emitting layer 159R is a light emitting layer made of an organic light emitting material that emits red light, and the light emitting layer 159G as a light emitting element is a light emitting layer made of an organic light emitting material that emits green light. Similarly, the light emitting layer 159B as the light emitting element is a light emitting layer made of an organic light emitting material that emits blue light.

  A cathode 161 as an electrode made of a light-transmitting conductive material or the like is formed over the entire upper surface of the functional layer 160 and the bank 156. In the present embodiment, the cathode 161 employs, for example, ITO.

  A sealing film 162 made of a light transmissive material or the like is formed on the upper surface of the cathode 161 to prevent the cathode 161 and the functional layer 160 from being oxidized by oxygen in the air.

  When a voltage is applied between the pixel electrode 157 and the cathode 161, the hole transport layer 158 flows only holes. The light emitting layers 159R, 159G, and 159B have a property of emitting light by energy when the holes supplied from the hole transport layer 158 and the electrons supplied from the cathode 161 are combined. The TFT element 151 performs a switching operation and controls the amount of light emitted from the light emitting layers 159R, 159G, and 159B by controlling the voltage applied to the functional layer 160. In this manner, by controlling the amount of light emitted by the light emitting layers 159R, 159G, and 159B, the amount of light can be controlled for each pixel, and the image can be displayed by blinking the pixel.

  The pixel electrode 157 is electrically connected to the drain terminal of the TFT element 151, and the pixel signal supplied from the data line 153 is supplied to each pixel electrode 157 at a predetermined timing by turning on the TFT for a certain period. Supplied in. The voltage level of the pixel signal of the predetermined level supplied to the pixel electrode 157 in this way is held between the cathode 161 and the pixel electrode 157, and the light emitting layers 159R, 159G, and 159B according to the voltage level of the pixel signal. The amount of light emitted changes.

  In the step of forming the scanning lines 152 and the data lines 153 in the element layer 154, the ejection method in the first to third embodiments is used. Specifically, a bank is formed of an insulating film so that a place where a wiring is to be formed becomes a recess. Then, the wiring material liquid is manufactured by dissolving the wiring material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this wiring is discharged and applied to the recesses formed between the banks.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the wiring material liquid is discharged and applied. Then, the scanning line 152 and the data line 153 are formed by heating and drying and solidifying the applied wiring material liquid.

  Further, in the step of forming the TFT element 151 in the element layer 154, the ejection method in the first to third embodiments is used. Specifically, a bank is formed with an insulating film so that the place where the TFT element 151 is formed becomes a recess. Then, a TFT element material solution is manufactured by dissolving a TFT element material such as silicon in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the TFT element is discharged and applied to the recesses formed between the banks.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment process and the measurement process are repeated to adjust the discharge amount, and then the material liquid of the TFT element is discharged and applied. Thereafter, the material liquid of the TFT element is heated and dried to solidify and crystallize. Then, after ion doping, the TFT element 151 is formed by forming an insulating film and a terminal.

  Further, in the step of forming the pixel electrode 157 on the upper surface of the insulating film 155, the ejection method in the first to third embodiments is used. Specifically, a material liquid for the electrode film is manufactured by dissolving the material of the pixel electrode 157 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the electrode film is discharged and applied to the upper surface of the insulating film 155.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Then, the pixel electrode 157 is formed by solidifying the electrode film material liquid by heating and drying.

  Further, in the step of forming the hole transport layer 158 on the upper surface of the pixel electrode 157, the ejection method in the first to third embodiments is used. Specifically, the material liquid of the hole transport layer is manufactured by dissolving the material of the hole transport layer 158 as the light emitting element forming material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the hole transport layer is discharged and applied to the upper surface of the pixel electrode 157.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the hole transport layer is discharged and applied. Thereafter, the hole transport layer 158 is formed by heating and solidifying the material liquid of the hole transport layer by heating.

  Further, in the step of forming the light emitting layers 159R, 159G, and 159B on the upper surface of the hole transport layer 158, the ejection method in the first to third embodiments is used. Specifically, the material liquid of the light emitting layer is manufactured by dissolving the material of the light emitting layers 159R, 159G, and 159B as the light emitting element forming material in a solvent or dispersing in a dispersion medium. Next, by using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the light emitting layer is discharged and applied to the upper surface of the hole transport layer 158.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the light emitting layer is discharged and applied. Then, the light emitting layer 159R, 159G, and 159B are formed by heat-drying and solidifying the material liquid of a light emitting layer.

  Further, in the step of forming the cathode 161 on the upper surface of the functional layer 160 and the bank 156, the ejection method in the first to third embodiments is used. Specifically, the material of the cathode 161 is dissolved in a solvent or dispersed in a dispersion medium to produce a cathode material solution. Next, using the droplet discharge device 1 or the droplet discharge device 108, the cathode material liquid is discharged and applied to the upper surfaces of the functional layer 160 and the bank 156.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the cathode material liquid is discharged and applied. Thereafter, the cathode 161 is formed by solidifying the cathode material liquid by heating and drying.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the scanning line 152 and the data line 153, the ejection amount of the wiring material can be accurately controlled by using the ejection method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the scanning lines 152 and the data lines 153 in which the coating amount of the wiring material is accurately applied.

  (2) According to the present embodiment, in the process of manufacturing the TFT element 151, the discharge method of the first to third embodiments is used to accurately discharge and apply the discharge amount of the semiconductor material. is doing. Therefore, it is possible to manufacture the TFT element 151 to which the semiconductor material is applied with high accuracy.

  (3) According to this embodiment, in the process of manufacturing the pixel electrode 157 and the cathode 161, the discharge method of the first to third embodiments is used to discharge the discharge amount of the electrode material with high accuracy. And apply. Accordingly, it is possible to manufacture the pixel electrode 157 and the cathode 161 to which the electrode material is applied with high accuracy.

  (4) According to the present embodiment, in the process of manufacturing the functional layer 160, the discharge method of the light emitting element forming material is discharged with high accuracy by using the discharge method in the first to third embodiments. Apply. Therefore, the functional layer 160 to which the application amount of the light emitting element forming material is accurately applied can be manufactured.

(Sixth embodiment)
Next, an embodiment of manufacturing a surface electric field display device by applying the ejection method of the present invention will be described with reference to FIG.

  First, a surface electric field display device which is one of electro-optical devices will be described. FIG. 17 is a schematic exploded perspective view showing the structure of the surface electric field display device.

  As shown in FIG. 17, the surface electric field display device 163 as an electro-optical device mainly includes an element substrate 164 and a counter substrate 165. The element substrate 164 includes a substrate 166. An insulating film 167 is formed on the upper surface of the substrate 166. On the upper surface of the insulating film 167, electron-emitting devices 168 as a pair of substantially circular electrodes are formed in a matrix, and when one electron-emitting device 168 does not function, the other electron-emitting device 168 operates. It is like that. The scanning lines 169 as wirings and the data lines 170 as wirings are formed in a grid pattern so as to surround each pair of electron-emitting devices 168. One pair of data lines 170 is disposed between a pair of electron-emitting devices 168.

  The electron-emitting device 168 is divided into two by a line passing through the center, and one of the electron-emitting devices 168 is connected to the scanning line 169. The other side of the electron-emitting device 168 is connected to the data line 170. The electron emission element 168, the scanning line 169, the data line 170, and the like constitute an element layer 171.

  The counter substrate 165 includes a substrate 172 made of a light transmissive material. An anode 173 as an electrode made of a light transmissive material is formed below the substrate 172. A color fluorescent film 174 as a light emitting element is formed on the lower surface of the anode 173, and a protective film 175 is formed so as to cover the color fluorescent film 174 and the anode 173.

  The element substrate 164 and the counter substrate 165 are bonded to each other through a spacer (not shown), and the element substrate 164 and the counter substrate 165 are degassed to be in a substantially vacuum state.

  In the electron-emitting device 168 in which the electrode is divided into two, when a voltage is applied between the two electrodes, the gap between the electrodes is formed narrow, so that minute electrons pass between the two electrodes. Then, when an electric field is formed by applying a voltage between the electron-emitting device 168 and the anode 173, an electromagnetic force acts on the electrons passing between the two electrodes, so that the electrons move to the anode 173. .

  Some of the electrons that move toward the anode 173 collide with the color phosphor film 174. The color phosphor film 174 emits light because it converts energy from electron collision into light. The surface electric field display device 163 includes a data voltage driving circuit and a scanning voltage driving circuit (not shown), and the data voltage driving circuit and the scanning voltage driving circuit control the voltage applied to the electron-emitting device 168. Since the voltage applied to the electron-emitting device 168 and the amount of light emitted from the color fluorescent film 174 have a positive correlation, the data voltage driving circuit and the scanning voltage driving circuit can control the amount of light emitted from the color fluorescent film 174. It has become.

  The data voltage driving circuit and the scanning voltage driving circuit can display an image by controlling the amount of light for each pixel and blinking the pixel. The color fluorescent film 174 is provided with fluorescent films of respective colors that emit red, blue, and green light. The data voltage driving circuit and the scanning voltage driving circuit select and control the color to be emitted. A color image can be displayed.

  In the step of forming the scanning lines 169 and the data lines 170 in the element layer 171, the ejection method in the first to third embodiments is used. Specifically, a bank is formed of an insulating film so that a place where a wiring is to be formed becomes a recess. Then, the wiring material liquid is manufactured by dissolving the wiring material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this wiring is discharged and applied to the recesses formed between the banks.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the wiring material liquid is discharged and applied. Then, the scanning line 169 and the data line 170 are formed by solidifying the applied wiring material liquid by heating and drying.

  Further, in the step of forming the electron-emitting device 168 in the device layer 171, the ejection method in the first to third embodiments is used. Specifically, the electrode film material in the electron-emitting device 168 is dissolved in a solvent or dispersed in a dispersion medium to produce an electrode film material solution. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged onto the surface of the insulating film 167 and applied.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Thereafter, the electrode film in the electron-emitting device 168 is formed by heating and solidifying the material liquid of the electrode film.

  Further, in the step of forming the anode 173 on the lower surface of the substrate 172, the ejection method in the first to third embodiments is used. Specifically, the electrode film material for the anode 173 is dissolved in a solvent or dispersed in a dispersion medium to produce an electrode film material solution. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the electrode film is discharged and applied to the lower surface of the substrate 172.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Then, the anode 173 is formed by solidifying the electrode film material liquid by heating and drying.

  Further, in the step of forming the color phosphor film 174 on the lower surface of the anode 173, the ejection method in the first to third embodiments is used. Specifically, the color phosphor film material as the light emitting element forming material is dissolved in a solvent or dispersed in a dispersion medium to produce a color phosphor film material liquid. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the lower surface of the anode 173.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the color phosphor film material liquid is discharged and applied. Thereafter, the color phosphor film 174 is formed by solidifying the material liquid of the color phosphor film by heating and drying.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the scanning lines 169 and the data lines 170, the ejection amount of the wiring material can be accurately controlled by using the ejection method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the scanning lines 169 and the data lines 170 to which the wiring material is applied with high accuracy.

  (2) According to the present embodiment, in the process of manufacturing the electron-emitting device 168 and the anode 173, the discharge amount of the electrode material can be accurately controlled by using the discharge method according to the first to third embodiments. Discharge and apply. Therefore, it is possible to manufacture the electron-emitting device 168 and the anode 173 in which the application amount of the electrode material is accurately applied.

  (3) According to the present embodiment, in the process of manufacturing the color phosphor film 174, the ejection amount of the color phosphor film forming material can be accurately controlled by using the ejection method according to the first to third embodiments. Discharge and apply. Accordingly, it is possible to manufacture the color fluorescent film 174 on which the coating amount of the color fluorescent film forming material is accurately applied.

(Seventh embodiment)
Next, an embodiment of manufacturing a plasma display device by applying the ejection method of the present invention will be described with reference to FIG.

  First, a plasma display device which is one of electro-optical devices will be described. FIG. 18 is a schematic exploded perspective view showing the structure of the plasma display device.

  As shown in FIG. 18, the plasma display device 178 as an electro-optical device mainly includes a back plate 179 and a front plate 180. The back plate 179 includes a substrate 181. An insulating film 182 is formed on the upper surface of the substrate 181, and address electrodes 183 and insulating films 184 as electrodes are formed in stripes on the upper surface of the insulating film 182.

  A dielectric layer 185 is formed on the top surfaces of the address electrodes 183 and the insulating film 184. Grid-shaped ribs 186 are formed on the top surface of the dielectric layer 185, and red (R) and green (G) formed by phosphors or the like at the bottoms of the concave regions formed by being surrounded by the ribs 186. The light emitting layers 187R, 187G, and 187B are formed as blue (B) light emitting elements. The light emitting layers 187R, 187G, and 187B are formed at locations facing the address electrodes 183.

  The front plate 180 includes a substrate 188 made of a light transmissive material, and an insulating film 189 is formed on the lower surface of the substrate 188. A bus electrode 190 as an electrode is formed on the lower surface of the insulating film 189 in a direction orthogonal to the direction in which the address electrode 183 extends. A sustain electrode 191 as a rectangular electrode made of a light-transmitting material is formed adjacent to the bus electrode 190 and facing the light emitting layers 187R, 187G, and 187B, and the bus electrode 190 and the sustain electrode 191 are connected to each other. Are electrically connected.

  A dielectric layer 192 is formed on the lower surface of the sustain electrode 191, and an insulating film 193 made of a non-light-transmissive insulating material is formed on the lower surface of the bus electrode 190. Then, the back plate 179 and the front plate 180 are joined, and the back plate 179 and the front plate 180 are degassed and brought into a substantially vacuum state, and then a gas such as xenon gas is enclosed.

  When a pulse voltage is applied between the address electrode 183 and the sustain electrode 191, plasma is generated between the dielectric layer 185 and the dielectric layer 192. The plasma emits ultraviolet light, and the emitted ultraviolet light excites phosphors contained in the light emitting layers 187R, 187G, and 187B, and red, green, and blue visible light is emitted.

  The plasma display device 178 includes a drive circuit that controls a pulse voltage applied between the address electrode 183 and the sustain electrode 191. This drive circuit can control the amount of light emitted for each pixel by controlling the voltage value and timing of the pulse voltage, and can display an image by blinking the pixel.

  In the step of forming the address electrode 183 on the upper surface of the insulating film 182 of the back plate 179, the ejection method in the first to third embodiments is used. Specifically, a bank-shaped insulating film 184 is formed on the upper surface of the insulating film 182. Next, the material of the address electrode 183 is dissolved in a solvent or dispersed in a dispersion medium to produce a material liquid for the electrode film. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the electrode film is discharged and applied to the recess formed by the insulating film 184.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Thereafter, the address electrode 183 is formed by solidifying the electrode film material liquid by heating and drying.

  In the step of forming the bus electrode 190 and the sustain electrode 191 on the lower surface of the insulating film 189 of the front plate 180, the ejection method in the first to third embodiments is used. Specifically, a bank-shaped insulating film 193 is formed on the lower surface of the insulating film 189. Next, the material of the electrode film is manufactured by dissolving the material of the bus electrode 190 and the sustain electrode 191 in a solvent or dispersing in a dispersion medium. Next, by using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the recess formed by the insulating film 193.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the electrode film is discharged and applied. Thereafter, the bus electrode 190 and the sustain electrode 191 are formed by heat drying and solidifying the material liquid of the electrode film.

  Further, in the step of forming the light emitting layers 187R, 187G, and 187B on the upper surface of the dielectric layer 185, the ejection method in the first to third embodiments is used. Specifically, the material liquid of the light emitting layer is manufactured by dissolving the material of the light emitting layers 187R, 187G and 187B as the light emitting element forming material in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the light emitting layer is discharged and applied to the upper surface of the dielectric layer 185.

  At this time, when using the discharge method of the first embodiment or the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then the material liquid of the light emitting layer is discharged and applied. Thereafter, the light emitting layer 187R, 187G, and 187B are formed by solidifying the material liquid of the light emitting layer by heating and drying.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the address electrode 183, the bus electrode 190, and the sustain electrode 191, the discharge of the electrode material is performed by using the discharge method according to the first to third embodiments. The amount is accurately discharged and applied. Therefore, it is possible to manufacture the address electrode 183, the bus electrode 190, and the sustain electrode 191 that have been applied with an accurate application amount of the electrode material.

  (2) According to the present embodiment, in the process of manufacturing the light emitting layers 187R, 187G, and 187B, the discharge amount of the light emitting element forming material is reduced by using the discharge method in the first to third embodiments. It is discharged and applied with high accuracy. Accordingly, it is possible to manufacture the light emitting layers 187R, 187G, and 187B in which the amount of the light emitting layer applied is accurately applied.

In addition, this invention is not limited to embodiment mentioned above, A various change and improvement can also be added. A modification will be described below.
(Modification 1)
In the first embodiment to the third embodiment, the discharge amount is measured for each droplet discharge head 14. However, the present invention is not limited to this, and the discharge amount is measured by dividing the nozzle 31 in another way. May be. For example, the measurement may be performed for each row of the droplet discharge heads 14. Further, for example, the discharge amount may be measured by dividing the nozzle 31 of one droplet discharge head 14 into three equal parts. In the coating step, the nozzle 31 to be measured may be divided in accordance with the pattern to be drawn, and the discharge amount may be measured and adjusted.

(Modification 2)
In the first embodiment to the third embodiment, the infrared camera 75 is used as the thermometer for measuring the temperature of the nozzle 31, but other thermometers may be used. The thermometer only needs to be able to detect the temperature of the nozzle 31. In addition, for example, a thermocouple, a platinum resistance temperature detector, a crystal resonator, a thermistor, or the like can be used as the temperature sensor. By using a sensor that is sensitive to the nozzle temperature, the temperature can be detected with high accuracy.

(Modification 3)
In the first to third embodiments, the piezoelectric element 43 is used as the pressurizing means for pressurizing the cavity 40, but other methods may be used. For example, the diaphragm 42 may be deformed and pressurized using a coil and a magnet. In addition, the heater wiring may be arranged in the cavity 40 and the heater wiring may be heated to vaporize the functional liquid 41 or expand the gas contained in the functional liquid 41 to pressurize the functional liquid 41. In addition, the diaphragm 42 may be deformed and pressurized using electrostatic attraction and repulsion.

  In any case, the ejection method in the first to third embodiments can be used. That is, when using the discharge method of the first embodiment and the second embodiment, the cooling set time is set in the cooling time setting step. In the cooling step, the droplet discharge head 14 is cooled for a time longer than the cooling set time. When the discharge method of the third embodiment is used, the cooling set temperature is set in the cooling temperature setting step. In the cooling step, the droplet discharge head 106 is cooled to a temperature that is equal to or lower than the cooling set temperature. And after discharging in a measurement discharge process, discharge amount is measured. Next, the adjustment step and the measurement step are repeated to adjust the discharge amount, and then discharged onto the substrate. With this method, the same effects as in the above-described embodiment can be obtained in any of the ejection methods.

(Modification 4)
In the first embodiment, the discharge amount is calculated by measuring the weight of the droplet 44 discharged from the nozzle 31. However, the discharge amount may be measured by measuring the volume of the discharge amount. For example, the droplet 44 is discharged to a tube having a constant cross-sectional area, and the droplet 44 is accumulated in the tube. Then, the volume may be measured by measuring the length of the liquid in the pipe, and the discharge amount may be estimated. In the case of a highly volatile liquid, it can be measured in a state where it is difficult to volatilize.

(Modification 5)
In the first embodiment and the second embodiment, the droplet discharge device 1 includes one carriage 12, but may include a plurality of carriages 12. By using a plurality of carriages 12, each carriage 12 can be made smaller. Since the smaller one is lighter and easier to operate than when the carriage 12 is large, the carriage 12 can be easily maintained. The droplet discharge device 108 in the third embodiment can be configured in the same manner. At this time, the carriage 12 can be easily maintained.

(Modification 6)
In the first embodiment and the second embodiment, twelve droplet discharge heads 14 are arranged in one carriage 12, but the present invention is not limited to this. The number of droplet discharge heads 14 arranged on one carriage 12 may be one or plural. It is preferable that the number and arrangement be suitable for the drawing pattern for discharging the droplets 44. The droplet discharge device 108 in the third embodiment can be configured in the same manner.

(Modification 7)
In the first embodiment, the discharge amount is measured by discharging from one droplet discharge head 14. The number of droplet discharge heads 14 for simultaneous measurement is not limited to this. You may measure according to an apparatus structure.

(Modification 8)
In the fourth embodiment, the color filters 141R, 141G, and 141B are provided inside the liquid crystal display panel 121. The color filters 141 </ b> R, 141 </ b> G, and 141 </ b> B may not be provided inside the liquid crystal display panel 121, and may be provided as separate components from the liquid crystal display panel 121. The yield of the liquid crystal display device 120 can be improved by combining the non-defective product of the liquid crystal display panel 121 selected in the inspection process and the non-defective product having the color filter selected in the inspection process.

(Modification 9)
In the third embodiment, a thermistor is used as the temperature sensor 107, but it is sufficient that the temperature of the droplet discharge head 106 can be detected. In addition, for example, a thermocouple, a platinum resistance temperature detector, a crystal resonator, or the like can be used as the temperature sensor 107. By using a sensor that is sensitive to the temperature of the functional liquid 41, the temperature can be detected with high accuracy.

(Modification 10)
In the first embodiment to the third embodiment, in the cooling step, the droplet discharge head 14 is left in the atmosphere and cooled by radiating heat, but is cooled using a cooling device. Also good. For example, a method in which air is blown against the droplet discharge head 14 and cooled by a blower. A method in which a cooled member is applied to the droplet discharge head 14 and cooled using a heat exchanger. It is possible to employ a method such as a method in which a cooled fluid is applied to the droplet discharge head 14 and cooled using a heat exchanger.

(Modification 11)
In the first embodiment, the order of adjusting the discharge amount 81 is the same order for the first, second, and third rounds, but is not limited thereto. In the second and third rounds, the order in which the droplet discharge head 14 is at a temperature lower than a predetermined temperature when the discharge amount 81 is measured may be used. At this time, since the leaving step of step S3 can be omitted or can be completed in a short time, the discharge amount 81 can be adjusted with high productivity.

(Modification 12)
In the third embodiment, one temperature sensor 107 is disposed in each droplet discharge head 106, but a temperature sensor 107 may be disposed for each nozzle 31. Furthermore, since the temperature distribution can be detected finely, the discharge amount 81 can be adjusted with higher accuracy.

(Modification 13)
In the third embodiment, the warm-up drive is performed. Even when the warm-up drive is not performed, the nozzle temperature 80 is accurately monitored by managing the nozzle temperature 80 using the temperature sensor 107. Can do. Accordingly, the measurement discharge can be performed at substantially the same temperature, and the discharge amount 81 can be accurately measured and adjusted.

(Modification 14)
In the fourth embodiment to the seventh embodiment, the ejection method in the first embodiment to the third embodiment is used. However, the present invention is not limited to this, and the first to thirteenth modifications are not limited thereto. You may use the method in.

1 is a schematic perspective view illustrating a configuration of a droplet discharge device according to a first embodiment. (A) is a schematic plan view of the carriage, (b) is a schematic side view for explaining the structure of the carriage, and (c) is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. The electric control block diagram of a droplet discharge device. The flowchart which shows the manufacturing process which discharges and applies a droplet to a board | substrate. (A) is a figure for demonstrating the method to measure the temperature of a nozzle plate, (b) is a graph which shows the relationship between nozzle temperature and discharge amount, (c) is a time chart which shows the change of discharge amount. . The figure which shows the adjustment order table which shows an adjustment order. (A) is a time chart which shows the drive waveform of a droplet discharge head, (b) And (c) is a figure explaining the discharge method using a droplet discharge apparatus. FIG. 6 illustrates a discharge method using a droplet discharge device. 9 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate according to a second embodiment. (A) is a time chart which shows the drive waveform of a droplet discharge head, (b) is a time chart which shows the change of discharge amount, (c) is a figure explaining the discharge method using a droplet discharge apparatus. FIG. 10 is a schematic cross-sectional view of a main part of a droplet discharge head according to a third embodiment. The electric control block diagram of a droplet discharge device. The flowchart which shows the manufacturing process which discharges and applies a droplet to a board | substrate. (A) is a time chart which shows the change of discharge amount, (b) is a graph which shows the relationship between nozzle temperature and discharge amount. FIG. 10 is a schematic exploded perspective view showing a structure of a liquid crystal display device according to a fourth embodiment. The schematic exploded perspective view which shows the structure of the organic electroluminescent apparatus concerning 5th Embodiment. The schematic exploded perspective view which shows the structure of the surface electric field display apparatus concerning 6th Embodiment. The schematic exploded perspective view which shows the structure of the plasma display apparatus which concerns on 7th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 7 ... Substrate as work, 31 ... Nozzle, 41 ... Functional liquid as liquid, 44 ... Droplet, 80 ... Nozzle temperature, 81 ... Discharge amount, 83 ... Time, 85 ... Tolerance, 120 ... Electro-optical device Liquid crystal display device, 122 ... lighting device, 124 ... element substrate as a first substrate, 125 ... counter substrate as a second substrate, 130, 157 ... pixel electrodes as electrodes, 131, 151 ... TFT elements as semiconductors, 132, 152, 169... Scanning line as wiring, 133, 153, 170... Data line as wiring, 135, 144... Orientation film, 143 .. counter electrode as electrode, 147. 148, 166, 172, 181, 188 ... substrate, 158 ... hole transport layer as light emitting element, 159B, 159G, 159R, 187B, 187G, 1 7R: a light emitting layer as a light emitting element, 160: a functional layer as a light emitting element, 161: a cathode as an electrode, 163: a surface electric field display device as an electro-optical device, 168 ... an electron-emitting device as an electrode, 173 ... as an electrode 174... Color fluorescent film as a light emitting element, 178... Plasma display device as an electro-optical device, 183... Address electrode as an electrode, 190... Bus electrode as an electrode, 191.

Claims (17)

A discharge amount adjustment method for adjusting a discharge amount when discharging droplets from a nozzle,
A measurement discharge step of discharging the droplets from the nozzle;
A cooling step of lowering the nozzle temperature, which is the temperature near the nozzle,
A measurement step of measuring the discharge amount discharged in the measurement discharge step;
An adjustment step for adjusting the measured discharge amount to be close to a target discharge amount in the measurement step;
A discharge amount characterized by performing a cooling step between the measurement discharge step and the measurement discharge step to be performed again when the measurement discharge step is performed again after the discharge amount is adjusted by the adjustment step. Adjustment method. The discharge amount adjusting method according to claim 1,
The discharge amount adjusting method, wherein the cooling step is performed in parallel with at least one of the measuring step and the adjusting step. The discharge amount adjusting method according to claim 1,
A plurality of the nozzles are provided, and when the cooling step is performed in at least one of the plurality of nozzles, the measurement discharge step is performed in at least one of the other nozzles. Discharge amount adjustment method. The discharge amount adjusting method according to claim 3,
In order to adjust the discharge amount in a plurality of the nozzles in order, after adjusting all the discharge amount to be adjusted,
The discharge amount adjustment method, wherein the discharge amount is adjusted in the nozzles that need to be adjusted again in the same order. The discharge amount adjusting method according to claim 1,
The nozzle temperature has a warm-up driving process for warm-up driving until reaching a preset warm-up set temperature,
The discharge amount adjusting method, wherein the warm-up drive step is performed before the measurement discharge step.   2. The discharge amount adjustment method according to claim 1, wherein in the cooling step, the nozzle is left to cool. The discharge amount adjustment method according to claim 6,
A cooling time setting step of setting a cooling setting time, which is a time for the nozzle temperature to drop to a predetermined temperature when the nozzle is left unattended,
In the cooling step, cooling is performed for the cooling set time or longer. The discharge amount adjustment method according to claim 7,
The discharge amount adjusting method, wherein the cooling set time is set to a time when an error of the discharge amount due to the influence of the nozzle temperature is equal to or less than an allowable error. The discharge amount adjusting method according to claim 1,
A cooling temperature setting step for setting a cooling set temperature that is a temperature to be cooled in the cooling step;
The cooling step includes a temperature measuring step for measuring the nozzle temperature,
A cooling determination step of comparing the nozzle temperature with a cooling set temperature, which is a temperature at which cooling is ended, and determining whether to continue cooling or to end;
A step of cooling the nozzle temperature, measuring the nozzle temperature, and cooling the nozzle temperature until the measured nozzle temperature reaches the cooling set temperature. . A liquid material discharge method for discharging a liquid material from a nozzle to a workpiece as a droplet,
A discharge amount adjusting step of adjusting the discharge amount;
An application step of discharging the droplets onto the workpiece,
In the said discharge amount measurement process, it adjusts using the discharge amount adjustment method as described in any one of Claims 1-9, The discharge method of the liquid body characterized by the above-mentioned. A method for producing a color filter comprising a step of applying and forming a color ink on a substrate,
A method for producing a color filter, wherein the color ink is ejected and applied to the substrate using the liquid material ejection method according to claim 10. A method for manufacturing a liquid crystal display device, comprising: forming an alignment film on a first substrate and a second substrate; and forming a liquid crystal between the first substrate and the second substrate,
The alignment film is formed by discharging and applying the material of the alignment film to at least one of the first substrate and the second substrate using the liquid discharge method according to claim 10. A method for manufacturing a liquid crystal display device. A method of manufacturing a liquid crystal display device comprising a step of forming a liquid crystal between a first substrate and a second substrate after applying the liquid crystal to the first substrate,
A method for manufacturing a liquid crystal display device, wherein the liquid crystal is discharged and applied to the first substrate using the liquid discharge method according to claim 10. A method of manufacturing an electro-optical device including a step of forming a light emitting element by solidifying after applying a light emitting element forming material to a substrate,
11. A method of manufacturing an electro-optical device, wherein the light emitting element forming material is discharged and applied to the substrate using the liquid discharge method according to claim 10. A method of manufacturing an electro-optical device having a step of forming an electrode by solidifying after applying a liquid electrode material to a substrate,
11. A method of manufacturing an electro-optical device, wherein the liquid material discharge method according to claim 10 is used to discharge and apply the electrode material of the liquid material to the substrate. An electro-optical device manufacturing method including a step of forming a wiring by applying a liquid wiring material to a substrate and then solidifying the substrate,
11. A method of manufacturing an electro-optical device, wherein the liquid material discharge method according to claim 10 is used to discharge and apply the wiring material of the liquid material to the substrate. A method of manufacturing an electro-optical device including a step of forming a semiconductor by applying a liquid semiconductor material to a substrate, solidifying the substrate, and then heating the substrate.
11. A method of manufacturing an electro-optical device, wherein the liquid material discharge method according to claim 10 is used to discharge and apply the semiconductor material of the liquid material to the substrate.

Images